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CYBT-263064-02 CYBT-263064-02 Infineon Technologies Infineon-CYBT-273063-02_CYBT-263064-02_CYBT-263065-02_EZ-BT_MODULE_(PRELIMINARY)-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea1d1c72f6 Description: RF TXRX MOD BT ISM>1GHZU.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: 37-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 176kB RAM
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.3V
Power - Output: 15dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.0
Current - Receiving: 5.9mA
Current - Transmitting: 5.8mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: CYW20819
Modulation: GFSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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CYBT-263065-02 CYBT-263065-02 Infineon Technologies Infineon-CYBT-273063-02_CYBT-263064-02_CYBT-263065-02_EZ-BT_MODULE_(PRELIMINARY)-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea1d1c72f6 Description: RF TXRX MOD BT ISM>1GHZU.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: 35-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 176kB RAM
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.3V
Power - Output: 15dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.0
Current - Receiving: 5.9mA
Current - Transmitting: 5.8mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: CYW20819
Modulation: GFSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MB39A130APFT-G-BND-ERE1 MB39A130APFT-G-BND-ERE1 Infineon Technologies download Description: IC REG CTRLR BUCK 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TFSOP (0.173", 4.40mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -30°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 780kHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 25V
Supplier Device Package: 24-TSSOP
Synchronous Rectifier: Yes
Control Features: Current Limit, Power Good, Soft Start
Output Phases: 1
Clock Sync: No
Part Status: Obsolete
Number of Outputs: 1
Produkt ist nicht verfügbar
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MB39A130APFT-G-BND-ERE1 MB39A130APFT-G-BND-ERE1 Infineon Technologies download Description: IC REG CTRLR BUCK 24TSSOP
Packaging: Cut Tape (CT)
Package / Case: 24-TFSOP (0.173", 4.40mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -30°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 780kHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 25V
Supplier Device Package: 24-TSSOP
Synchronous Rectifier: Yes
Control Features: Current Limit, Power Good, Soft Start
Output Phases: 1
Clock Sync: No
Part Status: Obsolete
Number of Outputs: 1
Produkt ist nicht verfügbar
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PTFA220081MV4S500XUMA1 Infineon Technologies PTFA220081M_Rev6_7-18-17.pdf Description: IC AMP RF LDMOS 10-SON
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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FF8MR12W1M1HB11BPSA1 FF8MR12W1M1HB11BPSA1 Infineon Technologies Infineon-FF8MR12W1M1H_B11-DataSheet-v00_30-EN.pdf?fileId=8ac78c8c8b6555fe018b72791dec7c06 Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
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FF17MR12W1M1HB70BPSA1 FF17MR12W1M1HB70BPSA1 Infineon Technologies Infineon-FF17MR12W1M1H_B70-DataSheet-v00_20-EN.pdf?fileId=8ac78c8c8779172a0188201359d2742d Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
auf Bestellung 26 Stücke:
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DF11MR12W1M1HFB67BPSA1 DF11MR12W1M1HFB67BPSA1 Infineon Technologies DF11MR12W1M1HF_B67_Rev0.10_11-24-22.pdf Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
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FF17MR12W1M1HPB11BPSA1 FF17MR12W1M1HPB11BPSA1 Infineon Technologies Infineon-FF17MR12W1M1HP_B11-DataSheet-v00_30-EN.pdf?fileId=8ac78c8c8779172a0188201303c57421 Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
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FF17MR12W1M1HB11BPSA1 FF17MR12W1M1HB11BPSA1 Infineon Technologies Infineon-FF17MR12W1M1H_B11-DataSheet-v00_30-EN.pdf?fileId=8ac78c8c8779172a01882012a9ea7415 Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
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CY90347DASPFV-GS-469E1 CY90347DASPFV-GS-469E1 Infineon Technologies Infineon-F2MC-16LX_MB90350E_Series_16-bit_Microcontrollers-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edd6b7d61d6 Description: IC MCU 16BIT 128KB MROM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-16LX
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 82
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BSZ0503NSIATMA1 BSZ0503NSIATMA1 Infineon Technologies Infineon-BSZ0503NSI-DS-v02_00-EN.pdf?fileId=5546d4624f205c9a014f3c2d37301ce7 Description: MOSFET N-CH 30V 20A/40A TSDSON
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 20A (Ta), 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 36W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-TSDSON-8-FL
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 15 V
Produkt ist nicht verfügbar
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BSZ0503NSIATMA1 BSZ0503NSIATMA1 Infineon Technologies Infineon-BSZ0503NSI-DS-v02_00-EN.pdf?fileId=5546d4624f205c9a014f3c2d37301ce7 Description: MOSFET N-CH 30V 20A/40A TSDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 20A (Ta), 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 36W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-TSDSON-8-FL
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 15 V
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8+2.78 EUR
12+1.75 EUR
100+1.17 EUR
500+0.92 EUR
1000+0.83 EUR
2000+0.76 EUR
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IPB034N06N3GATMA2 Infineon Technologies Infineon-IPB034N06N3%20G-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f56e2d130d41 Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 100A, 10V
Power Dissipation (Max): 167W (Tc)
Vgs(th) (Max) @ Id: 4V @ 93µA
Supplier Device Package: PG-TO263-7-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 130 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11000 pF @ 30 V
Produkt ist nicht verfügbar
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FP25R12KT4B16BPSA1 FP25R12KT4B16BPSA1 Infineon Technologies Infineon-FP25R12KT4-DS-v03_00-en_de.pdf?fileId=db3a30431ed1d7b2011f697849180e4c Description: IGBT MODULE 1200V 25A AG-ECONO2B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 25 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 160 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.45 nF @ 25 V
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FP75R07N2E4BPSA1 FP75R07N2E4BPSA1 Infineon Technologies Infineon-FP75R07N2E4-DS-v03_00-EN.pdf?fileId=db3a3043315daf440131612c3f1341df Description: IGBT MODULE 650V 95A AG-ECONO2B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.95V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 95 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 4.6 nF @ 25 V
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S29GL256S90DHSS33 S29GL256S90DHSS33 Infineon Technologies Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY3696 Infineon Technologies download Description: SOCKET ADAPTER FOR CY2077FS
Packaging: Bulk
For Use With/Related Products: CY2077FS
Accessory Type: Socket Adapter
Part Status: Obsolete
Produkt ist nicht verfügbar
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D2200N20TVFXPSA1 D2200N20TVFXPSA1 Infineon Technologies D2200N.pdf Description: DIODE STANDARD 2200A BGD7526K01
Packaging: Tray
Package / Case: DO-200AC, K-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 2200A
Supplier Device Package: BG-D7526K0-1
Operating Temperature - Junction: -40°C ~ 160°C
Part Status: Last Time Buy
Current - Reverse Leakage @ Vr: 150 mA @ 2000 V
Produkt ist nicht verfügbar
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CY25560SXC CY25560SXC Infineon Technologies Infineon-CY25560_SPREAD_SPECTRUM_CLOCK_GENERATOR-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec5cf783bf3 Description: IC CLK/FREQ SYNTH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 100MHz
Type: Clock/Frequency Synthesizer, Frequency Modulator, Spread Spectrum Clock Generator
Input: Clock, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:1
Differential - Input:Output: No/No
Supplier Device Package: 8-SOIC
PLL: Yes
Divider/Multiplier: Yes/No
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FF1200R17KP4B2NOSA2 FF1200R17KP4B2NOSA2 Infineon Technologies Infineon-FF1200R17KP4_B2-DS-v03_01-EN.pdf?fileId=db3a304320d39d590122175b5e4b07f5 Description: IGBT MODULE 1700V 1200A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
NTC Thermistor: No
Supplier Device Package: AG-PRIME2
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1700 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1400 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 98 nF @ 25 V
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1+2157.95 EUR
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S25HL512TDPNHV010 S25HL512TDPNHV010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 512MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FF200R12KE3B2HOSA1 FF200R12KE3B2HOSA1 Infineon Technologies Infineon-FF200R12KE3-DS-v03_01-en_cn.pdf?fileId=db3a30433dcf2fc4013dd01c80660219 Description: IGBT MOD 1200V 295A 1050W MOD
Part Status: Active
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
Operating Temperature: -40°C ~ 125°C
Configuration: Half Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 1050 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 295 A
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CY7112 CY7112 Infineon Technologies Infineon-CY7112_EZ-PD_PMG1-S2_Prototyping_Kit_Release_Notes-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0f039dbb1b30&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: EVAL BOARD FOR EZ-PD PMG1-S2
Packaging: Box
Function: USB Type-C® Power Delivery (PD)
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: EZ-PD PMG1-S2
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: USB PD 3.0
Secondary Attributes: I2C/SPI/UART Interface(s)
Embedded: Yes, MCU
Part Status: Active
Produkt ist nicht verfügbar
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CY9BF416RPMC-G-JNE2 CY9BF416RPMC-G-JNE2 Infineon Technologies download Description: IC MCU 32BIT 512KB FLASH 120LQFP
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Part Status: Active
Number of I/O: 103
DigiKey Programmable: Not Verified
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2+15.33 EUR
10+11.89 EUR
84+10.19 EUR
168+9.82 EUR
252+9.64 EUR
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BSF450NE7NH3XUMA1 BSF450NE7NH3XUMA1 Infineon Technologies Infineon-BSF450NE7NH3-DS-v02_02-EN.pdf?fileId=db3a30433a047ba0013a687e2ae403da Description: MOSFET N-CH 75V 5A/15A 2WDSON
Input Capacitance (Ciss) (Max) @ Vds: 390 pF @ 37.5 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Part Status: Active
Supplier Device Package: MG-WDSON-2, CanPAK M™
Vgs(th) (Max) @ Id: 3.5V @ 8µA
Power Dissipation (Max): 2.2W (Ta), 18W (Tc)
Rds On (Max) @ Id, Vgs: 45mOhm @ 8A, 10V
Current - Continuous Drain (Id) @ 25°C: 5A (Ta), 15A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-WDSON
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BSF450NE7NH3XUMA1 BSF450NE7NH3XUMA1 Infineon Technologies Infineon-BSF450NE7NH3-DS-v02_02-EN.pdf?fileId=db3a30433a047ba0013a687e2ae403da Description: MOSFET N-CH 75V 5A/15A 2WDSON
Current - Continuous Drain (Id) @ 25°C: 5A (Ta), 15A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-WDSON
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 390 pF @ 37.5 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Part Status: Active
Supplier Device Package: MG-WDSON-2, CanPAK M™
Vgs(th) (Max) @ Id: 3.5V @ 8µA
Power Dissipation (Max): 2.2W (Ta), 18W (Tc)
Rds On (Max) @ Id, Vgs: 45mOhm @ 8A, 10V
auf Bestellung 4300 Stücke:
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7+3.09 EUR
10+2.57 EUR
100+2.05 EUR
500+1.73 EUR
1000+1.46 EUR
2000+1.39 EUR
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IRS2001SPBF IRS2001SPBF Infineon Technologies irs2001pbf.pdf?fileId=5546d462533600a401535675a760277e Description: IC GATE DRVR HALF-BRIDGE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 200 V
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 70ns, 35ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IAUT300N10S5N014ATMA1 IAUT300N10S5N014ATMA1 Infineon Technologies Infineon-IAUT300N10S5N014-DataSheet-v01_01-EN.pdf?fileId=5546d46277921c32017795c1685a4680 Description: MOSFET_(75V 120V( PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 360A (Tj)
Rds On (Max) @ Id, Vgs: 1.4mOhm @ 100A, 10V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 275µA
Supplier Device Package: PG-HSOF-8-1
Grade: Automotive
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 216 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 16011 pF @ 50 V
Qualification: AEC-Q101
auf Bestellung 11773 Stücke:
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2+11.9 EUR
10+7.97 EUR
100+5.75 EUR
500+5.32 EUR
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IAUT300N08S5N011ATMA1 IAUT300N08S5N011ATMA1 Infineon Technologies infineon-iaut300n08s5n011-datasheet-en.pdf Description: MOSFET_(75V 120V( PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 410A (Tj)
Rds On (Max) @ Id, Vgs: 1.1mOhm @ 100A, 10V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 275µA
Supplier Device Package: PG-HSOF-8-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 231 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 16250 pF @ 40 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 17044 Stücke:
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10+8.03 EUR
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500+5.37 EUR
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IAUS300N10S5N014ATMA1 IAUS300N10S5N014ATMA1 Infineon Technologies Infineon-IAUS300N10S5N014-DataSheet-v01_01-EN.pdf?fileId=5546d46277921c32017795c159b7467d Description: MOSFET_(75V 120V( PG-HSOG-8
Qualification: AEC-Q101
Grade: Automotive
Package / Case: 8-PowerSMD, Gull Wing
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 16011 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 216 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-HSOG-8-1
Vgs(th) (Max) @ Id: 3.8V @ 275µA
Power Dissipation (Max): 375W (Tc)
Rds On (Max) @ Id, Vgs: 1.4mOhm @ 100A, 10V
Current - Continuous Drain (Id) @ 25°C: 360A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
auf Bestellung 959 Stücke:
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10+8.33 EUR
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IAUTN12S5N018GATMA1 IAUTN12S5N018GATMA1 Infineon Technologies Infineon-IAUTN12S5N018G-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c86919021018712f65ab14212 Description: MOSFET_(120V 300V)
Qualification: AEC-Q101
Grade: Automotive
Drain to Source Voltage (Vdss): 120 V
Part Status: Active
Supplier Device Package: PG-HSOG-8-1
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: 8-PowerSMD, Gull Wing
Packaging: Cut Tape (CT)
auf Bestellung 1276 Stücke:
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10+10.08 EUR
100+7.83 EUR
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IAUTN12S5N017ATMA1 IAUTN12S5N017ATMA1 Infineon Technologies Infineon-IAUTN12S5N017-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c86919021018712f66aa24215 Description: MOSFET_(120V 300V)
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: PG-HSOF-8-1
Part Status: Active
Drain to Source Voltage (Vdss): 120 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IAUTN12S5N017ATMA1 IAUTN12S5N017ATMA1 Infineon Technologies Infineon-IAUTN12S5N017-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c86919021018712f66aa24215 Description: MOSFET_(120V 300V)
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: PG-HSOF-8-1
Part Status: Active
Drain to Source Voltage (Vdss): 120 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 408 Stücke:
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2+13.15 EUR
10+8.9 EUR
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2SP0430T2A0CFF18R17NPSA1 Infineon Technologies Description: MODULE GATE DRIVER
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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CY9AF141MAPMC1-G-JNE2 Infineon Technologies Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I²C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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CYBT-343026-PROG CYBT-343026-PROG Infineon Technologies Infineon-CYBT-343026-PROG_EZ-BT(TM)_WICED_MODULE_PROGRAMMING_KIT-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0f01497918a0 Description: MODULE KIT
Packaging: Bulk
For Use With/Related Products: EZ-BT WICED Modules
Type: Programmer (Universal Out-of-Circuit)
Contents: Board(s)
Part Status: Active
auf Bestellung 2 Stücke:
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CY8C4244PVQ-442 CY8C4244PVQ-442 Infineon Technologies Infineon-PSOC_4_PSOC_4200_FAMILY_DATASHEET_PROGRAMMABLE_SYSTEM-ON-CHIP-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec80ee2400e Description: IC MCU 32BIT 16KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR; D/A 2xIDAC
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY14MB064Q1A-SXI CY14MB064Q1A-SXI Infineon Technologies download Description: IC NVSRAM 64KBIT SPI 40MHZ 8SOIC
DigiKey Programmable: Not Verified
Memory Organization: 8K x 8
Memory Interface: SPI
Part Status: Obsolete
Supplier Device Package: 8-SOIC
Memory Format: NVSRAM
Clock Frequency: 40 MHz
Technology: NVSRAM (Non-Volatile SRAM)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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XC2289H200F100LABKXUMA1 XC2289H200F100LABKXUMA1 Infineon Technologies XC228xH.pdf Description: IC MCU 16/32B 1.6MB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1.6MB (1.6M x 8)
RAM Size: 138K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-13
Part Status: Not For New Designs
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XE167FH200F100LABKXUMA1 XE167FH200F100LABKXUMA1 Infineon Technologies Infineon-XE167XH-DS-v01_03-en.pdf?fileId=db3a304328c6bd5c0129121370f609a2 Description: IC MCU 16BIT 1.56MB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1.56MB (1.56M x 8)
RAM Size: 138K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-13
Part Status: Not For New Designs
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XE169FH200F100LABKXQSA1 XE169FH200F100LABKXQSA1 Infineon Technologies Infineon-XE169XH-DS-v01_03-en.pdf?fileId=db3a304328c6bd5c01291216ba3909a8 Description: IC MCU 16BIT 1.6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1.6MB (1.6M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 30x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-176-12
Part Status: Not For New Designs
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPI076N15N5AKSA1 IPI076N15N5AKSA1 Infineon Technologies Infineon-IPI076N15N5-DS-v02_00-EN.pdf?fileId=5546d46253f650570154a04379f754c9 Description: MV POWER MOS
Input Capacitance (Ciss) (Max) @ Vds: 4700 pF @ 75 V
Gate Charge (Qg) (Max) @ Vgs: 61 nC @ 10 V
Drain to Source Voltage (Vdss): 150 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Part Status: Active
Supplier Device Package: PG-TO262-3
Vgs(th) (Max) @ Id: 4.6V @ 160µA
Power Dissipation (Max): 214W (Tc)
Rds On (Max) @ Id, Vgs: 7.6mOhm @ 56A, 10V
Current - Continuous Drain (Id) @ 25°C: 112A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
auf Bestellung 316 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.72 EUR
50+5.09 EUR
100+4.65 EUR
Mindestbestellmenge: 3 Stücke
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IRFC3710D Infineon Technologies Description: MOSFET 100V 57A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 57A
Rds On (Max) @ Id, Vgs: 23mOhm @ 57A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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IRFC230NB Infineon Technologies Description: MOSFET 200V 9.3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 9.3A
Rds On (Max) @ Id, Vgs: 300mOhm @ 9.3A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drain to Source Voltage (Vdss): 200 V
Produkt ist nicht verfügbar
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IRFC4568EB Infineon Technologies Description: MOSFET N-CH 150V 171A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 171A (Ta)
Supplier Device Package: Die
Part Status: Obsolete
Drain to Source Voltage (Vdss): 150 V
Produkt ist nicht verfügbar
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IRFC9130NB Infineon Technologies Description: MOSFET 100V 14A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 14A
Rds On (Max) @ Id, Vgs: 200mOhm @ 14A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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IRFC7416B Infineon Technologies Description: MOSFET 30V 10A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 10A
Rds On (Max) @ Id, Vgs: 20mOhm @ 10A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 30 V
Produkt ist nicht verfügbar
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IRFC9140NB Infineon Technologies Description: MOSFET 100V 23A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 23A
Rds On (Max) @ Id, Vgs: 117mOhm @ 23A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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IRFC3315B Infineon Technologies Description: MOSFET 150V 23A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 23A
Rds On (Max) @ Id, Vgs: 70mOhm @ 23A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 150 V
Produkt ist nicht verfügbar
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IRFC240NB Infineon Technologies Description: MOSFET 200V DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Supplier Device Package: Die
Part Status: Obsolete
Drain to Source Voltage (Vdss): 200 V
Produkt ist nicht verfügbar
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IRFC250NB Infineon Technologies Description: MOSFET 200V DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Supplier Device Package: Die
Part Status: Obsolete
Drain to Source Voltage (Vdss): 200 V
Produkt ist nicht verfügbar
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IRFC4127EB Infineon Technologies Description: MOSFET N-CH 200V 76A DIE
Drain to Source Voltage (Vdss): 200 V
Part Status: Obsolete
Supplier Device Package: Die
Current - Continuous Drain (Id) @ 25°C: 76A (Ta)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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IRFC4229EB Infineon Technologies Description: MOSFET N-CH 250V 46A DIE
Drain to Source Voltage (Vdss): 250 V
Part Status: Obsolete
Supplier Device Package: Die
Current - Continuous Drain (Id) @ 25°C: 46A
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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IRFC9120NB Infineon Technologies Description: MOSFET 100V 6.6A DIE
Part Status: Obsolete
Supplier Device Package: Die
Rds On (Max) @ Id, Vgs: 480mOhm @ 6.6A, 10V
Current - Continuous Drain (Id) @ 25°C: 6.6A
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Drain to Source Voltage (Vdss): 100 V
Drive Voltage (Max Rds On, Min Rds On): 10V
Produkt ist nicht verfügbar
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IRFC024NB Infineon Technologies Description: MOSFET 55V 17A DIE
Drain to Source Voltage (Vdss): 55 V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: Die
Rds On (Max) @ Id, Vgs: 75mOhm @ 17A, 10V
Current - Continuous Drain (Id) @ 25°C: 17A
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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IRFC3810B Infineon Technologies Description: MOSFET 100V 170A DIE
Drain to Source Voltage (Vdss): 100 V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: Die
Rds On (Max) @ Id, Vgs: 9mOhm @ 170A, 10V
Current - Continuous Drain (Id) @ 25°C: 170A
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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KITA2GTC3995VTRBSTOBO1 KITA2GTC3995VTRBSTOBO1 Infineon Technologies Infineon-TC3x9-UserManual-v01_00-EN.pdf?fileId=5546d46270c4f93e0170e4008f46127a Description: AURIX TC399 5V TRB SOCKET BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: TriCore™
Utilized IC / Part: TC399
Platform: AURIX TC399 5V TRB Socket
Part Status: Active
auf Bestellung 2 Stücke:
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IPI60R165CPXKSA1 IPI60R165CPXKSA1 Infineon Technologies Infineon-IPI60R165CP-DS-v02_00-en.pdf?fileId=db3a304314dca38901152841362412b2 Description: HIGH POWER_LEGACY
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Tc)
Rds On (Max) @ Id, Vgs: 165mOhm @ 12A, 10V
Power Dissipation (Max): 192W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 790µA
Supplier Device Package: PG-TO262-3-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 52 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2000 pF @ 100 V
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
3+9.53 EUR
50+4.94 EUR
100+4.5 EUR
500+3.71 EUR
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KITLGMBBOM003TOBO1 KITLGMBBOM003TOBO1 Infineon Technologies Infineon-UserManual_LVDSPD_low_voltage_drives_scalable_power_demonstration_board-UM-v01_00-EN.pdf?fileId=5546d462696dbf120169b58bda49538e Description: EVAL MASTER MOTHER BOARD
Part Status: Active
Supplied Contents: Board(s)
Type: Power Management
Function: Gate Driver
Packaging: Box
auf Bestellung 3 Stücke:
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CYBT-263064-02 Infineon-CYBT-273063-02_CYBT-263064-02_CYBT-263065-02_EZ-BT_MODULE_(PRELIMINARY)-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea1d1c72f6
CYBT-263064-02
Hersteller: Infineon Technologies
Description: RF TXRX MOD BT ISM>1GHZU.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: 37-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 176kB RAM
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.3V
Power - Output: 15dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.0
Current - Receiving: 5.9mA
Current - Transmitting: 5.8mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: CYW20819
Modulation: GFSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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CYBT-263065-02 Infineon-CYBT-273063-02_CYBT-263064-02_CYBT-263065-02_EZ-BT_MODULE_(PRELIMINARY)-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea1d1c72f6
CYBT-263065-02
Hersteller: Infineon Technologies
Description: RF TXRX MOD BT ISM>1GHZU.FL SMD
Packaging: Tape & Reel (TR)
Package / Case: 35-SMD Module
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 176kB RAM
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.71V ~ 3.3V
Power - Output: 15dBm
Data Rate: 2Mbps
Protocol: Bluetooth v5.0
Current - Receiving: 5.9mA
Current - Transmitting: 5.8mA
Antenna Type: Antenna Not Included, U.FL
Utilized IC / Part: CYW20819
Modulation: GFSK
RF Family/Standard: Bluetooth, General ISM > 1GHz
Serial Interfaces: I2C, SPI, UART
Part Status: Active
Produkt ist nicht verfügbar
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MB39A130APFT-G-BND-ERE1 download
MB39A130APFT-G-BND-ERE1
Hersteller: Infineon Technologies
Description: IC REG CTRLR BUCK 24TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 24-TFSOP (0.173", 4.40mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -30°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 780kHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 25V
Supplier Device Package: 24-TSSOP
Synchronous Rectifier: Yes
Control Features: Current Limit, Power Good, Soft Start
Output Phases: 1
Clock Sync: No
Part Status: Obsolete
Number of Outputs: 1
Produkt ist nicht verfügbar
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MB39A130APFT-G-BND-ERE1 download
MB39A130APFT-G-BND-ERE1
Hersteller: Infineon Technologies
Description: IC REG CTRLR BUCK 24TSSOP
Packaging: Cut Tape (CT)
Package / Case: 24-TFSOP (0.173", 4.40mm Width)
Output Type: Transistor Driver
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: -30°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 100kHz ~ 780kHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 4.5V ~ 25V
Supplier Device Package: 24-TSSOP
Synchronous Rectifier: Yes
Control Features: Current Limit, Power Good, Soft Start
Output Phases: 1
Clock Sync: No
Part Status: Obsolete
Number of Outputs: 1
Produkt ist nicht verfügbar
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PTFA220081MV4S500XUMA1 PTFA220081M_Rev6_7-18-17.pdf
Hersteller: Infineon Technologies
Description: IC AMP RF LDMOS 10-SON
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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FF8MR12W1M1HB11BPSA1 Infineon-FF8MR12W1M1H_B11-DataSheet-v00_30-EN.pdf?fileId=8ac78c8c8b6555fe018b72791dec7c06
FF8MR12W1M1HB11BPSA1
Hersteller: Infineon Technologies
Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
auf Bestellung 55 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+177.42 EUR
24+137.42 EUR
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FF17MR12W1M1HB70BPSA1 Infineon-FF17MR12W1M1H_B70-DataSheet-v00_20-EN.pdf?fileId=8ac78c8c8779172a0188201359d2742d
FF17MR12W1M1HB70BPSA1
Hersteller: Infineon Technologies
Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+157.14 EUR
24+118.74 EUR
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DF11MR12W1M1HFB67BPSA1 DF11MR12W1M1HF_B67_Rev0.10_11-24-22.pdf
DF11MR12W1M1HFB67BPSA1
Hersteller: Infineon Technologies
Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+138.06 EUR
24+130.97 EUR
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FF17MR12W1M1HPB11BPSA1 Infineon-FF17MR12W1M1HP_B11-DataSheet-v00_30-EN.pdf?fileId=8ac78c8c8779172a0188201303c57421
FF17MR12W1M1HPB11BPSA1
Hersteller: Infineon Technologies
Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+191.95 EUR
10+157.5 EUR
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FF17MR12W1M1HB11BPSA1 Infineon-FF17MR12W1M1H_B11-DataSheet-v00_30-EN.pdf?fileId=8ac78c8c8779172a01882012a9ea7415
FF17MR12W1M1HB11BPSA1
Hersteller: Infineon Technologies
Description: MOSFET 1200V AG-EASY1B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Supplier Device Package: AG-EASY1B
Part Status: Active
auf Bestellung 13 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+182.61 EUR
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CY90347DASPFV-GS-469E1 Infineon-F2MC-16LX_MB90350E_Series_16-bit_Microcontrollers-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edd6b7d61d6
CY90347DASPFV-GS-469E1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB MROM 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-16LX
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: CANbus, EBI/EMI, LINbus, SCI, UART/USART
Peripherals: DMA, POR, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Obsolete
Number of I/O: 82
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BSZ0503NSIATMA1 Infineon-BSZ0503NSI-DS-v02_00-EN.pdf?fileId=5546d4624f205c9a014f3c2d37301ce7
BSZ0503NSIATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 20A/40A TSDSON
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 20A (Ta), 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 36W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-TSDSON-8-FL
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 15 V
Produkt ist nicht verfügbar
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BSZ0503NSIATMA1 Infineon-BSZ0503NSI-DS-v02_00-EN.pdf?fileId=5546d4624f205c9a014f3c2d37301ce7
BSZ0503NSIATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 20A/40A TSDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 20A (Ta), 40A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 20A, 10V
Power Dissipation (Max): 2.1W (Ta), 36W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-TSDSON-8-FL
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1300 pF @ 15 V
auf Bestellung 3716 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
8+2.78 EUR
12+1.75 EUR
100+1.17 EUR
500+0.92 EUR
1000+0.83 EUR
2000+0.76 EUR
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IPB034N06N3GATMA2 Infineon-IPB034N06N3%20G-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f56e2d130d41
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 3.4mOhm @ 100A, 10V
Power Dissipation (Max): 167W (Tc)
Vgs(th) (Max) @ Id: 4V @ 93µA
Supplier Device Package: PG-TO263-7-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 130 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 11000 pF @ 30 V
Produkt ist nicht verfügbar
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FP25R12KT4B16BPSA1 Infineon-FP25R12KT4-DS-v03_00-en_de.pdf?fileId=db3a30431ed1d7b2011f697849180e4c
FP25R12KT4B16BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 25A AG-ECONO2B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 25 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 160 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.45 nF @ 25 V
auf Bestellung 15 Stücke:
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1+114.56 EUR
15+86.16 EUR
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FP75R07N2E4BPSA1 Infineon-FP75R07N2E4-DS-v03_00-EN.pdf?fileId=db3a3043315daf440131612c3f1341df
FP75R07N2E4BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 650V 95A AG-ECONO2B
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.95V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 95 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 4.6 nF @ 25 V
auf Bestellung 8 Stücke:
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1+131.86 EUR
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S29GL256S90DHSS33
S29GL256S90DHSS33
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY3696 download
Hersteller: Infineon Technologies
Description: SOCKET ADAPTER FOR CY2077FS
Packaging: Bulk
For Use With/Related Products: CY2077FS
Accessory Type: Socket Adapter
Part Status: Obsolete
Produkt ist nicht verfügbar
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D2200N20TVFXPSA1 D2200N.pdf
D2200N20TVFXPSA1
Hersteller: Infineon Technologies
Description: DIODE STANDARD 2200A BGD7526K01
Packaging: Tray
Package / Case: DO-200AC, K-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 2200A
Supplier Device Package: BG-D7526K0-1
Operating Temperature - Junction: -40°C ~ 160°C
Part Status: Last Time Buy
Current - Reverse Leakage @ Vr: 150 mA @ 2000 V
Produkt ist nicht verfügbar
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CY25560SXC Infineon-CY25560_SPREAD_SPECTRUM_CLOCK_GENERATOR-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec5cf783bf3
CY25560SXC
Hersteller: Infineon Technologies
Description: IC CLK/FREQ SYNTH 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 100MHz
Type: Clock/Frequency Synthesizer, Frequency Modulator, Spread Spectrum Clock Generator
Input: Clock, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.97V ~ 3.63V
Ratio - Input:Output: 1:1
Differential - Input:Output: No/No
Supplier Device Package: 8-SOIC
PLL: Yes
Divider/Multiplier: Yes/No
Part Status: Active
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FF1200R17KP4B2NOSA2 Infineon-FF1200R17KP4_B2-DS-v03_01-EN.pdf?fileId=db3a304320d39d590122175b5e4b07f5
FF1200R17KP4B2NOSA2
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 1200A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
NTC Thermistor: No
Supplier Device Package: AG-PRIME2
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1700 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1400 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 98 nF @ 25 V
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+2157.95 EUR
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S25HL512TDPNHV010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
S25HL512TDPNHV010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FF200R12KE3B2HOSA1 Infineon-FF200R12KE3-DS-v03_01-en_cn.pdf?fileId=db3a30433dcf2fc4013dd01c80660219
FF200R12KE3B2HOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 295A 1050W MOD
Part Status: Active
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
Operating Temperature: -40°C ~ 125°C
Configuration: Half Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 1050 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 295 A
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+210.38 EUR
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CY7112 Infineon-CY7112_EZ-PD_PMG1-S2_Prototyping_Kit_Release_Notes-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0f039dbb1b30&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY7112
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR EZ-PD PMG1-S2
Packaging: Box
Function: USB Type-C® Power Delivery (PD)
Type: Power Management
Contents: Board(s), Cable(s), Accessories
Utilized IC / Part: EZ-PD PMG1-S2
Supplied Contents: Board(s), Cable(s), Accessories
Primary Attributes: USB PD 3.0
Secondary Attributes: I2C/SPI/UART Interface(s)
Embedded: Yes, MCU
Part Status: Active
Produkt ist nicht verfügbar
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CY9BF416RPMC-G-JNE2 download
CY9BF416RPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 120LQFP
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Part Status: Active
Number of I/O: 103
DigiKey Programmable: Not Verified
auf Bestellung 383 Stücke:
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AnzahlPrivatkunde
2+15.33 EUR
10+11.89 EUR
84+10.19 EUR
168+9.82 EUR
252+9.64 EUR
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BSF450NE7NH3XUMA1 Infineon-BSF450NE7NH3-DS-v02_02-EN.pdf?fileId=db3a30433a047ba0013a687e2ae403da
BSF450NE7NH3XUMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 75V 5A/15A 2WDSON
Input Capacitance (Ciss) (Max) @ Vds: 390 pF @ 37.5 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Part Status: Active
Supplier Device Package: MG-WDSON-2, CanPAK M™
Vgs(th) (Max) @ Id: 3.5V @ 8µA
Power Dissipation (Max): 2.2W (Ta), 18W (Tc)
Rds On (Max) @ Id, Vgs: 45mOhm @ 8A, 10V
Current - Continuous Drain (Id) @ 25°C: 5A (Ta), 15A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-WDSON
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BSF450NE7NH3XUMA1 Infineon-BSF450NE7NH3-DS-v02_02-EN.pdf?fileId=db3a30433a047ba0013a687e2ae403da
BSF450NE7NH3XUMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 75V 5A/15A 2WDSON
Current - Continuous Drain (Id) @ 25°C: 5A (Ta), 15A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 3-WDSON
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 390 pF @ 37.5 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 7V, 10V
Part Status: Active
Supplier Device Package: MG-WDSON-2, CanPAK M™
Vgs(th) (Max) @ Id: 3.5V @ 8µA
Power Dissipation (Max): 2.2W (Ta), 18W (Tc)
Rds On (Max) @ Id, Vgs: 45mOhm @ 8A, 10V
auf Bestellung 4300 Stücke:
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AnzahlPrivatkunde
7+3.09 EUR
10+2.57 EUR
100+2.05 EUR
500+1.73 EUR
1000+1.46 EUR
2000+1.39 EUR
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IRS2001SPBF irs2001pbf.pdf?fileId=5546d462533600a401535675a760277e
IRS2001SPBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 200 V
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 70ns, 35ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
Part Status: Last Time Buy
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IAUT300N10S5N014ATMA1 Infineon-IAUT300N10S5N014-DataSheet-v01_01-EN.pdf?fileId=5546d46277921c32017795c1685a4680
IAUT300N10S5N014ATMA1
Hersteller: Infineon Technologies
Description: MOSFET_(75V 120V( PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 360A (Tj)
Rds On (Max) @ Id, Vgs: 1.4mOhm @ 100A, 10V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 275µA
Supplier Device Package: PG-HSOF-8-1
Grade: Automotive
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 216 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 16011 pF @ 50 V
Qualification: AEC-Q101
auf Bestellung 11773 Stücke:
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2+11.9 EUR
10+7.97 EUR
100+5.75 EUR
500+5.32 EUR
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IAUT300N08S5N011ATMA1 infineon-iaut300n08s5n011-datasheet-en.pdf
IAUT300N08S5N011ATMA1
Hersteller: Infineon Technologies
Description: MOSFET_(75V 120V( PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 410A (Tj)
Rds On (Max) @ Id, Vgs: 1.1mOhm @ 100A, 10V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 275µA
Supplier Device Package: PG-HSOF-8-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 231 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 16250 pF @ 40 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 17044 Stücke:
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2+11.98 EUR
10+8.03 EUR
100+5.8 EUR
500+5.37 EUR
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IAUS300N10S5N014ATMA1 Infineon-IAUS300N10S5N014-DataSheet-v01_01-EN.pdf?fileId=5546d46277921c32017795c159b7467d
IAUS300N10S5N014ATMA1
Hersteller: Infineon Technologies
Description: MOSFET_(75V 120V( PG-HSOG-8
Qualification: AEC-Q101
Grade: Automotive
Package / Case: 8-PowerSMD, Gull Wing
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 16011 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 216 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-HSOG-8-1
Vgs(th) (Max) @ Id: 3.8V @ 275µA
Power Dissipation (Max): 375W (Tc)
Rds On (Max) @ Id, Vgs: 1.4mOhm @ 100A, 10V
Current - Continuous Drain (Id) @ 25°C: 360A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
auf Bestellung 959 Stücke:
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2+12.35 EUR
10+8.33 EUR
100+6.15 EUR
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IAUTN12S5N018GATMA1 Infineon-IAUTN12S5N018G-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c86919021018712f65ab14212
IAUTN12S5N018GATMA1
Hersteller: Infineon Technologies
Description: MOSFET_(120V 300V)
Qualification: AEC-Q101
Grade: Automotive
Drain to Source Voltage (Vdss): 120 V
Part Status: Active
Supplier Device Package: PG-HSOG-8-1
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C
Mounting Type: Surface Mount
Package / Case: 8-PowerSMD, Gull Wing
Packaging: Cut Tape (CT)
auf Bestellung 1276 Stücke:
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2+14.8 EUR
10+10.08 EUR
100+7.83 EUR
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IAUTN12S5N017ATMA1 Infineon-IAUTN12S5N017-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c86919021018712f66aa24215
IAUTN12S5N017ATMA1
Hersteller: Infineon Technologies
Description: MOSFET_(120V 300V)
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: PG-HSOF-8-1
Part Status: Active
Drain to Source Voltage (Vdss): 120 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IAUTN12S5N017ATMA1 Infineon-IAUTN12S5N017-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c86919021018712f66aa24215
IAUTN12S5N017ATMA1
Hersteller: Infineon Technologies
Description: MOSFET_(120V 300V)
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: PG-HSOF-8-1
Part Status: Active
Drain to Source Voltage (Vdss): 120 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 408 Stücke:
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2+13.15 EUR
10+8.9 EUR
100+6.72 EUR
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2SP0430T2A0CFF18R17NPSA1
Hersteller: Infineon Technologies
Description: MODULE GATE DRIVER
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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CY9AF141MAPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I²C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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CYBT-343026-PROG Infineon-CYBT-343026-PROG_EZ-BT(TM)_WICED_MODULE_PROGRAMMING_KIT-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0f01497918a0
CYBT-343026-PROG
Hersteller: Infineon Technologies
Description: MODULE KIT
Packaging: Bulk
For Use With/Related Products: EZ-BT WICED Modules
Type: Programmer (Universal Out-of-Circuit)
Contents: Board(s)
Part Status: Active
auf Bestellung 2 Stücke:
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1+613.77 EUR
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CY8C4244PVQ-442 Infineon-PSOC_4_PSOC_4200_FAMILY_DATASHEET_PROGRAMMABLE_SYSTEM-ON-CHIP-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec80ee2400e
CY8C4244PVQ-442
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 16KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR; D/A 2xIDAC
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY14MB064Q1A-SXI download
CY14MB064Q1A-SXI
Hersteller: Infineon Technologies
Description: IC NVSRAM 64KBIT SPI 40MHZ 8SOIC
DigiKey Programmable: Not Verified
Memory Organization: 8K x 8
Memory Interface: SPI
Part Status: Obsolete
Supplier Device Package: 8-SOIC
Memory Format: NVSRAM
Clock Frequency: 40 MHz
Technology: NVSRAM (Non-Volatile SRAM)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Kbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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XC2289H200F100LABKXUMA1 XC228xH.pdf
XC2289H200F100LABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16/32B 1.6MB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1.6MB (1.6M x 8)
RAM Size: 138K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: DMA, I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-13
Part Status: Not For New Designs
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XE167FH200F100LABKXUMA1 Infineon-XE167XH-DS-v01_03-en.pdf?fileId=db3a304328c6bd5c0129121370f609a2
XE167FH200F100LABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 1.56MB FLSH 144LQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1.56MB (1.56M x 8)
RAM Size: 138K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 24x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-144-13
Part Status: Not For New Designs
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XE169FH200F100LABKXQSA1 Infineon-XE169XH-DS-v01_03-en.pdf?fileId=db3a304328c6bd5c01291216ba3909a8
XE169FH200F100LABKXQSA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 1.6MB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 1.6MB (1.6M x 8)
RAM Size: 112K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 30x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-176-12
Part Status: Not For New Designs
Number of I/O: 118
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPI076N15N5AKSA1 Infineon-IPI076N15N5-DS-v02_00-EN.pdf?fileId=5546d46253f650570154a04379f754c9
IPI076N15N5AKSA1
Hersteller: Infineon Technologies
Description: MV POWER MOS
Input Capacitance (Ciss) (Max) @ Vds: 4700 pF @ 75 V
Gate Charge (Qg) (Max) @ Vgs: 61 nC @ 10 V
Drain to Source Voltage (Vdss): 150 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Part Status: Active
Supplier Device Package: PG-TO262-3
Vgs(th) (Max) @ Id: 4.6V @ 160µA
Power Dissipation (Max): 214W (Tc)
Rds On (Max) @ Id, Vgs: 7.6mOhm @ 56A, 10V
Current - Continuous Drain (Id) @ 25°C: 112A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
auf Bestellung 316 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.72 EUR
50+5.09 EUR
100+4.65 EUR
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IRFC3710D
Hersteller: Infineon Technologies
Description: MOSFET 100V 57A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 57A
Rds On (Max) @ Id, Vgs: 23mOhm @ 57A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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IRFC230NB
Hersteller: Infineon Technologies
Description: MOSFET 200V 9.3A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 9.3A
Rds On (Max) @ Id, Vgs: 300mOhm @ 9.3A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drain to Source Voltage (Vdss): 200 V
Produkt ist nicht verfügbar
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IRFC4568EB
Hersteller: Infineon Technologies
Description: MOSFET N-CH 150V 171A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 171A (Ta)
Supplier Device Package: Die
Part Status: Obsolete
Drain to Source Voltage (Vdss): 150 V
Produkt ist nicht verfügbar
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IRFC9130NB
Hersteller: Infineon Technologies
Description: MOSFET 100V 14A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 14A
Rds On (Max) @ Id, Vgs: 200mOhm @ 14A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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IRFC7416B
Hersteller: Infineon Technologies
Description: MOSFET 30V 10A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 10A
Rds On (Max) @ Id, Vgs: 20mOhm @ 10A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 30 V
Produkt ist nicht verfügbar
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IRFC9140NB
Hersteller: Infineon Technologies
Description: MOSFET 100V 23A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 23A
Rds On (Max) @ Id, Vgs: 117mOhm @ 23A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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IRFC3315B
Hersteller: Infineon Technologies
Description: MOSFET 150V 23A DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 23A
Rds On (Max) @ Id, Vgs: 70mOhm @ 23A, 10V
Supplier Device Package: Die
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 150 V
Produkt ist nicht verfügbar
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IRFC240NB
Hersteller: Infineon Technologies
Description: MOSFET 200V DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Supplier Device Package: Die
Part Status: Obsolete
Drain to Source Voltage (Vdss): 200 V
Produkt ist nicht verfügbar
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IRFC250NB
Hersteller: Infineon Technologies
Description: MOSFET 200V DIE
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
Supplier Device Package: Die
Part Status: Obsolete
Drain to Source Voltage (Vdss): 200 V
Produkt ist nicht verfügbar
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IRFC4127EB
Hersteller: Infineon Technologies
Description: MOSFET N-CH 200V 76A DIE
Drain to Source Voltage (Vdss): 200 V
Part Status: Obsolete
Supplier Device Package: Die
Current - Continuous Drain (Id) @ 25°C: 76A (Ta)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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IRFC4229EB
Hersteller: Infineon Technologies
Description: MOSFET N-CH 250V 46A DIE
Drain to Source Voltage (Vdss): 250 V
Part Status: Obsolete
Supplier Device Package: Die
Current - Continuous Drain (Id) @ 25°C: 46A
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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IRFC9120NB
Hersteller: Infineon Technologies
Description: MOSFET 100V 6.6A DIE
Part Status: Obsolete
Supplier Device Package: Die
Rds On (Max) @ Id, Vgs: 480mOhm @ 6.6A, 10V
Current - Continuous Drain (Id) @ 25°C: 6.6A
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Drain to Source Voltage (Vdss): 100 V
Drive Voltage (Max Rds On, Min Rds On): 10V
Produkt ist nicht verfügbar
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IRFC024NB
Hersteller: Infineon Technologies
Description: MOSFET 55V 17A DIE
Drain to Source Voltage (Vdss): 55 V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: Die
Rds On (Max) @ Id, Vgs: 75mOhm @ 17A, 10V
Current - Continuous Drain (Id) @ 25°C: 17A
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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IRFC3810B
Hersteller: Infineon Technologies
Description: MOSFET 100V 170A DIE
Drain to Source Voltage (Vdss): 100 V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: Die
Rds On (Max) @ Id, Vgs: 9mOhm @ 170A, 10V
Current - Continuous Drain (Id) @ 25°C: 170A
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
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KITA2GTC3995VTRBSTOBO1 Infineon-TC3x9-UserManual-v01_00-EN.pdf?fileId=5546d46270c4f93e0170e4008f46127a
KITA2GTC3995VTRBSTOBO1
Hersteller: Infineon Technologies
Description: AURIX TC399 5V TRB SOCKET BRD
Packaging: Bulk
Mounting Type: Socket
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: TriCore™
Utilized IC / Part: TC399
Platform: AURIX TC399 5V TRB Socket
Part Status: Active
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+3645.97 EUR
Im Einkaufswagen  Stück im Wert von  UAH
IPI60R165CPXKSA1 Infineon-IPI60R165CP-DS-v02_00-en.pdf?fileId=db3a304314dca38901152841362412b2
IPI60R165CPXKSA1
Hersteller: Infineon Technologies
Description: HIGH POWER_LEGACY
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Tc)
Rds On (Max) @ Id, Vgs: 165mOhm @ 12A, 10V
Power Dissipation (Max): 192W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 790µA
Supplier Device Package: PG-TO262-3-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 52 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2000 pF @ 100 V
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+9.53 EUR
50+4.94 EUR
100+4.5 EUR
500+3.71 EUR
Mindestbestellmenge: 3 Stücke
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KITLGMBBOM003TOBO1 Infineon-UserManual_LVDSPD_low_voltage_drives_scalable_power_demonstration_board-UM-v01_00-EN.pdf?fileId=5546d462696dbf120169b58bda49538e
KITLGMBBOM003TOBO1
Hersteller: Infineon Technologies
Description: EVAL MASTER MOTHER BOARD
Part Status: Active
Supplied Contents: Board(s)
Type: Power Management
Function: Gate Driver
Packaging: Box
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+174.57 EUR
Im Einkaufswagen  Stück im Wert von  UAH
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