Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34270) > Seite 37 nach 572
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MC68HC11E1CFNE2 | NXP USA Inc. |
 Description: IC MCU 8BIT ROMLESS 52PLCCPackaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
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MC68HC11E1CFNE2R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tape & Reel (TR) Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC11E1CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC16Z1CAG25 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 144LQFP |
Produkt ist nicht verfügbar |
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MC68HC16Z1CEH16 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16MHz RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU16 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Part Status: Not For New Designs Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC16Z1CEH25 | NXP USA Inc. |
Description: IC MCU 16BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 25MHz RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU16 Data Converters: A/D 8x10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Part Status: Not For New Designs Number of I/O: 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC705C8ACFNE | NXP USA Inc. |
Description: IC MCU 8BIT 8KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 8KB (8K x 8) RAM Size: 304 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 24 DigiKey Programmable: Verified |
Produkt ist nicht verfügbar |
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MC68HC705C9AVFNE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 16KB (16K x 8) RAM Size: 352 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 24 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711D3CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 4KB (4K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711D3CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 4KB OTP 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 4KB (4K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC11 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 26 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711E9CFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711E9CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711E9MFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HC711E9VFNE2 | NXP USA Inc. |
Description: IC MCU 8BIT 12KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2MHz Program Memory Size: 12KB (12K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 512 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Part Status: Obsolete Number of I/O: 38 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68HSC705J1ACPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 20-DIP Part Status: Obsolete Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC68LC302CAF16CT | NXP USA Inc. |
Description: IC MPU M683XX 16MHZ 100LQFP |
Produkt ist nicht verfügbar |
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MC68LK332ACEH16 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 132PQFP Packaging: Tray Package / Case: 132-BQFP Bumpered Mounting Type: Surface Mount Speed: 16.78MHz RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: CPU32 Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 132-PQFP (24.13x24.13) Number of I/O: 15 DigiKey Programmable: Not Verified |
auf Bestellung 180 Stücke: Lieferzeit 21-28 Tag (e) |
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MC68MH360AI25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Packaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360AI25VL | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 240FQFP Packaging: Tray Package / Case: 240-BFQFP Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 3.3V Supplier Device Package: 240-FQFP (32x32) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360CVR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360VR25L | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360VR25LR2 | NXP USA Inc. |
Description: IC MPU M683XX 25MHZ 357BGA Packaging: Tape & Reel (TR) Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 25MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360VR33L | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68MH360VR33LR2 | NXP USA Inc. |
Description: IC MPU M683XX 33MHZ 357BGA Packaging: Tape & Reel (TR) Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 33MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: CPU32+ Voltage - I/O: 5.0V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68SEC000AA10R2 | NXP USA Inc. |
Description: IC MPU M680X0 10MHZ 64QFP |
Produkt ist nicht verfügbar |
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MC68SEC000AA20B1 | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 64QFP |
Produkt ist nicht verfügbar |
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MC68SEC000AE10 | NXP USA Inc. |
Description: IC MPU M680X0 10MHZ 64LQFP Packaging: Tray Package / Case: 64-LQFP Mounting Type: Surface Mount Speed: 10MHz Operating Temperature: 0°C ~ 70°C (TA) Core Processor: EC000 Voltage - I/O: 3.3V, 5.0V Supplier Device Package: 64-LQFP (10x10) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No |
Produkt ist nicht verfügbar |
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MC68SEC000CAA16 | NXP USA Inc. |
Description: IC MPU M680X0 16MHZ 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 16MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: EC000 Voltage - I/O: 3.3V, 5.0V Supplier Device Package: 64-QFP (14x14) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MC68SEC000CAA20 | NXP USA Inc. |
Description: IC MPU M680X0 20MHZ 64QFP |
Produkt ist nicht verfügbar |
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MC705J1ACDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 20-SOIC Part Status: Obsolete Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC705JP7CPE | NXP USA Inc. |
Description: IC MCU 8BIT 6KB OTP 28DIP |
Produkt ist nicht verfügbar |
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MC705P6ACDWE | NXP USA Inc. |
Description: IC MCU 8BIT 4.5KB OTP 28SOIC Packaging: Tube Package / Case: 28-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 4.5KB (4.5K x 8) RAM Size: 176 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SIO Peripherals: POR, WDT Supplier Device Package: 28-SOIC Part Status: Not For New Designs Number of I/O: 21 DigiKey Programmable: Verified |
auf Bestellung 162 Stücke: Lieferzeit 21-28 Tag (e) |
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MC711K4CFUE3 | NXP USA Inc. |
Description: IC MCU 8BIT 24KB OTP 80QFP |
Produkt ist nicht verfügbar |
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MC908AZ60AMFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8.4MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908AZ60AVFUER | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 64QFP Packaging: Tape & Reel (TR) Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8.4MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: HC08 Data Converters: A/D 15x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Obsolete Number of I/O: 52 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908GR16AMFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
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MC908GR16AVFJE | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
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MC908GR32AMFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP Packaging: Tray Package / Case: 64-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1.5K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 24x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 64-QFP (14x14) Part Status: Not For New Designs Number of I/O: 53 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC908GZ32MFAE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 48LQFP |
Produkt ist nicht verfügbar |
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MC908GZ32MFJE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 32LQFP |
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MC908GZ32VFUE | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 64QFP |
Produkt ist nicht verfügbar |
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MC908GZ60VFJE | NXP USA Inc. |
Description: IC MCU 8BIT 60KB FLASH 32LQFP |
Produkt ist nicht verfügbar |
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MC908JK1MDWE | NXP USA Inc. | Description: IC MCU 8BIT 1.5KB FLASH 20SOIC |
Produkt ist nicht verfügbar |
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MC908JK3CDWE | NXP USA Inc. | Description: IC MCU 8BIT 4KB FLASH 20SOIC |
Produkt ist nicht verfügbar |
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MC908JL3CPE | NXP USA Inc. | Description: IC MCU 8BIT 4KB FLASH 28DIP |
Produkt ist nicht verfügbar |
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MC908KX8CDWER2 | NXP USA Inc. |
Description: IC MCU 8BIT 8KB FLASH 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 8KB (8K x 8) RAM Size: 192 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 4x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI Peripherals: LVD, POR, PWM Supplier Device Package: 16-SOIC Number of I/O: 13 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC912D60ACFUE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 80QFP Packaging: Tray Package / Case: 80-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 8x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 80-QFP (14x14) Number of I/O: 48 DigiKey Programmable: Not Verified |
auf Bestellung 1997 Stücke: Lieferzeit 21-28 Tag (e) |
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MC912D60ACPVE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC912D60AMPVE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC912D60AVPVE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MC912D60CCPVE | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 68 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCF5272VM66R2 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB ROM 196MAPBGA |
Produkt ist nicht verfügbar |
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MCHC11F1CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
Produkt ist nicht verfügbar |
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MCHC11F1CFNE4 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
Produkt ist nicht verfügbar |
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MCHC11F1CFNE4R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
Produkt ist nicht verfügbar |
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MCHC705B16NCFNE | NXP USA Inc. |
Description: IC MCU 8BIT 15KB OTP 52PLCC |
Produkt ist nicht verfügbar |
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MCHC705KJ1CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-SOIC Part Status: Obsolete Number of I/O: 10 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCHC705KJ1CPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-PDIP Part Status: Obsolete Number of I/O: 10 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCHC711KS2MFNE4 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB OTP 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 68-PLCC (24.21x24.21) Part Status: Obsolete Number of I/O: 51 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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MCR908JK1CDWE | NXP USA Inc. | Description: IC MCU 8BIT 1.5KB FLASH 20SOIC |
Produkt ist nicht verfügbar |
| MC68HC11E1CFNE2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11E1CFNE2R |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tape & Reel (TR)
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC11E1CFNE3 |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT ROMLESS 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC16Z1CAG25 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 144LQFP
Description: IC MCU 16BIT ROMLESS 144LQFP
Produkt ist nicht verfügbar
| MC68HC16Z1CEH16 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Not For New Designs
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Not For New Designs
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC16Z1CEH25 |
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Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Not For New Designs
Number of I/O: 16
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 25MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Part Status: Not For New Designs
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC705C8ACFNE |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Verified
Description: IC MCU 8BIT 8KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 304 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Verified
Produkt ist nicht verfügbar
| MC68HC705C9AVFNE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711D3CFNE2 |
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Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711D3CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 4KB OTP 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC11
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711E9CFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711E9CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711E9MFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HC711E9VFNE2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 12KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 512 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Part Status: Obsolete
Number of I/O: 38
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68HSC705J1ACPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-DIP
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC68LC302CAF16CT |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 16MHZ 100LQFP
Description: IC MPU M683XX 16MHZ 100LQFP
Produkt ist nicht verfügbar
| MC68LK332ACEH16 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16.78MHz
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU32
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 15
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 147.89 EUR |
| 10+ | 119.98 EUR |
| 180+ | 104.18 EUR |
| MC68MH360AI25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360AI25VL |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 240FQFP
Packaging: Tray
Package / Case: 240-BFQFP
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 3.3V
Supplier Device Package: 240-FQFP (32x32)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360CVR25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360VR25L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360VR25LR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 25MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 25MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360VR33L |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68MH360VR33LR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M683XX 33MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 33MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: CPU32+
Voltage - I/O: 5.0V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68SEC000AA10R2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 10MHZ 64QFP
Description: IC MPU M680X0 10MHZ 64QFP
Produkt ist nicht verfügbar
| MC68SEC000AA20B1 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Description: IC MPU M680X0 20MHZ 64QFP
Produkt ist nicht verfügbar
| MC68SEC000AE10 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 10MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 10MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Description: IC MPU M680X0 10MHZ 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 10MHz
Operating Temperature: 0°C ~ 70°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-LQFP (10x10)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Produkt ist nicht verfügbar
| MC68SEC000CAA16 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU M680X0 16MHZ 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 16MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: EC000
Voltage - I/O: 3.3V, 5.0V
Supplier Device Package: 64-QFP (14x14)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
| MC68SEC000CAA20 |
|
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 20MHZ 64QFP
Description: IC MPU M680X0 20MHZ 64QFP
Produkt ist nicht verfügbar
| MC705J1ACDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 20-SOIC
Part Status: Obsolete
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC705JP7CPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 6KB OTP 28DIP
Description: IC MCU 8BIT 6KB OTP 28DIP
Produkt ist nicht verfügbar
| MC705P6ACDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
Description: IC MCU 8BIT 4.5KB OTP 28SOIC
Packaging: Tube
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 4.5KB (4.5K x 8)
RAM Size: 176 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SIO
Peripherals: POR, WDT
Supplier Device Package: 28-SOIC
Part Status: Not For New Designs
Number of I/O: 21
DigiKey Programmable: Verified
auf Bestellung 162 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 30.68 EUR |
| 10+ | 24.11 EUR |
| 104+ | 19.96 EUR |
| MC711K4CFUE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 24KB OTP 80QFP
Description: IC MCU 8BIT 24KB OTP 80QFP
Produkt ist nicht verfügbar
| MC908AZ60AMFUER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908AZ60AVFUER |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 60KB FLASH 64QFP
Packaging: Tape & Reel (TR)
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8.4MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: HC08
Data Converters: A/D 15x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Obsolete
Number of I/O: 52
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908GR16AMFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC908GR16AVFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC908GR32AMFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 53
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 64QFP
Packaging: Tray
Package / Case: 64-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.5K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 24x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 64-QFP (14x14)
Part Status: Not For New Designs
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC908GZ32MFAE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Description: IC MCU 8BIT 32KB FLASH 48LQFP
Produkt ist nicht verfügbar
| MC908GZ32MFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Description: IC MCU 8BIT 32KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC908GZ32VFUE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 64QFP
Description: IC MCU 8BIT 32KB FLASH 64QFP
Produkt ist nicht verfügbar
| MC908GZ60VFJE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Description: IC MCU 8BIT 60KB FLASH 32LQFP
Produkt ist nicht verfügbar
| MC908JK1MDWE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Produkt ist nicht verfügbar
| MC908JK3CDWE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Produkt ist nicht verfügbar
| MC908JL3CPE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28DIP
Description: IC MCU 8BIT 4KB FLASH 28DIP
Produkt ist nicht verfügbar
| MC908KX8CDWER2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 192 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC912D60ACFUE8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 80QFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-QFP (14x14)
Number of I/O: 48
DigiKey Programmable: Not Verified
auf Bestellung 1997 Stücke:
Lieferzeit 21-28 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 103.58 EUR |
| 10+ | 84.03 EUR |
| 80+ | 72.96 EUR |
| MC912D60ACPVE8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC912D60AMPVE8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC912D60AVPVE8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MC912D60CCPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCF5272VM66R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Produkt ist nicht verfügbar
| MCHC11F1CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
| MCHC11F1CFNE4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
| MCHC11F1CFNE4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
Produkt ist nicht verfügbar
| MCHC705B16NCFNE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
Description: IC MCU 8BIT 15KB OTP 52PLCC
Produkt ist nicht verfügbar
| MCHC705KJ1CDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCHC705KJ1CPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCHC711KS2MFNE4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
Number of I/O: 51
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| MCR908JK1CDWE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Produkt ist nicht verfügbar