Produkte > RAS
| Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||
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| RASVL190514BK1 | Hammond Manufacturing | Racks & Rack Cabinet Accessories Vented Shelf 3U Solid 16 AWG | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||
| RASVL190514BK1 | Hammond Manufacturing | Description: SHELF FIXED 14.5X17.5X5.22" BLAC Packaging: Bulk Color: Black Size / Dimension: 14.500" L x 17.500" W x 5.220" H (368.30mm x 444.50mm x 132.59mm) For Use With/Related Products: 19" Panel Width Racks Material: Metal, Steel Type: Shelf, Fixed Ventilation: Vented Part Status: Obsolete | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||
| RASW.015 100G | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.015" (0.38mm) Wire Gauge: 27 AWG, 28 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 3.53 oz (100g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 40 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.015 100G | Chip Quik | Soldering Flux | auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.020 .4OZ | Chip Quik Inc. | Description: SOLDER WIRE POCKET PACK 63/37 TI Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Tube, 0.4 oz (11.34g) Process: Leaded Flux Type: Rosin Activated (RA) | Produkt ist nicht verfügbar | Im Einkaufswagen Stück im Wert von UAH | ||||
| RASW.020 1LB | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 16 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.020 1OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 49 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.020 2OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 96 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.020 4OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: Rosin Activated (RA) Part Status: Active Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 159 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.020 8OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 8 oz (227g), 1/2 lb Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life: 60 Months | auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.031 .7OZ | Chip Quik Inc. | Description: SOLDER WIRE POCKET PACK 63/37 TI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Tube, 0.7 oz (19.85g) Process: Leaded Flux Type: Rosin Activated (RA) | auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.031 1LB | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 lb (454 g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.031 1LB | Chip Quik | Soldering Flux Solder Wire 63/37 Tin/Lead (Sn63/Pb37) Rosin Activated .031 1lb | auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.031 1OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 1 oz (28.35g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 119 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.031 2OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 2 oz (56.70g) Process: Leaded Flux Type: Rosin Activated (RA) | auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.031 4OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn63Pb37 (63/37) Type: Wire Solder Melting Point: 361°F (183°C) Form: Spool, 4 oz (113.40g) Process: Leaded Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 131 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASW.031 8OZ | Chip Quik Inc. | Description: SOLDER WIRE 63/37 TIN/LEAD ROSIN Flux Type: Rosin Activated (RA) Process: Leaded Form: Spool, 8 oz (227g), 1/2 lb Melting Point: 361°F (183°C) Type: Wire Solder Composition: Sn63Pb37 (63/37) Wire Gauge: 21 AWG, 20 SWG Diameter: 0.031" (0.79mm) Packaging: Bulk | auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.015 .3OZ | Chip Quik Inc. | Description: LF SOLDER WIRE POCKET PACK 96.5/ Flux Type: Rosin Activated (RA) Process: Lead Free Form: Tube, 0.3 oz (8.51g) Melting Point: 422 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.015 1LB | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Flux Type: Rosin Activated (RA) Process: Lead Free Form: Spool, 1 lb (454 g) Melting Point: 422 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.015 1OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Flux Type: Rosin Activated (RA) Process: Lead Free Form: Spool, 1 oz (28.35g) Melting Point: 422 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk | auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.015 2OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Flux Type: Rosin Activated (RA) Process: Lead Free Form: Spool, 2 oz (56.70g) Melting Point: 422 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk | auf Bestellung 7 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.015 4OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Flux Type: Rosin Activated (RA) Process: Lead Free Form: Spool, 4 oz (113.40g) Melting Point: 422 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk | auf Bestellung 96 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.015 8OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Shelf Life: 60 Months Shelf Life Start: Date of Manufacture Flux Type: Rosin Activated (RA) Process: Lead Free Form: Spool, 8 oz (227g), 1/2 lb Melting Point: 422 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 27 AWG, 28 SWG Diameter: 0.015" (0.38mm) Packaging: Bulk | auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.020 .4OZ | Chip Quik Inc. | Description: LF SOLDER WIRE POCKET PACK 96.5/ | auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.020 1LB | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI | auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||
| RASWLF.020 1OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI | auf Bestellung 21 Stücke: Lieferzeit 10-14 Tag (e) | Im Einkaufswagen Stück im Wert von UAH | ||||
| RASWLF.020 2OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI | auf Bestellung 8 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.020 4OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.020" (0.51mm) Wire Gauge: 24 AWG, 25 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: Rosin Activated (RA) | auf Bestellung 57 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.020 8OZ | Chip Quik | Soldering Flux | auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.020 8OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.031 .7OZ | Chip Quik Inc. | Description: LF SOLDER WIRE POCKET PACK 96.5/ | auf Bestellung 14 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.031 1OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 1 oz (28.35g) Process: Lead Free Flux Type: Rosin Activated (RA) | auf Bestellung 30 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.031 2OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 2 oz (56.70g) Process: Lead Free Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 23 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.031 4OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Packaging: Bulk Diameter: 0.031" (0.79mm) Wire Gauge: 21 AWG, 20 SWG Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Type: Wire Solder Melting Point: 422 ~ 428°F (217 ~ 220°C) Form: Spool, 4 oz (113.40g) Process: Lead Free Flux Type: Rosin Activated (RA) Shelf Life Start: Date of Manufacture Shelf Life: 60 Months | auf Bestellung 55 Stücke: Lieferzeit 10-14 Tag (e) |
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| RASWLF.031 8OZ | Chip Quik Inc. | Description: LF SOLDER WIRE 96.5/3/0.5 TIN/SI Flux Type: Rosin Activated (RA) Process: Lead Free Form: Spool, 8 oz (227g), 1/2 lb Melting Point: 422 ~ 428°F (217 ~ 220°C) Type: Wire Solder Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5) Wire Gauge: 21 AWG, 20 SWG Diameter: 0.031" (0.79mm) Packaging: Bulk | auf Bestellung 4 Stücke: Lieferzeit 10-14 Tag (e) |
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