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MC9S08DV32AMLC MC9S08DV32AMLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV60ACLF MC9S08DV60ACLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ48ACLC MC9S08DZ48ACLC NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ48ACLF MC9S08DZ48ACLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC34704BEPR2 MC34704BEPR2 NXP USA Inc. MC34704.pdf Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
2000+10.61 EUR
Mindestbestellmenge: 2000
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MC34704AEPR2 MC34704AEPR2 NXP USA Inc. MC34704.pdf Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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DEMO9RS08LA8 DEMO9RS08LA8 NXP USA Inc. DEMO9RS08LA8_Gde.pdf Description: MC9RS08LA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: RS08
Utilized IC / Part: MC9RS08LA8
Produkt ist nicht verfügbar
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DEMO9S08LL16 DEMO9S08LL16 NXP USA Inc. DEMO9S08LL16_UG.pdf Description: MC9S08LL16 EVAL BRD
Produkt ist nicht verfügbar
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DEMOMPR083 DEMOMPR083 NXP USA Inc. MPR083.pdf Description: BOARD DEMO FOR MPR083 CTLR
Produkt ist nicht verfügbar
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KIT33794EKEVM NXP USA Inc. KIT33794EKEVM.pdf Description: KIT EVALUATION HARDWARE 33794
Packaging: Box
Function: Sensor Signal Conditioner
Type: Interface
Utilized IC / Part: MC33794
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC34727AFCR2 MC34727AFCR2 NXP USA Inc. Description: IC REG BUCK 1.2V 600MA 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.2V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34727BFCR2 MC34727BFCR2 NXP USA Inc. Description: IC REG BUCK 1.8V 600MA 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.8V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08LL16CLH MC9S08LL16CLH NXP USA Inc. MC9S08LL16.pdf Description: IC MCU 8BIT 16KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 574 Stücke:
Lieferzeit 10-14 Tag (e)
2+9.86 EUR
10+7.69 EUR
80+6.30 EUR
Mindestbestellmenge: 2
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MMG3014NT1 MMG3014NT1 NXP USA Inc. MMG3014NT1.pdf Description: IC RF AMP 4GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 4GHz
Voltage - Supply: 5V
Gain: 19.5dB
Current - Supply: 135mA
Noise Figure: 5.7dB
P1dB: 25dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+3.28 EUR
Mindestbestellmenge: 1000
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MMG3H21NT1 MMG3H21NT1 NXP USA Inc. MMG3H21NT1.pdf Description: IC RF AMP 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
Voltage - Supply: 5V
Gain: 19.3dB
Current - Supply: 90mA
Noise Figure: 5.5dB
P1dB: 20.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
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1000+2.85 EUR
Mindestbestellmenge: 1000
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MRF6V10010NR4 MRF6V10010NR4 NXP USA Inc. MRF6V10010N.pdf Description: RF MOSFET LDMOS 50V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 10W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 100 Stücke:
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100+137.83 EUR
Mindestbestellmenge: 100
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MRF6V2010NBR5 MRF6V2010NBR5 NXP USA Inc. MRF6V2010N.pdf Description: FET RF 110V 220MHZ TO-272-2
Packaging: Tape & Reel (TR)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
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MRF6V2300NBR5 MRF6V2300NBR5 NXP USA Inc. MRF6V2300N(B)R1.pdf Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
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MRF6VP2600HR5 MRF6VP2600HR5 NXP USA Inc. MRF6VP2600HR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Produkt ist nicht verfügbar
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MC34704AEPR2 MC34704AEPR2 NXP USA Inc. MC34704.pdf Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34704BEPR2 MC34704BEPR2 NXP USA Inc. MC34704.pdf Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Active
auf Bestellung 3170 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.83 EUR
10+13.93 EUR
25+12.96 EUR
100+11.89 EUR
250+11.38 EUR
500+11.07 EUR
1000+10.82 EUR
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MC34727AFCR2 MC34727AFCR2 NXP USA Inc. Description: IC REG BUCK 1.2V 600MA 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.2V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34727BFCR2 MC34727BFCR2 NXP USA Inc. Description: IC REG BUCK 1.8V 600MA 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.8V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMG3014NT1 MMG3014NT1 NXP USA Inc. MMG3014NT1.pdf Description: IC RF AMP 4GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 4GHz
Voltage - Supply: 5V
Gain: 19.5dB
Current - Supply: 135mA
Noise Figure: 5.7dB
P1dB: 25dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
auf Bestellung 1860 Stücke:
Lieferzeit 10-14 Tag (e)
4+4.98 EUR
10+4.30 EUR
25+4.07 EUR
100+3.74 EUR
250+3.55 EUR
500+3.41 EUR
Mindestbestellmenge: 4
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MMG3H21NT1 MMG3H21NT1 NXP USA Inc. MMG3H21NT1.pdf Description: IC RF AMP 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
Voltage - Supply: 5V
Gain: 19.3dB
Current - Supply: 90mA
Noise Figure: 5.5dB
P1dB: 20.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
auf Bestellung 1471 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.35 EUR
10+3.75 EUR
25+3.54 EUR
100+3.26 EUR
250+3.08 EUR
500+2.96 EUR
Mindestbestellmenge: 5
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MRF1513NT1 MRF1513NT1 NXP USA Inc. MRF1513N.pdf Description: RF MOSFET LDMOS 12.5V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Current Rating (Amps): 2A
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 3W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 50 mA
Produkt ist nicht verfügbar
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MRF1518NT1 MRF1518NT1 NXP USA Inc. MRF1518N.pdf Description: RF MOSFET LDMOS 12.5V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 8W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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MRF6V10010NR4 MRF6V10010NR4 NXP USA Inc. MRF6V10010N.pdf Description: RF MOSFET LDMOS 50V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 10W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 182 Stücke:
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1+182.27 EUR
10+153.11 EUR
25+145.83 EUR
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MRF6V2300NBR5 MRF6V2300NBR5 NXP USA Inc. MRF6V2300N(B)R1.pdf Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
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MRF6VP2600HR5 MRF6VP2600HR5 NXP USA Inc. MRF6VP2600HR6.pdf Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Produkt ist nicht verfügbar
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MRFE6S9045NR1 MRFE6S9045NR1 NXP USA Inc. MRFE6S9045N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
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MRFE6S9060NR1 MRFE6S9060NR1 NXP USA Inc. MRFE6S9060N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
auf Bestellung 266 Stücke:
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1+85.47 EUR
10+70.26 EUR
25+66.47 EUR
100+62.30 EUR
250+60.31 EUR
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MW6S004NT1 MW6S004NT1 NXP USA Inc. MW6S004N.pdf Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
auf Bestellung 978 Stücke:
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1+24.20 EUR
10+19.16 EUR
25+17.90 EUR
100+17.07 EUR
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MW6S010NR1 MW6S010NR1 NXP USA Inc. MW6S010N.pdf Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Not For New Designs
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
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CWA-PRO-NL CWA-PRO-NL NXP USA Inc. 926-76000.pdf Description: SOFTWARE TECH SUPPORT BUNDLE
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Utilized IC / Part: Code Warrior™ Software
Operating System: Windows XP, 7
Edition: Professional
License Length: 1 Year
License - User Details: Fixed Node
Media Delivery Type: USB Flash Drive
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
1+4090.33 EUR
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TJA1021T/10/C,118 TJA1021T/10/C,118 NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
2500+1.05 EUR
Mindestbestellmenge: 2500
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TJA1021T/10/C,118 TJA1021T/10/C,118 NXP USA Inc. TJA1021.pdf Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10545 Stücke:
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10+1.81 EUR
13+1.36 EUR
25+1.31 EUR
100+1.24 EUR
250+1.19 EUR
500+1.13 EUR
1000+1.11 EUR
Mindestbestellmenge: 10
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NX3L1G53GT,115 NX3L1G53GT,115 NXP USA Inc. NX3L1G53.pdf Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+0.63 EUR
Mindestbestellmenge: 5000
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NX3V1G66GM,115 NX3V1G66GM,115 NXP USA Inc. NX3V1G66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3V1T66GM,115 NX3V1T66GM,115 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3V1T66GM,115 NX3V1T66GM,115 NXP USA Inc. NX3V1T66.pdf Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3L1G3157GM,115 NX3L1G3157GM,115 NXP USA Inc. NX3L1G3157.pdf Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3L2G66GT,115 NX3L2G66GT,115 NXP USA Inc. NX3L2G66.pdf Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
Produkt ist nicht verfügbar
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1322XUSB 1322XUSB NXP USA Inc. MC13224V_Rev1.3.pdf description Description: KIT USB 1322X
Packaging: Box
For Use With/Related Products: MC1322x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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1322XDSK-DBG 1322XDSK-DBG NXP USA Inc. ZigBee_Tech_Sum_Rev10.pdf description Description: KIT DEVELOPER STARTER 1322X
Packaging: Box
For Use With/Related Products: MC1322x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: MC1322x
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1322XNSK-DBG 1322XNSK-DBG NXP USA Inc. ZigBee_Tech_Sum_Rev10.pdf Description: KIT NETWORK STARTER 1322X
Produkt ist nicht verfügbar
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DEMO908AP64E DEMO908AP64E NXP USA Inc. Description: MC68HC908AP EVAL BRD
Produkt ist nicht verfügbar
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MMA7331LT MMA7331LT NXP USA Inc. MMA7331L.pdf Description: ACCELEROMETER 4-9G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 9g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Produkt ist nicht verfügbar
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MC9S08DN16ACLF MC9S08DN16ACLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN16AMLF MC9S08DN16AMLF NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DN32AMLC MC9S08DN32AMLC NXP USA Inc. MC9S08DN60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV16ACLC MC9S08DV16ACLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
MC9S08DV16ACLF MC9S08DV16ACLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV32ACLC MC9S08DV32ACLC NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC9S08DV32ACLF MC9S08DV32ACLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV32AMLF MC9S08DV32AMLF NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV32AMLH MC9S08DV32AMLH NXP USA Inc. MC9S08DV60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 646 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.80 EUR
10+19.02 EUR
80+16.06 EUR
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MC9S08DZ16ACLC MC9S08DZ16ACLC NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ16ACLF MC9S08DZ16ACLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 426 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.26 EUR
10+11.44 EUR
Mindestbestellmenge: 2
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MC9S08DZ32ACLC MC9S08DZ32ACLC NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 1130 Stücke:
Lieferzeit 10-14 Tag (e)
2+16.44 EUR
10+12.91 EUR
25+12.03 EUR
100+11.07 EUR
250+10.90 EUR
Mindestbestellmenge: 2
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MC9S08DV32AMLC MC9S08DV60.pdf
MC9S08DV32AMLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV60ACLF MC9S08DV60.pdf
MC9S08DV60ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ48ACLC MC9S08DZ60.pdf
MC9S08DZ48ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ48ACLF MC9S08DZ60.pdf
MC9S08DZ48ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 3K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1.5K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC34704BEPR2 MC34704.pdf
MC34704BEPR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+10.61 EUR
Mindestbestellmenge: 2000
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MC34704AEPR2 MC34704.pdf
MC34704AEPR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Tape & Reel (TR)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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DEMO9RS08LA8 DEMO9RS08LA8_Gde.pdf
DEMO9RS08LA8
Hersteller: NXP USA Inc.
Description: MC9RS08LA8 EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MCU 8-Bit
Contents: Board(s), Cable(s), LCD
Core Processor: RS08
Utilized IC / Part: MC9RS08LA8
Produkt ist nicht verfügbar
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DEMO9S08LL16 DEMO9S08LL16_UG.pdf
DEMO9S08LL16
Hersteller: NXP USA Inc.
Description: MC9S08LL16 EVAL BRD
Produkt ist nicht verfügbar
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DEMOMPR083 MPR083.pdf
DEMOMPR083
Hersteller: NXP USA Inc.
Description: BOARD DEMO FOR MPR083 CTLR
Produkt ist nicht verfügbar
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KIT33794EKEVM KIT33794EKEVM.pdf
Hersteller: NXP USA Inc.
Description: KIT EVALUATION HARDWARE 33794
Packaging: Box
Function: Sensor Signal Conditioner
Type: Interface
Utilized IC / Part: MC33794
Supplied Contents: Board(s)
Produkt ist nicht verfügbar
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MC34727AFCR2
MC34727AFCR2
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.2V 600MA 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.2V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34727BFCR2
MC34727BFCR2
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.8V 600MA 8UDFN
Packaging: Tape & Reel (TR)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.8V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC9S08LL16CLH MC9S08LL16.pdf
MC9S08LL16CLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: I2C, SCI, SPI
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 38
DigiKey Programmable: Not Verified
auf Bestellung 574 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.86 EUR
10+7.69 EUR
80+6.30 EUR
Mindestbestellmenge: 2
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MMG3014NT1 MMG3014NT1.pdf
MMG3014NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 4GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 4GHz
Voltage - Supply: 5V
Gain: 19.5dB
Current - Supply: 135mA
Noise Figure: 5.7dB
P1dB: 25dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+3.28 EUR
Mindestbestellmenge: 1000
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MMG3H21NT1 MMG3H21NT1.pdf
MMG3H21NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 0HZ-6GHZ SOT89-4
Packaging: Tape & Reel (TR)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
Voltage - Supply: 5V
Gain: 19.3dB
Current - Supply: 90mA
Noise Figure: 5.5dB
P1dB: 20.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+2.85 EUR
Mindestbestellmenge: 1000
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MRF6V10010NR4 MRF6V10010N.pdf
MRF6V10010NR4
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V PLD-1.5
Packaging: Tape & Reel (TR)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 10W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 100 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
100+137.83 EUR
Mindestbestellmenge: 100
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MRF6V2010NBR5 MRF6V2010N.pdf
MRF6V2010NBR5
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-2
Packaging: Tape & Reel (TR)
Package / Case: TO-272BC
Mounting Type: Chassis Mount
Frequency: 220MHz
Power - Output: 10W
Gain: 23.9dB
Technology: LDMOS
Supplier Device Package: TO-272-2
Part Status: Obsolete
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 30 mA
Produkt ist nicht verfügbar
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MRF6V2300NBR5 MRF6V2300N(B)R1.pdf
MRF6V2300NBR5
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
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MRF6VP2600HR5 MRF6VP2600HR6.pdf
MRF6VP2600HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Tape & Reel (TR)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Produkt ist nicht verfügbar
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MC34704AEPR2 MC34704.pdf
MC34704AEPR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34704BEPR2 MC34704.pdf
MC34704BEPR2
Hersteller: NXP USA Inc.
Description: IC PWR MGMNT DC-DC MULT 56-QFN
Packaging: Cut Tape (CT)
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -20°C ~ 85°C
Voltage - Supply: 2.7V ~ 5.5V
Applications: Processor
Current - Supply: 86mA
Supplier Device Package: 56-QFN-EP (7x7)
Part Status: Active
auf Bestellung 3170 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+17.83 EUR
10+13.93 EUR
25+12.96 EUR
100+11.89 EUR
250+11.38 EUR
500+11.07 EUR
1000+10.82 EUR
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MC34727AFCR2
MC34727AFCR2
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.2V 600MA 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.2V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC34727BFCR2
MC34727BFCR2
Hersteller: NXP USA Inc.
Description: IC REG BUCK 1.8V 600MA 8UDFN
Packaging: Cut Tape (CT)
Package / Case: 8-UFDFN
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 600mA
Operating Temperature: -25°C ~ 85°C (TA)
Output Configuration: Positive
Frequency - Switching: 2MHz
Voltage - Input (Max): 5.5V
Topology: Buck
Supplier Device Package: 8-USON (2x2)
Synchronous Rectifier: Yes
Voltage - Input (Min): 2.7V
Voltage - Output (Min/Fixed): 1.8V
Part Status: Obsolete
Produkt ist nicht verfügbar
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MMG3014NT1 MMG3014NT1.pdf
MMG3014NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 4GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 4GHz
Voltage - Supply: 5V
Gain: 19.5dB
Current - Supply: 135mA
Noise Figure: 5.7dB
P1dB: 25dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
auf Bestellung 1860 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.98 EUR
10+4.30 EUR
25+4.07 EUR
100+3.74 EUR
250+3.55 EUR
500+3.41 EUR
Mindestbestellmenge: 4
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MMG3H21NT1 MMG3H21NT1.pdf
MMG3H21NT1
Hersteller: NXP USA Inc.
Description: IC RF AMP 0HZ-6GHZ SOT89-4
Packaging: Cut Tape (CT)
Package / Case: TO-243AA
Mounting Type: Surface Mount
Frequency: 0Hz ~ 6GHz
Voltage - Supply: 5V
Gain: 19.3dB
Current - Supply: 90mA
Noise Figure: 5.5dB
P1dB: 20.5dBm
Test Frequency: 900MHz
Supplier Device Package: SOT-89-4
Part Status: Active
auf Bestellung 1471 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.35 EUR
10+3.75 EUR
25+3.54 EUR
100+3.26 EUR
250+3.08 EUR
500+2.96 EUR
Mindestbestellmenge: 5
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MRF1513NT1 MRF1513N.pdf
MRF1513NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Current Rating (Amps): 2A
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 3W
Gain: 15dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 50 mA
Produkt ist nicht verfügbar
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MRF1518NT1 MRF1518N.pdf
MRF1518NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 12.5V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Current Rating (Amps): 4A
Mounting Type: Surface Mount
Frequency: 520MHz
Power - Output: 8W
Gain: 13dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Obsolete
Voltage - Rated: 40 V
Voltage - Test: 12.5 V
Current - Test: 150 mA
Produkt ist nicht verfügbar
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MRF6V10010NR4 MRF6V10010N.pdf
MRF6V10010NR4
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.09GHz
Power - Output: 10W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 100 V
Voltage - Test: 50 V
Current - Test: 10 mA
auf Bestellung 182 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+182.27 EUR
10+153.11 EUR
25+145.83 EUR
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MRF6V2300NBR5 MRF6V2300N(B)R1.pdf
MRF6V2300NBR5
Hersteller: NXP USA Inc.
Description: FET RF 110V 220MHZ TO-272-4
Produkt ist nicht verfügbar
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MRF6VP2600HR5 MRF6VP2600HR6.pdf
MRF6VP2600HR5
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 50V NI1230
Packaging: Cut Tape (CT)
Package / Case: NI-1230
Mounting Type: Chassis Mount
Frequency: 225MHz
Configuration: Dual
Power - Output: 125W
Gain: 25dB
Technology: LDMOS
Supplier Device Package: NI-1230
Voltage - Rated: 110 V
Voltage - Test: 50 V
Current - Test: 2.6 A
Produkt ist nicht verfügbar
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MRFE6S9045NR1 MRFE6S9045N.pdf
MRFE6S9045NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 10W
Gain: 22.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Obsolete
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 350 mA
Produkt ist nicht verfügbar
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MRFE6S9060NR1 MRFE6S9060N.pdf
MRFE6S9060NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 880MHz
Power - Output: 14W
Gain: 21.1dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Active
Voltage - Rated: 66 V
Voltage - Test: 28 V
Current - Test: 450 mA
auf Bestellung 266 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+85.47 EUR
10+70.26 EUR
25+66.47 EUR
100+62.30 EUR
250+60.31 EUR
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MW6S004NT1 MW6S004N.pdf
MW6S004NT1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V PLD-1.5
Packaging: Cut Tape (CT)
Package / Case: PLD-1.5
Mounting Type: Surface Mount
Frequency: 1.96GHz
Power - Output: 4W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: PLD-1.5
Part Status: Active
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 50 mA
auf Bestellung 978 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.20 EUR
10+19.16 EUR
25+17.90 EUR
100+17.07 EUR
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MW6S010NR1 MW6S010N.pdf
MW6S010NR1
Hersteller: NXP USA Inc.
Description: RF MOSFET LDMOS 28V TO270-2
Packaging: Cut Tape (CT)
Package / Case: TO-270AA
Mounting Type: Surface Mount
Frequency: 960MHz
Power - Output: 10W
Gain: 18dB
Technology: LDMOS
Supplier Device Package: TO-270-2
Part Status: Not For New Designs
Voltage - Rated: 68 V
Voltage - Test: 28 V
Current - Test: 125 mA
Produkt ist nicht verfügbar
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CWA-PRO-NL 926-76000.pdf
CWA-PRO-NL
Hersteller: NXP USA Inc.
Description: SOFTWARE TECH SUPPORT BUNDLE
Packaging: Box
For Use With/Related Products: Code Warrior™ Software
Type: Integrated Development Environment (IDE)
Applications: Programming
Utilized IC / Part: Code Warrior™ Software
Operating System: Windows XP, 7
Edition: Professional
License Length: 1 Year
License - User Details: Fixed Node
Media Delivery Type: USB Flash Drive
Part Status: Active
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+4090.33 EUR
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TJA1021T/10/C,118 TJA1021.pdf
TJA1021T/10/C,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.05 EUR
Mindestbestellmenge: 2500
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TJA1021T/10/C,118 TJA1021.pdf
TJA1021T/10/C,118
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER FULL 1/1 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Voltage - Supply: 5.5V ~ 27V
Number of Drivers/Receivers: 1/1
Protocol: LINbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 175 mV
Duplex: Full
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 10545 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.81 EUR
13+1.36 EUR
25+1.31 EUR
100+1.24 EUR
250+1.19 EUR
500+1.13 EUR
1000+1.11 EUR
Mindestbestellmenge: 10
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NX3L1G53GT,115 NX3L1G53.pdf
NX3L1G53GT,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 8XSON
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 24ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Active
Number of Circuits: 1
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+0.63 EUR
Mindestbestellmenge: 5000
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NX3V1G66GM,115 NX3V1G66.pdf
NX3V1G66GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 24ns, 9ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3V1T66GM,115 NX3V1T66.pdf
NX3V1T66GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3V1T66GM,115 NX3V1T66.pdf
NX3V1T66GM,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX1 450MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 450mOhm
-3db Bandwidth: 25MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 12pC
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Switch Time (Ton, Toff) (Max): 28ns, 20ns
Channel Capacitance (CS(off), CD(off)): 70pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3L1G3157GM,115 NX3L1G3157.pdf
NX3L1G3157GM,115
Hersteller: NXP USA Inc.
Description: IC SWITCH SPDT X 1 750MOHM 6XSON
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 6-XSON, SOT886 (1.45x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 15pC
Switch Circuit: SPDT
Multiplexer/Demultiplexer Circuit: 2:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 25ns, 10ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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NX3L2G66GT,115 NX3L2G66.pdf
NX3L2G66GT,115
Hersteller: NXP USA Inc.
Description: IC SW SPST-NOX2 750MOHM 8XSON
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
On-State Resistance (Max): 750mOhm
-3db Bandwidth: 60MHz
Supplier Device Package: 8-XSON, SOT833-1 (1.95x1)
Voltage - Supply, Single (V+): 1.4V ~ 4.3V
Charge Injection: 6pC
Crosstalk: -90dB @ 100kHz
Switch Circuit: SPST - NO
Multiplexer/Demultiplexer Circuit: 1:1
Channel-to-Channel Matching (ΔRon): 20mOhm
Switch Time (Ton, Toff) (Max): 23ns, 8ns
Channel Capacitance (CS(off), CD(off)): 35pF
Current - Leakage (IS(off)) (Max): 10nA
Number of Circuits: 2
Produkt ist nicht verfügbar
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1322XUSB description MC13224V_Rev1.3.pdf
1322XUSB
Hersteller: NXP USA Inc.
Description: KIT USB 1322X
Packaging: Box
For Use With/Related Products: MC1322x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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1322XDSK-DBG description ZigBee_Tech_Sum_Rev10.pdf
1322XDSK-DBG
Hersteller: NXP USA Inc.
Description: KIT DEVELOPER STARTER 1322X
Packaging: Box
For Use With/Related Products: MC1322x
Frequency: 2.4GHz
Type: Transceiver; 802.15.4 (ZigBee®)
Supplied Contents: Board(s)
Contents: Board(s)
Utilized IC / Part: MC1322x
Produkt ist nicht verfügbar
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1322XNSK-DBG ZigBee_Tech_Sum_Rev10.pdf
1322XNSK-DBG
Hersteller: NXP USA Inc.
Description: KIT NETWORK STARTER 1322X
Produkt ist nicht verfügbar
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DEMO908AP64E
DEMO908AP64E
Hersteller: NXP USA Inc.
Description: MC68HC908AP EVAL BRD
Produkt ist nicht verfügbar
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MMA7331LT MMA7331L.pdf
MMA7331LT
Hersteller: NXP USA Inc.
Description: ACCELEROMETER 4-9G ANALOG 14LGA
Packaging: Tray
Features: Selectable Scale
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±4g, 9g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 308 (±4g) ~ 83.6 (±9g)
Produkt ist nicht verfügbar
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MC9S08DN16ACLF MC9S08DN60.pdf
MC9S08DN16ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DN16AMLF MC9S08DN60.pdf
MC9S08DN16AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DN32AMLC MC9S08DN60.pdf
MC9S08DN32AMLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
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MC9S08DV16ACLC MC9S08DV60.pdf
MC9S08DV16ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
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MC9S08DV16ACLF MC9S08DV60.pdf
MC9S08DV16ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DV32ACLC MC9S08DV60.pdf
MC9S08DV32ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC9S08DV32ACLF MC9S08DV60.pdf
MC9S08DV32ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Part Status: Active
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DV32AMLF MC9S08DV60.pdf
MC9S08DV32AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
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MC9S08DV32AMLH MC9S08DV60.pdf
MC9S08DV32AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 646 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.80 EUR
10+19.02 EUR
80+16.06 EUR
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MC9S08DZ16ACLC MC9S08DZ60.pdf
MC9S08DZ16ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08DZ16ACLF MC9S08DZ60.pdf
MC9S08DZ16ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 426 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.26 EUR
10+11.44 EUR
Mindestbestellmenge: 2
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MC9S08DZ32ACLC MC9S08DZ60.pdf
MC9S08DZ32ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 1130 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.44 EUR
10+12.91 EUR
25+12.03 EUR
100+11.07 EUR
250+10.90 EUR
Mindestbestellmenge: 2
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