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M5208EVB NXP USA Inc. Description: MCF5207/MCF5208 EVAL BRD
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M5211DEMO M5211DEMO NXP USA Inc. MCF5211.pdf Description: MCF5211 EVAL BRD
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M5213EVB NXP USA Inc. Description: MCF5213 EVAL BRD
Utilized IC / Part: MCF5213
Core Processor: Coldfire V2
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
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M5329EVB NXP USA Inc. Description: ZOOM MCF5329 EVAL BRD
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M5373EVB NXP USA Inc. MCF5373DS.pdf Description: MCF537X EVAL BRD
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MC13201FC MC13201FC NXP USA Inc. MC13201.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Sensitivity: -91dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
RF Family/Standard: 802.15.4, General ISM > 1GHz
Modulation: DSSS, O-QPSK
GPIO: 7
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 4dBm
Voltage - Supply: 2V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Serial Interfaces: SPI
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MC13201FCR2 MC13201FCR2 NXP USA Inc. MC13201.pdf Description: IC RF TXRX 802.15.4 32HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: SPI
RF Family/Standard: 802.15.4, General ISM > 1GHz
Modulation: DSSS, O-QPSK
GPIO: 7
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 4dBm
Voltage - Supply: 2V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -91dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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MC13202FCR2 MC13202FCR2 NXP USA Inc. MC13202.pdf Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
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MC13211 MC13211 NXP USA Inc. MC1321x.pdf Description: IC RF TXRX+MCU 802.15.4 71VFLGA
Part Status: Obsolete
Serial Interfaces: I²C, SPI
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 32
Supplier Device Package: 71-LGA (9x9)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 3dBm
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 16kB Flash, 1kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -92dBm
Package / Case: 71-VFLGA Exposed Pad
Packaging: Tray
Voltage - Supply: 2V ~ 3.4V
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MC13212 MC13212 NXP USA Inc. MC1321x.pdf Description: IC RF TXRX+MCU 802.15.4 71VFLGA
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MC908JL16CPE MC908JL16CPE NXP USA Inc. MC68HC908JL16.pdf Description: IC MCU 8BIT 16KB FLASH 28DIP
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MC908JL16CSPE MC908JL16CSPE NXP USA Inc. MC68HC908JL16.pdf Description: IC MCU 8BIT 16KB FLASH 32SDIP
Number of I/O: 26
Part Status: Obsolete
Supplier Device Package: 32-SDIP
Peripherals: LED, LVD, POR, PWM
Connectivity: I²C, SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 13x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 32-SDIP (0.400", 10.16mm)
Packaging: Tube
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MC908QB8CDTE MC908QB8CDTE NXP USA Inc. MC68HC908QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
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MC908QB8CDWE MC908QB8CDWE NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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MC908QB8CPE MC908QB8CPE NXP USA Inc. MC68HC908QB8.pdf Description: IC MCU 8BIT 8KB FLASH 16DIP
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MC9S08AW16CFDE MC9S08AW16CFDE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 16KB FLASH 48QFN
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
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MC9S08AW16CFGE MC9S08AW16CFGE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 16KB FLASH 44LQFP
Number of I/O: 34
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
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MC9S08AW16CFUE MC9S08AW16CFUE NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MC9S08AW16CPUE MC9S08AW16CPUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 16KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
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MC9S08AW32CFDE MC9S08AW32CFDE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 48QFN
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MC9S08AW32CFGE MC9S08AW32CFGE NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
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MC9S08AW32CFUE MC9S08AW32CFUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
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MC9S08AW32CPUE MC9S08AW32CPUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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800+14.83 EUR
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MC9S08AW48CFDE MC9S08AW48CFDE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 48KB FLASH 48QFN
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Verified
Number of I/O: 38
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
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MC9S08AW48CFUE MC9S08AW48CFUE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 48KB FLASH 64QFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
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MC9S08AW48CFUER MC9S08AW48CFUER NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 48KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08AW60CFDE MC9S08AW60CFDE NXP USA Inc. MC9S08AW60.pdf Description: IC MCU 8BIT 60KB FLASH 48QFN
DigiKey Programmable: Verified
Number of I/O: 38
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
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MC9S08AW60CFGE MC9S08AW60CFGE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
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MC9S08AW60CFUE MC9S08AW60CFUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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MC9S08AW60CFUER MC9S08AW60CFUER NXP USA Inc. MC9S08AC16.pdf Description: IC MCU 8BIT 60KB FLASH 64QFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08AW60CPUE MC9S08AW60CPUE NXP USA Inc. MC9S08AC60.pdf Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
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MC9S12DB128CPVE MC9S12DB128CPVE NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC9S12DG128CFUE MC9S12DG128CFUE NXP USA Inc. MC9S12DP256.pdf description Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12DG128CPVE MC9S12DG128CPVE NXP USA Inc. MC9S12DP256.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
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MC9S12DG256CFUE MC9S12DG256CFUE NXP USA Inc. MC9S12DP256.pdf Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12DG256CPVE MC9S12DG256CPVE NXP USA Inc. MC9S12DP256.pdf Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
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MC9S12DJ128CFUE MC9S12DJ128CFUE NXP USA Inc. 9S12DT128DGV2.pdf Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12DJ128CPVE MC9S12DJ128CPVE NXP USA Inc. HCS12DFAMILYPP.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
DigiKey Programmable: Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12DJ256CFUE NXP USA Inc. Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MC9S12NE64CPVE MC9S12NE64CPVE NXP USA Inc. MC9S12NE64V1.pdf description Description: IC MCU 16BIT 64KB FLASH 112LQFP
Produkt ist nicht verfügbar
 Mindestbestellmenge: 600 Stücke
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MC9S12NE64VTUE MC9S12NE64VTUE NXP USA Inc. MC9S12NE64V1.pdf Description: IC MCU 16BIT 64KB FLASH 80TQFP
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 80-TQFP-EP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.375V ~ 3.465V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-TQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12UF32PUE MC9S12UF32PUE NXP USA Inc. Description: IC MCU 16BIT 32KB FLASH 100LQFP
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 73
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, WDT
Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V
Core Size: 16-Bit
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 30MHz
Produkt ist nicht verfügbar
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MMA6270Q MMA6270Q NXP USA Inc. MMA6270QT.pdf Description: ACCEL 1.5-6G ANALOG 16QFN
Produkt ist nicht verfügbar
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MMA6270QR2 MMA6270QR2 NXP USA Inc. MMA6270QT.pdf Description: ACCEL 1.5-6G ANALOG 16QFN
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MMA6280Q MMA6280Q NXP USA Inc. MMA6280QT.pdf Description: ACCEL 1.5-6G ANALOG 16QFN
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MMA6280QR2 MMA6280QR2 NXP USA Inc. MMA6280QT.pdf Description: ACCEL 1.5-6G ANALOG 16QFN
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MMA7260QR2 MMA7260QR2 NXP USA Inc. MMA7260QT.pdf description Description: ACCEL 1.5-6G ANALOG 16QFN
Part Status: Obsolete
Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g)
Supplier Device Package: 16-QFN (6x6)
Bandwidth: 350Hz (X,Y), 150Hz (Z)
Voltage - Supply: 2.2V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±1.5g, 2g, 4g, 6g
Axis: X, Y, Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-LQFN Exposed Pad
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMA7261QR2 MMA7261QR2 NXP USA Inc. MMA7261QT.pdf Description: ACCEL 2.5-10G ANALOG 16QFN
Produkt ist nicht verfügbar
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BFG540W/X,115 BFG540W/X,115 NXP USA Inc. BFG540W_WX_WXR_Rev_Oct2010.pdf Description: RF TRANS NPN 15V 9GHZ CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA5211D/01,112 SA5211D/01,112 NXP USA Inc. SA5211.pdf Description: IC TRANSIMPEDANCE 1 CIRCUIT 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Amplifier Type: Transimpedance
Operating Temperature: -40°C ~ 85°C
Current - Supply: 26mA
Supplier Device Package: 14-SO
Part Status: Obsolete
Number of Circuits: 1
Current - Output / Channel: 4 mA
-3db Bandwidth: 180 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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SA58631TK,118 SA58631TK,118 NXP USA Inc. SA58631.pdf Description: IC AMP CLASS AB MONO 3W 8HVSON
Supplier Device Package: 8-HVSON (4x4)
Max Output Power x Channels @ Load: 3W x 1 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 8-VDFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SA58632BS,118 SA58632BS,118 NXP USA Inc. SA58632.pdf Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Output Type: 2-Channel (Stereo)
Package / Case: 20-VQFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Supplier Device Package: 20-HVQFN (5x6)
Max Output Power x Channels @ Load: 2.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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P89LPC922FDH,512 P89LPC922FDH,512 NXP USA Inc. P89LPC920%2C921%2C922%2C9221.pdf Description: IC MCU 8BIT 8KB FLASH 20TSSOP
DigiKey Programmable: Verified
Number of I/O: 18
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MPS3904,126 MPS3904,126 NXP USA Inc. MPS3904.pdf Description: TRANS NPN 40V 0.1A TO-92-3
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: TO-92-3
Frequency - Transition: 180MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPS3906,126 MPS3906,126 NXP USA Inc. MPS3906.pdf Description: TRANS PNP 40V 0.1A TO92-3
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: TO-92-3
Frequency - Transition: 150MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Transistor Type: PNP
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC2194HBD64,151 LPC2194HBD64,151 NXP USA Inc. LPC2194.pdf Description: IC MCU 16/32B 256KB FLASH 64LQFP
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 46
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Produkt ist nicht verfügbar
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SA58631TK,118 SA58631TK,118 NXP USA Inc. SA58631.pdf Description: IC AMP CLASS AB MONO 3W 8HVSON
Supplier Device Package: 8-HVSON (4x4)
Max Output Power x Channels @ Load: 3W x 1 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 8-VDFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SA58632BS,118 SA58632BS,118 NXP USA Inc. SA58632.pdf Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 20-VQFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Supplier Device Package: 20-HVQFN (5x6)
Max Output Power x Channels @ Load: 2.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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MPS3904,126 MPS3904,126 NXP USA Inc. MPS3904.pdf Description: TRANS NPN 40V 0.1A TO-92-3
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: TO-92-3
Frequency - Transition: 180MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MPS3906,126 MPS3906,126 NXP USA Inc. MPS3906.pdf Description: TRANS PNP 40V 0.1A TO92-3
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: TO-92-3
Frequency - Transition: 150MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Transistor Type: PNP
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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M5208EVB
Hersteller: NXP USA Inc.
Description: MCF5207/MCF5208 EVAL BRD
Produkt ist nicht verfügbar
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M5211DEMO MCF5211.pdf
M5211DEMO
Hersteller: NXP USA Inc.
Description: MCF5211 EVAL BRD
Produkt ist nicht verfügbar
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M5213EVB
Hersteller: NXP USA Inc.
Description: MCF5213 EVAL BRD
Utilized IC / Part: MCF5213
Core Processor: Coldfire V2
Contents: Board(s), Cable(s)
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Bulk
Produkt ist nicht verfügbar
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M5329EVB
Hersteller: NXP USA Inc.
Description: ZOOM MCF5329 EVAL BRD
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M5373EVB MCF5373DS.pdf
Hersteller: NXP USA Inc.
Description: MCF537X EVAL BRD
Produkt ist nicht verfügbar
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MC13201FC MC13201.pdf
MC13201FC
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Sensitivity: -91dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tray
RF Family/Standard: 802.15.4, General ISM > 1GHz
Modulation: DSSS, O-QPSK
GPIO: 7
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 4dBm
Voltage - Supply: 2V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Serial Interfaces: SPI
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MC13201FCR2 MC13201.pdf
MC13201FCR2
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
DigiKey Programmable: Not Verified
Serial Interfaces: SPI
RF Family/Standard: 802.15.4, General ISM > 1GHz
Modulation: DSSS, O-QPSK
GPIO: 7
Supplier Device Package: 32-HVQFN (5x5)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 4dBm
Voltage - Supply: 2V ~ 3.4V
Operating Temperature: -40°C ~ 85°C
Type: TxRx Only
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -91dBm
Package / Case: 32-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC13202FCR2 MC13202.pdf
MC13202FCR2
Hersteller: NXP USA Inc.
Description: IC RF TXRX 802.15.4 32HVQFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx Only
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 3.4V
Power - Output: 4dBm
Protocol: Zigbee®
Current - Receiving: 37mA
Data Rate (Max): 250kbps
Current - Transmitting: 30mA
Supplier Device Package: 32-HVQFN (5x5)
GPIO: 7
Modulation: DSSS, O-QPSK
RF Family/Standard: 802.15.4, General ISM > 1GHz
Serial Interfaces: SPI
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC13211 MC1321x.pdf
MC13211
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 71VFLGA
Part Status: Obsolete
Serial Interfaces: I²C, SPI
RF Family/Standard: 802.15.4
Modulation: DSSS, O-QPSK
GPIO: 32
Supplier Device Package: 71-LGA (9x9)
Current - Transmitting: 30mA
Data Rate (Max): 250kbps
Current - Receiving: 37mA
Power - Output: 3dBm
Operating Temperature: -40°C ~ 85°C
Type: TxRx + MCU
Memory Size: 16kB Flash, 1kB RAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -92dBm
Package / Case: 71-VFLGA Exposed Pad
Packaging: Tray
Voltage - Supply: 2V ~ 3.4V
auf Bestellung 462 Stücke:
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2+15.93 EUR
10+14.61 EUR
25+13.28 EUR
80+11.96 EUR
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MC13212 MC1321x.pdf
MC13212
Hersteller: NXP USA Inc.
Description: IC RF TXRX+MCU 802.15.4 71VFLGA
Produkt ist nicht verfügbar
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MC908JL16CPE MC68HC908JL16.pdf
MC908JL16CPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 28DIP
Produkt ist nicht verfügbar
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MC908JL16CSPE MC68HC908JL16.pdf
MC908JL16CSPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32SDIP
Number of I/O: 26
Part Status: Obsolete
Supplier Device Package: 32-SDIP
Peripherals: LED, LVD, POR, PWM
Connectivity: I²C, SCI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 13x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 16KB (16K x 8)
Speed: 8MHz
Mounting Type: Through Hole
Package / Case: 32-SDIP (0.400", 10.16mm)
Packaging: Tube
Produkt ist nicht verfügbar
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MC908QB8CDTE MC68HC908QB8.pdf
MC908QB8CDTE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Produkt ist nicht verfügbar
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MC908QB8CDWE MC68HLC908QY4.pdf
MC908QB8CDWE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
DigiKey Programmable: Not Verified
Number of I/O: 13
Supplier Device Package: 16-SOIC
Peripherals: LVD, POR, PWM
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 10x10b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MC908QB8CPE MC68HC908QB8.pdf
MC908QB8CPE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16DIP
Produkt ist nicht verfügbar
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MC9S08AW16CFDE MC9S08AW60.pdf
MC9S08AW16CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 48QFN
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Verified
Number of I/O: 38
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Produkt ist nicht verfügbar
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MC9S08AW16CFGE MC9S08AC60.pdf
MC9S08AW16CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44LQFP
Number of I/O: 34
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
DigiKey Programmable: Not Verified
auf Bestellung 1218 Stücke:
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2+20.81 EUR
10+16.28 EUR
25+15.15 EUR
100+13.91 EUR
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800+12.74 EUR
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MC9S08AW16CFUE MC9S08AC16.pdf
MC9S08AW16CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 158 Stücke:
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2+18.99 EUR
10+14.83 EUR
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MC9S08AW16CPUE MC9S08AC60.pdf
MC9S08AW16CPUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 759 Stücke:
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1+23.26 EUR
10+18.28 EUR
25+17.03 EUR
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MC9S08AW32CFDE MC9S08AC60.pdf
MC9S08AW32CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48QFN
auf Bestellung 375 Stücke:
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1+26.56 EUR
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25+19.54 EUR
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MC9S08AW32CFGE MC9S08AC16.pdf
MC9S08AW32CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44LQFP
DigiKey Programmable: Not Verified
Number of I/O: 34
Part Status: Active
Supplier Device Package: 44-LQFP (10x10)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 44-LQFP
Packaging: Tray
auf Bestellung 180 Stücke:
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2+17.74 EUR
10+13.84 EUR
25+12.86 EUR
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MC9S08AW32CFUE MC9S08AC60.pdf
MC9S08AW32CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08AW32CPUE MC9S08AC60.pdf
MC9S08AW32CPUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
auf Bestellung 2396 Stücke:
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1+23.9 EUR
10+18.8 EUR
25+17.53 EUR
100+16.14 EUR
250+15.46 EUR
800+14.83 EUR
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MC9S08AW48CFDE MC9S08AW60.pdf
MC9S08AW48CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 48QFN
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Verified
Number of I/O: 38
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Produkt ist nicht verfügbar
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MC9S08AW48CFUE MC9S08AW60.pdf
MC9S08AW48CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64QFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 969 Stücke:
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2+12.9 EUR
10+9.9 EUR
25+9.16 EUR
80+8.45 EUR
420+7.77 EUR
840+7.57 EUR
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MC9S08AW48CFUER MC9S08AW60.pdf
MC9S08AW48CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 48KB FLASH 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 48KB (48K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S08AW60CFDE MC9S08AW60.pdf
MC9S08AW60CFDE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 48QFN
DigiKey Programmable: Verified
Number of I/O: 38
Part Status: Active
Supplier Device Package: 48-QFN-EP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I²C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S08AW60CFGE MC9S08AC60.pdf
MC9S08AW60CFGE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 44LQFP
Packaging: Tray
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-LQFP (10x10)
Part Status: Active
Number of I/O: 34
DigiKey Programmable: Not Verified
auf Bestellung 341 Stücke:
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1+27.56 EUR
10+21.79 EUR
25+20.35 EUR
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MC9S08AW60CFUE MC9S08AC60.pdf
MC9S08AW60CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-QFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 546 Stücke:
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AnzahlPrivatkunde
1+29.89 EUR
10+23.68 EUR
25+22.13 EUR
100+20.43 EUR
420+19.24 EUR
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MC9S08AW60CFUER MC9S08AC16.pdf
MC9S08AW60CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Number of I/O: 54
Part Status: Active
Supplier Device Package: 64-QFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 60KB (60K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S08AW60CPUE MC9S08AC60.pdf
MC9S08AW60CPUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: S08
Data Converters: A/D 16x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, SCI, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Verified
auf Bestellung 1663 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+29.89 EUR
10+23.68 EUR
25+22.13 EUR
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800+18.85 EUR
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MC9S12DB128CPVE 9S12DT128DGV2.pdf
MC9S12DB128CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
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MC9S12DG128CFUE description MC9S12DP256.pdf
MC9S12DG128CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 392 Stücke:
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AnzahlPrivatkunde
1+99.13 EUR
10+81.47 EUR
24+77.22 EUR
80+72.85 EUR
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MC9S12DG128CPVE MC9S12DP256.pdf
MC9S12DG128CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
auf Bestellung 286 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+101.96 EUR
10+83.85 EUR
25+79.31 EUR
100+74.35 EUR
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MC9S12DG256CFUE MC9S12DP256.pdf
MC9S12DG256CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Part Status: Active
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 12184 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+121.12 EUR
10+100.11 EUR
24+95.07 EUR
80+89.88 EUR
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MC9S12DG256CPVE MC9S12DP256.pdf
MC9S12DG256CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Active
Number of I/O: 91
DigiKey Programmable: Verified
auf Bestellung 421 Stücke:
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60+93.21 EUR
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MC9S12DJ128CFUE 9S12DT128DGV2.pdf
MC9S12DJ128CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 621 Stücke:
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1+82.87 EUR
10+67.79 EUR
24+64.18 EUR
80+60.45 EUR
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MC9S12DJ128CPVE HCS12DFAMILYPP.pdf
MC9S12DJ128CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
DigiKey Programmable: Verified
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 2K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12DJ256CFUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 59
DigiKey Programmable: Not Verified
auf Bestellung 611 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+108.39 EUR
10+89.36 EUR
24+84.8 EUR
80+80.1 EUR
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MC9S12NE64CPVE description MC9S12NE64V1.pdf
MC9S12NE64CPVE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 112LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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MC9S12NE64VTUE MC9S12NE64V1.pdf
MC9S12NE64VTUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 64KB FLASH 80TQFP
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 80-TQFP-EP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, Ethernet, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.375V ~ 3.465V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-TQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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MC9S12UF32PUE
MC9S12UF32PUE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 32KB FLASH 100LQFP
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 73
Supplier Device Package: 100-LQFP (14x14)
Peripherals: POR, WDT
Connectivity: ATA, Compact Flash, EBI/EMI, Memory Card, SCI, SD, Smart Media, USB
Voltage - Supply (Vcc/Vdd): 2.25V ~ 5.5V
Core Size: 16-Bit
Core Processor: HCS12
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 3.5K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 30MHz
Produkt ist nicht verfügbar
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MMA6270Q MMA6270QT.pdf
MMA6270Q
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
Produkt ist nicht verfügbar
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MMA6270QR2 MMA6270QT.pdf
MMA6270QR2
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
Produkt ist nicht verfügbar
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MMA6280Q MMA6280QT.pdf
MMA6280Q
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
Produkt ist nicht verfügbar
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MMA6280QR2 MMA6280QT.pdf
MMA6280QR2
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
Produkt ist nicht verfügbar
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MMA7260QR2 description MMA7260QT.pdf
MMA7260QR2
Hersteller: NXP USA Inc.
Description: ACCEL 1.5-6G ANALOG 16QFN
Part Status: Obsolete
Sensitivity (mV/g): 800 (±1.5g) ~ 200 (±6g)
Supplier Device Package: 16-QFN (6x6)
Bandwidth: 350Hz (X,Y), 150Hz (Z)
Voltage - Supply: 2.2V ~ 3.6V
Operating Temperature: -40°C ~ 105°C
Acceleration Range: ±1.5g, 2g, 4g, 6g
Axis: X, Y, Z
Type: Analog
Mounting Type: Surface Mount
Output Type: Analog Voltage
Package / Case: 16-LQFN Exposed Pad
Features: Selectable Scale, Sleep Mode
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MMA7261QR2 MMA7261QT.pdf
MMA7261QR2
Hersteller: NXP USA Inc.
Description: ACCEL 2.5-10G ANALOG 16QFN
Produkt ist nicht verfügbar
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BFG540W/X,115 BFG540W_WX_WXR_Rev_Oct2010.pdf
BFG540W/X,115
Hersteller: NXP USA Inc.
Description: RF TRANS NPN 15V 9GHZ CMPAK-4
Packaging: Tape & Reel (TR)
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 175°C (TJ)
Power - Max: 500mW
Current - Collector (Ic) (Max): 120mA
Voltage - Collector Emitter Breakdown (Max): 15V
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 40mA, 8V
Frequency - Transition: 9GHz
Noise Figure (dB Typ @ f): 1.3dB ~ 2.4dB @ 900MHz
Supplier Device Package: CMPAK-4
Part Status: Obsolete
Produkt ist nicht verfügbar
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SA5211D/01,112 SA5211.pdf
SA5211D/01,112
Hersteller: NXP USA Inc.
Description: IC TRANSIMPEDANCE 1 CIRCUIT 14SO
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Output Type: Differential
Mounting Type: Surface Mount
Amplifier Type: Transimpedance
Operating Temperature: -40°C ~ 85°C
Current - Supply: 26mA
Supplier Device Package: 14-SO
Part Status: Obsolete
Number of Circuits: 1
Current - Output / Channel: 4 mA
-3db Bandwidth: 180 MHz
Voltage - Supply Span (Min): 4.5 V
Voltage - Supply Span (Max): 5.5 V
Produkt ist nicht verfügbar
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SA58631TK,118 SA58631.pdf
SA58631TK,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB MONO 3W 8HVSON
Supplier Device Package: 8-HVSON (4x4)
Max Output Power x Channels @ Load: 3W x 1 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 8-VDFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SA58632BS,118 SA58632.pdf
SA58632BS,118
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Output Type: 2-Channel (Stereo)
Package / Case: 20-VQFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Tape & Reel (TR)
Supplier Device Package: 20-HVQFN (5x6)
Max Output Power x Channels @ Load: 2.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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P89LPC922FDH,512 P89LPC920%2C921%2C922%2C9221.pdf
P89LPC922FDH,512
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 20TSSOP
DigiKey Programmable: Verified
Number of I/O: 18
Part Status: Obsolete
Supplier Device Package: 20-TSSOP
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity: I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Core Size: 8-Bit
Core Processor: 8051
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 18MHz
Mounting Type: Surface Mount
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MPS3904,126 MPS3904.pdf
MPS3904,126
Hersteller: NXP USA Inc.
Description: TRANS NPN 40V 0.1A TO-92-3
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: TO-92-3
Frequency - Transition: 180MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MPS3906,126 MPS3906.pdf
MPS3906,126
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 0.1A TO92-3
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: TO-92-3
Frequency - Transition: 150MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Transistor Type: PNP
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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LPC2194HBD64,151 LPC2194.pdf
LPC2194HBD64,151
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLASH 64LQFP
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 16/32-Bit
Data Converters: A/D 4x10b
Core Processor: ARM7®
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 16K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 46
Part Status: Obsolete
Supplier Device Package: 64-LQFP (10x10)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, I²C, Microwire, SPI, SSI, SSP, UART/USART
Produkt ist nicht verfügbar
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SA58631TK,118 SA58631.pdf
SA58631TK,118
Hersteller: NXP USA Inc.
Description: IC AMP CLASS AB MONO 3W 8HVSON
Supplier Device Package: 8-HVSON (4x4)
Max Output Power x Channels @ Load: 3W x 1 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Type: Class AB
Mounting Type: Surface Mount
Output Type: 1-Channel (Mono)
Package / Case: 8-VDFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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SA58632BS,118 SA58632.pdf
SA58632BS,118
Hersteller: NXP USA Inc.
Description: IC AMP CLSS AB STER 2.2W 20HVQFN
Type: Class AB
Mounting Type: Surface Mount
Output Type: 2-Channel (Stereo)
Package / Case: 20-VQFN Exposed Pad
Features: Depop, Mute, Short-Circuit and Thermal Protection, Standby
Packaging: Cut Tape (CT)
Supplier Device Package: 20-HVQFN (5x6)
Max Output Power x Channels @ Load: 2.2W x 2 @ 8Ohm
Voltage - Supply: 2.2V ~ 18V
Operating Temperature: -40°C ~ 85°C (TA)
Produkt ist nicht verfügbar
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MPS3904,126 MPS3904.pdf
MPS3904,126
Hersteller: NXP USA Inc.
Description: TRANS NPN 40V 0.1A TO-92-3
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: TO-92-3
Frequency - Transition: 180MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Transistor Type: NPN
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MPS3906,126 MPS3906.pdf
MPS3906,126
Hersteller: NXP USA Inc.
Description: TRANS PNP 40V 0.1A TO92-3
Power - Max: 500 mW
Voltage - Collector Emitter Breakdown (Max): 40 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: TO-92-3
Frequency - Transition: 150MHz
DC Current Gain (hFE) (Min) @ Ic, Vce: 100 @ 10mA, 1V
Current - Collector Cutoff (Max): 50nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 50mA
Operating Temperature: 150°C (TJ)
Transistor Type: PNP
Mounting Type: Through Hole
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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