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TZ740N22KOFHPSA3 TZ740N22KOFHPSA3 Infineon Technologies TZ740N.pdf Description: SCR MODULE 2.2KV 1500A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 500 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 30000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 819 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 2.2 kV
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TZ400N26KOFHPSA1 TZ400N26KOFHPSA1 Infineon Technologies Infineon-TZ400N-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b42f86ad4c0d Description: SCR MODULE 2.6KV 1050A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 13000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 670 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1050 A
Voltage - Off State: 2.6 kV
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T940N16TOFXPSA1 T940N16TOFXPSA1 Infineon Technologies Infineon-T940N-DS-v03_02-en_de.pdf?fileId=db3a3043284aacd80128638a89e4536f Description: SCR MODULE 1800V 1759A DO200AB
Voltage - Off State: 1.8 kV
Current - On State (It (RMS)) (Max): 1759 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (AV)) (Max): 959 A
Number of SCRs, Diodes: 1 SCR
Current - Non Rep. Surge 50, 60Hz (Itsm): 17500A @ 50Hz
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Single
Operating Temperature: -40°C ~ 125°C
Mounting Type: Clamp On
Package / Case: DO-200AB, B-PUK
Packaging: Tray
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FZ2400R17HP4B28BOSA2 FZ2400R17HP4B28BOSA2 Infineon Technologies Infineon-FZ2400R17HP4_B28-DS-v03_01-EN.pdf?fileId=5546d462525dbac401527e3ca8b66b48 Description: IGBT MOD 1700V 4800A 15500W MOD
Input Capacitance (Cies) @ Vce: 195 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 15500 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 4800 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 2400A
Operating Temperature: -40°C ~ 150°C
Configuration: Single Switch
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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MB95F136NBSPFV-GSE1 MB95F136NBSPFV-GSE1 Infineon Technologies 5047 Description: IC MCU 8BIT 32KB FLASH 30SSOP
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Packaging: Tube
Number of I/O: 19
Part Status: Discontinued at Digi-Key
Supplier Device Package: 30-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
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MB95F136NBSPFV-GS-N2E1 MB95F136NBSPFV-GS-N2E1 Infineon Technologies 5047 Description: IC MCU 8BIT 32KB FLASH 30SSOP
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Number of I/O: 19
Part Status: Obsolete
Supplier Device Package: 30-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Packaging: Bulk
Produkt ist nicht verfügbar
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MB95F136HWPF-GE1 Infineon Technologies 5047 Description: IC MCU 8BIT 32KB FLASH 28SOP
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: LCD, LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
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MB95F136HWPF-GE1 Infineon Technologies 5047 Description: IC MCU 8BIT 32KB FLASH 28SOP
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: LCD, LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
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MB95F136MBSPFV-GE1 MB95F136MBSPFV-GE1 Infineon Technologies 448_MB95130MBdownload.pdf Description: IC MCU 8BIT 32KB FLASH 30SSOP
Number of I/O: 19
Part Status: Discontinued at Digi-Key
Supplier Device Package: 30-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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CYPD3172-24LQXQT CYPD3172-24LQXQT Infineon Technologies Infineon-CCG3PA-NFET_USB_Type-C_Port_Controller-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea4c007347 Description: CCG3PA-NFET
Packaging: Tape & Reel (TR)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Controller Series: CYPD3x
Program Memory Type: FLASH (64kB)
Applications: Power Adaptor
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYPD3172-24LQXQ CYPD3172-24LQXQ Infineon Technologies Infineon-CCG3PA-NFET_USB_Type-C_Port_Controller-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea4c007347 Description: CCG3PA-NFET
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Controller Series: CYPD3x
Program Memory Type: FLASH (64kB)
Applications: Power Adaptor
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
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IPG20N06S4L11AATMA1 IPG20N06S4L11AATMA1 Infineon Technologies Infineon-IPG20N06S4L-11A-DS-v01_00-EN.pdf?fileId=5546d462503812bb01508030120e6574 Description: MOSFET 2N-CH 60V 20A 8TDSON
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount, Wettable Flank
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 65W
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 20A
Input Capacitance (Ciss) (Max) @ Vds: 4020pF @ 25V
Rds On (Max) @ Id, Vgs: 11.2mOhm @ 17A, 10V
Gate Charge (Qg) (Max) @ Vgs: 53nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2.2V @ 28µA
Supplier Device Package: PG-TDSON-8-10
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
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IPG20N06S4L11AATMA1 IPG20N06S4L11AATMA1 Infineon Technologies Infineon-IPG20N06S4L-11A-DS-v01_00-EN.pdf?fileId=5546d462503812bb01508030120e6574 Description: MOSFET 2N-CH 60V 20A 8TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount, Wettable Flank
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 65W
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 20A
Input Capacitance (Ciss) (Max) @ Vds: 4020pF @ 25V
Rds On (Max) @ Id, Vgs: 11.2mOhm @ 17A, 10V
Gate Charge (Qg) (Max) @ Vgs: 53nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2.2V @ 28µA
Supplier Device Package: PG-TDSON-8-10
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
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10+2.93 EUR
50+2.23 EUR
100+2 EUR
500+1.59 EUR
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BCR 519 E6327 BCR 519 E6327 Infineon Technologies BCR519.pdf Description: TRANS PREBIAS NPN 50V SOT23
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Resistor - Base (R1): 4.7 kOhms
Frequency - Transition: 100 MHz
Power - Max: 330 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 500 mA
Part Status: Obsolete
Supplier Device Package: PG-SOT23
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 50mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
Produkt ist nicht verfügbar
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IPP07N03LB G IPP07N03LB G Infineon Technologies IPP07N03LB_G.pdf Description: MOSFET N-CH 30V 50A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 2782 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: PG-TO220-3-1
Vgs(th) (Max) @ Id: 2V @ 40µA
Power Dissipation (Max): 94W (Tc)
Rds On (Max) @ Id, Vgs: 6.6mOhm @ 50A, 10V
Current - Continuous Drain (Id) @ 25°C: 50A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Produkt ist nicht verfügbar
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FP75R12N2T4PBPSA1 Infineon Technologies 448_FP75R12N2T4PBPSA1.pdf Description: IGBT MODULE LOW POWER ECONO
Part Status: Active
Packaging: Bulk
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FP75R12N2T4PBPSA1 Infineon Technologies 448_FP75R12N2T4PBPSA1.pdf Description: IGBT MODULE LOW POWER ECONO
Part Status: Active
Packaging: Tray
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MB89935BPFV-G-387-ERE1 Infineon Technologies ProductGuide_2008.1.pdf Description: IC MCU 8BIT 16KB MROM 30SSOP
Supplier Device Package: 30-SSOP
Peripherals: POR, PWM, WDT
Connectivity: Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Number of I/O: 21
Part Status: Obsolete
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MB89193APF-G-387-BND-RE1 Infineon Technologies Description: IC MCU 8BIT 8KB MROM 28SOP
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: POR, WDT
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tube
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
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MB89193APF-G-387-BND-R MB89193APF-G-387-BND-R Infineon Technologies Description: IC MCU 8BIT 8KB MROM 28SOP
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: POR, WDT
Connectivity: Serial I/O
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Bulk
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Produkt ist nicht verfügbar
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FD1000R33HE3KBPSA1 FD1000R33HE3KBPSA1 Infineon Technologies Infineon-FD1000R33HE3_K-DS-v03_01-en_de.pdf?fileId=db3a30431ce5fb52011d76007b9a7266 Description: IGBT MOD 3300V 1000A 11500W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Brake Chopper
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1000A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1000 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 11500 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 190 nF @ 25 V
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FF1000R17IE4PBOSA1 FF1000R17IE4PBOSA1 Infineon Technologies Infineon-FF1000R17IE4P-DS-v03_02-EN.pdf?fileId=5546d46253a864fe0153e62757277813 Description: IGBT MODULE 1700V 1000A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 1000A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1000 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1000000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 81 nF @ 25 V
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FZ1000R33HE3BPSA1 FZ1000R33HE3BPSA1 Infineon Technologies Infineon-FZ1000R33HE3-DS-v03_02-EN.pdf?fileId=db3a30431ce5fb52011d760f30227290 Description: IGBT MODULE 3300V 1000A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Switch
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Not For New Designs
Current - Collector (Ic) (Max): 1000 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 190 nF @ 25 V
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S70GL02GS12FHBV23 S70GL02GS12FHBV23 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S70GL02GS11FHSS60 S70GL02GS11FHSS60 Infineon Technologies infineon-s70gl02gs-2gbit256mbytes3-0v-flash-memory-datasheet-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
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S70GL02GS11FHI023 S70GL02GS11FHI023 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Memory Organization: 128M x 16
Access Time: 110 ns
Memory Interface: Parallel
DigiKey Programmable: Not Verified
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S70GL02GS12FHBV20 S70GL02GS12FHBV20 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 128M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S70GL02GS11FHI013 S70GL02GS11FHI013 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 110 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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S70GL02GS12FHIV23 S70GL02GS12FHIV23 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S70GL02GS11FHA013 S70GL02GS11FHA013 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74 Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Memory Organization: 128M x 16
Access Time: 110 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
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S70GL02GS11FHSS50 S70GL02GS11FHSS50 Infineon Technologies infineon-s70gl02gs-2gbit256mbytes3-0v-flash-memory-datasheet-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S70GL02GS12FHVV20 S70GL02GS12FHVV20 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 128M x 16
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S70GL02GS12FHB010 S70GL02GS12FHB010 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74 Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 128M x 16
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S70GL02GS12FHB020 S70GL02GS12FHB020 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74 Description: IC FLASH 2GBIT PARALLEL 64FBGA
Package / Case: 64-LBGA
Packaging: Tray
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
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S70GL02GS12FHIV13 S70GL02GS12FHIV13 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
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S70GL02GS12FHVV23 S70GL02GS12FHVV23 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 2GBIT PARALLEL 64FBGA
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
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S70GL02GS11FHA010 S70GL02GS11FHA010 Infineon Technologies Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74 Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 110 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
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IPC045N10L3X1SA1 IPC045N10L3X1SA1 Infineon Technologies Infineon-IPC045N10L3-DS-v02_05-EN.pdf?fileId=5546d4624ad04ef9014af2cbd861121a Description: MOSFET N-CH 100V 1A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tj)
Rds On (Max) @ Id, Vgs: 100mOhm @ 2A, 4.5V
Vgs(th) (Max) @ Id: 2.1V @ 33µA
Supplier Device Package: Sawn on foil
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Drain to Source Voltage (Vdss): 100 V
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IRFU7540PBF IRFU7540PBF Infineon Technologies irfr7540pbf.pdf?fileId=5546d462533600a401535635b06a211c Description: MOSFET N-CH 60V 90A IPAK
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 4360 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 130 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Obsolete
Supplier Device Package: IPAK (TO-251AA)
Vgs(th) (Max) @ Id: 3.7V @ 100µA
Power Dissipation (Max): 140W (Tc)
Rds On (Max) @ Id, Vgs: 4.8mOhm @ 66A, 10V
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IPA80R750P7XKSA1 IPA80R750P7XKSA1 Infineon Technologies infineon-ipa80r750p7-datasheet-en.pdf Description: MOSFET N-CHANNEL 800V 7A TO220
Part Status: Active
Supplier Device Package: PG-TO220-FP
Vgs(th) (Max) @ Id: 3.5V @ 140µA
Power Dissipation (Max): 27W (Tc)
Rds On (Max) @ Id, Vgs: 750mOhm @ 2.7A, 10V
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Drain to Source Voltage (Vdss): 800 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
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Lieferzeit 10-14 Tag (e)
6+3.8 EUR
50+1.83 EUR
100+1.64 EUR
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S29GL512S10DHSS23 S29GL512S10DHSS23 Infineon Technologies PdfFile_133368.pdf Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
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S29GL512S10DHSS10 S29GL512S10DHSS10 Infineon Technologies Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5 Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2600 Stücke
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S29GL512S10DHI013 S29GL512S10DHI013 Infineon Technologies infineon-s29gl01gs-s29gl512s-s29gl256s-s29gl128s-128-mb-256-mb-512-mb-1-gb-gl-s-mirrorbit-tm-flash-parallel-3-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
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S29GL512S10DHI023 S29GL512S10DHI023 Infineon Technologies infineon-s29gl01gs-s29gl512s-s29gl256s-s29gl128s-128-mb-256-mb-512-mb-1-gb-gl-s-mirrorbit-tm-flash-parallel-3-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
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S29GL512S10DHSS13 S29GL512S10DHSS13 Infineon Technologies PdfFile_133368.pdf Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
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S29GL512S10DHSS20 S29GL512S10DHSS20 Infineon Technologies PdfFile_133368.pdf Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S6J336CHSBSE20000 S6J336CHSBSE20000 Infineon Technologies Infineon-S6J3360_Series_S6J3370_Series_32-bit_Arm_Cortex-R5F_TRAVEO_T1G_Microcontroller-AdditionalTechnicalInformation-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4479d6ae2 Description: TRAVEO-40NM
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 112KB (112K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-TEQFP (20x20)
Part Status: Active
Number of I/O: 94
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S6J336CHEBSE20000 S6J336CHEBSE20000 Infineon Technologies Infineon-S6J3360_Series_S6J3370_Series_32-bit_Arm_Cortex-R5F_TRAVEO_T1G_Microcontroller-AdditionalTechnicalInformation-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4479d6ae2 Description: TRAVEO-40NM
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 112KB (112K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-TEQFP (20x20)
Part Status: Active
Number of I/O: 94
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MB9BF324KPMC-G-JNK1E2 MB9BF324KPMC-G-JNK1E2 Infineon Technologies Description: IC MCU 32BIT 288KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Connectivity: CSIO, EBI/EMI, I²C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 72MHz
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CY9BF324MPMC1-G-JNE2 CY9BF324MPMC1-G-JNE2 Infineon Technologies download Description: IC MCU 32BIT 288KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 26x12b; D/A 2x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
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CY9BF324KQN-G-AVK1E2 Infineon Technologies infineon-cy9b320m-fm3-mcu-datasheet-datasheet-en.pdf Description: IC MCU 32BIT 288KB 48VFQFN
Number of I/O: 35
Part Status: Active
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 14x12b SAR; D/A 2x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 72MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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CY9BF324KPMC-G-MNK1E2 CY9BF324KPMC-G-MNK1E2 Infineon Technologies Description: IC MM MCU 48LQFP
Part Status: Obsolete
Packaging: Tray
DigiKey Programmable: Not Verified
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CY9BF324KQN-G-AVEFE2 Infineon Technologies infineon-cy9b320m-fm3-mcu-datasheet-datasheet-en.pdf Description: IC MCU 32BIT 288KB 48VFQFN
Part Status: Active
Packaging: Tape & Reel (TR)
Number of I/O: 35
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 14x12b SAR; D/A 2x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 72MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Produkt ist nicht verfügbar
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SAK-XC886CM-8FFA3V3AC SAK-XC886CM-8FFA3V3AC Infineon Technologies INFNS13207-1.pdf?t.download=true&u=5oefqw Description: XC800 I-FAMILY MICROCONTROLLER ,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SAH-XC2361A72F100LAAHXUMA1 Infineon Technologies INFNS28084-1.pdf?t.download=true&u=5oefqw Description: 16-BIT C166 MICROCONTROLLER - XC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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XC2361A72F80L50AAHXUMA1 XC2361A72F80L50AAHXUMA1 Infineon Technologies XC2361A,63A-65A.pdf Description: IC MCU 16/32B 576KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-8
Part Status: Obsolete
Number of I/O: 75
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9023539AA Infineon Technologies Description: IC
Part Status: Discontinued at Digi-Key
Packaging: Bulk
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9023596AA Infineon Technologies Description: IC
Part Status: Discontinued at Digi-Key
Packaging: Bulk
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9023538AA Infineon Technologies Description: IC
Part Status: Discontinued at Digi-Key
Packaging: Bulk
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9023260 Infineon Technologies Description: IC
Part Status: Discontinued at Digi-Key
Packaging: Bulk
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TZ740N22KOFHPSA3 TZ740N.pdf
TZ740N22KOFHPSA3
Hersteller: Infineon Technologies
Description: SCR MODULE 2.2KV 1500A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 500 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 30000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 819 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 2.2 kV
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TZ400N26KOFHPSA1 Infineon-TZ400N-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b42f86ad4c0d
TZ400N26KOFHPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 2.6KV 1050A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 13000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 670 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1050 A
Voltage - Off State: 2.6 kV
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T940N16TOFXPSA1 Infineon-T940N-DS-v03_02-en_de.pdf?fileId=db3a3043284aacd80128638a89e4536f
T940N16TOFXPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1800V 1759A DO200AB
Voltage - Off State: 1.8 kV
Current - On State (It (RMS)) (Max): 1759 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (AV)) (Max): 959 A
Number of SCRs, Diodes: 1 SCR
Current - Non Rep. Surge 50, 60Hz (Itsm): 17500A @ 50Hz
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Single
Operating Temperature: -40°C ~ 125°C
Mounting Type: Clamp On
Package / Case: DO-200AB, B-PUK
Packaging: Tray
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1+321.97 EUR
18+301.56 EUR
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FZ2400R17HP4B28BOSA2 Infineon-FZ2400R17HP4_B28-DS-v03_01-EN.pdf?fileId=5546d462525dbac401527e3ca8b66b48
FZ2400R17HP4B28BOSA2
Hersteller: Infineon Technologies
Description: IGBT MOD 1700V 4800A 15500W MOD
Input Capacitance (Cies) @ Vce: 195 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 15500 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 4800 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 2400A
Operating Temperature: -40°C ~ 150°C
Configuration: Single Switch
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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MB95F136NBSPFV-GSE1 5047
MB95F136NBSPFV-GSE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 30SSOP
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Packaging: Tube
Number of I/O: 19
Part Status: Discontinued at Digi-Key
Supplier Device Package: 30-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
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MB95F136NBSPFV-GS-N2E1 5047
MB95F136NBSPFV-GS-N2E1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 30SSOP
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Number of I/O: 19
Part Status: Obsolete
Supplier Device Package: 30-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Packaging: Bulk
Produkt ist nicht verfügbar
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MB95F136HWPF-GE1 5047
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 28SOP
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: LCD, LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
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MB95F136HWPF-GE1 5047
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 28SOP
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Bulk
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: LCD, LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
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MB95F136MBSPFV-GE1 448_MB95130MBdownload.pdf
MB95F136MBSPFV-GE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 30SSOP
Number of I/O: 19
Part Status: Discontinued at Digi-Key
Supplier Device Package: 30-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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CYPD3172-24LQXQT Infineon-CCG3PA-NFET_USB_Type-C_Port_Controller-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea4c007347
CYPD3172-24LQXQT
Hersteller: Infineon Technologies
Description: CCG3PA-NFET
Packaging: Tape & Reel (TR)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Controller Series: CYPD3x
Program Memory Type: FLASH (64kB)
Applications: Power Adaptor
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYPD3172-24LQXQ Infineon-CCG3PA-NFET_USB_Type-C_Port_Controller-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea4c007347
CYPD3172-24LQXQ
Hersteller: Infineon Technologies
Description: CCG3PA-NFET
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Controller Series: CYPD3x
Program Memory Type: FLASH (64kB)
Applications: Power Adaptor
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPG20N06S4L11AATMA1 Infineon-IPG20N06S4L-11A-DS-v01_00-EN.pdf?fileId=5546d462503812bb01508030120e6574
IPG20N06S4L11AATMA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 60V 20A 8TDSON
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount, Wettable Flank
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 65W
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 20A
Input Capacitance (Ciss) (Max) @ Vds: 4020pF @ 25V
Rds On (Max) @ Id, Vgs: 11.2mOhm @ 17A, 10V
Gate Charge (Qg) (Max) @ Vgs: 53nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2.2V @ 28µA
Supplier Device Package: PG-TDSON-8-10
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IPG20N06S4L11AATMA1 Infineon-IPG20N06S4L-11A-DS-v01_00-EN.pdf?fileId=5546d462503812bb01508030120e6574
IPG20N06S4L11AATMA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 60V 20A 8TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount, Wettable Flank
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 65W
Drain to Source Voltage (Vdss): 60V
Current - Continuous Drain (Id) @ 25°C: 20A
Input Capacitance (Ciss) (Max) @ Vds: 4020pF @ 25V
Rds On (Max) @ Id, Vgs: 11.2mOhm @ 17A, 10V
Gate Charge (Qg) (Max) @ Vgs: 53nC @ 10V
FET Feature: Logic Level Gate
Vgs(th) (Max) @ Id: 2.2V @ 28µA
Supplier Device Package: PG-TDSON-8-10
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
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5+4.55 EUR
10+2.93 EUR
50+2.23 EUR
100+2 EUR
500+1.59 EUR
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BCR 519 E6327 BCR519.pdf
BCR 519 E6327
Hersteller: Infineon Technologies
Description: TRANS PREBIAS NPN 50V SOT23
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Resistor - Base (R1): 4.7 kOhms
Frequency - Transition: 100 MHz
Power - Max: 330 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 500 mA
Part Status: Obsolete
Supplier Device Package: PG-SOT23
DC Current Gain (hFE) (Min) @ Ic, Vce: 120 @ 50mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 2.5mA, 50mA
Produkt ist nicht verfügbar
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IPP07N03LB G IPP07N03LB_G.pdf
IPP07N03LB G
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 50A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 2782 pF @ 15 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 5 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Part Status: Obsolete
Supplier Device Package: PG-TO220-3-1
Vgs(th) (Max) @ Id: 2V @ 40µA
Power Dissipation (Max): 94W (Tc)
Rds On (Max) @ Id, Vgs: 6.6mOhm @ 50A, 10V
Current - Continuous Drain (Id) @ 25°C: 50A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Produkt ist nicht verfügbar
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FP75R12N2T4PBPSA1 448_FP75R12N2T4PBPSA1.pdf
Hersteller: Infineon Technologies
Description: IGBT MODULE LOW POWER ECONO
Part Status: Active
Packaging: Bulk
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3+217.92 EUR
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FP75R12N2T4PBPSA1 448_FP75R12N2T4PBPSA1.pdf
Hersteller: Infineon Technologies
Description: IGBT MODULE LOW POWER ECONO
Part Status: Active
Packaging: Tray
Produkt ist nicht verfügbar
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MB89935BPFV-G-387-ERE1 ProductGuide_2008.1.pdf
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB MROM 30SSOP
Supplier Device Package: 30-SSOP
Peripherals: POR, PWM, WDT
Connectivity: Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Number of I/O: 21
Part Status: Obsolete
Package / Case: 30-LSSOP (0.220", 5.60mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MB89193APF-G-387-BND-RE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB MROM 28SOP
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: POR, WDT
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tube
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
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MB89193APF-G-387-BND-R
MB89193APF-G-387-BND-R
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB MROM 28SOP
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: POR, WDT
Connectivity: Serial I/O
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Bulk
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Produkt ist nicht verfügbar
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FD1000R33HE3KBPSA1 Infineon-FD1000R33HE3_K-DS-v03_01-en_de.pdf?fileId=db3a30431ce5fb52011d76007b9a7266
FD1000R33HE3KBPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 3300V 1000A 11500W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Dual Brake Chopper
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1000A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1000 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 11500 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 190 nF @ 25 V
Produkt ist nicht verfügbar
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FF1000R17IE4PBOSA1 Infineon-FF1000R17IE4P-DS-v03_02-EN.pdf?fileId=5546d46253a864fe0153e62757277813
FF1000R17IE4PBOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 1000A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 1000A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1000 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1000000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 81 nF @ 25 V
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1+1118.93 EUR
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FZ1000R33HE3BPSA1 Infineon-FZ1000R33HE3-DS-v03_02-EN.pdf?fileId=db3a30431ce5fb52011d760f30227290
FZ1000R33HE3BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 3300V 1000A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Switch
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Not For New Designs
Current - Collector (Ic) (Max): 1000 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 190 nF @ 25 V
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+2245.8 EUR
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S70GL02GS12FHBV23 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GS12FHBV23
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1600 Stücke
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S70GL02GS11FHSS60 infineon-s70gl02gs-2gbit256mbytes3-0v-flash-memory-datasheet-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr
S70GL02GS11FHSS60
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S70GL02GS11FHI023 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GS11FHI023
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Memory Organization: 128M x 16
Access Time: 110 ns
Memory Interface: Parallel
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S70GL02GS12FHBV20 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GS12FHBV20
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 128M x 16
Grade: Automotive
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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S70GL02GS11FHI013 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GS11FHI013
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 110 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S70GL02GS12FHIV23 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GS12FHIV23
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1600 Stücke
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S70GL02GS11FHA013 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74
S70GL02GS11FHA013
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Memory Organization: 128M x 16
Access Time: 110 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S70GL02GS11FHSS50 infineon-s70gl02gs-2gbit256mbytes3-0v-flash-memory-datasheet-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr
S70GL02GS11FHSS50
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 128M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
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S70GL02GS12FHVV20 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GS12FHVV20
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
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S70GL02GS12FHB010 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74
S70GL02GS12FHB010
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 2Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 128M x 16
Produkt ist nicht verfügbar
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S70GL02GS12FHB020 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74
S70GL02GS12FHB020
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Package / Case: 64-LBGA
Packaging: Tray
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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S70GL02GS12FHIV13 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GS12FHIV13
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1600 Stücke
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S70GL02GS12FHVV23 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S70GL02GS12FHVV23
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Memory Organization: 128M x 16
Access Time: 120 ns
Memory Interface: Parallel
Part Status: Active
Produkt ist nicht verfügbar
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S70GL02GS11FHA010 Infineon-S70GL02GS_2Gbit_(256Mbytes)_3.0V_Flash_Memory-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed148734d74
S70GL02GS11FHA010
Hersteller: Infineon Technologies
Description: IC FLASH 2GBIT PARALLEL 64FBGA
Memory Organization: 128M x 16
Access Time: 110 ns
Memory Interface: Parallel
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 2Gbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
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IPC045N10L3X1SA1 Infineon-IPC045N10L3-DS-v02_05-EN.pdf?fileId=5546d4624ad04ef9014af2cbd861121a
IPC045N10L3X1SA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 1A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1A (Tj)
Rds On (Max) @ Id, Vgs: 100mOhm @ 2A, 4.5V
Vgs(th) (Max) @ Id: 2.1V @ 33µA
Supplier Device Package: Sawn on foil
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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IRFU7540PBF irfr7540pbf.pdf?fileId=5546d462533600a401535635b06a211c
IRFU7540PBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 90A IPAK
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 4360 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 130 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Obsolete
Supplier Device Package: IPAK (TO-251AA)
Vgs(th) (Max) @ Id: 3.7V @ 100µA
Power Dissipation (Max): 140W (Tc)
Rds On (Max) @ Id, Vgs: 4.8mOhm @ 66A, 10V
Produkt ist nicht verfügbar
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IPA80R750P7XKSA1 infineon-ipa80r750p7-datasheet-en.pdf
IPA80R750P7XKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CHANNEL 800V 7A TO220
Part Status: Active
Supplier Device Package: PG-TO220-FP
Vgs(th) (Max) @ Id: 3.5V @ 140µA
Power Dissipation (Max): 27W (Tc)
Rds On (Max) @ Id, Vgs: 750mOhm @ 2.7A, 10V
Current - Continuous Drain (Id) @ 25°C: 7A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 460 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Drain to Source Voltage (Vdss): 800 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
auf Bestellung 442 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
6+3.8 EUR
50+1.83 EUR
100+1.64 EUR
Mindestbestellmenge: 6 Stücke
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S29GL512S10DHSS23 PdfFile_133368.pdf
S29GL512S10DHSS23
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL512S10DHSS10 Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5
S29GL512S10DHSS10
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2600 Stücke
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S29GL512S10DHI013 infineon-s29gl01gs-s29gl512s-s29gl256s-s29gl128s-128-mb-256-mb-512-mb-1-gb-gl-s-mirrorbit-tm-flash-parallel-3-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium
S29GL512S10DHI013
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL512S10DHI023 infineon-s29gl01gs-s29gl512s-s29gl256s-s29gl128s-128-mb-256-mb-512-mb-1-gb-gl-s-mirrorbit-tm-flash-parallel-3-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium
S29GL512S10DHI023
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL512S10DHSS13 PdfFile_133368.pdf
S29GL512S10DHSS13
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL512S10DHSS20 PdfFile_133368.pdf
S29GL512S10DHSS20
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S6J336CHSBSE20000 Infineon-S6J3360_Series_S6J3370_Series_32-bit_Arm_Cortex-R5F_TRAVEO_T1G_Microcontroller-AdditionalTechnicalInformation-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4479d6ae2
S6J336CHSBSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-40NM
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 112KB (112K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-TEQFP (20x20)
Part Status: Active
Number of I/O: 94
Produkt ist nicht verfügbar
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S6J336CHEBSE20000 Infineon-S6J3360_Series_S6J3370_Series_32-bit_Arm_Cortex-R5F_TRAVEO_T1G_Microcontroller-AdditionalTechnicalInformation-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4479d6ae2
S6J336CHEBSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-40NM
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 112KB (112K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 144-TEQFP (20x20)
Part Status: Active
Number of I/O: 94
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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MB9BF324KPMC-G-JNK1E2
MB9BF324KPMC-G-JNK1E2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 48LQFP
DigiKey Programmable: Not Verified
Number of I/O: 35
Part Status: Obsolete
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Bulk
Connectivity: CSIO, EBI/EMI, I²C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 14x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 72MHz
Produkt ist nicht verfügbar
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CY9BF324MPMC1-G-JNE2 download
CY9BF324MPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 26x12b; D/A 2x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
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CY9BF324KQN-G-AVK1E2 infineon-cy9b320m-fm3-mcu-datasheet-datasheet-en.pdf
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB 48VFQFN
Number of I/O: 35
Part Status: Active
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 14x12b SAR; D/A 2x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 72MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 2600 Stücke
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CY9BF324KPMC-G-MNK1E2
CY9BF324KPMC-G-MNK1E2
Hersteller: Infineon Technologies
Description: IC MM MCU 48LQFP
Part Status: Obsolete
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF324KQN-G-AVEFE2 infineon-cy9b320m-fm3-mcu-datasheet-datasheet-en.pdf
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB 48VFQFN
Part Status: Active
Packaging: Tape & Reel (TR)
Number of I/O: 35
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 14x12b SAR; D/A 2x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 72MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 48-VFQFN Exposed Pad
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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SAK-XC886CM-8FFA3V3AC INFNS13207-1.pdf?t.download=true&u=5oefqw
SAK-XC886CM-8FFA3V3AC
Hersteller: Infineon Technologies
Description: XC800 I-FAMILY MICROCONTROLLER ,
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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SAH-XC2361A72F100LAAHXUMA1 INFNS28084-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: 16-BIT C166 MICROCONTROLLER - XC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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XC2361A72F80L50AAHXUMA1 XC2361A,63A-65A.pdf
XC2361A72F80L50AAHXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16/32B 576KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-8
Part Status: Obsolete
Number of I/O: 75
Produkt ist nicht verfügbar
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9023539AA
Hersteller: Infineon Technologies
Description: IC
Part Status: Discontinued at Digi-Key
Packaging: Bulk
Produkt ist nicht verfügbar
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9023596AA
Hersteller: Infineon Technologies
Description: IC
Part Status: Discontinued at Digi-Key
Packaging: Bulk
Produkt ist nicht verfügbar
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9023538AA
Hersteller: Infineon Technologies
Description: IC
Part Status: Discontinued at Digi-Key
Packaging: Bulk
Produkt ist nicht verfügbar
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9023260
Hersteller: Infineon Technologies
Description: IC
Part Status: Discontinued at Digi-Key
Packaging: Bulk
Produkt ist nicht verfügbar
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