Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (35746) > Seite 37 nach 596
| Foto | Bezeichnung | Hersteller | Beschreibung |
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MC912D60AMPVE8 | NXP USA Inc. |
 Description: IC MCU 16BIT 60KB FLASH 112LQFPPackaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 68 DigiKey Programmable: Not Verified |
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MC912D60AVPVE8 | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Part Status: Not For New Designs Number of I/O: 68 DigiKey Programmable: Not Verified |
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MC912D60CCPVE | NXP USA Inc. |
Description: IC MCU 16BIT 60KB FLASH 112LQFP Packaging: Tray Package / Case: 112-LQFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 60KB (60K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 1K x 8 Core Processor: CPU12 Data Converters: A/D 16x8/10b Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: CANbus, MI Bus, SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 112-LQFP (20x20) Number of I/O: 68 DigiKey Programmable: Not Verified |
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MCF5272VM66R2 | NXP USA Inc. |
Description: IC MCU 32BIT 16KB ROM 196MAPBGA |
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MCHC11F1CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
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MCHC11F1CFNE4 | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
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MCHC11F1CFNE4R | NXP USA Inc. |
Description: IC MCU 8BIT ROMLESS 68PLCC |
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MCHC705B16NCFNE | NXP USA Inc. |
Description: IC MCU 8BIT 15KB OTP 52PLCC Packaging: Tube Package / Case: 52-LCC (J-Lead) Mounting Type: Surface Mount Speed: 2.1MHz Program Memory Size: 15KB (15K x 8) RAM Size: 352 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 256 x 8 Core Processor: HC05 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI Peripherals: POR, WDT Supplier Device Package: 52-PLCC (19.1x19.1) Number of I/O: 32 DigiKey Programmable: Not Verified |
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MCHC705KJ1CDWE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16SOIC Packaging: Tube Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-SOIC Part Status: Obsolete Number of I/O: 10 DigiKey Programmable: Not Verified |
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MCHC705KJ1CPE | NXP USA Inc. |
Description: IC MCU 8BIT 1.2KB OTP 16DIP Packaging: Tube Package / Case: 16-DIP (0.300", 7.62mm) Mounting Type: Through Hole Speed: 4MHz Program Memory Size: 1.2KB (1.2K x 8) RAM Size: 64 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP Core Processor: HC05 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Peripherals: POR, WDT Supplier Device Package: 16-PDIP Part Status: Obsolete Number of I/O: 10 DigiKey Programmable: Not Verified |
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MCHC711KS2CFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB OTP 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 68-PLCC (24.21x24.21) Number of I/O: 51 DigiKey Programmable: Not Verified |
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MCHC711KS2CFNE4 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB OTP 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 68-PLCC (24.21x24.21) Number of I/O: 51 DigiKey Programmable: Not Verified |
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MCHC711KS2MFNE4 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB OTP 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Speed: 4MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 68-PLCC (24.21x24.21) Part Status: Obsolete Number of I/O: 51 DigiKey Programmable: Not Verified |
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MCHC711KS2VFNE3 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB OTP 68PLCC Packaging: Tube Package / Case: 68-LCC (J-Lead) Mounting Type: Surface Mount Speed: 3MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: OTP EEPROM Size: 640 x 8 Core Processor: HC11 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SCI, SPI Peripherals: POR, PWM, WDT Supplier Device Package: 68-PLCC (24.21x24.21) Number of I/O: 51 DigiKey Programmable: Not Verified |
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MCR908JK1CDWE | NXP USA Inc. | Description: IC MCU 8BIT 1.5KB FLASH 20SOIC |
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MCR908JK3CDWE | NXP USA Inc. | Description: IC MCU 8BIT 4KB FLASH 20SOIC |
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MCR908JK3MDWE | NXP USA Inc. | Description: IC MCU 8BIT 4KB FLASH 20SOIC |
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MCR908JL3ECPE | NXP USA Inc. |
Description: IC MCU 8BIT 4KB FLASH 28DIP |
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MPC565MVR56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz Program Memory Size: 1MB (1M x 8) RAM Size: 36K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: PowerPC Data Converters: A/D 40x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Part Status: Obsolete Number of I/O: 56 DigiKey Programmable: Not Verified |
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MPC855TVR50D4R2 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tape & Reel (TR) Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (1), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
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MPC860PVR66D4R2 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
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MPC860SRVR66D4R2 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA |
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SCF5250CAG120 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 120MHz RAM Size: 128K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: Coldfire V2 Data Converters: A/D 6x12b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V Connectivity: EBI/EMI, I²C, IDE, Memory Card, SPI, UART/USART Peripherals: DMA, I²S, POR, Serial Audio, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete Number of I/O: 57 DigiKey Programmable: Not Verified |
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SPAKXC309VL100A | NXP USA Inc. |
Description: IC DSP 24BIT 100MHZ 196-MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 196-LBGA (15x15) |
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XC56309VL100A | NXP USA Inc. |
Description: IC DSP 24BIT 100MHZ 196-MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 196-LBGA (15x15) |
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XC56309VL100AR2 | NXP USA Inc. |
Description: IC DSP 24BIT 100MHZ 196-MAPBGA Packaging: Tape & Reel (TR) Package / Case: 196-LBGA Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 196-LBGA (15x15) |
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XPC823CVR66B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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XPC823VR66B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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XPC823VR75B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 75MHZ 256BGA |
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XPC823VR81B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 81MHZ 256BGA |
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XPC8260CVVHFBC | NXP USA Inc. |
Description: IC MPU MPC82XX 166MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 166MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete |
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XPC8260CVVIHBC | NXP USA Inc. |
Description: IC MPU MPC82XX 200MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2 Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
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XPC8260VVIHBC | NXP USA Inc. |
Description: IC MPU MPC82XX 200MHZ 480TBGA |
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XPC850CVR66BU | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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XPC850DECVR50BU | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10Mbps (1) USB: USB 1.x (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
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XPC850DECVR66BU | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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XPC850DEVR66BU | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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XPC850DEVR66BUR2 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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XPC850SRCVR66BU | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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XPC850SRVR66BU | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
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XPC850SRVR80BU | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 256BGA |
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JN5121-000-M00T | NXP USA Inc. |
Description: RF TXRX MOD 802.15.4 TRACE ANT |
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MC33879EK | NXP USA Inc. |
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC |
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P89V51RB2FA,529 | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89V51RC2FA,512 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89V51RC2FBC,557 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44TQFP Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 44-TQFP (10x10) Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89V51RC2FN,112 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 40-DIP Part Status: Obsolete Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89V51RD2FN,112 | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 40DIP Packaging: Tube Package / Case: 40-DIP (0.600", 15.24mm) Mounting Type: Through Hole Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Supplier Device Package: 40-DIP Number of I/O: 32 DigiKey Programmable: Not Verified |
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P89V660FA,512 | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 36 DigiKey Programmable: Not Verified |
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P89V660FBC,557 | NXP USA Inc. |
Description: IC MCU 8BIT 16KB FLASH 44TQFP Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 16KB (16K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-TQFP (10x10) Part Status: Obsolete Number of I/O: 36 DigiKey Programmable: Not Verified |
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P89V662FA,512 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Number of I/O: 36 DigiKey Programmable: Not Verified |
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P89V662FBC,557 | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44TQFP Packaging: Tray Package / Case: 44-TQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I2C, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-TQFP (10x10) Part Status: Obsolete Number of I/O: 36 DigiKey Programmable: Not Verified |
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P89V664FA,512 | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 2K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: 8051 Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Connectivity: I²C, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 44-PLCC (16.59x16.59) Part Status: Obsolete Number of I/O: 36 |
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P89V664FBC,557 | NXP USA Inc. |
Description: IC MCU 8BIT 64KB FLASH 44TQFP |
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TEA1522T/N2,518 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 14SO Packaging: Tape & Reel (TR) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Operating Temperature: -40°C ~ 145°C (TJ) Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V Supplier Device Package: 14-SO Fault Protection: Current Limiting, Over Temperature, Short Circuit Voltage - Start Up: 9.5 V Control Features: Frequency Control Part Status: Active Power (Watts): 30 W |
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TEA1520P/N2,112 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -40°C ~ 145°C (TJ) Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V Supplier Device Package: 8-DIP Fault Protection: Current Limiting, Over Temperature, Short Circuit Voltage - Start Up: 9.5 V Control Features: Frequency Control Power (Watts): 30 W |
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TEA1521P/N2,112 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -40°C ~ 145°C (TJ) Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V Supplier Device Package: 8-DIP Fault Protection: Current Limiting, Over Temperature, Short Circuit Voltage - Start Up: 9.5 V Control Features: Frequency Control Part Status: Obsolete Power (Watts): 30 W |
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TEA1620P/N1,112 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -20°C ~ 85°C (TA) Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V Supplier Device Package: 8-DIP Fault Protection: Current Limiting, Over Temperature, Short Circuit Voltage - Start Up: 9.5 V Control Features: Frequency Control |
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TEA1622P/N1,112 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -20°C ~ 85°C (TA) Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V Supplier Device Package: 8-DIP Fault Protection: Current Limiting, Over Temperature, Short Circuit Voltage - Start Up: 9.5 V Control Features: Frequency Control |
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TEA1623P/N1,112 | NXP USA Inc. |
Description: IC OFFLINE SWITCH FLYBACK 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -20°C ~ 85°C (TA) Duty Cycle: 75% Frequency - Switching: 10kHz ~ 200kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V Supplier Device Package: 8-DIP Fault Protection: Current Limiting, Over Temperature, Short Circuit Voltage - Start Up: 9.5 V Control Features: Frequency Control |
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| MC912D60AMPVE8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
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| MC912D60AVPVE8 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 68
DigiKey Programmable: Not Verified
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| MC912D60CCPVE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 60KB FLASH 112LQFP
Packaging: Tray
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 60KB (60K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 1K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, MI Bus, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 68
DigiKey Programmable: Not Verified
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| MCF5272VM66R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
Description: IC MCU 32BIT 16KB ROM 196MAPBGA
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| MCHC11F1CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
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| MCHC11F1CFNE4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
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| MCHC11F1CFNE4R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 68PLCC
Description: IC MCU 8BIT ROMLESS 68PLCC
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| MCHC705B16NCFNE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 15KB OTP 52PLCC
Packaging: Tube
Package / Case: 52-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 2.1MHz
Program Memory Size: 15KB (15K x 8)
RAM Size: 352 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 256 x 8
Core Processor: HC05
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI
Peripherals: POR, WDT
Supplier Device Package: 52-PLCC (19.1x19.1)
Number of I/O: 32
DigiKey Programmable: Not Verified
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| MCHC705KJ1CDWE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MCHC705KJ1CPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 1.2KB OTP 16DIP
Packaging: Tube
Package / Case: 16-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Speed: 4MHz
Program Memory Size: 1.2KB (1.2K x 8)
RAM Size: 64 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
Core Processor: HC05
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Peripherals: POR, WDT
Supplier Device Package: 16-PDIP
Part Status: Obsolete
Number of I/O: 10
DigiKey Programmable: Not Verified
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| MCHC711KS2CFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 51
DigiKey Programmable: Not Verified
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| MCHC711KS2CFNE4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 51
DigiKey Programmable: Not Verified
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| MCHC711KS2MFNE4 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 4MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Part Status: Obsolete
Number of I/O: 51
DigiKey Programmable: Not Verified
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| MCHC711KS2VFNE3 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 51
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB OTP 68PLCC
Packaging: Tube
Package / Case: 68-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 3MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: OTP
EEPROM Size: 640 x 8
Core Processor: HC11
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 68-PLCC (24.21x24.21)
Number of I/O: 51
DigiKey Programmable: Not Verified
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| MCR908JK1CDWE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
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| MCR908JK3CDWE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Description: IC MCU 8BIT 4KB FLASH 20SOIC
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| MCR908JK3MDWE |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 20SOIC
Description: IC MCU 8BIT 4KB FLASH 20SOIC
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| MCR908JL3ECPE |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 28DIP
Description: IC MCU 8BIT 4KB FLASH 28DIP
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| MPC565MVR56R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 36K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: PowerPC
Data Converters: A/D 40x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Part Status: Obsolete
Number of I/O: 56
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MPC855TVR50D4R2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tape & Reel (TR)
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (1), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
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| MPC860PVR66D4R2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
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| MPC860SRVR66D4R2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
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| SCF5250CAG120 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: EBI/EMI, I²C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I²S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 57
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 120MHz
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: Coldfire V2
Data Converters: A/D 6x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.08V ~ 1.32V
Connectivity: EBI/EMI, I²C, IDE, Memory Card, SPI, UART/USART
Peripherals: DMA, I²S, POR, Serial Audio, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 57
DigiKey Programmable: Not Verified
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| SPAKXC309VL100A |
|
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
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| XC56309VL100A |
|
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
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| XC56309VL100AR2 |
|
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tape & Reel (TR)
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
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| XPC823CVR66B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
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| XPC823VR66B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
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| XPC823VR75B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 75MHZ 256BGA
Description: IC MPU MPC8XX 75MHZ 256BGA
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| XPC823VR81B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 81MHZ 256BGA
Description: IC MPU MPC8XX 81MHZ 256BGA
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| XPC8260CVVHFBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC82XX 166MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
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| XPC8260CVVIHBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 200MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| XPC8260VVIHBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ 480TBGA
Description: IC MPU MPC82XX 200MHZ 480TBGA
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| XPC850CVR66BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
Produkt ist nicht verfügbar
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| XPC850DECVR50BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10Mbps (1)
USB: USB 1.x (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
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| XPC850DECVR66BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
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| XPC850DEVR66BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
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| XPC850DEVR66BUR2 |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
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| XPC850SRCVR66BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
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| XPC850SRVR66BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
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| XPC850SRVR80BU |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Description: IC MPU MPC8XX 80MHZ 256BGA
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| JN5121-000-M00T |
|
Hersteller: NXP USA Inc.
Description: RF TXRX MOD 802.15.4 TRACE ANT
Description: RF TXRX MOD 802.15.4 TRACE ANT
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| MC33879EK |
|
Hersteller: NXP USA Inc.
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
Description: IC PWR SWITCH N-CHAN 1:4 32SOIC
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| P89V51RB2FA,529 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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| P89V51RC2FA,512 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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| P89V51RC2FBC,557 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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| P89V51RC2FN,112 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Part Status: Obsolete
Number of I/O: 32
DigiKey Programmable: Not Verified
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| P89V51RD2FN,112 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 64KB FLASH 40DIP
Packaging: Tube
Package / Case: 40-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SPI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: 40-DIP
Number of I/O: 32
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| P89V660FA,512 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
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| P89V660FBC,557 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
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| P89V662FA,512 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Number of I/O: 36
DigiKey Programmable: Not Verified
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| P89V662FBC,557 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44TQFP
Packaging: Tray
Package / Case: 44-TQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| P89V664FA,512 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 36
Description: IC MCU 8BIT 64KB FLASH 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: 8051
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: I²C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 44-PLCC (16.59x16.59)
Part Status: Obsolete
Number of I/O: 36
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Stück im Wert von UAH
| P89V664FBC,557 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 64KB FLASH 44TQFP
Description: IC MCU 8BIT 64KB FLASH 44TQFP
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TEA1522T/N2,518 |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
Description: IC OFFLINE SWITCH FLYBACK 14SO
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 14-SO
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Active
Power (Watts): 30 W
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| TEA1520P/N2,112 |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Power (Watts): 30 W
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Stück im Wert von UAH
| TEA1521P/N2,112 |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 145°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Part Status: Obsolete
Power (Watts): 30 W
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TEA1620P/N1,112 |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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Stück im Wert von UAH
| TEA1622P/N1,112 |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
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Stück im Wert von UAH
| TEA1623P/N1,112 |
|
Hersteller: NXP USA Inc.
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -20°C ~ 85°C (TA)
Duty Cycle: 75%
Frequency - Switching: 10kHz ~ 200kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 7.5V ~ 40V
Supplier Device Package: 8-DIP
Fault Protection: Current Limiting, Over Temperature, Short Circuit
Voltage - Start Up: 9.5 V
Control Features: Frequency Control
Produkt ist nicht verfügbar
Im Einkaufswagen
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