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CY8C4247LQI-BL473T CY8C4247LQI-BL473T Infineon Technologies Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 128KB FLASH 56QFN
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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CY96F386RSCPMC-GS204UJE2 CY96F386RSCPMC-GS204UJE2 Infineon Technologies CY96380.pdf Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY8C4247LQI-BL453T CY8C4247LQI-BL453T Infineon Technologies Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 128KB FLASH 56QFN
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LVD, POR, PWM, SmartCard, SmartSense, WDT
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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CY96F386RSCPMC-GS205UJE2 CY96F386RSCPMC-GS205UJE2 Infineon Technologies CY96380.pdf Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY8C4247LTQ-L485 CY8C4247LTQ-L485 Infineon Technologies Infineon-CY8C424x_PSoC_4_PSoC_4200L_Based_on_Arm_Cortex_-M0-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed894aa5a14 Description: IC MCU 32BIT 128MB FLASH 68VFQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 68-QFN (8x8)
Part Status: Active
Number of I/O: 55
auf Bestellung 1108 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.64 EUR
10+16.25 EUR
25+15.15 EUR
100+13.95 EUR
260+13.35 EUR
520+13.01 EUR
1040+12.73 EUR
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CY8C4247LQI-BL483T CY8C4247LQI-BL483T Infineon Technologies Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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CY8C4247LQI-BL463T CY8C4247LQI-BL463T Infineon Technologies Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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CY96F386RSCPMC-GS203UJE2 CY96F386RSCPMC-GS203UJE2 Infineon Technologies CY96380.pdf Description: IC MCU 16BIT 288KB FLASH 120LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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S25FS128SAGMFV103 S25FS128SAGMFV103 Infineon Technologies infineon-s25fs128s-s25fs256s-1-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed6b5ab5758&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC FLASH 128MBIT SPI/QUAD 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C24794-24LTXI CY8C24794-24LTXI Infineon Technologies Infineon-CY8C24094_CY8C24794_CY8C24894_CY8C24994_PSOC_PROGRAMMABLE_SYSTEM-ON-CHIP-DataSheet-v40_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec703773dba&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integra Description: IC MCU 8BIT 16KB FLASH 56QFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 50
Part Status: Active
Supplier Device Package: 56-QFN (8x8)
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 48x14b; D/A 2x9b
Core Processor: M8C
auf Bestellung 1103 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.72 EUR
10+9.11 EUR
25+8.46 EUR
100+7.74 EUR
260+7.51 EUR
Mindestbestellmenge: 2 Stücke
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CY8C24533-24PVXI CY8C24533-24PVXI Infineon Technologies Infineon-CY8C24533_PSOC_PROGRAMMABLE_SYSTEM-ON-CHIP_Datasheet-AdditionalTechnicalInformation-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed24ec84f14&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr Description: IC MCU 8BIT 8KB FLASH 28SSOP
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 28-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D - 14bit; D/A - 8bit
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tube
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
3+6.09 EUR
10+4.6 EUR
47+4.03 EUR
141+3.75 EUR
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CY8C21334-24PVXA CY8C21334-24PVXA Infineon Technologies Infineon-CY8C21334_CY8C21534_Automotive_PSoC_Programmable_System-on-Chip-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecb0041442d Description: IC MCU 8BIT 8KB FLASH 20SSOP
DigiKey Programmable: Verified
Number of I/O: 16
Part Status: Last Time Buy
Supplier Device Package: 20-SSOP
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 28x8b
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
auf Bestellung 1180 Stücke:
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76+6.69 EUR
Mindestbestellmenge: 76 Stücke
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TMA463-56LQI Infineon Technologies TrueTouch_Gen4_Brochure_10-21-14.pdf Description: IC MCU TRUETOUCH
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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TMA463-56LQIT Infineon Technologies TrueTouch_Gen4_Brochure_10-21-14.pdf Description: IC MCU TRUETOUCH
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
Produkt ist nicht verfügbar
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IPP180N10N3GXKSA1 IPP180N10N3GXKSA1 Infineon Technologies IPP180N10N3+G+Rev2.2.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30432239cccd01226066faa07f9d Description: MOSFET N-CH 100V 43A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V
auf Bestellung 816 Stücke:
Lieferzeit 10-14 Tag (e)
6+2.96 EUR
50+1.41 EUR
100+1.26 EUR
500+1 EUR
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IPI180N10N3GXKSA1 IPI180N10N3GXKSA1 Infineon Technologies IPP180N10N3+G_Rev2.2.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30432239cccd01226066faa07f9d Description: MOSFET N-CH 100V 43A TO262-3
Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Not For New Designs
Power Dissipation (Max): 71W (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Supplier Device Package: PG-TO262-3
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Produkt ist nicht verfügbar
 Mindestbestellmenge: 500 Stücke
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MB89663RPF-GT-141-BNDE1 Infineon Technologies Description: IC MCU 8BIT 8KB MROM 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB89637PF-GT-1415-BNDE1 Infineon Technologies Description: IC MCU 8BIT 32KB MROM 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FF400R12KT3HOSA1 FF400R12KT3HOSA1 Infineon Technologies Infineon-FF400R12KT3-DS-v03_00-en_de.pdf?fileId=db3a304412b407950112b4345f49601d Description: IGBT MOD 1200V 580A 2000W
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Not For New Designs
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FD400R12KE3B5HOSA1 FD400R12KE3B5HOSA1 Infineon Technologies Infineon-FD400R12KE3_B5-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b431ebef565a Description: IGBT MOD 1200V 580A 2000W MOD
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: Single Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 34 Stücke:
Lieferzeit 10-14 Tag (e)
1+237.72 EUR
10+213.48 EUR
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P2000DL45X168APTHPSA1 P2000DL45X168APTHPSA1 Infineon Technologies Infineon-P2000DL45X168-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7f2a768a017facf50b1340af Description: IGBT MOD 4500V 2000A P16826K-1
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 2000A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: DO-200AE
Packaging: Tray
Input Capacitance (Cies) @ Vce: 420 nF @ 25 V
Current - Collector Cutoff (Max): 200 µA
Voltage - Collector Emitter Breakdown (Max): 4500 V
Current - Collector (Ic) (Max): 2000 A
Part Status: Active
IGBT Type: Trench
Supplier Device Package: BG-P16826K-1
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
1+13271.37 EUR
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FF400R12KE3B2HOSA1 FF400R12KE3B2HOSA1 Infineon Technologies Infineon-FF400R12KE3_B2-DS-v03_00-en_de.pdf?fileId=db3a3043156fd57301161f5b4b131ef1 Description: IGBT MOD 1200V 580A 2000W
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
1+365.62 EUR
10+342.45 EUR
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CY2304NZZXI-1T CY2304NZZXI-1T Infineon Technologies Infineon-CY2304NZ_Four_Output_PCI-X_and_General_Purpose_Buffer-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcd7a92ea3&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Active
PLL: No
Supplier Device Package: 8-TSSOP
Differential - Input:Output: No/No
Ratio - Input:Output: 1:4
Main Purpose: PCI Express (PCIe)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVTTL
Frequency - Max: 140MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
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CY2304NZZXI-1T CY2304NZZXI-1T Infineon Technologies Infineon-CY2304NZ_Four_Output_PCI-X_and_General_Purpose_Buffer-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcd7a92ea3&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Active
PLL: No
Supplier Device Package: 8-TSSOP
Differential - Input:Output: No/No
Ratio - Input:Output: 1:4
Main Purpose: PCI Express (PCIe)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVTTL
Frequency - Max: 140MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 3256 Stücke:
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25+17.33 EUR
100+15.99 EUR
250+15.35 EUR
500+14.97 EUR
1000+14.65 EUR
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S6J32EEKSNSE20000 S6J32EEKSNSE20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
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S6J32EELTPSC20000 S6J32EELTPSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
auf Bestellung 396 Stücke:
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10+45.65 EUR
40+41.92 EUR
120+39.84 EUR
280+38.62 EUR
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S6J32FEKSNSE20000 S6J32FEKSNSE20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
 Mindestbestellmenge: 360 Stücke
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S6J32NELSMSC20000 S6J32NELSMSC20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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S6J32MELSMSC20000 S6J32MELSMSC20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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S6J32EELTMSC2000A S6J32EELTMSC2000A Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
 Mindestbestellmenge: 400 Stücke
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S6J32NEKSMSE20000 S6J32NEKSMSE20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
 Mindestbestellmenge: 360 Stücke
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S6J32EELSNSC20000 S6J32EELSNSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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T1451N52TOHXPSA1 T1451N52TOHXPSA1 Infineon Technologies Infineon-T1451N-DS-v08_00-en_de.pdf?fileId=db3a304412b407950112b4318b2854ac Description: SCR MODULE 5.2KV 2610A TO-200AF
Voltage - Off State: 5.2 kV
Current - On State (It (RMS)) (Max): 2610 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (AV)) (Max): 2320 A
Number of SCRs, Diodes: 1 SCR
Current - Non Rep. Surge 50, 60Hz (Itsm): 44000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Hold (Ih) (Max): 350 mA
Structure: Single
Operating Temperature: -40°C ~ 125°C
Mounting Type: Chassis Mount
Package / Case: TO-200AF
Packaging: Tray
Produkt ist nicht verfügbar
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XMC4500F100F768ACXQMA1 XMC4500F100F768ACXQMA1 Infineon Technologies Infineon-XMC4500-DS-v01_05-EN.pdf?fileId=5546d46254e133b40154e1b56cbe0123 Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-11
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
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90+12.91 EUR
180+12.48 EUR
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DF200R12KE3HOSA1 DF200R12KE3HOSA1 Infineon Technologies Infineon-DF200R12KE3-DS-v03_00-en_de.pdf?fileId=db3a304412b407950112b431ab75550c Description: IGBT MODULE 1200V 1040W MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1040 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
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10+138.26 EUR
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CY8C5288FNI-LP213T CY8C5288FNI-LP213T Infineon Technologies download Description: IC MCU 32BIT 256KB FLASH 99WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 99-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 99-WLCSP (5.19x5.94)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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CY8C4725FNI-S402T CY8C4725FNI-S402T Infineon Technologies Infineon-PSoC_4_PSoC_4700S_Family_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee62f926e3e Description: IC MCU 32BIT 32KB FLASH 25WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 21
Part Status: Active
Supplier Device Package: 25-WLCSP (2.02x1.93)
Peripherals: Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b; D/A 2x7b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 25-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
 Mindestbestellmenge: 2000 Stücke
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CYBLE-014008-00 CYBLE-014008-00 Infineon Technologies Infineon-CYBLE-014008-00_EZ-BLE_Creator_Module-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed3c9c3519e&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: RF TXRX MOD BT TH SMD
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: Integrated, Trace
Current - Transmitting: 12.5mA ~ 20mA
Current - Receiving: 16.4mA ~ 21.5mA
Protocol: Bluetooth v4.1
Data Rate: 1Mbps
Power - Output: 3dBm
Voltage - Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Memory Size: 128kB Flash, 16kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -87dBm
Package / Case: 32-SMD Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CYBLE-014008-00 CYBLE-014008-00 Infineon Technologies Infineon-CYBLE-014008-00_EZ-BLE_Creator_Module-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed3c9c3519e&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: RF TXRX MOD BT TH SMD
Packaging: Cut Tape (CT)
Package / Case: 32-SMD Module
Sensitivity: -87dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 16kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 5.5V
Power - Output: 3dBm
Data Rate: 1Mbps
Protocol: Bluetooth v4.1
Current - Receiving: 16.4mA ~ 21.5mA
Current - Transmitting: 12.5mA ~ 20mA
Antenna Type: Integrated, Trace
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
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10+24.21 EUR
25+22.97 EUR
100+21.26 EUR
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MB89677ARPMC1-G-238E1 Infineon Technologies ProductGuide_2008.1.pdf Description: IC MCU 8BIT 32KB MROM 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Connectivity: EBI/EMI, Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-PQFP (14x14)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB90678PF-G-238-BND-BE1 Infineon Technologies Description: AUTO IC MICRONTROLLER
DigiKey Programmable: Not Verified
Number of I/O: 84
Part Status: Obsolete
Supplier Device Package: 100-QFP (14x20)
Peripherals: POR, WDT
Connectivity: EBI/EMI, I²C, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-16L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 3K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB89193APF-G-238-BND-RE1 Infineon Technologies ProductGuide_2008.1.pdf Description: IC MCU 8BIT 8KB MROM 28SOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tray
Peripherals: POR, WDT
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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ICE2QR2280GXUMA1 ICE2QR2280GXUMA1 Infineon Technologies Infineon-ICE2QR2280G-DS-v02_00-en.pdf?fileId=db3a304328c6bd5c01293561f75b2e10 Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Produkt ist nicht verfügbar
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ICE2QR2280GXUMA1 ICE2QR2280GXUMA1 Infineon Technologies Infineon-ICE2QR2280G-DS-v02_00-en.pdf?fileId=db3a304328c6bd5c01293561f75b2e10 Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
auf Bestellung 7148 Stücke:
Lieferzeit 10-14 Tag (e)
5+3.94 EUR
10+2.91 EUR
25+2.65 EUR
100+2.37 EUR
250+2.23 EUR
500+2.15 EUR
1000+2.09 EUR
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ICE2QR2280G1XUMA1 ICE2QR2280G1XUMA1 Infineon Technologies Infineon-ICE2QR2280G1-DS-v2_2-en.pdf?fileId=db3a30433dd42dcf013dd4f1067601a7 Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Produkt ist nicht verfügbar
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ICE2QR2280G1XUMA1 ICE2QR2280G1XUMA1 Infineon Technologies Infineon-ICE2QR2280G1-DS-v2_2-en.pdf?fileId=db3a30433dd42dcf013dd4f1067601a7 Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
auf Bestellung 44 Stücke:
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10+2.91 EUR
25+2.65 EUR
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EVAL2QR2280G1TOBO1 EVAL2QR2280G1TOBO1 Infineon Technologies Infineon-ICE2QR2280G-1-Demoboard-AN-v01_01-EN.pdf?fileId=5546d4624b0b249c014bbb35f4d13948 Description: EVAL BOARD FOR ICE2QR2280G1
Packaging: Bulk
Voltage - Output: 5V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 4A
Contents: Board(s)
Frequency - Switching: 65kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: ICE2QR2280G-1
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 1 Isolated Output
Part Status: Active
Power - Output: 20W
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BAV99WB6327XT BAV99WB6327XT Infineon Technologies bav99series.pdf Description: DIODE ARRAY GP 80V 200MA SOT323
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: PG-SOT323
Operating Temperature - Junction: 150°C (Max)
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 150 nA @ 70 V
Produkt ist nicht verfügbar
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TC334LP32F200FAAKXUMA1 TC334LP32F200FAAKXUMA1 Infineon Technologies 4_cip10529.pdf Description: IC MCU 32BIT 2MB FLASH 144TQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-144-27
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC334LP32F200FAAKXUMA1 TC334LP32F200FAAKXUMA1 Infineon Technologies 4_cip10529.pdf Description: IC MCU 32BIT 2MB FLASH 144TQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-144-27
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 722 Stücke:
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1+33.81 EUR
10+27.07 EUR
25+25.39 EUR
100+23.55 EUR
250+22.67 EUR
500+22.13 EUR
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IKB30N65EH5ATMA1 IKB30N65EH5ATMA1 Infineon Technologies Infineon-IKB30N65EH5-DS-v02_01-EN.pdf?fileId=5546d46262b31d2e0162cd134705491a Description: IGBT TRENCH FS 650V 55A TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO263-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 24ns/159ns
Switching Energy: 870µJ (on), 300µJ (off)
Test Condition: 400V, 30A, 22Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
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1000+2.25 EUR
2000+2.18 EUR
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IKB30N65EH5ATMA1 IKB30N65EH5ATMA1 Infineon Technologies Infineon-IKB30N65EH5-DS-v02_01-EN.pdf?fileId=5546d46262b31d2e0162cd134705491a Description: IGBT TRENCH FS 650V 55A TO263-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO263-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 24ns/159ns
Switching Energy: 870µJ (on), 300µJ (off)
Test Condition: 400V, 30A, 22Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
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3+6.34 EUR
10+4.17 EUR
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500+2.67 EUR
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S29GL256S90FHSS63 S29GL256S90FHSS63 Infineon Technologies PdfFile_133368.pdf Description: IC FLASH 256MBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 16M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S29GL256S90FHSS50 S29GL256S90FHSS50 Infineon Technologies PdfFile_133368.pdf Description: IC FLASH 256MBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 16M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CY15V104QN-50LPXI CY15V104QN-50LPXI Infineon Technologies Infineon-CY15B104QN_CY15V104QN_Excelon(TM)_LP_4-Mbit_(512K_X_8)_Serial_(SPI)_F-RAM-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7709b704a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr Description: IC FRAM 4MBIT SPI 50MHZ 8GQFN
DigiKey Programmable: Not Verified
Memory Organization: 512K x 8
Memory Interface: SPI
Part Status: Active
Supplier Device Package: 8-GQFN (3.23x3.28)
Memory Format: FRAM
Clock Frequency: 50 MHz
Technology: FRAM (Ferroelectric RAM)
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 8-UQFN
Packaging: Tray
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CYUSBS232-BO Infineon Technologies Description: DEVELOPMENT KIT
Part Status: Obsolete
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: CY7C65213
Type: Interface
Function: USB to UART (RS232) Bridge
Packaging: Box
Produkt ist nicht verfügbar
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MB90561APMC-G-415E1 MB90561APMC-G-415E1 Infineon Technologies ProductGuide_2008.1.pdf Description: IC MCU 16BIT 32KB MROM 64LQFP
Part Status: Obsolete
Supplier Device Package: 64-LQFP (12x12)
Peripherals: POR, WDT
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-16LX
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 51
Produkt ist nicht verfügbar
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XMC4500F100K768ACXQMA1 XMC4500F100K768ACXQMA1 Infineon Technologies Infineon-XMC4500-DS-v01_05-EN.pdf?fileId=5546d46254e133b40154e1b56cbe0123 Description: IC MCU 32BIT 768KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: PG-LQFP-100-11
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 160K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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IPI60R385CPXKSA1 IPI60R385CPXKSA1 Infineon Technologies IPI60R385CP_rev2.1.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b42d946f48a3 Description: MOSFET N-CH 650V 9A TO262-3
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 9A (Tc)
Rds On (Max) @ Id, Vgs: 385mOhm @ 5.2A, 10V
Power Dissipation (Max): 83W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 340µA
Supplier Device Package: PG-TO262-3
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 790 pF @ 100 V
Produkt ist nicht verfügbar
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S29GL032N11TFIV20 S29GL032N11TFIV20 Infineon Technologies Infineon-S29GL064N_S29GL032N_64_Mbit_32_Mbit_3_V_Page_Mode_MirrorBit_Flash-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed556fd548b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fi Description: IC FLASH 32MBIT PARALLEL 56TSOP
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 110 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 110ns
Part Status: Obsolete
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tray
auf Bestellung 391 Stücke:
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171+5.17 EUR
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CY8C4247LQI-BL473T Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY8C4247LQI-BL473T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Produkt ist nicht verfügbar
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CY96F386RSCPMC-GS204UJE2 CY96380.pdf
CY96F386RSCPMC-GS204UJE2
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY8C4247LQI-BL453T Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY8C4247LQI-BL453T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LVD, POR, PWM, SmartCard, SmartSense, WDT
Produkt ist nicht verfügbar
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CY96F386RSCPMC-GS205UJE2 CY96380.pdf
CY96F386RSCPMC-GS205UJE2
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY8C4247LTQ-L485 Infineon-CY8C424x_PSoC_4_PSoC_4200L_Based_on_Arm_Cortex_-M0-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed894aa5a14
CY8C4247LTQ-L485
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128MB FLASH 68VFQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 68-QFN (8x8)
Part Status: Active
Number of I/O: 55
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1+20.64 EUR
10+16.25 EUR
25+15.15 EUR
100+13.95 EUR
260+13.35 EUR
520+13.01 EUR
1040+12.73 EUR
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CY8C4247LQI-BL483T Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY8C4247LQI-BL483T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY8C4247LQI-BL463T Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY8C4247LQI-BL463T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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CY96F386RSCPMC-GS203UJE2 CY96380.pdf
CY96F386RSCPMC-GS203UJE2
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 288KB FLASH 120LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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S25FS128SAGMFV103 infineon-s25fs128s-s25fs256s-1-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed6b5ab5758&utm_source=cypress&utm_medium=referral&utm_campaign
S25FS128SAGMFV103
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT SPI/QUAD 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C24794-24LTXI Infineon-CY8C24094_CY8C24794_CY8C24894_CY8C24994_PSOC_PROGRAMMABLE_SYSTEM-ON-CHIP-DataSheet-v40_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec703773dba&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integra
CY8C24794-24LTXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 56QFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 50
Part Status: Active
Supplier Device Package: 56-QFN (8x8)
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 48x14b; D/A 2x9b
Core Processor: M8C
auf Bestellung 1103 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+11.72 EUR
10+9.11 EUR
25+8.46 EUR
100+7.74 EUR
260+7.51 EUR
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CY8C24533-24PVXI Infineon-CY8C24533_PSOC_PROGRAMMABLE_SYSTEM-ON-CHIP_Datasheet-AdditionalTechnicalInformation-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed24ec84f14&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr
CY8C24533-24PVXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 28SSOP
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 28-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D - 14bit; D/A - 8bit
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tube
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+6.09 EUR
10+4.6 EUR
47+4.03 EUR
141+3.75 EUR
Mindestbestellmenge: 3 Stücke
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CY8C21334-24PVXA Infineon-CY8C21334_CY8C21534_Automotive_PSoC_Programmable_System-on-Chip-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecb0041442d
CY8C21334-24PVXA
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 20SSOP
DigiKey Programmable: Verified
Number of I/O: 16
Part Status: Last Time Buy
Supplier Device Package: 20-SSOP
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 28x8b
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
auf Bestellung 1180 Stücke:
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AnzahlPreis
76+6.69 EUR
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TMA463-56LQI TrueTouch_Gen4_Brochure_10-21-14.pdf
Hersteller: Infineon Technologies
Description: IC MCU TRUETOUCH
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
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TMA463-56LQIT TrueTouch_Gen4_Brochure_10-21-14.pdf
Hersteller: Infineon Technologies
Description: IC MCU TRUETOUCH
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
Produkt ist nicht verfügbar
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IPP180N10N3GXKSA1 IPP180N10N3+G+Rev2.2.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30432239cccd01226066faa07f9d
IPP180N10N3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 43A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V
auf Bestellung 816 Stücke:
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AnzahlPreis
6+2.96 EUR
50+1.41 EUR
100+1.26 EUR
500+1 EUR
Mindestbestellmenge: 6 Stücke
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IPI180N10N3GXKSA1 IPP180N10N3+G_Rev2.2.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30432239cccd01226066faa07f9d
IPI180N10N3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 43A TO262-3
Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Not For New Designs
Power Dissipation (Max): 71W (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Supplier Device Package: PG-TO262-3
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Produkt ist nicht verfügbar
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MB89663RPF-GT-141-BNDE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB MROM 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB89637PF-GT-1415-BNDE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB MROM 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FF400R12KT3HOSA1 Infineon-FF400R12KT3-DS-v03_00-en_de.pdf?fileId=db3a304412b407950112b4345f49601d
FF400R12KT3HOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 580A 2000W
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Not For New Designs
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FD400R12KE3B5HOSA1 Infineon-FD400R12KE3_B5-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b431ebef565a
FD400R12KE3B5HOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 580A 2000W MOD
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: Single Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 34 Stücke:
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AnzahlPreis
1+237.72 EUR
10+213.48 EUR
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P2000DL45X168APTHPSA1 Infineon-P2000DL45X168-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7f2a768a017facf50b1340af
P2000DL45X168APTHPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 4500V 2000A P16826K-1
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 2000A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: DO-200AE
Packaging: Tray
Input Capacitance (Cies) @ Vce: 420 nF @ 25 V
Current - Collector Cutoff (Max): 200 µA
Voltage - Collector Emitter Breakdown (Max): 4500 V
Current - Collector (Ic) (Max): 2000 A
Part Status: Active
IGBT Type: Trench
Supplier Device Package: BG-P16826K-1
auf Bestellung 1 Stücke:
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AnzahlPreis
1+13271.37 EUR
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FF400R12KE3B2HOSA1 Infineon-FF400R12KE3_B2-DS-v03_00-en_de.pdf?fileId=db3a3043156fd57301161f5b4b131ef1
FF400R12KE3B2HOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 580A 2000W
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+365.62 EUR
10+342.45 EUR
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CY2304NZZXI-1T Infineon-CY2304NZ_Four_Output_PCI-X_and_General_Purpose_Buffer-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcd7a92ea3&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY2304NZZXI-1T
Hersteller: Infineon Technologies
Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Active
PLL: No
Supplier Device Package: 8-TSSOP
Differential - Input:Output: No/No
Ratio - Input:Output: 1:4
Main Purpose: PCI Express (PCIe)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVTTL
Frequency - Max: 140MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2500+13.5 EUR
Mindestbestellmenge: 2500 Stücke
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CY2304NZZXI-1T Infineon-CY2304NZ_Four_Output_PCI-X_and_General_Purpose_Buffer-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcd7a92ea3&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY2304NZZXI-1T
Hersteller: Infineon Technologies
Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Active
PLL: No
Supplier Device Package: 8-TSSOP
Differential - Input:Output: No/No
Ratio - Input:Output: 1:4
Main Purpose: PCI Express (PCIe)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVTTL
Frequency - Max: 140MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 3256 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+23.44 EUR
10+18.56 EUR
25+17.33 EUR
100+15.99 EUR
250+15.35 EUR
500+14.97 EUR
1000+14.65 EUR
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S6J32EEKSNSE20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32EEKSNSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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S6J32EELTPSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32EELTPSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+56.16 EUR
10+45.65 EUR
40+41.92 EUR
120+39.84 EUR
280+38.62 EUR
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S6J32FEKSNSE20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32FEKSNSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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S6J32NELSMSC20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32NELSMSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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S6J32MELSMSC20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32MELSMSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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S6J32EELTMSC2000A Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32EELTMSC2000A
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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S6J32NEKSMSE20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32NEKSMSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
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S6J32EELSNSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32EELSNSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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T1451N52TOHXPSA1 Infineon-T1451N-DS-v08_00-en_de.pdf?fileId=db3a304412b407950112b4318b2854ac
T1451N52TOHXPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 5.2KV 2610A TO-200AF
Voltage - Off State: 5.2 kV
Current - On State (It (RMS)) (Max): 2610 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (AV)) (Max): 2320 A
Number of SCRs, Diodes: 1 SCR
Current - Non Rep. Surge 50, 60Hz (Itsm): 44000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Hold (Ih) (Max): 350 mA
Structure: Single
Operating Temperature: -40°C ~ 125°C
Mounting Type: Chassis Mount
Package / Case: TO-200AF
Packaging: Tray
Produkt ist nicht verfügbar
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XMC4500F100F768ACXQMA1 Infineon-XMC4500-DS-v01_05-EN.pdf?fileId=5546d46254e133b40154e1b56cbe0123
XMC4500F100F768ACXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-11
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 441 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+19.03 EUR
10+14.97 EUR
90+12.91 EUR
180+12.48 EUR
270+12.27 EUR
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DF200R12KE3HOSA1 Infineon-DF200R12KE3-DS-v03_00-en_de.pdf?fileId=db3a304412b407950112b431ab75550c
DF200R12KE3HOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 1040W MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1040 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+172.81 EUR
10+138.26 EUR
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CY8C5288FNI-LP213T download
CY8C5288FNI-LP213T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 99WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 99-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 99-WLCSP (5.19x5.94)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4725FNI-S402T Infineon-PSoC_4_PSoC_4700S_Family_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee62f926e3e
CY8C4725FNI-S402T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 25WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 21
Part Status: Active
Supplier Device Package: 25-WLCSP (2.02x1.93)
Peripherals: Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b; D/A 2x7b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 25-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CYBLE-014008-00 Infineon-CYBLE-014008-00_EZ-BLE_Creator_Module-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed3c9c3519e&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CYBLE-014008-00
Hersteller: Infineon Technologies
Description: RF TXRX MOD BT TH SMD
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: Integrated, Trace
Current - Transmitting: 12.5mA ~ 20mA
Current - Receiving: 16.4mA ~ 21.5mA
Protocol: Bluetooth v4.1
Data Rate: 1Mbps
Power - Output: 3dBm
Voltage - Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Memory Size: 128kB Flash, 16kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -87dBm
Package / Case: 32-SMD Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CYBLE-014008-00 Infineon-CYBLE-014008-00_EZ-BLE_Creator_Module-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed3c9c3519e&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CYBLE-014008-00
Hersteller: Infineon Technologies
Description: RF TXRX MOD BT TH SMD
Packaging: Cut Tape (CT)
Package / Case: 32-SMD Module
Sensitivity: -87dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 16kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 5.5V
Power - Output: 3dBm
Data Rate: 1Mbps
Protocol: Bluetooth v4.1
Current - Receiving: 16.4mA ~ 21.5mA
Current - Transmitting: 12.5mA ~ 20mA
Antenna Type: Integrated, Trace
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+27.81 EUR
10+24.21 EUR
25+22.97 EUR
100+21.26 EUR
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MB89677ARPMC1-G-238E1 ProductGuide_2008.1.pdf
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB MROM 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Connectivity: EBI/EMI, Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-PQFP (14x14)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB90678PF-G-238-BND-BE1
Hersteller: Infineon Technologies
Description: AUTO IC MICRONTROLLER
DigiKey Programmable: Not Verified
Number of I/O: 84
Part Status: Obsolete
Supplier Device Package: 100-QFP (14x20)
Peripherals: POR, WDT
Connectivity: EBI/EMI, I²C, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-16L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 3K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB89193APF-G-238-BND-RE1 ProductGuide_2008.1.pdf
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB MROM 28SOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tray
Peripherals: POR, WDT
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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ICE2QR2280GXUMA1 Infineon-ICE2QR2280G-DS-v02_00-en.pdf?fileId=db3a304328c6bd5c01293561f75b2e10
ICE2QR2280GXUMA1
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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ICE2QR2280GXUMA1 Infineon-ICE2QR2280G-DS-v02_00-en.pdf?fileId=db3a304328c6bd5c01293561f75b2e10
ICE2QR2280GXUMA1
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
auf Bestellung 7148 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.94 EUR
10+2.91 EUR
25+2.65 EUR
100+2.37 EUR
250+2.23 EUR
500+2.15 EUR
1000+2.09 EUR
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ICE2QR2280G1XUMA1 Infineon-ICE2QR2280G1-DS-v2_2-en.pdf?fileId=db3a30433dd42dcf013dd4f1067601a7
ICE2QR2280G1XUMA1
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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ICE2QR2280G1XUMA1 Infineon-ICE2QR2280G1-DS-v2_2-en.pdf?fileId=db3a30433dd42dcf013dd4f1067601a7
ICE2QR2280G1XUMA1
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.94 EUR
10+2.91 EUR
25+2.65 EUR
Mindestbestellmenge: 5 Stücke
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EVAL2QR2280G1TOBO1 Infineon-ICE2QR2280G-1-Demoboard-AN-v01_01-EN.pdf?fileId=5546d4624b0b249c014bbb35f4d13948
EVAL2QR2280G1TOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR ICE2QR2280G1
Packaging: Bulk
Voltage - Output: 5V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 4A
Contents: Board(s)
Frequency - Switching: 65kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: ICE2QR2280G-1
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 1 Isolated Output
Part Status: Active
Power - Output: 20W
auf Bestellung 1 Stücke:
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AnzahlPreis
1+265.8 EUR
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BAV99WB6327XT bav99series.pdf
BAV99WB6327XT
Hersteller: Infineon Technologies
Description: DIODE ARRAY GP 80V 200MA SOT323
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: PG-SOT323
Operating Temperature - Junction: 150°C (Max)
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 150 nA @ 70 V
Produkt ist nicht verfügbar
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TC334LP32F200FAAKXUMA1 4_cip10529.pdf
TC334LP32F200FAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 144TQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-144-27
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC334LP32F200FAAKXUMA1 4_cip10529.pdf
TC334LP32F200FAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 144TQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-144-27
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 722 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+33.81 EUR
10+27.07 EUR
25+25.39 EUR
100+23.55 EUR
250+22.67 EUR
500+22.13 EUR
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IKB30N65EH5ATMA1 Infineon-IKB30N65EH5-DS-v02_01-EN.pdf?fileId=5546d46262b31d2e0162cd134705491a
IKB30N65EH5ATMA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 55A TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO263-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 24ns/159ns
Switching Energy: 870µJ (on), 300µJ (off)
Test Condition: 400V, 30A, 22Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1000+2.25 EUR
2000+2.18 EUR
Mindestbestellmenge: 1000 Stücke
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IKB30N65EH5ATMA1 Infineon-IKB30N65EH5-DS-v02_01-EN.pdf?fileId=5546d46262b31d2e0162cd134705491a
IKB30N65EH5ATMA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 55A TO263-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO263-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 24ns/159ns
Switching Energy: 870µJ (on), 300µJ (off)
Test Condition: 400V, 30A, 22Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
auf Bestellung 4022 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+6.34 EUR
10+4.17 EUR
100+2.94 EUR
500+2.67 EUR
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S29GL256S90FHSS63 PdfFile_133368.pdf
S29GL256S90FHSS63
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 16M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S29GL256S90FHSS50 PdfFile_133368.pdf
S29GL256S90FHSS50
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
DigiKey Programmable: Not Verified
Memory Organization: 16M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: 0°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CY15V104QN-50LPXI Infineon-CY15B104QN_CY15V104QN_Excelon(TM)_LP_4-Mbit_(512K_X_8)_Serial_(SPI)_F-RAM-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7709b704a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr
CY15V104QN-50LPXI
Hersteller: Infineon Technologies
Description: IC FRAM 4MBIT SPI 50MHZ 8GQFN
DigiKey Programmable: Not Verified
Memory Organization: 512K x 8
Memory Interface: SPI
Part Status: Active
Supplier Device Package: 8-GQFN (3.23x3.28)
Memory Format: FRAM
Clock Frequency: 50 MHz
Technology: FRAM (Ferroelectric RAM)
Voltage - Supply: 1.71V ~ 1.89V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 4Mbit
Mounting Type: Surface Mount
Package / Case: 8-UQFN
Packaging: Tray
Produkt ist nicht verfügbar
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CYUSBS232-BO
Hersteller: Infineon Technologies
Description: DEVELOPMENT KIT
Part Status: Obsolete
Supplied Contents: Board(s), Cable(s)
Utilized IC / Part: CY7C65213
Type: Interface
Function: USB to UART (RS232) Bridge
Packaging: Box
Produkt ist nicht verfügbar
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MB90561APMC-G-415E1 ProductGuide_2008.1.pdf
MB90561APMC-G-415E1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 32KB MROM 64LQFP
Part Status: Obsolete
Supplier Device Package: 64-LQFP (12x12)
Peripherals: POR, WDT
Connectivity: UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-16LX
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 51
Produkt ist nicht verfügbar
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XMC4500F100K768ACXQMA1 Infineon-XMC4500-DS-v01_05-EN.pdf?fileId=5546d46254e133b40154e1b56cbe0123
XMC4500F100K768ACXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 768KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 55
Part Status: Active
Supplier Device Package: PG-LQFP-100-11
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 160K x 8
Program Memory Size: 768KB (768K x 8)
Speed: 120MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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IPI60R385CPXKSA1 IPI60R385CP_rev2.1.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b42d946f48a3
IPI60R385CPXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 9A TO262-3
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 9A (Tc)
Rds On (Max) @ Id, Vgs: 385mOhm @ 5.2A, 10V
Power Dissipation (Max): 83W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 340µA
Supplier Device Package: PG-TO262-3
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 22 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 790 pF @ 100 V
Produkt ist nicht verfügbar
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S29GL032N11TFIV20 Infineon-S29GL064N_S29GL032N_64_Mbit_32_Mbit_3_V_Page_Mode_MirrorBit_Flash-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed556fd548b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fi
S29GL032N11TFIV20
Hersteller: Infineon Technologies
Description: IC FLASH 32MBIT PARALLEL 56TSOP
DigiKey Programmable: Not Verified
Memory Organization: 4M x 8, 2M x 16
Access Time: 110 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 110ns
Part Status: Obsolete
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 32Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tray
auf Bestellung 391 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
171+5.17 EUR
Mindestbestellmenge: 171 Stücke
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