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FZ1500R33HE3BPSA1 FZ1500R33HE3BPSA1 Infineon Technologies Infineon-FZ1500R33HE3-DS-v03_01-en_de.pdf?fileId=db3a304314dca389011527dfc61411c3 Description: IGBT MOD 3300V 1500A 17000W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1500A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 1500 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 17000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
auf Bestellung 57 Stücke:
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1+2766.72 EUR
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FF400R33KF2CNOSA1 FF400R33KF2CNOSA1 Infineon Technologies Infineon-FF400R33KF2C-DS-v02_01-en_de.pdf?fileId=db3a304412b407950112b430e9825263 Description: IGBT MOD 3300V 660A 4800W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 4.25V @ 15V, 400A
NTC Thermistor: No
Supplier Device Package: Module
Current - Collector (Ic) (Max): 660 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 4800 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 50 nF @ 25 V
Produkt ist nicht verfügbar
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CY8C27643-24PVXIT CY8C27643-24PVXIT Infineon Technologies download Description: IC MCU 8BIT 16KB FLASH 48SSOP
Packaging: Cut Tape (CT)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 4x14b; D/A 4x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-SSOP
Number of I/O: 44
DigiKey Programmable: Verified
auf Bestellung 464 Stücke:
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1+21.16 EUR
10+16.64 EUR
25+15.52 EUR
100+14.28 EUR
250+13.69 EUR
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PEB3352HTV2.1 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 540 Stücke:
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35+14.78 EUR
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PEB3332FV2.1 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 11400 Stücke:
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24+21.43 EUR
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PEB3320HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 360 Stücke:
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24+21.85 EUR
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PEB3314EV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 180 Stücke:
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19+27.37 EUR
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PEB3314HLV1.4 PEB3314HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3332HTV2.1PE Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3322HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 29400 Stücke:
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S28HL01GTFPBHB030 S28HL01GTFPBHB030 Infineon Technologies download Description: IC FLASH 1GBIT SPI/OCTAL 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Memory Interface: SPI - Octal I/O
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
auf Bestellung 122 Stücke:
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1+32.47 EUR
10+30.09 EUR
25+29.14 EUR
50+28.43 EUR
100+27.72 EUR
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IDWD30E65E7XKSA1 IDWD30E65E7XKSA1 Infineon Technologies Infineon-IDWD30E65E7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8b6555fe018c3a59d2d158ea Description: DIODE STD 650V 50A PGTO24722
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 82 ns
Technology: Standard
Current - Average Rectified (Io): 50A
Supplier Device Package: PG-TO247-2-2
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 30 A
Current - Reverse Leakage @ Vr: 20 µA @ 650 V
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4+4.7 EUR
30+2.52 EUR
120+2.01 EUR
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IRFB7787PBF IRFB7787PBF Infineon Technologies irfs7787pbf.pdf?fileId=5546d462533600a40153563ad73d21eb Description: MOSFET N-CH 75V 76A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 76A (Tc)
Rds On (Max) @ Id, Vgs: 8.4mOhm @ 46A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 100µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4020 pF @ 25 V
Produkt ist nicht verfügbar
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S25HL01GTFAMHI010 S25HL01GTFAMHI010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 1GBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
auf Bestellung 5712 Stücke:
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1+29.81 EUR
10+26.45 EUR
25+25.22 EUR
40+24.61 EUR
80+23.74 EUR
240+22.42 EUR
480+21.62 EUR
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S25HL01GTFAMHM010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 1GBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FM25V20A-DGTR FM25V20A-DGTR Infineon Technologies FM25V20A_RevJ_12-22-23.pdf Description: IC FRAM 2MBIT SPI 40MHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-DFN (5x6)
Memory Interface: SPI
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1361B-117AC CY7C1361B-117AC Infineon Technologies CY7C1361B%2C%2063B.pdf Description: IC SRAM 9MBIT PAR 117MHZ 100TQFP
Packaging: Bag
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 117 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 7.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FP50R06W2E3BOMA1 FP50R06W2E3BOMA1 Infineon Technologies Infineon-FP50R06W2E3-DS-v02_02-en_de.pdf?fileId=db3a30431b3e89eb011b455c99987d24 Description: IGBT MODULE 600V 65A 175W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 175 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 3.1 nF @ 25 V
auf Bestellung 10 Stücke:
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1+88.39 EUR
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TLE49632MXTSA1 TLE49632MXTSA1 Infineon Technologies Infineon-TLE4963-2M-DS-v01_00-EN.pdf?fileId=5546d462525dbac4015287edd79f27ca Description: MAGNETIC SWITCH HALL EFF SOT23-3
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Collector
Polarization: South Pole
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 18V
Technology: Hall Effect
Sensing Range: 13.9mT Trip, 5mT Release
Current - Output (Max): 20mA
Current - Supply (Max): 6mA
Supplier Device Package: PG-SOT23-3-15
Test Condition: 25°C
auf Bestellung 3000 Stücke:
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3000+0.39 EUR
Mindestbestellmenge: 3000
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TLE49632MXTSA1 TLE49632MXTSA1 Infineon Technologies Infineon-TLE4963-2M-DS-v01_00-EN.pdf?fileId=5546d462525dbac4015287edd79f27ca Description: MAGNETIC SWITCH HALL EFF SOT23-3
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Collector
Polarization: South Pole
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 18V
Technology: Hall Effect
Sensing Range: 13.9mT Trip, 5mT Release
Current - Output (Max): 20mA
Current - Supply (Max): 6mA
Supplier Device Package: PG-SOT23-3-15
Test Condition: 25°C
auf Bestellung 3000 Stücke:
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18+0.99 EUR
24+0.75 EUR
28+0.64 EUR
50+0.62 EUR
100+0.53 EUR
500+0.46 EUR
1000+0.4 EUR
Mindestbestellmenge: 18
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CY8C4147LQE-S263T Infineon Technologies Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8 Description: IC MCU 32BIT 128KB FLASH 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 40-QFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4147LQE-S273 CY8C4147LQE-S273 Infineon Technologies Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8 Description: IC MCU 32BIT 128KB FLASH 40QFN
Packaging: Tray
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 40-QFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AUIRFU540Z AUIRFU540Z Infineon Technologies auirfr540z.pdf?fileId=5546d462533600a4015355b5d6c91496 Description: MOSFET N-CH 100V 35A IPAK
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 28.5mOhm @ 21A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: IPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PEB2047NV2.1 PEB2047NV2.1 Infineon Technologies INFNS00941-1.pdf?t.download=true&u=5oefqw Description: IC MEMORY 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Memory
Supplier Device Package: 44-PLCC (16.6x16.6)
DigiKey Programmable: Not Verified
auf Bestellung 106 Stücke:
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7+80.04 EUR
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FS500R17OE4DB61BPSA1 Infineon Technologies Infineon-FS500R17OE4D-DS-v03_00-en_de.pdf?fileId=5546d46145f1f3a40145fb209c810fee Description: FS500R17OE4 - IGBT Module
Packaging: Bulk
auf Bestellung 385 Stücke:
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1+961.86 EUR
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FS50R12W2T7PBPSA1 Infineon Technologies Description: LOW POWER EASY
Packaging: Tray
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
1+95.87 EUR
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FS50R06KE3BOSA1 Infineon Technologies Infineon-FS50R06KE3-DS-v02_00-en_cn.pdf?fileId=db3a30433de4e67f013dee44d2593890 Description: FS50R06 - IGBT MODULE
Packaging: Bulk
auf Bestellung 664 Stücke:
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6+86.37 EUR
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SHRDIN933M10X23HPSA1 Infineon Technologies Description: SCR MODULE POWERBLOCK
Packaging: Tray
Produkt ist nicht verfügbar
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AUIRF3805L-7P AUIRF3805L-7P Infineon Technologies auirf3805s-7p.pdf?fileId=5546d462533600a4015355aca8a713b3 Description: MOSFET N-CH 55V 160A TO262
Packaging: Tube
Package / Case: TO-262-7
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 160A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 140A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-262
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 200 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7820 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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TLE9263BQXXUMA2 TLE9263BQXXUMA2 Infineon Technologies Infineon-TLE9263BQX-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805e310398a Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
auf Bestellung 1996 Stücke:
Lieferzeit 10-14 Tag (e)
4+5.7 EUR
10+4.3 EUR
25+3.95 EUR
100+3.56 EUR
250+3.38 EUR
500+3.27 EUR
1000+3.18 EUR
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TLE9263BQXV33XUMA2 TLE9263BQXV33XUMA2 Infineon Technologies Infineon-TLE9263BQX%20V33-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805ee79398d Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
auf Bestellung 1398 Stücke:
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4+5.79 EUR
10+4.37 EUR
25+4.01 EUR
100+3.62 EUR
250+3.44 EUR
500+3.41 EUR
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TLE92633BQXV33XUMA2 TLE92633BQXV33XUMA2 Infineon Technologies Infineon-TLE9263-3BQX%20V33-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805d7dc3987 Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
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3+6.23 EUR
10+4.7 EUR
25+4.32 EUR
100+3.91 EUR
250+3.71 EUR
500+3.69 EUR
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TLE9844QXXUMA1 TLE9844QXXUMA1 Infineon Technologies Infineon-TLE9844QX-DS-v01_00-EN.pdf?fileId=5546d46259d9a4bf015a84a1c8a87505 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SSI, UART
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Program Memory Type: FLASH (64kB)
Core Processor: ARM® Cortex®-M0
Supplier Device Package: PG-VQFN-48-31
Grade: Automotive
Number of I/O: 10
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2498 Stücke:
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500+3.88 EUR
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TLE9854QXWXUMA1 TLE9854QXWXUMA1 Infineon Technologies Infineon-TLE9854QXW-DataSheet-v01_00-EN.pdf?fileId=5546d4626c1f3dc3016c71d0fb7538f4 Description: IC MCU 32BIT 64KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 9x8b, 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 28V
Connectivity: LINbus, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-29
Number of I/O: 10
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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TLE9854QXWXUMA1 TLE9854QXWXUMA1 Infineon Technologies Infineon-TLE9854QXW-DataSheet-v01_00-EN.pdf?fileId=5546d4626c1f3dc3016c71d0fb7538f4 Description: IC MCU 32BIT 64KB FLASH 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 9x8b, 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 28V
Connectivity: LINbus, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-29
Number of I/O: 10
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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XDPE152C4D1000XUMA1 XDPE152C4D1000XUMA1 Infineon Technologies Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc Description: IFX PRIMARION CNTRLLER
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: 0.25V ~ 3.04V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 0.25V ~ 12V
Applications: Controller, Intel VR13
Supplier Device Package: PG-VQFN-48-63
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XDPE152C4D1000XUMA1 XDPE152C4D1000XUMA1 Infineon Technologies Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc Description: IFX PRIMARION CNTRLLER
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: 0.25V ~ 3.04V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 0.25V ~ 12V
Applications: Controller, Intel VR13
Supplier Device Package: PG-VQFN-48-63
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CY8C3MFIDOCK-125 Infineon Technologies 5047 Description: IC MCU
Packaging: Tray
DigiKey Programmable: Not Verified
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AUIRFN8403TR AUIRFN8403TR Infineon Technologies auirfn8403.pdf Description: MOSFET N-CH 40V 95A 8PQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 95A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 50A, 10V
Power Dissipation (Max): 4.3W (Ta), 94W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 100µA
Supplier Device Package: 8-PQFN (5x6)
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 98 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3174 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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AUIRFN8401TR AUIRFN8401TR Infineon Technologies auirfn8401.pdf?fileId=5546d462533600a4015355b169f4143c Description: MOSFET N-CH 40V 84A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 50A, 10V
Power Dissipation (Max): 4.2W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 50µA
Supplier Device Package: PQFN (5x6)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2170 pF @ 25 V
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6PS03012E33G34160NOSA1 6PS03012E33G34160NOSA1 Infineon Technologies Description: IGBT MODULE 300V 234A 2100W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -25°C ~ 55°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: Module
Power - Max: 2100 W
Produkt ist nicht verfügbar
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TLE98912QTW60XUMA1 TLE98912QTW60XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98912QTW60XUMA1 TLE98912QTW60XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2006 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.55 EUR
10+8.92 EUR
25+8.27 EUR
100+7.55 EUR
250+7.21 EUR
500+7 EUR
1000+6.83 EUR
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TLE98932QTA62XUMA1 TLE98932QTA62XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QTA62XUMA1 TLE98932QTA62XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 1982 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.76 EUR
10+9.1 EUR
25+8.44 EUR
100+7.71 EUR
250+7.36 EUR
500+7.15 EUR
1000+6.98 EUR
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TLE98912QTW61XUMA1 TLE98912QTW61XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98912QTW61XUMA1 TLE98912QTW61XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2203 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.32 EUR
10+8.75 EUR
25+8.1 EUR
100+7.4 EUR
250+7.06 EUR
500+6.86 EUR
1000+6.69 EUR
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TLE98932QTA62SXUMA1 TLE98932QTA62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QTA62SXUMA1 TLE98932QTA62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2187 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.44 EUR
10+8.84 EUR
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1000+6.77 EUR
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TLE98932QTW62SXUMA1 TLE98932QTW62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QTW62SXUMA1 TLE98932QTW62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 119 Stücke:
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2+12.58 EUR
10+9.74 EUR
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100+8.26 EUR
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CY62136FV30LL-45BVXI CY62136FV30LL-45BVXI Infineon Technologies Infineon-CY62136FV30_MoBL_2-Mbit_(128_K_16)_Static_RAM-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebef2bb32ee&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 2MBIT PARALLEL 48VFBGA
Packaging: Tray
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 128K x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ADM8668TXA12-G Infineon Technologies Description: WIRELESS NETWORK BRIDGING SYSTEM
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 5040 Stücke:
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23+21.84 EUR
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CY8C4148AZSS555XQLA1 CY8C4148AZSS555XQLA1 Infineon Technologies Infineon-CY8C4148AZS-S555-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
auf Bestellung 1600 Stücke:
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2+12.69 EUR
10+9.85 EUR
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160+8.15 EUR
320+7.89 EUR
640+7.68 EUR
1120+7.54 EUR
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S29GL256S11DHIV20 S29GL256S11DHIV20 Infineon Technologies infineon-s29gl01gs-s29gl512s-s29gl256s-s29gl128s-128-mb-256-mb-512-mb-1-gb-gl-s-mirrorbit-tm-flash-parallel-3-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
auf Bestellung 115 Stücke:
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2+15.88 EUR
10+14.75 EUR
25+14.3 EUR
50+13.96 EUR
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R12VPDUSWITCH20TOBO1 R12VPDUSWITCH20TOBO1 Infineon Technologies Description: EVAL BOARD FOR 2ED2410-EM
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: 2ED2410-EM, IAUTN04S7N003, TLE4972-AE35D5
Supplied Contents: Board(s)
Primary Attributes: 8V ~ 36V Supply
Embedded: No
Contents: Board(s)
Secondary Attributes: On-Board Test Points
auf Bestellung 2 Stücke:
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1+794.59 EUR
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BC860CE6359HTMA1 BC860CE6359HTMA1 Infineon Technologies bc856_bc857_bc858_bc859_bc860_1.pdf Description: TRANS PNP 45V 0.1A PG-SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SOT23
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 330 mW
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CY8C4147AZS-S445 CY8C4147AZS-S445 Infineon Technologies Infineon-Automotive_PSoC_4100S_Plus-DataSheet-v20_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8 Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FD200R65KF2-K Infineon Technologies INFNS28302-1.pdf?t.download=true&u=5oefqw Description: IGBT MODULE 3600V 200A 380000W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 4.9V @ 15V, 200A
NTC Thermistor: No
Current - Collector (Ic) (Max): 200 A
Voltage - Collector Emitter Breakdown (Max): 3600 V
Power - Max: 380000 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
auf Bestellung 22 Stücke:
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TT250N12KOFKHPSA1 TT250N12KOFKHPSA1 Infineon Technologies Description: SCR MODULE 1.8KV 410A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8000A @ 50Hz
Number of SCRs, Diodes: 2 SCRs
Current - On State (It (AV)) (Max): 250 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (RMS)) (Max): 410 A
Voltage - Off State: 1.8 kV
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2+227.05 EUR
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FZ1500R33HE3BPSA1 Infineon-FZ1500R33HE3-DS-v03_01-en_de.pdf?fileId=db3a304314dca389011527dfc61411c3
FZ1500R33HE3BPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 3300V 1500A 17000W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1500A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 1500 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 17000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
auf Bestellung 57 Stücke:
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Anzahl Preis
1+2766.72 EUR
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FF400R33KF2CNOSA1 Infineon-FF400R33KF2C-DS-v02_01-en_de.pdf?fileId=db3a304412b407950112b430e9825263
FF400R33KF2CNOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 3300V 660A 4800W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 4.25V @ 15V, 400A
NTC Thermistor: No
Supplier Device Package: Module
Current - Collector (Ic) (Max): 660 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 4800 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 50 nF @ 25 V
Produkt ist nicht verfügbar
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CY8C27643-24PVXIT download
CY8C27643-24PVXIT
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 48SSOP
Packaging: Cut Tape (CT)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 4x14b; D/A 4x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-SSOP
Number of I/O: 44
DigiKey Programmable: Verified
auf Bestellung 464 Stücke:
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Anzahl Preis
1+21.16 EUR
10+16.64 EUR
25+15.52 EUR
100+14.28 EUR
250+13.69 EUR
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PEB3352HTV2.1
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 540 Stücke:
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Anzahl Preis
35+14.78 EUR
Mindestbestellmenge: 35
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PEB3332FV2.1
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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Anzahl Preis
24+21.43 EUR
Mindestbestellmenge: 24
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PEB3320HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 360 Stücke:
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Anzahl Preis
24+21.85 EUR
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PEB3314EV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 180 Stücke:
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Anzahl Preis
19+27.37 EUR
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PEB3314HLV1.4
PEB3314HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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Anzahl Preis
15+28.91 EUR
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PEB3332HTV2.1PE
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 3240 Stücke:
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Anzahl Preis
17+31.03 EUR
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PEB3322HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 29400 Stücke:
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Anzahl Preis
14+36.35 EUR
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S28HL01GTFPBHB030 download
S28HL01GTFPBHB030
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT SPI/OCTAL 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Memory Interface: SPI - Octal I/O
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
auf Bestellung 122 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+32.47 EUR
10+30.09 EUR
25+29.14 EUR
50+28.43 EUR
100+27.72 EUR
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IDWD30E65E7XKSA1 Infineon-IDWD30E65E7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8b6555fe018c3a59d2d158ea
IDWD30E65E7XKSA1
Hersteller: Infineon Technologies
Description: DIODE STD 650V 50A PGTO24722
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 82 ns
Technology: Standard
Current - Average Rectified (Io): 50A
Supplier Device Package: PG-TO247-2-2
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 30 A
Current - Reverse Leakage @ Vr: 20 µA @ 650 V
auf Bestellung 189 Stücke:
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4+4.7 EUR
30+2.52 EUR
120+2.01 EUR
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IRFB7787PBF irfs7787pbf.pdf?fileId=5546d462533600a40153563ad73d21eb
IRFB7787PBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 75V 76A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 76A (Tc)
Rds On (Max) @ Id, Vgs: 8.4mOhm @ 46A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 100µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4020 pF @ 25 V
Produkt ist nicht verfügbar
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S25HL01GTFAMHI010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
S25HL01GTFAMHI010
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
auf Bestellung 5712 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.81 EUR
10+26.45 EUR
25+25.22 EUR
40+24.61 EUR
80+23.74 EUR
240+22.42 EUR
480+21.62 EUR
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S25HL01GTFAMHM010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FM25V20A-DGTR FM25V20A_RevJ_12-22-23.pdf
FM25V20A-DGTR
Hersteller: Infineon Technologies
Description: IC FRAM 2MBIT SPI 40MHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-DFN (5x6)
Memory Interface: SPI
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1361B-117AC CY7C1361B%2C%2063B.pdf
CY7C1361B-117AC
Hersteller: Infineon Technologies
Description: IC SRAM 9MBIT PAR 117MHZ 100TQFP
Packaging: Bag
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 117 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 7.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FP50R06W2E3BOMA1 Infineon-FP50R06W2E3-DS-v02_02-en_de.pdf?fileId=db3a30431b3e89eb011b455c99987d24
FP50R06W2E3BOMA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 600V 65A 175W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 175 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 3.1 nF @ 25 V
auf Bestellung 10 Stücke:
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Anzahl Preis
1+88.39 EUR
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TLE49632MXTSA1 Infineon-TLE4963-2M-DS-v01_00-EN.pdf?fileId=5546d462525dbac4015287edd79f27ca
TLE49632MXTSA1
Hersteller: Infineon Technologies
Description: MAGNETIC SWITCH HALL EFF SOT23-3
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Collector
Polarization: South Pole
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 18V
Technology: Hall Effect
Sensing Range: 13.9mT Trip, 5mT Release
Current - Output (Max): 20mA
Current - Supply (Max): 6mA
Supplier Device Package: PG-SOT23-3-15
Test Condition: 25°C
auf Bestellung 3000 Stücke:
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Anzahl Preis
3000+0.39 EUR
Mindestbestellmenge: 3000
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TLE49632MXTSA1 Infineon-TLE4963-2M-DS-v01_00-EN.pdf?fileId=5546d462525dbac4015287edd79f27ca
TLE49632MXTSA1
Hersteller: Infineon Technologies
Description: MAGNETIC SWITCH HALL EFF SOT23-3
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Collector
Polarization: South Pole
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 18V
Technology: Hall Effect
Sensing Range: 13.9mT Trip, 5mT Release
Current - Output (Max): 20mA
Current - Supply (Max): 6mA
Supplier Device Package: PG-SOT23-3-15
Test Condition: 25°C
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
18+0.99 EUR
24+0.75 EUR
28+0.64 EUR
50+0.62 EUR
100+0.53 EUR
500+0.46 EUR
1000+0.4 EUR
Mindestbestellmenge: 18
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CY8C4147LQE-S263T Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 40-QFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4147LQE-S273 Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8
CY8C4147LQE-S273
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 40QFN
Packaging: Tray
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 40-QFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AUIRFU540Z auirfr540z.pdf?fileId=5546d462533600a4015355b5d6c91496
AUIRFU540Z
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 35A IPAK
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 28.5mOhm @ 21A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: IPAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PEB2047NV2.1 INFNS00941-1.pdf?t.download=true&u=5oefqw
PEB2047NV2.1
Hersteller: Infineon Technologies
Description: IC MEMORY 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Memory
Supplier Device Package: 44-PLCC (16.6x16.6)
DigiKey Programmable: Not Verified
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+80.04 EUR
Mindestbestellmenge: 7
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FS500R17OE4DB61BPSA1 Infineon-FS500R17OE4D-DS-v03_00-en_de.pdf?fileId=5546d46145f1f3a40145fb209c810fee
Hersteller: Infineon Technologies
Description: FS500R17OE4 - IGBT Module
Packaging: Bulk
auf Bestellung 385 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+961.86 EUR
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FS50R12W2T7PBPSA1
Hersteller: Infineon Technologies
Description: LOW POWER EASY
Packaging: Tray
auf Bestellung 15 Stücke:
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Anzahl Preis
1+95.87 EUR
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FS50R06KE3BOSA1 Infineon-FS50R06KE3-DS-v02_00-en_cn.pdf?fileId=db3a30433de4e67f013dee44d2593890
Hersteller: Infineon Technologies
Description: FS50R06 - IGBT MODULE
Packaging: Bulk
auf Bestellung 664 Stücke:
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Anzahl Preis
6+86.37 EUR
Mindestbestellmenge: 6
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SHRDIN933M10X23HPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE POWERBLOCK
Packaging: Tray
Produkt ist nicht verfügbar
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AUIRF3805L-7P auirf3805s-7p.pdf?fileId=5546d462533600a4015355aca8a713b3
AUIRF3805L-7P
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 160A TO262
Packaging: Tube
Package / Case: TO-262-7
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 160A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 140A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-262
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 200 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7820 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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TLE9263BQXXUMA2 Infineon-TLE9263BQX-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805e310398a
TLE9263BQXXUMA2
Hersteller: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
auf Bestellung 1996 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.7 EUR
10+4.3 EUR
25+3.95 EUR
100+3.56 EUR
250+3.38 EUR
500+3.27 EUR
1000+3.18 EUR
Mindestbestellmenge: 4
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TLE9263BQXV33XUMA2 Infineon-TLE9263BQX%20V33-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805ee79398d
TLE9263BQXV33XUMA2
Hersteller: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
auf Bestellung 1398 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.79 EUR
10+4.37 EUR
25+4.01 EUR
100+3.62 EUR
250+3.44 EUR
500+3.41 EUR
Mindestbestellmenge: 4
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TLE92633BQXV33XUMA2 Infineon-TLE9263-3BQX%20V33-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805d7dc3987
TLE92633BQXV33XUMA2
Hersteller: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
auf Bestellung 4572 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.23 EUR
10+4.7 EUR
25+4.32 EUR
100+3.91 EUR
250+3.71 EUR
500+3.69 EUR
Mindestbestellmenge: 3
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TLE9844QXXUMA1 Infineon-TLE9844QX-DS-v01_00-EN.pdf?fileId=5546d46259d9a4bf015a84a1c8a87505
TLE9844QXXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SSI, UART
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Program Memory Type: FLASH (64kB)
Core Processor: ARM® Cortex®-M0
Supplier Device Package: PG-VQFN-48-31
Grade: Automotive
Number of I/O: 10
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2498 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.67 EUR
10+5.07 EUR
25+4.66 EUR
100+4.22 EUR
250+4.01 EUR
500+3.88 EUR
1000+3.78 EUR
Mindestbestellmenge: 3
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TLE9854QXWXUMA1 Infineon-TLE9854QXW-DataSheet-v01_00-EN.pdf?fileId=5546d4626c1f3dc3016c71d0fb7538f4
TLE9854QXWXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 9x8b, 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 28V
Connectivity: LINbus, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-29
Number of I/O: 10
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE9854QXWXUMA1 Infineon-TLE9854QXW-DataSheet-v01_00-EN.pdf?fileId=5546d4626c1f3dc3016c71d0fb7538f4
TLE9854QXWXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 9x8b, 12x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 5.5V ~ 28V
Connectivity: LINbus, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-29
Number of I/O: 10
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1966 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+8.99 EUR
10+6.89 EUR
25+6.37 EUR
100+5.79 EUR
250+5.52 EUR
500+5.35 EUR
1000+5.21 EUR
Mindestbestellmenge: 2
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XDPE152C4D1000XUMA1 Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc
XDPE152C4D1000XUMA1
Hersteller: Infineon Technologies
Description: IFX PRIMARION CNTRLLER
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: 0.25V ~ 3.04V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 0.25V ~ 12V
Applications: Controller, Intel VR13
Supplier Device Package: PG-VQFN-48-63
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+5.23 EUR
Mindestbestellmenge: 4000
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XDPE152C4D1000XUMA1 Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc
XDPE152C4D1000XUMA1
Hersteller: Infineon Technologies
Description: IFX PRIMARION CNTRLLER
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: 0.25V ~ 3.04V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 0.25V ~ 12V
Applications: Controller, Intel VR13
Supplier Device Package: PG-VQFN-48-63
auf Bestellung 5457 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.91 EUR
10+7.62 EUR
25+7.05 EUR
100+6.42 EUR
250+6.12 EUR
500+5.94 EUR
1000+5.79 EUR
Mindestbestellmenge: 2
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CY8C3MFIDOCK-125 5047
Hersteller: Infineon Technologies
Description: IC MCU
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
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AUIRFN8403TR auirfn8403.pdf
AUIRFN8403TR
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 95A 8PQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 95A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 50A, 10V
Power Dissipation (Max): 4.3W (Ta), 94W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 100µA
Supplier Device Package: 8-PQFN (5x6)
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 98 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3174 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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AUIRFN8401TR auirfn8401.pdf?fileId=5546d462533600a4015355b169f4143c
AUIRFN8401TR
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 84A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 50A, 10V
Power Dissipation (Max): 4.2W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 50µA
Supplier Device Package: PQFN (5x6)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2170 pF @ 25 V
Produkt ist nicht verfügbar
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6PS03012E33G34160NOSA1
6PS03012E33G34160NOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 300V 234A 2100W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -25°C ~ 55°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: Module
Power - Max: 2100 W
Produkt ist nicht verfügbar
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TLE98912QTW60XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98912QTW60XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98912QTW60XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98912QTW60XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2006 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.55 EUR
10+8.92 EUR
25+8.27 EUR
100+7.55 EUR
250+7.21 EUR
500+7 EUR
1000+6.83 EUR
Mindestbestellmenge: 2
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TLE98932QTA62XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTA62XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QTA62XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTA62XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 1982 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.76 EUR
10+9.1 EUR
25+8.44 EUR
100+7.71 EUR
250+7.36 EUR
500+7.15 EUR
1000+6.98 EUR
Mindestbestellmenge: 2
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TLE98912QTW61XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98912QTW61XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98912QTW61XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98912QTW61XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2203 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.32 EUR
10+8.75 EUR
25+8.1 EUR
100+7.4 EUR
250+7.06 EUR
500+6.86 EUR
1000+6.69 EUR
Mindestbestellmenge: 2
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TLE98932QTA62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTA62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QTA62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTA62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2187 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.44 EUR
10+8.84 EUR
25+8.19 EUR
100+7.48 EUR
250+7.14 EUR
500+6.94 EUR
1000+6.77 EUR
Mindestbestellmenge: 2
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TLE98932QTW62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTW62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QTW62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTW62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.58 EUR
10+9.74 EUR
25+9.03 EUR
100+8.26 EUR
Mindestbestellmenge: 2
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CY62136FV30LL-45BVXI Infineon-CY62136FV30_MoBL_2-Mbit_(128_K_16)_Static_RAM-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebef2bb32ee&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY62136FV30LL-45BVXI
Hersteller: Infineon Technologies
Description: IC SRAM 2MBIT PARALLEL 48VFBGA
Packaging: Tray
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 128K x 16
DigiKey Programmable: Not Verified
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ADM8668TXA12-G
Hersteller: Infineon Technologies
Description: WIRELESS NETWORK BRIDGING SYSTEM
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 5040 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
23+21.84 EUR
Mindestbestellmenge: 23
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CY8C4148AZSS555XQLA1 Infineon-CY8C4148AZS-S555-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4148AZSS555XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
auf Bestellung 1600 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.69 EUR
10+9.85 EUR
25+9.13 EUR
160+8.15 EUR
320+7.89 EUR
640+7.68 EUR
1120+7.54 EUR
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S29GL256S11DHIV20 infineon-s29gl01gs-s29gl512s-s29gl256s-s29gl128s-128-mb-256-mb-512-mb-1-gb-gl-s-mirrorbit-tm-flash-parallel-3-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium
S29GL256S11DHIV20
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 110 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
auf Bestellung 115 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.88 EUR
10+14.75 EUR
25+14.3 EUR
50+13.96 EUR
100+13.62 EUR
Mindestbestellmenge: 2
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R12VPDUSWITCH20TOBO1
R12VPDUSWITCH20TOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR 2ED2410-EM
Packaging: Bulk
Function: Power Distribution Switch (Load Switch)
Type: Power Management
Utilized IC / Part: 2ED2410-EM, IAUTN04S7N003, TLE4972-AE35D5
Supplied Contents: Board(s)
Primary Attributes: 8V ~ 36V Supply
Embedded: No
Contents: Board(s)
Secondary Attributes: On-Board Test Points
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+794.59 EUR
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BC860CE6359HTMA1 bc856_bc857_bc858_bc859_bc860_1.pdf
BC860CE6359HTMA1
Hersteller: Infineon Technologies
Description: TRANS PNP 45V 0.1A PG-SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SOT23
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 45 V
Power - Max: 330 mW
Produkt ist nicht verfügbar
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CY8C4147AZS-S445 Infineon-Automotive_PSoC_4100S_Plus-DataSheet-v20_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8
CY8C4147AZS-S445
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Number of I/O: 54
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FD200R65KF2-K INFNS28302-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: IGBT MODULE 3600V 200A 380000W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 4.9V @ 15V, 200A
NTC Thermistor: No
Current - Collector (Ic) (Max): 200 A
Voltage - Collector Emitter Breakdown (Max): 3600 V
Power - Max: 380000 W
Current - Collector Cutoff (Max): 200 µA
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
auf Bestellung 22 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+3432.3 EUR
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TT250N12KOFKHPSA1
TT250N12KOFKHPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1.8KV 410A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 8000A @ 50Hz
Number of SCRs, Diodes: 2 SCRs
Current - On State (It (AV)) (Max): 250 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (RMS)) (Max): 410 A
Voltage - Off State: 1.8 kV
auf Bestellung 3 Stücke:
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Anzahl Preis
2+227.05 EUR
Mindestbestellmenge: 2
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