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CY2308SXC-3T CY2308SXC-3T Infineon Technologies Infineon-CY2308_3.3_V_Zero_Delay_Buffer-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcea4d2ec4&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FANOUT BUFFER 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-SOIC
PLL: Yes
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 480 Stücke:
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10+3.39 EUR
25+3.18 EUR
100+2.89 EUR
250+2.72 EUR
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CY62256NLL-70ZRXIT CY62256NLL-70ZRXIT Infineon Technologies Infineon-CY62256N_256-Kbit_(32_K_8)_Static_RAM-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebee07732ce Description: IC SRAM 256KBIT PAR 28TSOP I
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 28-TSOP I
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1079 Stücke:
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14+1.28 EUR
16+1.1 EUR
25+1.03 EUR
50+0.99 EUR
100+0.94 EUR
250+0.88 EUR
500+0.84 EUR
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CY3280-MBR CY3280-MBR Infineon Technologies download Description: BOARD EVAL CAPSENSE EXPRESS
Produkt ist nicht verfügbar
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CY4502 CY4502 Infineon Technologies Infineon-EZ-PD_CCG2_Datasheet_USB_Type-C_Port_Controller-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd9536480b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: KIT DEV FOR INTERFACE CNTRLR
Packaging: Box
Function: USB Type-C®
Type: Interface
Utilized IC / Part: CCG2
Supplied Contents: Board(s)
Part Status: Active
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CY5676 CY5676 Infineon Technologies Infineon-Quick_Start_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ef9a09b0f90&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: DEV KIT PROC BLE
Packaging: Bulk
For Use With/Related Products: PRoC™ BLE
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Obsolete
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3+6.71 EUR
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CY8CKIT-046 CY8CKIT-046 Infineon Technologies CY8CKIT-046_Web.pdf Description: PSOC 4 L-SERIES PIONEER KIT
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: PSoC 4200L
Platform: PSoC 4 L-Series Pioneer Kit
Part Status: Active
Packaging: Bulk
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CG7618AA Infineon Technologies Infineon-CY7C1418KV18_CY7C1420KV18_36-Mbit_DDR_II_SRAM_Two-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1b25e368a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
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CY7C1011G30-12ZSXE CY7C1011G30-12ZSXE Infineon Technologies Infineon-CY7C1011G_AUTOMOTIVE_2_MBIT_(128K_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7727c5896 Description: IC SRAM 2MBIT PARALLEL 44TSOP II
Packaging: Tray
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 128K x 16
DigiKey Programmable: Not Verified
auf Bestellung 63 Stücke:
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10+4.08 EUR
25+3.82 EUR
40+3.7 EUR
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CY7C1061GE30-10ZXI CY7C1061GE30-10ZXI Infineon Technologies Infineon-CY7C1061G_CY7C1061GE_16_MBIT_(1M_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec387e33888&utm_source=cypress&utm_medium=referral&utm_campaign=202110_ Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Part Status: Active
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1149 Stücke:
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1+18.16 EUR
10+15.5 EUR
25+14.58 EUR
40+14.13 EUR
96+13.35 EUR
288+12.47 EUR
480+12.09 EUR
960+11.6 EUR
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CY7C1380KV33-167BZI CY7C1380KV33-167BZI Infineon Technologies download Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 167 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Access Time: 3.4 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
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1+18.23 EUR
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CY7C1413KV18-250BZXI CY7C1413KV18-250BZXI Infineon Technologies Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 2M x 18
DigiKey Programmable: Not Verified
auf Bestellung 86 Stücke:
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CY7C1415KV18-250BZI CY7C1415KV18-250BZI Infineon Technologies Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 625 Stücke:
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1+20.93 EUR
10+17.92 EUR
25+16.88 EUR
40+16.39 EUR
80+15.7 EUR
230+14.75 EUR
440+14.21 EUR
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CY7C1415KV18-250BZXC CY7C1415KV18-250BZXC Infineon Technologies Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 1649 Stücke:
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1+24.25 EUR
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CY7C2270KV18-550BZXC CY7C2270KV18-550BZXC Infineon Technologies Infineon-CY7C2268KV18_CY7C2270KV18_36-Mbit_DDR_II+_SRAM_Two-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)_with_ODT-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec197363665 Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II+
Clock Frequency: 550 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 643 Stücke:
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CY8C20234-12LKXI CY8C20234-12LKXI Infineon Technologies Infineon-CY8C20134_CY8C20234_CY8C20334_CY8C20434_CY8C20534_CY8C20634_PSoC_Programmable_System-on-Chip-DataSheet-v24_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcc61b2e7f&utm_source=cypress&utm_medium=referral&utm_campaign=202110_ Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 2448 Stücke:
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16+1.16 EUR
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CY8C20424-12LQXI CY8C20424-12LQXI Infineon Technologies Infineon-CY8C20224_CY8C20324_CY8C20424_CY8C20524_CAPSENSE_PSOC_PROGRAMMABLE_SYSTEM_ON_CHIP-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecae11743f6 Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1262 Stücke:
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16+1.16 EUR
18+1 EUR
25+0.93 EUR
100+0.83 EUR
490+0.73 EUR
980+0.7 EUR
Mindestbestellmenge: 16
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S25FL164K0XBHI030 S25FL164K0XBHI030 Infineon Technologies S25FL116K_132K_164K__RevH_5-19-17.pdf Description: IC FLASH 64MBIT SPI/QUAD 24BGA
auf Bestellung 35 Stücke:
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35+0.51 EUR
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S29GL256S10DHSS50 S29GL256S10DHSS50 Infineon Technologies Infineon-S29GL01GS_S29GL512S_S29GL256S_S29GL128S_128_Mb_256_Mb_512_Mb_1_Gb_GL-S_MIRRORBIT_TM_Flash_Parallel_3-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5 Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
auf Bestellung 841 Stücke:
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8+2.34 EUR
10+2.19 EUR
25+2.13 EUR
50+2.08 EUR
100+2.03 EUR
260+1.97 EUR
520+1.92 EUR
Mindestbestellmenge: 8
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CY2308SXI-3 CY2308SXI-3 Infineon Technologies CY2308.pdf Description: IC FANOUT BUFFER 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-SOIC
PLL: Yes
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 93 Stücke:
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2+10.3 EUR
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CY8C20546A-24PVXI CY8C20546A-24PVXI Infineon Technologies download Description: IC MCU 16K FLASH 2K SRAM 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I²C, SPI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 5.5V
Controller Series: CY8C20xx6A
Program Memory Type: FLASH (16kB)
Applications: Capacitive Sensing
Core Processor: M8C
Supplier Device Package: 48-SSOP
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1368 Stücke:
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FM25V20A-PG FM25V20A-PG Infineon Technologies FM25V20A_PDIP_RevE_2-9-24.pdf Description: IC FRAM 2MBIT SPI 40MHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-PDIP
Part Status: Active
Memory Interface: SPI
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 113 Stücke:
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4+5.51 EUR
10+5.14 EUR
25+4.99 EUR
53+4.87 EUR
106+4.75 EUR
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BGA855N6E6327XTSA1 BGA855N6E6327XTSA1 Infineon Technologies Infineon-BGA855N6-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32ebeb1141d Description: IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.164GHz ~ 1.3GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.1V ~ 3.3V
Gain: 18.9dB
Current - Supply: 5.4mA
Noise Figure: 0.6dB
P1dB: -8dBm
Test Frequency: 1.214GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
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12000+0.4 EUR
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REFXDPL8221U50WTOBO1 REFXDPL8221U50WTOBO1 Infineon Technologies Infineon-XDPL8221-DS-v01_01-EN.pdf?fileId=5546d46266f85d6301670d68764e3679 Description: EVAL BOARD FOR XDPL8221
Packaging: Bulk
Features: Dimmable
Voltage - Output: 16V ~ 48V
Voltage - Input: 90 ~ 305 VAC, 90V ~ 430V
Current - Output / Channel: 1.5A
Utilized IC / Part: XDPL8221
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Active
Contents: Board(s)
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REFXDPL8221U100WTOBO1 REFXDPL8221U100WTOBO1 Infineon Technologies Infineon-EngineeringReport_ReferenceBoard_XDPdigitalpower_REF-XDPL8221-U100W-AN-v01_00-EN.pdf?fileId=5546d462689a790c0168dbf6d0a652e1 Description: EVAL BOARD FOR XDPL8221
Packaging: Bulk
Features: Dimmable
Voltage - Output: 16V ~ 48V
Voltage - Input: 90 ~ 305 VAC, 90V ~ 305V
Current - Output / Channel: 2.5A
Utilized IC / Part: XDPL8221
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Active
Contents: Board(s)
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1+211.8 EUR
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TLE8457CSJXUMA1 TLE8457CSJXUMA1 Infineon Technologies Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be Description: IC TRANSCEIVER 1/1 PGDSO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-DSO-8
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2409 Stücke:
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9+2.11 EUR
12+1.54 EUR
25+1.4 EUR
100+1.24 EUR
250+1.16 EUR
500+1.12 EUR
1000+1.08 EUR
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TLE8457DLEXUMA1 TLE8457DLEXUMA1 Infineon Technologies Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be Description: IC TRANSCEIVER 1/1 PGTDSON81
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-TDSON-8-1
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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250+1.26 EUR
500+1.21 EUR
1000+1.17 EUR
2500+1.12 EUR
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TLE8457DSJXUMA1 TLE8457DSJXUMA1 Infineon Technologies Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be Description: IC TRANSCEIVER 1/1 DSO-8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-DSO-8
Part Status: Active
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100+2.05 EUR
250+1.93 EUR
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1000+1.4 EUR
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BGA855N6E6327XTSA1 BGA855N6E6327XTSA1 Infineon Technologies Infineon-BGA855N6-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32ebeb1141d Description: IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.164GHz ~ 1.3GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.1V ~ 3.3V
Gain: 18.9dB
Current - Supply: 5.4mA
Noise Figure: 0.6dB
P1dB: -8dBm
Test Frequency: 1.214GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
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30+0.6 EUR
100+0.52 EUR
250+0.49 EUR
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1000+0.45 EUR
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TLE8104EXUMA2 TLE8104EXUMA2 Infineon Technologies Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25 Description: IC PWR SWITCH N-CHAN 1:1 DSO-20
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TLE8104EXUMA2 TLE8104EXUMA2 Infineon Technologies Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25 Description: IC PWR SWITCH N-CHAN 1:1 DSO-20
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BGS14MPA9E6327XTSA1 BGS14MPA9E6327XTSA1 Infineon Technologies Infineon-BGS14MPA9-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32eb6c5141a Description: IC RF SWITCH SP4T 6GHZ ATSLP9-3
Packaging: Cut Tape (CT)
Features: DC Blocked
Package / Case: 9-UFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP4T
RF Type: 2G/3G/4G/5G, Cellular, LTE, W-CDMA
Operating Temperature: 125°C (TJ)
Voltage - Supply: 1.65V ~ 1.95V
Insertion Loss: 1dB
Frequency Range: 50MHz ~ 6GHz
Test Frequency: 5.925GHz
Isolation: 23dB
Supplier Device Package: PG-ATSLP-9-3
IIP3: 77dBm
Part Status: Not For New Designs
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11+1.65 EUR
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100+0.88 EUR
250+0.81 EUR
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1000+0.74 EUR
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BSM150GB170DLCE3256HDLA1 Infineon Technologies Description: IGBT MODULE 1700V 300A 1250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 3.2V @ 15V, 150A
NTC Thermistor: No
Part Status: Obsolete
Current - Collector (Ic) (Max): 300 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1250 W
Current - Collector Cutoff (Max): 300 µA
Input Capacitance (Cies) @ Vce: 10 nF @ 25 V
Produkt ist nicht verfügbar
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BSC010N04LS6ATMA1 BSC010N04LS6ATMA1 Infineon Technologies Infineon-BSC010N04LS6-DS-v02_00-EN.pdf?fileId=5546d462689a790c0168bd076e184818 Description: MOSFET N-CH 40V 40A/100A TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 100A (Tc)
Rds On (Max) @ Id, Vgs: 1mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 250µA
Supplier Device Package: PG-TDSON-8-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 4600 pF @ 20 V
auf Bestellung 8019 Stücke:
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6+3.45 EUR
10+2.31 EUR
100+1.7 EUR
500+1.37 EUR
1000+1.36 EUR
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BSC022N04LS6ATMA1 BSC022N04LS6ATMA1 Infineon Technologies Infineon-BSC022N04LS6-DS-v02_00-EN.pdf?fileId=5546d462689a790c0168bd1094dc481b Description: MOSFET N-CH 40V 27A/100A TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 27A (Ta), 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 79W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 250µA
Supplier Device Package: PG-TDSON-8-1
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1900 pF @ 20 V
auf Bestellung 5472 Stücke:
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AUXDILZ24NS Infineon Technologies Description: MOSFET N-CH D2PAK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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IPD650P06NMSAUMA1 IPD650P06NMSAUMA1 Infineon Technologies Power_Sensing_Selection_Guide_2021.pdf Description: MOSFET P-CH 60V 22A TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 22A, 10V
Power Dissipation (Max): 83W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1.04mA
Supplier Device Package: PG-TO252-3-313
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 39 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1600 pF @ 30 V
Produkt ist nicht verfügbar
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IPD950P06NMSAUMA1 IPD950P06NMSAUMA1 Infineon Technologies Description: MOSFET P-CH 60V TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Supplier Device Package: PG-TO252-3-313
Part Status: Active
Drain to Source Voltage (Vdss): 60 V
Produkt ist nicht verfügbar
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IPD06P003NSAUMA1 IPD06P003NSAUMA1 Infineon Technologies Description: MOSFET P-CH 60V 22A TO252-3
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IDWD15G120C5XKSA1 IDWD15G120C5XKSA1 Infineon Technologies Infineon-IDWD15G120C5-DS-v02_00-EN.pdf?fileId=5546d462689a790c016933d54d2b5489 Description: DIODE SIL CARB 1.2KV 49A TO247-2
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1050pF @ 1V, 1MHz
Current - Average Rectified (Io): 49A
Supplier Device Package: PG-TO247-2
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.65 V @ 15 A
Current - Reverse Leakage @ Vr: 124 µA @ 1200 V
auf Bestellung 230 Stücke:
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1+18.88 EUR
10+16.18 EUR
100+13.49 EUR
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IKP28N65ES5XKSA1 IKP28N65ES5XKSA1 Infineon Technologies Infineon-IKP28N65ES5-DS-v02_01-EN.pdf?fileId=5546d462696dbf1201697b6e31284429 Description: IGBT TRENCH FS 650V 38A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 73 ns
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 28A
Supplier Device Package: PG-TO220-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 27ns/184ns
Switching Energy: 530µJ (on), 400µJ (off)
Test Condition: 400V, 28A, 34Ohm, 15V
Gate Charge: 50 nC
Part Status: Active
Current - Collector (Ic) (Max): 38 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 130 W
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IM393L6FXKLA1 IM393L6FXKLA1 Infineon Technologies Infineon-IM393-L6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a946a8b78d2 Description: POWER MODULE 600V 15A MDIP22
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6FXKLA1 IM393M6FXKLA1 Infineon Technologies Infineon-IM393-M6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a947c0278da Description: POWER MODULE 600V 10A 26PWRSIP
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393S6FXKLA1 IM393S6FXKLA1 Infineon Technologies Infineon-IM393-S6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a9d808378dd Description: POWER MODULE 600V 6A MDIP22
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 6 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393L6EXKLA1 IM393L6EXKLA1 Infineon Technologies Infineon-IM393-L6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a8b350f78c7 Description: POWER MODULE 600V 15A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393L6E3XKLA1 Infineon Technologies Infineon-IM393-L6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a8b350f78c7 Description: POWER MODULE 600V 15A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6EXKLA1 IM393M6EXKLA1 Infineon Technologies Infineon-IM393-M6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a94732278d5 Description: POWER MODULE 600V 10A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6E2XKLA1 IM393M6E2XKLA1 Infineon Technologies Infineon-IM393-M6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a94732278d5 Description: POWER MODULE 600V 10A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6E3XKLA1 IM393M6E3XKLA1 Infineon Technologies Infineon-IM393-M6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a94732278d5 Description: POWER MODULE 600V 10A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393S6E2XKLA1 IM393S6E2XKLA1 Infineon Technologies Infineon-IM393-S6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a9d912478e4 Description: POWER MODULE 600V 6A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 6 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393X6EXKLA1 IM393X6EXKLA1 Infineon Technologies Infineon-IM393-X6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a9d9a3578e9 Description: POWER MODULE 600V 20A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 20 A
Voltage: 600 V
Produkt ist nicht verfügbar
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EVALM1IM231TOBO1 Infineon Technologies Infineon-IM231-L6S1B_T2B-DS-v02_00-EN.pdf?fileId=5546d462689a790c0169067334d10ef3 Description: EVAL IM231 CIPOS MICRO IPM
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EVALSHNBV01DPS422TOBO1 EVALSHNBV01DPS422TOBO1 Infineon Technologies Infineon-Quick%20Setup%20Guide%20for%20Barometric%20Pressure%20Sensor%20Hub%20Nano-GS-v01_01-EN.pdf?fileId=5546d46269bda8df0169bf3dccc11a5c Description: EVAL DPS422 BAROMETRIC HUB
Packaging: Bulk
Interface: RF
Sensor Type: Pressure
Utilized IC / Part: DPS422, XMC1100
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s)
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S2GOPRESSUREDPS422TOBO1 S2GOPRESSUREDPS422TOBO1 Infineon Technologies Description: EVAL DPS422 BAROMETRIC
Packaging: Bulk
Function: Barometer
Type: Sensor
Contents: Board(s)
Utilized IC / Part: DPS422
Platform: Shield2Go
Produkt ist nicht verfügbar
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TLF50211ELXUMA2 TLF50211ELXUMA2 Infineon Technologies Infineon-TLF50211EL-DS-v01_10-EN.pdf?fileId=5546d46258fc0bc1015969d2af9641e9 Description: IC REG BUCK 5V 500MA SSOP-14-3
Packaging: Cut Tape (CT)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 500mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Frequency - Switching: 2.25MHz
Voltage - Input (Max): 45V
Topology: Buck
Supplier Device Package: PG-SSOP-14-3
Synchronous Rectifier: No
Voltage - Input (Min): 4.75V
Voltage - Output (Min/Fixed): 5V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1930 Stücke:
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5+3.85 EUR
10+2.87 EUR
25+2.62 EUR
100+2.35 EUR
250+2.22 EUR
500+2.14 EUR
1000+2.08 EUR
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AUIR3241SDEMOBOARDTOBO1 AUIR3241SDEMOBOARDTOBO1 Infineon Technologies Infineon-AUIR3241S%20DEMOBOARD-DS-v01_00-EN.pdf?fileId=5546d46265f064ff016667e5d4133c3f Description: EVAL BOARD FOR AUIR3241S
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: AUIR3241S
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
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28576411 B Infineon Technologies Description: IC FLASH 24FBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Technology: FLASH - NOR
Memory Format: FLASH
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FM24W256-EGTR Infineon Technologies FM24W256_RevL_12-17-18.pdf Description: IC FRAM 256KBIT 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Memory Size: 256Kbit
Memory Format: FRAM
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FM24W256-EG Infineon Technologies FM24W256_RevL_12-17-18.pdf Description: IC FRAM 256KBIT 8SOIC
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Memory Size: 256Kbit
Memory Format: FRAM
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MB88386PMC-GS-TLE1 Infineon Technologies Description: IC AUTO MCU 80LQFP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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IKB20N60TATMA1 IKB20N60TATMA1 Infineon Technologies IKB20N60T+Rev2_4G.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b42883273e12 Description: IGBT TRENCH FS 600V 40A TO263-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 41 ns
Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 20A
Supplier Device Package: PG-TO263-3-2
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 18ns/199ns
Switching Energy: 770µJ
Test Condition: 400V, 20A, 12Ohm, 15V
Gate Charge: 120 nC
Part Status: Active
Current - Collector (Ic) (Max): 40 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 60 A
Power - Max: 166 W
auf Bestellung 4298 Stücke:
Lieferzeit 10-14 Tag (e)
5+4.36 EUR
10+2.83 EUR
100+1.95 EUR
500+1.61 EUR
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CY2308SXC-3T Infineon-CY2308_3.3_V_Zero_Delay_Buffer-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcea4d2ec4&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY2308SXC-3T
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-SOIC
PLL: Yes
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 480 Stücke:
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Anzahl Preis
5+3.98 EUR
10+3.39 EUR
25+3.18 EUR
100+2.89 EUR
250+2.72 EUR
Mindestbestellmenge: 5
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CY62256NLL-70ZRXIT Infineon-CY62256N_256-Kbit_(32_K_8)_Static_RAM-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebee07732ce
CY62256NLL-70ZRXIT
Hersteller: Infineon Technologies
Description: IC SRAM 256KBIT PAR 28TSOP I
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 28-TSOP I
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1079 Stücke:
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Anzahl Preis
14+1.28 EUR
16+1.1 EUR
25+1.03 EUR
50+0.99 EUR
100+0.94 EUR
250+0.88 EUR
500+0.84 EUR
Mindestbestellmenge: 14
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CY3280-MBR download
CY3280-MBR
Hersteller: Infineon Technologies
Description: BOARD EVAL CAPSENSE EXPRESS
Produkt ist nicht verfügbar
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CY4502 Infineon-EZ-PD_CCG2_Datasheet_USB_Type-C_Port_Controller-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd9536480b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY4502
Hersteller: Infineon Technologies
Description: KIT DEV FOR INTERFACE CNTRLR
Packaging: Box
Function: USB Type-C®
Type: Interface
Utilized IC / Part: CCG2
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 74 Stücke:
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Anzahl Preis
1+43.35 EUR
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CY5676 Infineon-Quick_Start_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ef9a09b0f90&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY5676
Hersteller: Infineon Technologies
Description: DEV KIT PROC BLE
Packaging: Bulk
For Use With/Related Products: PRoC™ BLE
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Obsolete
auf Bestellung 7 Stücke:
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Anzahl Preis
3+6.71 EUR
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CY8CKIT-046 CY8CKIT-046_Web.pdf
CY8CKIT-046
Hersteller: Infineon Technologies
Description: PSOC 4 L-SERIES PIONEER KIT
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: PSoC 4200L
Platform: PSoC 4 L-Series Pioneer Kit
Part Status: Active
Packaging: Bulk
auf Bestellung 1036 Stücke:
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Anzahl Preis
2+16.32 EUR
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CG7618AA Infineon-CY7C1418KV18_CY7C1420KV18_36-Mbit_DDR_II_SRAM_Two-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1b25e368a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+27.19 EUR
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CY7C1011G30-12ZSXE Infineon-CY7C1011G_AUTOMOTIVE_2_MBIT_(128K_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7727c5896
CY7C1011G30-12ZSXE
Hersteller: Infineon Technologies
Description: IC SRAM 2MBIT PARALLEL 44TSOP II
Packaging: Tray
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 128K x 16
DigiKey Programmable: Not Verified
auf Bestellung 63 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.79 EUR
10+4.08 EUR
25+3.82 EUR
40+3.7 EUR
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CY7C1061GE30-10ZXI Infineon-CY7C1061G_CY7C1061GE_16_MBIT_(1M_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec387e33888&utm_source=cypress&utm_medium=referral&utm_campaign=202110_
CY7C1061GE30-10ZXI
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Part Status: Active
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1149 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.16 EUR
10+15.5 EUR
25+14.58 EUR
40+14.13 EUR
96+13.35 EUR
288+12.47 EUR
480+12.09 EUR
960+11.6 EUR
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CY7C1380KV33-167BZI download
CY7C1380KV33-167BZI
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 167 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Access Time: 3.4 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
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Anzahl Preis
1+18.23 EUR
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CY7C1413KV18-250BZXI Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign
CY7C1413KV18-250BZXI
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 2M x 18
DigiKey Programmable: Not Verified
auf Bestellung 86 Stücke:
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Anzahl Preis
1+25.45 EUR
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CY7C1415KV18-250BZI Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign
CY7C1415KV18-250BZI
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 625 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.93 EUR
10+17.92 EUR
25+16.88 EUR
40+16.39 EUR
80+15.7 EUR
230+14.75 EUR
440+14.21 EUR
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CY7C1415KV18-250BZXC Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign
CY7C1415KV18-250BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 1649 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.25 EUR
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CY7C2270KV18-550BZXC Infineon-CY7C2268KV18_CY7C2270KV18_36-Mbit_DDR_II+_SRAM_Two-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)_with_ODT-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec197363665
CY7C2270KV18-550BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II+
Clock Frequency: 550 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 643 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+56.6 EUR
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CY8C20234-12LKXI Infineon-CY8C20134_CY8C20234_CY8C20334_CY8C20434_CY8C20534_CY8C20634_PSoC_Programmable_System-on-Chip-DataSheet-v24_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcc61b2e7f&utm_source=cypress&utm_medium=referral&utm_campaign=202110_
CY8C20234-12LKXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 2448 Stücke:
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Anzahl Preis
16+1.16 EUR
Mindestbestellmenge: 16
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CY8C20424-12LQXI Infineon-CY8C20224_CY8C20324_CY8C20424_CY8C20524_CAPSENSE_PSOC_PROGRAMMABLE_SYSTEM_ON_CHIP-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecae11743f6
CY8C20424-12LQXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1262 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+1.16 EUR
18+1 EUR
25+0.93 EUR
100+0.83 EUR
490+0.73 EUR
980+0.7 EUR
Mindestbestellmenge: 16
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S25FL164K0XBHI030 S25FL116K_132K_164K__RevH_5-19-17.pdf
S25FL164K0XBHI030
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 24BGA
auf Bestellung 35 Stücke:
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Anzahl Preis
35+0.51 EUR
Mindestbestellmenge: 35
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S29GL256S10DHSS50 Infineon-S29GL01GS_S29GL512S_S29GL256S_S29GL128S_128_Mb_256_Mb_512_Mb_1_Gb_GL-S_MIRRORBIT_TM_Flash_Parallel_3-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5
S29GL256S10DHSS50
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
auf Bestellung 841 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.34 EUR
10+2.19 EUR
25+2.13 EUR
50+2.08 EUR
100+2.03 EUR
260+1.97 EUR
520+1.92 EUR
Mindestbestellmenge: 8
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CY2308SXI-3 CY2308.pdf
CY2308SXI-3
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-SOIC
PLL: Yes
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 93 Stücke:
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Anzahl Preis
2+10.3 EUR
Mindestbestellmenge: 2
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CY8C20546A-24PVXI download
CY8C20546A-24PVXI
Hersteller: Infineon Technologies
Description: IC MCU 16K FLASH 2K SRAM 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I²C, SPI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 5.5V
Controller Series: CY8C20xx6A
Program Memory Type: FLASH (16kB)
Applications: Capacitive Sensing
Core Processor: M8C
Supplier Device Package: 48-SSOP
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1368 Stücke:
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Anzahl Preis
10+1.87 EUR
Mindestbestellmenge: 10
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FM25V20A-PG FM25V20A_PDIP_RevE_2-9-24.pdf
FM25V20A-PG
Hersteller: Infineon Technologies
Description: IC FRAM 2MBIT SPI 40MHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-PDIP
Part Status: Active
Memory Interface: SPI
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 113 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.51 EUR
10+5.14 EUR
25+4.99 EUR
53+4.87 EUR
106+4.75 EUR
Mindestbestellmenge: 4
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BGA855N6E6327XTSA1 Infineon-BGA855N6-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32ebeb1141d
BGA855N6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.164GHz ~ 1.3GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.1V ~ 3.3V
Gain: 18.9dB
Current - Supply: 5.4mA
Noise Figure: 0.6dB
P1dB: -8dBm
Test Frequency: 1.214GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12000+0.4 EUR
Mindestbestellmenge: 12000
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REFXDPL8221U50WTOBO1 Infineon-XDPL8221-DS-v01_01-EN.pdf?fileId=5546d46266f85d6301670d68764e3679
REFXDPL8221U50WTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR XDPL8221
Packaging: Bulk
Features: Dimmable
Voltage - Output: 16V ~ 48V
Voltage - Input: 90 ~ 305 VAC, 90V ~ 430V
Current - Output / Channel: 1.5A
Utilized IC / Part: XDPL8221
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Active
Contents: Board(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+231.77 EUR
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REFXDPL8221U100WTOBO1 Infineon-EngineeringReport_ReferenceBoard_XDPdigitalpower_REF-XDPL8221-U100W-AN-v01_00-EN.pdf?fileId=5546d462689a790c0168dbf6d0a652e1
REFXDPL8221U100WTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR XDPL8221
Packaging: Bulk
Features: Dimmable
Voltage - Output: 16V ~ 48V
Voltage - Input: 90 ~ 305 VAC, 90V ~ 305V
Current - Output / Channel: 2.5A
Utilized IC / Part: XDPL8221
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Active
Contents: Board(s)
auf Bestellung 1 Stücke:
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Anzahl Preis
1+211.8 EUR
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TLE8457CSJXUMA1 Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be
TLE8457CSJXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER 1/1 PGDSO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-DSO-8
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2409 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.11 EUR
12+1.54 EUR
25+1.4 EUR
100+1.24 EUR
250+1.16 EUR
500+1.12 EUR
1000+1.08 EUR
Mindestbestellmenge: 9
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TLE8457DLEXUMA1 Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be
TLE8457DLEXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER 1/1 PGTDSON81
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-TDSON-8-1
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 20044 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.27 EUR
11+1.66 EUR
25+1.5 EUR
100+1.34 EUR
250+1.26 EUR
500+1.21 EUR
1000+1.17 EUR
2500+1.12 EUR
Mindestbestellmenge: 8
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TLE8457DSJXUMA1 Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be
TLE8457DSJXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER 1/1 DSO-8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-DSO-8
Part Status: Active
auf Bestellung 9366 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.85 EUR
10+2.56 EUR
25+2.41 EUR
100+2.05 EUR
250+1.93 EUR
500+1.69 EUR
1000+1.4 EUR
Mindestbestellmenge: 7
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BGA855N6E6327XTSA1 Infineon-BGA855N6-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32ebeb1141d
BGA855N6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.164GHz ~ 1.3GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.1V ~ 3.3V
Gain: 18.9dB
Current - Supply: 5.4mA
Noise Figure: 0.6dB
P1dB: -8dBm
Test Frequency: 1.214GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
auf Bestellung 14950 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
19+0.95 EUR
27+0.67 EUR
30+0.6 EUR
100+0.52 EUR
250+0.49 EUR
500+0.46 EUR
1000+0.45 EUR
2500+0.43 EUR
5000+0.42 EUR
Mindestbestellmenge: 19
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TLE8104EXUMA2 Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25
TLE8104EXUMA2
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 DSO-20
Produkt ist nicht verfügbar
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TLE8104EXUMA2 Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25
TLE8104EXUMA2
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 DSO-20
Produkt ist nicht verfügbar
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BGS14MPA9E6327XTSA1 Infineon-BGS14MPA9-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32eb6c5141a
BGS14MPA9E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH SP4T 6GHZ ATSLP9-3
Packaging: Cut Tape (CT)
Features: DC Blocked
Package / Case: 9-UFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP4T
RF Type: 2G/3G/4G/5G, Cellular, LTE, W-CDMA
Operating Temperature: 125°C (TJ)
Voltage - Supply: 1.65V ~ 1.95V
Insertion Loss: 1dB
Frequency Range: 50MHz ~ 6GHz
Test Frequency: 5.925GHz
Isolation: 23dB
Supplier Device Package: PG-ATSLP-9-3
IIP3: 77dBm
Part Status: Not For New Designs
auf Bestellung 4005 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.65 EUR
16+1.15 EUR
25+1.02 EUR
100+0.88 EUR
250+0.81 EUR
500+0.77 EUR
1000+0.74 EUR
Mindestbestellmenge: 11
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BSM150GB170DLCE3256HDLA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 300A 1250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 3.2V @ 15V, 150A
NTC Thermistor: No
Part Status: Obsolete
Current - Collector (Ic) (Max): 300 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1250 W
Current - Collector Cutoff (Max): 300 µA
Input Capacitance (Cies) @ Vce: 10 nF @ 25 V
Produkt ist nicht verfügbar
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BSC010N04LS6ATMA1 Infineon-BSC010N04LS6-DS-v02_00-EN.pdf?fileId=5546d462689a790c0168bd076e184818
BSC010N04LS6ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 40A/100A TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 100A (Tc)
Rds On (Max) @ Id, Vgs: 1mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 250µA
Supplier Device Package: PG-TDSON-8-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 4600 pF @ 20 V
auf Bestellung 8019 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.45 EUR
10+2.31 EUR
100+1.7 EUR
500+1.37 EUR
1000+1.36 EUR
Mindestbestellmenge: 6
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BSC022N04LS6ATMA1 Infineon-BSC022N04LS6-DS-v02_00-EN.pdf?fileId=5546d462689a790c0168bd1094dc481b
BSC022N04LS6ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 27A/100A TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 27A (Ta), 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 79W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 250µA
Supplier Device Package: PG-TDSON-8-1
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1900 pF @ 20 V
auf Bestellung 5472 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.39 EUR
10+1.82 EUR
100+1.28 EUR
500+1.01 EUR
1000+0.95 EUR
Mindestbestellmenge: 8
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AUXDILZ24NS
Hersteller: Infineon Technologies
Description: MOSFET N-CH D2PAK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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IPD650P06NMSAUMA1 Power_Sensing_Selection_Guide_2021.pdf
IPD650P06NMSAUMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V 22A TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 22A, 10V
Power Dissipation (Max): 83W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1.04mA
Supplier Device Package: PG-TO252-3-313
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 39 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1600 pF @ 30 V
Produkt ist nicht verfügbar
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IPD950P06NMSAUMA1
IPD950P06NMSAUMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Supplier Device Package: PG-TO252-3-313
Part Status: Active
Drain to Source Voltage (Vdss): 60 V
Produkt ist nicht verfügbar
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IPD06P003NSAUMA1
IPD06P003NSAUMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V 22A TO252-3
Produkt ist nicht verfügbar
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IDWD15G120C5XKSA1 Infineon-IDWD15G120C5-DS-v02_00-EN.pdf?fileId=5546d462689a790c016933d54d2b5489
IDWD15G120C5XKSA1
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 1.2KV 49A TO247-2
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1050pF @ 1V, 1MHz
Current - Average Rectified (Io): 49A
Supplier Device Package: PG-TO247-2
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.65 V @ 15 A
Current - Reverse Leakage @ Vr: 124 µA @ 1200 V
auf Bestellung 230 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.88 EUR
10+16.18 EUR
100+13.49 EUR
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IKP28N65ES5XKSA1 Infineon-IKP28N65ES5-DS-v02_01-EN.pdf?fileId=5546d462696dbf1201697b6e31284429
IKP28N65ES5XKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 38A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 73 ns
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 28A
Supplier Device Package: PG-TO220-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 27ns/184ns
Switching Energy: 530µJ (on), 400µJ (off)
Test Condition: 400V, 28A, 34Ohm, 15V
Gate Charge: 50 nC
Part Status: Active
Current - Collector (Ic) (Max): 38 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 130 W
Produkt ist nicht verfügbar
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IM393L6FXKLA1 Infineon-IM393-L6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a946a8b78d2
IM393L6FXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 15A MDIP22
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6FXKLA1 Infineon-IM393-M6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a947c0278da
IM393M6FXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 10A 26PWRSIP
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393S6FXKLA1 Infineon-IM393-S6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a9d808378dd
IM393S6FXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 6A MDIP22
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 6 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393L6EXKLA1 Infineon-IM393-L6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a8b350f78c7
IM393L6EXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 15A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393L6E3XKLA1 Infineon-IM393-L6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a8b350f78c7
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 15A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6EXKLA1 Infineon-IM393-M6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a94732278d5
IM393M6EXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 10A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6E2XKLA1 Infineon-IM393-M6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a94732278d5
IM393M6E2XKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 10A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6E3XKLA1 Infineon-IM393-M6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a94732278d5
IM393M6E3XKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 10A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393S6E2XKLA1 Infineon-IM393-S6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a9d912478e4
IM393S6E2XKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 6A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 6 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393X6EXKLA1 Infineon-IM393-X6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a9d9a3578e9
IM393X6EXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 20A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 20 A
Voltage: 600 V
Produkt ist nicht verfügbar
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EVALM1IM231TOBO1 Infineon-IM231-L6S1B_T2B-DS-v02_00-EN.pdf?fileId=5546d462689a790c0169067334d10ef3
Hersteller: Infineon Technologies
Description: EVAL IM231 CIPOS MICRO IPM
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
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EVALSHNBV01DPS422TOBO1 Infineon-Quick%20Setup%20Guide%20for%20Barometric%20Pressure%20Sensor%20Hub%20Nano-GS-v01_01-EN.pdf?fileId=5546d46269bda8df0169bf3dccc11a5c
EVALSHNBV01DPS422TOBO1
Hersteller: Infineon Technologies
Description: EVAL DPS422 BAROMETRIC HUB
Packaging: Bulk
Interface: RF
Sensor Type: Pressure
Utilized IC / Part: DPS422, XMC1100
Supplied Contents: Board(s)
Embedded: Yes, MCU, 32-Bit
Contents: Board(s)
Produkt ist nicht verfügbar
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S2GOPRESSUREDPS422TOBO1
S2GOPRESSUREDPS422TOBO1
Hersteller: Infineon Technologies
Description: EVAL DPS422 BAROMETRIC
Packaging: Bulk
Function: Barometer
Type: Sensor
Contents: Board(s)
Utilized IC / Part: DPS422
Platform: Shield2Go
Produkt ist nicht verfügbar
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TLF50211ELXUMA2 Infineon-TLF50211EL-DS-v01_10-EN.pdf?fileId=5546d46258fc0bc1015969d2af9641e9
TLF50211ELXUMA2
Hersteller: Infineon Technologies
Description: IC REG BUCK 5V 500MA SSOP-14-3
Packaging: Cut Tape (CT)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Output Type: Fixed
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 500mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Frequency - Switching: 2.25MHz
Voltage - Input (Max): 45V
Topology: Buck
Supplier Device Package: PG-SSOP-14-3
Synchronous Rectifier: No
Voltage - Input (Min): 4.75V
Voltage - Output (Min/Fixed): 5V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1930 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.85 EUR
10+2.87 EUR
25+2.62 EUR
100+2.35 EUR
250+2.22 EUR
500+2.14 EUR
1000+2.08 EUR
Mindestbestellmenge: 5
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AUIR3241SDEMOBOARDTOBO1 Infineon-AUIR3241S%20DEMOBOARD-DS-v01_00-EN.pdf?fileId=5546d46265f064ff016667e5d4133c3f
AUIR3241SDEMOBOARDTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR AUIR3241S
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: AUIR3241S
Supplied Contents: Board(s)
Part Status: Obsolete
Contents: Board(s)
Produkt ist nicht verfügbar
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28576411 B
Hersteller: Infineon Technologies
Description: IC FLASH 24FBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Technology: FLASH - NOR
Memory Format: FLASH
Produkt ist nicht verfügbar
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FM24W256-EGTR FM24W256_RevL_12-17-18.pdf
Hersteller: Infineon Technologies
Description: IC FRAM 256KBIT 8SOIC
Packaging: Tape & Reel (TR)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Memory Size: 256Kbit
Memory Format: FRAM
Produkt ist nicht verfügbar
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FM24W256-EG FM24W256_RevL_12-17-18.pdf
Hersteller: Infineon Technologies
Description: IC FRAM 256KBIT 8SOIC
Packaging: Tray
Part Status: Obsolete
DigiKey Programmable: Not Verified
Memory Size: 256Kbit
Memory Format: FRAM
Produkt ist nicht verfügbar
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MB88386PMC-GS-TLE1
Hersteller: Infineon Technologies
Description: IC AUTO MCU 80LQFP
Packaging: Tray
Part Status: Obsolete
Produkt ist nicht verfügbar
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IKB20N60TATMA1 IKB20N60T+Rev2_4G.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b42883273e12
IKB20N60TATMA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 600V 40A TO263-3
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 41 ns
Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 20A
Supplier Device Package: PG-TO263-3-2
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 18ns/199ns
Switching Energy: 770µJ
Test Condition: 400V, 20A, 12Ohm, 15V
Gate Charge: 120 nC
Part Status: Active
Current - Collector (Ic) (Max): 40 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 60 A
Power - Max: 166 W
auf Bestellung 4298 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.36 EUR
10+2.83 EUR
100+1.95 EUR
500+1.61 EUR
Mindestbestellmenge: 5
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