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TLE9893QKW62SXUMA1 TLE9893QKW62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Number of I/O: 16
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QKW62SXUMA1 TLE98932QKW62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Number of I/O: 16
Qualification: AEC-Q100
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XC2234L20F66LRAAKXUMA1 XC2234L20F66LRAAKXUMA1 Infineon Technologies Infineon-XC223XL-DS-v01_03-EN.pdf?fileId=5546d4624bcaebcf014c30fa4491268b Description: IC MCU 16/32B 160KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 19x12b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-22
Number of I/O: 48
DigiKey Programmable: Not Verified
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XE162FM72F80LRABFXUMA1 Infineon Technologies Infineon-XE162XM-DS-v02_01-en.pdf?fileId=db3a304334c41e910134eb1b31de04eb Description: IC MCU 16BIT 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-13
Number of I/O: 40
DigiKey Programmable: Not Verified
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TLE9243QKXUMA1 Infineon Technologies Infineon-TLE9243QK-ProductBrief-v01_00-EN.pdf?fileId=8ac78c8c7bb971ed017bbf902524389a Description: OPTIREG AP SPEC PMIC PG-LQFP-64
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 175°C (TJ)
Voltage - Supply: 3V ~ 40V
Applications: Transmission Systems
Current - Supply: 800mA (Max)
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XC164CM16F20FBAKXUMA1 XC164CM16F20FBAKXUMA1 Infineon Technologies xc164cm_ds_v1.4_2007_03.pdf?fileId=db3a304412b407950112b40c0f3c0a1b&ack=t Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 14x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Connectivity: CANbus, SPI, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Number of I/O: 47
DigiKey Programmable: Not Verified
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XC164CM16F40FBAKXUMA1 XC164CM16F40FBAKXUMA1 Infineon Technologies xc164cm_ds_v1.4_2007_03.pdf?fileId=db3a304412b407950112b40c0f3c0a1b&ack=t Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 14x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Connectivity: CANbus, SPI, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Number of I/O: 47
DigiKey Programmable: Not Verified
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XC164CM16F40FBAKXQMA1 XC164CM16F40FBAKXQMA1 Infineon Technologies XC164CM_v1.4_Mar2007.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 14x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Connectivity: CANbus, SPI, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Number of I/O: 47
DigiKey Programmable: Not Verified
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REFMHA0K2IMC101TTOBO1 REFMHA0K2IMC101TTOBO1 Infineon Technologies infineon-ug-2022-13-ref-mha0k2imc101t-usermanual-en.pdf Description: EVAL BOARD FOR IM241-L6S1B
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: IM241-L6S1B, IMC101T-T038, TLS202B1MBV33
Supplied Contents: Board(s)
Primary Attributes: Compressor
Embedded: No
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BCV29H6327XTSA1 BCV29H6327XTSA1 Infineon Technologies BCV29_49.pdf Description: TRANS NPN DARL 30V 0.5A SOT89
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20000 @ 100mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: PG-SOT89
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 1 W
Qualification: AEC-Q101
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BCR10PNB6327XT BCR10PNB6327XT Infineon Technologies bcr10pn.pdf?folderId=db3a30431428a37301144053a52002e2&fileId=db3a30431441fb5d0114dae2a30d1f66 Description: TRANS PREBIAS 1NPN 1PNP SOT363
Packaging: Tape & Reel (TR)
Package / Case: 6-VSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Frequency - Transition: 130MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: PG-SOT363-PO
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CYT2B95CACQ0AZEGS CYT2B95CACQ0AZEGS Infineon Technologies download Description: TVII-B-E-2M-100REV A2 CFLASH 2MB
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+/M4F
Data Converters: A/D 57x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 74
DigiKey Programmable: Not Verified
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CYT2B95CACQ0AZEGS CYT2B95CACQ0AZEGS Infineon Technologies download Description: TVII-B-E-2M-100REV A2 CFLASH 2MB
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+/M4F
Data Converters: A/D 57x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 74
DigiKey Programmable: Not Verified
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CY7C107D-10VXIT CY7C107D-10VXIT Infineon Technologies Infineon-CY7C107D_CY7C1007D_1-Mbit_(1M_x_1)_Static_RAM-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebf2ac23343&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 1MBIT PARALLEL 28SOJ
Packaging: Tape & Reel (TR)
Package / Case: 28-BSOJ (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 28-SOJ
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 1
DigiKey Programmable: Not Verified
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IPT60T040S7XTMA1 IPT60T040S7XTMA1 Infineon Technologies Infineon-IPT60T040S7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c8afe5bd0018b4c4745b27ae8 Description: HIGH POWER_NEW
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 13A (Tj)
Rds On (Max) @ Id, Vgs: 40mOhm @ 13A, 12V
Power Dissipation (Max): 245W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 780µA
Supplier Device Package: PG-HSOF-8-2
Drive Voltage (Max Rds On, Min Rds On): 12V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 83 nC @ 12 V
Input Capacitance (Ciss) (Max) @ Vds: 3128 pF @ 300 V
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IHW25N140R5LXKSA1 IHW25N140R5LXKSA1 Infineon Technologies Infineon-IHW25N140R5L-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d0189b539e0ca36a2 Description: IGBT 1400V 68A TO247-44
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 25A
Supplier Device Package: PG-TO247-44
Td (on/off) @ 25°C: -/195ns
Switching Energy: -, 110µJ (off)
Test Condition: 25V, 25A, 2.2Ohm, 15V
Gate Charge: 150 nC
Current - Collector (Ic) (Max): 68 A
Voltage - Collector Emitter Breakdown (Max): 1400 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 246 W
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S25FL127SABMFI101 S25FL127SABMFI101 Infineon Technologies Infineon-S25FL127S_128-Mb_(16_MB)_3.0_V_SPI_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfa58c49f7&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 128MBIT SPI/QUAD 8SOIC
DigiKey Programmable: Verified
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Supplier Device Package: 8-SOIC
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tube
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TLT9255WLCXUMA1 TLT9255WLCXUMA1 Infineon Technologies Infineon-TLT9255WLC-DataSheet-v01_00-EN.pdf?fileId=5546d4626e8d4b8f016ea702e41108ee Description: IC TRANSCEIVER HALF 1/1 TSON-14
Packaging: Tape & Reel (TR)
Package / Case: 14-TDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: PG-TSON-14-3
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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TLT9255WLCXUMA1 TLT9255WLCXUMA1 Infineon Technologies Infineon-TLT9255WLC-DataSheet-v01_00-EN.pdf?fileId=5546d4626e8d4b8f016ea702e41108ee Description: IC TRANSCEIVER HALF 1/1 TSON-14
Packaging: Cut Tape (CT)
Package / Case: 14-TDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: PG-TSON-14-3
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
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100+2.93 EUR
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1000+2.59 EUR
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4DIR1401HXUMA1 4DIR1401HXUMA1 Infineon Technologies Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxH_family-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c8929aa4d01899cc3b5175436 Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Data Rate: 40Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16-46
Propagation Delay tpLH / tpHL (Max): 26ns, 26ns
Isolated Power: No
Channel Type: Bidirectional
Pulse Width Distortion (Max): 15ns
Number of Channels: 4
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4DIR1401HXUMA1 4DIR1401HXUMA1 Infineon Technologies Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxH_family-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c8929aa4d01899cc3b5175436 Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Data Rate: 40Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16-46
Propagation Delay tpLH / tpHL (Max): 26ns, 26ns
Isolated Power: No
Channel Type: Bidirectional
Pulse Width Distortion (Max): 15ns
Number of Channels: 4
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4DIR1400HAXUMA1 Infineon Technologies Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610 Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
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4DIR1400HAXUMA1 Infineon Technologies Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610 Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
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4DIR1401HAXUMA1 Infineon Technologies Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610 Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
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4DIR1401HAXUMA1 Infineon Technologies Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610 Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
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4DIR2400HAXUMA1 Infineon Technologies Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610 Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 2/2
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
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4DIR2400HAXUMA1 Infineon Technologies Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610 Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 2/2
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
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CG9075AM Infineon Technologies Description: IC
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CG9079AAT Infineon Technologies Description: IC
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FP25R12W2T4PBPSA1 Infineon Technologies Infineon-FP25R12W2T4P-DS-v03_00-EN.pdf?fileId=5546d4625bd71aa0015bfbc806e571fc Description: FP25R12 - IGBT MODULE
Packaging: Bulk
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FP25R12N2T7B16BPSA1 Infineon Technologies Description: IGBT MODULE AG-EASY2B
IGBT Type: Trench Field Stop
Supplier Device Package: AG-EASY2B
NTC Thermistor: No
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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FP25R12KT4B15BPSA1 FP25R12KT4B15BPSA1 Infineon Technologies Infineon-FP25R12KT4_B15-DS-v02_00-en_de.pdf?fileId=db3a30432d9b3066012da33f29623575 Description: IGBT MODULE 1200V 25A AG-ECONO2C
Input Capacitance (Cies) @ Vce: 1.45 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 160 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 25 A
IGBT Type: Trench Field Stop
Supplier Device Package: AG-ECONO2C
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 25A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Three Phase Inverter
Input: Three Phase Bridge Rectifier
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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FP25R12N2T7BPSA1 Infineon Technologies Description: LOW POWER ECONO
Packaging: Tray
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FP25R12N2T7B80BPSA1 Infineon Technologies Description: IGBT MODULE AG-EASY2B
Supplier Device Package: AG-EASY2B
NTC Thermistor: No
IGBT Type: Trench Field Stop
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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FP25R12KT3BOSA1 FP25R12KT3BOSA1 Infineon Technologies Infineon-FP25R12KT3-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b4316c90543e Description: IGBT MOD 1200V 40A 155W MOD
Input Capacitance (Cies) @ Vce: 1.8 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 155 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 40 A
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 25A
Operating Temperature: -40°C ~ 125°C
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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S6E2C29L0AGL2000A S6E2C29L0AGL2000A Infineon Technologies download Description: IC MCU 32BIT 1.5MB FLASH 216LQFP
Packaging: Tray
Package / Case: 216-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-LQFP (24x24)
Number of I/O: 190
DigiKey Programmable: Not Verified
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FF800R12KE7PEHPSA1 Infineon Technologies Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
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FF800R12KE7PHPSA1 Infineon Technologies Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
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CY7C1061GE-10ZXI CY7C1061GE-10ZXI Infineon Technologies Infineon-CY7C1061G_CY7C1061GE_16_MBIT_(1M_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec387e33888&utm_source=cypress&utm_medium=referral&utm_campaign=202110_ Description: IC SRAM 16MBIT PAR 54TSOP II
Packaging: Tray
Package / Case: 54-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 54-TSOP II
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
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FZ1500R33HE3BPSA1 FZ1500R33HE3BPSA1 Infineon Technologies Infineon-FZ1500R33HE3-DS-v03_01-en_de.pdf?fileId=db3a304314dca389011527dfc61411c3 Description: IGBT MOD 3300V 1500A 17000W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1500A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 1500 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 17000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
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FF400R33KF2CNOSA1 FF400R33KF2CNOSA1 Infineon Technologies Infineon-FF400R33KF2C-DS-v02_01-en_de.pdf?fileId=db3a304412b407950112b430e9825263 Description: IGBT MOD 3300V 660A 4800W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 4.25V @ 15V, 400A
NTC Thermistor: No
Supplier Device Package: Module
Current - Collector (Ic) (Max): 660 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 4800 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 50 nF @ 25 V
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CY8C27643-24PVXIT CY8C27643-24PVXIT Infineon Technologies download Description: IC MCU 8BIT 16KB FLASH 48SSOP
Packaging: Cut Tape (CT)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 4x14b; D/A 4x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-SSOP
Number of I/O: 44
DigiKey Programmable: Verified
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PEB3352HTV2.1 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3332FV2.1 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3320HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3314EV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3314HLV1.4 PEB3314HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3332HTV2.1PE Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3322HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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S28HL01GTFPBHB030 S28HL01GTFPBHB030 Infineon Technologies download Description: IC FLASH 1GBIT SPI/OCTAL 24FBGA
DigiKey Programmable: Not Verified
Memory Organization: 128M x 8
Memory Interface: SPI - Octal I/O
Supplier Device Package: 24-FBGA (6x8)
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 24-VBGA
Packaging: Tray
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IDWD30E65E7XKSA1 IDWD30E65E7XKSA1 Infineon Technologies Infineon-IDWD30E65E7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8b6555fe018c3a59d2d158ea Description: DIODE STD 650V 50A PGTO247-22
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 82 ns
Technology: Standard
Current - Average Rectified (Io): 50A
Supplier Device Package: PG-TO247-2-2
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 30 A
Current - Reverse Leakage @ Vr: 20 µA @ 650 V
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IRFB7787PBF IRFB7787PBF Infineon Technologies irfs7787pbf.pdf?fileId=5546d462533600a40153563ad73d21eb Description: MOSFET N-CH 75V 76A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 76A (Tc)
Rds On (Max) @ Id, Vgs: 8.4mOhm @ 46A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 100µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4020 pF @ 25 V
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TLE9893QKW62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE9893QKW62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Number of I/O: 16
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QKW62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QKW62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Number of I/O: 16
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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XC2234L20F66LRAAKXUMA1 Infineon-XC223XL-DS-v01_03-EN.pdf?fileId=5546d4624bcaebcf014c30fa4491268b
XC2234L20F66LRAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16/32B 160KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 19x12b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I2S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-22
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XE162FM72F80LRABFXUMA1 Infineon-XE162XM-DS-v02_01-en.pdf?fileId=db3a304334c41e910134eb1b31de04eb
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 9x10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-13
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TLE9243QKXUMA1 Infineon-TLE9243QK-ProductBrief-v01_00-EN.pdf?fileId=8ac78c8c7bb971ed017bbf902524389a
Hersteller: Infineon Technologies
Description: OPTIREG AP SPEC PMIC PG-LQFP-64
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 175°C (TJ)
Voltage - Supply: 3V ~ 40V
Applications: Transmission Systems
Current - Supply: 800mA (Max)
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1900 Stücke
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XC164CM16F20FBAKXUMA1 xc164cm_ds_v1.4_2007_03.pdf?fileId=db3a304412b407950112b40c0f3c0a1b&ack=t
XC164CM16F20FBAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 14x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Connectivity: CANbus, SPI, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1900 Stücke
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XC164CM16F40FBAKXUMA1 xc164cm_ds_v1.4_2007_03.pdf?fileId=db3a304412b407950112b40c0f3c0a1b&ack=t
XC164CM16F40FBAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 14x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Connectivity: CANbus, SPI, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1900 Stücke
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XC164CM16F40FBAKXQMA1 XC164CM_v1.4_Mar2007.pdf
XC164CM16F40FBAKXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 14x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Connectivity: CANbus, SPI, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 960 Stücke
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REFMHA0K2IMC101TTOBO1 infineon-ug-2022-13-ref-mha0k2imc101t-usermanual-en.pdf
REFMHA0K2IMC101TTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR IM241-L6S1B
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: IM241-L6S1B, IMC101T-T038, TLS202B1MBV33
Supplied Contents: Board(s)
Primary Attributes: Compressor
Embedded: No
auf Bestellung 2 Stücke:
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AnzahlPrivatkunde
1+505.69 EUR
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BCV29H6327XTSA1 BCV29_49.pdf
BCV29H6327XTSA1
Hersteller: Infineon Technologies
Description: TRANS NPN DARL 30V 0.5A SOT89
Packaging: Bulk
Package / Case: TO-243AA
Mounting Type: Surface Mount
Transistor Type: NPN - Darlington
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 1V @ 100µA, 100mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 20000 @ 100mA, 5V
Frequency - Transition: 150MHz
Supplier Device Package: PG-SOT89
Grade: Automotive
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 1 W
Qualification: AEC-Q101
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1265+0.46 EUR
Mindestbestellmenge: 1265 Stücke
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BCR10PNB6327XT bcr10pn.pdf?folderId=db3a30431428a37301144053a52002e2&fileId=db3a30431441fb5d0114dae2a30d1f66
BCR10PNB6327XT
Hersteller: Infineon Technologies
Description: TRANS PREBIAS 1NPN 1PNP SOT363
Packaging: Tape & Reel (TR)
Package / Case: 6-VSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 1 NPN, 1 PNP - Pre-Biased (Dual)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 50V
Vce Saturation (Max) @ Ib, Ic: 300mV @ 500µA, 10mA
DC Current Gain (hFE) (Min) @ Ic, Vce: 30 @ 5mA, 5V
Frequency - Transition: 130MHz
Resistor - Base (R1): 10kOhms
Resistor - Emitter Base (R2): 10kOhms
Supplier Device Package: PG-SOT363-PO
Produkt ist nicht verfügbar
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CYT2B95CACQ0AZEGS download
CYT2B95CACQ0AZEGS
Hersteller: Infineon Technologies
Description: TVII-B-E-2M-100REV A2 CFLASH 2MB
Packaging: Bulk
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+/M4F
Data Converters: A/D 57x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 74
DigiKey Programmable: Not Verified
auf Bestellung 390 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
35+17.31 EUR
Mindestbestellmenge: 35 Stücke
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CYT2B95CACQ0AZEGS download
CYT2B95CACQ0AZEGS
Hersteller: Infineon Technologies
Description: TVII-B-E-2M-100REV A2 CFLASH 2MB
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+/M4F
Data Converters: A/D 57x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 74
DigiKey Programmable: Not Verified
auf Bestellung 774 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+31.19 EUR
10+24.7 EUR
90+21.41 EUR
180+20.72 EUR
270+20.38 EUR
540+19.88 EUR
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CY7C107D-10VXIT Infineon-CY7C107D_CY7C1007D_1-Mbit_(1M_x_1)_Static_RAM-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebf2ac23343&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY7C107D-10VXIT
Hersteller: Infineon Technologies
Description: IC SRAM 1MBIT PARALLEL 28SOJ
Packaging: Tape & Reel (TR)
Package / Case: 28-BSOJ (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 28-SOJ
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPT60T040S7XTMA1 Infineon-IPT60T040S7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c8afe5bd0018b4c4745b27ae8
IPT60T040S7XTMA1
Hersteller: Infineon Technologies
Description: HIGH POWER_NEW
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 13A (Tj)
Rds On (Max) @ Id, Vgs: 40mOhm @ 13A, 12V
Power Dissipation (Max): 245W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 780µA
Supplier Device Package: PG-HSOF-8-2
Drive Voltage (Max Rds On, Min Rds On): 12V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 83 nC @ 12 V
Input Capacitance (Ciss) (Max) @ Vds: 3128 pF @ 300 V
Produkt ist nicht verfügbar
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IHW25N140R5LXKSA1 Infineon-IHW25N140R5L-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d0189b539e0ca36a2
IHW25N140R5LXKSA1
Hersteller: Infineon Technologies
Description: IGBT 1400V 68A TO247-44
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 25A
Supplier Device Package: PG-TO247-44
Td (on/off) @ 25°C: -/195ns
Switching Energy: -, 110µJ (off)
Test Condition: 25V, 25A, 2.2Ohm, 15V
Gate Charge: 150 nC
Current - Collector (Ic) (Max): 68 A
Voltage - Collector Emitter Breakdown (Max): 1400 V
Current - Collector Pulsed (Icm): 75 A
Power - Max: 246 W
auf Bestellung 169 Stücke:
Lieferzeit 10-14 Tag (e)
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4+6.97 EUR
30+3.81 EUR
120+3.11 EUR
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S25FL127SABMFI101 Infineon-S25FL127S_128-Mb_(16_MB)_3.0_V_SPI_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfa58c49f7&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S25FL127SABMFI101
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT SPI/QUAD 8SOIC
DigiKey Programmable: Verified
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Supplier Device Package: 8-SOIC
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.209", 5.30mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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TLT9255WLCXUMA1 Infineon-TLT9255WLC-DataSheet-v01_00-EN.pdf?fileId=5546d4626e8d4b8f016ea702e41108ee
TLT9255WLCXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER HALF 1/1 TSON-14
Packaging: Tape & Reel (TR)
Package / Case: 14-TDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: PG-TSON-14-3
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5000+2.27 EUR
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TLT9255WLCXUMA1 Infineon-TLT9255WLC-DataSheet-v01_00-EN.pdf?fileId=5546d4626e8d4b8f016ea702e41108ee
TLT9255WLCXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER HALF 1/1 TSON-14
Packaging: Cut Tape (CT)
Package / Case: 14-TDFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Type: Transceiver
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.75V ~ 5.25V
Number of Drivers/Receivers: 1/1
Data Rate: 5Mbps
Protocol: CANbus
Supplier Device Package: PG-TSON-14-3
Duplex: Half
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 9686 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+4.8 EUR
10+3.57 EUR
25+3.26 EUR
100+2.93 EUR
250+2.76 EUR
500+2.67 EUR
1000+2.59 EUR
2500+2.5 EUR
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4DIR1401HXUMA1 Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxH_family-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c8929aa4d01899cc3b5175436
4DIR1401HXUMA1
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Data Rate: 40Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16-46
Propagation Delay tpLH / tpHL (Max): 26ns, 26ns
Isolated Power: No
Channel Type: Bidirectional
Pulse Width Distortion (Max): 15ns
Number of Channels: 4
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1500+1.98 EUR
Mindestbestellmenge: 1500 Stücke
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4DIR1401HXUMA1 Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxH_family-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c8929aa4d01899cc3b5175436
4DIR1401HXUMA1
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Data Rate: 40Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16-46
Propagation Delay tpLH / tpHL (Max): 26ns, 26ns
Isolated Power: No
Channel Type: Bidirectional
Pulse Width Distortion (Max): 15ns
Number of Channels: 4
auf Bestellung 2701 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
5+5.19 EUR
10+3.42 EUR
100+2.51 EUR
500+2.14 EUR
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4DIR1400HAXUMA1 Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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4DIR1400HAXUMA1 Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
auf Bestellung 1490 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.85 EUR
10+5.55 EUR
100+4.55 EUR
500+3.83 EUR
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4DIR1401HAXUMA1 Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1500+3.51 EUR
Mindestbestellmenge: 1500 Stücke
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4DIR1401HAXUMA1 Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 3/1
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.85 EUR
10+5.55 EUR
100+4.55 EUR
500+3.83 EUR
Mindestbestellmenge: 3 Stücke
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4DIR2400HAXUMA1 Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 2/2
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
auf Bestellung 1500 Stücke:
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1500+3.51 EUR
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4DIR2400HAXUMA1 Infineon-Datasheet_ISOFACE(TM)_4DIRx4xxHA_family-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8929aa4d01899cd5eb0a5610
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: SPI
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Magnetic Coupling
Voltage - Isolation: 5700Vrms
Inputs - Side 1/Side 2: 2/2
Supplier Device Package: PG-DSO-16
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: Yes
Channel Type: Unidirectional
Pulse Width Distortion (Max): 3ns
Grade: Automotive
Number of Channels: 4
Qualification: AEC-Q100
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10+5.55 EUR
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CG9075AM
Hersteller: Infineon Technologies
Description: IC
Packaging: Bulk
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CG9070AMT
Hersteller: Infineon Technologies
Description: IC
Packaging: Bulk
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CG9077AMT
Hersteller: Infineon Technologies
Description: IC
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CG9070AM
Hersteller: Infineon Technologies
Description: IC
Packaging: Bulk
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CG9077AM
Hersteller: Infineon Technologies
Description: IC
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CG9072AM
Hersteller: Infineon Technologies
Description: IC
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CG9075AMT
Hersteller: Infineon Technologies
Description: IC
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CG9079AA
Hersteller: Infineon Technologies
Description: IC
Packaging: Bulk
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CG9072AMT
Hersteller: Infineon Technologies
Description: IC
Packaging: Bulk
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CG9079AAT
Hersteller: Infineon Technologies
Description: IC
Packaging: Bulk
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FP25R12W2T4PBPSA1 Infineon-FP25R12W2T4P-DS-v03_00-EN.pdf?fileId=5546d4625bd71aa0015bfbc806e571fc
Hersteller: Infineon Technologies
Description: FP25R12 - IGBT MODULE
Packaging: Bulk
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FP25R12N2T7B16BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE AG-EASY2B
IGBT Type: Trench Field Stop
Supplier Device Package: AG-EASY2B
NTC Thermistor: No
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FP25R12KT4B15BPSA1 Infineon-FP25R12KT4_B15-DS-v02_00-en_de.pdf?fileId=db3a30432d9b3066012da33f29623575
FP25R12KT4B15BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 25A AG-ECONO2C
Input Capacitance (Cies) @ Vce: 1.45 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 160 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 25 A
IGBT Type: Trench Field Stop
Supplier Device Package: AG-ECONO2C
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 25A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Three Phase Inverter
Input: Three Phase Bridge Rectifier
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FP25R12N2T7BPSA1
Hersteller: Infineon Technologies
Description: LOW POWER ECONO
Packaging: Tray
Produkt ist nicht verfügbar
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FP25R12N2T7B80BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE AG-EASY2B
Supplier Device Package: AG-EASY2B
NTC Thermistor: No
IGBT Type: Trench Field Stop
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FP25R12KT3BOSA1 Infineon-FP25R12KT3-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b4316c90543e
FP25R12KT3BOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 40A 155W MOD
Input Capacitance (Cies) @ Vce: 1.8 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 155 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 40 A
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 25A
Operating Temperature: -40°C ~ 125°C
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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4+132.41 EUR
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S6E2C29L0AGL2000A download
S6E2C29L0AGL2000A
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 216LQFP
Packaging: Tray
Package / Case: 216-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-LQFP (24x24)
Number of I/O: 190
DigiKey Programmable: Not Verified
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FF800R12KE7PEHPSA1
Hersteller: Infineon Technologies
Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Produkt ist nicht verfügbar
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FF800R12KE7PHPSA1
Hersteller: Infineon Technologies
Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Produkt ist nicht verfügbar
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CY7C1061GE-10ZXI Infineon-CY7C1061G_CY7C1061GE_16_MBIT_(1M_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec387e33888&utm_source=cypress&utm_medium=referral&utm_campaign=202110_
CY7C1061GE-10ZXI
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PAR 54TSOP II
Packaging: Tray
Package / Case: 54-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 54-TSOP II
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FZ1500R33HE3BPSA1 Infineon-FZ1500R33HE3-DS-v03_01-en_de.pdf?fileId=db3a304314dca389011527dfc61411c3
FZ1500R33HE3BPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 3300V 1500A 17000W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1500A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 1500 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 17000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
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1+3364.43 EUR
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FF400R33KF2CNOSA1 Infineon-FF400R33KF2C-DS-v02_01-en_de.pdf?fileId=db3a304412b407950112b430e9825263
FF400R33KF2CNOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 3300V 660A 4800W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 4.25V @ 15V, 400A
NTC Thermistor: No
Supplier Device Package: Module
Current - Collector (Ic) (Max): 660 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 4800 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 50 nF @ 25 V
Produkt ist nicht verfügbar
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CY8C27643-24PVXIT download
CY8C27643-24PVXIT
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 48SSOP
Packaging: Cut Tape (CT)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 4x14b; D/A 4x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-SSOP
Number of I/O: 44
DigiKey Programmable: Verified
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1+25.18 EUR
10+19.8 EUR
25+18.47 EUR
100+16.99 EUR
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PEB3352HTV2.1
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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35+17.59 EUR
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PEB3332FV2.1
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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24+25.5 EUR
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PEB3320HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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24+26 EUR
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PEB3314EV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3314HLV1.4
PEB3314HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3332HTV2.1PE
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3322HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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S28HL01GTFPBHB030 download
S28HL01GTFPBHB030
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT SPI/OCTAL 24FBGA
DigiKey Programmable: Not Verified
Memory Organization: 128M x 8
Memory Interface: SPI - Octal I/O
Supplier Device Package: 24-FBGA (6x8)
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 1Gbit
Mounting Type: Surface Mount
Package / Case: 24-VBGA
Packaging: Tray
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10+35.81 EUR
25+34.68 EUR
50+33.83 EUR
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IDWD30E65E7XKSA1 Infineon-IDWD30E65E7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8b6555fe018c3a59d2d158ea
IDWD30E65E7XKSA1
Hersteller: Infineon Technologies
Description: DIODE STD 650V 50A PGTO247-22
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 82 ns
Technology: Standard
Current - Average Rectified (Io): 50A
Supplier Device Package: PG-TO247-2-2
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 30 A
Current - Reverse Leakage @ Vr: 20 µA @ 650 V
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4+6.53 EUR
30+3.55 EUR
120+2.88 EUR
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IRFB7787PBF irfs7787pbf.pdf?fileId=5546d462533600a40153563ad73d21eb
IRFB7787PBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 75V 76A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 76A (Tc)
Rds On (Max) @ Id, Vgs: 8.4mOhm @ 46A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 100µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4020 pF @ 25 V
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