Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36952) > Seite 135 nach 616

Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 14-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC TXRX 8-SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Protocol: CANbus
Supplier Device Package: 8-SO
Receiver Hysteresis: 70 mV
Duplex: Half
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC 3.3V 48-LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: Audio, AC '97
Data Interface: Serial
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Resolution (Bits): 20 b
Number of ADCs / DACs: 2 / 2
S/N Ratio, ADCs / DACs (db) Typ: 97 / 91
Sigma Delta: No
Supplier Device Package: 48-LQFP (7x7)

Hersteller: NXP USA Inc.
Description: IC AUDIO CODEC 3.3V 48-LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Type: Audio, AC '97
Data Interface: Serial
Operating Temperature: -40°C ~ 85°C
Voltage - Supply, Analog: 3V ~ 3.6V
Voltage - Supply, Digital: 3V ~ 3.6V
Resolution (Bits): 20 b
Number of ADCs / DACs: 2 / 2
S/N Ratio, ADCs / DACs (db) Typ: 97 / 91
Sigma Delta: No
Supplier Device Package: 48-LQFP (7x7)

Hersteller: NXP USA Inc.
Description: TRIAC SENS GATE 600V 0.8A TO92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Triac Type: Logic - Sensitive Gate
Configuration: Single
Operating Temperature: 125°C (TJ)
Current - Hold (Ih) (Max): 10 mA
Current - Gate Trigger (Igt) (Max): 5 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 9A, 10A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - On State (It (RMS)) (Max): 800 mA
Voltage - Off State: 600 V

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.053" W (3.30mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 10pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 16dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 33dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Number of Channels: 6

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHMS ESD SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.053" W (3.30mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 200Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 33dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 200
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/30PF SMD

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 12-XFDFN Exposed Pad
Size / Dimension: 0.098" L x 0.053" W (2.50mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 6

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.053" W (3.30mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Tape & Reel (TR)
Package / Case: 8-XFDFN Exposed Pad
Size / Dimension: 0.067" L x 0.053" W (1.70mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 4

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 200 OHM/30PF SMD

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Cut Tape (CT)
Package / Case: 16-XFDFN Exposed Pad
Size / Dimension: 0.130" L x 0.053" W (3.30mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Part Status: Obsolete
Number of Channels: 8

Hersteller: NXP USA Inc.
Description: FILTER RC(PI) 100 OHM/30PF SMD
Packaging: Cut Tape (CT)
Package / Case: 8-XFDFN Exposed Pad
Size / Dimension: 0.067" L x 0.053" W (1.70mm x 1.35mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 100Ohms, C = 30pF (Total)
Height: 0.020" (0.50mm)
Attenuation Value: 28dB @ 800MHz ~ 3GHz
Filter Order: 2nd
Applications: LAN, WAN
Technology: RC (Pi)
Resistance - Channel (Ohms): 100
ESD Protection: Yes
Number of Channels: 4

Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
SATA: SATA 3Gbps (2)
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI

Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 533MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 533MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 667MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 667MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI

Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 800MHZ PBGA689
Packaging: Tray
Package / Case: 689-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 800MHz
Operating Temperature: 0°C ~ 125°C (TA)
Core Processor: PowerPC e300c4s
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 689-TEPBGA II (31x31)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 3.0
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: DUART, I2C, MMC/SD, PCI, SPI

Hersteller: NXP USA Inc.
Description: MPC8377E EVAL BRD
Packaging: Box
Mounting Type: Fixed
Type: MPU
Contents: Board(s)
Core Processor: e300
Utilized IC / Part: MPC8377E

Hersteller: NXP USA Inc.
Description: MC9S08JS16 EVAL BRD
Packaging: Box
Mounting Type: Socket
Type: MCU 8-Bit
Contents: Board(s), Cable(s)
Core Processor: HCS08
Board Type: Evaluation Platform
Utilized IC / Part: MC9S08JS16
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 24-HVQFN (5x5)
Number of I/O: 14
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 20-SOIC
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI, SPI, USB
Peripherals: LVD, POR, PWM
Supplier Device Package: 24-HVQFN (5x5)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-TSSOP
Number of I/O: 14
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: LINbus, SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 28-SOIC
Part Status: Active
Number of I/O: 24
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 333MHZ 516TEPBGA
Packaging: Tray
Package / Case: 516-BBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC e300c3
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 516-TEPBGA (27x27)
Ethernet: 10/100/1000Mbps (2)
USB: USB 2.0 + PHY (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Security; SEC 2.2
RAM Controllers: DDR, DDR2
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: DUART, HSSI, I2C, PCI, SPI

Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator

Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.0GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.0GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator

Hersteller: NXP USA Inc.
Description: IC MPU MPC85XX 1.333GHZ 783FCBGA
Packaging: Tray
Package / Case: 783-BBGA, FCBGA
Mounting Type: Surface Mount
Speed: 1.333GHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC e500
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 783-FCBGA (29x29)
Ethernet: 10/100/1000Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Signal Processing; SPE, Security; SEC
RAM Controllers: DDR, DDR2, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator

Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR DDR 8-HWSON
Packaging: Tape & Reel (TR)
Package / Case: 8-WFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active

Hersteller: NXP USA Inc.
Description: IC TEMP SENSOR DDR 8-HWSON
Packaging: Cut Tape (CT)
Package / Case: 8-WFDFN Exposed Pad
Output Type: I2C/SMBus
Mounting Type: Surface Mount
Function: Temp Monitoring System (Sensor)
Accuracy: ±4°C(Max)
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 1.7V ~ 3.6V
Sensor Type: Internal
Sensing Temperature: -40°C ~ 125°C
Topology: ADC (Sigma Delta), Register Bank
Output Alarm: Yes
Output Fan: Yes
Supplier Device Package: 8-HWSON (2x3)
Part Status: Active

Hersteller: NXP USA Inc.
Description: KIT EVAL 1.56/6G 3-AXIS ACCELER
Packaging: Box
Sensitivity: 800mV/g
Interface: Analog
Contents: Board(s)
Voltage - Supply: 2.2V ~ 3.6V
Sensor Type: Accelerometer, 3 Axis
Utilized IC / Part: MMA7361L
Supplied Contents: Board(s)
Embedded: No
Sensing Range: ±1.5g, 6g

Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL TRIAC 2A 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 100kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 100°C (TA)
Current - Output / Channel: 2A (Switch)
Internal Switch(s): Yes
Topology: Flyback, Step-Down (Buck)
Supplier Device Package: 16-SO
Dimming: Triac
Voltage - Supply (Min): 8.5V
Voltage - Supply (Max): 40V

Hersteller: NXP USA Inc.
Description: IC LED DRIVER OFFL TRIAC 2A 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 100kHz
Type: AC DC Offline Switcher
Operating Temperature: -40°C ~ 100°C (TA)
Current - Output / Channel: 2A (Switch)
Internal Switch(s): Yes
Topology: Flyback, Step-Down (Buck)
Supplier Device Package: 16-SO
Dimming: Triac
Voltage - Supply (Min): 8.5V
Voltage - Supply (Max): 40V

Hersteller: NXP USA Inc.
Description: KIT DEMO NFC PN532
Packaging: Box
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s), Cable(s), Power Supply
Supplied Contents: Board(s), Cable(s), Power Supply
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J

Hersteller: NXP USA Inc.
Description: IC RF AMP GP 40MHZ-6GHZ 6XSON

Hersteller: NXP USA Inc.
Description: IC AMP CATV SOT115J

Hersteller: NXP USA Inc.
Description: KIT LCD TOUCH 5.7" FOR LPC2478

Hersteller: NXP USA Inc.
Description: MODULE DIMM LPC2478 ARM7
Packaging: Box
For Use With/Related Products: ARM-57TS-LPC2478
Accessory Type: Module Card

Hersteller: NXP USA Inc.
Description: KIT LCD TOUCH 5.7" FOR LPC3250

Hersteller: NXP USA Inc.
Description: MODULE DIMM LPC3250 ARM9

Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 208MAPBGA
Packaging: Tray
Package / Case: 208-BGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 34x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, Ethernet, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 208-BGA (17x17)
Number of I/O: 192
DigiKey Programmable: Not Verified

Hersteller: NXP USA Inc.
Description: ACCELEROMETER 3-11G ANALOG 14LGA
Features: Selectable Scale, Sleep Mode
Packaging: Bag
Package / Case: 14-TFLGA
Output Type: Analog Voltage
Mounting Type: Surface Mount
Type: Analog
Axis: X, Y, Z
Acceleration Range: ±3g, 11g
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.2V ~ 3.6V
Bandwidth: 400Hz (X,Y), 300Hz (Z)
Supplier Device Package: 14-LGA (3x5)
Sensitivity (mV/g): 440 (±3g) ~ 117.8 (±9g)

Hersteller: NXP USA Inc.
Description: EMULATOR LPC700 PDS76X

Hersteller: NXP USA Inc.
Description: PROGRAMMER LPC700 P76XLCP

Hersteller: NXP USA Inc.
Description: EMULATOR 80C51 PDS51-MK2
Packaging: Box
For Use With/Related Products: P87C51
Type: Emulator (In-Circuit/In-System)
Contents: Board(s), Cable(s), Power Supply
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: DAUGHTER BOARD FOR PDS51-MK2

Hersteller: NXP USA Inc.
Description: KIT FOR LCD DEMO LPC900
Packaging: Box
Function: LCD Controller
Type: Display
Utilized IC / Part: PCF8562TT
Supplied Contents: Board(s)
Embedded: Yes, MCU, 8-Bit

Hersteller: NXP USA Inc.
Description: KIT DEV WLAN ADK

Hersteller: NXP USA Inc.
Description: PHYTEC PHYCORE RAPID DEV KIT LPC
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Power Supply
Core Processor: ARM7
Board Type: Evaluation Platform
Utilized IC / Part: LPC2220
Platform: PHYTEC phyCORE Rapid Dev Kit
Part Status: Obsolete

Hersteller: NXP USA Inc.
Description: IAR KICKSTART LPC935 EVAL BRD

Hersteller: NXP USA Inc.
Description: P89V52X2 EVAL BRD

Hersteller: NXP USA Inc.
Description: LPC2388 EVAL BRD