Produkte > BM2
| Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||||
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| BM23PF0.8-20DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 20P HDR STRGHT SMT HYBRID W/POWER | auf Bestellung 1776 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-20DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 20POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.025" (0.63mm) Pitch: 0.014" (0.35mm) Number of Positions: 20 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Cut Tape (CT) | auf Bestellung 1137 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-20DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 20POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-20DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 20POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 2349 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-20DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 20P RCPT STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-20DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 20POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 20 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-20DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 20P RCPT STRGHT SMT HYBRID W/POWER | auf Bestellung 937 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-20DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 20POS SMD GOLD Number of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 20 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) | auf Bestellung 839 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-20DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 20POS SMD GOLD Number of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 20 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-24DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 24POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-24DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 24POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 6996 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-24DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 24P HDR STRGHT SMT HYBRID W/POWER | auf Bestellung 2823 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-24DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 24POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.025" (0.63mm) Pitch: 0.014" (0.35mm) Number of Positions: 24 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Tape & Reel (TR) | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-24DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 24P HDR STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 2 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-24DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 24POS SMD GOLD Packaging: Cut Tape (CT) Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.025" (0.63mm) Pitch: 0.014" (0.35mm) Number of Positions: 24 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention | auf Bestellung 966 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-24DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 24P RCPT STRGHT SMT HYBRID W/POWER | auf Bestellung 3740 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-24DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 24POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 2161 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-24DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 24POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-24DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 24POS SMD GOLD Packaging: Cut Tape (CT) Features: Solder Retention Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 | auf Bestellung 72 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-24DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 24P RCPT STRGHT SMT HYBRID W/POWER | auf Bestellung 7768 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-24DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 24POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 24 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-30DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 30P HDR STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-30DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 30POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 5185 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 30POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-30DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 30POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 30POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.025" (0.63mm) Pitch: 0.014" (0.35mm) Number of Positions: 30 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Cut Tape (CT) | auf Bestellung 2468 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 30P HDR STRGHT SMT HYBRID W/POWER | auf Bestellung 495 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 30POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-30DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 30P RCPT STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 2 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-30DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 30POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 2139 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 30P RCPT STRGHT SMT HYBRID W/POWER | auf Bestellung 5892 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DS-0.35V(895) | Hirose | BM23PF0.8-30DS-0.35V(895) | auf Bestellung 809 Stücke: Lieferzeit 14-21 Tag (e) |
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| BM23PF0.8-30DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 30POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 30 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) | auf Bestellung 18522 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-30DS-0.35V(895) | HIROSE | Category: Board-to-board connectors Description: Connector: PCB to PCB; socket; female; PIN: 30; BM23PF; vertical Number of pins: 30 Manufacturer series: BM23PF Contacts pitch: 0.35mm Current rating: 0.3A Mechanical durability: 10 cycles Mechanical mounting: on PCBs Electrical mounting: SMT Type of connector: PCB to PCB Kind of connector: female Connector: socket Contact plating: gold-plated Spatial orientation: vertical | auf Bestellung 169 Stücke: Lieferzeit 14-21 Tag (e) |
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| BM23PF0.8-30DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 30POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 17000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-40DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 40POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 7409 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-40DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 40P HDR STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-40DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 40POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-40DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 40P HDR STRGHT SMT HYBRID W/POWER | auf Bestellung 2537 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-40DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 40POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 986 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-40DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 40POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-40DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 40POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-40DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 40POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 4950 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-40DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 40P RCPT STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 2 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-40DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 40POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 40 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-40DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 40P RCPT STRGHT SMT HYBRID W/POWER | auf Bestellung 66 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-40DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 40POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 40 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) | auf Bestellung 555 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-42DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 42P HDR STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-42DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 42POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 42 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-42DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 42P HDR STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-42DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 42POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 42 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-42DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 42P RCPT STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-42DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 42POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 42 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-42DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 42P RCPT STRGHT SMT HYBRID W/POWER | auf Bestellung 978 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-44DP-0.35V(51) | Hirose Electric Co Ltd | Description: INTERCONNECT RECTANGULAR Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 44 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-44DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-44DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-44DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-44DS-0.35V(51) | Hirose Electric Co Ltd | Description: INTERCONNECT RECTANGULAR Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 44 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-44DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-44DS-0.35V(895) | Hirose Electric Co Ltd | Description: INTERCONNECT RECTANGULAR Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 44 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-46DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 46POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 46 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 11026 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-46DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 46P HDR STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-46DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 46POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 46 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-46DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 46POS SMD GOLD Number of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.025" (0.63mm) Pitch: 0.014" (0.35mm) Number of Positions: 46 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Tape & Reel (TR) | auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-46DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 46P HDR STRGHT SMT HYBRID W/POWER | auf Bestellung 1436 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-46DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 46POS SMD GOLD Height Above Board: 0.025" (0.63mm) Pitch: 0.014" (0.35mm) Number of Positions: 46 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Header, Outer Shroud Contacts Features: Solder Retention Packaging: Cut Tape (CT) Number of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) | auf Bestellung 3560 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-46DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 46POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 46 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-46DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 46P RCPT STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-46DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 46POS SMD GOLD Number of Rows: 2 Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 46 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) | auf Bestellung 1753 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-46DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 46P RCPT STRGHT SMT HYBRID W/POWER | auf Bestellung 872 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-46DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 46POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 46 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-50DP-0.35V(51) | Hirose Electric Co Ltd | Description: INTERCONNECT RECTANGULAR Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 50 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-50DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-50DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-50DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-50DS-0.35V(51) | Hirose Electric Co Ltd | Description: INTERCONNECT RECTANGULAR Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 50 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-50DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-54DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 54POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 54 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-54DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 54P HDR STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-54DP-0.35V(51) | Hirose Electric Co Ltd | Description: CONN HDR 54POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 54 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 9305 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-54DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 54POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 54 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 | auf Bestellung 911 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-54DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 54P HDR STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-54DP-0.35V(895) | Hirose Electric Co Ltd | Description: CONN HDR 54POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 54 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Part Status: Active Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-54DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 54POS SMD GOLD Features: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 54 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | auf Bestellung 8434 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-54DS-0.35V(51) | Hirose Electric Co Ltd | Description: CONN RCPT 54POS SMD GOLD Features: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 54 Pitch: 0.014" (0.35mm) Height Above Board: 0.031" (0.80mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-54DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors 54P RCPT STRGHT SMT HYBRID W/POWER | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-54DS-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors 54P RCPT STRGHT SMT HYBRID W/POWER | auf Bestellung 805 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-54DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 54POS SMD GOLD Number of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 54 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Cut Tape (CT) | auf Bestellung 2044 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-54DS-0.35V(895) | Hirose Electric Co Ltd | Description: CONN RCPT 54POS SMD GOLD Number of Rows: 2 Part Status: Active Mated Stacking Heights: 0.8mm Contact Finish Thickness: 1.97µin (0.050µm) Height Above Board: 0.031" (0.80mm) Pitch: 0.014" (0.35mm) Number of Positions: 54 Mounting Type: Surface Mount Contact Finish: Gold Connector Type: Receptacle, Center Strip Contacts Features: Solder Retention Packaging: Tape & Reel (TR) | auf Bestellung 2000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-60DP-0.35V(51) | Hirose Electric Co Ltd | Description: PLUG, 0.35MM PITCH, 60 POS., 5.0 Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-60DP-0.35V(51) | Hirose Electric Co Ltd | Description: PLUG, 0.35MM PITCH, 60 POS., 5.0 Features: Board Guide, Pick and Place Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-60DP-0.35V(51) | Hirose Electric Co Ltd | Description: PLUG, 0.35MM PITCH, 60 POS., 5.0 Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-60DP-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors Plug, 0.35mm Pitch, 60 Pos., 5.0A, AC 30.0V, DC 30.0V | Produkt ist nicht verfügbar | Mindestbestellmenge: 2 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-60DP-0.35V(895) | Hirose Electric Co Ltd | Description: PLUG, 0.35MM PITCH, 60 POS., 5.0 Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-60DP-0.35V(895) | Hirose Connector | Board to Board & Mezzanine Connectors Plug, 0.35mm Pitch, 60 Pos., 5.0A, AC 30.0V, DC 30.0V | auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-60DP-0.35V(895) | Hirose Electric Co Ltd | Description: PLUG, 0.35MM PITCH, 60 POS., 5.0 Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Header, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-60DS-0.35V(51) | Hirose Electric Co Ltd | Description: RECEPTACLE, 0.35MM PITCH, 60 POS Features: Board Guide, Pick and Place Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Mindestbestellmenge: 10000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||||
| BM23PF0.8-60DS-0.35V(51) | Hirose Connector | Board to Board & Mezzanine Connectors Receptacle, 0.35mm Pitch, 60 Pos., 5.0A, AC 30.0V, DC 30.0V | auf Bestellung 9191 Stücke: Lieferzeit 10-14 Tag (e) |
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| BM23PF0.8-60DS-0.35V(51) | Hirose Electric Co Ltd | Description: RECEPTACLE, 0.35MM PITCH, 60 POS Features: Board Guide, Pick and Place Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 60 Pitch: 0.014" (0.35mm) Height Above Board: 0.025" (0.63mm) Contact Finish Thickness: 1.97µin (0.050µm) Mated Stacking Heights: 0.8mm Number of Rows: 2 | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH |