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MC9S08DZ32ACLF MC9S08DZ32ACLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1208 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.65 EUR
10+17.03 EUR
25+15.87 EUR
80+14.78 EUR
230+14.05 EUR
440+13.70 EUR
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MC9S08DZ32AMLH MC9S08DZ32AMLH NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 471 Stücke:
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2+16.86 EUR
10+13.82 EUR
Mindestbestellmenge: 2
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MC9S08DZ60ACLC MC9S08DZ60ACLC NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 505 Stücke:
Lieferzeit 10-14 Tag (e)
1+23.57 EUR
10+18.59 EUR
25+17.35 EUR
80+16.17 EUR
230+15.39 EUR
440+15.01 EUR
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MC9S08DZ60ACLF MC9S08DZ60ACLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 5576 Stücke:
Lieferzeit 10-14 Tag (e)
1+22.26 EUR
10+17.58 EUR
25+16.41 EUR
100+15.13 EUR
250+14.51 EUR
500+14.15 EUR
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MC9S08DZ60ACLH MC9S08DZ60ACLH NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 1394 Stücke:
Lieferzeit 10-14 Tag (e)
1+25.54 EUR
10+20.20 EUR
25+18.87 EUR
80+17.60 EUR
230+16.76 EUR
800+16.04 EUR
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MC9S08DZ60AMLC MC9S08DZ60AMLC NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 1315 Stücke:
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2+16.58 EUR
10+13.51 EUR
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MC9S08DZ60AMLF MC9S08DZ60AMLF NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 670 Stücke:
Lieferzeit 10-14 Tag (e)
1+26.31 EUR
10+20.84 EUR
25+19.47 EUR
80+18.17 EUR
230+17.31 EUR
440+16.89 EUR
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MC9S08DZ60AMLH MC9S08DZ60AMLH NXP USA Inc. MC9S08DZ60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 164 Stücke:
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1+27.93 EUR
10+22.32 EUR
80+18.85 EUR
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LM75BD,118 LM75BD,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 15000 Stücke:
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2500+0.56 EUR
5000+0.54 EUR
7500+0.53 EUR
12500+0.52 EUR
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LM75BD,118 LM75BD,118 NXP USA Inc. LM75B.pdf Description: SENSOR DIGITAL -55C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 18054 Stücke:
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19+0.97 EUR
21+0.85 EUR
22+0.81 EUR
25+0.75 EUR
50+0.72 EUR
100+0.68 EUR
500+0.62 EUR
1000+0.59 EUR
Mindestbestellmenge: 19
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LPC2103FHN48,551 LPC2103FHN48,551 NXP USA Inc. LPC2101_02_03.pdf Description: IC MCU 16/32B 32KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2158FBD100,551 LPC2158FBD100,551 NXP USA Inc. LPC2157_2158.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC3130FET180,551 LPC3130FET180,551 NXP USA Inc. LPC3130_31.pdf Description: IC MCU 16/32BIT ROMLESS 180TFBGA
auf Bestellung 52 Stücke:
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P89LPC9321FA,112 P89LPC9321FA,112 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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P89LPC9321FDH,518 P89LPC9321FDH,518 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC9321FN,112 P89LPC9321FN,112 NXP USA Inc. P89LPC9321.pdf Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-DIP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC9351FA,112 P89LPC9351FA,112 NXP USA Inc. P89LPC9331_9341_9351_9361.pdf Description: IC MCU 8BIT 8KB FLASH 28PLCC
Produkt ist nicht verfügbar
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P89LPC9351FDH,518 P89LPC9351FDH,518 NXP USA Inc. P89LPC9351.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52252AF80 MCF52252AF80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52254AF80 MCF52254AF80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 730 Stücke:
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1+39.58 EUR
10+31.64 EUR
80+26.72 EUR
450+26.56 EUR
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MCF52254CAF66 MCF52254CAF66 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 410 Stücke:
Lieferzeit 10-14 Tag (e)
1+37.49 EUR
10+27.55 EUR
25+25.00 EUR
80+22.55 EUR
230+20.90 EUR
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MCF52255CAF80 MCF52255CAF80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 1082 Stücke:
Lieferzeit 10-14 Tag (e)
1+40.06 EUR
10+32.16 EUR
25+30.18 EUR
80+28.30 EUR
230+27.05 EUR
450+26.43 EUR
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MCF52256CAG66 MCF52256CAG66 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 231 Stücke:
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1+25.91 EUR
10+20.07 EUR
25+19.98 EUR
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MCF52258AG80 MCF52258AG80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52258CAG66 MCF52258CAG66 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 389 Stücke:
Lieferzeit 10-14 Tag (e)
1+38.30 EUR
10+30.72 EUR
25+28.83 EUR
100+26.75 EUR
300+25.59 EUR
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MCF52258CVN66 MCF52258CVN66 NXP USA Inc. MCF52259.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 96
Produkt ist nicht verfügbar
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MCF52259CAG80 MCF52259CAG80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 576 Stücke:
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25+29.91 EUR
100+27.79 EUR
300+26.60 EUR
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MCF52259CVN80 MCF52259CVN80 NXP USA Inc. MCF52259.pdf Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
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1+44.99 EUR
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MC9S08EL16CTL MC9S08EL16CTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
auf Bestellung 349 Stücke:
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MC9S08EL32CTJ MC9S08EL32CTJ NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Produkt ist nicht verfügbar
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MC9S08EL32CTL MC9S08EL32CTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 32KB FLASH 28TSSOP
auf Bestellung 147 Stücke:
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10+11.50 EUR
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MC9S08SL16CTL MC9S08SL16CTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08SL8CTJ MC9S08SL8CTJ NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 339 Stücke:
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2+12.00 EUR
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MC9S08SL8CTL MC9S08SL8CTL NXP USA Inc. MC9S08EL32.pdf Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tray
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QB8CGK MC9S08QB8CGK NXP USA Inc. 9S08QB84FS.pdf Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-HVQFN (5x5)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.58 EUR
10+4.37 EUR
80+3.58 EUR
490+3.50 EUR
980+2.95 EUR
2450+2.81 EUR
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MC9S08QB8CTG MC9S08QB8CTG NXP USA Inc. MC9S08QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
auf Bestellung 829 Stücke:
Lieferzeit 10-14 Tag (e)
3+7.50 EUR
10+5.86 EUR
100+4.80 EUR
500+4.70 EUR
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MC9S08QB8CWL MC9S08QB8CWL NXP USA Inc. 9S08QB84FS.pdf Description: IC MCU 8BIT 8KB FLASH 28SOIC
Produkt ist nicht verfügbar
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OM6290,598 OM6290,598 NXP USA Inc. OM6290_UM.pdf Description: EVAL BRD PCF2119 PCF8531 PCF8576
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCF2119, PCF8531, PCF8576
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 16/32-Bit
Part Status: Obsolete
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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OM6293,598 OM6293,598 NXP USA Inc. OM6293_Man.pdf Description: EVAL BOARD FOR PCA9600
Packaging: Bulk
Function: I2C Bus Buffer
Type: Interface
Utilized IC / Part: PCA9600
Supplied Contents: Board(s)
Embedded: No
Part Status: Obsolete
Contents: Board(s)
Produkt ist nicht verfügbar
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PX1011B-EL1/N,551 PX1011B-EL1/N,551 NXP USA Inc. PX1011B.pdf Description: IC INTFACE SPECIALIZED 81LFBGA
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
Produkt ist nicht verfügbar
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SC16C850SVIBS,151 SC16C850SVIBS,151 NXP USA Inc. SC16C850SV.pdf Description: IC UART SINGLE W/FIFO 32-HVQFN
Produkt ist nicht verfügbar
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SC18IS600IBS,151 SC18IS600IBS,151 NXP USA Inc. SC18IS600.pdf Description: IC SPI TO I2C BUS 24-HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC18IS601IBS,151 SC18IS601IBS,151 NXP USA Inc. SC18IS600.pdf Description: IC SPI TO I2C BUS 24-HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9600DP,118 PCA9600DP,118 NXP USA Inc. PCA9600.pdf Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.2mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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OM5571/N5122S01,69 NXP USA Inc. Description: KIT DEMO PN512C1 2 BOARDS
Packaging: Box
For Use With/Related Products: PN512
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM5588/N5331U01,69 OM5588/N5331U01,69 NXP USA Inc. Description: KIT DEMO PN533/C207
Packaging: Box
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s), Cable(s)
Utilized IC / Part: PN533
Produkt ist nicht verfügbar
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PIP213-12M,518 PIP213-12M,518 NXP USA Inc. PIP213-12M.pdf Description: IC HALF BRIDGE DRVR 25A 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit, 5V Regulated Output
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 16V
Rds On (Typ): 3.8mOhm LS, 6.5mOhm HS
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 40A
Technology: DrMOS
Voltage - Load: 24V (Max)
Supplier Device Package: 56-HVQFN (8x8)
Fault Protection: Over Temperature, UVLO
Load Type: Inductive
Part Status: Obsolete
Produkt ist nicht verfügbar
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BFG540/XR,215 BFG540/XR,215 NXP USA Inc. BFG540_X_XR_Rev5.pdf Description: RF TRANS NPN 15V 9GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 400mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: SOT-143R
Part Status: Obsolete
Produkt ist nicht verfügbar
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74HCT299PW,112 74HCT299PW,112 NXP USA Inc. 74HC%28T%29299.pdf Description: IC UNIV SHIFT REGISTER 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Universal
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT299PW,118 74HCT299PW,118 NXP USA Inc. 74HC%28T%29299.pdf Description: IC UNIV SHIFT REGISTER 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Universal
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74LVC543ABQ,118 74LVC543ABQ,118 NXP USA Inc. 74LVC543A.pdf Description: IC TXRX NON-INVERT 3.6V 24DHVQFN
Produkt ist nicht verfügbar
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BF1105R,215 BF1105R,215 NXP USA Inc. BF1105_R_WR.pdf Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Gain: 20dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.7dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 7 V
Voltage - Test: 5 V
Produkt ist nicht verfügbar
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BUT11AI,127 BUT11AI,127 NXP USA Inc. BUT11AI_2.pdf Description: TRANS NPN 450V 5A TO-220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 330mA, 2.5A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 14 @ 500mA, 5V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 450 V
Power - Max: 100 W
Produkt ist nicht verfügbar
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BUT11APX-1200,127 BUT11APX-1200,127 NXP USA Inc. BUT11APX-1200_1.pdf Description: TRANS NPN 550V 6A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 400mA, 2A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 500mA, 5V
Supplier Device Package: TO-220F
Part Status: Obsolete
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 550 V
Power - Max: 32 W
Produkt ist nicht verfügbar
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CBTV4012EE/G,518 NXP USA Inc. Description: IC MULTIPLEXER 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage Supply Source: Single Supply
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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CBTV4012EE,551 NXP USA Inc. Description: IC MUX/BUS SW 10BIT 64-TFBGA
Produkt ist nicht verfügbar
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CBTV4012EE,518 NXP USA Inc. Description: IC MULTIPLEXER 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage Supply Source: Single Supply
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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GTL2002D/DG,118 GTL2002D/DG,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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GTL2002DP/DG,118 GTL2002DP/DG,118 NXP USA Inc. GTL2002.pdf Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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GTL2002DP/S440,118 GTL2002DP/S440,118 NXP USA Inc. GTL2002.pdf Description: IC TRNSLTR BIDIRECTIONAL 8TSSOP
Produkt ist nicht verfügbar
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MC9S08DZ32ACLF MC9S08DZ60.pdf
MC9S08DZ32ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 1208 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.65 EUR
10+17.03 EUR
25+15.87 EUR
80+14.78 EUR
230+14.05 EUR
440+13.70 EUR
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MC9S08DZ32AMLH MC9S08DZ60.pdf
MC9S08DZ32AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 471 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.86 EUR
10+13.82 EUR
Mindestbestellmenge: 2
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MC9S08DZ60ACLC MC9S08DZ60.pdf
MC9S08DZ60ACLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 505 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+23.57 EUR
10+18.59 EUR
25+17.35 EUR
80+16.17 EUR
230+15.39 EUR
440+15.01 EUR
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MC9S08DZ60ACLF MC9S08DZ60.pdf
MC9S08DZ60ACLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 5576 Stücke:
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1+22.26 EUR
10+17.58 EUR
25+16.41 EUR
100+15.13 EUR
250+14.51 EUR
500+14.15 EUR
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MC9S08DZ60ACLH MC9S08DZ60.pdf
MC9S08DZ60ACLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 1394 Stücke:
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Anzahl Preis
1+25.54 EUR
10+20.20 EUR
25+18.87 EUR
80+17.60 EUR
230+16.76 EUR
800+16.04 EUR
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MC9S08DZ60AMLC MC9S08DZ60.pdf
MC9S08DZ60AMLC
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 10x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
auf Bestellung 1315 Stücke:
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Anzahl Preis
2+16.58 EUR
10+13.51 EUR
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MC9S08DZ60AMLF MC9S08DZ60.pdf
MC9S08DZ60AMLF
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 16x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 39
DigiKey Programmable: Not Verified
auf Bestellung 670 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+26.31 EUR
10+20.84 EUR
25+19.47 EUR
80+18.17 EUR
230+17.31 EUR
440+16.89 EUR
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MC9S08DZ60AMLH MC9S08DZ60.pdf
MC9S08DZ60AMLH
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: S08
Data Converters: A/D 24x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 53
DigiKey Programmable: Not Verified
auf Bestellung 164 Stücke:
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Anzahl Preis
1+27.93 EUR
10+22.32 EUR
80+18.85 EUR
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LM75BD,118 LM75B.pdf
LM75BD,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8SO
Packaging: Tape & Reel (TR)
Features: Output Switch, Programmable Limit
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.56 EUR
5000+0.54 EUR
7500+0.53 EUR
12500+0.52 EUR
Mindestbestellmenge: 2500
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LM75BD,118 LM75B.pdf
LM75BD,118
Hersteller: NXP USA Inc.
Description: SENSOR DIGITAL -55C-125C 8SO
Features: Output Switch, Programmable Limit
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: I2C
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Voltage - Supply: 2.8V ~ 5.5V
Sensor Type: Digital, Local
Resolution: 11 b
Supplier Device Package: 8-SO
Test Condition: -25°C ~ 100°C (-55°C ~ 125°C)
Accuracy - Highest (Lowest): ±2°C (±3°C)
Sensing Temperature - Local: -55°C ~ 125°C
Part Status: Active
auf Bestellung 18054 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
19+0.97 EUR
21+0.85 EUR
22+0.81 EUR
25+0.75 EUR
50+0.72 EUR
100+0.68 EUR
500+0.62 EUR
1000+0.59 EUR
Mindestbestellmenge: 19
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LPC2103FHN48,551 LPC2101_02_03.pdf
LPC2103FHN48,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 32KB FLASH 48HVQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 70MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-HVQFN (7x7)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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LPC2158FBD100,551 LPC2157_2158.pdf
LPC2158FBD100,551
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Produkt ist nicht verfügbar
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LPC3130FET180,551 LPC3130_31.pdf
LPC3130FET180,551
Hersteller: NXP USA Inc.
Description: IC MCU 16/32BIT ROMLESS 180TFBGA
auf Bestellung 52 Stücke:
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P89LPC9321FA,112 P89LPC9321.pdf
P89LPC9321FA,112
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
Packaging: Tube
Package / Case: 28-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-PLCC (11.48x11.48)
Number of I/O: 26
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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P89LPC9321FDH,518 P89LPC9321.pdf
P89LPC9321FDH,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC9321FN,112 P89LPC9321.pdf
P89LPC9321FN,112
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 28-DIP
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P89LPC9351FA,112 P89LPC9331_9341_9351_9361.pdf
P89LPC9351FA,112
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28PLCC
Produkt ist nicht verfügbar
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P89LPC9351FDH,518 P89LPC9351.pdf
P89LPC9351FDH,518
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 18MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512 x 8
Core Processor: 8051
Data Converters: A/D 8x8b; D/A 2x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 28-TSSOP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52252AF80 MCF52259.pdf
MCF52252AF80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52254AF80 MCF52259.pdf
MCF52254AF80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 730 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+39.58 EUR
10+31.64 EUR
80+26.72 EUR
450+26.56 EUR
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MCF52254CAF66 MCF52259.pdf
MCF52254CAF66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 410 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+37.49 EUR
10+27.55 EUR
25+25.00 EUR
80+22.55 EUR
230+20.90 EUR
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MCF52255CAF80 MCF52259.pdf
MCF52255CAF80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 56
DigiKey Programmable: Not Verified
auf Bestellung 1082 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+40.06 EUR
10+32.16 EUR
25+30.18 EUR
80+28.30 EUR
230+27.05 EUR
450+26.43 EUR
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MCF52256CAG66 MCF52259.pdf
MCF52256CAG66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 256KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 231 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.91 EUR
10+20.07 EUR
25+19.98 EUR
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MCF52258AG80 MCF52259.pdf
MCF52258AG80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Active
Number of I/O: 96
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MCF52258CAG66 MCF52259.pdf
MCF52258CAG66
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 389 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+38.30 EUR
10+30.72 EUR
25+28.83 EUR
100+26.75 EUR
300+25.59 EUR
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MCF52258CVN66 MCF52259.pdf
MCF52258CVN66
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Part Status: Active
Number of I/O: 96
Produkt ist nicht verfügbar
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MCF52259CAG80 MCF52259.pdf
MCF52259CAG80
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 576 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+39.60 EUR
10+31.85 EUR
25+29.91 EUR
100+27.79 EUR
300+26.60 EUR
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MCF52259CVN80 MCF52259.pdf
MCF52259CVN80
Hersteller: NXP USA Inc.
Description: IC MCU 32B 512KB FLASH 144MAPBGA
Packaging: Tray
Package / Case: 144-LBGA
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Coldfire V2
Data Converters: A/D 8x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, QSPI, UART/USART, USB OTG
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-MAPBGA (13x13)
Number of I/O: 96
DigiKey Programmable: Not Verified
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+44.99 EUR
10+36.09 EUR
80+30.82 EUR
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MC9S08EL16CTL MC9S08EL32.pdf
MC9S08EL16CTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
auf Bestellung 349 Stücke:
Lieferzeit 10-14 Tag (e)
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MC9S08EL32CTJ MC9S08EL32.pdf
MC9S08EL32CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 20TSSOP
Produkt ist nicht verfügbar
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MC9S08EL32CTL MC9S08EL32.pdf
MC9S08EL32CTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 28TSSOP
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.16 EUR
10+11.50 EUR
Mindestbestellmenge: 2
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MC9S08SL16CTL MC9S08EL32.pdf
MC9S08SL16CTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08SL8CTJ MC9S08EL32.pdf
MC9S08SL8CTJ
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
Packaging: Tray
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 12x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I²C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Part Status: Active
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 339 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.00 EUR
10+9.44 EUR
150+7.82 EUR
Mindestbestellmenge: 2
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MC9S08SL8CTL MC9S08EL32.pdf
MC9S08SL8CTL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28TSSOP
Packaging: Tray
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 256 x 8
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-TSSOP
Part Status: Active
Number of I/O: 22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08QB8CGK 9S08QB84FS.pdf
MC9S08QB8CGK
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 24QFN
Packaging: Tray
Package / Case: 24-VQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x12b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Connectivity: LINbus, SCI
Peripherals: LVD, PWM, WDT
Supplier Device Package: 24-HVQFN (5x5)
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 2450 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.58 EUR
10+4.37 EUR
80+3.58 EUR
490+3.50 EUR
980+2.95 EUR
2450+2.81 EUR
Mindestbestellmenge: 4
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MC9S08QB8CTG MC9S08QB8.pdf
MC9S08QB8CTG
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
auf Bestellung 829 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.50 EUR
10+5.86 EUR
100+4.80 EUR
500+4.70 EUR
Mindestbestellmenge: 3
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MC9S08QB8CWL 9S08QB84FS.pdf
MC9S08QB8CWL
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 28SOIC
Produkt ist nicht verfügbar
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OM6290,598 OM6290_UM.pdf
OM6290,598
Hersteller: NXP USA Inc.
Description: EVAL BRD PCF2119 PCF8531 PCF8576
Packaging: Bulk
Function: LCD Controller
Type: Display
Utilized IC / Part: PCF2119, PCF8531, PCF8576
Supplied Contents: Board(s), Cable(s)
Embedded: Yes, MCU, 16/32-Bit
Part Status: Obsolete
Contents: Board(s), Cable(s)
Produkt ist nicht verfügbar
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OM6293,598 OM6293_Man.pdf
OM6293,598
Hersteller: NXP USA Inc.
Description: EVAL BOARD FOR PCA9600
Packaging: Bulk
Function: I2C Bus Buffer
Type: Interface
Utilized IC / Part: PCA9600
Supplied Contents: Board(s)
Embedded: No
Part Status: Obsolete
Contents: Board(s)
Produkt ist nicht verfügbar
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PX1011B-EL1/N,551 PX1011B.pdf
PX1011B-EL1/N,551
Hersteller: NXP USA Inc.
Description: IC INTFACE SPECIALIZED 81LFBGA
Packaging: Tray
Package / Case: 81-LFBGA
Mounting Type: Surface Mount
Interface: JTAG
Voltage - Supply: 1.2V
Applications: PCI Express MAX to PCI Express PHY
Supplier Device Package: 81-LFBGA (9x9)
Produkt ist nicht verfügbar
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SC16C850SVIBS,151 SC16C850SV.pdf
SC16C850SVIBS,151
Hersteller: NXP USA Inc.
Description: IC UART SINGLE W/FIFO 32-HVQFN
Produkt ist nicht verfügbar
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SC18IS600IBS,151 SC18IS600.pdf
SC18IS600IBS,151
Hersteller: NXP USA Inc.
Description: IC SPI TO I2C BUS 24-HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I²C
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SC18IS601IBS,151 SC18IS600.pdf
SC18IS601IBS,151
Hersteller: NXP USA Inc.
Description: IC SPI TO I2C BUS 24-HVQFN
Packaging: Tray
Package / Case: 24-VFQFN Exposed Pad
Function: Controller
Interface: SPI
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.4V ~ 3.6V
Current - Supply: 11mA
Protocol: I2C
Supplier Device Package: 24-HVQFN (4x4)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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PCA9600DP,118 PCA9600.pdf
PCA9600DP,118
Hersteller: NXP USA Inc.
Description: IC REDRIVER I2C 1CH 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Number of Channels: 1
Mounting Type: Surface Mount
Output: 2-Wire Bus
Type: Buffer, ReDriver
Input: 2-Wire Bus
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.5V ~ 15V
Applications: I2C
Current - Supply: 5.2mA
Data Rate (Max): 1MHz
Supplier Device Package: 8-TSSOP
Capacitance - Input: 10 pF
Produkt ist nicht verfügbar
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OM5571/N5122S01,69
Hersteller: NXP USA Inc.
Description: KIT DEMO PN512C1 2 BOARDS
Packaging: Box
For Use With/Related Products: PN512
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Supplied Contents: Board(s)
Part Status: Obsolete
Produkt ist nicht verfügbar
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OM5588/N5331U01,69
OM5588/N5331U01,69
Hersteller: NXP USA Inc.
Description: KIT DEMO PN533/C207
Packaging: Box
Frequency: 13.56MHz
Type: Near Field Communication (NFC)
Contents: Board(s), Cable(s)
Utilized IC / Part: PN533
Produkt ist nicht verfügbar
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PIP213-12M,518 PIP213-12M.pdf
PIP213-12M,518
Hersteller: NXP USA Inc.
Description: IC HALF BRIDGE DRVR 25A 56HVQFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit, 5V Regulated Output
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: PWM
Operating Temperature: -55°C ~ 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 3.3V ~ 16V
Rds On (Typ): 3.8mOhm LS, 6.5mOhm HS
Applications: Synchronous Buck Converters
Current - Output / Channel: 25A
Current - Peak Output: 40A
Technology: DrMOS
Voltage - Load: 24V (Max)
Supplier Device Package: 56-HVQFN (8x8)
Fault Protection: Over Temperature, UVLO
Load Type: Inductive
Part Status: Obsolete
Produkt ist nicht verfügbar
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BFG540/XR,215 BFG540_X_XR_Rev5.pdf
BFG540/XR,215
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ SOT-143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Power - Max: 400mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: SOT-143R
Part Status: Obsolete
Produkt ist nicht verfügbar
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74HCT299PW,112 74HC%28T%29299.pdf
74HCT299PW,112
Hersteller: NXP USA Inc.
Description: IC UNIV SHIFT REGISTER 20TSSOP
Packaging: Tube
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Universal
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74HCT299PW,118 74HC%28T%29299.pdf
74HCT299PW,118
Hersteller: NXP USA Inc.
Description: IC UNIV SHIFT REGISTER 20TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Output Type: Tri-State
Mounting Type: Surface Mount
Number of Elements: 2
Function: Universal
Logic Type: Shift Register
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-TSSOP
Number of Bits per Element: 8
Produkt ist nicht verfügbar
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74LVC543ABQ,118 74LVC543A.pdf
74LVC543ABQ,118
Hersteller: NXP USA Inc.
Description: IC TXRX NON-INVERT 3.6V 24DHVQFN
Produkt ist nicht verfügbar
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BF1105R,215 BF1105_R_WR.pdf
BF1105R,215
Hersteller: NXP USA Inc.
Description: RF MOSFET 5V SOT143R
Packaging: Tape & Reel (TR)
Package / Case: SOT-143R
Current Rating (Amps): 30mA
Mounting Type: Surface Mount
Frequency: 800MHz
Configuration: N-Channel Dual Gate
Gain: 20dB
Technology: MOSFET (Metal Oxide)
Noise Figure: 1.7dB
Supplier Device Package: SOT-143R
Part Status: Obsolete
Voltage - Rated: 7 V
Voltage - Test: 5 V
Produkt ist nicht verfügbar
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BUT11AI,127 BUT11AI_2.pdf
BUT11AI,127
Hersteller: NXP USA Inc.
Description: TRANS NPN 450V 5A TO-220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1.5V @ 330mA, 2.5A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 14 @ 500mA, 5V
Supplier Device Package: TO-220AB
Part Status: Obsolete
Current - Collector (Ic) (Max): 5 A
Voltage - Collector Emitter Breakdown (Max): 450 V
Power - Max: 100 W
Produkt ist nicht verfügbar
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BUT11APX-1200,127 BUT11APX-1200_1.pdf
BUT11APX-1200,127
Hersteller: NXP USA Inc.
Description: TRANS NPN 550V 6A TO-220F
Packaging: Tube
Package / Case: TO-220-3 Full Pack, Isolated Tab
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 400mA, 2A
Current - Collector Cutoff (Max): 1mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 20 @ 500mA, 5V
Supplier Device Package: TO-220F
Part Status: Obsolete
Current - Collector (Ic) (Max): 6 A
Voltage - Collector Emitter Breakdown (Max): 550 V
Power - Max: 32 W
Produkt ist nicht verfügbar
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CBTV4012EE/G,518
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage Supply Source: Single Supply
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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CBTV4012EE,551
Hersteller: NXP USA Inc.
Description: IC MUX/BUS SW 10BIT 64-TFBGA
Produkt ist nicht verfügbar
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CBTV4012EE,518
Hersteller: NXP USA Inc.
Description: IC MULTIPLEXER 64TFBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-TFBGA
Mounting Type: Surface Mount
Type: Multiplexer
Operating Temperature: 0°C ~ 85°C
Voltage Supply Source: Single Supply
Supplier Device Package: 64-TFBGA (7x7)
Produkt ist nicht verfügbar
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GTL2002D/DG,118 GTL2002.pdf
GTL2002D/DG,118
Hersteller: NXP USA Inc.
Description: IC TRANSLATOR BIDIRECTIONAL 8SO
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-SO
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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GTL2002DP/DG,118 GTL2002.pdf
GTL2002DP/DG,118
Hersteller: NXP USA Inc.
Description: IC TRANSLTR BIDIRECTIONAL 8TSSOP
Packaging: Tape & Reel (TR)
Features: Auto-Direction Sensing
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Output Type: Open Drain
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C (TA)
Supplier Device Package: 8-TSSOP
Channel Type: Bidirectional
Translator Type: Voltage Level
Channels per Circuit: 2
Voltage - VCCA: 1 V ~ 5.5 V
Voltage - VCCB: 1 V ~ 5.5 V
Number of Circuits: 1
Produkt ist nicht verfügbar
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GTL2002DP/S440,118 GTL2002.pdf
GTL2002DP/S440,118
Hersteller: NXP USA Inc.
Description: IC TRNSLTR BIDIRECTIONAL 8TSSOP
Produkt ist nicht verfügbar
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