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30-PRS16017-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
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30-PRS16018-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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30-PRS16020-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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30-PRS16022-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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324-PLS18001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
324-PRS18001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PLS20019-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PLS20021-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PLS21022-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PRS20019-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PRS20021-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PRS21022-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
34-PRS17034-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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361-PLS19001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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400-PLS20001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
400-PLS20001-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
400-PRS20001-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
400-PRS20001-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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Im Einkaufswagen  Stück im Wert von  UAH
441-PRS21001-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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44-PLS12017-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-PRS12017-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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47-PLS16021-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
47-PRS16021-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
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50-PLS13118-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
54-PRS17038-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PLS14031-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PLS15057-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PRS14031-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
64-PLS16016-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
64-PRS16016-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
65-PRS10008-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
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65-PRS11037-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
66-PLS11049-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
66-PLS11054-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PLS11033-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PLS11033-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PRS11033-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PLS11031-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PLS13112-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PRS11031-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PRS11055-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PRS13112-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
76-PLS19033-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
76-PRS19033-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRL13127-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRL15072-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRS13127-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRS15072-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRS21027-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PLS10003-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS10003-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS11010-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS11032-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS11032-16 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS12022-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS13053-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS13125-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
85-PRS11008-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
96-PRS14024-12 Aries Electronics 10004-pga-zif-test-and-burn-in-socket.pdf Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1109042 Aries Electronics 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf Description: 537 ZIF TEST SCKT LIVE BUG TYPE
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-PRS16017-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-PRS16018-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-PRS16020-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
30-PRS16022-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
324-PLS18001-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
324-PRS18001-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PLS20019-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PLS20021-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PLS21022-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PRS20019-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PRS20021-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
336-PRS21022-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
34-PRS17034-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
361-PLS19001-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
400-PLS20001-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
400-PLS20001-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
400-PRS20001-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
400-PRS20001-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
441-PRS21001-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-PLS12017-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
44-PRS12017-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
47-PLS16021-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
47-PRS16021-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
50-PLS13118-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
54-PRS17038-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PLS14031-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PLS15057-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
56-PRS14031-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
64-PLS16016-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
64-PRS16016-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
65-PRS10008-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
65-PRS11037-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
66-PLS11049-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
66-PLS11054-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PLS11033-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PLS11033-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
68-PRS11033-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 200°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Nickel Bronze
Contact Finish Thickness - Post: 50.0µin (1.27µm)
Contact Material - Post: Beryllium Copper
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PLS11031-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PLS13112-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PRS11031-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PRS11055-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
69-PRS13112-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
76-PLS19033-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Features: Closed Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
76-PRS19033-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRL13127-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRL15072-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRS13127-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRS15072-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
80-PRS21027-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PLS10003-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Part Status: Active
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS10003-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS11010-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS11032-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS11032-16 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS12022-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS13053-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
84-PRS13125-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: PGA, ZIF (ZIP)
Operating Temperature: -65°C ~ 125°C
Termination: Solder
Housing Material: Polyphenylene Sulfide (PPS)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Beryllium Copper
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
85-PRS11008-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
96-PRS14024-12 10004-pga-zif-test-and-burn-in-socket.pdf
Hersteller: Aries Electronics
Description: CONN SOCKET PGA ZIF GOLD
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
1109042 10012-insert-plates-for-universal-plcc-zif-test-socket.pdf
Hersteller: Aries Electronics
Description: 537 ZIF TEST SCKT LIVE BUG TYPE
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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