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FP25R12KT4B15BPSA1 Infineon Technologies Infineon-FP25R12KT4_B15-DS-v02_00-en_de.pdf?fileId=db3a30432d9b3066012da33f29623575 Description: LOW POWER ECONO AG-ECONO2C-411
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2C
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 25 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 160 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.45 nF @ 25 V
Produkt ist nicht verfügbar
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FP25R12N2T7BPSA1 Infineon Technologies Description: LOW POWER ECONO
Packaging: Tray
Produkt ist nicht verfügbar
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FP25R12N2T7B80BPSA1 Infineon Technologies Description: LOW POWER ECONO
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
NTC Thermistor: No
Supplier Device Package: AG-EASY2B
IGBT Type: Trench Field Stop
Produkt ist nicht verfügbar
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FP25R12KT3BOSA1 FP25R12KT3BOSA1 Infineon Technologies Infineon-FP25R12KT3-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b4316c90543e Description: IGBT MOD 1200V 40A 155W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 40 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 155 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 1.8 nF @ 25 V
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4+110.51 EUR
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S6E2C29L0AGL2000A S6E2C29L0AGL2000A Infineon Technologies download Description: IC MCU 32BIT 1.5MB FLASH 216LQFP
Packaging: Tray
Package / Case: 216-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-LQFP (24x24)
Number of I/O: 190
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FF800R12KE7PEHPSA1 Infineon Technologies Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Produkt ist nicht verfügbar
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FF800R12KE7PHPSA1 Infineon Technologies Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Produkt ist nicht verfügbar
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CY7C1061GE-10ZXI CY7C1061GE-10ZXI Infineon Technologies Infineon-CY7C1061G_CY7C1061GE_16_MBIT_(1M_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec387e33888&utm_source=cypress&utm_medium=referral&utm_campaign=202110_ Description: IC SRAM 16MBIT PAR 54TSOP II
Packaging: Tray
Package / Case: 54-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 54-TSOP II
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FZ1500R33HE3BPSA1 FZ1500R33HE3BPSA1 Infineon Technologies Infineon-FZ1500R33HE3-DS-v03_01-en_de.pdf?fileId=db3a304314dca389011527dfc61411c3 Description: IGBT MOD 3300V 1500A 17000W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1500A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 1500 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 17000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
auf Bestellung 57 Stücke:
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1+3189.28 EUR
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FF400R33KF2CNOSA1 FF400R33KF2CNOSA1 Infineon Technologies Infineon-FF400R33KF2C-DS-v02_01-en_de.pdf?fileId=db3a304412b407950112b430e9825263 Description: IGBT MOD 3300V 660A 4800W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 4.25V @ 15V, 400A
NTC Thermistor: No
Supplier Device Package: Module
Current - Collector (Ic) (Max): 660 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 4800 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 50 nF @ 25 V
Produkt ist nicht verfügbar
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CY8C27643-24PVXIT CY8C27643-24PVXIT Infineon Technologies download Description: IC MCU 8BIT 16KB FLASH 48SSOP
Packaging: Cut Tape (CT)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 4x14b; D/A 4x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-SSOP
Number of I/O: 44
DigiKey Programmable: Verified
auf Bestellung 464 Stücke:
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1+21.16 EUR
10+16.64 EUR
25+15.52 EUR
100+14.28 EUR
250+13.69 EUR
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PEB3352HTV2.1 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 540 Stücke:
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35+14.78 EUR
Mindestbestellmenge: 35
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PEB3332FV2.1 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 11400 Stücke:
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24+21.43 EUR
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PEB3320HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 360 Stücke:
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24+21.85 EUR
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PEB3314EV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 180 Stücke:
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19+27.37 EUR
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PEB3314HLV1.4 PEB3314HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 711 Stücke:
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18+28.76 EUR
Mindestbestellmenge: 18
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PEB3332HTV2.1PE Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
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PEB3322HLV1.4 Infineon Technologies Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 29400 Stücke:
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14+36.35 EUR
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S28HL01GTFPBHB030 S28HL01GTFPBHB030 Infineon Technologies download Description: IC FLASH 1GBIT SPI/OCTAL 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Memory Interface: SPI - Octal I/O
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
auf Bestellung 777 Stücke:
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1+41.11 EUR
10+36.48 EUR
25+34.79 EUR
40+33.95 EUR
80+32.74 EUR
260+30.79 EUR
520+29.7 EUR
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IDWD30E65E7XKSA1 IDWD30E65E7XKSA1 Infineon Technologies Infineon-IDWD30E65E7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8b6555fe018c3a59d2d158ea Description: DIODE STD 650V 50A PGTO24722
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 82 ns
Technology: Standard
Current - Average Rectified (Io): 50A
Supplier Device Package: PG-TO247-2-2
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 30 A
Current - Reverse Leakage @ Vr: 20 µA @ 650 V
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4+5.68 EUR
30+3.08 EUR
120+2.54 EUR
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IRFB7787PBF IRFB7787PBF Infineon Technologies irfs7787pbf.pdf?fileId=5546d462533600a40153563ad73d21eb Description: MOSFET N-CH 75V 76A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 76A (Tc)
Rds On (Max) @ Id, Vgs: 8.4mOhm @ 46A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 100µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4020 pF @ 25 V
Produkt ist nicht verfügbar
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S25HL01GTFAMHI010 S25HL01GTFAMHI010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 1GBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
auf Bestellung 5712 Stücke:
Lieferzeit 10-14 Tag (e)
1+29.81 EUR
10+26.45 EUR
25+25.22 EUR
40+24.61 EUR
80+23.74 EUR
240+22.42 EUR
480+21.62 EUR
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S25HL01GTFAMHM010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 1GBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FM25V20A-DGTR FM25V20A-DGTR Infineon Technologies FM25V20A_RevJ_12-22-23.pdf Description: IC FRAM 2MBIT SPI 40MHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-DFN (5x6)
Memory Interface: SPI
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1361B-117AC CY7C1361B-117AC Infineon Technologies CY7C1361B%2C%2063B.pdf Description: IC SRAM 9MBIT PAR 117MHZ 100TQFP
Packaging: Bag
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 117 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 7.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FP50R06W2E3BOMA1 FP50R06W2E3BOMA1 Infineon Technologies Infineon-FP50R06W2E3-DS-v02_02-en_de.pdf?fileId=db3a30431b3e89eb011b455c99987d24 Description: IGBT MODULE 600V 65A 175W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 175 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 3.1 nF @ 25 V
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1+88.39 EUR
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TLE49632MXTSA1 TLE49632MXTSA1 Infineon Technologies Infineon-TLE4963-2M-DS-v01_00-EN.pdf?fileId=5546d462525dbac4015287edd79f27ca Description: MAGNETIC SWITCH HALL EFF SOT23-3
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Collector
Polarization: South Pole
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 18V
Technology: Hall Effect
Sensing Range: 13.9mT Trip, 5mT Release
Current - Output (Max): 20mA
Current - Supply (Max): 6mA
Supplier Device Package: PG-SOT23-3-15
Test Condition: 25°C
auf Bestellung 3000 Stücke:
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3000+0.39 EUR
Mindestbestellmenge: 3000
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TLE49632MXTSA1 TLE49632MXTSA1 Infineon Technologies Infineon-TLE4963-2M-DS-v01_00-EN.pdf?fileId=5546d462525dbac4015287edd79f27ca Description: MAGNETIC SWITCH HALL EFF SOT23-3
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Collector
Polarization: South Pole
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 18V
Technology: Hall Effect
Sensing Range: 13.9mT Trip, 5mT Release
Current - Output (Max): 20mA
Current - Supply (Max): 6mA
Supplier Device Package: PG-SOT23-3-15
Test Condition: 25°C
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18+0.99 EUR
24+0.75 EUR
28+0.64 EUR
50+0.62 EUR
100+0.53 EUR
500+0.46 EUR
1000+0.4 EUR
Mindestbestellmenge: 18
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CY8C4147LQE-S263T Infineon Technologies Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8 Description: IC MCU 32BIT 128KB FLASH 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 40-QFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4147LQE-S273 CY8C4147LQE-S273 Infineon Technologies Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8 Description: IC MCU 32BIT 128KB FLASH 40QFN
Packaging: Tray
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 40-QFN (6x6)
Grade: Automotive
Number of I/O: 34
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AUIRFU540Z AUIRFU540Z Infineon Technologies auirfr540z.pdf?fileId=5546d462533600a4015355b5d6c91496 Description: MOSFET N-CH 100V 35A IPAK
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 28.5mOhm @ 21A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: IPAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PEB2047NV2.1 PEB2047NV2.1 Infineon Technologies INFNS00941-1.pdf?t.download=true&u=5oefqw Description: IC MEMORY 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Memory
Supplier Device Package: 44-PLCC (16.6x16.6)
DigiKey Programmable: Not Verified
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FS500R17OE4DB61BPSA1 Infineon Technologies Infineon-FS500R17OE4D-DS-v03_00-en_de.pdf?fileId=5546d46145f1f3a40145fb209c810fee Description: FS500R17OE4 - IGBT Module
Packaging: Bulk
auf Bestellung 385 Stücke:
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FS50R12W2T7PBPSA1 Infineon Technologies Description: LOW POWER EASY
Packaging: Tray
auf Bestellung 15 Stücke:
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FS50R06KE3BOSA1 Infineon Technologies Infineon-FS50R06KE3-DS-v02_00-en_cn.pdf?fileId=db3a30433de4e67f013dee44d2593890 Description: FS50R06 - IGBT MODULE
Packaging: Bulk
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SHRDIN933M10X23HPSA1 Infineon Technologies Description: SCR MODULE POWERBLOCK
Packaging: Tray
Produkt ist nicht verfügbar
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AUIRF3805L-7P AUIRF3805L-7P Infineon Technologies auirf3805s-7p.pdf?fileId=5546d462533600a4015355aca8a713b3 Description: MOSFET N-CH 55V 160A TO262
Packaging: Tube
Package / Case: TO-262-7
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 160A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 140A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-262
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 200 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7820 pF @ 25 V
Qualification: AEC-Q101
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TLE9263BQXXUMA2 TLE9263BQXXUMA2 Infineon Technologies Infineon-TLE9263BQX-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805e310398a Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
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TLE9263BQXV33XUMA2 TLE9263BQXV33XUMA2 Infineon Technologies Infineon-TLE9263BQX%20V33-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805ee79398d Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
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3+6.72 EUR
10+5.09 EUR
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100+4.23 EUR
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TLE92633BQXV33XUMA2 TLE92633BQXV33XUMA2 Infineon Technologies Infineon-TLE9263-3BQX%20V33-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805d7dc3987 Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
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TLE9844QXXUMA1 TLE9844QXXUMA1 Infineon Technologies Infineon-TLE9844QX-DS-v01_00-EN.pdf?fileId=5546d46259d9a4bf015a84a1c8a87505 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SSI, UART
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Program Memory Type: FLASH (64kB)
Core Processor: ARM® Cortex®-M0
Supplier Device Package: PG-VQFN-48-31
Grade: Automotive
Number of I/O: 10
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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Lieferzeit 10-14 Tag (e)
3+8.24 EUR
10+7.39 EUR
25+6.99 EUR
100+6.06 EUR
250+5.75 EUR
500+5.16 EUR
1000+4.35 EUR
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TLE9854QXWXUMA1 Infineon Technologies Infineon-TLE9854QXW-DataSheet-v01_00-EN.pdf?fileId=5546d4626c1f3dc3016c71d0fb7538f4 Description: IC MCU 32BIT 64KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 9x8b, 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 5.5V ~ 28V
Connectivity: LINbus, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-29
Grade: Automotive
Number of I/O: 10
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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2500+5.39 EUR
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TLE9854QXWXUMA1 Infineon Technologies Infineon-TLE9854QXW-DataSheet-v01_00-EN.pdf?fileId=5546d4626c1f3dc3016c71d0fb7538f4 Description: IC MCU 32BIT 64KB FLASH 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 9x8b, 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 5.5V ~ 28V
Connectivity: LINbus, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-29
Grade: Automotive
Number of I/O: 10
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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10+8.92 EUR
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250+7.05 EUR
500+6.43 EUR
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XDPE152C4D1000XUMA1 XDPE152C4D1000XUMA1 Infineon Technologies Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc Description: IFX PRIMARION CNTRLLER
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: 0.25V ~ 3.04V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 0.25V ~ 12V
Applications: Controller, Intel VR13
Supplier Device Package: PG-VQFN-48-63
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4000+5.53 EUR
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XDPE152C4D1000XUMA1 XDPE152C4D1000XUMA1 Infineon Technologies Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc Description: IFX PRIMARION CNTRLLER
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: 0.25V ~ 3.04V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 0.25V ~ 12V
Applications: Controller, Intel VR13
Supplier Device Package: PG-VQFN-48-63
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Lieferzeit 10-14 Tag (e)
2+9.84 EUR
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CY8C3MFIDOCK-125 Infineon Technologies 5047 Description: IC MCU
Packaging: Tray
DigiKey Programmable: Not Verified
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6+3.04 EUR
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AUIRFN8403TR AUIRFN8403TR Infineon Technologies auirfn8403.pdf Description: MOSFET N-CH 40V 95A 8PQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 95A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 50A, 10V
Power Dissipation (Max): 4.3W (Ta), 94W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 100µA
Supplier Device Package: 8-PQFN (5x6)
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 98 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3174 pF @ 25 V
Qualification: AEC-Q101
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AUIRFN8401TR AUIRFN8401TR Infineon Technologies auirfn8401.pdf?fileId=5546d462533600a4015355b169f4143c Description: MOSFET N-CH 40V 84A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 50A, 10V
Power Dissipation (Max): 4.2W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 50µA
Supplier Device Package: PQFN (5x6)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2170 pF @ 25 V
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6PS03012E33G34160NOSA1 6PS03012E33G34160NOSA1 Infineon Technologies Description: IGBT MODULE 300V 234A 2100W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -25°C ~ 55°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: Module
Power - Max: 2100 W
Produkt ist nicht verfügbar
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TLE98912QTW60XUMA1 TLE98912QTW60XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
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TLE98912QTW60XUMA1 TLE98912QTW60XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2376 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.7 EUR
10+9.05 EUR
25+8.39 EUR
100+7.66 EUR
250+7.32 EUR
500+7.11 EUR
1000+6.93 EUR
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TLE98932QTA62XUMA1 TLE98932QTA62XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
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TLE98932QTA62XUMA1 TLE98932QTA62XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2007 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.93 EUR
10+9.24 EUR
25+8.56 EUR
100+7.82 EUR
250+7.47 EUR
500+7.26 EUR
1000+7.08 EUR
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TLE98912QTW61XUMA1 TLE98912QTW61XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98912QTW61XUMA1 TLE98912QTW61XUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2203 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.48 EUR
10+8.87 EUR
25+8.22 EUR
100+7.51 EUR
250+7.17 EUR
500+6.96 EUR
1000+6.79 EUR
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TLE98932QTA62SXUMA1 TLE98932QTA62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QTA62SXUMA1 TLE98932QTA62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2252 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.6 EUR
10+8.97 EUR
25+8.31 EUR
100+7.59 EUR
250+7.25 EUR
500+7.04 EUR
1000+6.87 EUR
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TLE98932QTW62SXUMA1 TLE98932QTW62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
2500+7.02 EUR
Mindestbestellmenge: 2500
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TLE98932QTW62SXUMA1 TLE98932QTW62SXUMA1 Infineon Technologies Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50 Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2808 Stücke:
Lieferzeit 10-14 Tag (e)
2+12.13 EUR
10+9.39 EUR
25+8.7 EUR
100+7.95 EUR
250+7.6 EUR
500+7.38 EUR
1000+7.2 EUR
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CY62136FV30LL-45BVXI CY62136FV30LL-45BVXI Infineon Technologies Infineon-CY62136FV30_MoBL_2-Mbit_(128_K_16)_Static_RAM-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebef2bb32ee&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 2MBIT PARALLEL 48VFBGA
Packaging: Tray
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 128K x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FP25R12KT4B15BPSA1 Infineon-FP25R12KT4_B15-DS-v02_00-en_de.pdf?fileId=db3a30432d9b3066012da33f29623575
Hersteller: Infineon Technologies
Description: LOW POWER ECONO AG-ECONO2C-411
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.25V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2C
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 25 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 160 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.45 nF @ 25 V
Produkt ist nicht verfügbar
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FP25R12N2T7BPSA1
Hersteller: Infineon Technologies
Description: LOW POWER ECONO
Packaging: Tray
Produkt ist nicht verfügbar
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FP25R12N2T7B80BPSA1
Hersteller: Infineon Technologies
Description: LOW POWER ECONO
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
NTC Thermistor: No
Supplier Device Package: AG-EASY2B
IGBT Type: Trench Field Stop
Produkt ist nicht verfügbar
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FP25R12KT3BOSA1 Infineon-FP25R12KT3-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b4316c90543e
FP25R12KT3BOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 40A 155W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 40 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 155 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 1.8 nF @ 25 V
auf Bestellung 7 Stücke:
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Anzahl Preis
4+110.51 EUR
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S6E2C29L0AGL2000A download
S6E2C29L0AGL2000A
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 216LQFP
Packaging: Tray
Package / Case: 216-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, SPI, UART/USART, USB
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-LQFP (24x24)
Number of I/O: 190
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FF800R12KE7PEHPSA1
Hersteller: Infineon Technologies
Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Produkt ist nicht verfügbar
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FF800R12KE7PHPSA1
Hersteller: Infineon Technologies
Description: MEDIUM POWER 62MM
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
NTC Thermistor: No
Supplier Device Package: AG-62MMHB
IGBT Type: Trench Field Stop
Produkt ist nicht verfügbar
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CY7C1061GE-10ZXI Infineon-CY7C1061G_CY7C1061GE_16_MBIT_(1M_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec387e33888&utm_source=cypress&utm_medium=referral&utm_campaign=202110_
CY7C1061GE-10ZXI
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PAR 54TSOP II
Packaging: Tray
Package / Case: 54-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 54-TSOP II
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FZ1500R33HE3BPSA1 Infineon-FZ1500R33HE3-DS-v03_01-en_de.pdf?fileId=db3a304314dca389011527dfc61411c3
FZ1500R33HE3BPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 3300V 1500A 17000W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 3.1V @ 15V, 1500A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 1500 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 17000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
auf Bestellung 57 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+3189.28 EUR
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FF400R33KF2CNOSA1 Infineon-FF400R33KF2C-DS-v02_01-en_de.pdf?fileId=db3a304412b407950112b430e9825263
FF400R33KF2CNOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 3300V 660A 4800W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 4.25V @ 15V, 400A
NTC Thermistor: No
Supplier Device Package: Module
Current - Collector (Ic) (Max): 660 A
Voltage - Collector Emitter Breakdown (Max): 3300 V
Power - Max: 4800 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 50 nF @ 25 V
Produkt ist nicht verfügbar
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CY8C27643-24PVXIT download
CY8C27643-24PVXIT
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 48SSOP
Packaging: Cut Tape (CT)
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 256 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 4x14b; D/A 4x9b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 48-SSOP
Number of I/O: 44
DigiKey Programmable: Verified
auf Bestellung 464 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.16 EUR
10+16.64 EUR
25+15.52 EUR
100+14.28 EUR
250+13.69 EUR
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PEB3352HTV2.1
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 540 Stücke:
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Anzahl Preis
35+14.78 EUR
Mindestbestellmenge: 35
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PEB3332FV2.1
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 11400 Stücke:
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Anzahl Preis
24+21.43 EUR
Mindestbestellmenge: 24
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PEB3320HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 360 Stücke:
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Anzahl Preis
24+21.85 EUR
Mindestbestellmenge: 24
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PEB3314EV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 180 Stücke:
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Anzahl Preis
19+27.37 EUR
Mindestbestellmenge: 19
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PEB3314HLV1.4
PEB3314HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 711 Stücke:
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Anzahl Preis
18+28.76 EUR
Mindestbestellmenge: 18
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PEB3332HTV2.1PE
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 3240 Stücke:
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Anzahl Preis
17+31.03 EUR
Mindestbestellmenge: 17
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PEB3322HLV1.4
Hersteller: Infineon Technologies
Description: VINETIC VOICE AND INTERNET ENHAN
Packaging: Bulk
auf Bestellung 29400 Stücke:
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Anzahl Preis
14+36.35 EUR
Mindestbestellmenge: 14
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S28HL01GTFPBHB030 download
S28HL01GTFPBHB030
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT SPI/OCTAL 24FBGA
Packaging: Tray
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 24-FBGA (6x8)
Memory Interface: SPI - Octal I/O
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
auf Bestellung 777 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+41.11 EUR
10+36.48 EUR
25+34.79 EUR
40+33.95 EUR
80+32.74 EUR
260+30.79 EUR
520+29.7 EUR
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IDWD30E65E7XKSA1 Infineon-IDWD30E65E7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8b6555fe018c3a59d2d158ea
IDWD30E65E7XKSA1
Hersteller: Infineon Technologies
Description: DIODE STD 650V 50A PGTO24722
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 82 ns
Technology: Standard
Current - Average Rectified (Io): 50A
Supplier Device Package: PG-TO247-2-2
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 30 A
Current - Reverse Leakage @ Vr: 20 µA @ 650 V
auf Bestellung 193 Stücke:
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Anzahl Preis
4+5.68 EUR
30+3.08 EUR
120+2.54 EUR
Mindestbestellmenge: 4
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IRFB7787PBF irfs7787pbf.pdf?fileId=5546d462533600a40153563ad73d21eb
IRFB7787PBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 75V 76A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 76A (Tc)
Rds On (Max) @ Id, Vgs: 8.4mOhm @ 46A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 100µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 75 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4020 pF @ 25 V
Produkt ist nicht verfügbar
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S25HL01GTFAMHI010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
S25HL01GTFAMHI010
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
auf Bestellung 5712 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+29.81 EUR
10+26.45 EUR
25+25.22 EUR
40+24.61 EUR
80+23.74 EUR
240+22.42 EUR
480+21.62 EUR
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S25HL01GTFAMHM010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FM25V20A-DGTR FM25V20A_RevJ_12-22-23.pdf
FM25V20A-DGTR
Hersteller: Infineon Technologies
Description: IC FRAM 2MBIT SPI 40MHZ 8DFN
Packaging: Tape & Reel (TR)
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-DFN (5x6)
Memory Interface: SPI
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1361B-117AC CY7C1361B%2C%2063B.pdf
CY7C1361B-117AC
Hersteller: Infineon Technologies
Description: IC SRAM 9MBIT PAR 117MHZ 100TQFP
Packaging: Bag
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 117 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 7.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FP50R06W2E3BOMA1 Infineon-FP50R06W2E3-DS-v02_02-en_de.pdf?fileId=db3a30431b3e89eb011b455c99987d24
FP50R06W2E3BOMA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 600V 65A 175W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 50A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 65 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 175 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 3.1 nF @ 25 V
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+88.39 EUR
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TLE49632MXTSA1 Infineon-TLE4963-2M-DS-v01_00-EN.pdf?fileId=5546d462525dbac4015287edd79f27ca
TLE49632MXTSA1
Hersteller: Infineon Technologies
Description: MAGNETIC SWITCH HALL EFF SOT23-3
Features: Temperature Compensated
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Collector
Polarization: South Pole
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 18V
Technology: Hall Effect
Sensing Range: 13.9mT Trip, 5mT Release
Current - Output (Max): 20mA
Current - Supply (Max): 6mA
Supplier Device Package: PG-SOT23-3-15
Test Condition: 25°C
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.39 EUR
Mindestbestellmenge: 3000
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TLE49632MXTSA1 Infineon-TLE4963-2M-DS-v01_00-EN.pdf?fileId=5546d462525dbac4015287edd79f27ca
TLE49632MXTSA1
Hersteller: Infineon Technologies
Description: MAGNETIC SWITCH HALL EFF SOT23-3
Features: Temperature Compensated
Packaging: Cut Tape (CT)
Package / Case: TO-236-3, SC-59, SOT-23-3
Output Type: Open Collector
Polarization: South Pole
Mounting Type: Surface Mount
Function: Unipolar Switch
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 18V
Technology: Hall Effect
Sensing Range: 13.9mT Trip, 5mT Release
Current - Output (Max): 20mA
Current - Supply (Max): 6mA
Supplier Device Package: PG-SOT23-3-15
Test Condition: 25°C
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
18+0.99 EUR
24+0.75 EUR
28+0.64 EUR
50+0.62 EUR
100+0.53 EUR
500+0.46 EUR
1000+0.4 EUR
Mindestbestellmenge: 18
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CY8C4147LQE-S263T Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 40-QFN (6x6)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4147LQE-S273 Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8
CY8C4147LQE-S273
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 40QFN
Packaging: Tray
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 24MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 20x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 40-QFN (6x6)
Grade: Automotive
Number of I/O: 34
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AUIRFU540Z auirfr540z.pdf?fileId=5546d462533600a4015355b5d6c91496
AUIRFU540Z
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 35A IPAK
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 28.5mOhm @ 21A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: IPAK
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 59 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1690 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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PEB2047NV2.1 INFNS00941-1.pdf?t.download=true&u=5oefqw
PEB2047NV2.1
Hersteller: Infineon Technologies
Description: IC MEMORY 44PLCC
Packaging: Bulk
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Type: Memory
Supplier Device Package: 44-PLCC (16.6x16.6)
DigiKey Programmable: Not Verified
auf Bestellung 106 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+80.04 EUR
Mindestbestellmenge: 7
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FS500R17OE4DB61BPSA1 Infineon-FS500R17OE4D-DS-v03_00-en_de.pdf?fileId=5546d46145f1f3a40145fb209c810fee
Hersteller: Infineon Technologies
Description: FS500R17OE4 - IGBT Module
Packaging: Bulk
auf Bestellung 385 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+961.86 EUR
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FS50R12W2T7PBPSA1
Hersteller: Infineon Technologies
Description: LOW POWER EASY
Packaging: Tray
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+95.87 EUR
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FS50R06KE3BOSA1 Infineon-FS50R06KE3-DS-v02_00-en_cn.pdf?fileId=db3a30433de4e67f013dee44d2593890
Hersteller: Infineon Technologies
Description: FS50R06 - IGBT MODULE
Packaging: Bulk
auf Bestellung 664 Stücke:
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Anzahl Preis
6+86.37 EUR
Mindestbestellmenge: 6
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SHRDIN933M10X23HPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE POWERBLOCK
Packaging: Tray
Produkt ist nicht verfügbar
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AUIRF3805L-7P auirf3805s-7p.pdf?fileId=5546d462533600a4015355aca8a713b3
AUIRF3805L-7P
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 160A TO262
Packaging: Tube
Package / Case: TO-262-7
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 160A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 140A, 10V
Power Dissipation (Max): 300W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-262
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 200 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7820 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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TLE9263BQXXUMA2 Infineon-TLE9263BQX-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805e310398a
TLE9263BQXXUMA2
Hersteller: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
Produkt ist nicht verfügbar
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TLE9263BQXV33XUMA2 Infineon-TLE9263BQX%20V33-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805ee79398d
TLE9263BQXV33XUMA2
Hersteller: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
auf Bestellung 1418 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.72 EUR
10+5.09 EUR
25+4.68 EUR
100+4.23 EUR
250+4.01 EUR
500+3.88 EUR
1000+3.78 EUR
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TLE92633BQXV33XUMA2 Infineon-TLE9263-3BQX%20V33-DataSheet-v01_20-EN.pdf?fileId=5546d462602a9dc801609805d7dc3987
TLE92633BQXV33XUMA2
Hersteller: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Applications: System Basis Chip
Current - Supply: 3.5mA
Supplier Device Package: PG-VQFN-48-79
auf Bestellung 4572 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.76 EUR
10+5.13 EUR
25+4.72 EUR
100+4.27 EUR
250+4.06 EUR
500+3.93 EUR
1000+3.82 EUR
Mindestbestellmenge: 3
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TLE9844QXXUMA1 Infineon-TLE9844QX-DS-v01_00-EN.pdf?fileId=5546d46259d9a4bf015a84a1c8a87505
TLE9844QXXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: LIN, SSI, UART
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 3V ~ 28V
Program Memory Type: FLASH (64kB)
Core Processor: ARM® Cortex®-M0
Supplier Device Package: PG-VQFN-48-31
Grade: Automotive
Number of I/O: 10
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.24 EUR
10+7.39 EUR
25+6.99 EUR
100+6.06 EUR
250+5.75 EUR
500+5.16 EUR
1000+4.35 EUR
Mindestbestellmenge: 3
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TLE9854QXWXUMA1 Infineon-TLE9854QXW-DataSheet-v01_00-EN.pdf?fileId=5546d4626c1f3dc3016c71d0fb7538f4
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 9x8b, 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 5.5V ~ 28V
Connectivity: LINbus, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-29
Grade: Automotive
Number of I/O: 10
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+5.39 EUR
Mindestbestellmenge: 2500
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TLE9854QXWXUMA1 Infineon-TLE9854QXW-DataSheet-v01_00-EN.pdf?fileId=5546d4626c1f3dc3016c71d0fb7538f4
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 4K x 8
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 9x8b, 12x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 5.5V ~ 28V
Connectivity: LINbus, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-29
Grade: Automotive
Number of I/O: 10
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.87 EUR
10+8.92 EUR
25+8.5 EUR
100+7.38 EUR
250+7.05 EUR
500+6.43 EUR
1000+5.6 EUR
Mindestbestellmenge: 2
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XDPE152C4D1000XUMA1 Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc
XDPE152C4D1000XUMA1
Hersteller: Infineon Technologies
Description: IFX PRIMARION CNTRLLER
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: 0.25V ~ 3.04V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 0.25V ~ 12V
Applications: Controller, Intel VR13
Supplier Device Package: PG-VQFN-48-63
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4000+5.53 EUR
Mindestbestellmenge: 4000
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XDPE152C4D1000XUMA1 Infineon-XDPE152C4D-0000-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018042f23aff00cc
XDPE152C4D1000XUMA1
Hersteller: Infineon Technologies
Description: IFX PRIMARION CNTRLLER
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: 0.25V ~ 3.04V
Mounting Type: Surface Mount
Number of Outputs: 2
Voltage - Input: 0.25V ~ 12V
Applications: Controller, Intel VR13
Supplier Device Package: PG-VQFN-48-63
auf Bestellung 5457 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.84 EUR
10+7.57 EUR
25+7 EUR
100+6.38 EUR
250+6.08 EUR
500+5.9 EUR
1000+5.75 EUR
Mindestbestellmenge: 2
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CY8C3MFIDOCK-125 5047
Hersteller: Infineon Technologies
Description: IC MCU
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.04 EUR
Mindestbestellmenge: 6
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AUIRFN8403TR auirfn8403.pdf
AUIRFN8403TR
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 95A 8PQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 95A (Tc)
Rds On (Max) @ Id, Vgs: 3.3mOhm @ 50A, 10V
Power Dissipation (Max): 4.3W (Ta), 94W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 100µA
Supplier Device Package: 8-PQFN (5x6)
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 98 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3174 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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AUIRFN8401TR auirfn8401.pdf?fileId=5546d462533600a4015355b169f4143c
AUIRFN8401TR
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 84A PQFN
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 84A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 50A, 10V
Power Dissipation (Max): 4.2W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 3.9V @ 50µA
Supplier Device Package: PQFN (5x6)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2170 pF @ 25 V
Produkt ist nicht verfügbar
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6PS03012E33G34160NOSA1
6PS03012E33G34160NOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 300V 234A 2100W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -25°C ~ 55°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 300A
NTC Thermistor: No
Supplier Device Package: Module
Power - Max: 2100 W
Produkt ist nicht verfügbar
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TLE98912QTW60XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98912QTW60XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98912QTW60XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98912QTW60XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2376 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.7 EUR
10+9.05 EUR
25+8.39 EUR
100+7.66 EUR
250+7.32 EUR
500+7.11 EUR
1000+6.93 EUR
Mindestbestellmenge: 2
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TLE98932QTA62XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTA62XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98932QTA62XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTA62XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2007 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.93 EUR
10+9.24 EUR
25+8.56 EUR
100+7.82 EUR
250+7.47 EUR
500+7.26 EUR
1000+7.08 EUR
Mindestbestellmenge: 2
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TLE98912QTW61XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98912QTW61XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE98912QTW61XUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98912QTW61XUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (144kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2203 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.48 EUR
10+8.87 EUR
25+8.22 EUR
100+7.51 EUR
250+7.17 EUR
500+6.96 EUR
1000+6.79 EUR
Mindestbestellmenge: 2
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TLE98932QTA62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTA62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TLE98932QTA62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTA62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2252 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.6 EUR
10+8.97 EUR
25+8.31 EUR
100+7.59 EUR
250+7.25 EUR
500+7.04 EUR
1000+6.87 EUR
Mindestbestellmenge: 2
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TLE98932QTW62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTW62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Tape & Reel (TR)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+7.02 EUR
Mindestbestellmenge: 2500
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TLE98932QTW62SXUMA1 Infineon-TLE988x_9x_DataSheet-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8823155701882e60aa3a4f50
TLE98932QTW62SXUMA1
Hersteller: Infineon Technologies
Description: EMBEDDED POWER
Packaging: Cut Tape (CT)
Package / Case: 48-TQFP Exposed Pad
Mounting Type: Surface Mount
Interface: CANbus, DMA, GPIO, SPI, SSC, UART/USART
RAM Size: 31K x 8
Operating Temperature: -40°C ~ 175°C (TJ)
Voltage - Supply: 5.5V ~ 28V
Controller Series: TLE989x
Program Memory Type: EEPROM (8kB), FLASH (272kB)
Applications: BLDC Controller
Core Processor: ARM® Cortex®-M3
Supplier Device Package: PG-TQFP-48-10
Grade: Automotive
Number of I/O: 8
Qualification: AEC-Q100
auf Bestellung 2808 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.13 EUR
10+9.39 EUR
25+8.7 EUR
100+7.95 EUR
250+7.6 EUR
500+7.38 EUR
1000+7.2 EUR
Mindestbestellmenge: 2
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CY62136FV30LL-45BVXI Infineon-CY62136FV30_MoBL_2-Mbit_(128_K_16)_Static_RAM-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebef2bb32ee&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY62136FV30LL-45BVXI
Hersteller: Infineon Technologies
Description: IC SRAM 2MBIT PARALLEL 48VFBGA
Packaging: Tray
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 128K x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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