Produkte > INFINEON TECHNOLOGIES > Alle Produkte des Herstellers INFINEON TECHNOLOGIES (124701) > Seite 590 nach 2079
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| S6J324CKSMSE20000 | Infineon Technologies |
 Description: IC MCU 32B 2.112MB FLASH 208TQFPDigiKey Programmable: Not Verified Number of I/O: 120 Part Status: Obsolete Supplier Device Package: 208-TQFP (28x28) Peripherals: DMA, I²S, LVD, POR, PWM, WDT Connectivity: CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 50x12b Core Processor: Arm® Cortex®-R5F Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512K x 8 Program Memory Size: 2.112MB (2.112M x 8) Speed: 240MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| S6J323CKSMSE2000A | Infineon Technologies |
Description: IC MCU 32B 2.112MB FLASH 208TQFP DigiKey Programmable: Not Verified Number of I/O: 120 Part Status: Obsolete Supplier Device Package: 208-TQFP (28x28) Peripherals: DMA, I²S, LVD, POR, PWM, WDT Connectivity: CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 50x12b Core Processor: Arm® Cortex®-R5F Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 512K x 8 Program Memory Size: 2.112MB (2.112M x 8) Speed: 240MHz Mounting Type: Surface Mount Package / Case: 208-LQFP Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| S6J325CKSMSE20000 | Infineon Technologies |
Description: IC MCU 32BIT AUTO 208-EXLQFP DigiKey Programmable: Not Verified Part Status: Discontinued at Digi-Key Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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CY8C4247LQQ-BL483T | Infineon Technologies |
Description: IC MCU 32BIT 128KB FLASH 56QFN DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 56-QFN (7x7) Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 56-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C4247LQQ-BL483T | Infineon Technologies |
Description: IC MCU 32BIT 128KB FLASH 56QFN DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 56-QFN (7x7) Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 56-UFQFN Exposed Pad Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C4247LQI-BL493T | Infineon Technologies |
Description: IC MCU 32BIT 128KB FLASH 56QFN DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 56-QFN (7x7) Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 56-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C4247LQQ-BL483 | Infineon Technologies |
Description: IC MCU 32BIT 128KB FLASH 56QFN DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 56-QFN (7x7) Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 56-UFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 520 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY96F386RSCPMC-GS208UJE2 | Infineon Technologies |
Description: IC MCU 16BIT 288KB FLASH 120LQFP DigiKey Programmable: Not Verified Number of I/O: 94 Part Status: Obsolete Supplier Device Package: 120-LQFP (16x16) Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x10b SAR Core Processor: F²MC-16FX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 288KB (288K x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 120-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C4247LQI-BL473T | Infineon Technologies |
Description: IC MCU 32BIT 128KB FLASH 56QFN Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 56-UFQFN Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 56-QFN (7x7) Peripherals: Bluetooth, Brown-out Detect/Reset, LVD, POR, PWM, SmartCard, SmartSense, WDT Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY96F386RSCPMC-GS204UJE2 | Infineon Technologies |
Description: IC MCU 16BIT 288KB FLASH 120LQFP DigiKey Programmable: Not Verified Number of I/O: 94 Part Status: Obsolete Supplier Device Package: 120-LQFP (16x16) Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x10b SAR Core Processor: F²MC-16FX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 288KB (288K x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 120-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C4247LQI-BL453T | Infineon Technologies |
Description: IC MCU 32BIT 128KB FLASH 56QFN Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Package / Case: 56-UFQFN Exposed Pad Packaging: Tape & Reel (TR) Mounting Type: Surface Mount DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 56-QFN (7x7) Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LVD, POR, PWM, SmartCard, SmartSense, WDT |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY96F386RSCPMC-GS205UJE2 | Infineon Technologies |
Description: IC MCU 16BIT 288KB FLASH 120LQFP DigiKey Programmable: Not Verified Number of I/O: 94 Part Status: Obsolete Supplier Device Package: 120-LQFP (16x16) Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x10b SAR Core Processor: F²MC-16FX Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 288KB (288K x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 120-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C4247LTQ-L485 | Infineon Technologies |
Description: IC MCU 32BIT 128MB FLASH 68VFQFN Packaging: Tray Package / Case: 68-VFQFN Exposed Pad Mounting Type: Surface Mount Speed: 48MHz Program Memory Size: 128KB (128K x 8) RAM Size: 16K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0 Data Converters: A/D 16x12b SAR; D/A 4x7/8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT Supplier Device Package: 68-QFN (8x8) Part Status: Active Number of I/O: 55 |
auf Bestellung 1108 Stücke: Lieferzeit 10-14 Tag (e) |
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CY8C4247LQI-BL483T | Infineon Technologies |
Description: IC MCU 32BIT 128KB FLASH 56QFN DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 56-QFN (7x7) Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 56-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C4247LQI-BL463T | Infineon Technologies |
Description: IC MCU 32BIT 128KB FLASH 56QFN DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Active Supplier Device Package: 56-QFN (7x7) Peripherals: Bluetooth, Brown-out Detect/Reset, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b Core Processor: ARM® Cortex®-M0 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 128KB (128K x 8) Speed: 48MHz Mounting Type: Surface Mount Package / Case: 56-UFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY96F386RSCPMC-GS203UJE2 | Infineon Technologies |
Description: IC MCU 16BIT 288KB FLASH 120LQFP Oscillator Type: Internal Operating Temperature: -40°C ~ 105°C (TA) RAM Size: 16K x 8 Program Memory Size: 288KB (288K x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 120-LQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 94 Part Status: Obsolete Supplier Device Package: 120-LQFP (16x16) Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 16x10b SAR Core Processor: F²MC-16FX Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S25FS128SAGMFV103 | Infineon Technologies |
Description: IC FLASH 128MBIT SPI/QUAD 8SOIC Packaging: Tape & Reel (TR) Package / Case: 8-SOIC (0.209", 5.30mm Width) Mounting Type: Surface Mount Memory Size: 128Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 125°C (TA) Voltage - Supply: 1.7V ~ 2V Technology: FLASH - NOR Clock Frequency: 133 MHz Memory Format: FLASH Supplier Device Package: 8-SOIC Part Status: Active Memory Interface: SPI - Quad I/O, QPI Memory Organization: 16M x 8 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2100 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C24794-24LTXI | Infineon Technologies |
Description: IC MCU 8BIT 16KB FLASH 56QFN Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 16KB (16K x 8) Speed: 24MHz Mounting Type: Surface Mount Package / Case: 56-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 50 Part Status: Active Supplier Device Package: 56-QFN (8x8) Peripherals: POR, PWM, WDT Connectivity: I2C, SPI, UART/USART, USB Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Core Size: 8-Bit Data Converters: A/D 48x14b; D/A 2x9b Core Processor: M8C |
auf Bestellung 1103 Stücke: Lieferzeit 10-14 Tag (e) |
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CY8C24533-24PVXI | Infineon Technologies |
Description: IC MCU 8BIT 8KB FLASH 28SSOP DigiKey Programmable: Not Verified Number of I/O: 26 Part Status: Active Supplier Device Package: 28-SSOP Peripherals: LVD, POR, PWM, WDT Connectivity: I2C, IrDA, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V Core Size: 8-Bit Data Converters: A/D - 14bit; D/A - 8bit Core Processor: M8C Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 256 x 8 Program Memory Size: 8KB (8K x 8) Speed: 24MHz Mounting Type: Surface Mount Package / Case: 28-SSOP (0.209", 5.30mm Width) Packaging: Tube |
auf Bestellung 235 Stücke: Lieferzeit 10-14 Tag (e) |
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CY8C21334-24PVXA | Infineon Technologies |
Description: IC MCU 8BIT 8KB FLASH 20SSOP DigiKey Programmable: Verified Number of I/O: 16 Part Status: Last Time Buy Supplier Device Package: 20-SSOP Peripherals: POR, PWM, WDT Connectivity: I2C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V Core Size: 8-Bit Data Converters: A/D 28x8b Core Processor: M8C Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 512 x 8 Program Memory Size: 8KB (8K x 8) Speed: 24MHz Mounting Type: Surface Mount Package / Case: 20-SSOP (0.209", 5.30mm Width) Packaging: Bulk |
auf Bestellung 1180 Stücke: Lieferzeit 10-14 Tag (e) |
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| TMA463-56LQI | Infineon Technologies |
Description: IC MCU TRUETOUCH DigiKey Programmable: Not Verified Part Status: Obsolete Packaging: Tray |
Produkt ist nicht verfügbar |
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| TMA463-56LQIT | Infineon Technologies |
Description: IC MCU TRUETOUCH Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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IPP180N10N3GXKSA1 | Infineon Technologies |
Description: MOSFET N-CH 100V 43A TO220-3 Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 43A (Tc) Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V Power Dissipation (Max): 71W (Tc) Vgs(th) (Max) @ Id: 3.5V @ 33µA Supplier Device Package: PG-TO220-3 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 6V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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IPI180N10N3GXKSA1 | Infineon Technologies |
Description: MOSFET N-CH 100V 43A TO262-3 Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V Drain to Source Voltage (Vdss): 100 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 6V, 10V Part Status: Not For New Designs Power Dissipation (Max): 71W (Tc) Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V Current - Continuous Drain (Id) @ 25°C: 43A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA Packaging: Tube Supplier Device Package: PG-TO262-3 Vgs(th) (Max) @ Id: 3.5V @ 33µA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
| MB89663RPF-GT-141-BNDE1 | Infineon Technologies |
Description: IC MCU 8BIT 8KB MROM 64QFP DigiKey Programmable: Not Verified Number of I/O: 36 Part Status: Obsolete Supplier Device Package: 64-QFP (14x20) Peripherals: POR, PWM, WDT Connectivity: Serial I/O, UART/USART Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: F²MC-8L Program Memory Type: Mask ROM Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 256 x 8 Program Memory Size: 8KB (8K x 8) Speed: 10MHz Mounting Type: Surface Mount Package / Case: 64-BQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MB89637PF-GT-1415-BNDE1 | Infineon Technologies |
Description: IC MCU 8BIT 32KB MROM 64QFP DigiKey Programmable: Not Verified Number of I/O: 53 Part Status: Obsolete Supplier Device Package: 64-QFP (14x20) Peripherals: POR, PWM, WDT Connectivity: EBI/EMI, Serial I/O, UART/USART Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: F²MC-8L Program Memory Type: Mask ROM Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1K x 8 Program Memory Size: 32KB (32K x 8) Speed: 10MHz Mounting Type: Surface Mount Package / Case: 64-BQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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FF400R12KT3HOSA1 | Infineon Technologies |
Description: IGBT MOD 1200V 580A 2000W MOD Input Capacitance (Cies) @ Vce: 28 nF @ 25 V Current - Collector Cutoff (Max): 5 mA Power - Max: 2000 W Voltage - Collector Emitter Breakdown (Max): 1200 V Current - Collector (Ic) (Max): 580 A Part Status: Not For New Designs IGBT Type: Trench Field Stop Supplier Device Package: Module NTC Thermistor: No Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A Operating Temperature: -40°C ~ 125°C Configuration: 2 Independent Input: Standard Mounting Type: Chassis Mount Package / Case: Module Packaging: Tray |
Produkt ist nicht verfügbar |
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FD400R12KE3B5HOSA1 | Infineon Technologies |
Description: IGBT MOD 1200V 580A 2000W MOD Input Capacitance (Cies) @ Vce: 28 nF @ 25 V Current - Collector Cutoff (Max): 5 mA Power - Max: 2000 W Voltage - Collector Emitter Breakdown (Max): 1200 V Current - Collector (Ic) (Max): 580 A Part Status: Active IGBT Type: Trench Field Stop Supplier Device Package: Module NTC Thermistor: No Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A Operating Temperature: -40°C ~ 125°C Configuration: Single Chopper Input: Standard Mounting Type: Chassis Mount Package / Case: Module Packaging: Tray |
auf Bestellung 54 Stücke: Lieferzeit 10-14 Tag (e) |
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P2000DL45X168APTHPSA1 | Infineon Technologies |
Description: IGBT MOD 4500V 2000A P16826K-1 NTC Thermistor: No Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 2000A Operating Temperature: -40°C ~ 150°C (TJ) Configuration: Single Input: Standard Mounting Type: Chassis Mount Package / Case: DO-200AE Packaging: Tray Input Capacitance (Cies) @ Vce: 420 nF @ 25 V Current - Collector Cutoff (Max): 200 µA Voltage - Collector Emitter Breakdown (Max): 4500 V Current - Collector (Ic) (Max): 2000 A Part Status: Active IGBT Type: Trench Supplier Device Package: BG-P16826K-1 |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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FF400R12KE3B2HOSA1 | Infineon Technologies |
Description: IGBT MOD 1200V 580A 2000W Input Capacitance (Cies) @ Vce: 28 nF @ 25 V Current - Collector Cutoff (Max): 5 mA Power - Max: 2000 W Voltage - Collector Emitter Breakdown (Max): 1200 V Current - Collector (Ic) (Max): 580 A Part Status: Active IGBT Type: Trench Field Stop Supplier Device Package: Module NTC Thermistor: No Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A Operating Temperature: -40°C ~ 125°C Configuration: 2 Independent Input: Standard Mounting Type: Chassis Mount Package / Case: Module Packaging: Tray |
auf Bestellung 10 Stücke: Lieferzeit 10-14 Tag (e) |
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CY2304NZZXI-1T | Infineon Technologies |
Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP DigiKey Programmable: Not Verified Number of Circuits: 1 Part Status: Active PLL: No Supplier Device Package: 8-TSSOP Differential - Input:Output: No/No Ratio - Input:Output: 1:4 Main Purpose: PCI Express (PCIe) Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Input: LVCMOS, LVTTL Frequency - Max: 140MHz Output: LVCMOS Mounting Type: Surface Mount Package / Case: 8-TSSOP (0.173", 4.40mm Width) Packaging: Tape & Reel (TR) |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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CY2304NZZXI-1T | Infineon Technologies |
Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP DigiKey Programmable: Not Verified Number of Circuits: 1 Part Status: Active PLL: No Supplier Device Package: 8-TSSOP Differential - Input:Output: No/No Ratio - Input:Output: 1:4 Main Purpose: PCI Express (PCIe) Voltage - Supply: 3V ~ 3.6V Operating Temperature: -40°C ~ 85°C Input: LVCMOS, LVTTL Frequency - Max: 140MHz Output: LVCMOS Mounting Type: Surface Mount Package / Case: 8-TSSOP (0.173", 4.40mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 3256 Stücke: Lieferzeit 10-14 Tag (e) |
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S6J32EEKSNSE20000 | Infineon Technologies |
Description: TRAVEO-55NM Packaging: Tray Package / Case: 208-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.171875MB (4.171875M x 8) RAM Size: 2.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Arm® Cortex®-R5F Data Converters: A/D 46x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 208-TEQFP (28x28) Part Status: Active Number of I/O: 120 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 360 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S6J32EELTPSC20000 | Infineon Technologies |
Description: TRAVEO-55NM Packaging: Tray Package / Case: 216-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.171875MB (4.171875M x 8) RAM Size: 2.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Arm® Cortex®-R5F Data Converters: A/D 50x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 216-TEQFP (24x24) Part Status: Active Number of I/O: 128 |
auf Bestellung 396 Stücke: Lieferzeit 10-14 Tag (e) |
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S6J32FEKSNSE20000 | Infineon Technologies |
Description: TRAVEO-55NM Packaging: Tray Package / Case: 208-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.171875MB (4.171875M x 8) RAM Size: 2.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Arm® Cortex®-R5F Data Converters: A/D 46x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 208-TEQFP (28x28) Part Status: Active Number of I/O: 120 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 360 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S6J32NELSMSC20000 | Infineon Technologies |
Description: TRAVEO-55NM Packaging: Tray Package / Case: 216-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.171875MB (4.171875M x 8) RAM Size: 3M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Arm® Cortex®-R5F Data Converters: A/D 50x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 216-TEQFP (24x24) Part Status: Active Number of I/O: 128 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S6J32MELSMSC20000 | Infineon Technologies |
Description: TRAVEO-55NM Packaging: Tray Package / Case: 216-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.171875MB (4.171875M x 8) RAM Size: 3M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Arm® Cortex®-R5F Data Converters: A/D 50x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 216-TEQFP (24x24) Part Status: Active Number of I/O: 128 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S6J32EELTMSC2000A | Infineon Technologies |
Description: TRAVEO-55NM Packaging: Tray Package / Case: 216-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.171875MB (4.171875M x 8) RAM Size: 2.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Arm® Cortex®-R5F Data Converters: A/D 50x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 216-TEQFP (24x24) Part Status: Active Number of I/O: 128 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S6J32NEKSMSE20000 | Infineon Technologies |
Description: TRAVEO-55NM Packaging: Tray Package / Case: 208-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.171875MB (4.171875M x 8) RAM Size: 3M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Arm® Cortex®-R5F Data Converters: A/D 46x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT Supplier Device Package: 208-TEQFP (28x28) Part Status: Active Number of I/O: 120 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 360 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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S6J32EELSNSC20000 | Infineon Technologies |
Description: TRAVEO-55NM Packaging: Tray Package / Case: 216-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 240MHz Program Memory Size: 4.171875MB (4.171875M x 8) RAM Size: 2.125M x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: Arm® Cortex®-R5F Data Converters: A/D 50x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, POR, PWM, WDT Supplier Device Package: 216-TEQFP (24x24) Part Status: Active Number of I/O: 128 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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T1451N52TOHXPSA1 | Infineon Technologies |
Description: SCR MODULE 5.2KV 2610A TO-200AF Voltage - Off State: 5.2 kV Current - On State (It (RMS)) (Max): 2610 A Part Status: Active Voltage - Gate Trigger (Vgt) (Max): 2.5 V Current - On State (It (AV)) (Max): 2320 A Number of SCRs, Diodes: 1 SCR Current - Non Rep. Surge 50, 60Hz (Itsm): 44000A @ 50Hz Current - Gate Trigger (Igt) (Max): 350 mA Current - Hold (Ih) (Max): 350 mA Structure: Single Operating Temperature: -40°C ~ 125°C Mounting Type: Chassis Mount Package / Case: TO-200AF Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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XMC4500F100F768ACXQMA1 | Infineon Technologies |
Description: IC MCU 32BIT 768KB FLASH 100LQFP Packaging: Tray Package / Case: 100-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 120MHz Program Memory Size: 768KB (768K x 8) RAM Size: 160K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M4 Data Converters: A/D 24x12b; D/A 2x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB Peripherals: DMA, I2S, LED, POR, PWM, WDT Supplier Device Package: PG-LQFP-100-11 Part Status: Active Number of I/O: 55 DigiKey Programmable: Not Verified |
auf Bestellung 441 Stücke: Lieferzeit 10-14 Tag (e) |
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DF200R12KE3HOSA1 | Infineon Technologies |
Description: IGBT MODULE 1200V 1040W MODULE Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Single Operating Temperature: -40°C ~ 125°C Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A NTC Thermistor: No Supplier Device Package: Module Part Status: Active Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 1040 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 14 nF @ 25 V |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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CY8C5288FNI-LP213T | Infineon Technologies |
Description: IC MCU 32BIT 256KB FLASH 99WLCSP Packaging: Tape & Reel (TR) Package / Case: 99-UFBGA, WLCSP Mounting Type: Surface Mount Speed: 80MHz Program Memory Size: 256KB (256K x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH EEPROM Size: 2K x 8 Core Processor: ARM® Cortex®-M3 Data Converters: A/D 1x12b; D/A 1x8b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I2C, LINbus, SPI, UART/USART, USB Peripherals: CapSense, DMA, LCD, POR, PWM, WDT Supplier Device Package: 99-WLCSP (5.19x5.94) Part Status: Active Number of I/O: 62 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CY8C4725FNI-S402T | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 25WLCSP DigiKey Programmable: Not Verified Number of I/O: 21 Part Status: Active Supplier Device Package: 25-WLCSP (2.02x1.93) Peripherals: Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x10b; D/A 2x7b Core Processor: ARM® Cortex®-M0+ Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Program Memory Size: 32KB (32K x 8) Speed: 24MHz Mounting Type: Surface Mount Package / Case: 25-XFBGA, WLCSP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CYBLE-014008-00 | Infineon Technologies |
Description: RF TXRX MOD BT TH SMD DigiKey Programmable: Not Verified Part Status: Active Serial Interfaces: I2C, SPI, UART RF Family/Standard: Bluetooth Antenna Type: Integrated, Trace Current - Transmitting: 12.5mA ~ 20mA Current - Receiving: 16.4mA ~ 21.5mA Protocol: Bluetooth v4.1 Data Rate: 1Mbps Power - Output: 3dBm Voltage - Supply: 1.7V ~ 5.5V Operating Temperature: -40°C ~ 85°C Memory Size: 128kB Flash, 16kB SRAM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -87dBm Package / Case: 32-SMD Module Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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CYBLE-014008-00 | Infineon Technologies |
Description: RF TXRX MOD BT TH SMD Packaging: Cut Tape (CT) Package / Case: 32-SMD Module Sensitivity: -87dBm Mounting Type: Surface Mount Frequency: 2.4GHz Memory Size: 128kB Flash, 16kB SRAM Operating Temperature: -40°C ~ 85°C Voltage - Supply: 1.7V ~ 5.5V Power - Output: 3dBm Data Rate: 1Mbps Protocol: Bluetooth v4.1 Current - Receiving: 16.4mA ~ 21.5mA Current - Transmitting: 12.5mA ~ 20mA Antenna Type: Integrated, Trace RF Family/Standard: Bluetooth Serial Interfaces: I2C, SPI, UART Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 110 Stücke: Lieferzeit 10-14 Tag (e) |
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| MB89677ARPMC1-G-238E1 | Infineon Technologies |
Description: IC MCU 8BIT 32KB MROM 80LQFP Packaging: Tray Package / Case: 80-LQFP Mounting Type: Surface Mount Speed: 10MHz Program Memory Size: 32KB (32K x 8) RAM Size: 1K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External Program Memory Type: Mask ROM Core Processor: F²MC-8L Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V Connectivity: EBI/EMI, Serial I/O, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 80-PQFP (14x14) Part Status: Obsolete Number of I/O: 39 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MB90678PF-G-238-BND-BE1 | Infineon Technologies |
Description: AUTO IC MICRONTROLLER DigiKey Programmable: Not Verified Number of I/O: 84 Part Status: Obsolete Supplier Device Package: 100-QFP (14x20) Peripherals: POR, WDT Connectivity: EBI/EMI, I²C, SCI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x8/10b Core Processor: F²MC-16L Program Memory Type: Mask ROM Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 3K x 8 Program Memory Size: 64KB (64K x 8) Speed: 16MHz Mounting Type: Surface Mount Package / Case: 100-BQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
| MB89193APF-G-238-BND-RE1 | Infineon Technologies |
Description: IC MCU 8BIT 8KB MROM 28SOP DigiKey Programmable: Not Verified Number of I/O: 16 Part Status: Obsolete Supplier Device Package: 28-SOP Package / Case: 28-SOIC (0.342", 8.69mm Width) Packaging: Tray Peripherals: POR, WDT Connectivity: Serial I/O Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V Core Size: 8-Bit Data Converters: A/D 8x8b Core Processor: F²MC-8L Program Memory Type: Mask ROM Oscillator Type: External Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 256 x 8 Program Memory Size: 8KB (8K x 8) Speed: 4.2MHz Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||
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ICE2QR2280GXUMA1 | Infineon Technologies |
Description: IC OFFLINE SWITCH FLYBACK 12DSO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 50% Frequency - Switching: 52kHz Internal Switch(s): Yes Voltage - Breakdown: 800V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V Supplier Device Package: PG-DSO-12-10 Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Voltage - Start Up: 18 V Part Status: Active Power (Watts): 53 W |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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ICE2QR2280GXUMA1 | Infineon Technologies |
Description: IC OFFLINE SWITCH FLYBACK 12DSO Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 50% Frequency - Switching: 52kHz Internal Switch(s): Yes Voltage - Breakdown: 800V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V Supplier Device Package: PG-DSO-12-10 Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Voltage - Start Up: 18 V Part Status: Active Power (Watts): 53 W |
auf Bestellung 7148 Stücke: Lieferzeit 10-14 Tag (e) |
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ICE2QR2280G1XUMA1 | Infineon Technologies |
Description: IC OFFLINE SWITCH FLYBACK 12DSO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 50% Frequency - Switching: 52kHz Internal Switch(s): Yes Voltage - Breakdown: 800V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V Supplier Device Package: PG-DSO-12-10 Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Voltage - Start Up: 18 V Part Status: Active Power (Watts): 53 W |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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ICE2QR2280G1XUMA1 | Infineon Technologies |
Description: IC OFFLINE SWITCH FLYBACK 12DSO Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 50% Frequency - Switching: 52kHz Internal Switch(s): Yes Voltage - Breakdown: 800V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V Supplier Device Package: PG-DSO-12-10 Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Voltage - Start Up: 18 V Part Status: Active Power (Watts): 53 W |
auf Bestellung 44 Stücke: Lieferzeit 10-14 Tag (e) |
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EVAL2QR2280G1TOBO1 | Infineon Technologies |
Description: EVAL BOARD FOR ICE2QR2280G1 Packaging: Bulk Voltage - Output: 5V Voltage - Input: 85 ~ 265 VAC Current - Output: 4A Contents: Board(s) Frequency - Switching: 65kHz Regulator Topology: Flyback Board Type: Fully Populated Utilized IC / Part: ICE2QR2280G-1 Supplied Contents: Board(s) Main Purpose: AC/DC, Primary Side Outputs and Type: 1 Isolated Output Part Status: Active Power - Output: 20W |
auf Bestellung 1 Stücke: Lieferzeit 10-14 Tag (e) |
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BAV99WB6327XT | Infineon Technologies |
Description: DIODE ARRAY GP 80V 200MA SOT323 Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Mounting Type: Surface Mount Speed: Small Signal =< 200mA (Io), Any Speed Reverse Recovery Time (trr): 4 ns Technology: Standard Diode Configuration: 1 Pair Series Connection Current - Average Rectified (Io) (per Diode): 200mA (DC) Supplier Device Package: PG-SOT323 Operating Temperature - Junction: 150°C (Max) Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 80 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA Current - Reverse Leakage @ Vr: 150 nA @ 70 V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 60000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TC334LP32F200FAAKXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 2MB FLASH 144TQFP Packaging: Tape & Reel (TR) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 2MB (2M x 8) RAM Size: 248K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: TriCore™ Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.3V, 5V Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: PG-TQFP-144-27 Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||
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TC334LP32F200FAAKXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 2MB FLASH 144TQFP Packaging: Cut Tape (CT) Package / Case: 144-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 200MHz Program Memory Size: 2MB (2M x 8) RAM Size: 248K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: TriCore™ Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.3V, 5V Connectivity: DMA, I2S, PWM, WDT Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: PG-TQFP-144-27 Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 722 Stücke: Lieferzeit 10-14 Tag (e) |
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IKB30N65EH5ATMA1 | Infineon Technologies |
Description: IGBT TRENCH FS 650V 55A TO263-3 Packaging: Tape & Reel (TR) Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -40°C ~ 175°C (TJ) Input Type: Standard Reverse Recovery Time (trr): 75 ns Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A Supplier Device Package: PG-TO263-3 IGBT Type: Trench Field Stop Td (on/off) @ 25°C: 24ns/159ns Switching Energy: 870µJ (on), 300µJ (off) Test Condition: 400V, 30A, 22Ohm, 15V Gate Charge: 70 nC Part Status: Active Current - Collector (Ic) (Max): 55 A Voltage - Collector Emitter Breakdown (Max): 650 V Current - Collector Pulsed (Icm): 90 A Power - Max: 188 W |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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IKB30N65EH5ATMA1 | Infineon Technologies |
Description: IGBT TRENCH FS 650V 55A TO263-3 Packaging: Cut Tape (CT) Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -40°C ~ 175°C (TJ) Input Type: Standard Reverse Recovery Time (trr): 75 ns Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A Supplier Device Package: PG-TO263-3 IGBT Type: Trench Field Stop Td (on/off) @ 25°C: 24ns/159ns Switching Energy: 870µJ (on), 300µJ (off) Test Condition: 400V, 30A, 22Ohm, 15V Gate Charge: 70 nC Part Status: Active Current - Collector (Ic) (Max): 55 A Voltage - Collector Emitter Breakdown (Max): 650 V Current - Collector Pulsed (Icm): 90 A Power - Max: 188 W |
auf Bestellung 4022 Stücke: Lieferzeit 10-14 Tag (e) |
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| S6J324CKSMSE20000 |
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Hersteller: Infineon Technologies
Description: IC MCU 32B 2.112MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Obsolete
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 50x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2.112MB (2.112M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32B 2.112MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Obsolete
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 50x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2.112MB (2.112M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S6J323CKSMSE2000A |
Hersteller: Infineon Technologies
Description: IC MCU 32B 2.112MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Obsolete
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 50x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2.112MB (2.112M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
Description: IC MCU 32B 2.112MB FLASH 208TQFP
DigiKey Programmable: Not Verified
Number of I/O: 120
Part Status: Obsolete
Supplier Device Package: 208-TQFP (28x28)
Peripherals: DMA, I²S, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, Ethernet, I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 50x12b
Core Processor: Arm® Cortex®-R5F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 512K x 8
Program Memory Size: 2.112MB (2.112M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 208-LQFP Exposed Pad
Packaging: Tray
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| S6J325CKSMSE20000 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT AUTO 208-EXLQFP
DigiKey Programmable: Not Verified
Part Status: Discontinued at Digi-Key
Packaging: Tray
Description: IC MCU 32BIT AUTO 208-EXLQFP
DigiKey Programmable: Not Verified
Part Status: Discontinued at Digi-Key
Packaging: Tray
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| CY8C4247LQQ-BL483T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| CY8C4247LQQ-BL483T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Cut Tape (CT)
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Cut Tape (CT)
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| CY8C4247LQI-BL493T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| CY8C4247LQQ-BL483 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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| CY96F386RSCPMC-GS208UJE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
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| CY8C4247LQI-BL473T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Description: IC MCU 32BIT 128KB FLASH 56QFN
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Produkt ist nicht verfügbar
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| CY96F386RSCPMC-GS204UJE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
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| CY8C4247LQI-BL453T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LVD, POR, PWM, SmartCard, SmartSense, WDT
Description: IC MCU 32BIT 128KB FLASH 56QFN
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LVD, POR, PWM, SmartCard, SmartSense, WDT
Produkt ist nicht verfügbar
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| CY96F386RSCPMC-GS205UJE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
Description: IC MCU 16BIT 288KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
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Im Einkaufswagen
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| CY8C4247LTQ-L485 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128MB FLASH 68VFQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 68-QFN (8x8)
Part Status: Active
Number of I/O: 55
Description: IC MCU 32BIT 128MB FLASH 68VFQFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 68-QFN (8x8)
Part Status: Active
Number of I/O: 55
auf Bestellung 1108 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24.56 EUR |
| 10+ | 19.34 EUR |
| 25+ | 18.03 EUR |
| 100+ | 16.6 EUR |
| 260+ | 15.89 EUR |
| 520+ | 15.48 EUR |
| 1040+ | 15.15 EUR |
| CY8C4247LQI-BL483T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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Stück im Wert von UAH
| CY8C4247LQI-BL463T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 128KB FLASH 56QFN
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Active
Supplier Device Package: 56-QFN (7x7)
Peripherals: Bluetooth, Brown-out Detect/Reset, LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 56-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
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Stück im Wert von UAH
| CY96F386RSCPMC-GS203UJE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 288KB FLASH 120LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Description: IC MCU 16BIT 288KB FLASH 120LQFP
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 94
Part Status: Obsolete
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LCD, LVD, LVR, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 16x10b SAR
Core Processor: F²MC-16FX
Program Memory Type: FLASH
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S25FS128SAGMFV103 |
|
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT SPI/QUAD 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Description: IC FLASH 128MBIT SPI/QUAD 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 16M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2100 Stücke
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Stück im Wert von UAH
| CY8C24794-24LTXI |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 56QFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 50
Part Status: Active
Supplier Device Package: 56-QFN (8x8)
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 48x14b; D/A 2x9b
Core Processor: M8C
Description: IC MCU 8BIT 16KB FLASH 56QFN
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 16KB (16K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 50
Part Status: Active
Supplier Device Package: 56-QFN (8x8)
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 48x14b; D/A 2x9b
Core Processor: M8C
auf Bestellung 1103 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.95 EUR |
| 10+ | 10.84 EUR |
| 25+ | 10.07 EUR |
| 100+ | 9.21 EUR |
| 260+ | 8.94 EUR |
| CY8C24533-24PVXI |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 28SSOP
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 28-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D - 14bit; D/A - 8bit
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tube
Description: IC MCU 8BIT 8KB FLASH 28SSOP
DigiKey Programmable: Not Verified
Number of I/O: 26
Part Status: Active
Supplier Device Package: 28-SSOP
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D - 14bit; D/A - 8bit
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Packaging: Tube
auf Bestellung 235 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.66 EUR |
| 10+ | 5.78 EUR |
| 47+ | 5.06 EUR |
| 141+ | 4.7 EUR |
| CY8C21334-24PVXA |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 20SSOP
DigiKey Programmable: Verified
Number of I/O: 16
Part Status: Last Time Buy
Supplier Device Package: 20-SSOP
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 28x8b
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
Description: IC MCU 8BIT 8KB FLASH 20SSOP
DigiKey Programmable: Verified
Number of I/O: 16
Part Status: Last Time Buy
Supplier Device Package: 20-SSOP
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 28x8b
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 512 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 20-SSOP (0.209", 5.30mm Width)
Packaging: Bulk
auf Bestellung 1180 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 76+ | 7.96 EUR |
| TMA463-56LQI |
|
Hersteller: Infineon Technologies
Description: IC MCU TRUETOUCH
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
Description: IC MCU TRUETOUCH
DigiKey Programmable: Not Verified
Part Status: Obsolete
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TMA463-56LQIT |
|
Hersteller: Infineon Technologies
Description: IC MCU TRUETOUCH
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
Description: IC MCU TRUETOUCH
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IPP180N10N3GXKSA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 43A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V
Description: MOSFET N-CH 100V 43A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IPI180N10N3GXKSA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 43A TO262-3
Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Not For New Designs
Power Dissipation (Max): 71W (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Supplier Device Package: PG-TO262-3
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Description: MOSFET N-CH 100V 43A TO262-3
Input Capacitance (Ciss) (Max) @ Vds: 1800 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Not For New Designs
Power Dissipation (Max): 71W (Tc)
Rds On (Max) @ Id, Vgs: 18mOhm @ 33A, 10V
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Packaging: Tube
Supplier Device Package: PG-TO262-3
Vgs(th) (Max) @ Id: 3.5V @ 33µA
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MB89663RPF-GT-141-BNDE1 |
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB MROM 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Packaging: Tray
Description: IC MCU 8BIT 8KB MROM 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 36
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MB89637PF-GT-1415-BNDE1 |
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB MROM 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Packaging: Tray
Description: IC MCU 8BIT 32KB MROM 64QFP
DigiKey Programmable: Not Verified
Number of I/O: 53
Part Status: Obsolete
Supplier Device Package: 64-QFP (14x20)
Peripherals: POR, PWM, WDT
Connectivity: EBI/EMI, Serial I/O, UART/USART
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 10MHz
Mounting Type: Surface Mount
Package / Case: 64-BQFP
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FF400R12KT3HOSA1 |
|
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 580A 2000W MOD
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Not For New Designs
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Description: IGBT MOD 1200V 580A 2000W MOD
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Not For New Designs
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| FD400R12KE3B5HOSA1 |
|
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 580A 2000W MOD
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: Single Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Description: IGBT MOD 1200V 580A 2000W MOD
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: Single Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 54 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 331.96 EUR |
| 10+ | 288.71 EUR |
| P2000DL45X168APTHPSA1 |
|
Hersteller: Infineon Technologies
Description: IGBT MOD 4500V 2000A P16826K-1
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 2000A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: DO-200AE
Packaging: Tray
Input Capacitance (Cies) @ Vce: 420 nF @ 25 V
Current - Collector Cutoff (Max): 200 µA
Voltage - Collector Emitter Breakdown (Max): 4500 V
Current - Collector (Ic) (Max): 2000 A
Part Status: Active
IGBT Type: Trench
Supplier Device Package: BG-P16826K-1
Description: IGBT MOD 4500V 2000A P16826K-1
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.5V @ 15V, 2000A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: DO-200AE
Packaging: Tray
Input Capacitance (Cies) @ Vce: 420 nF @ 25 V
Current - Collector Cutoff (Max): 200 µA
Voltage - Collector Emitter Breakdown (Max): 4500 V
Current - Collector (Ic) (Max): 2000 A
Part Status: Active
IGBT Type: Trench
Supplier Device Package: BG-P16826K-1
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 15792.93 EUR |
| FF400R12KE3B2HOSA1 |
|
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 580A 2000W
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Description: IGBT MOD 1200V 580A 2000W
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2000 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 580 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
Operating Temperature: -40°C ~ 125°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 435.09 EUR |
| 10+ | 407.52 EUR |
| CY2304NZZXI-1T |
|
Hersteller: Infineon Technologies
Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Active
PLL: No
Supplier Device Package: 8-TSSOP
Differential - Input:Output: No/No
Ratio - Input:Output: 1:4
Main Purpose: PCI Express (PCIe)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVTTL
Frequency - Max: 140MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Active
PLL: No
Supplier Device Package: 8-TSSOP
Differential - Input:Output: No/No
Ratio - Input:Output: 1:4
Main Purpose: PCI Express (PCIe)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVTTL
Frequency - Max: 140MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 16.06 EUR |
| CY2304NZZXI-1T |
|
Hersteller: Infineon Technologies
Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Active
PLL: No
Supplier Device Package: 8-TSSOP
Differential - Input:Output: No/No
Ratio - Input:Output: 1:4
Main Purpose: PCI Express (PCIe)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVTTL
Frequency - Max: 140MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
Description: IC CLK ZDB 4OUT 140MHZ 8TSSOP
DigiKey Programmable: Not Verified
Number of Circuits: 1
Part Status: Active
PLL: No
Supplier Device Package: 8-TSSOP
Differential - Input:Output: No/No
Ratio - Input:Output: 1:4
Main Purpose: PCI Express (PCIe)
Voltage - Supply: 3V ~ 3.6V
Operating Temperature: -40°C ~ 85°C
Input: LVCMOS, LVTTL
Frequency - Max: 140MHz
Output: LVCMOS
Mounting Type: Surface Mount
Package / Case: 8-TSSOP (0.173", 4.40mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 3256 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.89 EUR |
| 10+ | 22.09 EUR |
| 25+ | 20.62 EUR |
| 100+ | 19.03 EUR |
| 250+ | 18.27 EUR |
| 500+ | 17.81 EUR |
| 1000+ | 17.43 EUR |
| S6J32EEKSNSE20000 |
|
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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| S6J32EELTPSC20000 |
|
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
auf Bestellung 396 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 68.9 EUR |
| 10+ | 56.03 EUR |
| 40+ | 51.44 EUR |
| 120+ | 48.9 EUR |
| 280+ | 47.4 EUR |
| S6J32FEKSNSE20000 |
|
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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| S6J32NELSMSC20000 |
|
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
Im Einkaufswagen
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| S6J32MELSMSC20000 |
|
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
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| S6J32EELTMSC2000A |
|
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Mindestbestellmenge: 400 Stücke
Im Einkaufswagen
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| S6J32NEKSMSE20000 |
|
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S6J32EELSNSC20000 |
|
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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| T1451N52TOHXPSA1 |
|
Hersteller: Infineon Technologies
Description: SCR MODULE 5.2KV 2610A TO-200AF
Voltage - Off State: 5.2 kV
Current - On State (It (RMS)) (Max): 2610 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (AV)) (Max): 2320 A
Number of SCRs, Diodes: 1 SCR
Current - Non Rep. Surge 50, 60Hz (Itsm): 44000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Hold (Ih) (Max): 350 mA
Structure: Single
Operating Temperature: -40°C ~ 125°C
Mounting Type: Chassis Mount
Package / Case: TO-200AF
Packaging: Tray
Description: SCR MODULE 5.2KV 2610A TO-200AF
Voltage - Off State: 5.2 kV
Current - On State (It (RMS)) (Max): 2610 A
Part Status: Active
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (AV)) (Max): 2320 A
Number of SCRs, Diodes: 1 SCR
Current - Non Rep. Surge 50, 60Hz (Itsm): 44000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Hold (Ih) (Max): 350 mA
Structure: Single
Operating Temperature: -40°C ~ 125°C
Mounting Type: Chassis Mount
Package / Case: TO-200AF
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XMC4500F100F768ACXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-11
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-11
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 441 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 24.44 EUR |
| 10+ | 19.24 EUR |
| 90+ | 16.59 EUR |
| 180+ | 16.04 EUR |
| 270+ | 15.77 EUR |
| DF200R12KE3HOSA1 |
|
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 1040W MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1040 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
Description: IGBT MODULE 1200V 1040W MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1040 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 257.23 EUR |
| 10+ | 213.85 EUR |
| CY8C5288FNI-LP213T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 99WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 99-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 99-WLCSP (5.19x5.94)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 256KB FLASH 99WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 99-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x12b; D/A 1x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 99-WLCSP (5.19x5.94)
Part Status: Active
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
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| CY8C4725FNI-S402T |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 25WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 21
Part Status: Active
Supplier Device Package: 25-WLCSP (2.02x1.93)
Peripherals: Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b; D/A 2x7b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 25-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 32KB FLASH 25WLCSP
DigiKey Programmable: Not Verified
Number of I/O: 21
Part Status: Active
Supplier Device Package: 25-WLCSP (2.02x1.93)
Peripherals: Brown-out Detect/Reset, LCD, LVD, POR, PWM, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b; D/A 2x7b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 25-XFBGA, WLCSP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CYBLE-014008-00 |
|
Hersteller: Infineon Technologies
Description: RF TXRX MOD BT TH SMD
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: Integrated, Trace
Current - Transmitting: 12.5mA ~ 20mA
Current - Receiving: 16.4mA ~ 21.5mA
Protocol: Bluetooth v4.1
Data Rate: 1Mbps
Power - Output: 3dBm
Voltage - Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Memory Size: 128kB Flash, 16kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -87dBm
Package / Case: 32-SMD Module
Packaging: Tape & Reel (TR)
Description: RF TXRX MOD BT TH SMD
DigiKey Programmable: Not Verified
Part Status: Active
Serial Interfaces: I2C, SPI, UART
RF Family/Standard: Bluetooth
Antenna Type: Integrated, Trace
Current - Transmitting: 12.5mA ~ 20mA
Current - Receiving: 16.4mA ~ 21.5mA
Protocol: Bluetooth v4.1
Data Rate: 1Mbps
Power - Output: 3dBm
Voltage - Supply: 1.7V ~ 5.5V
Operating Temperature: -40°C ~ 85°C
Memory Size: 128kB Flash, 16kB SRAM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -87dBm
Package / Case: 32-SMD Module
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| CYBLE-014008-00 |
|
Hersteller: Infineon Technologies
Description: RF TXRX MOD BT TH SMD
Packaging: Cut Tape (CT)
Package / Case: 32-SMD Module
Sensitivity: -87dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 16kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 5.5V
Power - Output: 3dBm
Data Rate: 1Mbps
Protocol: Bluetooth v4.1
Current - Receiving: 16.4mA ~ 21.5mA
Current - Transmitting: 12.5mA ~ 20mA
Antenna Type: Integrated, Trace
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
Description: RF TXRX MOD BT TH SMD
Packaging: Cut Tape (CT)
Package / Case: 32-SMD Module
Sensitivity: -87dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 128kB Flash, 16kB SRAM
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.7V ~ 5.5V
Power - Output: 3dBm
Data Rate: 1Mbps
Protocol: Bluetooth v4.1
Current - Receiving: 16.4mA ~ 21.5mA
Current - Transmitting: 12.5mA ~ 20mA
Antenna Type: Integrated, Trace
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 33.09 EUR |
| 10+ | 28.81 EUR |
| 25+ | 27.33 EUR |
| 100+ | 25.3 EUR |
| MB89677ARPMC1-G-238E1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB MROM 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Connectivity: EBI/EMI, Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-PQFP (14x14)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB MROM 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Connectivity: EBI/EMI, Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 80-PQFP (14x14)
Part Status: Obsolete
Number of I/O: 39
DigiKey Programmable: Not Verified
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| MB90678PF-G-238-BND-BE1 |
Hersteller: Infineon Technologies
Description: AUTO IC MICRONTROLLER
DigiKey Programmable: Not Verified
Number of I/O: 84
Part Status: Obsolete
Supplier Device Package: 100-QFP (14x20)
Peripherals: POR, WDT
Connectivity: EBI/EMI, I²C, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-16L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 3K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Description: AUTO IC MICRONTROLLER
DigiKey Programmable: Not Verified
Number of I/O: 84
Part Status: Obsolete
Supplier Device Package: 100-QFP (14x20)
Peripherals: POR, WDT
Connectivity: EBI/EMI, I²C, SCI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-16L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 3K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
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Im Einkaufswagen
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| MB89193APF-G-238-BND-RE1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB MROM 28SOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tray
Peripherals: POR, WDT
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Description: IC MCU 8BIT 8KB MROM 28SOP
DigiKey Programmable: Not Verified
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tray
Peripherals: POR, WDT
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
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| ICE2QR2280GXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Produkt ist nicht verfügbar
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| ICE2QR2280GXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
auf Bestellung 7148 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 4.08 EUR |
| 10+ | 3.01 EUR |
| 25+ | 2.75 EUR |
| 100+ | 2.45 EUR |
| 250+ | 2.32 EUR |
| 500+ | 2.24 EUR |
| ICE2QR2280G1XUMA1 |
|
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Produkt ist nicht verfügbar
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| ICE2QR2280G1XUMA1 |
|
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 800V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 53 W
auf Bestellung 44 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 4.08 EUR |
| 10+ | 3.01 EUR |
| 25+ | 2.75 EUR |
| EVAL2QR2280G1TOBO1 |
|
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR ICE2QR2280G1
Packaging: Bulk
Voltage - Output: 5V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 4A
Contents: Board(s)
Frequency - Switching: 65kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: ICE2QR2280G-1
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 1 Isolated Output
Part Status: Active
Power - Output: 20W
Description: EVAL BOARD FOR ICE2QR2280G1
Packaging: Bulk
Voltage - Output: 5V
Voltage - Input: 85 ~ 265 VAC
Current - Output: 4A
Contents: Board(s)
Frequency - Switching: 65kHz
Regulator Topology: Flyback
Board Type: Fully Populated
Utilized IC / Part: ICE2QR2280G-1
Supplied Contents: Board(s)
Main Purpose: AC/DC, Primary Side
Outputs and Type: 1 Isolated Output
Part Status: Active
Power - Output: 20W
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 339.25 EUR |
| BAV99WB6327XT |
|
Hersteller: Infineon Technologies
Description: DIODE ARRAY GP 80V 200MA SOT323
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: PG-SOT323
Operating Temperature - Junction: 150°C (Max)
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 150 nA @ 70 V
Description: DIODE ARRAY GP 80V 200MA SOT323
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Mounting Type: Surface Mount
Speed: Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr): 4 ns
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 200mA (DC)
Supplier Device Package: PG-SOT323
Operating Temperature - Junction: 150°C (Max)
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 80 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 150 mA
Current - Reverse Leakage @ Vr: 150 nA @ 70 V
Produkt ist nicht verfügbar
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| TC334LP32F200FAAKXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 144TQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-144-27
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144TQFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-144-27
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| TC334LP32F200FAAKXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 144TQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-144-27
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 144TQFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-144-27
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 722 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 40.23 EUR |
| 10+ | 32.21 EUR |
| 25+ | 30.21 EUR |
| 100+ | 28.02 EUR |
| 250+ | 26.98 EUR |
| 500+ | 26.33 EUR |
| IKB30N65EH5ATMA1 |
|
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 55A TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO263-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 24ns/159ns
Switching Energy: 870µJ (on), 300µJ (off)
Test Condition: 400V, 30A, 22Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
Description: IGBT TRENCH FS 650V 55A TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO263-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 24ns/159ns
Switching Energy: 870µJ (on), 300µJ (off)
Test Condition: 400V, 30A, 22Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 2.68 EUR |
| 2000+ | 2.59 EUR |
| IKB30N65EH5ATMA1 |
|
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 55A TO263-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO263-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 24ns/159ns
Switching Energy: 870µJ (on), 300µJ (off)
Test Condition: 400V, 30A, 22Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
Description: IGBT TRENCH FS 650V 55A TO263-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO263-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 24ns/159ns
Switching Energy: 870µJ (on), 300µJ (off)
Test Condition: 400V, 30A, 22Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
auf Bestellung 4022 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.54 EUR |
| 10+ | 4.96 EUR |
| 100+ | 3.5 EUR |
| 500+ | 3.18 EUR |