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320205B00000G BOYD CORP Board-Level-Heatsinks_Cat.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; L: 12.7mm; W: 12.7mm; H: 6.35mm
Height: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Width: 12.7mm
Material: aluminium
Length: 12.7mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
321127B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: die-cut; round; TO5; black; L: 15.88mm; W: 15.88mm
Colour: black
Width: 15.88mm
Height: 12.45mm
Type of heatsink: die-cut
Heatsink shape: round
Material finishing: anodized
Material: aluminium
Length: 15.88mm
Application: TO5
Produkt ist nicht verfügbar
321127B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: die-cut; round; TO5; black; L: 15.88mm; W: 15.88mm
Colour: black
Width: 15.88mm
Height: 12.45mm
Type of heatsink: die-cut
Heatsink shape: round
Material finishing: anodized
Material: aluminium
Length: 15.88mm
Application: TO5
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
321527B00000G BOYD CORP Board-Level-Heatsinks_Cat.pdf Category: Heatsinks
Description: Heatsink: die-cut; round; TO39,TO5; black; L: 19.05mm; W: 19.05mm
Height: 12.7mm
Length: 19.05mm
Application: TO5; TO39
Type of heatsink: die-cut
Heatsink shape: round
Material finishing: anodized
Colour: black
Width: 19.05mm
Material: aluminium
Produkt ist nicht verfügbar
321527B00000G BOYD CORP Board-Level-Heatsinks_Cat.pdf Category: Heatsinks
Description: Heatsink: die-cut; round; TO39,TO5; black; L: 19.05mm; W: 19.05mm
Height: 12.7mm
Length: 19.05mm
Application: TO5; TO39
Type of heatsink: die-cut
Heatsink shape: round
Material finishing: anodized
Colour: black
Width: 19.05mm
Material: aluminium
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
322505B00000G BOYD CORP Aavid3200.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 19.05mm; W: 19.05mm
Type of heatsink: extruded
Heatsink shape: round
Application: TO5
Colour: black
Length: 19.05mm
Width: 19.05mm
Height: 10.16mm
Material: aluminium
Material finishing: anodized
Produkt ist nicht verfügbar
322505B00000G BOYD CORP Aavid3200.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 19.05mm; W: 19.05mm
Type of heatsink: extruded
Heatsink shape: round
Application: TO5
Colour: black
Length: 19.05mm
Width: 19.05mm
Height: 10.16mm
Material: aluminium
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
322605B00000G BOYD CORP Aavid3200.pdf 322605B00000G Heatsinks
Produkt ist nicht verfügbar
322805B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 22.23mm; W: 22.23mm
Length: 22.23mm
Width: 22.23mm
Height: 13.49mm
Material: aluminium
Colour: black
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Produkt ist nicht verfügbar
322805B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 22.23mm; W: 22.23mm
Length: 22.23mm
Width: 22.23mm
Height: 13.49mm
Material: aluminium
Colour: black
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
323005B00000G BOYD CORP Board-Level-Heatsinks_Cat.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 19.05mm; W: 19.05mm
Length: 19.05mm
Colour: black
Material: aluminium
Width: 19.05mm
Height: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Produkt ist nicht verfügbar
323005B00000G BOYD CORP Board-Level-Heatsinks_Cat.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 19.05mm; W: 19.05mm
Length: 19.05mm
Colour: black
Material: aluminium
Width: 19.05mm
Height: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
325705B00000G BOYD CORP Board-Level-Cooling-Extruded-Collar-3250.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Colour: black
Height: 6.35mm
Length: 12.7mm
Material: aluminium
Width: 12.7mm
Produkt ist nicht verfügbar
325705B00000G BOYD CORP Board-Level-Cooling-Extruded-Collar-3250.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Colour: black
Height: 6.35mm
Length: 12.7mm
Material: aluminium
Width: 12.7mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
325705R00000G BOYD CORP Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
325705R00000G BOYD CORP Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
326005B00000G BOYD CORP Board-Level-Cooling-Extruded-Collar-3250.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 9.52mm
Colour: black
Application: TO5
Material: aluminium
Width: 12.7mm
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Height: 9.52mm
Length: 12.7mm
Produkt ist nicht verfügbar
326005B00000G BOYD CORP Board-Level-Cooling-Extruded-Collar-3250.pdf Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 9.52mm
Colour: black
Application: TO5
Material: aluminium
Width: 12.7mm
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Height: 9.52mm
Length: 12.7mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
326005R00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 9.52mm
Colour: black
Application: TO5
Material: aluminium
Width: 12.7mm
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Height: 9.52mm
Length: 12.7mm
Produkt ist nicht verfügbar
326005R00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 9.52mm
Colour: black
Application: TO5
Material: aluminium
Width: 12.7mm
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Height: 9.52mm
Length: 12.7mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
335224B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Material: aluminium
Length: 25.02mm
Colour: black
Width: 25.02mm
Height: 9.91mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
335224B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Material: aluminium
Length: 25.02mm
Colour: black
Width: 25.02mm
Height: 9.91mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
335224B00034G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Material: aluminium
Length: 25.02mm
Colour: black
Width: 25.02mm
Height: 9.91mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
335224B00034G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Material: aluminium
Length: 25.02mm
Colour: black
Width: 25.02mm
Height: 9.91mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
335824B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
335824B00000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
341900F00000G BOYD CORP Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Category: Heatsinks
Description: Heatsink: die-cut; PCl/AGP Chip Sets; L: 19.1mm; W: 76.2mm; H: 330um
Application: PCl/AGP Chip Sets
Height: 330µm
Length: 19.1mm
Material: copper
Width: 76.2mm
Type of heatsink: die-cut
Produkt ist nicht verfügbar
341900F00000G BOYD CORP Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Category: Heatsinks
Description: Heatsink: die-cut; PCl/AGP Chip Sets; L: 19.1mm; W: 76.2mm; H: 330um
Application: PCl/AGP Chip Sets
Height: 330µm
Length: 19.1mm
Material: copper
Width: 76.2mm
Type of heatsink: die-cut
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342940 BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 37.58mm; W: 38.5mm; H: 14mm; copper
Type of heatsink: attachable
Length: 37.58mm
Width: 38.5mm
Heatsink shape: grilled
Height: 14mm
Material: copper
Produkt ist nicht verfügbar
342940 BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 37.58mm; W: 38.5mm; H: 14mm; copper
Type of heatsink: attachable
Length: 37.58mm
Width: 38.5mm
Heatsink shape: grilled
Height: 14mm
Material: copper
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342943 BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 50mm; W: 50mm; H: 14mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 50mm
Width: 50mm
Height: 14mm
Material: copper
Produkt ist nicht verfügbar
342943 BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 50mm; W: 50mm; H: 14mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 50mm
Width: 50mm
Height: 14mm
Material: copper
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342946 BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 60mm; W: 60mm; H: 22mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 60mm
Width: 60mm
Height: 22mm
Material: copper
Produkt ist nicht verfügbar
342946 BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 60mm; W: 60mm; H: 22mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 60mm
Width: 60mm
Height: 22mm
Material: copper
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342949 BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 80mm; W: 80mm; H: 12mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 80mm
Width: 80mm
Height: 12mm
Material: copper
Produkt ist nicht verfügbar
342949 BOYD CORP Board-Level-Cooling-Square-Skived-Fin.pdf Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 80mm; W: 80mm; H: 12mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 80mm
Width: 80mm
Height: 12mm
Material: copper
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
364424B00032G BOYD CORP 364424B00032G_Web.pdf 364424B00032G Heatsinks
Produkt ist nicht verfügbar
371824B00032G BOYD CORP 371824B00034G%20Side.jpg Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm; H: 7mm
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA; FPGA
Colour: black
Length: 35mm
Width: 35mm
Height: 7mm
Material: aluminium
Material finishing: anodized
Produkt ist nicht verfügbar
371824B00032G BOYD CORP 371824B00034G%20Side.jpg Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm; H: 7mm
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA; FPGA
Colour: black
Length: 35mm
Width: 35mm
Height: 7mm
Material: aluminium
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
371924B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 13.97mm
Application: BGA
Colour: black
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Material: aluminium
Height: 13.97mm
Length: 35mm
Produkt ist nicht verfügbar
371924B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 13.97mm
Application: BGA
Colour: black
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Material: aluminium
Height: 13.97mm
Length: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
372024B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; BGA,FPGA; L: 35mm; W: 35mm; H: 27.9mm; aluminium
Application: BGA; FPGA
Material: aluminium
Height: 27.9mm
Length: 35mm
Type of heatsink: extruded
Width: 35mm
Produkt ist nicht verfügbar
372024B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; BGA,FPGA; L: 35mm; W: 35mm; H: 27.9mm; aluminium
Application: BGA; FPGA
Material: aluminium
Height: 27.9mm
Length: 35mm
Type of heatsink: extruded
Width: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
372024B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
372024B00035G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
372924M02000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; green; L: 37.4mm; W: 37.4mm
Material: aluminium
Length: 37.4mm
Width: 37.4mm
Height: 6mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: green
Produkt ist nicht verfügbar
372924M02000G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; green; L: 37.4mm; W: 37.4mm
Material: aluminium
Length: 37.4mm
Width: 37.4mm
Height: 6mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: green
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
373024B00034G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
373024B00034G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
373324M00000G BOYD CORP 373324M00000G Heatsinks
Produkt ist nicht verfügbar
374024B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374024B00032G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374024B00035G BOYD CORP Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Length: 23mm
Width: 23mm
Height: 10mm
Material: aluminium
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
374024B00035G BOYD CORP Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Length: 23mm
Width: 23mm
Height: 10mm
Material: aluminium
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374024B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374024B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374124B00035G BOYD CORP Boyd-Board-Level-Cooling-3741.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Application: BGA; FPGA
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
374124B00035G BOYD CORP Boyd-Board-Level-Cooling-3741.pdf Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Application: BGA; FPGA
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374124B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Application: BGA; FPGA
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
374124B60023G BOYD CORP Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Application: BGA; FPGA
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
320205B00000G Board-Level-Heatsinks_Cat.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; L: 12.7mm; W: 12.7mm; H: 6.35mm
Height: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Width: 12.7mm
Material: aluminium
Length: 12.7mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
321127B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: die-cut; round; TO5; black; L: 15.88mm; W: 15.88mm
Colour: black
Width: 15.88mm
Height: 12.45mm
Type of heatsink: die-cut
Heatsink shape: round
Material finishing: anodized
Material: aluminium
Length: 15.88mm
Application: TO5
Produkt ist nicht verfügbar
321127B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: die-cut; round; TO5; black; L: 15.88mm; W: 15.88mm
Colour: black
Width: 15.88mm
Height: 12.45mm
Type of heatsink: die-cut
Heatsink shape: round
Material finishing: anodized
Material: aluminium
Length: 15.88mm
Application: TO5
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
321527B00000G Board-Level-Heatsinks_Cat.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: die-cut; round; TO39,TO5; black; L: 19.05mm; W: 19.05mm
Height: 12.7mm
Length: 19.05mm
Application: TO5; TO39
Type of heatsink: die-cut
Heatsink shape: round
Material finishing: anodized
Colour: black
Width: 19.05mm
Material: aluminium
Produkt ist nicht verfügbar
321527B00000G Board-Level-Heatsinks_Cat.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: die-cut; round; TO39,TO5; black; L: 19.05mm; W: 19.05mm
Height: 12.7mm
Length: 19.05mm
Application: TO5; TO39
Type of heatsink: die-cut
Heatsink shape: round
Material finishing: anodized
Colour: black
Width: 19.05mm
Material: aluminium
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
322505B00000G Aavid3200.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 19.05mm; W: 19.05mm
Type of heatsink: extruded
Heatsink shape: round
Application: TO5
Colour: black
Length: 19.05mm
Width: 19.05mm
Height: 10.16mm
Material: aluminium
Material finishing: anodized
Produkt ist nicht verfügbar
322505B00000G Aavid3200.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 19.05mm; W: 19.05mm
Type of heatsink: extruded
Heatsink shape: round
Application: TO5
Colour: black
Length: 19.05mm
Width: 19.05mm
Height: 10.16mm
Material: aluminium
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
322605B00000G Aavid3200.pdf
Hersteller: BOYD CORP
322605B00000G Heatsinks
Produkt ist nicht verfügbar
322805B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 22.23mm; W: 22.23mm
Length: 22.23mm
Width: 22.23mm
Height: 13.49mm
Material: aluminium
Colour: black
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Produkt ist nicht verfügbar
322805B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 22.23mm; W: 22.23mm
Length: 22.23mm
Width: 22.23mm
Height: 13.49mm
Material: aluminium
Colour: black
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
323005B00000G Board-Level-Heatsinks_Cat.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 19.05mm; W: 19.05mm
Length: 19.05mm
Colour: black
Material: aluminium
Width: 19.05mm
Height: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Produkt ist nicht verfügbar
323005B00000G Board-Level-Heatsinks_Cat.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 19.05mm; W: 19.05mm
Length: 19.05mm
Colour: black
Material: aluminium
Width: 19.05mm
Height: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
325705B00000G Board-Level-Cooling-Extruded-Collar-3250.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Colour: black
Height: 6.35mm
Length: 12.7mm
Material: aluminium
Width: 12.7mm
Produkt ist nicht verfügbar
325705B00000G Board-Level-Cooling-Extruded-Collar-3250.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 6.35mm
Application: TO5
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Colour: black
Height: 6.35mm
Length: 12.7mm
Material: aluminium
Width: 12.7mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
325705R00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
325705R00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
326005B00000G Board-Level-Cooling-Extruded-Collar-3250.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 9.52mm
Colour: black
Application: TO5
Material: aluminium
Width: 12.7mm
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Height: 9.52mm
Length: 12.7mm
Produkt ist nicht verfügbar
326005B00000G Board-Level-Cooling-Extruded-Collar-3250.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 9.52mm
Colour: black
Application: TO5
Material: aluminium
Width: 12.7mm
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Height: 9.52mm
Length: 12.7mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
326005R00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 9.52mm
Colour: black
Application: TO5
Material: aluminium
Width: 12.7mm
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Height: 9.52mm
Length: 12.7mm
Produkt ist nicht verfügbar
326005R00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; round; TO5; black; L: 12.7mm; W: 12.7mm; H: 9.52mm
Colour: black
Application: TO5
Material: aluminium
Width: 12.7mm
Type of heatsink: extruded
Heatsink shape: round
Material finishing: anodized
Height: 9.52mm
Length: 12.7mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
335224B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Material: aluminium
Length: 25.02mm
Colour: black
Width: 25.02mm
Height: 9.91mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
335224B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Material: aluminium
Length: 25.02mm
Colour: black
Width: 25.02mm
Height: 9.91mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
335224B00034G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Material: aluminium
Length: 25.02mm
Colour: black
Width: 25.02mm
Height: 9.91mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
335224B00034G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 25.02mm; W: 25.02mm
Material: aluminium
Length: 25.02mm
Colour: black
Width: 25.02mm
Height: 9.91mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
335824B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
335824B00000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
341900F00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: die-cut; PCl/AGP Chip Sets; L: 19.1mm; W: 76.2mm; H: 330um
Application: PCl/AGP Chip Sets
Height: 330µm
Length: 19.1mm
Material: copper
Width: 76.2mm
Type of heatsink: die-cut
Produkt ist nicht verfügbar
341900F00000G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: die-cut; PCl/AGP Chip Sets; L: 19.1mm; W: 76.2mm; H: 330um
Application: PCl/AGP Chip Sets
Height: 330µm
Length: 19.1mm
Material: copper
Width: 76.2mm
Type of heatsink: die-cut
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342940 Board-Level-Cooling-Square-Skived-Fin.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 37.58mm; W: 38.5mm; H: 14mm; copper
Type of heatsink: attachable
Length: 37.58mm
Width: 38.5mm
Heatsink shape: grilled
Height: 14mm
Material: copper
Produkt ist nicht verfügbar
342940 Board-Level-Cooling-Square-Skived-Fin.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 37.58mm; W: 38.5mm; H: 14mm; copper
Type of heatsink: attachable
Length: 37.58mm
Width: 38.5mm
Heatsink shape: grilled
Height: 14mm
Material: copper
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342943 Board-Level-Cooling-Square-Skived-Fin.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 50mm; W: 50mm; H: 14mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 50mm
Width: 50mm
Height: 14mm
Material: copper
Produkt ist nicht verfügbar
342943 Board-Level-Cooling-Square-Skived-Fin.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 50mm; W: 50mm; H: 14mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 50mm
Width: 50mm
Height: 14mm
Material: copper
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342946 Board-Level-Cooling-Square-Skived-Fin.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 60mm; W: 60mm; H: 22mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 60mm
Width: 60mm
Height: 22mm
Material: copper
Produkt ist nicht verfügbar
342946 Board-Level-Cooling-Square-Skived-Fin.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 60mm; W: 60mm; H: 22mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 60mm
Width: 60mm
Height: 22mm
Material: copper
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
342949 Board-Level-Cooling-Square-Skived-Fin.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 80mm; W: 80mm; H: 12mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 80mm
Width: 80mm
Height: 12mm
Material: copper
Produkt ist nicht verfügbar
342949 Board-Level-Cooling-Square-Skived-Fin.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: attachable; grilled; L: 80mm; W: 80mm; H: 12mm; copper
Type of heatsink: attachable
Heatsink shape: grilled
Length: 80mm
Width: 80mm
Height: 12mm
Material: copper
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
364424B00032G 364424B00032G_Web.pdf
Hersteller: BOYD CORP
364424B00032G Heatsinks
Produkt ist nicht verfügbar
371824B00032G 371824B00034G%20Side.jpg
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm; H: 7mm
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA; FPGA
Colour: black
Length: 35mm
Width: 35mm
Height: 7mm
Material: aluminium
Material finishing: anodized
Produkt ist nicht verfügbar
371824B00032G 371824B00034G%20Side.jpg
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 35mm; W: 35mm; H: 7mm
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA; FPGA
Colour: black
Length: 35mm
Width: 35mm
Height: 7mm
Material: aluminium
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
371924B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 13.97mm
Application: BGA
Colour: black
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Material: aluminium
Height: 13.97mm
Length: 35mm
Produkt ist nicht verfügbar
371924B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 35mm; W: 35mm; H: 13.97mm
Application: BGA
Colour: black
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Width: 35mm
Material: aluminium
Height: 13.97mm
Length: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
372024B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; BGA,FPGA; L: 35mm; W: 35mm; H: 27.9mm; aluminium
Application: BGA; FPGA
Material: aluminium
Height: 27.9mm
Length: 35mm
Type of heatsink: extruded
Width: 35mm
Produkt ist nicht verfügbar
372024B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; BGA,FPGA; L: 35mm; W: 35mm; H: 27.9mm; aluminium
Application: BGA; FPGA
Material: aluminium
Height: 27.9mm
Length: 35mm
Type of heatsink: extruded
Width: 35mm
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
372024B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
372024B00035G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
372924M02000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; green; L: 37.4mm; W: 37.4mm
Material: aluminium
Length: 37.4mm
Width: 37.4mm
Height: 6mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: green
Produkt ist nicht verfügbar
372924M02000G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; green; L: 37.4mm; W: 37.4mm
Material: aluminium
Length: 37.4mm
Width: 37.4mm
Height: 6mm
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Colour: green
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
373024B00034G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
373024B00034G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
373324M00000G
Hersteller: BOYD CORP
373324M00000G Heatsinks
Produkt ist nicht verfügbar
374024B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374024B00032G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374024B00035G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Length: 23mm
Width: 23mm
Height: 10mm
Material: aluminium
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
374024B00035G Boyd-Guide-to-Heat-Sink-Fabrications-2020-Technical-Paper.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Length: 23mm
Width: 23mm
Height: 10mm
Material: aluminium
Colour: black
Application: BGA; FPGA
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374024B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Produkt ist nicht verfügbar
374024B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded
Type of heatsink: extruded
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374124B00035G Boyd-Board-Level-Cooling-3741.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Application: BGA; FPGA
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
374124B00035G Boyd-Board-Level-Cooling-3741.pdf
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Application: BGA; FPGA
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
374124B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Application: BGA; FPGA
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Produkt ist nicht verfügbar
374124B60023G
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA,FPGA; black; L: 23mm; W: 23mm
Colour: black
Application: BGA; FPGA
Width: 23mm
Material: aluminium
Height: 18mm
Length: 23mm
Type of heatsink: extruded
Heatsink shape: grilled
Material finishing: anodized
Anzahl je Verpackung: 1 Stücke
Produkt ist nicht verfügbar
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