Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (34275) > Seite 35 nach 572
Foto | Bezeichnung | Hersteller | Beschreibung |
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MPC860ENCVR66D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: -40°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860ENVR50D4 | NXP USA Inc. | Description: IC MPU MPC8XX 50MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC860PCVR50D4 | NXP USA Inc. | Description: IC MPU MPC8XX 50MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC860PVR50D4 | NXP USA Inc. |
Description: IC MPU MPC8XX 50MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 50MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC860SRCVR50D4 | NXP USA Inc. | Description: IC MPU MPC8XX 50MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC860TCVR66D4 | NXP USA Inc. | Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC862PVR100B | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC862TCVR66B | NXP USA Inc. | Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC862TVR100B | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC862TVR66B | NXP USA Inc. | Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC866PCVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC866PVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC866PVR133A | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC866TCVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC866TVR100A | NXP USA Inc. |
Description: IC MPU MPC8XX 100MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 100MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC866TVR133A | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (4), 10/100Mbps (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC870VR133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART Part Status: Obsolete |
auf Bestellung 1 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC870VR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC870VR80 | NXP USA Inc. |
Description: IC MPU MPC8XX 80MHZ 256BGA Packaging: Tray Package / Case: 256-BBGA Mounting Type: Surface Mount Speed: 80MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 256-PBGA (23x23) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MPC875VR80 | NXP USA Inc. | Description: IC MPU MPC8XX 80MHZ 256BGA |
auf Bestellung 70 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC880CVR133 | NXP USA Inc. | Description: IC MPU MPC8XX 133MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC880VR133 | NXP USA Inc. | Description: IC MPU MPC8XX 133MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC880VR66 | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 66MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (2), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC880VR80 | NXP USA Inc. | Description: IC MPU MPC8XX 80MHZ 357BGA |
auf Bestellung 3300 Stücke: Lieferzeit 21-28 Tag (e) |
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MPC885CVR133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: -40°C ~ 100°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MPC885CVR66 | NXP USA Inc. | Description: IC MPU MPC8XX 66MHZ 357BGA |
Produkt ist nicht verfügbar |
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MPC885VR133 | NXP USA Inc. |
Description: IC MPU MPC8XX 133MHZ 357BGA Packaging: Tray Package / Case: 357-BBGA Mounting Type: Surface Mount Speed: 133MHz Operating Temperature: 0°C ~ 95°C (TA) Core Processor: MPC8xx Voltage - I/O: 3.3V Supplier Device Package: 357-PBGA (25x25) Ethernet: 10Mbps (3), 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM, Security; SEC RAM Controllers: DRAM Graphics Acceleration: No Security Features: Cryptography Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART |
Produkt ist nicht verfügbar |
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MRF5S19060NBR1 | NXP USA Inc. | Description: FET RF 65V 1.99GHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MRF5S19060NR1 | NXP USA Inc. | Description: FET RF 65V 1.99GHZ TO-270-4 |
Produkt ist nicht verfügbar |
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MRF5S9100NBR1 | NXP USA Inc. | Description: FET RF 68V 880MHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MRF5S9101NBR1 | NXP USA Inc. | Description: FET RF 68V 960MHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MSC8101VT1375F | NXP USA Inc. | Description: IC DSP 16BIT 250MHZ 332FCBGA |
Produkt ist nicht verfügbar |
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MSC8103VT1100F | NXP USA Inc. |
Description: IC DSP 16BIT 275MHZ 332FCBGA Packaging: Tray Package / Case: 332-BFBGA, FCBGA Mounting Type: Surface Mount Interface: Communications Processor Module (CPM) Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 512KB Voltage - I/O: 3.30V Voltage - Core: 1.60V Clock Rate: 275MHz Supplier Device Package: 332-FCBGA (17x17) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MSC8122TVT6400V | NXP USA Inc. |
Description: IC DSP QUAD 16B 400MHZ 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: DSI, Ethernet, RS-232 Type: SC140 Core Operating Temperature: -40°C ~ 105°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.10V Clock Rate: 400MHz Supplier Device Package: 431-FCPBGA (20x20) |
Produkt ist nicht verfügbar |
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MSC8126VT8000 | NXP USA Inc. |
Description: IC DSP QUAD 16B 500MHZ 431FCBGA Packaging: Tray Package / Case: 431-BFBGA, FCBGA Mounting Type: Surface Mount Interface: DSI, Ethernet, RS-232 Type: SC140 Core Operating Temperature: 0°C ~ 90°C (TJ) Non-Volatile Memory: External On-Chip RAM: 1.436MB Voltage - I/O: 3.30V Voltage - Core: 1.20V Clock Rate: 500MHz Supplier Device Package: 431-FCPBGA (20x20) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MW4IC2230GNBR1 | NXP USA Inc. |
Description: IC AMP CELL 1.6-2.4GHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Gull Wing Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 2.4GHz RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Gain: 31dB Current - Supply: 60mA Supplier Device Package: TO-272 WB-16 GULL |
Produkt ist nicht verfügbar |
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MWIC930GNR1 | NXP USA Inc. | Description: IC RF AMP CEL 900MHZ TO272 WB-16 |
Produkt ist nicht verfügbar |
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MWIC930NR1 | NXP USA Inc. |
Description: IC AMP CELLULAR 900MHZ TO272WB Packaging: Tape & Reel (TR) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 900MHz RF Type: Cellular, GSM, EDGE, N-CDMA Voltage - Supply: 26V Gain: 30dB Current - Supply: 90mA Supplier Device Package: TO-272 WB-16 Part Status: Obsolete |
Produkt ist nicht verfügbar |
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MW4IC2230GNBR1 | NXP USA Inc. |
Description: IC AMP CELL 1.6-2.4GHZ TO272WB Packaging: Cut Tape (CT) Package / Case: TO-272-16 Variant, Gull Wing Mounting Type: Chassis Mount Frequency: 1.6GHz ~ 2.4GHz RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA Voltage - Supply: 26V Gain: 31dB Current - Supply: 60mA Supplier Device Package: TO-272 WB-16 GULL |
Produkt ist nicht verfügbar |
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MWIC930GNR1 | NXP USA Inc. | Description: IC RF AMP CEL 900MHZ TO272 WB-16 |
Produkt ist nicht verfügbar |
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MWIC930NR1 | NXP USA Inc. |
Description: IC AMP CELLULAR 900MHZ TO272WB Packaging: Cut Tape (CT) Package / Case: TO-272-16 Variant, Flat Leads Mounting Type: Chassis Mount Frequency: 900MHz RF Type: Cellular, GSM, EDGE, N-CDMA Voltage - Supply: 26V Gain: 30dB Current - Supply: 90mA Supplier Device Package: TO-272 WB-16 Part Status: Obsolete |
auf Bestellung 266 Stücke: Lieferzeit 21-28 Tag (e) |
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MRF5S19060NBR1 | NXP USA Inc. | Description: FET RF 65V 1.99GHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MRF5S19060NR1 | NXP USA Inc. | Description: FET RF 65V 1.99GHZ TO-270-4 |
Produkt ist nicht verfügbar |
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MRF5S9100NBR1 | NXP USA Inc. | Description: FET RF 68V 880MHZ TO-272-4 |
Produkt ist nicht verfügbar |
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MC908GP32CFBER | NXP USA Inc. |
Description: IC MCU 8BIT 32KB FLASH 44QFP Packaging: Cut Tape (CT) Package / Case: 44-QFP Mounting Type: Surface Mount Speed: 8MHz Program Memory Size: 32KB (32K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: HC08 Data Converters: A/D 8x8b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Connectivity: SCI, SPI Peripherals: LVD, POR, PWM Supplier Device Package: 44-QFP (10x10) Part Status: Not For New Designs Number of I/O: 33 DigiKey Programmable: Not Verified |
auf Bestellung 740 Stücke: Lieferzeit 21-28 Tag (e) |
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MC33897EFR2 | NXP USA Inc. |
Description: IC TRANSCEIVER HALF 1/1 14SOIC Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Mounting Type: Surface Mount Type: Transceiver Operating Temperature: -40°C ~ 125°C Voltage - Supply: 12V Number of Drivers/Receivers: 1/1 Data Rate: 83.33Kbps Protocol: CANbus Supplier Device Package: 14-SOIC Receiver Hysteresis: 500 mV Duplex: Half Part Status: Obsolete |
Produkt ist nicht verfügbar |
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PCA9555BS,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN Packaging: Tape & Reel (TR) Features: POR Package / Case: 24-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 18000 Stücke: Lieferzeit 21-28 Tag (e) |
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LPC2294HBD144,551 | NXP USA Inc. |
Description: IC MCU 16/32B 256KB FLSH 144LQFP Packaging: Tray Package / Case: 144-LQFP Mounting Type: Surface Mount Speed: 60MHz Program Memory Size: 256KB (256K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM7® Data Converters: A/D 8x10b Core Size: 16/32-Bit Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 144-LQFP (20x20) Part Status: Obsolete Number of I/O: 112 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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PCA9555BS,118 | NXP USA Inc. |
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN Packaging: Cut Tape (CT) Features: POR Package / Case: 24-VFQFN Exposed Pad Output Type: Push-Pull Mounting Type: Surface Mount Interface: I2C, SMBus Number of I/O: 16 Operating Temperature: -40°C ~ 85°C Voltage - Supply: 2.3V ~ 5.5V Clock Frequency: 400 kHz Interrupt Output: Yes Supplier Device Package: 24-HVQFN (4x4) Current - Output Source/Sink: 10mA, 25mA Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 22327 Stücke: Lieferzeit 21-28 Tag (e) |
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KMZ51,115 | NXP USA Inc. |
Description: SENSOR MR ANALOG 8SO Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Axis: Single Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5V ~ 8V Technology: Magnetoresistive Supplier Device Package: 8-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KMZ52,118 | NXP USA Inc. |
Description: SENSOR MR ANALOG 16SO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Axis: Single Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5V ~ 8V Technology: Magnetoresistive Supplier Device Package: 16-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KMZ51,115 | NXP USA Inc. |
Description: SENSOR MR ANALOG 8SO Packaging: Cut Tape (CT) Package / Case: 8-SOIC (0.154", 3.90mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Axis: Single Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5V ~ 8V Technology: Magnetoresistive Supplier Device Package: 8-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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KMZ52,118 | NXP USA Inc. |
Description: SENSOR MR ANALOG 16SO Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width) Output Type: Analog Voltage Mounting Type: Surface Mount Axis: Single Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 5V ~ 8V Technology: Magnetoresistive Supplier Device Package: 16-SO Part Status: Obsolete |
Produkt ist nicht verfügbar |
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DSP56303VL100 | NXP USA Inc. |
Description: IC DSP 24BIT 100MHZ 196-MAPBGA Packaging: Tray Package / Case: 196-LBGA Mounting Type: Surface Mount Interface: Host Interface, SSI, SCI Type: Fixed Point Operating Temperature: -40°C ~ 100°C (TJ) Non-Volatile Memory: ROM (576B) On-Chip RAM: 24kB Voltage - I/O: 3.30V Voltage - Core: 3.30V Clock Rate: 100MHz Supplier Device Package: 196-LBGA (15x15) Part Status: Obsolete |
Produkt ist nicht verfügbar |
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DSP56321VL200R2 | NXP USA Inc. | Description: IC DSP 24BIT 200MHZ 196MAPBGA |
Produkt ist nicht verfügbar |
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M68LC302CAF16VCT | NXP USA Inc. |
Description: IC MPU M683XX 166MHZ 100LQFP Packaging: Tray Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 166MHz Operating Temperature: -40°C ~ 85°C (TA) Core Processor: M68000 Voltage - I/O: 3.3V Supplier Device Package: 100-LQFP (14x14) Number of Cores/Bus Width: 1 Core, 8/16-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM Graphics Acceleration: No Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI |
Produkt ist nicht verfügbar |
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M68LC302CAF20VCT | NXP USA Inc. | Description: IC MPU M683XX 20MHZ 100LQFP |
Produkt ist nicht verfügbar |
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MC14489BDWE | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 20SOIC Packaging: Tube Package / Case: 20-SOIC (0.295", 7.50mm Width) Display Type: LED Mounting Type: Surface Mount Interface: Serial Configuration: 7 Segment Operating Temperature: -40°C ~ 130°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 20-SOIC Part Status: Not For New Designs Current - Supply: 5.5 mA |
auf Bestellung 1557 Stücke: Lieferzeit 21-28 Tag (e) |
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MC14489BDWER2 | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 20SOIC Packaging: Tape & Reel (TR) Package / Case: 20-SOIC (0.295", 7.50mm Width) Display Type: LED Mounting Type: Surface Mount Interface: Serial Configuration: 7 Segment Operating Temperature: -40°C ~ 130°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 20-SOIC Part Status: Not For New Designs Current - Supply: 5.5 mA |
auf Bestellung 13000 Stücke: Lieferzeit 21-28 Tag (e) |
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MC14489BPE | NXP USA Inc. |
Description: IC DRVR 7 SEGMENT 20DIP Packaging: Tube Package / Case: 20-DIP (0.300", 7.62mm) Display Type: LED Mounting Type: Through Hole Interface: Serial Configuration: 7 Segment Operating Temperature: -40°C ~ 130°C Voltage - Supply: 4.5V ~ 5.5V Supplier Device Package: 20-PDIP Part Status: Obsolete Current - Supply: 5.5 mA |
Produkt ist nicht verfügbar |
MPC860ENCVR66D4 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: -40°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
MPC860ENVR50D4 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Description: IC MPU MPC8XX 50MHZ 357BGA
Produkt ist nicht verfügbar
MPC860PCVR50D4 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Description: IC MPU MPC8XX 50MHZ 357BGA
Produkt ist nicht verfügbar
MPC860PVR50D4 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 50MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 50MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
MPC860SRCVR50D4 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 50MHZ 357BGA
Description: IC MPU MPC8XX 50MHZ 357BGA
Produkt ist nicht verfügbar
MPC860TCVR66D4 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
MPC862PVR100B |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
MPC862TCVR66B |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
MPC862TVR100B |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC862TVR66B |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
MPC866PCVR100A |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
MPC866PVR100A |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC866PVR133A |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC866TCVR100A |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC866TVR100A |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 100MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC866TVR133A |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (4), 10/100Mbps (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC870VR133 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 133MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
auf Bestellung 1 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 93.65 EUR |
MPC870VR66 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 66MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC870VR80 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Description: IC MPU MPC8XX 80MHZ 256BGA
Packaging: Tray
Package / Case: 256-BBGA
Mounting Type: Surface Mount
Speed: 80MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 256-PBGA (23x23)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: I2C, PCMCIA, SPI, TDM, UART
Part Status: Obsolete
Produkt ist nicht verfügbar
MPC875VR80 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 256BGA
Description: IC MPU MPC8XX 80MHZ 256BGA
auf Bestellung 70 Stücke:
Lieferzeit 21-28 Tag (e)MPC880CVR133 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
Produkt ist nicht verfügbar
MPC880VR133 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Description: IC MPU MPC8XX 133MHZ 357BGA
Produkt ist nicht verfügbar
MPC880VR66 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 66MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 66MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (2), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
MPC880VR80 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 80MHZ 357BGA
Description: IC MPU MPC8XX 80MHZ 357BGA
auf Bestellung 3300 Stücke:
Lieferzeit 21-28 Tag (e)MPC885CVR133 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: -40°C ~ 100°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
MPC885CVR66 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 357BGA
Description: IC MPU MPC8XX 66MHZ 357BGA
Produkt ist nicht verfügbar
MPC885VR133 |
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description: IC MPU MPC8XX 133MHZ 357BGA
Packaging: Tray
Package / Case: 357-BBGA
Mounting Type: Surface Mount
Speed: 133MHz
Operating Temperature: 0°C ~ 95°C (TA)
Core Processor: MPC8xx
Voltage - I/O: 3.3V
Supplier Device Package: 357-PBGA (25x25)
Ethernet: 10Mbps (3), 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; CPM, Security; SEC
RAM Controllers: DRAM
Graphics Acceleration: No
Security Features: Cryptography
Additional Interfaces: HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
Produkt ist nicht verfügbar
MRF5S19060NBR1 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-272-4
Description: FET RF 65V 1.99GHZ TO-272-4
Produkt ist nicht verfügbar
MRF5S19060NR1 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-270-4
Description: FET RF 65V 1.99GHZ TO-270-4
Produkt ist nicht verfügbar
MRF5S9100NBR1 |
Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ TO-272-4
Description: FET RF 68V 880MHZ TO-272-4
Produkt ist nicht verfügbar
MRF5S9101NBR1 |
Hersteller: NXP USA Inc.
Description: FET RF 68V 960MHZ TO-272-4
Description: FET RF 68V 960MHZ TO-272-4
Produkt ist nicht verfügbar
MSC8101VT1375F |
Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 250MHZ 332FCBGA
Description: IC DSP 16BIT 250MHZ 332FCBGA
Produkt ist nicht verfügbar
MSC8103VT1100F |
Hersteller: NXP USA Inc.
Description: IC DSP 16BIT 275MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 275MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
Description: IC DSP 16BIT 275MHZ 332FCBGA
Packaging: Tray
Package / Case: 332-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: Communications Processor Module (CPM)
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 512KB
Voltage - I/O: 3.30V
Voltage - Core: 1.60V
Clock Rate: 275MHz
Supplier Device Package: 332-FCBGA (17x17)
Part Status: Obsolete
Produkt ist nicht verfügbar
MSC8122TVT6400V |
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 16B 400MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 400MHz
Supplier Device Package: 431-FCPBGA (20x20)
Description: IC DSP QUAD 16B 400MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: -40°C ~ 105°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.10V
Clock Rate: 400MHz
Supplier Device Package: 431-FCPBGA (20x20)
Produkt ist nicht verfügbar
MSC8126VT8000 |
Hersteller: NXP USA Inc.
Description: IC DSP QUAD 16B 500MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 500MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
Description: IC DSP QUAD 16B 500MHZ 431FCBGA
Packaging: Tray
Package / Case: 431-BFBGA, FCBGA
Mounting Type: Surface Mount
Interface: DSI, Ethernet, RS-232
Type: SC140 Core
Operating Temperature: 0°C ~ 90°C (TJ)
Non-Volatile Memory: External
On-Chip RAM: 1.436MB
Voltage - I/O: 3.30V
Voltage - Core: 1.20V
Clock Rate: 500MHz
Supplier Device Package: 431-FCPBGA (20x20)
Part Status: Obsolete
Produkt ist nicht verfügbar
MW4IC2230GNBR1 |
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Produkt ist nicht verfügbar
MWIC930GNR1 |
Hersteller: NXP USA Inc.
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Produkt ist nicht verfügbar
MWIC930NR1 |
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 900MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 900MHz
RF Type: Cellular, GSM, EDGE, N-CDMA
Voltage - Supply: 26V
Gain: 30dB
Current - Supply: 90mA
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Description: IC AMP CELLULAR 900MHZ TO272WB
Packaging: Tape & Reel (TR)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 900MHz
RF Type: Cellular, GSM, EDGE, N-CDMA
Voltage - Supply: 26V
Gain: 30dB
Current - Supply: 90mA
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Produkt ist nicht verfügbar
MW4IC2230GNBR1 |
Hersteller: NXP USA Inc.
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Description: IC AMP CELL 1.6-2.4GHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Gull Wing
Mounting Type: Chassis Mount
Frequency: 1.6GHz ~ 2.4GHz
RF Type: Cellular, CDMA, EDGE, GSM, TDMA, W-CDMA
Voltage - Supply: 26V
Gain: 31dB
Current - Supply: 60mA
Supplier Device Package: TO-272 WB-16 GULL
Produkt ist nicht verfügbar
MWIC930GNR1 |
Hersteller: NXP USA Inc.
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Description: IC RF AMP CEL 900MHZ TO272 WB-16
Produkt ist nicht verfügbar
MWIC930NR1 |
Hersteller: NXP USA Inc.
Description: IC AMP CELLULAR 900MHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 900MHz
RF Type: Cellular, GSM, EDGE, N-CDMA
Voltage - Supply: 26V
Gain: 30dB
Current - Supply: 90mA
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
Description: IC AMP CELLULAR 900MHZ TO272WB
Packaging: Cut Tape (CT)
Package / Case: TO-272-16 Variant, Flat Leads
Mounting Type: Chassis Mount
Frequency: 900MHz
RF Type: Cellular, GSM, EDGE, N-CDMA
Voltage - Supply: 26V
Gain: 30dB
Current - Supply: 90mA
Supplier Device Package: TO-272 WB-16
Part Status: Obsolete
auf Bestellung 266 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 198.48 EUR |
10+ | 185.06 EUR |
25+ | 171.65 EUR |
100+ | 160.92 EUR |
MRF5S19060NBR1 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-272-4
Description: FET RF 65V 1.99GHZ TO-272-4
Produkt ist nicht verfügbar
MRF5S19060NR1 |
Hersteller: NXP USA Inc.
Description: FET RF 65V 1.99GHZ TO-270-4
Description: FET RF 65V 1.99GHZ TO-270-4
Produkt ist nicht verfügbar
MRF5S9100NBR1 |
Hersteller: NXP USA Inc.
Description: FET RF 68V 880MHZ TO-272-4
Description: FET RF 68V 880MHZ TO-272-4
Produkt ist nicht verfügbar
MC908GP32CFBER |
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Part Status: Not For New Designs
Number of I/O: 33
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 44QFP
Packaging: Cut Tape (CT)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 8x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 44-QFP (10x10)
Part Status: Not For New Designs
Number of I/O: 33
DigiKey Programmable: Not Verified
auf Bestellung 740 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1+ | 56.89 EUR |
10+ | 45.46 EUR |
100+ | 38.39 EUR |
MC33897EFR2 |
Hersteller: NXP USA Inc.
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Obsolete
Description: IC TRANSCEIVER HALF 1/1 14SOIC
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 12V
Number of Drivers/Receivers: 1/1
Data Rate: 83.33Kbps
Protocol: CANbus
Supplier Device Package: 14-SOIC
Receiver Hysteresis: 500 mV
Duplex: Half
Part Status: Obsolete
Produkt ist nicht verfügbar
PCA9555BS,118 |
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Tape & Reel (TR)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 18000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
6000+ | 2.63 EUR |
LPC2294HBD144,551 |
Hersteller: NXP USA Inc.
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
Description: IC MCU 16/32B 256KB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 60MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM7®
Data Converters: A/D 8x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
PCA9555BS,118 |
Hersteller: NXP USA Inc.
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC XPND 400KHZ I2C SMBUS 24HVQFN
Packaging: Cut Tape (CT)
Features: POR
Package / Case: 24-VFQFN Exposed Pad
Output Type: Push-Pull
Mounting Type: Surface Mount
Interface: I2C, SMBus
Number of I/O: 16
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.3V ~ 5.5V
Clock Frequency: 400 kHz
Interrupt Output: Yes
Supplier Device Package: 24-HVQFN (4x4)
Current - Output Source/Sink: 10mA, 25mA
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 22327 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
5+ | 5.95 EUR |
10+ | 5.35 EUR |
25+ | 5.05 EUR |
100+ | 4.3 EUR |
250+ | 4.04 EUR |
500+ | 3.54 EUR |
1000+ | 2.93 EUR |
2500+ | 2.73 EUR |
KMZ51,115 |
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 8V
Technology: Magnetoresistive
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: SENSOR MR ANALOG 8SO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 8V
Technology: Magnetoresistive
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
KMZ52,118 |
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 8V
Technology: Magnetoresistive
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: SENSOR MR ANALOG 16SO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 8V
Technology: Magnetoresistive
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
KMZ51,115 |
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 8V
Technology: Magnetoresistive
Supplier Device Package: 8-SO
Part Status: Obsolete
Description: SENSOR MR ANALOG 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 8V
Technology: Magnetoresistive
Supplier Device Package: 8-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
KMZ52,118 |
Hersteller: NXP USA Inc.
Description: SENSOR MR ANALOG 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 8V
Technology: Magnetoresistive
Supplier Device Package: 16-SO
Part Status: Obsolete
Description: SENSOR MR ANALOG 16SO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 5V ~ 8V
Technology: Magnetoresistive
Supplier Device Package: 16-SO
Part Status: Obsolete
Produkt ist nicht verfügbar
DSP56303VL100 |
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Part Status: Obsolete
Description: IC DSP 24BIT 100MHZ 196-MAPBGA
Packaging: Tray
Package / Case: 196-LBGA
Mounting Type: Surface Mount
Interface: Host Interface, SSI, SCI
Type: Fixed Point
Operating Temperature: -40°C ~ 100°C (TJ)
Non-Volatile Memory: ROM (576B)
On-Chip RAM: 24kB
Voltage - I/O: 3.30V
Voltage - Core: 3.30V
Clock Rate: 100MHz
Supplier Device Package: 196-LBGA (15x15)
Part Status: Obsolete
Produkt ist nicht verfügbar
DSP56321VL200R2 |
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 200MHZ 196MAPBGA
Description: IC DSP 24BIT 200MHZ 196MAPBGA
Produkt ist nicht verfügbar
M68LC302CAF16VCT |
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 166MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Description: IC MPU M683XX 166MHZ 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 166MHz
Operating Temperature: -40°C ~ 85°C (TA)
Core Processor: M68000
Voltage - I/O: 3.3V
Supplier Device Package: 100-LQFP (14x14)
Number of Cores/Bus Width: 1 Core, 8/16-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM
Graphics Acceleration: No
Additional Interfaces: GCI, IDL, ISDN, NMSI, PCM, SCPI
Produkt ist nicht verfügbar
M68LC302CAF20VCT |
Hersteller: NXP USA Inc.
Description: IC MPU M683XX 20MHZ 100LQFP
Description: IC MPU M683XX 20MHZ 100LQFP
Produkt ist nicht verfügbar
MC14489BDWE |
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Current - Supply: 5.5 mA
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Tube
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Current - Supply: 5.5 mA
auf Bestellung 1557 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
2+ | 21.16 EUR |
10+ | 19.1 EUR |
38+ | 18.22 EUR |
114+ | 15.82 EUR |
266+ | 15.11 EUR |
532+ | 13.77 EUR |
1026+ | 12 EUR |
MC14489BDWER2 |
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Current - Supply: 5.5 mA
Description: IC DRVR 7 SEGMENT 20SOIC
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Display Type: LED
Mounting Type: Surface Mount
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-SOIC
Part Status: Not For New Designs
Current - Supply: 5.5 mA
auf Bestellung 13000 Stücke:
Lieferzeit 21-28 Tag (e)Anzahl | Preis ohne MwSt |
---|---|
1000+ | 12 EUR |
2000+ | 11.55 EUR |
MC14489BPE |
Hersteller: NXP USA Inc.
Description: IC DRVR 7 SEGMENT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Display Type: LED
Mounting Type: Through Hole
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-PDIP
Part Status: Obsolete
Current - Supply: 5.5 mA
Description: IC DRVR 7 SEGMENT 20DIP
Packaging: Tube
Package / Case: 20-DIP (0.300", 7.62mm)
Display Type: LED
Mounting Type: Through Hole
Interface: Serial
Configuration: 7 Segment
Operating Temperature: -40°C ~ 130°C
Voltage - Supply: 4.5V ~ 5.5V
Supplier Device Package: 20-PDIP
Part Status: Obsolete
Current - Supply: 5.5 mA
Produkt ist nicht verfügbar