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CY7C1165KV18-400BZXC CY7C1165KV18-400BZXC Infineon Technologies Infineon-CY7C1163KV18_CY7C1165KV18_18-Mbit_QDR_II+_SRAM_Four-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1f05636ce&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Bulk
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C1168V18-400BZXC CY7C1168V18-400BZXC Infineon Technologies Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
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CY7C1170V18-400BZXC CY7C1170V18-400BZXC Infineon Technologies CY7C116x,117xV18_8.pdf Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C11481KV18-400BZXC CY7C11481KV18-400BZXC Infineon Technologies CY7C11461,11481,11571,11501KV18.pdf Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
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CY7C1150KV18-400BZXC CY7C1150KV18-400BZXC Infineon Technologies Infineon-CY7C1148KV18_CY7C1150KV18_18-Mbit_DDR_II+_SRAM_Two-Word_Burst_Architecture_(2.0_Cycle_Read_Latency)-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebdb2e93084&utm_source=cypress&utm_medium=referral&utm_campaign= Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C1165V18-400BZXC CY7C1165V18-400BZXC Infineon Technologies CY7C11(61,63,65,76)V18_8.pdf Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C1170KV18-400BZXC CY7C1170KV18-400BZXC Infineon Technologies CY7C11(68,70)KV18.pdf Description: IC SRAM 18MBIT PARALLEL 165FBGA
Memory Format: SRAM
Clock Frequency: 400 MHz
Technology: SRAM - Synchronous, DDR II+
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Volatile
Memory Size: 18Mbit
Mounting Type: Surface Mount
Package / Case: 165-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 512K x 36
Memory Interface: Parallel
Part Status: Obsolete
Supplier Device Package: 165-FBGA (13x15)
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CY22388ZXC-11 CY22388ZXC-11 Infineon Technologies CY22388,89,91.pdf Description: IC CLOCK GEN PROG 16TSSOP
Packaging: Tube
Part Status: Obsolete
DigiKey Programmable: Not Verified
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CY7C1145LV18-400BZXC CY7C1145LV18-400BZXC Infineon Technologies Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY7C1145KV18-400BZXCT CY7C1145KV18-400BZXCT Infineon Technologies Infineon-CY7C1143KV18_CY7C1145KV18_18-Mbit_QDR_II+_SRAM_Four-Word_Burst_Architecture_(2.0_Cycle_Read_Latency)-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1f8f936d7&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TLE49615MXTSA1 TLE49615MXTSA1 Infineon Technologies Infineon-TLE4961_5M-DS-v01_00-en.pdf?fileId=db3a30433fe811c7013ff1eb97b65ec9 Description: MAG SWITCH IC HALL EFF SOT23-3
Test Condition: 25°C
Supplier Device Package: PG-SOT23-3-15
Current - Supply (Max): 2.5mA
Current - Output (Max): 25mA
Sensing Range: 19.8mT Trip, -19.8mT Release
Technology: Hall Effect
Voltage - Supply: 3V ~ 32V
Operating Temperature: -40°C ~ 170°C
Function: Latch
Mounting Type: Surface Mount
Polarization: South Pole
Output Type: Open Drain
Package / Case: TO-236-3, SC-59, SOT-23-3
Features: Temperature Compensated
Part Status: Active
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE49615MXTSA1 TLE49615MXTSA1 Infineon Technologies Infineon-TLE4961_5M-DS-v01_00-en.pdf?fileId=db3a30433fe811c7013ff1eb97b65ec9 Description: MAG SWITCH IC HALL EFF SOT23-3
Test Condition: 25°C
Supplier Device Package: PG-SOT23-3-15
Current - Supply (Max): 2.5mA
Current - Output (Max): 25mA
Sensing Range: 19.8mT Trip, -19.8mT Release
Technology: Hall Effect
Voltage - Supply: 3V ~ 32V
Operating Temperature: -40°C ~ 170°C
Function: Latch
Mounting Type: Surface Mount
Polarization: South Pole
Output Type: Open Drain
Package / Case: TO-236-3, SC-59, SOT-23-3
Features: Temperature Compensated
Part Status: Active
Packaging: Cut Tape (CT)
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26+0.81 EUR
28+0.75 EUR
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500+0.62 EUR
1000+0.58 EUR
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XMC1302T016X0008ABXUMA1 XMC1302T016X0008ABXUMA1 Infineon Technologies infineon-xmc1300-ab-datasheet-en.pdf Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 11x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-8
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
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XMC1301T038F0064ABXUMA1 XMC1301T038F0064ABXUMA1 Infineon Technologies infineon-xmc1300-ab-datasheet-en.pdf Description: IC MCU 32BIT 64KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-9
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
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IRS2807DSTRPBF IRS2807DSTRPBF Infineon Technologies Infineon-Infineon-IRS28x7DS-DS-v01_00-EN-DS-v01_01-EN.pdf?fileId=5546d462602a9dc801604a3dcbd308af Description: IC GATE DRVR HI/LOW SIDE 8SOIC
DigiKey Programmable: Not Verified
Part Status: Active
Current - Peak Output (Source, Sink): 200mA, 350mA
Logic Voltage - VIL, VIH: 0.8V, 2.2V
Gate Type: IGBT, N-Channel MOSFET
Number of Drivers: 2
Driven Configuration: High-Side or Low-Side
Channel Type: Synchronous
Rise / Fall Time (Typ): 150ns, 50ns
Supplier Device Package: PG-DSO-8-903
High Side Voltage - Max (Bootstrap): 600 V
Input Type: Non-Inverting
Voltage - Supply: 10V ~ 20V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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IRS2807DSTRPBF IRS2807DSTRPBF Infineon Technologies Infineon-Infineon-IRS28x7DS-DS-v01_00-EN-DS-v01_01-EN.pdf?fileId=5546d462602a9dc801604a3dcbd308af Description: IC GATE DRVR HI/LOW SIDE 8SOIC
Logic Voltage - VIL, VIH: 0.8V, 2.2V
Gate Type: IGBT, N-Channel MOSFET
Number of Drivers: 2
Driven Configuration: High-Side or Low-Side
Channel Type: Synchronous
Rise / Fall Time (Typ): 150ns, 50ns
Supplier Device Package: PG-DSO-8-903
High Side Voltage - Max (Bootstrap): 600 V
Input Type: Non-Inverting
Voltage - Supply: 10V ~ 20V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Current - Peak Output (Source, Sink): 200mA, 350mA
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IPP100N08N3GXKSA1 IPP100N08N3GXKSA1 Infineon Technologies IPP_I_B100N08N3_Rev2.0.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431ddc9372011e071f53b82619 Description: MOSFET N-CH 80V 70A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 46A, 10V
Power Dissipation (Max): 100W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 46µA
Supplier Device Package: PG-TO220-3
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 35 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2410 pF @ 40 V
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CY15V116QSN-108BKXI CY15V116QSN-108BKXI Infineon Technologies Infineon-CY15B116QSN-108BKXIE-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea5be97353&utm_source=n403&utm_medium=email&utm_campaign=202208_glob_en_atv_ATV.P.RAMMemory&utm_content=e1_ Description: IC FRAM 16MBIT SPI/QUAD 24FBGA
DigiKey Programmable: Not Verified
Memory Organization: 2M x 8
Access Time: 6.7 ns
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 24-FBGA (6x8)
Memory Format: FRAM
Clock Frequency: 108 MHz
Technology: FRAM (Ferroelectric RAM)
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
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50+49.85 EUR
100+48.6 EUR
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IPW80R280P7XKSA1 IPW80R280P7XKSA1 Infineon Technologies Infineon-IPW80R280P7-DS-v02_00-EN.pdf?fileId=5546d46255dd933d0155e96482cb07dc Description: MOSFET N-CH 800V 17A TO247-3
Input Capacitance (Ciss) (Max) @ Vds: 1200 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 36 nC @ 10 V
Drain to Source Voltage (Vdss): 800 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: PG-TO247-3-41
Vgs(th) (Max) @ Id: 3.5V @ 360µA
Power Dissipation (Max): 101W (Tc)
Rds On (Max) @ Id, Vgs: 280mOhm @ 7.2A, 10V
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
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98-0176PBF Infineon Technologies Description: IC GATE DRIVER HALF BRIDGE 64MQF
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPP051N15N5AKSA1 IPP051N15N5AKSA1 Infineon Technologies Infineon-IPP051N15N5-DS-v02_00-EN.pdf?fileId=5546d46253f650570154a0437e3754cb Description: MOSFET N-CH 150V 120A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 7800 pF @ 75 V
Gate Charge (Qg) (Max) @ Vgs: 100 nC @ 10 V
Drain to Source Voltage (Vdss): 150 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Part Status: Active
Supplier Device Package: PG-TO220-3
Vgs(th) (Max) @ Id: 4.6V @ 264µA
Power Dissipation (Max): 300mW (Tc)
Rds On (Max) @ Id, Vgs: 5.1mOhm @ 60A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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IDH09SG60CXKSA2 IDH09SG60CXKSA2 Infineon Technologies Infineon-IDH09SG60C-DS-v02_03-en.pdf?fileId=db3a30431ff98815012047f4e80f2cff Description: DIODE SIL CARB 600V 9A TO220-2-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 280pF @ 1V, 1MHz
Current - Average Rectified (Io): 9A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Last Time Buy
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 9 A
Current - Reverse Leakage @ Vr: 80 µA @ 600 V
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CY7C199D-25SXE CY7C199D-25SXE Infineon Technologies Infineon-CY7C199D_256-Kbit_(32_K_8)_Static_RAM-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebf20333330 Description: IC SRAM 256K PARALLEL 28SOIC
DigiKey Programmable: Not Verified
Memory Organization: 32K x 8
Access Time: 25 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 25ns
Part Status: Obsolete
Supplier Device Package: 28-SOIC
Memory Format: SRAM
Technology: SRAM - Asynchronous
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Volatile
Memory Size: 256Kbit
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
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CY7C199D-10ZXI CY7C199D-10ZXI Infineon Technologies Infineon-CY7C199D_256-Kbit_(32_K_8)_Static_RAM-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebf20333330&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 256KBIT PAR 28TSOP I
Access Time: 10 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 10ns
Part Status: Obsolete
Supplier Device Package: 28-TSOP I
Memory Format: SRAM
Technology: SRAM - Asynchronous
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 256Kbit
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 32K x 8
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D1131SH65TXPSA1 D1131SH65TXPSA1 Infineon Technologies Infineon-D1131SH-DS-v8_0-en_de.pdf?fileId=db3a304412b407950112b43188ed54a8 Description: DIODE STANDARD 6500V 1100A
Packaging: Tray
Package / Case: DO-200AE
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 1100A
Operating Temperature - Junction: 0°C ~ 140°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 6500 V
Voltage - Forward (Vf) (Max) @ If: 5.6 V @ 2500 A
Current - Reverse Leakage @ Vr: 150 mA @ 6500 V
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DD600S65K3NOSA1 Infineon Technologies Description: DIODE MODULE GP 6500V AIHV130-6
Current - Reverse Leakage @ Vr: 900 A @ 3600 V
Voltage - Forward (Vf) (Max) @ If: 3.5 V @ 600 A
Voltage - DC Reverse (Vr) (Max): 6500 V
Part Status: Active
Operating Temperature - Junction: -50°C ~ 125°C
Supplier Device Package: A-IHV130-6
Diode Configuration: 2 Independent
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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FD1200R17HP4KB2BOSA2 FD1200R17HP4KB2BOSA2 Infineon Technologies Infineon-FD1200R17HP4-K_B2-DS-v03_01-EN.pdf?fileId=5546d462525dbac401527e2a7ee26b29 Description: IGBT MOD 1700V 1200A AGIHVB130-3
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 1.2kA
NTC Thermistor: No
Supplier Device Package: AG-IHVB130-3
Part Status: Active
Current - Collector (Ic) (Max): 1200 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 6500 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 97.5 nF @ 25 V
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CY8C26643-24AI CY8C26643-24AI Infineon Technologies CY8C25122%2C26233%2C26443%2C26643.pdf Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Bag
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
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CYAT81652-100AS48 Infineon Technologies Infineon-CYAT81650-100AA48-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837e917f1c0b4b Description: PSOC BASED - TRUETOUCH
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Part Status: Active
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CYAT81652-100AA48T Infineon Technologies Infineon-CYAT81650-100AA48-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837e917f1c0b4b Description: PSOC BASED - TRUETOUCH
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Part Status: Active
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CYAT81652-100AS48T Infineon Technologies Infineon-CYAT81650-100AA48-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837e917f1c0b4b Description: PSOC BASED - TRUETOUCH
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Part Status: Active
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CYAT81652-100AA48 Infineon Technologies Infineon-CYAT81650-100AA48-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837e917f1c0b4b Description: PSOC BASED - TRUETOUCH
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Part Status: Active
Produkt ist nicht verfügbar
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DZ600N12KHPSA1 DZ600N12KHPSA1 Infineon Technologies Infineon-DZ600N-DS-v01_00-en_de.pdf?fileId=db3a304412b407950112b431311153cd Description: DIODE STANDARD 1200V 735A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 735A
Supplier Device Package: Module
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 2200 A
Current - Reverse Leakage @ Vr: 40 mA @ 1200 V
Produkt ist nicht verfügbar
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DZ600N14KHQSA2 DZ600N14KHQSA2 Infineon Technologies DZ600N_v01_5-6-03.pdf Description: DIODE GP 1.4KV 735A PB501-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 735A
Supplier Device Package: BG-PB501-1
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1400 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 2200 A
Current - Reverse Leakage @ Vr: 40 mA @ 1400 V
Produkt ist nicht verfügbar
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DZ600N16KB01HPSA1 DZ600N16KB01HPSA1 Infineon Technologies DZ600N_v01_5-6-03.pdf Description: DIODE GP 1.8KV 735A PB501-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 735A
Supplier Device Package: BG-PB501-1
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1800 V
Current - Reverse Leakage @ Vr: 40 mA @ 1800 V
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C164SL6RMCAKXUMA7 Infineon Technologies Description: IC MCU 16BIT 48KB MROM 80MQFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: C166
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-80-7
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
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CY7C433-10JXC CY7C433-10JXC Infineon Technologies CY7C4xx_RevB.pdf Description: IC FIFO ASYNC 4KX9 10NS 32PLCC
DigiKey Programmable: Not Verified
Voltage - Supply: 4.5 V ~ 5.5 V
Part Status: Obsolete
FWFT Support: No
Retransmit Capability: Yes
Programmable Flags Support: No
Expansion Type: Depth, Width
Bus Directional: Uni-Directional
Supplier Device Package: 32-PLCC (11.43x13.97)
Current - Supply (Max): 85mA
Access Time: 10ns
Data Rate: 50MHz
Operating Temperature: 0°C ~ 70°C
Memory Size: 36K (4K x 9)
Function: Asynchronous
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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XDPE152C4D0000XUMA1 XDPE152C4D0000XUMA1 Infineon Technologies Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc Description: IFX PRIMARION CNTRLLER
Part Status: Active
Supplier Device Package: PG-VQFN-48-63
Applications: Controller, Intel VR13
Voltage - Input: 0.25V ~ 12V
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 0.25V ~ 3.04V
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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XDPE152C4D0000XUMA1 XDPE152C4D0000XUMA1 Infineon Technologies Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc Description: IFX PRIMARION CNTRLLER
Applications: Controller, Intel VR13
Voltage - Input: 0.25V ~ 12V
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 0.25V ~ 3.04V
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: PG-VQFN-48-63
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25+8.96 EUR
100+8.16 EUR
250+7.78 EUR
500+7.54 EUR
1000+7.37 EUR
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MB91F575BHSPMC-GSK5E1 MB91F575BHSPMC-GSK5E1 Infineon Technologies download Description: IC MCU 32BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F575BHSPMC-GSE1 CY91F575BHSPMC-GSE1 Infineon Technologies download Description: IC MCU 32BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F575BPMC-GSE2 CY91F575BPMC-GSE2 Infineon Technologies download Description: IC MCU 32BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB91F577BHPMC-GSK5E1 MB91F577BHPMC-GSK5E1 Infineon Technologies download Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB91F577BHPMC-GSK5E2 MB91F577BHPMC-GSK5E2 Infineon Technologies Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB91F579CMPMC-GSK5E2 MB91F579CMPMC-GSK5E2 Infineon Technologies Description: IC MCU 32B 2.0625MB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Obsolete
Number of I/O: 159
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F577BHSPMC1-GSE1 CY91F577BHSPMC1-GSE1 Infineon Technologies download Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (16x16)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F577BHSPMC-GSE1 CY91F577BHSPMC-GSE1 Infineon Technologies download Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F577BHPMC-GS-F4E1 CY91F577BHPMC-GS-F4E1 Infineon Technologies download Description: ICU MCU FLASH
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB91F579CHSPMC-GSK5E1 MB91F579CHSPMC-GSK5E1 Infineon Technologies Description: IC MCU 32B 2.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 60 Stücke
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CY91F577BPMC-GSE2 CY91F577BPMC-GSE2 Infineon Technologies download Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 600 Stücke
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MB91F575BPMC-GSK5E2 MB91F575BPMC-GSK5E2 Infineon Technologies Description: IC MCU 32BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 60 Stücke
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CY91F579CMPMC-GSE2 CY91F579CMPMC-GSE2 Infineon Technologies download Description: IC MCU 32B 2.0625MB FLSH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 159
Part Status: Last Time Buy
Supplier Device Package: 208-LQFP (28x28)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Processor: FR81S
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 2.0625MB (2.0625M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB91F575BHPMC-GSK5E2 MB91F575BHPMC-GSK5E2 Infineon Technologies Description: IC MCU 32BIT 576KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Processor: FR81S
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 576KB (576K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY91F579CHSPMC-GSE1 CY91F579CHSPMC-GSE1 Infineon Technologies download Description: IC MCU 32B 2.0625MB FLSH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Last Time Buy
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Processor: FR81S
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 2.0625MB (2.0625M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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IPB240N04S41R0ATMA1 IPB240N04S41R0ATMA1 Infineon Technologies Infineon-IPB240N04S4-1R0-DS-v01_00-EN.pdf?fileId=5546d46249a28d750149a3ce59740632 Description: MOSFET N-CH 40V 240A TO263-7
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 240A (Tc)
Rds On (Max) @ Id, Vgs: 1mOhm @ 100A, 10V
Power Dissipation (Max): 231W (Tc)
Vgs(th) (Max) @ Id: 4V @ 180µA
Supplier Device Package: PG-TO263-7-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 221 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 17682 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IPB240N04S41R0ATMA1 IPB240N04S41R0ATMA1 Infineon Technologies Infineon-IPB240N04S4-1R0-DS-v01_00-EN.pdf?fileId=5546d46249a28d750149a3ce59740632 Description: MOSFET N-CH 40V 240A TO263-7
Packaging: Cut Tape (CT)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 240A (Tc)
Rds On (Max) @ Id, Vgs: 1mOhm @ 100A, 10V
Power Dissipation (Max): 231W (Tc)
Vgs(th) (Max) @ Id: 4V @ 180µA
Supplier Device Package: PG-TO263-7-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 221 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 17682 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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10+5.82 EUR
100+4.12 EUR
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TLE7230RNUMA1 Infineon Technologies Description: IC PWR SWITCH N-CHAN 1:8 DSO-36
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: PG-DSO-36-47
Ratio - Input:Output: 1:8
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 4.5V ~ 5.5V
Rds On (Typ): 800mOhm
Output Configuration: Low Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 8
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Features: Status Flag
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CYBT-223058-02 Infineon Technologies Description: BTBLE-OTHERS
Part Status: Active
Serial Interfaces: I²C, I²S, PCM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: GFSK
Utilized IC / Part: CYW20819
Antenna Type: Integrated, Chip
Current - Transmitting: 5.8mA
Current - Receiving: 5.9mA
Protocol: Bluetooth v5.0 + EDR
Data Rate: 2Mbps
Power - Output: 4dBm
Voltage - Supply: 1.71V ~ 3.3V
Operating Temperature: -30°C ~ 85°C
Memory Size: 256kB Flash, 176kB RAM
Frequency: 2.4GHz ~ 2.5GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 35-SMD Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BCR108E6433HTMA1 BCR108E6433HTMA1 Infineon Technologies bcr108series.pdf?folderId=db3a30431400ef68011406f3ddb1012e&fileId=db3a30431428a37301143a27e5a401ce Description: TRANS PREBIAS NPN 50V SOT23
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 2.2 kOhms
Frequency - Transition: 170 MHz
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Last Time Buy
Supplier Device Package: PG-SOT23
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 5mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BCR 108 B6327 BCR 108 B6327 Infineon Technologies bcr108series.pdf?folderId=db3a30431400ef68011406f3ddb1012e&fileId=db3a30431428a37301143a27e5a401ce Description: TRANS PREBIAS NPN 50V SOT23
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 2.2 kOhms
Frequency - Transition: 170 MHz
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: PG-SOT23
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 5mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 30000 Stücke
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CY7C1165KV18-400BZXC Infineon-CY7C1163KV18_CY7C1165KV18_18-Mbit_QDR_II+_SRAM_Four-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1f05636ce&utm_source=cypress&utm_medium=referral&utm_campaign
CY7C1165KV18-400BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Bulk
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
9+71.79 EUR
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CY7C1168V18-400BZXC
CY7C1168V18-400BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1170V18-400BZXC CY7C116x,117xV18_8.pdf
CY7C1170V18-400BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 443 Stücke:
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AnzahlPrivatkunde
9+76.05 EUR
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CY7C11481KV18-400BZXC CY7C11461,11481,11571,11501KV18.pdf
CY7C11481KV18-400BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
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AnzahlPrivatkunde
8+84.47 EUR
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CY7C1150KV18-400BZXC Infineon-CY7C1148KV18_CY7C1150KV18_18-Mbit_DDR_II+_SRAM_Two-Word_Burst_Architecture_(2.0_Cycle_Read_Latency)-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebdb2e93084&utm_source=cypress&utm_medium=referral&utm_campaign=
CY7C1150KV18-400BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 419 Stücke:
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AnzahlPrivatkunde
10+65.26 EUR
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CY7C1165V18-400BZXC CY7C11(61,63,65,76)V18_8.pdf
CY7C1165V18-400BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Obsolete
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 458 Stücke:
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AnzahlPrivatkunde
6+111.69 EUR
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CY7C1170KV18-400BZXC CY7C11(68,70)KV18.pdf
CY7C1170KV18-400BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Memory Format: SRAM
Clock Frequency: 400 MHz
Technology: SRAM - Synchronous, DDR II+
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Volatile
Memory Size: 18Mbit
Mounting Type: Surface Mount
Package / Case: 165-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 512K x 36
Memory Interface: Parallel
Part Status: Obsolete
Supplier Device Package: 165-FBGA (13x15)
auf Bestellung 1959 Stücke:
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AnzahlPrivatkunde
9+75.04 EUR
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CY22388ZXC-11 CY22388,89,91.pdf
CY22388ZXC-11
Hersteller: Infineon Technologies
Description: IC CLOCK GEN PROG 16TSSOP
Packaging: Tube
Part Status: Obsolete
DigiKey Programmable: Not Verified
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CY7C1145LV18-400BZXC
CY7C1145LV18-400BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1145KV18-400BZXCT Infineon-CY7C1143KV18_CY7C1145KV18_18-Mbit_QDR_II+_SRAM_Four-Word_Burst_Architecture_(2.0_Cycle_Read_Latency)-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1f8f936d7&utm_source=cypress&utm_medium=referral&utm_campaign
CY7C1145KV18-400BZXCT
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 400 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TLE49615MXTSA1 Infineon-TLE4961_5M-DS-v01_00-en.pdf?fileId=db3a30433fe811c7013ff1eb97b65ec9
TLE49615MXTSA1
Hersteller: Infineon Technologies
Description: MAG SWITCH IC HALL EFF SOT23-3
Test Condition: 25°C
Supplier Device Package: PG-SOT23-3-15
Current - Supply (Max): 2.5mA
Current - Output (Max): 25mA
Sensing Range: 19.8mT Trip, -19.8mT Release
Technology: Hall Effect
Voltage - Supply: 3V ~ 32V
Operating Temperature: -40°C ~ 170°C
Function: Latch
Mounting Type: Surface Mount
Polarization: South Pole
Output Type: Open Drain
Package / Case: TO-236-3, SC-59, SOT-23-3
Features: Temperature Compensated
Part Status: Active
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE49615MXTSA1 Infineon-TLE4961_5M-DS-v01_00-en.pdf?fileId=db3a30433fe811c7013ff1eb97b65ec9
TLE49615MXTSA1
Hersteller: Infineon Technologies
Description: MAG SWITCH IC HALL EFF SOT23-3
Test Condition: 25°C
Supplier Device Package: PG-SOT23-3-15
Current - Supply (Max): 2.5mA
Current - Output (Max): 25mA
Sensing Range: 19.8mT Trip, -19.8mT Release
Technology: Hall Effect
Voltage - Supply: 3V ~ 32V
Operating Temperature: -40°C ~ 170°C
Function: Latch
Mounting Type: Surface Mount
Polarization: South Pole
Output Type: Open Drain
Package / Case: TO-236-3, SC-59, SOT-23-3
Features: Temperature Compensated
Part Status: Active
Packaging: Cut Tape (CT)
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22+0.99 EUR
25+0.86 EUR
26+0.81 EUR
28+0.75 EUR
50+0.71 EUR
100+0.68 EUR
500+0.62 EUR
1000+0.58 EUR
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XMC1302T016X0008ABXUMA1 infineon-xmc1300-ab-datasheet-en.pdf
XMC1302T016X0008ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 11x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-8
Part Status: Active
Number of I/O: 11
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC1301T038F0064ABXUMA1 infineon-xmc1300-ab-datasheet-en.pdf
XMC1301T038F0064ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-9
Part Status: Active
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IRS2807DSTRPBF Infineon-Infineon-IRS28x7DS-DS-v01_00-EN-DS-v01_01-EN.pdf?fileId=5546d462602a9dc801604a3dcbd308af
IRS2807DSTRPBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR HI/LOW SIDE 8SOIC
DigiKey Programmable: Not Verified
Part Status: Active
Current - Peak Output (Source, Sink): 200mA, 350mA
Logic Voltage - VIL, VIH: 0.8V, 2.2V
Gate Type: IGBT, N-Channel MOSFET
Number of Drivers: 2
Driven Configuration: High-Side or Low-Side
Channel Type: Synchronous
Rise / Fall Time (Typ): 150ns, 50ns
Supplier Device Package: PG-DSO-8-903
High Side Voltage - Max (Bootstrap): 600 V
Input Type: Non-Inverting
Voltage - Supply: 10V ~ 20V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IRS2807DSTRPBF Infineon-Infineon-IRS28x7DS-DS-v01_00-EN-DS-v01_01-EN.pdf?fileId=5546d462602a9dc801604a3dcbd308af
IRS2807DSTRPBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR HI/LOW SIDE 8SOIC
Logic Voltage - VIL, VIH: 0.8V, 2.2V
Gate Type: IGBT, N-Channel MOSFET
Number of Drivers: 2
Driven Configuration: High-Side or Low-Side
Channel Type: Synchronous
Rise / Fall Time (Typ): 150ns, 50ns
Supplier Device Package: PG-DSO-8-903
High Side Voltage - Max (Bootstrap): 600 V
Input Type: Non-Inverting
Voltage - Supply: 10V ~ 20V
Operating Temperature: -40°C ~ 125°C (TA)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Current - Peak Output (Source, Sink): 200mA, 350mA
Produkt ist nicht verfügbar
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IPP100N08N3GXKSA1 IPP_I_B100N08N3_Rev2.0.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431ddc9372011e071f53b82619
IPP100N08N3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 80V 70A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 46A, 10V
Power Dissipation (Max): 100W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 46µA
Supplier Device Package: PG-TO220-3
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 35 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2410 pF @ 40 V
Produkt ist nicht verfügbar
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CY15V116QSN-108BKXI Infineon-CY15B116QSN-108BKXIE-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea5be97353&utm_source=n403&utm_medium=email&utm_campaign=202208_glob_en_atv_ATV.P.RAMMemory&utm_content=e1_
CY15V116QSN-108BKXI
Hersteller: Infineon Technologies
Description: IC FRAM 16MBIT SPI/QUAD 24FBGA
DigiKey Programmable: Not Verified
Memory Organization: 2M x 8
Access Time: 6.7 ns
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 24-FBGA (6x8)
Memory Format: FRAM
Clock Frequency: 108 MHz
Technology: FRAM (Ferroelectric RAM)
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 16Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
auf Bestellung 495 Stücke:
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AnzahlPrivatkunde
1+57.05 EUR
10+52.8 EUR
25+51.11 EUR
50+49.85 EUR
100+48.6 EUR
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IPW80R280P7XKSA1 Infineon-IPW80R280P7-DS-v02_00-EN.pdf?fileId=5546d46255dd933d0155e96482cb07dc
IPW80R280P7XKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 800V 17A TO247-3
Input Capacitance (Ciss) (Max) @ Vds: 1200 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 36 nC @ 10 V
Drain to Source Voltage (Vdss): 800 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: PG-TO247-3-41
Vgs(th) (Max) @ Id: 3.5V @ 360µA
Power Dissipation (Max): 101W (Tc)
Rds On (Max) @ Id, Vgs: 280mOhm @ 7.2A, 10V
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
auf Bestellung 252 Stücke:
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AnzahlPrivatkunde
3+7.69 EUR
30+3.57 EUR
120+3.37 EUR
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98-0176PBF
Hersteller: Infineon Technologies
Description: IC GATE DRIVER HALF BRIDGE 64MQF
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPP051N15N5AKSA1 Infineon-IPP051N15N5-DS-v02_00-EN.pdf?fileId=5546d46253f650570154a0437e3754cb
IPP051N15N5AKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 150V 120A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 7800 pF @ 75 V
Gate Charge (Qg) (Max) @ Vgs: 100 nC @ 10 V
Drain to Source Voltage (Vdss): 150 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Part Status: Active
Supplier Device Package: PG-TO220-3
Vgs(th) (Max) @ Id: 4.6V @ 264µA
Power Dissipation (Max): 300mW (Tc)
Rds On (Max) @ Id, Vgs: 5.1mOhm @ 60A, 10V
Current - Continuous Drain (Id) @ 25°C: 120A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Produkt ist nicht verfügbar
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IDH09SG60CXKSA2 Infineon-IDH09SG60C-DS-v02_03-en.pdf?fileId=db3a30431ff98815012047f4e80f2cff
IDH09SG60CXKSA2
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 600V 9A TO220-2-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 280pF @ 1V, 1MHz
Current - Average Rectified (Io): 9A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Last Time Buy
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 9 A
Current - Reverse Leakage @ Vr: 80 µA @ 600 V
Produkt ist nicht verfügbar
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CY7C199D-25SXE Infineon-CY7C199D_256-Kbit_(32_K_8)_Static_RAM-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebf20333330
CY7C199D-25SXE
Hersteller: Infineon Technologies
Description: IC SRAM 256K PARALLEL 28SOIC
DigiKey Programmable: Not Verified
Memory Organization: 32K x 8
Access Time: 25 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 25ns
Part Status: Obsolete
Supplier Device Package: 28-SOIC
Memory Format: SRAM
Technology: SRAM - Asynchronous
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Volatile
Memory Size: 256Kbit
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.295", 7.50mm Width)
Packaging: Tube
auf Bestellung 697 Stücke:
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AnzahlPrivatkunde
29+36.32 EUR
Mindestbestellmenge: 29 Stücke
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CY7C199D-10ZXI Infineon-CY7C199D_256-Kbit_(32_K_8)_Static_RAM-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebf20333330&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY7C199D-10ZXI
Hersteller: Infineon Technologies
Description: IC SRAM 256KBIT PAR 28TSOP I
Access Time: 10 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 10ns
Part Status: Obsolete
Supplier Device Package: 28-TSOP I
Memory Format: SRAM
Technology: SRAM - Asynchronous
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 256Kbit
Mounting Type: Surface Mount
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 32K x 8
Produkt ist nicht verfügbar
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D1131SH65TXPSA1 Infineon-D1131SH-DS-v8_0-en_de.pdf?fileId=db3a304412b407950112b43188ed54a8
D1131SH65TXPSA1
Hersteller: Infineon Technologies
Description: DIODE STANDARD 6500V 1100A
Packaging: Tray
Package / Case: DO-200AE
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 1100A
Operating Temperature - Junction: 0°C ~ 140°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 6500 V
Voltage - Forward (Vf) (Max) @ If: 5.6 V @ 2500 A
Current - Reverse Leakage @ Vr: 150 mA @ 6500 V
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1+2539.73 EUR
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DD600S65K3NOSA1
Hersteller: Infineon Technologies
Description: DIODE MODULE GP 6500V AIHV130-6
Current - Reverse Leakage @ Vr: 900 A @ 3600 V
Voltage - Forward (Vf) (Max) @ If: 3.5 V @ 600 A
Voltage - DC Reverse (Vr) (Max): 6500 V
Part Status: Active
Operating Temperature - Junction: -50°C ~ 125°C
Supplier Device Package: A-IHV130-6
Diode Configuration: 2 Independent
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 4 Stücke:
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AnzahlPrivatkunde
1+2429.94 EUR
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FD1200R17HP4KB2BOSA2 Infineon-FD1200R17HP4-K_B2-DS-v03_01-EN.pdf?fileId=5546d462525dbac401527e2a7ee26b29
FD1200R17HP4KB2BOSA2
Hersteller: Infineon Technologies
Description: IGBT MOD 1700V 1200A AGIHVB130-3
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 1.2kA
NTC Thermistor: No
Supplier Device Package: AG-IHVB130-3
Part Status: Active
Current - Collector (Ic) (Max): 1200 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 6500 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 97.5 nF @ 25 V
auf Bestellung 12 Stücke:
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1+1936.36 EUR
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CY8C26643-24AI CY8C25122%2C26233%2C26443%2C26643.pdf
CY8C26643-24AI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 44TQFP
Packaging: Bag
Package / Case: 44-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 44-TQFP (10x10)
Part Status: Obsolete
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYAT81652-100AS48 Infineon-CYAT81650-100AA48-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837e917f1c0b4b
Hersteller: Infineon Technologies
Description: PSOC BASED - TRUETOUCH
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Part Status: Active
Produkt ist nicht verfügbar
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CYAT81652-100AA48T Infineon-CYAT81650-100AA48-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837e917f1c0b4b
Hersteller: Infineon Technologies
Description: PSOC BASED - TRUETOUCH
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Part Status: Active
Produkt ist nicht verfügbar
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CYAT81652-100AS48T Infineon-CYAT81650-100AA48-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837e917f1c0b4b
Hersteller: Infineon Technologies
Description: PSOC BASED - TRUETOUCH
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Part Status: Active
Produkt ist nicht verfügbar
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CYAT81652-100AA48 Infineon-CYAT81650-100AA48-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837e917f1c0b4b
Hersteller: Infineon Technologies
Description: PSOC BASED - TRUETOUCH
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Part Status: Active
Produkt ist nicht verfügbar
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DZ600N12KHPSA1 Infineon-DZ600N-DS-v01_00-en_de.pdf?fileId=db3a304412b407950112b431311153cd
DZ600N12KHPSA1
Hersteller: Infineon Technologies
Description: DIODE STANDARD 1200V 735A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 735A
Supplier Device Package: Module
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 2200 A
Current - Reverse Leakage @ Vr: 40 mA @ 1200 V
Produkt ist nicht verfügbar
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DZ600N14KHQSA2 DZ600N_v01_5-6-03.pdf
DZ600N14KHQSA2
Hersteller: Infineon Technologies
Description: DIODE GP 1.4KV 735A PB501-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 735A
Supplier Device Package: BG-PB501-1
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1400 V
Voltage - Forward (Vf) (Max) @ If: 1.4 V @ 2200 A
Current - Reverse Leakage @ Vr: 40 mA @ 1400 V
Produkt ist nicht verfügbar
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DZ600N16KB01HPSA1 DZ600N_v01_5-6-03.pdf
DZ600N16KB01HPSA1
Hersteller: Infineon Technologies
Description: DIODE GP 1.8KV 735A PB501-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 735A
Supplier Device Package: BG-PB501-1
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 1800 V
Current - Reverse Leakage @ Vr: 40 mA @ 1800 V
Produkt ist nicht verfügbar
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C164SL6RMCAKXUMA7
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 48KB MROM 80MQFP
Packaging: Tray
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 48KB (48K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: C166
Data Converters: A/D 8x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-80-7
Part Status: Obsolete
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C433-10JXC CY7C4xx_RevB.pdf
CY7C433-10JXC
Hersteller: Infineon Technologies
Description: IC FIFO ASYNC 4KX9 10NS 32PLCC
DigiKey Programmable: Not Verified
Voltage - Supply: 4.5 V ~ 5.5 V
Part Status: Obsolete
FWFT Support: No
Retransmit Capability: Yes
Programmable Flags Support: No
Expansion Type: Depth, Width
Bus Directional: Uni-Directional
Supplier Device Package: 32-PLCC (11.43x13.97)
Current - Supply (Max): 85mA
Access Time: 10ns
Data Rate: 50MHz
Operating Temperature: 0°C ~ 70°C
Memory Size: 36K (4K x 9)
Function: Asynchronous
Mounting Type: Surface Mount
Package / Case: 32-LCC (J-Lead)
Packaging: Tube
Produkt ist nicht verfügbar
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XDPE152C4D0000XUMA1 Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc
XDPE152C4D0000XUMA1
Hersteller: Infineon Technologies
Description: IFX PRIMARION CNTRLLER
Part Status: Active
Supplier Device Package: PG-VQFN-48-63
Applications: Controller, Intel VR13
Voltage - Input: 0.25V ~ 12V
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 0.25V ~ 3.04V
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
4000+7.08 EUR
Mindestbestellmenge: 4000 Stücke
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XDPE152C4D0000XUMA1 Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc
XDPE152C4D0000XUMA1
Hersteller: Infineon Technologies
Description: IFX PRIMARION CNTRLLER
Applications: Controller, Intel VR13
Voltage - Input: 0.25V ~ 12V
Number of Outputs: 2
Mounting Type: Surface Mount
Voltage - Output: 0.25V ~ 3.04V
Package / Case: 48-VFQFN Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: PG-VQFN-48-63
auf Bestellung 5724 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+12.59 EUR
10+9.69 EUR
25+8.96 EUR
100+8.16 EUR
250+7.78 EUR
500+7.54 EUR
1000+7.37 EUR
Mindestbestellmenge: 2 Stücke
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MB91F575BHSPMC-GSK5E1 download
MB91F575BHSPMC-GSK5E1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F575BHSPMC-GSE1 download
CY91F575BHSPMC-GSE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F575BPMC-GSE2 download
CY91F575BPMC-GSE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB91F577BHPMC-GSK5E1 download
MB91F577BHPMC-GSK5E1
Hersteller: Infineon Technologies
Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB91F577BHPMC-GSK5E2
MB91F577BHPMC-GSK5E2
Hersteller: Infineon Technologies
Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB91F579CMPMC-GSK5E2
MB91F579CMPMC-GSK5E2
Hersteller: Infineon Technologies
Description: IC MCU 32B 2.0625MB FLSH 208LQFP
Packaging: Tray
Package / Case: 208-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-LQFP (28x28)
Part Status: Obsolete
Number of I/O: 159
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F577BHSPMC1-GSE1 download
CY91F577BHSPMC1-GSE1
Hersteller: Infineon Technologies
Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (16x16)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F577BHSPMC-GSE1 download
CY91F577BHSPMC-GSE1
Hersteller: Infineon Technologies
Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F577BHPMC-GS-F4E1 download
CY91F577BHPMC-GS-F4E1
Hersteller: Infineon Technologies
Description: ICU MCU FLASH
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB91F579CHSPMC-GSK5E1
MB91F579CHSPMC-GSK5E1
Hersteller: Infineon Technologies
Description: IC MCU 32B 2.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 144K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F577BPMC-GSE2 download
CY91F577BPMC-GSE2
Hersteller: Infineon Technologies
Description: IC MCU 32B 1.0625MB FLSH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1.0625MB (1.0625M x 8)
RAM Size: 72K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Last Time Buy
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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MB91F575BPMC-GSK5E2
MB91F575BPMC-GSK5E2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 576KB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: FR81S
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Part Status: Obsolete
Number of I/O: 111
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F579CMPMC-GSE2 download
CY91F579CMPMC-GSE2
Hersteller: Infineon Technologies
Description: IC MCU 32B 2.0625MB FLSH 208LQFP
DigiKey Programmable: Not Verified
Number of I/O: 159
Part Status: Last Time Buy
Supplier Device Package: 208-LQFP (28x28)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Processor: FR81S
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 2.0625MB (2.0625M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB91F575BHPMC-GSK5E2
MB91F575BHPMC-GSK5E2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 576KB FLASH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Obsolete
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x8/10b; D/A 2x8b
Core Processor: FR81S
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 48K x 8
Program Memory Size: 576KB (576K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY91F579CHSPMC-GSE1 download
CY91F579CHSPMC-GSE1
Hersteller: Infineon Technologies
Description: IC MCU 32B 2.0625MB FLSH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Last Time Buy
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x8/10b SAR; D/A 2x8b R2R
Core Processor: FR81S
EEPROM Size: 64K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 144K x 8
Program Memory Size: 2.0625MB (2.0625M x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 600 Stücke
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IPB240N04S41R0ATMA1 Infineon-IPB240N04S4-1R0-DS-v01_00-EN.pdf?fileId=5546d46249a28d750149a3ce59740632
IPB240N04S41R0ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 240A TO263-7
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 240A (Tc)
Rds On (Max) @ Id, Vgs: 1mOhm @ 100A, 10V
Power Dissipation (Max): 231W (Tc)
Vgs(th) (Max) @ Id: 4V @ 180µA
Supplier Device Package: PG-TO263-7-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 221 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 17682 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IPB240N04S41R0ATMA1 Infineon-IPB240N04S4-1R0-DS-v01_00-EN.pdf?fileId=5546d46249a28d750149a3ce59740632
IPB240N04S41R0ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 240A TO263-7
Packaging: Cut Tape (CT)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 240A (Tc)
Rds On (Max) @ Id, Vgs: 1mOhm @ 100A, 10V
Power Dissipation (Max): 231W (Tc)
Vgs(th) (Max) @ Id: 4V @ 180µA
Supplier Device Package: PG-TO263-7-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 221 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 17682 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 417 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+8.82 EUR
10+5.82 EUR
100+4.12 EUR
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TLE7230RNUMA1
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:8 DSO-36
Part Status: Obsolete
Fault Protection: Open Load Detect, Over Temperature, Over Voltage
Supplier Device Package: PG-DSO-36-47
Ratio - Input:Output: 1:8
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 4.5V ~ 5.5V
Rds On (Typ): 800mOhm
Output Configuration: Low Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: General Purpose
Interface: SPI
Number of Outputs: 8
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Features: Status Flag
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CYBT-223058-02
Hersteller: Infineon Technologies
Description: BTBLE-OTHERS
Part Status: Active
Serial Interfaces: I²C, I²S, PCM, SPI, UART
RF Family/Standard: Bluetooth, General ISM > 1GHz
Modulation: GFSK
Utilized IC / Part: CYW20819
Antenna Type: Integrated, Chip
Current - Transmitting: 5.8mA
Current - Receiving: 5.9mA
Protocol: Bluetooth v5.0 + EDR
Data Rate: 2Mbps
Power - Output: 4dBm
Voltage - Supply: 1.71V ~ 3.3V
Operating Temperature: -30°C ~ 85°C
Memory Size: 256kB Flash, 176kB RAM
Frequency: 2.4GHz ~ 2.5GHz
Mounting Type: Surface Mount
Sensitivity: -95dBm
Package / Case: 35-SMD Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BCR108E6433HTMA1 bcr108series.pdf?folderId=db3a30431400ef68011406f3ddb1012e&fileId=db3a30431428a37301143a27e5a401ce
BCR108E6433HTMA1
Hersteller: Infineon Technologies
Description: TRANS PREBIAS NPN 50V SOT23
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 2.2 kOhms
Frequency - Transition: 170 MHz
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Last Time Buy
Supplier Device Package: PG-SOT23
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 5mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BCR 108 B6327 bcr108series.pdf?folderId=db3a30431400ef68011406f3ddb1012e&fileId=db3a30431428a37301143a27e5a401ce
BCR 108 B6327
Hersteller: Infineon Technologies
Description: TRANS PREBIAS NPN 50V SOT23
Resistor - Emitter Base (R2): 47 kOhms
Resistor - Base (R1): 2.2 kOhms
Frequency - Transition: 170 MHz
Power - Max: 200 mW
Voltage - Collector Emitter Breakdown (Max): 50 V
Current - Collector (Ic) (Max): 100 mA
Part Status: Obsolete
Supplier Device Package: PG-SOT23
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 5mA, 5V
Current - Collector Cutoff (Max): 100nA (ICBO)
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
Transistor Type: NPN - Pre-Biased
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 30000 Stücke
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