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PHT8N06LT,135 PHT8N06LT,135 NXP USA Inc. PHT8N06LT.pdf Description: MOSFET N-CH 55V 3.5A SOT223
Drive Voltage (Max Rds On, Min Rds On): 5V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 5A, 5V
Current - Continuous Drain (Id) @ 25°C: 3.5A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 650 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 11.2 nC @ 5 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±13V
Produkt ist nicht verfügbar
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PHX14NQ20T,127 PHX14NQ20T,127 NXP USA Inc. PHX,F14NQ20T.pdf Description: MOSFET N-CH 200V 7.6A TO220F
Rds On (Max) @ Id, Vgs: 230mOhm @ 7A, 10V
Current - Continuous Drain (Id) @ 25°C: 7.6A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 38 nC @ 10 V
Drain to Source Voltage (Vdss): 200 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 30W (Tc)
Produkt ist nicht verfügbar
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PHX9NQ20T,127 PHX9NQ20T,127 NXP USA Inc. PHX%2CPHF9NQ20T.pdf Description: MOSFET N-CH 200V 5.2A TO220F
Input Capacitance (Ciss) (Max) @ Vds: 959 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Drain to Source Voltage (Vdss): 200 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 25W (Tc)
Rds On (Max) @ Id, Vgs: 400mOhm @ 4.5A, 10V
Current - Continuous Drain (Id) @ 25°C: 5.2A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Produkt ist nicht verfügbar
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PMN55LN,135 PMN55LN,135 NXP USA Inc. PMN55LN.pdf Description: MOSFET N-CH 20V 4.1A 6TSOP
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PSMN003-30B,118 PSMN003-30B,118 NXP USA Inc. PSMN003-30(P,B)_Rev01.pdf Description: MOSFET N-CH 30V 75A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 9200 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 3V @ 1mA
Power Dissipation (Max): 230W (Tc)
Rds On (Max) @ Id, Vgs: 2.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN004-60P,127 PSMN004-60P,127 NXP USA Inc. Description: MOSFET N-CH 60V 75A TO220AB
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 8300 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Rds On (Max) @ Id, Vgs: 3.6mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Produkt ist nicht verfügbar
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PSMN008-75P,127 PSMN008-75P,127 NXP USA Inc. PSMN008-75P_Rev_4.pdf Description: MOSFET N-CH 75V 75A TO220AB
Input Capacitance (Ciss) (Max) @ Vds: 5260 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 122.8 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 230W (Tc)
Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Produkt ist nicht verfügbar
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BC547B,112 BC547B,112 NXP USA Inc. BC847_Rev_Feb2017.pdf Description: TRANS NPN 45V 0.1A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
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BC547C,112 BC547C,112 NXP USA Inc. BC847_Rev_Feb2017.pdf Description: TRANS NPN 45V 0.1A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
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BC556B,112 BC556B,112 NXP USA Inc. BC556%2CBC557.pdf Description: TRANS PNP 65V 0.1A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 500 mW
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BC557B,112 BC557B,112 NXP USA Inc. BC556%2CBC557.pdf Description: TRANS PNP 45V 0.1A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
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MC908QB8CDWER MC908QB8CDWER NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
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MC9S08QG4CPBE MC9S08QG4CPBE NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 4KB FLASH 16DIP
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MC908QY4MDWER MC908QY4MDWER NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
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MC908QY2AVDWER MC908QY2AVDWER NXP USA Inc. MC68HC908QY4.pdf Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33591FTAE MC33591FTAE NXP USA Inc. MC33591.pdf Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33591FTAER2 MC33591FTAER2 NXP USA Inc. MC33591.pdf Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33592FTAE MC33592FTAE NXP USA Inc. MC33592.pdf Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33592FTAER2 MC33592FTAER2 NXP USA Inc. MC33592.pdf Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33593FTAE MC33593FTAE NXP USA Inc. MC33593.pdf Description: RF RX FSK/OOK 868/915MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 7.8mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33593FTAER2 MC33593FTAER2 NXP USA Inc. MC33593.pdf Description: RF RX FSK/OOK 868/915MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 7.8mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33594FTAER2 MC33594FTAER2 NXP USA Inc. MC33594.pdf Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC908JL16CFJER MC908JL16CFJER NXP USA Inc. MC68HC908JL16.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC68HC705L5FUE MC68HC705L5FUE NXP USA Inc. MC68HC05_705L5.pdf Description: IC MCU 8BIT 8KB EPROM/UV 80QFP
Core Processor: HC05
Program Memory Type: EPROM, UV
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 80-QFP (14x14)
Peripherals: LCD, POR, WDT
Connectivity: SPI
Voltage - Supply (Vcc/Vdd): 2.2V ~ 5.5V
Core Size: 8-Bit
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MCR908JK1ECDWER NXP USA Inc. MC68HC908Jx%281%2C3%29.pdf Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Not For New Designs
Supplier Device Package: 20-SOIC
Peripherals: LED, LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Core Size: 8-Bit
Data Converters: A/D 12x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 1.5KB (1.5K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC3PHACVFAE MC3PHACVFAE NXP USA Inc. MC3PHAC.pdf Description: IC MOTOR DRIVER 4.5V-5.5V 32LQFP
Part Status: Obsolete
Motor Type - AC, DC: AC, Synchronous
Supplier Device Package: 32-LQFP (7x7)
Technology: IGBT
Applications: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: Serial
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC68HC11A1MFNE MC68HC11A1MFNE NXP USA Inc. MC68HC11A.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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MC68HC11A1MFNER MC68HC11A1MFNER NXP USA Inc. MC68HC11A.pdf Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC68HC711D3VFNE2 MC68HC711D3VFNE2 NXP USA Inc. MC68HC711D3.pdf Description: IC MCU 8BIT 4KB OTP 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Obsolete
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC11
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08QG8CDTER MC9S08QG8CDTER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Verified
Number of I/O: 12
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5000+3.75 EUR
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MC705X32MFUE4R MC705X32MFUE4R NXP USA Inc. MC68HC05X16.pdf Description: IC MCU 8BIT 32KB OTP 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, WDT
Connectivity: CANbus, SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 528 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCHC705B16NVFNE MCHC705B16NVFNE NXP USA Inc. MC68HC05B6.pdf Description: IC MCU 8BIT 15KB OTP 52PLCC
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 32
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MC705B16NCFNER MC705B16NCFNER NXP USA Inc. MC68HC05B6.pdf Description: IC MCU 8BIT 15KB OTP 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tape & Reel (TR)
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MC9S12C96CFUER MC9S12C96CFUER NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 96KB FLASH 80QFP
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MC9S12GC128MFAE MC9S12GC128MFAE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
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MC9S12DP512CPVER MC9S12DP512CPVER NXP USA Inc. MC9S12DP512%20Guide.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
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MC68HC16Z1VEH16 MC68HC16Z1VEH16 NXP USA Inc. MC68HC16ZUM.pdf Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 16
DigiKey Programmable: Not Verified
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MC68SEC000AA16R2 MC68SEC000AA16R2 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 16MHZ 64QFP
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MC912DG128ACPVER MC912DG128ACPVER NXP USA Inc. MC912DT128A.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 69
DigiKey Programmable: Not Verified
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MC9S12H256VFVER MC9S12H256VFVER NXP USA Inc. MC9S12H256%20Guide.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
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MC9S12C128CFAE MC9S12C128CFAE NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Verified
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MRFG35002N6R5 NXP USA Inc. MRFG35002N6.pdf Description: FET RF 8V 3.55GHZ
Produkt ist nicht verfügbar
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MRFG35010ANR5 MRFG35010ANR5 NXP USA Inc. Description: RF MOSFET PHEMT FET 12V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 130 mA
Produkt ist nicht verfügbar
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MC908QB8CDWER MC908QB8CDWER NXP USA Inc. MC68HLC908QY4.pdf Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
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100+7 EUR
250+6.68 EUR
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MC908JL16CFJER MC908JL16CFJER NXP USA Inc. MC68HC908JL16.pdf Description: IC MCU 8BIT 16KB FLASH 32LQFP
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MC9S08QG8CDTER MC9S08QG8CDTER NXP USA Inc. MC9S08QG8.pdf Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
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10+5.26 EUR
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100+4.39 EUR
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1000+3.93 EUR
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MC705X32MFUE4R MC705X32MFUE4R NXP USA Inc. MC68HC05X16.pdf Description: IC MCU 8BIT 32KB OTP 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, WDT
Connectivity: CANbus, SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 528 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
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MC9S12C96CFUER MC9S12C96CFUER NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 96KB FLASH 80QFP
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MC9S12DP512CPVER MC9S12DP512CPVER NXP USA Inc. MC9S12DP512%20Guide.pdf Description: IC MCU 16BIT 512KB FLASH 112LQFP
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Verified
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10+73.16 EUR
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100+64.88 EUR
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MC68SEC000AA16R2 MC68SEC000AA16R2 NXP USA Inc. MC68SEC000.pdf Description: IC MPU M680X0 16MHZ 64QFP
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MC912DG128ACPVER MC912DG128ACPVER NXP USA Inc. MC912DT128A.pdf Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 69
DigiKey Programmable: Not Verified
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MC9S12H256VFVER MC9S12H256VFVER NXP USA Inc. MC9S12H256%20Guide.pdf Description: IC MCU 16BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
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MRFG35002N6R5 NXP USA Inc. MRFG35002N6.pdf Description: FET RF 8V 3.55GHZ
Produkt ist nicht verfügbar
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MC9S12C96CFUER MC9S12C96CFUER NXP USA Inc. MC9S12C128V1.pdf Description: IC MCU 16BIT 96KB FLASH 80QFP
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DSP56301VF80 DSP56301VF80 NXP USA Inc. DSP56301DS.pdf Description: IC DSP 24BIT 80MHZ 252-BGA
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DSP56301VF80B1 DSP56301VF80B1 NXP USA Inc. DSP56301DS.pdf Description: IC DSP 24BIT 80MHZ 252-BGA
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DSP56303VF100B1 DSP56303VF100B1 NXP USA Inc. DSP56303.pdf Description: IC DSP 24BIT 100MHZ 196-BGA
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DSP56303VF100R2 DSP56303VF100R2 NXP USA Inc. DSP56303.pdf Description: IC DSP 24BIT 100MHZ 196-BGA
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DSP56303VL100B1 DSP56303VL100B1 NXP USA Inc. DSP56303.pdf Description: IC DSP 24BIT 100MHZ 196-BGA
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DSP56311VF150B1 DSP56311VF150B1 NXP USA Inc. DSP56311.pdf Description: IC DSP 24BIT 150MHZ 196-BGA
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PHT8N06LT,135 PHT8N06LT.pdf
PHT8N06LT,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 55V 3.5A SOT223
Drive Voltage (Max Rds On, Min Rds On): 5V
Part Status: Obsolete
Supplier Device Package: SC-73
Vgs(th) (Max) @ Id: 2V @ 1mA
Power Dissipation (Max): 1.8W (Ta), 8.3W (Tc)
Rds On (Max) @ Id, Vgs: 80mOhm @ 5A, 5V
Current - Continuous Drain (Id) @ 25°C: 3.5A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 650 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 11.2 nC @ 5 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±13V
Produkt ist nicht verfügbar
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PHX14NQ20T,127 PHX,F14NQ20T.pdf
PHX14NQ20T,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 200V 7.6A TO220F
Rds On (Max) @ Id, Vgs: 230mOhm @ 7A, 10V
Current - Continuous Drain (Id) @ 25°C: 7.6A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 38 nC @ 10 V
Drain to Source Voltage (Vdss): 200 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 30W (Tc)
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PHX9NQ20T,127 PHX%2CPHF9NQ20T.pdf
PHX9NQ20T,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 200V 5.2A TO220F
Input Capacitance (Ciss) (Max) @ Vds: 959 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Drain to Source Voltage (Vdss): 200 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220F
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 25W (Tc)
Rds On (Max) @ Id, Vgs: 400mOhm @ 4.5A, 10V
Current - Continuous Drain (Id) @ 25°C: 5.2A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack, Isolated Tab
Packaging: Tube
Produkt ist nicht verfügbar
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PMN55LN,135 PMN55LN.pdf
PMN55LN,135
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 20V 4.1A 6TSOP
Produkt ist nicht verfügbar
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PSMN003-30B,118 PSMN003-30(P,B)_Rev01.pdf
PSMN003-30B,118
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 30V 75A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 9200 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 170 nC @ 10 V
Drain to Source Voltage (Vdss): 30 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 5V, 10V
Part Status: Obsolete
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 3V @ 1mA
Power Dissipation (Max): 230W (Tc)
Rds On (Max) @ Id, Vgs: 2.8mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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PSMN004-60P,127
PSMN004-60P,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 60V 75A TO220AB
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 8300 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 168 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Rds On (Max) @ Id, Vgs: 3.6mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Produkt ist nicht verfügbar
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PSMN008-75P,127 PSMN008-75P_Rev_4.pdf
PSMN008-75P,127
Hersteller: NXP USA Inc.
Description: MOSFET N-CH 75V 75A TO220AB
Input Capacitance (Ciss) (Max) @ Vds: 5260 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 122.8 nC @ 10 V
Drain to Source Voltage (Vdss): 75 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Obsolete
Supplier Device Package: TO-220AB
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 230W (Tc)
Rds On (Max) @ Id, Vgs: 8.5mOhm @ 25A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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BC547B,112 BC847_Rev_Feb2017.pdf
BC547B,112
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
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BC547C,112 BC847_Rev_Feb2017.pdf
BC547C,112
Hersteller: NXP USA Inc.
Description: TRANS NPN 45V 0.1A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 400mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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BC556B,112 BC556%2CBC557.pdf
BC556B,112
Hersteller: NXP USA Inc.
Description: TRANS PNP 65V 0.1A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 65 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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BC557B,112 BC556%2CBC557.pdf
BC557B,112
Hersteller: NXP USA Inc.
Description: TRANS PNP 45V 0.1A TO-92-3
Packaging: Bulk
Package / Case: TO-226-3, TO-92-3 (TO-226AA) Formed Leads
Mounting Type: Through Hole
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 220 @ 2mA, 5V
Frequency - Transition: 100MHz
Supplier Device Package: TO-92-3
Part Status: Obsolete
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 500 mW
Produkt ist nicht verfügbar
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MC908QB8CDWER MC68HLC908QY4.pdf
MC908QB8CDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1000+6.32 EUR
2000+6.19 EUR
Mindestbestellmenge: 1000 Stücke
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MC9S08QG4CPBE MC9S08QG8.pdf
MC9S08QG4CPBE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16DIP
Produkt ist nicht verfügbar
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MC908QY4MDWER MC68HC908QY4.pdf
MC908QY4MDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB FLASH 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Number of I/O: 5
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC908QY2AVDWER MC68HC908QY4.pdf
MC908QY2AVDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 1.5KB (1.5K x 8)
RAM Size: 128 x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 6x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Number of I/O: 13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC33591FTAE MC33591.pdf
MC33591FTAE
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33591FTAER2 MC33591.pdf
MC33591FTAER2
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33592FTAE MC33592.pdf
MC33592FTAE
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33592FTAER2 MC33592.pdf
MC33592FTAER2
Hersteller: NXP USA Inc.
Description: RF RCVR OOK 315MHZ/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.9V ~ 3.6V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33593FTAE MC33593.pdf
MC33593FTAE
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 868/915MHZ 24LQFP
Packaging: Tray
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 7.8mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33593FTAER2 MC33593.pdf
MC33593FTAER2
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 868/915MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 868MHz, 915MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 7.8mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC33594FTAER2 MC33594.pdf
MC33594FTAER2
Hersteller: NXP USA Inc.
Description: RF RX FSK/OOK 315/434MHZ 24LQFP
Packaging: Tape & Reel (TR)
Package / Case: 24-LQFP
Sensitivity: -105dBm
Mounting Type: Surface Mount
Frequency: 315MHz, 434MHz
Modulation or Protocol: FSK, OOK
Data Interface: PCB, Surface Mount
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 4.5V ~ 5.5V
Applications: General Data Transfer
Current - Receiving: 5.7mA
Data Rate (Max): 11kBaud
Antenna Connector: PCB, Surface Mount
Supplier Device Package: 24-LQFP (4x4)
Part Status: Obsolete
Produkt ist nicht verfügbar
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MC908JL16CFJER MC68HC908JL16.pdf
MC908JL16CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC68HC705L5FUE MC68HC05_705L5.pdf
MC68HC705L5FUE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB EPROM/UV 80QFP
Core Processor: HC05
Program Memory Type: EPROM, UV
Oscillator Type: Internal
Operating Temperature: 0°C ~ 70°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 16
Supplier Device Package: 80-QFP (14x14)
Peripherals: LCD, POR, WDT
Connectivity: SPI
Voltage - Supply (Vcc/Vdd): 2.2V ~ 5.5V
Core Size: 8-Bit
Produkt ist nicht verfügbar
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MCR908JK1ECDWER MC68HC908Jx%281%2C3%29.pdf
MCR908JK1ECDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 1.5KB FLASH 20SOIC
DigiKey Programmable: Not Verified
Number of I/O: 14
Part Status: Not For New Designs
Supplier Device Package: 20-SOIC
Peripherals: LED, LVD, POR, PWM
Voltage - Supply (Vcc/Vdd): 2.7V ~ 3.3V
Core Size: 8-Bit
Data Converters: A/D 12x8b
Core Processor: HC08
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 128 x 8
Program Memory Size: 1.5KB (1.5K x 8)
Speed: 8MHz
Mounting Type: Surface Mount
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC3PHACVFAE MC3PHAC.pdf
MC3PHACVFAE
Hersteller: NXP USA Inc.
Description: IC MOTOR DRIVER 4.5V-5.5V 32LQFP
Part Status: Obsolete
Motor Type - AC, DC: AC, Synchronous
Supplier Device Package: 32-LQFP (7x7)
Technology: IGBT
Applications: General Purpose
Voltage - Supply: 4.5V ~ 5.5V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 105°C (TA)
Interface: Serial
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MC68HC11A1MFNE MC68HC11A.pdf
MC68HC11A1MFNE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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MC68HC11A1MFNER MC68HC11A.pdf
MC68HC11A1MFNER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT ROMLESS 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC11
EEPROM Size: 512 x 8
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256 x 8
Speed: 3MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC68HC711D3VFNE2 MC68HC711D3.pdf
MC68HC711D3VFNE2
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 4KB OTP 44PLCC
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Obsolete
Supplier Device Package: 44-PLCC (16.59x16.59)
Peripherals: POR, WDT
Connectivity: SCI, SPI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Core Processor: HC11
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192 x 8
Program Memory Size: 4KB (4K x 8)
Speed: 2MHz
Mounting Type: Surface Mount
Package / Case: 44-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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MC9S08QG8CDTER MC9S08QG8.pdf
MC9S08QG8CDTER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Verified
Number of I/O: 12
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5000+3.75 EUR
Mindestbestellmenge: 5000 Stücke
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MC705X32MFUE4R MC68HC05X16.pdf
MC705X32MFUE4R
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, WDT
Connectivity: CANbus, SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 528 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MCHC705B16NVFNE MC68HC05B6.pdf
MCHC705B16NVFNE
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tube
DigiKey Programmable: Not Verified
Number of I/O: 32
Produkt ist nicht verfügbar
Mindestbestellmenge: 23 Stücke
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MC705B16NCFNER MC68HC05B6.pdf
MC705B16NCFNER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 15KB OTP 52PLCC
DigiKey Programmable: Not Verified
Number of I/O: 32
Part Status: Obsolete
Supplier Device Package: 52-PLCC (19.1x19.1)
Peripherals: POR, WDT
Connectivity: SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 352 x 8
Program Memory Size: 15KB (15K x 8)
Speed: 2.1MHz
Mounting Type: Surface Mount
Package / Case: 52-LCC (J-Lead)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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MC9S12C96CFUER MC9S12C128V1.pdf
MC9S12C96CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
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MC9S12GC128MFAE MC9S12C128V1.pdf
MC9S12GC128MFAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 250 Stücke
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MC9S12DP512CPVER MC9S12DP512%20Guide.pdf
MC9S12DP512CPVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 12K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: HCS12
Data Converters: A/D 16x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Number of I/O: 91
DigiKey Programmable: Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
500+61.57 EUR
Mindestbestellmenge: 500 Stücke
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MC68HC16Z1VEH16 MC68HC16ZUM.pdf
MC68HC16Z1VEH16
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT ROMLESS 132PQFP
Packaging: Tray
Package / Case: 132-BQFP Bumpered
Mounting Type: Surface Mount
Speed: 16MHz
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: CPU16
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 132-PQFP (24.13x24.13)
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC68SEC000AA16R2 MC68SEC000.pdf
MC68SEC000AA16R2
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Produkt ist nicht verfügbar
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MC912DG128ACPVER MC912DT128A.pdf
MC912DG128ACPVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Tape & Reel (TR)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 69
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MC9S12H256VFVER MC9S12H256%20Guide.pdf
MC9S12H256VFVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
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MC9S12C128CFAE MC9S12C128V1.pdf
MC9S12C128CFAE
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HCS12
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 31
DigiKey Programmable: Verified
auf Bestellung 596 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+48.49 EUR
10+39.22 EUR
25+36.91 EUR
100+34.37 EUR
250+33.16 EUR
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MRFG35002N6R5 MRFG35002N6.pdf
Hersteller: NXP USA Inc.
Description: FET RF 8V 3.55GHZ
Produkt ist nicht verfügbar
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MRFG35010ANR5
MRFG35010ANR5
Hersteller: NXP USA Inc.
Description: RF MOSFET PHEMT FET 12V NI360
Packaging: Tape & Reel (TR)
Package / Case: NI-360HF
Mounting Type: Chassis Mount
Frequency: 3.55GHz
Power - Output: 1W
Gain: 10dB
Technology: pHEMT FET
Supplier Device Package: NI-360HF
Voltage - Rated: 15 V
Voltage - Test: 12 V
Current - Test: 130 mA
Produkt ist nicht verfügbar
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MC908QB8CDWER MC68HLC908QY4.pdf
MC908QB8CDWER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: HC08
Data Converters: A/D 10x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: SCI, SPI
Peripherals: LVD, POR, PWM
Supplier Device Package: 16-SOIC
Part Status: Not For New Designs
Number of I/O: 13
DigiKey Programmable: Verified
auf Bestellung 2762 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+10.79 EUR
10+8.3 EUR
25+7.68 EUR
100+7 EUR
250+6.68 EUR
500+6.65 EUR
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MC908JL16CFJER MC68HC908JL16.pdf
MC908JL16CFJER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 16KB FLASH 32LQFP
Produkt ist nicht verfügbar
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MC9S08QG8CDTER MC9S08QG8.pdf
MC9S08QG8CDTER
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 8KB FLASH 16TSSOP
DigiKey Programmable: Verified
Number of I/O: 12
Part Status: Active
Supplier Device Package: 16-TSSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.8V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: S08
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 8301 Stücke:
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AnzahlPreis
3+6.93 EUR
10+5.26 EUR
25+4.85 EUR
100+4.39 EUR
250+4.17 EUR
500+4.04 EUR
1000+3.93 EUR
2500+3.82 EUR
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MC705X32MFUE4R MC68HC05X16.pdf
MC705X32MFUE4R
Hersteller: NXP USA Inc.
Description: IC MCU 8BIT 32KB OTP 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 24
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x14)
Peripherals: POR, WDT
Connectivity: CANbus, SCI
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: HC05
EEPROM Size: 256 x 8
Program Memory Type: OTP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 528 x 8
Program Memory Size: 32KB (32K x 8)
Speed: 4MHz
Mounting Type: Surface Mount
Package / Case: 64-QFP
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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MC9S12C96CFUER MC9S12C128V1.pdf
MC9S12C96CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Produkt ist nicht verfügbar
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MC9S12DP512CPVER MC9S12DP512%20Guide.pdf
MC9S12DP512CPVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 512KB FLASH 112LQFP
Number of I/O: 91
Supplier Device Package: 112-LQFP (20x20)
Peripherals: PWM, WDT
Connectivity: CANbus, I2C, SCI, SPI
Voltage - Supply (Vcc/Vdd): 2.35V ~ 5.25V
Core Size: 16-Bit
Data Converters: A/D 16x10b
Core Processor: HCS12
EEPROM Size: 4K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 112-LQFP
Packaging: Cut Tape (CT)
DigiKey Programmable: Verified
auf Bestellung 1496 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+88.97 EUR
10+73.16 EUR
25+69.22 EUR
100+64.88 EUR
250+62.81 EUR
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MC68SEC000AA16R2 MC68SEC000.pdf
MC68SEC000AA16R2
Hersteller: NXP USA Inc.
Description: IC MPU M680X0 16MHZ 64QFP
Produkt ist nicht verfügbar
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MC912DG128ACPVER MC912DT128A.pdf
MC912DG128ACPVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 128KB FLASH 112LQFP
Packaging: Cut Tape (CT)
Package / Case: 112-LQFP
Mounting Type: Surface Mount
Speed: 8MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: CPU12
Data Converters: A/D 16x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, I2C, SCI, SPI
Peripherals: POR, PWM, WDT
Supplier Device Package: 112-LQFP (20x20)
Part Status: Not For New Designs
Number of I/O: 69
DigiKey Programmable: Not Verified
auf Bestellung 167 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+113.01 EUR
10+93.87 EUR
25+91.92 EUR
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MC9S12H256VFVER MC9S12H256%20Guide.pdf
MC9S12H256VFVER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 256KB FLASH 144LQFP
Produkt ist nicht verfügbar
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MRFG35002N6R5 MRFG35002N6.pdf
Hersteller: NXP USA Inc.
Description: FET RF 8V 3.55GHZ
Produkt ist nicht verfügbar
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MC9S12C96CFUER MC9S12C128V1.pdf
MC9S12C96CFUER
Hersteller: NXP USA Inc.
Description: IC MCU 16BIT 96KB FLASH 80QFP
Produkt ist nicht verfügbar
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DSP56301VF80 DSP56301DS.pdf
DSP56301VF80
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 80MHZ 252-BGA
Produkt ist nicht verfügbar
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DSP56301VF80B1 DSP56301DS.pdf
DSP56301VF80B1
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 80MHZ 252-BGA
Produkt ist nicht verfügbar
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DSP56303VF100B1 DSP56303.pdf
DSP56303VF100B1
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-BGA
Produkt ist nicht verfügbar
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DSP56303VF100R2 DSP56303.pdf
DSP56303VF100R2
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-BGA
Produkt ist nicht verfügbar
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DSP56303VL100B1 DSP56303.pdf
DSP56303VL100B1
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 100MHZ 196-BGA
Produkt ist nicht verfügbar
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DSP56311VF150B1 DSP56311.pdf
DSP56311VF150B1
Hersteller: NXP USA Inc.
Description: IC DSP 24BIT 150MHZ 196-BGA
Produkt ist nicht verfügbar
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