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BTS3035EJDEMOBOARDTOBO1 BTS3035EJDEMOBOARDTOBO1 Infineon Technologies Infineon-Demoboard_Description_BTS3XXXEJ-UM-v01_00-EN.pdf?fileId=5546d462584d1d4a0158cf40d2dc031a Description: BTS3035EJ DEMOBOARD
Packaging: Bulk
Function: Switch
Type: Power Management
Contents: Board(s)
Utilized IC / Part: BTS3035EJ
Platform: Arduino
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IPD50N04S309ATMA1 IPD50N04S309ATMA1 Infineon Technologies Infineon-IPD50N04S3_09-DS-v01_01-en.pdf?folderId=db3a304412b407950112b42b75b74520&fileId=db3a30431b3e89eb011bb7664e2d070f&ack=t Description: MOSFET N-CH 40V 50A TO252-3
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 50A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 50A, 10V
Power Dissipation (Max): 63W (Tc)
Vgs(th) (Max) @ Id: 4V @ 28µA
Supplier Device Package: PG-TO252-3-11
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 26 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1750 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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D2450N04TXPSA1 D2450N04TXPSA1 Infineon Technologies Infineon-D2450N-DS-v03_01-en_de.pdf?fileId=db3a3043284aacd8012863a4b431538d Description: DIODE STANDARD 400V 2450A
Packaging: Tray
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 2450A
Operating Temperature - Junction: -40°C ~ 180°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 2000 A
Current - Reverse Leakage @ Vr: 50 mA @ 400 V
Produkt ist nicht verfügbar
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CY7C60413-16LKXC CY7C60413-16LKXC Infineon Technologies CY7C604xx.pdf Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
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4+5 EUR
10+4.49 EUR
25+4.25 EUR
80+3.68 EUR
230+3.49 EUR
490+3.13 EUR
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CY8C5867AXI-LP024 CY8C5867AXI-LP024 Infineon Technologies Infineon-PSoC_5LP_CY8C58LP_Family_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec547013ab9 Description: IC MCU 32BIT 128KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x20b, 1x12b; D/A 4x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 62
DigiKey Programmable: Not Verified
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CY8C5868AXI-LP032 CY8C5868AXI-LP032 Infineon Technologies Infineon-PSoC_5LP_CY8C58LP_Family_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec547013ab9 Description: IC MCU 32BIT 256KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x20b, 2x12b; D/A 4x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 62
DigiKey Programmable: Not Verified
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CYW88373CUBGT Infineon Technologies Description: WIRELESS AUTOMOTIVE
Packaging: Tape & Reel (TR)
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CYW88373CUBGT Infineon Technologies Description: WIRELESS AUTOMOTIVE
Packaging: Cut Tape (CT)
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10+15.79 EUR
25+14.44 EUR
100+12.77 EUR
250+11.89 EUR
500+11.32 EUR
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CYW55572MIWBGT CYW55572MIWBGT Infineon Technologies Description: RF TXRX MODULE BLUETOOTH WIFI
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz, 6GHz
Operating Temperature: -40°C ~ 85°C
Data Rate: 1.2Gbps
Protocol: Bluetooth v5.2
Antenna Type: Antenna Not Included
Utilized IC / Part: CYW55573
Modulation: 1024-QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, JTAG, PCM, UART
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CYW55572MIWBGT CYW55572MIWBGT Infineon Technologies Description: RF TXRX MODULE BLUETOOTH WIFI
Packaging: Cut Tape (CT)
Frequency: 2.4GHz, 5GHz, 6GHz
Operating Temperature: -40°C ~ 85°C
Data Rate: 1.2Gbps
Protocol: Bluetooth v5.2
Antenna Type: Antenna Not Included
Utilized IC / Part: CYW55573
Modulation: 1024-QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, JTAG, PCM, UART
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10+23.06 EUR
25+21.15 EUR
100+18.81 EUR
250+17.57 EUR
500+16.77 EUR
1000+16.07 EUR
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CYW88273CUBGT Infineon Technologies Description: RF TXRX MODULE WIFI BLUETOOTH
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW54907KWBGT CYW54907KWBGT Infineon Technologies Infineon-CYW54907_WICED_IEEE_802.11ac_IOT_System_on_Chip_with_Embedded_Applications_Processor-ProductBrief-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0f6618d353cf Description: IC RF TXRX+MCU BLE 316WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 316-XFBGA, WLCSP
Sensitivity: -98.9dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz, 4.9GHz ~ 5.85GHz
Memory Size: 640kB ROM, 2MB SRAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 4.8V
Power - Output: 20.5dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 72.4mA ~ 112mA
Data Rate (Max): 480Mbps
Current - Transmitting: 309mA ~ 334mA
Supplier Device Package: 316-WLCSP (4.91x5.85)
GPIO: 17
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, Cellular, WiFi
Serial Interfaces: I2C, I2S, JTAG, PWM, SDIO, SPI, UART, USB
Produkt ist nicht verfügbar
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CY22150FZXI CY22150FZXI Infineon Technologies download Description: IC CLOCK GENERATOR 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: CMOS
Frequency - Max: 166.6MHz
Type: Clock Generator, Fanout Distribution
Input: LVCMOS, LVTTL, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:6
Differential - Input:Output: No/No
Supplier Device Package: 16-TSSOP
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Verified
auf Bestellung 424 Stücke:
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1+27.07 EUR
10+21.48 EUR
96+18.58 EUR
192+18.01 EUR
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1EDS20I12SVXUMA1 1EDS20I12SVXUMA1 Infineon Technologies Infineon-1EDS20I12SV-DS-v00_73-en.pdf?fileId=5546d46145f1f3a40145faf0aa200fc1 Description: DIGITAL ISO 5KV 1CH GATE DVR
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Technology: Magnetic Coupling
Voltage - Isolation: 5000Vrms
Number of Channels: 1
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2+12.8 EUR
10+9.9 EUR
25+9.17 EUR
100+8.38 EUR
250+8 EUR
500+7.77 EUR
Mindestbestellmenge: 2
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TLD55421QUXUMA1 TLD55421QUXUMA1 Infineon Technologies Description: IC LED DRVR CTRL PWM 90MA 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Voltage - Output: 4.5V ~ 55V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 200kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Current - Output / Channel: 90mA
Internal Switch(s): Yes
Topology: Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: PG-TQFP-48
Dimming: Analog, PWM
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 36V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE7183QUXUMA1 TLE7183QUXUMA1 Infineon Technologies Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd Description: IC MOTOR DRIVER 5.5V-20V 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 5.5V ~ 20V
Technology: Power MOSFET
Supplier Device Package: PG-TQFP-48-8
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Produkt ist nicht verfügbar
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TLE7183QUXUMA2 TLE7183QUXUMA2 Infineon Technologies Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd Description: IC MOTOR DRIVER 5.5V-20V 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 5.5V ~ 20V
Technology: Power MOSFET
Supplier Device Package: PG-TQFP-48-8
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Produkt ist nicht verfügbar
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CY8C4125AZA-M443 CY8C4125AZA-M443 Infineon Technologies Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: PG-TQFP-48
Number of I/O: 38
Produkt ist nicht verfügbar
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CY8C4125AZA-M443T CY8C4125AZA-M443T Infineon Technologies Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: PG-TQFP-48
Number of I/O: 38
Produkt ist nicht verfügbar
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CY8C4125AZS-M443 CY8C4125AZS-M443 Infineon Technologies Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: PG-TQFP-48
Number of I/O: 38
Produkt ist nicht verfügbar
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PEF55008EV1.3-G-INF Infineon Technologies Description: GEMINAX D8 MAX IS A 8 CHANNEL AD
Packaging: Bulk
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PEF55008FV1.2 Infineon Technologies Description: GEMINAX D8 MAX IS A 8 CHANNEL AD
Packaging: Bulk
auf Bestellung 370 Stücke:
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8+66.09 EUR
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IRF7201TRPBFXTMA1 IRF7201TRPBFXTMA1 Infineon Technologies Description: PLANAR <=40V
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.3A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 7.3A, 10V
Power Dissipation (Max): 2.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: PG-DSO-8-902
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 550 pF @ 25 V
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AUIRLR3705Z AUIRLR3705Z Infineon Technologies AUIRLR3705Z.pdf Description: MOSFET N-CH 55V 42A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 42A, 10V
Power Dissipation (Max): 130W (Tc)
Vgs(th) (Max) @ Id: 3V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2900 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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CY2304SXI-2 CY2304SXI-2 Infineon Technologies Infineon-CY2304_3.3_V_ZERO_DELAY_BUFFER-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcfb162ee6 Description: IC FANOUT BUFFER 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: No/No
Supplier Device Package: 8-SOIC
PLL: Yes
Divider/Multiplier: Yes/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
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S6E2HE6F0AGV2000A S6E2HE6F0AGV2000A Infineon Technologies Infineon-S6E2H_Series_32-bit_Arm_Cortex-M4F_FM4_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed234f14ede Description: IC MCU 32BIT 544KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 544KB (544K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AUIPS6021RTRL AUIPS6021RTRL Infineon Technologies AUIPS6021%28S%2CR%29.pdf Description: IC PWR SWITCH N-CHANNEL 1:1 DPAK
Features: Auto Restart
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 24mOhm
Input Type: Non-Inverting
Voltage - Load: 36V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.9A
Ratio - Input:Output: 1:1
Supplier Device Package: TO-252AA (DPAK)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Grade: Automotive
Qualification: AEC-Q100
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AUIPS6021R AUIPS6021R Infineon Technologies AUIPS6021%28S%2CR%29.pdf Description: IC PWR SWITCH N-CHANNEL 1:1 DPAK
Packaging: Tube
Features: Auto Restart
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 24mOhm
Input Type: Non-Inverting
Voltage - Load: 36V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.9A
Ratio - Input:Output: 1:1
Supplier Device Package: TO-252AA (DPAK)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8CKIT-005-A CY8CKIT-005-A Infineon Technologies Infineon-CY8CKIT-005_MiniProg4_Quick_Start_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0f0123eb1859 Description: KIT PSOC MINIPROG4 PROGRAM DEBUG
Packaging: Bulk
For Use With/Related Products: MCU
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: MCU
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IRS25411PBF IRS25411PBF Infineon Technologies irs25401pbf.pdf?fileId=5546d462533600a40153567b06662826 Description: IC LED DRIVER CTRLR PWM 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Outputs: 1
Frequency: 500kHz
Type: DC DC Controller
Operating Temperature: -25°C ~ 150°C (TJ)
Internal Switch(s): No
Topology: Step-Down (Buck)
Supplier Device Package: 8-PDIP
Dimming: PWM
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16.6V
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IRS25411PBF IRS25411PBF Infineon Technologies irs25401pbf.pdf?fileId=5546d462533600a40153567b06662826 Description: IC LED DRIVER CTRLR PWM 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Outputs: 1
Frequency: 500kHz
Type: DC DC Controller
Operating Temperature: -25°C ~ 150°C (TJ)
Internal Switch(s): No
Topology: Step-Down (Buck)
Supplier Device Package: 8-PDIP
Dimming: PWM
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16.6V
Produkt ist nicht verfügbar
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F3L300R12PT4B26COSA1 F3L300R12PT4B26COSA1 Infineon Technologies Infineon-F3L300R12PT4_B26-DS-v02_00-en_de.pdf?fileId=db3a30433a747525013a87af3b9c6443 Description: IGBT MOD 1200V 460A 1650W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 300A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 460 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1650 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
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FDDF80R12W1H3B52BOMA1 Infineon Technologies Description: IGBT MODULE
Packaging: Bulk
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F3L75R12W1H3B11BPSA1 F3L75R12W1H3B11BPSA1 Infineon Technologies Infineon-F3L75R12W1H3_B11-DS-v02_00-EN.pdf?fileId=5546d462518ffd8501523f8b806b5034 Description: IGBT MOD 1200V 45A 275W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 30A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 45 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 275 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
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F450R07W1H3B11ABOMA1 F450R07W1H3B11ABOMA1 Infineon Technologies Infineon-F4_50R07W1H3_B11A-DS-v03_00-en_de.pdf?fileId=db3a3043405f2978014071e0c83f2079 Description: IGBT MODULES
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.85V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 200 W
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 3.25 nF @ 25 V
Produkt ist nicht verfügbar
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DF200R12W1H3B27BOMA1 DF200R12W1H3B27BOMA1 Infineon Technologies Infineon-DF200R12W1H3_B27-DS-v02_00-en_de.pdf?fileId=5546d4614546039901456441be013fad Description: IGBT MOD 1200V 30A 375W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 1.3V @ 15V, 30A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 30 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 375 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 2 nF @ 25 V
Produkt ist nicht verfügbar
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BGA7H1BN6E6327XTSA1 BGA7H1BN6E6327XTSA1 Infineon Technologies Infineon-BGA7H1BN6-DS-v03_02-EN.pdf?fileId=5546d46254e133b401552f47303f69d3 Description: IC AMP LTE 1.805-2.69GHZ TSNP6
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.6V
Gain: 11dB
Current - Supply: 4.3mA
Noise Figure: 2.7dB
Test Frequency: 2.69GHz
Supplier Device Package: PG-TSNP-6-2
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BGA7H1BN6E6327XTSA1 BGA7H1BN6E6327XTSA1 Infineon Technologies Infineon-BGA7H1BN6-DS-v03_02-EN.pdf?fileId=5546d46254e133b401552f47303f69d3 Description: IC AMP LTE 1.805-2.69GHZ TSNP6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.6V
Gain: 11dB
Current - Supply: 4.3mA
Noise Figure: 2.7dB
Test Frequency: 2.69GHz
Supplier Device Package: PG-TSNP-6-2
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BGA525N6E6327XTSA1 BGA525N6E6327XTSA1 Infineon Technologies Infineon-BGA525N6-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c872bd8d6018775bb1e8d010e Description: IC AMP GPS LNA FOR BAND L1/L5
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.16GHz ~ 1.62GHz
RF Type: 5G, GNSS, LTE
Voltage - Supply: 1.1V ~ 3.3V
Gain: 21dB
Current - Supply: 1.5mA
Noise Figure: 0.7dB
Supplier Device Package: PG-TSNP-6-10
Produkt ist nicht verfügbar
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BGA525N6E6327XTSA1 BGA525N6E6327XTSA1 Infineon Technologies Infineon-BGA525N6-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c872bd8d6018775bb1e8d010e Description: IC AMP GPS LNA FOR BAND L1/L5
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.16GHz ~ 1.62GHz
RF Type: 5G, GNSS, LTE
Voltage - Supply: 1.1V ~ 3.3V
Gain: 21dB
Current - Supply: 1.5mA
Noise Figure: 0.7dB
Supplier Device Package: PG-TSNP-6-10
Produkt ist nicht verfügbar
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BGA8V1BN6E6327XTSA1 BGA8V1BN6E6327XTSA1 Infineon Technologies Infineon-BGA8V1BN6-DS-v03_03-EN.pdf?fileId=5546d462617643590161b39f384935a5 Description: IC RF AMP 3.4GHZ-3.8GHZ TSNP6
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
Voltage - Supply: 1.6V ~ 3.1V
Current - Supply: 4.2mA
Noise Figure: 1.2dB ~ 5.3dB
P1dB: -3dBm
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: PG-TSNP-6-2
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BGA8U1BN6E6327XTSA1 BGA8U1BN6E6327XTSA1 Infineon Technologies Infineon-BGA8U1BN6-DS-v03_01-EN.pdf?fileId=5546d462617643590161b39607a63591 Description: IC RF AMP 5.15GHZ-5.85GHZ TSNP6
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 5.15GHz ~ 5.85GHz
Voltage - Supply: 1.6V ~ 3.1V
Current - Supply: 4mA
Noise Figure: 1.6dB ~ 5dB
P1dB: -5dBm
Test Frequency: 5.15GHz ~ 5.85GHz
Supplier Device Package: PG-TSNP-6-2
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BGA8H1BN6E6327XTSA1 BGA8H1BN6E6327XTSA1 Infineon Technologies Description: IC RF AMP 1.805GHZ-2.69GHZ TSNP6
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.69GHz
Voltage - Supply: 1.6V ~ 3.1V
Current - Supply: 6mA
Noise Figure: 0.85dB ~ 3.6dB
P1dB: 13.5dBm
Test Frequency: 1.805GHz ~ 2.69GHz
Supplier Device Package: PG-TSNP-6-2
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BGA6H1BN6E6327XTSA1 Infineon Technologies fundamentals-of-power-semiconductors Description: IC RF AMP TSNP-6
Packaging: Bulk
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BGA6L1BN6E6327XTSA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: IC RF AMP TSNP-6
Packaging: Tape & Reel (TR)
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CY15E004J-SXA CY15E004J-SXA Infineon Technologies Infineon-CY15E004J_4-Kbit_(512_x_8)_Serial_(I2C)_Automotive-A_F-RAM-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee354ee6a48&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FRAM 4KBIT I2C 1MHZ 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 1 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Memory Interface: I2C
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4125PVI-482 CY8C4125PVI-482 Infineon Technologies Infineon-PSoC_4_PSoC_4100_Family-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec86cc240d7&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 32KB FLASH 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR; D/A 2xIDAC
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
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145+3.5 EUR
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CY9BF121JLPMC-G-JNE2 CY9BF121JLPMC-G-JNE2 Infineon Technologies Description: IC MCU 32BIT 64KB 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 23
Produkt ist nicht verfügbar
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CY9BF121LQN-G-AVE2 CY9BF121LQN-G-AVE2 Infineon Technologies Infineon-CY9B120M_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edfa79064e9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 96KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 23x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF121MPMC1-G-JNE2 CY9BF121MPMC1-G-JNE2 Infineon Technologies Infineon-CY9B120M_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edfa79064e9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 96KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 26x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF121KQN-G-AVE2 CY9BF121KQN-G-AVE2 Infineon Technologies Infineon-CY9B120M_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edfa79064e9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 14x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
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10+7.36 EUR
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80+6.26 EUR
260+5.87 EUR
520+5.69 EUR
1040+5.55 EUR
2600+5.39 EUR
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IPP052N06L3GXKSA1 IPP052N06L3GXKSA1 Infineon Technologies Infineon-IPP_B052N06L3-DS-v02_04-en.pdf?fileId=db3a30432313ff5e0123a32d97c125b6 Description: MOSFET N-CH 60V 80A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 80A (Tc)
Rds On (Max) @ Id, Vgs: 5mOhm @ 80A, 10V
Power Dissipation (Max): 115W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 58µA
Supplier Device Package: PG-TO220-3
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 50 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 8400 pF @ 30 V
Produkt ist nicht verfügbar
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S29GL512S10DHSS30 S29GL512S10DHSS30 Infineon Technologies Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BCP49H6419 BCP49H6419 Infineon Technologies INFNS10858-1.pdf?t.download=true&u=5oefqw Description: BIPOLAR DARLINGTON TRANSISTOR
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 10000 @ 100mA, 5V
Frequency - Transition: 200MHz
Supplier Device Package: PG-SOT223-4
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1.5 W
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2308+0.22 EUR
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BCP49H6327XTSA1 BCP49H6327XTSA1 Infineon Technologies bcp49.pdf?folderId=db3a30431441fb5d011445c30f210183&fileId=db3a30431441fb5d011445c44a930184 Description: TRANS NPN DARL 60V 0.5A SOT223-4
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 10000 @ 100mA, 5V
Frequency - Transition: 200MHz
Supplier Device Package: PG-SOT223-4-10
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1.5 W
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FF200R06KE3HOSA1 FF200R06KE3HOSA1 Infineon Technologies Infineon-FF200R06KE3-DS-v03_00-en_de.pdf?fileId=db3a304412b407950112b434a07960d4 Description: IGBT MOD 600V 260A 680W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 260 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 680 W
Current - Collector Cutoff (Max): 5 mA
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10+111.42 EUR
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FF200R12KE4PHOSA1 FF200R12KE4PHOSA1 Infineon Technologies Infineon-FF200R12KE4P-DS-v02_00-EN.pdf?fileId=5546d46253a864fe0153e69514d8791d Description: IGBT MODULE 1200V 200A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 200 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
Produkt ist nicht verfügbar
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FF200R17KE4PHPSA1 Infineon Technologies Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 310 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1250 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 18 nF @ 25 V
Produkt ist nicht verfügbar
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FF200R17KE3HDLA1 Infineon Technologies Description: MEDIUM POWER 62MM
Packaging: Tape & Reel (TR)
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Switch
Operating Temperature: -40°C ~ 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 310 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1250 W
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 18 nF @ 25 V
Produkt ist nicht verfügbar
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IR2233PBF IR2233PBF Infineon Technologies IRSDS12168-1.pdf?t.download=true&u=5oefqw description Description: IC GATE DRVR HALF-BRIDGE 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Operating Temperature: 125°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Inverting
High Side Voltage - Max (Bootstrap): 1200 V
Supplier Device Package: 28-PDIP
Rise / Fall Time (Typ): 90ns, 40ns
Channel Type: 3-Phase
Driven Configuration: Half-Bridge
Number of Drivers: 6
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 250mA, 500mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTS3035EJDEMOBOARDTOBO1 Infineon-Demoboard_Description_BTS3XXXEJ-UM-v01_00-EN.pdf?fileId=5546d462584d1d4a0158cf40d2dc031a
BTS3035EJDEMOBOARDTOBO1
Hersteller: Infineon Technologies
Description: BTS3035EJ DEMOBOARD
Packaging: Bulk
Function: Switch
Type: Power Management
Contents: Board(s)
Utilized IC / Part: BTS3035EJ
Platform: Arduino
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+50.62 EUR
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IPD50N04S309ATMA1 Infineon-IPD50N04S3_09-DS-v01_01-en.pdf?folderId=db3a304412b407950112b42b75b74520&fileId=db3a30431b3e89eb011bb7664e2d070f&ack=t
IPD50N04S309ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 50A TO252-3
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 50A (Tc)
Rds On (Max) @ Id, Vgs: 9mOhm @ 50A, 10V
Power Dissipation (Max): 63W (Tc)
Vgs(th) (Max) @ Id: 4V @ 28µA
Supplier Device Package: PG-TO252-3-11
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 26 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1750 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 75899 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
465+1.09 EUR
Mindestbestellmenge: 465
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D2450N04TXPSA1 Infineon-D2450N-DS-v03_01-en_de.pdf?fileId=db3a3043284aacd8012863a4b431538d
D2450N04TXPSA1
Hersteller: Infineon Technologies
Description: DIODE STANDARD 400V 2450A
Packaging: Tray
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 2450A
Operating Temperature - Junction: -40°C ~ 180°C
Voltage - DC Reverse (Vr) (Max): 400 V
Voltage - Forward (Vf) (Max) @ If: 880 mV @ 2000 A
Current - Reverse Leakage @ Vr: 50 mA @ 400 V
Produkt ist nicht verfügbar
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CY7C60413-16LKXC CY7C604xx.pdf
CY7C60413-16LKXC
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 1K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 1x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 490 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5 EUR
10+4.49 EUR
25+4.25 EUR
80+3.68 EUR
230+3.49 EUR
490+3.13 EUR
Mindestbestellmenge: 4
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CY8C5867AXI-LP024 Infineon-PSoC_5LP_CY8C58LP_Family_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec547013ab9
CY8C5867AXI-LP024
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x20b, 1x12b; D/A 4x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 62
DigiKey Programmable: Not Verified
auf Bestellung 63 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+35.85 EUR
10+28.87 EUR
25+27.15 EUR
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CY8C5868AXI-LP032 Infineon-PSoC_5LP_CY8C58LP_Family_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec547013ab9
CY8C5868AXI-LP032
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 1x20b, 2x12b; D/A 4x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 62
DigiKey Programmable: Not Verified
auf Bestellung 2152 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+45.37 EUR
10+36.59 EUR
90+32.14 EUR
180+31.22 EUR
270+30.76 EUR
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CYW88373CUBGT
Hersteller: Infineon Technologies
Description: WIRELESS AUTOMOTIVE
Packaging: Tape & Reel (TR)
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+9.9 EUR
Mindestbestellmenge: 5000
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CYW88373CUBGT
Hersteller: Infineon Technologies
Description: WIRELESS AUTOMOTIVE
Packaging: Cut Tape (CT)
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.28 EUR
10+15.79 EUR
25+14.44 EUR
100+12.77 EUR
250+11.89 EUR
500+11.32 EUR
1000+10.82 EUR
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CYW55572MIWBGT
CYW55572MIWBGT
Hersteller: Infineon Technologies
Description: RF TXRX MODULE BLUETOOTH WIFI
Packaging: Tape & Reel (TR)
Frequency: 2.4GHz, 5GHz, 6GHz
Operating Temperature: -40°C ~ 85°C
Data Rate: 1.2Gbps
Protocol: Bluetooth v5.2
Antenna Type: Antenna Not Included
Utilized IC / Part: CYW55573
Modulation: 1024-QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, JTAG, PCM, UART
Produkt ist nicht verfügbar
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CYW55572MIWBGT
CYW55572MIWBGT
Hersteller: Infineon Technologies
Description: RF TXRX MODULE BLUETOOTH WIFI
Packaging: Cut Tape (CT)
Frequency: 2.4GHz, 5GHz, 6GHz
Operating Temperature: -40°C ~ 85°C
Data Rate: 1.2Gbps
Protocol: Bluetooth v5.2
Antenna Type: Antenna Not Included
Utilized IC / Part: CYW55573
Modulation: 1024-QAM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2C, I2S, JTAG, PCM, UART
auf Bestellung 4989 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.44 EUR
10+23.06 EUR
25+21.15 EUR
100+18.81 EUR
250+17.57 EUR
500+16.77 EUR
1000+16.07 EUR
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CYW88273CUBGT
Hersteller: Infineon Technologies
Description: RF TXRX MODULE WIFI BLUETOOTH
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW54907KWBGT Infineon-CYW54907_WICED_IEEE_802.11ac_IOT_System_on_Chip_with_Embedded_Applications_Processor-ProductBrief-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0f6618d353cf
CYW54907KWBGT
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 316WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 316-XFBGA, WLCSP
Sensitivity: -98.9dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz ~ 2.5GHz, 4.9GHz ~ 5.85GHz
Memory Size: 640kB ROM, 2MB SRAM
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C (TA)
Voltage - Supply: 2.3V ~ 4.8V
Power - Output: 20.5dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.2
Current - Receiving: 72.4mA ~ 112mA
Data Rate (Max): 480Mbps
Current - Transmitting: 309mA ~ 334mA
Supplier Device Package: 316-WLCSP (4.91x5.85)
GPIO: 17
Modulation: CCK, DSSS, OFDM
RF Family/Standard: Bluetooth, Cellular, WiFi
Serial Interfaces: I2C, I2S, JTAG, PWM, SDIO, SPI, UART, USB
Produkt ist nicht verfügbar
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CY22150FZXI download
CY22150FZXI
Hersteller: Infineon Technologies
Description: IC CLOCK GENERATOR 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: CMOS
Frequency - Max: 166.6MHz
Type: Clock Generator, Fanout Distribution
Input: LVCMOS, LVTTL, Crystal
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 1:6
Differential - Input:Output: No/No
Supplier Device Package: 16-TSSOP
PLL: Yes
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Verified
auf Bestellung 424 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.07 EUR
10+21.48 EUR
96+18.58 EUR
192+18.01 EUR
288+17.72 EUR
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1EDS20I12SVXUMA1 Infineon-1EDS20I12SV-DS-v00_73-en.pdf?fileId=5546d46145f1f3a40145faf0aa200fc1
1EDS20I12SVXUMA1
Hersteller: Infineon Technologies
Description: DIGITAL ISO 5KV 1CH GATE DVR
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Technology: Magnetic Coupling
Voltage - Isolation: 5000Vrms
Number of Channels: 1
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.8 EUR
10+9.9 EUR
25+9.17 EUR
100+8.38 EUR
250+8 EUR
500+7.77 EUR
Mindestbestellmenge: 2
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TLD55421QUXUMA1
TLD55421QUXUMA1
Hersteller: Infineon Technologies
Description: IC LED DRVR CTRL PWM 90MA 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Voltage - Output: 4.5V ~ 55V
Mounting Type: Surface Mount
Number of Outputs: 1
Frequency: 200kHz ~ 700kHz
Type: DC DC Controller
Operating Temperature: -40°C ~ 150°C (TJ)
Applications: Lighting
Current - Output / Channel: 90mA
Internal Switch(s): Yes
Topology: Step-Down (Buck), Step-Up (Boost)
Supplier Device Package: PG-TQFP-48
Dimming: Analog, PWM
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 36V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE7183QUXUMA1 Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd
TLE7183QUXUMA1
Hersteller: Infineon Technologies
Description: IC MOTOR DRIVER 5.5V-20V 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 5.5V ~ 20V
Technology: Power MOSFET
Supplier Device Package: PG-TQFP-48-8
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Produkt ist nicht verfügbar
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TLE7183QUXUMA2 Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd
TLE7183QUXUMA2
Hersteller: Infineon Technologies
Description: IC MOTOR DRIVER 5.5V-20V 48TQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Commutation, Direction Management
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Pre-Driver - Half Bridge (3)
Voltage - Supply: 5.5V ~ 20V
Technology: Power MOSFET
Supplier Device Package: PG-TQFP-48-8
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Produkt ist nicht verfügbar
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CY8C4125AZA-M443
CY8C4125AZA-M443
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: PG-TQFP-48
Number of I/O: 38
Produkt ist nicht verfügbar
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CY8C4125AZA-M443T
CY8C4125AZA-M443T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tape & Reel (TR)
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: PG-TQFP-48
Number of I/O: 38
Produkt ist nicht verfügbar
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CY8C4125AZS-M443
CY8C4125AZS-M443
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: PG-TQFP-48
Number of I/O: 38
Produkt ist nicht verfügbar
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PEF55008EV1.3-G-INF
Hersteller: Infineon Technologies
Description: GEMINAX D8 MAX IS A 8 CHANNEL AD
Packaging: Bulk
Produkt ist nicht verfügbar
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PEF55008FV1.2
Hersteller: Infineon Technologies
Description: GEMINAX D8 MAX IS A 8 CHANNEL AD
Packaging: Bulk
auf Bestellung 370 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+66.09 EUR
Mindestbestellmenge: 8
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IRF7201TRPBFXTMA1
IRF7201TRPBFXTMA1
Hersteller: Infineon Technologies
Description: PLANAR <=40V
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.3A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 7.3A, 10V
Power Dissipation (Max): 2.5W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: PG-DSO-8-902
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 550 pF @ 25 V
Produkt ist nicht verfügbar
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AUIRLR3705Z AUIRLR3705Z.pdf
AUIRLR3705Z
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 42A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 8mOhm @ 42A, 10V
Power Dissipation (Max): 130W (Tc)
Vgs(th) (Max) @ Id: 3V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 2900 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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CY2304SXI-2 Infineon-CY2304_3.3_V_ZERO_DELAY_BUFFER-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcfb162ee6
CY2304SXI-2
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: Clock
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:4
Differential - Input:Output: No/No
Supplier Device Package: 8-SOIC
PLL: Yes
Divider/Multiplier: Yes/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 49 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.95 EUR
10+17.28 EUR
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S6E2HE6F0AGV2000A Infineon-S6E2H_Series_32-bit_Arm_Cortex-M4F_FM4_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed234f14ede
S6E2HE6F0AGV2000A
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 544KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 544KB (544K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SD, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AUIPS6021RTRL AUIPS6021%28S%2CR%29.pdf
AUIPS6021RTRL
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHANNEL 1:1 DPAK
Features: Auto Restart
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 24mOhm
Input Type: Non-Inverting
Voltage - Load: 36V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.9A
Ratio - Input:Output: 1:1
Supplier Device Package: TO-252AA (DPAK)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AUIPS6021R AUIPS6021%28S%2CR%29.pdf
AUIPS6021R
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHANNEL 1:1 DPAK
Packaging: Tube
Features: Auto Restart
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 24mOhm
Input Type: Non-Inverting
Voltage - Load: 36V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 3.9A
Ratio - Input:Output: 1:1
Supplier Device Package: TO-252AA (DPAK)
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8CKIT-005-A Infineon-CY8CKIT-005_MiniProg4_Quick_Start_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0f0123eb1859
CY8CKIT-005-A
Hersteller: Infineon Technologies
Description: KIT PSOC MINIPROG4 PROGRAM DEBUG
Packaging: Bulk
For Use With/Related Products: MCU
Type: Debugger, Programmer (In-Circuit/In-System)
Contents: Board(s)
Utilized IC / Part: MCU
auf Bestellung 1418 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+151.78 EUR
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IRS25411PBF irs25401pbf.pdf?fileId=5546d462533600a40153567b06662826
IRS25411PBF
Hersteller: Infineon Technologies
Description: IC LED DRIVER CTRLR PWM 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Outputs: 1
Frequency: 500kHz
Type: DC DC Controller
Operating Temperature: -25°C ~ 150°C (TJ)
Internal Switch(s): No
Topology: Step-Down (Buck)
Supplier Device Package: 8-PDIP
Dimming: PWM
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16.6V
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
289+1.69 EUR
Mindestbestellmenge: 289
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IRS25411PBF irs25401pbf.pdf?fileId=5546d462533600a40153567b06662826
IRS25411PBF
Hersteller: Infineon Technologies
Description: IC LED DRIVER CTRLR PWM 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Number of Outputs: 1
Frequency: 500kHz
Type: DC DC Controller
Operating Temperature: -25°C ~ 150°C (TJ)
Internal Switch(s): No
Topology: Step-Down (Buck)
Supplier Device Package: 8-PDIP
Dimming: PWM
Voltage - Supply (Min): 8V
Voltage - Supply (Max): 16.6V
Produkt ist nicht verfügbar
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F3L300R12PT4B26COSA1 Infineon-F3L300R12PT4_B26-DS-v02_00-en_de.pdf?fileId=db3a30433a747525013a87af3b9c6443
F3L300R12PT4B26COSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 460A 1650W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 300A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 460 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1650 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+530.71 EUR
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FDDF80R12W1H3B52BOMA1
Hersteller: Infineon Technologies
Description: IGBT MODULE
Packaging: Bulk
auf Bestellung 672 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+52.66 EUR
Mindestbestellmenge: 11
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F3L75R12W1H3B11BPSA1 Infineon-F3L75R12W1H3_B11-DS-v02_00-EN.pdf?fileId=5546d462518ffd8501523f8b806b5034
F3L75R12W1H3B11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 45A 275W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 30A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 45 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 275 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 4.4 nF @ 25 V
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+70.4 EUR
24+48.18 EUR
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F450R07W1H3B11ABOMA1 Infineon-F4_50R07W1H3_B11A-DS-v03_00-en_de.pdf?fileId=db3a3043405f2978014071e0c83f2079
F450R07W1H3B11ABOMA1
Hersteller: Infineon Technologies
Description: IGBT MODULES
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.85V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 200 W
Current - Collector Cutoff (Max): 50 µA
Input Capacitance (Cies) @ Vce: 3.25 nF @ 25 V
Produkt ist nicht verfügbar
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DF200R12W1H3B27BOMA1 Infineon-DF200R12W1H3_B27-DS-v02_00-en_de.pdf?fileId=5546d4614546039901456441be013fad
DF200R12W1H3B27BOMA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 30A 375W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 1.3V @ 15V, 30A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 30 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 375 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 2 nF @ 25 V
Produkt ist nicht verfügbar
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BGA7H1BN6E6327XTSA1 Infineon-BGA7H1BN6-DS-v03_02-EN.pdf?fileId=5546d46254e133b401552f47303f69d3
BGA7H1BN6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP LTE 1.805-2.69GHZ TSNP6
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.6V
Gain: 11dB
Current - Supply: 4.3mA
Noise Figure: 2.7dB
Test Frequency: 2.69GHz
Supplier Device Package: PG-TSNP-6-2
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15000+0.41 EUR
Mindestbestellmenge: 15000
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BGA7H1BN6E6327XTSA1 Infineon-BGA7H1BN6-DS-v03_02-EN.pdf?fileId=5546d46254e133b401552f47303f69d3
BGA7H1BN6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP LTE 1.805-2.69GHZ TSNP6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.69GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.6V
Gain: 11dB
Current - Supply: 4.3mA
Noise Figure: 2.7dB
Test Frequency: 2.69GHz
Supplier Device Package: PG-TSNP-6-2
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.18 EUR
17+1.05 EUR
25+0.98 EUR
100+0.8 EUR
250+0.75 EUR
500+0.63 EUR
1000+0.51 EUR
2500+0.46 EUR
5000+0.43 EUR
Mindestbestellmenge: 15
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BGA525N6E6327XTSA1 Infineon-BGA525N6-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c872bd8d6018775bb1e8d010e
BGA525N6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP GPS LNA FOR BAND L1/L5
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.16GHz ~ 1.62GHz
RF Type: 5G, GNSS, LTE
Voltage - Supply: 1.1V ~ 3.3V
Gain: 21dB
Current - Supply: 1.5mA
Noise Figure: 0.7dB
Supplier Device Package: PG-TSNP-6-10
Produkt ist nicht verfügbar
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BGA525N6E6327XTSA1 Infineon-BGA525N6-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c872bd8d6018775bb1e8d010e
BGA525N6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP GPS LNA FOR BAND L1/L5
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.16GHz ~ 1.62GHz
RF Type: 5G, GNSS, LTE
Voltage - Supply: 1.1V ~ 3.3V
Gain: 21dB
Current - Supply: 1.5mA
Noise Figure: 0.7dB
Supplier Device Package: PG-TSNP-6-10
Produkt ist nicht verfügbar
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BGA8V1BN6E6327XTSA1 Infineon-BGA8V1BN6-DS-v03_03-EN.pdf?fileId=5546d462617643590161b39f384935a5
BGA8V1BN6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF AMP 3.4GHZ-3.8GHZ TSNP6
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 3.4GHz ~ 3.8GHz
Voltage - Supply: 1.6V ~ 3.1V
Current - Supply: 4.2mA
Noise Figure: 1.2dB ~ 5.3dB
P1dB: -3dBm
Test Frequency: 3.4GHz ~ 3.8GHz
Supplier Device Package: PG-TSNP-6-2
auf Bestellung 1492500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
896+0.6 EUR
Mindestbestellmenge: 896
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BGA8U1BN6E6327XTSA1 Infineon-BGA8U1BN6-DS-v03_01-EN.pdf?fileId=5546d462617643590161b39607a63591
BGA8U1BN6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF AMP 5.15GHZ-5.85GHZ TSNP6
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 5.15GHz ~ 5.85GHz
Voltage - Supply: 1.6V ~ 3.1V
Current - Supply: 4mA
Noise Figure: 1.6dB ~ 5dB
P1dB: -5dBm
Test Frequency: 5.15GHz ~ 5.85GHz
Supplier Device Package: PG-TSNP-6-2
auf Bestellung 44978 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
896+0.56 EUR
Mindestbestellmenge: 896
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BGA8H1BN6E6327XTSA1
BGA8H1BN6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF AMP 1.805GHZ-2.69GHZ TSNP6
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.805GHz ~ 2.69GHz
Voltage - Supply: 1.6V ~ 3.1V
Current - Supply: 6mA
Noise Figure: 0.85dB ~ 3.6dB
P1dB: 13.5dBm
Test Frequency: 1.805GHz ~ 2.69GHz
Supplier Device Package: PG-TSNP-6-2
Produkt ist nicht verfügbar
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BGA6H1BN6E6327XTSA1 fundamentals-of-power-semiconductors
Hersteller: Infineon Technologies
Description: IC RF AMP TSNP-6
Packaging: Bulk
auf Bestellung 2175000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
796+0.6 EUR
Mindestbestellmenge: 796
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BGA6L1BN6E6327XTSA1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: IC RF AMP TSNP-6
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY15E004J-SXA Infineon-CY15E004J_4-Kbit_(512_x_8)_Serial_(I2C)_Automotive-A_F-RAM-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee354ee6a48&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY15E004J-SXA
Hersteller: Infineon Technologies
Description: IC FRAM 4KBIT I2C 1MHZ 8SOIC
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 4Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 1 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Memory Interface: I2C
Memory Organization: 512 x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4125PVI-482 Infineon-PSoC_4_PSoC_4100_Family-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec86cc240d7&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY8C4125PVI-482
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b SAR; D/A 2xIDAC
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 22
DigiKey Programmable: Not Verified
auf Bestellung 678 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
145+3.5 EUR
Mindestbestellmenge: 145
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CY9BF121JLPMC-G-JNE2
CY9BF121JLPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB 32LQFP
Packaging: Tray
Package / Case: 32-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 32-LQFP (7x7)
Number of I/O: 23
Produkt ist nicht verfügbar
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CY9BF121LQN-G-AVE2 Infineon-CY9B120M_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edfa79064e9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9BF121LQN-G-AVE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB FLASH 64QFN
Packaging: Tray
Package / Case: 64-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 23x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 64-QFN (9x9)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF121MPMC1-G-JNE2 Infineon-CY9B120M_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edfa79064e9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9BF121MPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 26x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Number of I/O: 65
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF121KQN-G-AVE2 Infineon-CY9B120M_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edfa79064e9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9BF121KQN-G-AVE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 72MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 14x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 35
DigiKey Programmable: Not Verified
auf Bestellung 2600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.61 EUR
10+7.36 EUR
25+6.79 EUR
80+6.26 EUR
260+5.87 EUR
520+5.69 EUR
1040+5.55 EUR
2600+5.39 EUR
Mindestbestellmenge: 2
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IPP052N06L3GXKSA1 Infineon-IPP_B052N06L3-DS-v02_04-en.pdf?fileId=db3a30432313ff5e0123a32d97c125b6
IPP052N06L3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 80A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 80A (Tc)
Rds On (Max) @ Id, Vgs: 5mOhm @ 80A, 10V
Power Dissipation (Max): 115W (Tc)
Vgs(th) (Max) @ Id: 2.2V @ 58µA
Supplier Device Package: PG-TO220-3
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 50 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 8400 pF @ 30 V
Produkt ist nicht verfügbar
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S29GL512S10DHSS30
S29GL512S10DHSS30
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BCP49H6419 INFNS10858-1.pdf?t.download=true&u=5oefqw
BCP49H6419
Hersteller: Infineon Technologies
Description: BIPOLAR DARLINGTON TRANSISTOR
Packaging: Bulk
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 10000 @ 100mA, 5V
Frequency - Transition: 200MHz
Supplier Device Package: PG-SOT223-4
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1.5 W
auf Bestellung 16000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2308+0.22 EUR
Mindestbestellmenge: 2308
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BCP49H6327XTSA1 bcp49.pdf?folderId=db3a30431441fb5d011445c30f210183&fileId=db3a30431441fb5d011445c44a930184
BCP49H6327XTSA1
Hersteller: Infineon Technologies
Description: TRANS NPN DARL 60V 0.5A SOT223-4
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 10000 @ 100mA, 5V
Frequency - Transition: 200MHz
Supplier Device Package: PG-SOT223-4-10
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 60 V
Power - Max: 1.5 W
Produkt ist nicht verfügbar
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FF200R06KE3HOSA1 Infineon-FF200R06KE3-DS-v03_00-en_de.pdf?fileId=db3a304412b407950112b434a07960d4
FF200R06KE3HOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 600V 260A 680W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 260 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 680 W
Current - Collector Cutoff (Max): 5 mA
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+137.17 EUR
10+111.42 EUR
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FF200R12KE4PHOSA1 Infineon-FF200R12KE4P-DS-v02_00-EN.pdf?fileId=5546d46253a864fe0153e69514d8791d
FF200R12KE4PHOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 200A
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 200 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
Produkt ist nicht verfügbar
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FF200R17KE4PHPSA1
Hersteller: Infineon Technologies
Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 310 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1250 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 18 nF @ 25 V
Produkt ist nicht verfügbar
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FF200R17KE3HDLA1
Hersteller: Infineon Technologies
Description: MEDIUM POWER 62MM
Packaging: Tape & Reel (TR)
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Switch
Operating Temperature: -40°C ~ 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 310 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1250 W
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 18 nF @ 25 V
Produkt ist nicht verfügbar
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IR2233PBF description IRSDS12168-1.pdf?t.download=true&u=5oefqw
IR2233PBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 28DIP
Packaging: Tube
Package / Case: 28-DIP (0.600", 15.24mm)
Mounting Type: Through Hole
Operating Temperature: 125°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Inverting
High Side Voltage - Max (Bootstrap): 1200 V
Supplier Device Package: 28-PDIP
Rise / Fall Time (Typ): 90ns, 40ns
Channel Type: 3-Phase
Driven Configuration: Half-Bridge
Number of Drivers: 6
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2V
Current - Peak Output (Source, Sink): 250mA, 500mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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