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LPC5514JBD64E LPC5514JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 145 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.7 EUR
10+ 8.35 EUR
Mindestbestellmenge: 2
LPC55S14JBD64E LPC55S14JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 113 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.72 EUR
10+ 9.15 EUR
Mindestbestellmenge: 2
LPC5516JBD64E LPC5516JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 83 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.48 EUR
10+ 9.01 EUR
Mindestbestellmenge: 2
LPC55S16JBD64E LPC55S16JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.39 EUR
10+ 9.74 EUR
160+ 8.06 EUR
Mindestbestellmenge: 2
LPC5526JBD100K LPC5526JBD100K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 448 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.81 EUR
10+ 10.06 EUR
80+ 8.33 EUR
Mindestbestellmenge: 2
LPC5516JEV98E LPC5516JEV98E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 305 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.02 EUR
10+ 10.22 EUR
80+ 8.46 EUR
Mindestbestellmenge: 2
LPC55S66JBD64K LPC55S66JBD64K NXP USA Inc. LPC55S6x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC55S26JEV98K LPC55S26JEV98K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1122 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.43 EUR
10+ 10.55 EUR
80+ 8.74 EUR
Mindestbestellmenge: 2
LPC55S28JBD64K LPC55S28JBD64K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1637 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.75 EUR
10+ 10.79 EUR
80+ 8.93 EUR
1600+ 7.79 EUR
Mindestbestellmenge: 2
LPC55S28JBD100K LPC55S28JBD100K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 635 Stücke:
Lieferzeit 10-14 Tag (e)
2+15.38 EUR
10+ 12.07 EUR
80+ 10 EUR
Mindestbestellmenge: 2
LPC55S16JEV98E LPC55S16JEV98E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 2039 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.06 EUR
10+ 11.04 EUR
80+ 9.14 EUR
1040+ 7.97 EUR
Mindestbestellmenge: 2
LPC5528JBD100K LPC5528JBD100K NXP USA Inc. LPC552xFAMFS.pdf Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.5 EUR
10+ 11.4 EUR
80+ 9.43 EUR
Mindestbestellmenge: 2
LPC5512JBD100E LPC5512JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
2+10.7 EUR
10+ 8.35 EUR
Mindestbestellmenge: 2
LPC55S14JBD100E LPC55S14JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.21 EUR
10+ 9.6 EUR
Mindestbestellmenge: 2
LPC5516JBD100E LPC5516JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 187 Stücke:
Lieferzeit 10-14 Tag (e)
2+13.22 EUR
10+ 10.38 EUR
90+ 8.59 EUR
Mindestbestellmenge: 2
LPC55S16JBD100E LPC55S16JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.27 EUR
Mindestbestellmenge: 2
LPC5512JBD64E LPC5512JBD64E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 64KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
3+8.54 EUR
10+ 6.67 EUR
Mindestbestellmenge: 3
LPC5514JBD100E LPC5514JBD100E NXP USA Inc. LPC55S1x_LPC551x_DS.pdf Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.32 EUR
10+ 8.89 EUR
Mindestbestellmenge: 2
LPC55S66JEV98K LPC55S66JEV98K NXP USA Inc. LPC55S6x_DS.pdf Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SAF775CHV/N208Q/KK NXP USA Inc. Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF4000EL/101S500Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
SAF4000EL/101S504Y NXP USA Inc. Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
HEF4894BP,112 HEF4894BP,112 NXP USA Inc. HEF4894B.pdf Description: IC REGISTER SHIFT 12STAGE 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Open Drain
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of Bits per Element: 12
auf Bestellung 1391 Stücke:
Lieferzeit 10-14 Tag (e)
174+2.85 EUR
Mindestbestellmenge: 174
PDTC143XQA147 PDTC143XQA147 NXP USA Inc. PDTC143X_123J_143Z_114YQA_SER.pdf Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 280 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
auf Bestellung 122553 Stücke:
Lieferzeit 10-14 Tag (e)
9489+0.048 EUR
Mindestbestellmenge: 9489
PDTC143EQA147 NXP USA Inc. PDTC143_114_124_144EQA_SER.pdf Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
OM15080-QN9090 OM15080-QN9090 NXP USA Inc. QN9090(T)QN9030(T).pdf Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+58.98 EUR
S9S08DZ60F2MLHR S9S08DZ60F2MLHR NXP USA Inc. Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HCT573N/C4112 NXP USA Inc. PHGL-S-A0001574510-1.pdf?t.download=true&u=5oefqw Description: BUS DRIVER, HCT SERIES, 8-BIT
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 17ns
Supplier Device Package: 20-DIP
Part Status: Active
Produkt ist nicht verfügbar
TJA1059TKJ TJA1059TKJ NXP USA Inc. TJA1059.pdf Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
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TJA1059TKJ TJA1059TKJ NXP USA Inc. TJA1059.pdf Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 30150 Stücke:
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10+ 4.06 EUR
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100+ 3.33 EUR
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1000+ 2.39 EUR
2500+ 2.27 EUR
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FS32K146HRT0VLQR FS32K146HRT0VLQR NXP USA Inc. S32K1xx.pdf Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVC2G17GW/S400125 74LVC2G17GW/S400125 NXP USA Inc. PHGLS27957-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G17GW/S911125 74LVC2G17GW/S911125 NXP USA Inc. PHGLS27957-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G17GW132 74LVC2G17GW132 NXP USA Inc. PHGLS27957-1.pdf?t.download=true&u=5oefqw Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G17GW-Q100125 74LVC2G17GW-Q100125 NXP USA Inc. 74LVC2G17_Q100.pdf Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G17GV-Q100125 74LVC2G17GV-Q100125 NXP USA Inc. 74LVC2G17_Q100.pdf Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PEMI2STD/CM,115 PEMI2STD/CM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/16PF SMD
Packaging: Bulk
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
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PEMI2QFN/CM,115 PEMI2QFN/CM,115 NXP USA Inc. PEMIXQFN_PEMI2STD_FAM.pdf Description: FILTER RC(PI) 20 OHM/16PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
auf Bestellung 15000 Stücke:
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3806+0.13 EUR
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74HC32PW/AU118 74HC32PW/AU118 NXP USA Inc. 74HC_HCT32.pdf Description: IC GATE OR 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC32PW/S400118 74HC32PW/S400118 NXP USA Inc. 74HC_HCT32.pdf Description: IC GATE OR 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HCT4015D,112 74HCT4015D,112 NXP USA Inc. 74HC(T)4015.pdf Description: IC DUAL 4BIT SHIFT REG 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Part Status: Obsolete
Number of Bits per Element: 4
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74HCT4015N,112 74HCT4015N,112 NXP USA Inc. 74HC(T)4015.pdf Description: IC DUAL 4BIT SHIFT REG 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 2
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Number of Bits per Element: 4
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74HCT4016N,112 74HCT4016N,112 NXP USA Inc. 74HC_T4016.pdf Description: IC SWITCH SPST-NOX2 95OHM 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-DIP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Switch Time (Ton, Toff) (Max): 30ns, 44ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Part Status: Obsolete
Number of Circuits: 2
auf Bestellung 6955 Stücke:
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430+1.14 EUR
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SAF5000EL/V100K NXP USA Inc. Description: IC RADIO SYSTEM MULTI
Produkt ist nicht verfügbar
MF1PLUS8031DA8/03, NXP USA Inc. Description: CLHW
Produkt ist nicht verfügbar
N74F166N,602 N74F166N,602 NXP USA Inc. 74F166.pdf Description: IC SHIFT REGISTER 8BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Number of Bits per Element: 8
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PMBT4403/S911215 PMBT4403/S911215 NXP USA Inc. PHGL-S-A0000711722-1.pdf?t.download=true&u=5oefqw Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
auf Bestellung 181700 Stücke:
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2N7002/S711215 2N7002/S711215 NXP USA Inc. 1PS74SB23.pdf Description: N-CHANNEL SMALL SIGNAL MOSFET
Produkt ist nicht verfügbar
HEF4014BT-Q100118 HEF4014BT-Q100118 NXP USA Inc. HEF4014B_Q100.pdf Description: PARALLEL IN SERIAL OUT, 8-BIT
Packaging: Bulk
Produkt ist nicht verfügbar
BAV99W/DG/B2115 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
BAV99W/MI135 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
BAV99W/DG/B4115 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
BAV99W/MI115 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
BAV99W/DG/B3115 NXP USA Inc. BAV99_SER.pdf Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
SL3S1213FTB0,115 SL3S1213FTB0,115 NXP USA Inc. SL3S1203_1213.pdf Description: IC RFID TRANSP 840-960MHZ XSON6
Produkt ist nicht verfügbar
TEA1620P/N1,112 TEA1620P/N1,112 NXP USA Inc. TEA1620P_1.pdf Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
PCAL9555AHF,128 PCAL9555AHF,128 NXP USA Inc. PCAL9555A.pdf Description: IC XPNDR 400KHZ I2C 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 22238 Stücke:
Lieferzeit 10-14 Tag (e)
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10+ 3.38 EUR
25+ 3.18 EUR
100+ 2.71 EUR
250+ 2.55 EUR
500+ 2.23 EUR
1000+ 1.85 EUR
2500+ 1.72 EUR
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PCA9704PW/Q900J PCA9704PW/Q900J NXP USA Inc. PCA9704.pdf Description: IC XPNDR 5MHZ SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 8 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCA9704PW/Q900J PCA9704PW/Q900J NXP USA Inc. PCA9704.pdf Description: IC XPNDR 5MHZ SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 8 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 1547 Stücke:
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500+ 4.47 EUR
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PCAL6408AHKX PCAL6408AHKX NXP USA Inc. PCAL6408A.pdf Description: IC XPNDR 400KHZ I2C SMBUS 16XQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-XQFN (1.8x2.6)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 11715 Stücke:
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100+ 1.74 EUR
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1000+ 1.13 EUR
Mindestbestellmenge: 8
LPC5514JBD64E LPC55S1x_LPC551x_DS.pdf
LPC5514JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 145 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+10.7 EUR
10+ 8.35 EUR
Mindestbestellmenge: 2
LPC55S14JBD64E LPC55S1x_LPC551x_DS.pdf
LPC55S14JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 113 Stücke:
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Anzahl Preis ohne MwSt
2+11.72 EUR
10+ 9.15 EUR
Mindestbestellmenge: 2
LPC5516JBD64E LPC55S1x_LPC551x_DS.pdf
LPC5516JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 83 Stücke:
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Anzahl Preis ohne MwSt
2+11.48 EUR
10+ 9.01 EUR
Mindestbestellmenge: 2
LPC55S16JBD64E LPC55S1x_LPC551x_DS.pdf
LPC55S16JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.39 EUR
10+ 9.74 EUR
160+ 8.06 EUR
Mindestbestellmenge: 2
LPC5526JBD100K LPC552xFAMFS.pdf
LPC5526JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 448 Stücke:
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2+12.81 EUR
10+ 10.06 EUR
80+ 8.33 EUR
Mindestbestellmenge: 2
LPC5516JEV98E LPC55S1x_LPC551x_DS.pdf
LPC5516JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 305 Stücke:
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Anzahl Preis ohne MwSt
2+13.02 EUR
10+ 10.22 EUR
80+ 8.46 EUR
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LPC55S66JBD64K LPC55S6x_DS.pdf
LPC55S66JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
LPC55S26JEV98K LPC552xFAMFS.pdf
LPC55S26JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 1122 Stücke:
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Anzahl Preis ohne MwSt
2+13.43 EUR
10+ 10.55 EUR
80+ 8.74 EUR
Mindestbestellmenge: 2
LPC55S28JBD64K LPC552xFAMFS.pdf
LPC55S28JBD64K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1637 Stücke:
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Anzahl Preis ohne MwSt
2+13.75 EUR
10+ 10.79 EUR
80+ 8.93 EUR
1600+ 7.79 EUR
Mindestbestellmenge: 2
LPC55S28JBD100K LPC552xFAMFS.pdf
LPC55S28JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 635 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+15.38 EUR
10+ 12.07 EUR
80+ 10 EUR
Mindestbestellmenge: 2
LPC55S16JEV98E LPC55S1x_LPC551x_DS.pdf
LPC55S16JEV98E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 2039 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+14.06 EUR
10+ 11.04 EUR
80+ 9.14 EUR
1040+ 7.97 EUR
Mindestbestellmenge: 2
LPC5528JBD100K LPC552xFAMFS.pdf
LPC5528JBD100K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 131 Stücke:
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Anzahl Preis ohne MwSt
2+14.5 EUR
10+ 11.4 EUR
80+ 9.43 EUR
Mindestbestellmenge: 2
LPC5512JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5512JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 39 Stücke:
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Anzahl Preis ohne MwSt
2+10.7 EUR
10+ 8.35 EUR
Mindestbestellmenge: 2
LPC55S14JBD100E LPC55S1x_LPC551x_DS.pdf
LPC55S14JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 70 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
2+12.21 EUR
10+ 9.6 EUR
Mindestbestellmenge: 2
LPC5516JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5516JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 187 Stücke:
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Anzahl Preis ohne MwSt
2+13.22 EUR
10+ 10.38 EUR
90+ 8.59 EUR
Mindestbestellmenge: 2
LPC55S16JBD100E LPC55S1x_LPC551x_DS.pdf
LPC55S16JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 2 Stücke:
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Anzahl Preis ohne MwSt
2+14.27 EUR
Mindestbestellmenge: 2
LPC5512JBD64E LPC55S1x_LPC551x_DS.pdf
LPC5512JBD64E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 64KB FLASH 64HTQFP
Packaging: Tray
Package / Case: 64-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 64-HTQFP (10x10)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 19 Stücke:
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Anzahl Preis ohne MwSt
3+8.54 EUR
10+ 6.67 EUR
Mindestbestellmenge: 3
LPC5514JBD100E LPC55S1x_LPC551x_DS.pdf
LPC5514JBD100E
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 128KB FLSH 100HLQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: CAN FD, Flexcomm, I2C, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 100-HLQFP (14x14)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 84 Stücke:
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Anzahl Preis ohne MwSt
2+11.32 EUR
10+ 8.89 EUR
Mindestbestellmenge: 2
LPC55S66JEV98K LPC55S6x_DS.pdf
LPC55S66JEV98K
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 98VFBGA
Packaging: Tray
Package / Case: 98-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M33
Data Converters: A/D 10x16b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Supplier Device Package: 98-VFBGA (7x7)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
SAF775CHV/N208Q/KK
Hersteller: NXP USA Inc.
Description: CAR RADIO TUNER & AUDIO DSP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Type: Audio, Car Signal Processor
Supplier Device Package: 176-HLQFP (24x24)
Part Status: Obsolete
Produkt ist nicht verfügbar
SAF4000EL/101S500Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
SAF4000EL/101S504Y
Hersteller: NXP USA Inc.
Description: SOFTWARE DEFINED RADIO
Produkt ist nicht verfügbar
HEF4894BP,112 HEF4894B.pdf
HEF4894BP,112
Hersteller: NXP USA Inc.
Description: IC REGISTER SHIFT 12STAGE 20-DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Open Drain
Mounting Type: Through Hole
Number of Elements: 1
Function: Serial to Parallel, Serial
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3V ~ 15V
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of Bits per Element: 12
auf Bestellung 1391 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
174+2.85 EUR
Mindestbestellmenge: 174
PDTC143XQA147 PDTC143X_123J_143Z_114YQA_SER.pdf
PDTC143XQA147
Hersteller: NXP USA Inc.
Description: TRANS PREBIAS
Packaging: Bulk
Part Status: Active
Package / Case: 3-XDFN Exposed Pad
Mounting Type: Surface Mount
Transistor Type: NPN - Pre-Biased
Vce Saturation (Max) @ Ib, Ic: 100mV @ 500µA, 10mA
Current - Collector Cutoff (Max): 1µA
DC Current Gain (hFE) (Min) @ Ic, Vce: 50 @ 10mA, 5V
Supplier Device Package: DFN1010D-3
Grade: Automotive
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 50 V
Power - Max: 280 mW
Frequency - Transition: 230 MHz
Resistor - Base (R1): 4.7 kOhms
Resistor - Emitter Base (R2): 10 kOhms
Qualification: AEC-Q101
auf Bestellung 122553 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
9489+0.048 EUR
Mindestbestellmenge: 9489
PDTC143EQA147 PDTC143_114_124_144EQA_SER.pdf
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
OM15080-QN9090 QN9090(T)QN9030(T).pdf
OM15080-QN9090
Hersteller: NXP USA Inc.
Description: QN9090 BLE SOC DEV KIT
Packaging: Bulk
For Use With/Related Products: QN9090
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® 5.x
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 4 Stücke:
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Anzahl Preis ohne MwSt
1+58.98 EUR
S9S08DZ60F2MLHR
S9S08DZ60F2MLHR
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74HCT573N/C4112 PHGL-S-A0001574510-1.pdf?t.download=true&u=5oefqw
Hersteller: NXP USA Inc.
Description: BUS DRIVER, HCT SERIES, 8-BIT
Packaging: Bulk
Package / Case: 20-DIP (0.300", 7.62mm)
Output Type: Tri-State
Mounting Type: Through Hole
Circuit: 1:8
Logic Type: D-Type Transparent Latch
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Independent Circuits: 1
Current - Output High, Low: 6mA, 6mA
Delay Time - Propagation: 17ns
Supplier Device Package: 20-DIP
Part Status: Active
Produkt ist nicht verfügbar
TJA1059TKJ TJA1059.pdf
TJA1059TKJ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Tape & Reel (TR)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 30000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
6000+2.18 EUR
Mindestbestellmenge: 6000
TJA1059TKJ TJA1059.pdf
TJA1059TKJ
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 2/2 14HVSON
Packaging: Cut Tape (CT)
Package / Case: 14-VDFN Exposed Pad
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 2/2
Protocol: CANbus
Supplier Device Package: 14-HVSON (3x4.5)
Receiver Hysteresis: 300 mV
Duplex: Half
Part Status: Active
auf Bestellung 30150 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
4+4.52 EUR
10+ 4.06 EUR
25+ 3.84 EUR
100+ 3.33 EUR
250+ 3.16 EUR
500+ 2.83 EUR
1000+ 2.39 EUR
2500+ 2.27 EUR
Mindestbestellmenge: 4
FS32K146HRT0VLQR S32K1xx.pdf
FS32K146HRT0VLQR
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 128
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
74LVC2G17GW/S400125 PHGLS27957-1.pdf?t.download=true&u=5oefqw
74LVC2G17GW/S400125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G17GW/S911125 PHGLS27957-1.pdf?t.download=true&u=5oefqw
74LVC2G17GW/S911125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G17GW132 PHGLS27957-1.pdf?t.download=true&u=5oefqw
74LVC2G17GW132
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G17GW-Q100125 74LVC2G17_Q100.pdf
74LVC2G17GW-Q100125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
74LVC2G17GV-Q100125 74LVC2G17_Q100.pdf
74LVC2G17GV-Q100125
Hersteller: NXP USA Inc.
Description: BUFFER, LVC/LCX/Z SERIES
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
PEMI2STD/CM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2STD/CM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/16PF SMD
Packaging: Bulk
Package / Case: SOT-665
Size / Dimension: 0.063" L x 0.047" W (1.60mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 16pF (Total)
Height: 0.024" (0.60mm)
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Number of Channels: 2
auf Bestellung 80000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5323+0.099 EUR
Mindestbestellmenge: 5323
PEMI2QFN/CM,115 PEMIXQFN_PEMI2STD_FAM.pdf
PEMI2QFN/CM,115
Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 20 OHM/16PF SMD
Packaging: Bulk
Package / Case: 6-XFDFN
Size / Dimension: 0.057" L x 0.039" W (1.45mm x 1.00mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 20Ohms, C = 16pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 12dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, PCS, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 20
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 2
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3806+0.13 EUR
Mindestbestellmenge: 3806
74HC32PW/AU118 74HC_HCT32.pdf
74HC32PW/AU118
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HC32PW/S400118 74HC_HCT32.pdf
74HC32PW/S400118
Hersteller: NXP USA Inc.
Description: IC GATE OR 4CH 2-INP 14TSSOP
Packaging: Bulk
Package / Case: 14-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Logic Type: OR Gate
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2V ~ 6V
Current - Output High, Low: 5.2mA, 5.2mA
Number of Inputs: 2
Supplier Device Package: 14-TSSOP
Input Logic Level - High: 1.5V ~ 4.2V
Input Logic Level - Low: 0.5V ~ 1.8V
Max Propagation Delay @ V, Max CL: 15ns @ 6V, 50pF
Part Status: Active
Number of Circuits: 4
Current - Quiescent (Max): 2 µA
Produkt ist nicht verfügbar
74HCT4015D,112 74HC(T)4015.pdf
74HCT4015D,112
Hersteller: NXP USA Inc.
Description: IC DUAL 4BIT SHIFT REG 16-SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Push-Pull
Mounting Type: Surface Mount
Number of Elements: 2
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-SO
Part Status: Obsolete
Number of Bits per Element: 4
auf Bestellung 2646 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
952+0.52 EUR
Mindestbestellmenge: 952
74HCT4015N,112 74HC(T)4015.pdf
74HCT4015N,112
Hersteller: NXP USA Inc.
Description: IC DUAL 4BIT SHIFT REG 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 2
Function: Serial to Parallel
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Number of Bits per Element: 4
auf Bestellung 6207 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
430+1.15 EUR
Mindestbestellmenge: 430
74HCT4016N,112 74HC_T4016.pdf
74HCT4016N,112
Hersteller: NXP USA Inc.
Description: IC SWITCH SPST-NOX2 95OHM 14DIP
Packaging: Tube
Package / Case: 14-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 95Ohm
-3db Bandwidth: 200MHz
Supplier Device Package: 14-DIP
Voltage - Supply, Single (V+): 4.5V ~ 5.5V
Crosstalk: -60dB @ 1MHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 5Ohm
Switch Time (Ton, Toff) (Max): 30ns, 44ns
Channel Capacitance (CS(off), CD(off)): 3.5pF
Current - Leakage (IS(off)) (Max): 1µA
Part Status: Obsolete
Number of Circuits: 2
auf Bestellung 6955 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
430+1.14 EUR
Mindestbestellmenge: 430
SAF5000EL/V100K
Hersteller: NXP USA Inc.
Description: IC RADIO SYSTEM MULTI
Produkt ist nicht verfügbar
MF1PLUS8031DA8/03,
Hersteller: NXP USA Inc.
Description: CLHW
Produkt ist nicht verfügbar
N74F166N,602 74F166.pdf
N74F166N,602
Hersteller: NXP USA Inc.
Description: IC SHIFT REGISTER 8BIT 16-DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Output Type: Push-Pull
Mounting Type: Through Hole
Number of Elements: 1
Function: Universal
Logic Type: Register, Bidirectional
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 16-DIP
Number of Bits per Element: 8
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
138+3.59 EUR
Mindestbestellmenge: 138
PMBT4403/S911215 PHGL-S-A0000711722-1.pdf?t.download=true&u=5oefqw
PMBT4403/S911215
Hersteller: NXP USA Inc.
Description: SMALL SIGNAL BIPOLAR TRANSISTOR
Packaging: Bulk
auf Bestellung 181700 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
15000+0.032 EUR
Mindestbestellmenge: 15000
2N7002/S711215 1PS74SB23.pdf
2N7002/S711215
Hersteller: NXP USA Inc.
Description: N-CHANNEL SMALL SIGNAL MOSFET
Produkt ist nicht verfügbar
HEF4014BT-Q100118 HEF4014B_Q100.pdf
HEF4014BT-Q100118
Hersteller: NXP USA Inc.
Description: PARALLEL IN SERIAL OUT, 8-BIT
Packaging: Bulk
Produkt ist nicht verfügbar
BAV99W/DG/B2115 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
BAV99W/MI135 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
BAV99W/DG/B4115 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
BAV99W/MI115 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
BAV99W/DG/B3115 BAV99_SER.pdf
Hersteller: NXP USA Inc.
Description: RECTIFIER DIODE
Packaging: Bulk
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 150mA (DC)
Supplier Device Package: SOT-323
Operating Temperature - Junction: 150°C (Max)
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 100 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 500 nA @ 80 V
Produkt ist nicht verfügbar
SL3S1213FTB0,115 SL3S1203_1213.pdf
SL3S1213FTB0,115
Hersteller: NXP USA Inc.
Description: IC RFID TRANSP 840-960MHZ XSON6
Produkt ist nicht verfügbar
TEA1620P/N1,112 TEA1620P_1.pdf
TEA1620P/N1,112
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
PCAL9555AHF,128 PCAL9555A.pdf
PCAL9555AHF,128
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C 24HWQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 24-WFQFN Exposed Pad
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HWQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 22238 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
5+3.77 EUR
10+ 3.38 EUR
25+ 3.18 EUR
100+ 2.71 EUR
250+ 2.55 EUR
500+ 2.23 EUR
1000+ 1.85 EUR
2500+ 1.72 EUR
Mindestbestellmenge: 5
PCA9704PW/Q900J PCA9704.pdf
PCA9704PW/Q900J
Hersteller: NXP USA Inc.
Description: IC XPNDR 5MHZ SPI 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 8 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
PCA9704PW/Q900J PCA9704.pdf
PCA9704PW/Q900J
Hersteller: NXP USA Inc.
Description: IC XPNDR 5MHZ SPI 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Interface: SPI
Number of I/O: 8 (Input Only)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Clock Frequency: 5 MHz
Interrupt Output: Yes
Supplier Device Package: 16-TSSOP
Grade: Automotive
Part Status: Active
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 1547 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
3+7.13 EUR
10+ 6.4 EUR
25+ 6.05 EUR
100+ 5.25 EUR
250+ 4.98 EUR
500+ 4.47 EUR
1000+ 3.77 EUR
Mindestbestellmenge: 3
PCAL6408AHKX PCAL6408A.pdf
PCAL6408AHKX
Hersteller: NXP USA Inc.
Description: IC XPNDR 400KHZ I2C SMBUS 16XQFN
Features: POR
Packaging: Cut Tape (CT)
Package / Case: 16-XFQFN
Output Type: Open Drain, Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.65V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 16-XQFN (1.8x2.6)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 11715 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
8+2.48 EUR
10+ 2.23 EUR
25+ 2.11 EUR
100+ 1.74 EUR
250+ 1.62 EUR
500+ 1.44 EUR
1000+ 1.13 EUR
Mindestbestellmenge: 8
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