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TLD23313EPXUMA1 TLD23313EPXUMA1 Infineon Technologies Infineon-TLD2331-3EP-DataSheet-v01_00-EN.pdf?fileId=5546d4626eab8fbf016eb161ce1b0461 Description: IC LED DRVR LIN PWM 60MA 14TSDSO
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 60mA
Internal Switch(s): Yes
Supplier Device Package: PG-TSDSO-14
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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14+1.3 EUR
25+1.17 EUR
100+1.04 EUR
250+0.97 EUR
500+0.93 EUR
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BTS70021EPPXUMA1 BTS70021EPPXUMA1 Infineon Technologies BTS7002-1EPP_v1.03_4-29-19.pdf Description: IC PWR SWTCH N-CHAN 1:1 TSDSO-14
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.154", 3.90mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 2.6mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 18V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 21A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TSDSO-14-22
Fault Protection: Over Current, Over Voltage, Short Circuit, UVLO
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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5+4.29 EUR
10+3.22 EUR
25+2.94 EUR
100+2.64 EUR
250+2.5 EUR
500+2.41 EUR
1000+2.34 EUR
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AUIR3240STR AUIR3240STR Infineon Technologies Infineon-AUIR3240S-DS-v01_10-EN.pdf?fileId=5546d462533600a4015355a835801345 Description: IC GATE DRVR HIGH-SIDE 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4V ~ 36V
Input Type: Non-Inverting
Supplier Device Package: PG-DSO-8-903
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.9V, 2.5V
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
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SLB9645TT12FW13333XUMA2 SLB9645TT12FW13333XUMA2 Infineon Technologies Infineon-Data-sheet-SLB9645_1.2_Rev1.2-DS-v01_02-EN.pdf?fileId=5546d462689a790c016929d1c4074fdf Description: TPM
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3V ~ 3.6V
Program Memory Type: NVM (6kB)
Applications: Trusted Platform Module (TPM)
Core Processor: 16-Bit
Supplier Device Package: PG-TSSOP-28-2
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
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10+4.77 EUR
25+4.39 EUR
100+3.97 EUR
250+3.77 EUR
500+3.65 EUR
1000+3.55 EUR
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SLB9665TT20FW563XUMA3 SLB9665TT20FW563XUMA3 Infineon Technologies Infineon-data-sheet-SLB9665_2.0_Rev1.2-DS-v01_02-EN.pdf?fileId=5546d462689a790c016929d1d3054feb Description: TPM
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: LPC
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Program Memory Type: NVM (7.04kB)
Applications: Trusted Platform Module (TPM)
Core Processor: 16-Bit
Supplier Device Package: PG-TSSOP-28-2
Part Status: Active
Number of I/O: 1
DigiKey Programmable: Not Verified
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10+4.74 EUR
25+4.36 EUR
100+3.94 EUR
250+3.74 EUR
500+3.62 EUR
1000+3.52 EUR
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AIKW75N60CTE8188XKSA1 AIKW75N60CTE8188XKSA1 Infineon Technologies Infineon-AIKW75N60CT-DS-v02_01-EN.pdf?fileId=5546d4625c167129015c5382c93a7ca3 Description: IGBT TRENCH FS 600V 80A TO-247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 121 ns
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Supplier Device Package: PG-TO247-3-41
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 33ns/330ns
Switching Energy: 2mJ (on), 2.5mJ (off)
Test Condition: 400V, 75A, 5Ohm, 15V
Gate Charge: 470 nC
Part Status: Active
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 225 A
Power - Max: 428 W
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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HUE20XUMA1 Infineon Technologies Description: IC POWER MANAGEMENT SMD
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IPP90R1K0C3XK IPP90R1K0C3XK Infineon Technologies IPP90R1K0C3_Rev1.0_7-29-08.pdf Description: MOSFET N-CH 900V 5.7A TO220-3
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NBC9604 Infineon Technologies Description: IC PAD 15NS 40QFN
Packaging: Tray
Produkt ist nicht verfügbar
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ICE2PCS02GE8191XUMA1 ICE2PCS02GE8191XUMA1 Infineon Technologies Description: IC PFC CTRLR CCM 65KHZ 8DSO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 11V ~ 25V
Frequency - Switching: 65kHz
Mode: Continuous Conduction (CCM)
Supplier Device Package: PG-DSO-8-41
Current - Startup: 450 µA
Produkt ist nicht verfügbar
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D170S25BS1XPSA1 Infineon Technologies Description: DIODE GEN PURP BG-DSW271-1
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D56S45CS02PRXPSA1 D56S45CS02PRXPSA1 Infineon Technologies Description: DIODE GEN PURP BG-DSW272-1
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D690S26TS01XPSA1 D690S26TS01XPSA1 Infineon Technologies Description: DIODE GP 2.6KV 690A D5726K-1
Packaging: Bulk
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 9 µs
Technology: Standard
Current - Average Rectified (Io): 690A
Supplier Device Package: BG-D5726K-1
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 2600 V
Voltage - Forward (Vf) (Max) @ If: 2.7 V @ 3000 A
Current - Reverse Leakage @ Vr: 25 mA @ 2600 V
Produkt ist nicht verfügbar
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CY8C20424-12LQXIT CY8C20424-12LQXIT Infineon Technologies Infineon-CY8C20224_CY8C20324_CY8C20424_CY8C20524_CAPSENSE_PSOC_PROGRAMMABLE_SYSTEM_ON_CHIP-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecae11743f6 Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 87500 Stücke:
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2500+0.66 EUR
5000+0.63 EUR
7500+0.62 EUR
12500+0.61 EUR
17500+0.6 EUR
25000+0.59 EUR
Mindestbestellmenge: 2500
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CYW20707UA1KFFB4GT CYW20707UA1KFFB4GT Infineon Technologies Infineon-CYW20707_Bluetooth_SoC_for_Embedded_Wireless_Devices_Datasheet-AdditionalTechnicalInformation-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee1ecf86806&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_ Description: IC RF TXRX+MCU BLE 49FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 49-VFBGA, FCBGA
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Power - Output: 9dBm
Protocol: Bluetooth v4.2
Current - Receiving: 26.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 60mA
Supplier Device Package: 49-FCBGA (4.5x4)
GPIO: 8
RF Family/Standard: Bluetooth
Serial Interfaces: I2S, SPI, UART
DigiKey Programmable: Not Verified
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CY2308SXC-3T CY2308SXC-3T Infineon Technologies Infineon-CY2308_3.3_V_Zero_Delay_Buffer-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcea4d2ec4&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FANOUT BUFFER 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-SOIC
PLL: Yes
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 480 Stücke:
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10+3.39 EUR
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100+2.89 EUR
250+2.72 EUR
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CY62256NLL-70ZRXIT CY62256NLL-70ZRXIT Infineon Technologies Infineon-CY62256N_256-Kbit_(32_K_8)_Static_RAM-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebee07732ce Description: IC SRAM 256KBIT PAR 28TSOP I
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 28-TSOP I
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
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14+1.28 EUR
16+1.1 EUR
25+1.03 EUR
50+0.99 EUR
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500+0.84 EUR
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CY3280-MBR CY3280-MBR Infineon Technologies download Description: BOARD EVAL CAPSENSE EXPRESS
Produkt ist nicht verfügbar
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CY4502 CY4502 Infineon Technologies Infineon-EZ-PD_CCG2_Datasheet_USB_Type-C_Port_Controller-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd9536480b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: KIT DEV FOR INTERFACE CNTRLR
Packaging: Box
Function: USB Type-C®
Type: Interface
Utilized IC / Part: CCG2
Supplied Contents: Board(s)
Part Status: Active
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CY5676 CY5676 Infineon Technologies Infineon-Quick_Start_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ef9a09b0f90&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: DEV KIT PROC BLE
Packaging: Bulk
For Use With/Related Products: PRoC™ BLE
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Obsolete
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3+6.71 EUR
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CY8CKIT-046 CY8CKIT-046 Infineon Technologies CY8CKIT-046_Web.pdf Description: PSOC 4 L-SERIES PIONEER KIT
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: PSoC 4200L
Platform: PSoC 4 L-Series Pioneer Kit
Part Status: Active
Packaging: Bulk
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2+16.44 EUR
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CG7618AA Infineon Technologies Infineon-CY7C1418KV18_CY7C1420KV18_36-Mbit_DDR_II_SRAM_Two-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1b25e368a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
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1+27.19 EUR
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CY7C1011G30-12ZSXE CY7C1011G30-12ZSXE Infineon Technologies Infineon-CY7C1011G_AUTOMOTIVE_2_MBIT_(128K_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7727c5896 Description: IC SRAM 2MBIT PARALLEL 44TSOP II
Packaging: Tray
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 128K x 16
DigiKey Programmable: Not Verified
auf Bestellung 63 Stücke:
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10+4.08 EUR
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40+3.7 EUR
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CY7C1061GE30-10ZXI CY7C1061GE30-10ZXI Infineon Technologies Infineon-CY7C1061G_CY7C1061GE_16_MBIT_(1M_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec387e33888&utm_source=cypress&utm_medium=referral&utm_campaign=202110_ Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Part Status: Active
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1097 Stücke:
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10+13.25 EUR
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96+12.25 EUR
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288+11.77 EUR
576+11.48 EUR
1056+11.22 EUR
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CY7C1380KV33-167BZI CY7C1380KV33-167BZI Infineon Technologies download Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 167 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Access Time: 3.4 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
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1+18.23 EUR
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CY7C1413KV18-250BZXI CY7C1413KV18-250BZXI Infineon Technologies Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 2M x 18
DigiKey Programmable: Not Verified
auf Bestellung 86 Stücke:
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1+25.45 EUR
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CY7C1415KV18-250BZI CY7C1415KV18-250BZI Infineon Technologies Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 625 Stücke:
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1+20.93 EUR
10+17.92 EUR
25+16.88 EUR
40+16.39 EUR
80+15.7 EUR
230+14.75 EUR
440+14.21 EUR
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CY7C1415KV18-250BZXC CY7C1415KV18-250BZXC Infineon Technologies Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 1649 Stücke:
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CY7C2270KV18-550BZXC CY7C2270KV18-550BZXC Infineon Technologies Infineon-CY7C2268KV18_CY7C2270KV18_36-Mbit_DDR_II+_SRAM_Two-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)_with_ODT-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec197363665 Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II+
Clock Frequency: 550 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
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CY8C20234-12LKXI CY8C20234-12LKXI Infineon Technologies Infineon-CY8C20134_CY8C20234_CY8C20334_CY8C20434_CY8C20534_CY8C20634_PSoC_Programmable_System-on-Chip-DataSheet-v24_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcc61b2e7f&utm_source=cypress&utm_medium=referral&utm_campaign=202110_ Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 13
DigiKey Programmable: Not Verified
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CY8C20424-12LQXI CY8C20424-12LQXI Infineon Technologies Infineon-CY8C20224_CY8C20324_CY8C20424_CY8C20524_CAPSENSE_PSOC_PROGRAMMABLE_SYSTEM_ON_CHIP-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecae11743f6 Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
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S25FL164K0XBHI030 S25FL164K0XBHI030 Infineon Technologies S25FL116K_132K_164K__RevH_5-19-17.pdf Description: IC FLASH 64MBIT SPI/QUAD 24BGA
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S29GL256S10DHSS50 S29GL256S10DHSS50 Infineon Technologies Infineon-S29GL01GS_S29GL512S_S29GL256S_S29GL128S_128_Mb_256_Mb_512_Mb_1_Gb_GL-S_MIRRORBIT_TM_Flash_Parallel_3-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5 Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
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CY2308SXI-3 CY2308SXI-3 Infineon Technologies CY2308.pdf Description: IC FANOUT BUFFER 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-SOIC
PLL: Yes
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
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CY8C20546A-24PVXI CY8C20546A-24PVXI Infineon Technologies download Description: IC MCU 16K FLASH 2K SRAM 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I²C, SPI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 5.5V
Controller Series: CY8C20xx6A
Program Memory Type: FLASH (16kB)
Applications: Capacitive Sensing
Core Processor: M8C
Supplier Device Package: 48-SSOP
Number of I/O: 36
DigiKey Programmable: Not Verified
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FM25V20A-PG FM25V20A-PG Infineon Technologies FM25V20A_PDIP_RevE_2-9-24.pdf Description: IC FRAM 2MBIT SPI 40MHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-PDIP
Part Status: Active
Memory Interface: SPI
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
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BGA855N6E6327XTSA1 BGA855N6E6327XTSA1 Infineon Technologies Infineon-BGA855N6-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32ebeb1141d Description: IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.164GHz ~ 1.3GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.1V ~ 3.3V
Gain: 18.9dB
Current - Supply: 5.4mA
Noise Figure: 0.6dB
P1dB: -8dBm
Test Frequency: 1.214GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
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REFXDPL8221U50WTOBO1 REFXDPL8221U50WTOBO1 Infineon Technologies Infineon-XDPL8221-DS-v01_01-EN.pdf?fileId=5546d46266f85d6301670d68764e3679 Description: EVAL BOARD FOR XDPL8221
Packaging: Bulk
Features: Dimmable
Voltage - Output: 16V ~ 48V
Voltage - Input: 90 ~ 305 VAC, 90V ~ 430V
Current - Output / Channel: 1.5A
Utilized IC / Part: XDPL8221
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Active
Contents: Board(s)
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REFXDPL8221U100WTOBO1 REFXDPL8221U100WTOBO1 Infineon Technologies Infineon-EngineeringReport_ReferenceBoard_XDPdigitalpower_REF-XDPL8221-U100W-AN-v01_00-EN.pdf?fileId=5546d462689a790c0168dbf6d0a652e1 Description: EVAL BOARD FOR XDPL8221
Packaging: Bulk
Features: Dimmable
Voltage - Output: 16V ~ 48V
Voltage - Input: 90 ~ 305 VAC, 90V ~ 305V
Current - Output / Channel: 2.5A
Utilized IC / Part: XDPL8221
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Active
Contents: Board(s)
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TLE8457CSJXUMA1 TLE8457CSJXUMA1 Infineon Technologies Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be Description: IC TRANSCEIVER 1/1 PGDSO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-DSO-8
Grade: Automotive
Qualification: AEC-Q100
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TLE8457DLEXUMA1 TLE8457DLEXUMA1 Infineon Technologies Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be Description: IC TRANSCEIVER 1/1 PGTDSON81
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-TDSON-8-1
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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TLE8457DSJXUMA1 TLE8457DSJXUMA1 Infineon Technologies Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be Description: IC TRANSCEIVER 1/1 DSO-8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-DSO-8
Part Status: Active
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BGA855N6E6327XTSA1 BGA855N6E6327XTSA1 Infineon Technologies Infineon-BGA855N6-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32ebeb1141d Description: IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.164GHz ~ 1.3GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.1V ~ 3.3V
Gain: 18.9dB
Current - Supply: 5.4mA
Noise Figure: 0.6dB
P1dB: -8dBm
Test Frequency: 1.214GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
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TLE8104EXUMA2 TLE8104EXUMA2 Infineon Technologies Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25 Description: IC PWR SWITCH N-CHAN 1:1 DSO-20
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TLE8104EXUMA2 TLE8104EXUMA2 Infineon Technologies Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25 Description: IC PWR SWITCH N-CHAN 1:1 DSO-20
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BGS14MPA9E6327XTSA1 BGS14MPA9E6327XTSA1 Infineon Technologies Infineon-BGS14MPA9-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32eb6c5141a Description: IC RF SWITCH SP4T 6GHZ ATSLP9-3
Packaging: Cut Tape (CT)
Features: DC Blocked
Package / Case: 9-UFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP4T
RF Type: 2G/3G/4G/5G, Cellular, LTE, W-CDMA
Operating Temperature: 125°C (TJ)
Voltage - Supply: 1.65V ~ 1.95V
Insertion Loss: 1dB
Frequency Range: 50MHz ~ 6GHz
Test Frequency: 5.925GHz
Isolation: 23dB
Supplier Device Package: PG-ATSLP-9-3
IIP3: 77dBm
Part Status: Not For New Designs
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BSM150GB170DLCE3256HDLA1 Infineon Technologies Description: IGBT MODULE 1700V 300A 1250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 3.2V @ 15V, 150A
NTC Thermistor: No
Part Status: Obsolete
Current - Collector (Ic) (Max): 300 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1250 W
Current - Collector Cutoff (Max): 300 µA
Input Capacitance (Cies) @ Vce: 10 nF @ 25 V
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BSC010N04LS6ATMA1 BSC010N04LS6ATMA1 Infineon Technologies Infineon-BSC010N04LS6-DS-v02_00-EN.pdf?fileId=5546d462689a790c0168bd076e184818 Description: MOSFET N-CH 40V 40A/100A TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 100A (Tc)
Rds On (Max) @ Id, Vgs: 1mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 250µA
Supplier Device Package: PG-TDSON-8-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 4600 pF @ 20 V
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BSC022N04LS6ATMA1 BSC022N04LS6ATMA1 Infineon Technologies Infineon-BSC022N04LS6-DS-v02_00-EN.pdf?fileId=5546d462689a790c0168bd1094dc481b Description: MOSFET N-CH 40V 27A/100A TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 27A (Ta), 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 79W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 250µA
Supplier Device Package: PG-TDSON-8-1
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1900 pF @ 20 V
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AUXDILZ24NS Infineon Technologies Description: MOSFET N-CH D2PAK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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IPD650P06NMSAUMA1 IPD650P06NMSAUMA1 Infineon Technologies Power_Sensing_Selection_Guide_2021.pdf Description: MOSFET P-CH 60V 22A TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 22A, 10V
Power Dissipation (Max): 83W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1.04mA
Supplier Device Package: PG-TO252-3-313
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 39 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1600 pF @ 30 V
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IPD950P06NMSAUMA1 IPD950P06NMSAUMA1 Infineon Technologies Description: MOSFET P-CH 60V TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Supplier Device Package: PG-TO252-3-313
Part Status: Active
Drain to Source Voltage (Vdss): 60 V
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IPD06P003NSAUMA1 IPD06P003NSAUMA1 Infineon Technologies Description: MOSFET P-CH 60V 22A TO252-3
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IDWD15G120C5XKSA1 IDWD15G120C5XKSA1 Infineon Technologies Infineon-IDWD15G120C5-DS-v02_00-EN.pdf?fileId=5546d462689a790c016933d54d2b5489 Description: DIODE SIC 1.2KV 49A PGTO2472
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1050pF @ 1V, 1MHz
Current - Average Rectified (Io): 49A
Supplier Device Package: PG-TO247-2
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.65 V @ 15 A
Current - Reverse Leakage @ Vr: 124 µA @ 1200 V
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IKP28N65ES5XKSA1 IKP28N65ES5XKSA1 Infineon Technologies Infineon-IKP28N65ES5-DS-v02_01-EN.pdf?fileId=5546d462696dbf1201697b6e31284429 Description: IGBT TRENCH FS 650V 38A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 73 ns
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 28A
Supplier Device Package: PG-TO220-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 27ns/184ns
Switching Energy: 530µJ (on), 400µJ (off)
Test Condition: 400V, 28A, 34Ohm, 15V
Gate Charge: 50 nC
Part Status: Active
Current - Collector (Ic) (Max): 38 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 130 W
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IM393L6FXKLA1 IM393L6FXKLA1 Infineon Technologies Infineon-IM393-L6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a946a8b78d2 Description: POWER MODULE 600V 15A MDIP22
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
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IM393M6FXKLA1 IM393M6FXKLA1 Infineon Technologies Infineon-IM393-M6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a947c0278da Description: POWER MODULE 600V 10A 26PWRSIP
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393S6FXKLA1 IM393S6FXKLA1 Infineon Technologies Infineon-IM393-S6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a9d808378dd Description: POWER MODULE 600V 6A MDIP22
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 6 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393L6EXKLA1 IM393L6EXKLA1 Infineon Technologies Infineon-IM393-L6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a8b350f78c7 Description: POWER MODULE 600V 15A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393L6E3XKLA1 Infineon Technologies Infineon-IM393-L6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a8b350f78c7 Description: POWER MODULE 600V 15A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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TLD23313EPXUMA1 Infineon-TLD2331-3EP-DataSheet-v01_00-EN.pdf?fileId=5546d4626eab8fbf016eb161ce1b0461
TLD23313EPXUMA1
Hersteller: Infineon Technologies
Description: IC LED DRVR LIN PWM 60MA 14TSDSO
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 60mA
Internal Switch(s): Yes
Supplier Device Package: PG-TSDSO-14
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 599 Stücke:
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10+1.78 EUR
14+1.3 EUR
25+1.17 EUR
100+1.04 EUR
250+0.97 EUR
500+0.93 EUR
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BTS70021EPPXUMA1 BTS7002-1EPP_v1.03_4-29-19.pdf
BTS70021EPPXUMA1
Hersteller: Infineon Technologies
Description: IC PWR SWTCH N-CHAN 1:1 TSDSO-14
Packaging: Cut Tape (CT)
Package / Case: 14-TSSOP (0.154", 3.90mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 2.6mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 18V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 21A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TSDSO-14-22
Fault Protection: Over Current, Over Voltage, Short Circuit, UVLO
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
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5+4.29 EUR
10+3.22 EUR
25+2.94 EUR
100+2.64 EUR
250+2.5 EUR
500+2.41 EUR
1000+2.34 EUR
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AUIR3240STR Infineon-AUIR3240S-DS-v01_10-EN.pdf?fileId=5546d462533600a4015355a835801345
AUIR3240STR
Hersteller: Infineon Technologies
Description: IC GATE DRVR HIGH-SIDE 8SO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4V ~ 36V
Input Type: Non-Inverting
Supplier Device Package: PG-DSO-8-903
Channel Type: Single
Driven Configuration: High-Side
Number of Drivers: 1
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.9V, 2.5V
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SLB9645TT12FW13333XUMA2 Infineon-Data-sheet-SLB9645_1.2_Rev1.2-DS-v01_02-EN.pdf?fileId=5546d462689a790c016929d1c4074fdf
SLB9645TT12FW13333XUMA2
Hersteller: Infineon Technologies
Description: TPM
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: I2C
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 1.62V ~ 1.98V, 3V ~ 3.6V
Program Memory Type: NVM (6kB)
Applications: Trusted Platform Module (TPM)
Core Processor: 16-Bit
Supplier Device Package: PG-TSSOP-28-2
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
auf Bestellung 6162 Stücke:
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Anzahl Preis
3+6.3 EUR
10+4.77 EUR
25+4.39 EUR
100+3.97 EUR
250+3.77 EUR
500+3.65 EUR
1000+3.55 EUR
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SLB9665TT20FW563XUMA3 Infineon-data-sheet-SLB9665_2.0_Rev1.2-DS-v01_02-EN.pdf?fileId=5546d462689a790c016929d1d3054feb
SLB9665TT20FW563XUMA3
Hersteller: Infineon Technologies
Description: TPM
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Interface: LPC
Operating Temperature: -20°C ~ 85°C (TA)
Voltage - Supply: 3V ~ 3.6V
Program Memory Type: NVM (7.04kB)
Applications: Trusted Platform Module (TPM)
Core Processor: 16-Bit
Supplier Device Package: PG-TSSOP-28-2
Part Status: Active
Number of I/O: 1
DigiKey Programmable: Not Verified
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Anzahl Preis
3+6.27 EUR
10+4.74 EUR
25+4.36 EUR
100+3.94 EUR
250+3.74 EUR
500+3.62 EUR
1000+3.52 EUR
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AIKW75N60CTE8188XKSA1 Infineon-AIKW75N60CT-DS-v02_01-EN.pdf?fileId=5546d4625c167129015c5382c93a7ca3
AIKW75N60CTE8188XKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 600V 80A TO-247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 121 ns
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Supplier Device Package: PG-TO247-3-41
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 33ns/330ns
Switching Energy: 2mJ (on), 2.5mJ (off)
Test Condition: 400V, 75A, 5Ohm, 15V
Gate Charge: 470 nC
Part Status: Active
Current - Collector (Ic) (Max): 80 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 225 A
Power - Max: 428 W
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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HUE20XUMA1
Hersteller: Infineon Technologies
Description: IC POWER MANAGEMENT SMD
Produkt ist nicht verfügbar
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IPP90R1K0C3XK IPP90R1K0C3_Rev1.0_7-29-08.pdf
IPP90R1K0C3XK
Hersteller: Infineon Technologies
Description: MOSFET N-CH 900V 5.7A TO220-3
Produkt ist nicht verfügbar
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NBC9604
Hersteller: Infineon Technologies
Description: IC PAD 15NS 40QFN
Packaging: Tray
Produkt ist nicht verfügbar
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ICE2PCS02GE8191XUMA1
ICE2PCS02GE8191XUMA1
Hersteller: Infineon Technologies
Description: IC PFC CTRLR CCM 65KHZ 8DSO
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TJ)
Voltage - Supply: 11V ~ 25V
Frequency - Switching: 65kHz
Mode: Continuous Conduction (CCM)
Supplier Device Package: PG-DSO-8-41
Current - Startup: 450 µA
Produkt ist nicht verfügbar
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D170S25BS1XPSA1
Hersteller: Infineon Technologies
Description: DIODE GEN PURP BG-DSW271-1
Produkt ist nicht verfügbar
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D56S45CS02PRXPSA1
D56S45CS02PRXPSA1
Hersteller: Infineon Technologies
Description: DIODE GEN PURP BG-DSW272-1
Produkt ist nicht verfügbar
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D690S26TS01XPSA1
D690S26TS01XPSA1
Hersteller: Infineon Technologies
Description: DIODE GP 2.6KV 690A D5726K-1
Packaging: Bulk
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr): 9 µs
Technology: Standard
Current - Average Rectified (Io): 690A
Supplier Device Package: BG-D5726K-1
Operating Temperature - Junction: 150°C (Max)
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 2600 V
Voltage - Forward (Vf) (Max) @ If: 2.7 V @ 3000 A
Current - Reverse Leakage @ Vr: 25 mA @ 2600 V
Produkt ist nicht verfügbar
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CY8C20424-12LQXIT Infineon-CY8C20224_CY8C20324_CY8C20424_CY8C20524_CAPSENSE_PSOC_PROGRAMMABLE_SYSTEM_ON_CHIP-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecae11743f6
CY8C20424-12LQXIT
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 87500 Stücke:
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Anzahl Preis
2500+0.66 EUR
5000+0.63 EUR
7500+0.62 EUR
12500+0.61 EUR
17500+0.6 EUR
25000+0.59 EUR
Mindestbestellmenge: 2500
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CYW20707UA1KFFB4GT Infineon-CYW20707_Bluetooth_SoC_for_Embedded_Wireless_Devices_Datasheet-AdditionalTechnicalInformation-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee1ecf86806&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_
CYW20707UA1KFFB4GT
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 49FCBGA
Packaging: Tape & Reel (TR)
Package / Case: 49-VFBGA, FCBGA
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Power - Output: 9dBm
Protocol: Bluetooth v4.2
Current - Receiving: 26.4mA
Data Rate (Max): 2Mbps
Current - Transmitting: 60mA
Supplier Device Package: 49-FCBGA (4.5x4)
GPIO: 8
RF Family/Standard: Bluetooth
Serial Interfaces: I2S, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 175000 Stücke:
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Anzahl Preis
2500+1.69 EUR
Mindestbestellmenge: 2500
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CY2308SXC-3T Infineon-CY2308_3.3_V_Zero_Delay_Buffer-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcea4d2ec4&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY2308SXC-3T
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 16SOIC
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-SOIC
PLL: Yes
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 480 Stücke:
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5+3.98 EUR
10+3.39 EUR
25+3.18 EUR
100+2.89 EUR
250+2.72 EUR
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CY62256NLL-70ZRXIT Infineon-CY62256N_256-Kbit_(32_K_8)_Static_RAM-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebee07732ce
CY62256NLL-70ZRXIT
Hersteller: Infineon Technologies
Description: IC SRAM 256KBIT PAR 28TSOP I
Packaging: Cut Tape (CT)
Package / Case: 28-TSSOP (0.465", 11.80mm Width)
Mounting Type: Surface Mount
Memory Size: 256Kbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 4.5V ~ 5.5V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 28-TSOP I
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 32K x 8
DigiKey Programmable: Not Verified
auf Bestellung 1079 Stücke:
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Anzahl Preis
14+1.28 EUR
16+1.1 EUR
25+1.03 EUR
50+0.99 EUR
100+0.94 EUR
250+0.88 EUR
500+0.84 EUR
Mindestbestellmenge: 14
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CY3280-MBR download
CY3280-MBR
Hersteller: Infineon Technologies
Description: BOARD EVAL CAPSENSE EXPRESS
Produkt ist nicht verfügbar
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CY4502 Infineon-EZ-PD_CCG2_Datasheet_USB_Type-C_Port_Controller-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecd9536480b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY4502
Hersteller: Infineon Technologies
Description: KIT DEV FOR INTERFACE CNTRLR
Packaging: Box
Function: USB Type-C®
Type: Interface
Utilized IC / Part: CCG2
Supplied Contents: Board(s)
Part Status: Active
auf Bestellung 74 Stücke:
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1+43.35 EUR
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CY5676 Infineon-Quick_Start_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ef9a09b0f90&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY5676
Hersteller: Infineon Technologies
Description: DEV KIT PROC BLE
Packaging: Bulk
For Use With/Related Products: PRoC™ BLE
Frequency: 2.4GHz
Type: Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
Supplied Contents: Board(s)
Part Status: Obsolete
auf Bestellung 7 Stücke:
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Anzahl Preis
3+6.71 EUR
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CY8CKIT-046 CY8CKIT-046_Web.pdf
CY8CKIT-046
Hersteller: Infineon Technologies
Description: PSOC 4 L-SERIES PIONEER KIT
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s), Cable(s), Accessories
Core Processor: ARM® Cortex®-M0
Board Type: Evaluation Platform
Utilized IC / Part: PSoC 4200L
Platform: PSoC 4 L-Series Pioneer Kit
Part Status: Active
Packaging: Bulk
auf Bestellung 1036 Stücke:
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Anzahl Preis
2+16.44 EUR
Mindestbestellmenge: 2
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CG7618AA Infineon-CY7C1418KV18_CY7C1420KV18_36-Mbit_DDR_II_SRAM_Two-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1b25e368a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integr
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 160 Stücke:
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Anzahl Preis
1+27.19 EUR
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CY7C1011G30-12ZSXE Infineon-CY7C1011G_AUTOMOTIVE_2_MBIT_(128K_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed7727c5896
CY7C1011G30-12ZSXE
Hersteller: Infineon Technologies
Description: IC SRAM 2MBIT PARALLEL 44TSOP II
Packaging: Tray
Package / Case: 44-TSOP (0.400", 10.16mm Width)
Mounting Type: Surface Mount
Memory Size: 2Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 44-TSOP II
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 128K x 16
DigiKey Programmable: Not Verified
auf Bestellung 63 Stücke:
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Anzahl Preis
4+4.79 EUR
10+4.08 EUR
25+3.82 EUR
40+3.7 EUR
Mindestbestellmenge: 4
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CY7C1061GE30-10ZXI Infineon-CY7C1061G_CY7C1061GE_16_MBIT_(1M_WORDS_X_16_BIT)_STATIC_RAM_WITH_ERROR_CORRECTING_CODE_(ECC)-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec387e33888&utm_source=cypress&utm_medium=referral&utm_campaign=202110_
CY7C1061GE30-10ZXI
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Part Status: Active
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1097 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.26 EUR
10+13.25 EUR
25+12.84 EUR
96+12.25 EUR
192+11.95 EUR
288+11.77 EUR
576+11.48 EUR
1056+11.22 EUR
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CY7C1380KV33-167BZI download
CY7C1380KV33-167BZI
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 167 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Access Time: 3.4 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 10 Stücke:
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Anzahl Preis
1+18.23 EUR
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CY7C1413KV18-250BZXI Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign
CY7C1413KV18-250BZXI
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 2M x 18
DigiKey Programmable: Not Verified
auf Bestellung 86 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.45 EUR
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CY7C1415KV18-250BZI Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign
CY7C1415KV18-250BZI
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 625 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.93 EUR
10+17.92 EUR
25+16.88 EUR
40+16.39 EUR
80+15.7 EUR
230+14.75 EUR
440+14.21 EUR
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CY7C1415KV18-250BZXC Infineon-CY7C1411KV18_CY7C1426KV18_CY7C1413KV18_CY7C1415KV18_36-Mbit_QDR_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd4aea2fa7&utm_source=cypress&utm_medium=referral&utm_campaign
CY7C1415KV18-250BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 1649 Stücke:
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Anzahl Preis
1+24.25 EUR
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CY7C2270KV18-550BZXC Infineon-CY7C2268KV18_CY7C2270KV18_36-Mbit_DDR_II+_SRAM_Two-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)_with_ODT-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec197363665
CY7C2270KV18-550BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, DDR II+
Clock Frequency: 550 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
auf Bestellung 643 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+56.6 EUR
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CY8C20234-12LKXI Infineon-CY8C20134_CY8C20234_CY8C20334_CY8C20434_CY8C20534_CY8C20634_PSoC_Programmable_System-on-Chip-DataSheet-v24_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebcc61b2e7f&utm_source=cypress&utm_medium=referral&utm_campaign=202110_
CY8C20234-12LKXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 16QFN
Packaging: Tray
Package / Case: 16-UFQFN
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 16-QFN (3x3)
Number of I/O: 13
DigiKey Programmable: Not Verified
auf Bestellung 2448 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
16+1.16 EUR
Mindestbestellmenge: 16
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CY8C20424-12LQXI Infineon-CY8C20224_CY8C20324_CY8C20424_CY8C20524_CAPSENSE_PSOC_PROGRAMMABLE_SYSTEM_ON_CHIP-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecae11743f6
CY8C20424-12LQXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 1262 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
15+1.18 EUR
18+1.01 EUR
25+0.94 EUR
100+0.84 EUR
490+0.74 EUR
980+0.71 EUR
Mindestbestellmenge: 15
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S25FL164K0XBHI030 S25FL116K_132K_164K__RevH_5-19-17.pdf
S25FL164K0XBHI030
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 24BGA
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
35+0.51 EUR
Mindestbestellmenge: 35
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S29GL256S10DHSS50 Infineon-S29GL01GS_S29GL512S_S29GL256S_S29GL128S_128_Mb_256_Mb_512_Mb_1_Gb_GL-S_MIRRORBIT_TM_Flash_Parallel_3-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5
S29GL256S10DHSS50
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
auf Bestellung 841 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.36 EUR
10+2.2 EUR
25+2.14 EUR
50+2.09 EUR
100+2.05 EUR
260+1.98 EUR
520+1.93 EUR
Mindestbestellmenge: 8
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CY2308SXI-3 CY2308.pdf
CY2308SXI-3
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-SOIC
PLL: Yes
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
auf Bestellung 93 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.3 EUR
Mindestbestellmenge: 2
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CY8C20546A-24PVXI download
CY8C20546A-24PVXI
Hersteller: Infineon Technologies
Description: IC MCU 16K FLASH 2K SRAM 48SSOP
Packaging: Tube
Package / Case: 48-BSSOP (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Interface: I²C, SPI
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.71V ~ 5.5V
Controller Series: CY8C20xx6A
Program Memory Type: FLASH (16kB)
Applications: Capacitive Sensing
Core Processor: M8C
Supplier Device Package: 48-SSOP
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 1368 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
10+1.87 EUR
Mindestbestellmenge: 10
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FM25V20A-PG FM25V20A_PDIP_RevE_2-9-24.pdf
FM25V20A-PG
Hersteller: Infineon Technologies
Description: IC FRAM 2MBIT SPI 40MHZ 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Memory Size: 2Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 8-PDIP
Part Status: Active
Memory Interface: SPI
Memory Organization: 256K x 8
DigiKey Programmable: Not Verified
auf Bestellung 113 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.51 EUR
10+5.14 EUR
25+4.99 EUR
53+4.87 EUR
106+4.75 EUR
Mindestbestellmenge: 4
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BGA855N6E6327XTSA1 Infineon-BGA855N6-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32ebeb1141d
BGA855N6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.164GHz ~ 1.3GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.1V ~ 3.3V
Gain: 18.9dB
Current - Supply: 5.4mA
Noise Figure: 0.6dB
P1dB: -8dBm
Test Frequency: 1.214GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
12000+0.41 EUR
Mindestbestellmenge: 12000
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REFXDPL8221U50WTOBO1 Infineon-XDPL8221-DS-v01_01-EN.pdf?fileId=5546d46266f85d6301670d68764e3679
REFXDPL8221U50WTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR XDPL8221
Packaging: Bulk
Features: Dimmable
Voltage - Output: 16V ~ 48V
Voltage - Input: 90 ~ 305 VAC, 90V ~ 430V
Current - Output / Channel: 1.5A
Utilized IC / Part: XDPL8221
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Active
Contents: Board(s)
auf Bestellung 2 Stücke:
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Anzahl Preis
1+231.77 EUR
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REFXDPL8221U100WTOBO1 Infineon-EngineeringReport_ReferenceBoard_XDPdigitalpower_REF-XDPL8221-U100W-AN-v01_00-EN.pdf?fileId=5546d462689a790c0168dbf6d0a652e1
REFXDPL8221U100WTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR XDPL8221
Packaging: Bulk
Features: Dimmable
Voltage - Output: 16V ~ 48V
Voltage - Input: 90 ~ 305 VAC, 90V ~ 305V
Current - Output / Channel: 2.5A
Utilized IC / Part: XDPL8221
Supplied Contents: Board(s)
Outputs and Type: 1 Isolated Output
Part Status: Active
Contents: Board(s)
auf Bestellung 1 Stücke:
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Anzahl Preis
1+211.68 EUR
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TLE8457CSJXUMA1 Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be
TLE8457CSJXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER 1/1 PGDSO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-DSO-8
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2409 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
9+2.11 EUR
12+1.54 EUR
25+1.4 EUR
100+1.24 EUR
250+1.16 EUR
500+1.12 EUR
1000+1.08 EUR
Mindestbestellmenge: 9
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TLE8457DLEXUMA1 Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be
TLE8457DLEXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER 1/1 PGTDSON81
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-TDSON-8-1
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 20044 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.27 EUR
11+1.66 EUR
25+1.5 EUR
100+1.34 EUR
250+1.26 EUR
500+1.21 EUR
1000+1.17 EUR
2500+1.12 EUR
Mindestbestellmenge: 8
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TLE8457DSJXUMA1 Infineon-TLE8457CD-DS-v01_10-EN.pdf?fileId=5546d462689a790c0168a1d53be462be
TLE8457DSJXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER 1/1 DSO-8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Number of Drivers/Receivers: 1/1
Data Rate: 20kbps
Protocol: LIN
Supplier Device Package: PG-DSO-8
Part Status: Active
auf Bestellung 9366 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.85 EUR
10+2.56 EUR
25+2.41 EUR
100+2.05 EUR
250+1.93 EUR
500+1.69 EUR
1000+1.4 EUR
Mindestbestellmenge: 7
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BGA855N6E6327XTSA1 Infineon-BGA855N6-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32ebeb1141d
BGA855N6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP GPS 1.164GHZ-1.3GHZ TSNP6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.164GHz ~ 1.3GHz
RF Type: GPS/GNSS
Voltage - Supply: 1.1V ~ 3.3V
Gain: 18.9dB
Current - Supply: 5.4mA
Noise Figure: 0.6dB
P1dB: -8dBm
Test Frequency: 1.214GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
auf Bestellung 14919 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
19+0.95 EUR
27+0.67 EUR
30+0.6 EUR
100+0.53 EUR
250+0.49 EUR
500+0.47 EUR
1000+0.45 EUR
2500+0.43 EUR
5000+0.42 EUR
Mindestbestellmenge: 19
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TLE8104EXUMA2 Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25
TLE8104EXUMA2
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 DSO-20
Produkt ist nicht verfügbar
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TLE8104EXUMA2 Infineon-TLE8104E-DS-v01_04-en.pdf?fileId=db3a304318f3fe2901190401cfda7f25
TLE8104EXUMA2
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 DSO-20
Produkt ist nicht verfügbar
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BGS14MPA9E6327XTSA1 Infineon-BGS14MPA9-DS-v01_00-EN.pdf?fileId=5546d462677d0f460167a32eb6c5141a
BGS14MPA9E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH SP4T 6GHZ ATSLP9-3
Packaging: Cut Tape (CT)
Features: DC Blocked
Package / Case: 9-UFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP4T
RF Type: 2G/3G/4G/5G, Cellular, LTE, W-CDMA
Operating Temperature: 125°C (TJ)
Voltage - Supply: 1.65V ~ 1.95V
Insertion Loss: 1dB
Frequency Range: 50MHz ~ 6GHz
Test Frequency: 5.925GHz
Isolation: 23dB
Supplier Device Package: PG-ATSLP-9-3
IIP3: 77dBm
Part Status: Not For New Designs
auf Bestellung 4005 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
11+1.65 EUR
16+1.15 EUR
25+1.02 EUR
100+0.88 EUR
250+0.81 EUR
500+0.77 EUR
1000+0.74 EUR
Mindestbestellmenge: 11
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BSM150GB170DLCE3256HDLA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 300A 1250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 3.2V @ 15V, 150A
NTC Thermistor: No
Part Status: Obsolete
Current - Collector (Ic) (Max): 300 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 1250 W
Current - Collector Cutoff (Max): 300 µA
Input Capacitance (Cies) @ Vce: 10 nF @ 25 V
Produkt ist nicht verfügbar
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BSC010N04LS6ATMA1 Infineon-BSC010N04LS6-DS-v02_00-EN.pdf?fileId=5546d462689a790c0168bd076e184818
BSC010N04LS6ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 40A/100A TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 100A (Tc)
Rds On (Max) @ Id, Vgs: 1mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 250µA
Supplier Device Package: PG-TDSON-8-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 67 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 4600 pF @ 20 V
auf Bestellung 6243 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.87 EUR
10+2.5 EUR
100+1.71 EUR
500+1.37 EUR
Mindestbestellmenge: 5
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BSC022N04LS6ATMA1 Infineon-BSC022N04LS6-DS-v02_00-EN.pdf?fileId=5546d462689a790c0168bd1094dc481b
BSC022N04LS6ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 27A/100A TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 27A (Ta), 100A (Tc)
Rds On (Max) @ Id, Vgs: 2.2mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 79W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 250µA
Supplier Device Package: PG-TDSON-8-1
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1900 pF @ 20 V
auf Bestellung 5472 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.39 EUR
10+1.82 EUR
100+1.28 EUR
500+1.01 EUR
1000+0.95 EUR
Mindestbestellmenge: 8
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AUXDILZ24NS
Hersteller: Infineon Technologies
Description: MOSFET N-CH D2PAK
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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IPD650P06NMSAUMA1 Power_Sensing_Selection_Guide_2021.pdf
IPD650P06NMSAUMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V 22A TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Tc)
Rds On (Max) @ Id, Vgs: 65mOhm @ 22A, 10V
Power Dissipation (Max): 83W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1.04mA
Supplier Device Package: PG-TO252-3-313
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 39 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1600 pF @ 30 V
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IPD950P06NMSAUMA1
IPD950P06NMSAUMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Supplier Device Package: PG-TO252-3-313
Part Status: Active
Drain to Source Voltage (Vdss): 60 V
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IPD06P003NSAUMA1
IPD06P003NSAUMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V 22A TO252-3
Produkt ist nicht verfügbar
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IDWD15G120C5XKSA1 Infineon-IDWD15G120C5-DS-v02_00-EN.pdf?fileId=5546d462689a790c016933d54d2b5489
IDWD15G120C5XKSA1
Hersteller: Infineon Technologies
Description: DIODE SIC 1.2KV 49A PGTO2472
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 1050pF @ 1V, 1MHz
Current - Average Rectified (Io): 49A
Supplier Device Package: PG-TO247-2
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.65 V @ 15 A
Current - Reverse Leakage @ Vr: 124 µA @ 1200 V
auf Bestellung 182 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.97 EUR
30+6.94 EUR
120+5.83 EUR
Mindestbestellmenge: 2
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IKP28N65ES5XKSA1 Infineon-IKP28N65ES5-DS-v02_01-EN.pdf?fileId=5546d462696dbf1201697b6e31284429
IKP28N65ES5XKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 38A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 73 ns
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 28A
Supplier Device Package: PG-TO220-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 27ns/184ns
Switching Energy: 530µJ (on), 400µJ (off)
Test Condition: 400V, 28A, 34Ohm, 15V
Gate Charge: 50 nC
Part Status: Active
Current - Collector (Ic) (Max): 38 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 130 W
Produkt ist nicht verfügbar
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IM393L6FXKLA1 Infineon-IM393-L6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a946a8b78d2
IM393L6FXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 15A MDIP22
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393M6FXKLA1 Infineon-IM393-M6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a947c0278da
IM393M6FXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 10A 26PWRSIP
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 10 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393S6FXKLA1 Infineon-IM393-S6F-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a9d808378dd
IM393S6FXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 6A MDIP22
Packaging: Tube
Package / Case: 26-PowerSIP Module, 22 Leads, Formed Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 6 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393L6EXKLA1 Infineon-IM393-L6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a8b350f78c7
IM393L6EXKLA1
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 15A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM393L6E3XKLA1 Infineon-IM393-L6E-DS-v02_00-EN.pdf?fileId=5546d462696dbf1201699a8b350f78c7
Hersteller: Infineon Technologies
Description: POWER MODULE 600V 15A MDIP30
Packaging: Tube
Package / Case: 35-PowerDIP Module (0.866", 22.00mm), 30 Leads
Mounting Type: Through Hole
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Obsolete
Current: 15 A
Voltage: 600 V
Produkt ist nicht verfügbar
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