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374224B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
Material: aluminium
Application: BGA; FPGA
Height: 25mm
Length: 23mm
Type of heatsink: extruded
Width: 23mm
Produkt ist nicht verfügbar
374224B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
Material: aluminium
Application: BGA; FPGA
Height: 25mm
Length: 23mm
Type of heatsink: extruded
Width: 23mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374224B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Material: aluminium
Application: BGA; FPGA
Height: 25mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 23mm
Produkt ist nicht verfügbar
374224B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Material: aluminium
Application: BGA; FPGA
Height: 25mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 23mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374324B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Produkt ist nicht verfügbar
374324B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374324B00035G BOYD CORP Board-Level-Cooling-3743.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Produkt ist nicht verfügbar
374324B00035G BOYD CORP Board-Level-Cooling-3743.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374324B60023G 374324B60023G BOYD CORP Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
auf Bestellung 288 Stücke:
Lieferzeit 14-21 Tag (e)
17+4.25 EUR
20+ 3.69 EUR
21+ 3.49 EUR
96+ 3.35 EUR
Mindestbestellmenge: 17
374324B60023G 374324B60023G BOYD CORP Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Anzahl je Verpackung: 1 Stücke
auf Bestellung 288 Stücke:
Lieferzeit 7-14 Tag (e)
17+4.25 EUR
20+ 3.69 EUR
21+ 3.49 EUR
96+ 3.35 EUR
Mindestbestellmenge: 17
374424B00035G 374424B00035G BOYD CORP 371824B00034G%20Side.jpg Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Width: 27mm
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
auf Bestellung 442 Stücke:
Lieferzeit 14-21 Tag (e)
18+4.13 EUR
20+ 3.68 EUR
21+ 3.47 EUR
Mindestbestellmenge: 18
374424B00035G 374424B00035G BOYD CORP 371824B00034G%20Side.jpg Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Width: 27mm
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Anzahl je Verpackung: 1 Stücke
auf Bestellung 442 Stücke:
Lieferzeit 7-14 Tag (e)
18+4.13 EUR
20+ 3.68 EUR
21+ 3.47 EUR
567+ 3.33 EUR
Mindestbestellmenge: 18
374424B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Width: 27mm
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Produkt ist nicht verfügbar
374424B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Width: 27mm
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374524B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374524B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374524B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374524B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374624B00000G BOYD CORP 374624B00000G Heatsinks
Produkt ist nicht verfügbar
374624B00032G BOYD CORP 371824B00034G%20Side.jpg Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Produkt ist nicht verfügbar
374624B00032G BOYD CORP 371824B00034G%20Side.jpg Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374624B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Produkt ist nicht verfügbar
374624B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374624B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Produkt ist nicht verfügbar
374624B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374724B00032G BOYD CORP Board-Level-Cooling-3747.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Produkt ist nicht verfügbar
374724B00032G BOYD CORP Board-Level-Cooling-3747.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374724B00035G BOYD CORP Board-Level-Cooling-3747.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Produkt ist nicht verfügbar
374724B00035G BOYD CORP Board-Level-Cooling-3747.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374724B60024G BOYD CORP Board-Level-Cooling-3747.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Produkt ist nicht verfügbar
374724B60024G BOYD CORP Board-Level-Cooling-3747.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374824B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374824B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374824B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Length: 35mm
Material: aluminium
Application: BGA; FPGA
Width: 35mm
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Height: 25mm
Type of heatsink: extruded
Produkt ist nicht verfügbar
374824B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Length: 35mm
Material: aluminium
Application: BGA; FPGA
Width: 35mm
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Height: 25mm
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374824B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Length: 35mm
Material: aluminium
Application: BGA; FPGA
Width: 35mm
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Height: 25mm
Type of heatsink: extruded
Produkt ist nicht verfügbar
374824B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Length: 35mm
Material: aluminium
Application: BGA; FPGA
Width: 35mm
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Height: 25mm
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374924B00032G BOYD CORP 374924B00032G%20Side.jpg Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374924B00032G BOYD CORP 374924B00032G%20Side.jpg Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374924B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Application: BGA; FPGA
Height: 10mm
Length: 40mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Width: 40mm
Material: aluminium
Produkt ist nicht verfügbar
374924B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Application: BGA; FPGA
Height: 10mm
Length: 40mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Width: 40mm
Material: aluminium
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374924B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Application: BGA; FPGA
Height: 10mm
Length: 40mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Width: 40mm
Material: aluminium
Produkt ist nicht verfügbar
374924B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Application: BGA; FPGA
Height: 10mm
Length: 40mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Width: 40mm
Material: aluminium
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375024B00032G BOYD CORP Aavid_Boyd_Board_Level_Heatsinks_Catalog-3043646.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Width: 40mm
Length: 40mm
Material: aluminium
Colour: black
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
375024B00032G BOYD CORP Aavid_Boyd_Board_Level_Heatsinks_Catalog-3043646.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Width: 40mm
Length: 40mm
Material: aluminium
Colour: black
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375024B60024G 375024B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Width: 40mm
Length: 40mm
Material: aluminium
Colour: black
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
auf Bestellung 215 Stücke:
Lieferzeit 14-21 Tag (e)
6+12.47 EUR
7+ 10.6 EUR
96+ 10.44 EUR
Mindestbestellmenge: 6
375024B60024G 375024B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Width: 40mm
Length: 40mm
Material: aluminium
Colour: black
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
auf Bestellung 215 Stücke:
Lieferzeit 7-14 Tag (e)
6+12.47 EUR
7+ 10.6 EUR
96+ 10.44 EUR
216+ 10.31 EUR
Mindestbestellmenge: 6
375124B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
375124B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375124B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Colour: black
Length: 40mm
Application: BGA; FPGA
Material: aluminium
Width: 40mm
Height: 25mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
375124B60024G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Colour: black
Length: 40mm
Application: BGA; FPGA
Material: aluminium
Width: 40mm
Height: 25mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375224B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm
Colour: black
Height: 10.2mm
Length: 11.1mm
Width: 10.2mm
Type of heatsink: extruded
Application: BGA; FPGA
Heatsink shape: grilled
Material: aluminium
Material finishing: anodized
Produkt ist nicht verfügbar
375224B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm
Colour: black
Height: 10.2mm
Length: 11.1mm
Width: 10.2mm
Type of heatsink: extruded
Application: BGA; FPGA
Heatsink shape: grilled
Material: aluminium
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375324B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 10.2mm; W: 10.2mm
Width: 10.2mm
Length: 10.2mm
Colour: black
Material: aluminium
Application: BGA; FPGA
Height: 10.2mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
375324B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 10.2mm; W: 10.2mm
Width: 10.2mm
Length: 10.2mm
Colour: black
Material: aluminium
Application: BGA; FPGA
Height: 10.2mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375424B00034G BOYD CORP Board-Level-Heatsinks_Cat.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 15.3mm; W: 15.2mm
Length: 15.3mm
Width: 15.2mm
Material: aluminium
Height: 6.35mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
375424B00034G BOYD CORP Board-Level-Heatsinks_Cat.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 15.3mm; W: 15.2mm
Length: 15.3mm
Width: 15.2mm
Material: aluminium
Height: 6.35mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375424B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
375424B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
500403B00000G BOYD CORP Board-Level-Cooling-Basket-5000.pdf Category: Heatsinks
Description: Heatsink: die-cut; grilled; TO3; black; L: 45.97mm; W: 45.97mm
Width: 45.97mm
Height: 31.75mm
Application: TO3
Length: 45.97mm
Type of heatsink: die-cut
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Material: aluminium
Produkt ist nicht verfügbar
374224B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
Material: aluminium
Application: BGA; FPGA
Height: 25mm
Length: 23mm
Type of heatsink: extruded
Width: 23mm
Produkt ist nicht verfügbar
374224B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; BGA,FPGA; L: 23mm; W: 23mm; H: 25mm; aluminium
Material: aluminium
Application: BGA; FPGA
Height: 25mm
Length: 23mm
Type of heatsink: extruded
Width: 23mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374224B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Material: aluminium
Application: BGA; FPGA
Height: 25mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 23mm
Produkt ist nicht verfügbar
374224B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Material: aluminium
Application: BGA; FPGA
Height: 25mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 23mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374324B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Produkt ist nicht verfügbar
374324B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374324B00035G Board-Level-Cooling-3743.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Produkt ist nicht verfügbar
374324B00035G Board-Level-Cooling-3743.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374324B60023G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
374324B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
auf Bestellung 288 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis ohne MwSt
17+4.25 EUR
20+ 3.69 EUR
21+ 3.49 EUR
96+ 3.35 EUR
Mindestbestellmenge: 17
374324B60023G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
374324B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 27mm
Height: 10mm
Anzahl je Verpackung: 1 Stücke
auf Bestellung 288 Stücke:
Lieferzeit 7-14 Tag (e)
Anzahl Preis ohne MwSt
17+4.25 EUR
20+ 3.69 EUR
21+ 3.49 EUR
96+ 3.35 EUR
Mindestbestellmenge: 17
374424B00035G 371824B00034G%20Side.jpg
374424B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Width: 27mm
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
auf Bestellung 442 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis ohne MwSt
18+4.13 EUR
20+ 3.68 EUR
21+ 3.47 EUR
Mindestbestellmenge: 18
374424B00035G 371824B00034G%20Side.jpg
374424B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Width: 27mm
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Anzahl je Verpackung: 1 Stücke
auf Bestellung 442 Stücke:
Lieferzeit 7-14 Tag (e)
Anzahl Preis ohne MwSt
18+4.13 EUR
20+ 3.68 EUR
21+ 3.47 EUR
567+ 3.33 EUR
Mindestbestellmenge: 18
374424B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Width: 27mm
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Produkt ist nicht verfügbar
374424B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm
Material: aluminium
Length: 27mm
Width: 27mm
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374524B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374524B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374524B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374524B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374624B00000G
Hersteller: BOYD CORP
374624B00000G Heatsinks
Produkt ist nicht verfügbar
374624B00032G 371824B00034G%20Side.jpg
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Produkt ist nicht verfügbar
374624B00032G 371824B00034G%20Side.jpg
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374624B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Produkt ist nicht verfügbar
374624B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374624B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Produkt ist nicht verfügbar
374624B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Application: BGA; FPGA
Colour: black
Material: aluminium
Material finishing: anodized
Type of heatsink: extruded
Length: 35mm
Width: 35mm
Heatsink shape: grilled
Height: 10mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374724B00032G Board-Level-Cooling-3747.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Produkt ist nicht verfügbar
374724B00032G Board-Level-Cooling-3747.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374724B00035G Board-Level-Cooling-3747.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Produkt ist nicht verfügbar
374724B00035G Board-Level-Cooling-3747.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374724B60024G Board-Level-Cooling-3747.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Produkt ist nicht verfügbar
374724B60024G Board-Level-Cooling-3747.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 18mm
Colour: black
Material: aluminium
Height: 18mm
Length: 35mm
Application: BGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374824B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374824B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374824B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Length: 35mm
Material: aluminium
Application: BGA; FPGA
Width: 35mm
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Height: 25mm
Type of heatsink: extruded
Produkt ist nicht verfügbar
374824B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Length: 35mm
Material: aluminium
Application: BGA; FPGA
Width: 35mm
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Height: 25mm
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374824B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Length: 35mm
Material: aluminium
Application: BGA; FPGA
Width: 35mm
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Height: 25mm
Type of heatsink: extruded
Produkt ist nicht verfügbar
374824B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm
Length: 35mm
Material: aluminium
Application: BGA; FPGA
Width: 35mm
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Height: 25mm
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374924B00032G 374924B00032G%20Side.jpg
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374924B00032G 374924B00032G%20Side.jpg
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374924B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Application: BGA; FPGA
Height: 10mm
Length: 40mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Width: 40mm
Material: aluminium
Produkt ist nicht verfügbar
374924B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Application: BGA; FPGA
Height: 10mm
Length: 40mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Width: 40mm
Material: aluminium
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374924B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Application: BGA; FPGA
Height: 10mm
Length: 40mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Width: 40mm
Material: aluminium
Produkt ist nicht verfügbar
374924B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Application: BGA; FPGA
Height: 10mm
Length: 40mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Width: 40mm
Material: aluminium
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375024B00032G Aavid_Boyd_Board_Level_Heatsinks_Catalog-3043646.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Width: 40mm
Length: 40mm
Material: aluminium
Colour: black
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
375024B00032G Aavid_Boyd_Board_Level_Heatsinks_Catalog-3043646.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Width: 40mm
Length: 40mm
Material: aluminium
Colour: black
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375024B60024G
375024B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Width: 40mm
Length: 40mm
Material: aluminium
Colour: black
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
auf Bestellung 215 Stücke:
Lieferzeit 14-21 Tag (e)
Anzahl Preis ohne MwSt
6+12.47 EUR
7+ 10.6 EUR
96+ 10.44 EUR
Mindestbestellmenge: 6
375024B60024G
375024B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Width: 40mm
Length: 40mm
Material: aluminium
Colour: black
Height: 18mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
auf Bestellung 215 Stücke:
Lieferzeit 7-14 Tag (e)
Anzahl Preis ohne MwSt
6+12.47 EUR
7+ 10.6 EUR
96+ 10.44 EUR
216+ 10.31 EUR
Mindestbestellmenge: 6
375124B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
375124B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375124B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Colour: black
Length: 40mm
Application: BGA; FPGA
Material: aluminium
Width: 40mm
Height: 25mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
375124B60024G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 40mm; W: 40mm
Colour: black
Length: 40mm
Application: BGA; FPGA
Material: aluminium
Width: 40mm
Height: 25mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375224B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm
Colour: black
Height: 10.2mm
Length: 11.1mm
Width: 10.2mm
Type of heatsink: extruded
Application: BGA; FPGA
Heatsink shape: grilled
Material: aluminium
Material finishing: anodized
Produkt ist nicht verfügbar
375224B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 11.1mm; W: 10.2mm
Colour: black
Height: 10.2mm
Length: 11.1mm
Width: 10.2mm
Type of heatsink: extruded
Application: BGA; FPGA
Heatsink shape: grilled
Material: aluminium
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375324B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 10.2mm; W: 10.2mm
Width: 10.2mm
Length: 10.2mm
Colour: black
Material: aluminium
Application: BGA; FPGA
Height: 10.2mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
375324B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 10.2mm; W: 10.2mm
Width: 10.2mm
Length: 10.2mm
Colour: black
Material: aluminium
Application: BGA; FPGA
Height: 10.2mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375424B00034G Board-Level-Heatsinks_Cat.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 15.3mm; W: 15.2mm
Length: 15.3mm
Width: 15.2mm
Material: aluminium
Height: 6.35mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
375424B00034G Board-Level-Heatsinks_Cat.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 15.3mm; W: 15.2mm
Length: 15.3mm
Width: 15.2mm
Material: aluminium
Height: 6.35mm
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
375424B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
375424B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
500403B00000G Board-Level-Cooling-Basket-5000.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: die-cut; grilled; TO3; black; L: 45.97mm; W: 45.97mm
Width: 45.97mm
Height: 31.75mm
Application: TO3
Length: 45.97mm
Type of heatsink: die-cut
Heatsink shape: grilled
Material finishing: anodized
Colour: black
Material: aluminium
Produkt ist nicht verfügbar
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