Produkte > NXP USA INC. > Alle Produkte des Herstellers NXP USA INC. (36589) > Seite 87 nach 610
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||
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MPC17511EP | NXP USA Inc. |
 Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFNMotor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 24-QFN-EP (4x4) Voltage - Load: 2V ~ 6.8V Technology: CMOS Applications: Battery Powered Voltage - Supply: 2.7V ~ 5.7V Output Configuration: Half Bridge (2) Operating Temperature: -20°C ~ 150°C (TJ) Interface: Parallel Current - Output: 1A Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC17511EPR2 | NXP USA Inc. |
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 24-QFN-EP (4x4) Voltage - Load: 2V ~ 6.8V Technology: CMOS Applications: Battery Powered Voltage - Supply: 2.7V ~ 5.7V Output Configuration: Half Bridge (2) Operating Temperature: -20°C ~ 150°C (TJ) Interface: Parallel Current - Output: 1A Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 24-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC17533EVEL | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 16-VMFP Voltage - Load: 2V ~ 6.8V Technology: CMOS Applications: Battery Powered Voltage - Supply: 2.7V ~ 5.7V Output Configuration: Half Bridge (4) Operating Temperature: -55°C ~ 150°C (TJ) Interface: Parallel Current - Output: 700mA Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 16-SSOP (0.209", 5.30mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC17550EV | NXP USA Inc. |
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP Packaging: Tube Package / Case: 36-SSOP (0.209", 5.30mm Width) Mounting Type: Surface Mount Function: Driver - Fully Integrated, Control and Power Stage Current - Output: 700mA Interface: Parallel Operating Temperature: -10°C ~ 150°C (TJ) Output Configuration: Half Bridge (8) Voltage - Supply: 2.5V ~ 5.5V Applications: Battery Powered Technology: Power MOSFET Voltage - Load: 1.6V ~ 5.5V Supplier Device Package: 36-VMFP Motor Type - Stepper: Bipolar Motor Type - AC, DC: Brushed DC Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC17C724EP | NXP USA Inc. |
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN Motor Type - AC, DC: Brushed DC Motor Type - Stepper: Bipolar Supplier Device Package: 16-QFN (3x3) Voltage - Load: 2.7V ~ 5.5V Technology: Power MOSFET Applications: Camera Voltage - Supply: 2.7V ~ 5.5V Output Configuration: Half Bridge (4) Operating Temperature: -20°C ~ 150°C (TJ) Interface: Parallel Current - Output: 400mA Function: Driver - Fully Integrated, Control and Power Stage Mounting Type: Surface Mount Package / Case: 16-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC184VFB | NXP USA Inc. |
Description: IC SECURITY PROCESSOR 252-MAPBGA DigiKey Programmable: Not Verified Supplier Device Package: 252-MAPBGA (21x21) Type: Security Processor Mounting Type: Surface Mount Package / Case: 252-BGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC18730EPR2 | NXP USA Inc. |
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN Part Status: Obsolete Supplier Device Package: 64-QFN (9x9) Current - Supply: 9mA Applications: Handheld/Mobile Devices Voltage - Supply: 0.9V ~ 4.2V Operating Temperature: -10°C ~ 65°C Mounting Type: Surface Mount Package / Case: 64-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC5554MVR132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 256 DigiKey Programmable: Not Verified |
auf Bestellung 51 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC5554MVR132R2 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Mounting Type: Surface Mount Package / Case: 416-BBGA Packaging: Tape & Reel (TR) Number of I/O: 256 Part Status: Obsolete Supplier Device Package: 416-PBGA (27x27) Peripherals: DMA, POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Core Size: 32-Bit Single-Core Data Converters: A/D 40x12b Core Processor: e200z6 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 64K x 8 Program Memory Size: 2MB (2M x 8) Speed: 132MHz DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC5554MZP132 | NXP USA Inc. |
Description: IC MCU 32BIT 2MB FLASH 416PBGA Packaging: Tray Package / Case: 416-BBGA Mounting Type: Surface Mount Speed: 132MHz Program Memory Size: 2MB (2M x 8) RAM Size: 64K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH Core Processor: e200z6 Data Converters: A/D 40x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: DMA, POR, PWM, WDT Supplier Device Package: 416-PBGA (27x27) Part Status: Not For New Designs Number of I/O: 256 DigiKey Programmable: Not Verified |
auf Bestellung 286 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC555LFMZP40R2 | NXP USA Inc. |
Description: IC MCU 32BIT 448KB FLASH 272PBGA DigiKey Programmable: Not Verified Number of I/O: 101 Supplier Device Package: 272-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 26K x 8 Program Memory Size: 448KB (448K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 272-BBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC561MVR56 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA DigiKey Programmable: Not Verified Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Speed: 56MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tray Number of I/O: 64 Part Status: Not For New Designs Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: ROMless |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC561MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Speed: 56MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 64 Part Status: Not For New Designs Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: ROMless |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC562MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388PBGA Packaging: Tape & Reel (TR) Package / Case: 388-BBGA Mounting Type: Surface Mount Speed: 56MHz RAM Size: 32K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: ROMless Core Processor: PowerPC Data Converters: A/D 32x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Supplier Device Package: 388-PBGA (27x27) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC562MZP66R2 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 388BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC563MVR56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Number of I/O: 56 Part Status: Not For New Designs Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC563MVR66R | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 56 Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC563MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA DigiKey Programmable: Not Verified Number of I/O: 56 Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC563MZP66R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA DigiKey Programmable: Not Verified Number of I/O: 56 Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 66MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC564CVR66 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC564MVR56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA Number of I/O: 56 Part Status: Obsolete Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC564MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA DigiKey Programmable: Not Verified Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 512KB (512K x 8) Speed: 56MHz Mounting Type: Surface Mount Package / Case: 388-BBGA Packaging: Tape & Reel (TR) Number of I/O: 56 Part Status: Obsolete Supplier Device Package: 388-PBGA (27x27) Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V Core Size: 32-Bit Single-Core Data Converters: A/D 32x10b Core Processor: PowerPC Program Memory Type: FLASH |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC564MZP66R2 | NXP USA Inc. |
Description: IC MCU 32BIT 512KB FLASH 388PBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC565MZP56R2 | NXP USA Inc. |
Description: IC MCU 32BIT 1MB FLASH 388BGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC603RRX200TC | NXP USA Inc. |
Description: IC MPU MPC6XX 200MHZ 255FCCBGA Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 255-FCCBGA (21x21) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: -40°C ~ 105°C (TA) Speed: 200MHz Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC603RRX266TC | NXP USA Inc. |
Description: IC MPU MPC6XX 266MHZ 255FCCBGA Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 255-FCCBGA (21x21) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 255-BCBGA, FCCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC7410HX450LE | NXP USA Inc. |
Description: IC MPU MPC74XX 450MHZ 360FCCBGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 44 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC7410HX500LE | NXP USA Inc. |
Description: IC MPU MPC74XX 500MHZ 360CBGA Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-CBGA (25x25) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC G4 Operating Temperature: 0°C ~ 105°C (TA) Speed: 500MHz Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Packaging: Tray Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC7410THX400LE | NXP USA Inc. |
Description: IC MPU MPC74XX 400MHZ 360CBGA Graphics Acceleration: No Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 360-CBGA (25x25) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC G4 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 360-BCBGA, FCCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC7410THX500LE | NXP USA Inc. |
Description: IC MPU MPC74XX 500MHZ 360CBGA Packaging: Tray Package / Case: 360-BCBGA, FCCBGA Mounting Type: Surface Mount Speed: 500MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G4 Voltage - I/O: 1.8V, 2.5V, 3.3V Supplier Device Package: 360-CBGA (25x25) Number of Cores/Bus Width: 1 Core, 32-Bit Graphics Acceleration: No Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC823ZQ66B2T | NXP USA Inc. |
Description: IC MPU MPC8XX 66MHZ 256BGA |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 300 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8245TZU300D | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 352TBGA Additional Interfaces: I2C, I²O, PCI, UART Graphics Acceleration: No RAM Controllers: SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit Supplier Device Package: 352-TBGA (35x35) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: -40°C ~ 105°C (TA) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 352-LBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 24 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8245TZU333D | NXP USA Inc. |
Description: IC MPU MPC82XX 333MHZ 352TBGA Supplier Device Package: 352-TBGA (35x35) Voltage - I/O: 3.3V Core Processor: PowerPC 603e Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 352-LBGA Packaging: Tray Additional Interfaces: I2C, I²O, PCI, UART Graphics Acceleration: No RAM Controllers: SDRAM Number of Cores/Bus Width: 1 Core, 32-Bit |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8247ZQMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ PBGA516 Package / Case: 516-BBGA Packaging: Tray Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 516-PBGA (27x27) Voltage - I/O: 3.3V Core Processor: PowerPC G2_LE Operating Temperature: 0°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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mpc8250aczqihbc | NXP USA Inc. |
Description: IC MPU MPC82XX 200MHZ PBGA516 Speed: 200MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Packaging: Tray Ethernet: 10/100Mbps (3) Supplier Device Package: 516-PBGA (27x27) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8255ACZUMIBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 42 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8264ACZUMIBB | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8265ACVVMIBC | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Package / Case: 480-LBGA Exposed Pad Packaging: Tray Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8265ACZUMHBC | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8265ACZUMIBC | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 480TBGA Part Status: Obsolete RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray Graphics Acceleration: No |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8265AVVPJDC | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 480TBGA Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: 0°C ~ 105°C (TA) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8265AZUPJDC | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ 480TBGA Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Part Status: Obsolete Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2 Operating Temperature: 0°C ~ 105°C (TA) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 21 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8270CZQMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 333MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 333MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Active Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
auf Bestellung 43 Stücke: Lieferzeit 10-14 Tag (e) |
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MPC8270CZUQLDA | NXP USA Inc. |
Description: IC MPU MPC82XX 333MHZ 480TBGA Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2_LE Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8270CZUUPEA | NXP USA Inc. |
Description: IC MPU MPC82XX 450MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 450MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8271CZQMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 516BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8272CZQMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 266MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8272CZQPIEA | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8272CZQTIEA | NXP USA Inc. |
Description: IC MPU MPC82XX 400MHZ PBGA516 Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM, Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (2) Supplier Device Package: 516-PBGA (27x27) Voltage - I/O: 3.3V Core Processor: PowerPC G2_LE Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 516-BBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8272ZQMIBA | NXP USA Inc. |
Description: IC MPU MPC82XX 266MHZ 516BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8272ZQPIEA | NXP USA Inc. |
Description: IC MPU MPC82XX 300MHZ PBGA516 Packaging: Tray Package / Case: 516-BBGA Mounting Type: Surface Mount Speed: 300MHz Operating Temperature: 0°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 516-PBGA (27x27) Ethernet: 10/100Mbps (2) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM, Security; SEC RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Security Features: Cryptography, Random Number Generator Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 40 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8272ZQTIEA | NXP USA Inc. |
Description: IC MPU MPC82XX 400MHZ 516BGA |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8280CZUQLDA | NXP USA Inc. |
Description: IC MPU MPC82XX 333MHZ 480TBGA Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2_LE Operating Temperature: -40°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8280CZUUPEA | NXP USA Inc. |
Description: IC MPU MPC82XX 450MHZ 480TBGA Packaging: Tray Package / Case: 480-LBGA Exposed Pad Mounting Type: Surface Mount Speed: 450MHz Operating Temperature: -40°C ~ 105°C (TA) Core Processor: PowerPC G2_LE Voltage - I/O: 3.3V Supplier Device Package: 480-TBGA (37.5x37.5) Ethernet: 10/100Mbps (3) USB: USB 2.0 (1) Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; RISC CPM RAM Controllers: DRAM, SDRAM Graphics Acceleration: No Part Status: Obsolete Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8280ZUQLDA | NXP USA Inc. |
Description: IC MPU MPC82XX 333MHZ 480TBGA Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART Graphics Acceleration: No RAM Controllers: DRAM, SDRAM Co-Processors/DSP: Communications; RISC CPM Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 (1) Ethernet: 10/100Mbps (3) Supplier Device Package: 480-TBGA (37.5x37.5) Voltage - I/O: 3.3V Core Processor: PowerPC G2_LE Operating Temperature: 0°C ~ 105°C (TA) Speed: 333MHz Mounting Type: Surface Mount Package / Case: 480-LBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8343CVRADD | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Additional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8343CVRAGD | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Additional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8343CZQADD | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Additional Interfaces: DUART, I2C, PCI, SPI Graphics Acceleration: No RAM Controllers: DDR, DDR2 Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: -40°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8343EVRADD | NXP USA Inc. |
Description: IC MPU MPC83XX 266MHZ 620HBGA Additional Interfaces: DUART, I2C, PCI, SPI Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 266MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||
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MPC8343EZQAGD | NXP USA Inc. |
Description: IC MPU MPC83XX 400MHZ 620HBGA Additional Interfaces: DUART, I2C, PCI, SPI Security Features: Cryptography, Random Number Generator Graphics Acceleration: No RAM Controllers: DDR, DDR2 Co-Processors/DSP: Security; SEC Number of Cores/Bus Width: 1 Core, 32-Bit USB: USB 2.0 + PHY (2) Ethernet: 10/100/1000Mbps (3) Supplier Device Package: 620-HBGA (29x29) Voltage - I/O: 1.8V, 2.5V, 3.3V Core Processor: PowerPC e300 Operating Temperature: 0°C ~ 105°C (TA) Speed: 400MHz Mounting Type: Surface Mount Package / Case: 620-BBGA Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| MPC17511EP |
|
Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 24-QFN-EP (4x4)
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (2)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 1A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 24-QFN-EP (4x4)
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (2)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 1A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC17511EPR2 |
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Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 24-QFN-EP (4x4)
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (2)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 1A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC MTR DRV BIPOLR 2.7-5.7V 24QFN
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 24-QFN-EP (4x4)
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (2)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 1A
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 24-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC17533EVEL |
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Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-VMFP
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (4)
Operating Temperature: -55°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 700mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Description: IC MTR DRV BIPLR 2.7-5.7V 16VMFP
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-VMFP
Voltage - Load: 2V ~ 6.8V
Technology: CMOS
Applications: Battery Powered
Voltage - Supply: 2.7V ~ 5.7V
Output Configuration: Half Bridge (4)
Operating Temperature: -55°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 700mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-SSOP (0.209", 5.30mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC17550EV |
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Hersteller: NXP USA Inc.
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tube
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
Description: IC MTR DRV BIPLR 2.5-5.5V 36VMFP
Packaging: Tube
Package / Case: 36-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 700mA
Interface: Parallel
Operating Temperature: -10°C ~ 150°C (TJ)
Output Configuration: Half Bridge (8)
Voltage - Supply: 2.5V ~ 5.5V
Applications: Battery Powered
Technology: Power MOSFET
Voltage - Load: 1.6V ~ 5.5V
Supplier Device Package: 36-VMFP
Motor Type - Stepper: Bipolar
Motor Type - AC, DC: Brushed DC
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 40 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC17C724EP |
|
Hersteller: NXP USA Inc.
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-QFN (3x3)
Voltage - Load: 2.7V ~ 5.5V
Technology: Power MOSFET
Applications: Camera
Voltage - Supply: 2.7V ~ 5.5V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 400mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tray
Description: IC MTR DRVR BIPLR 2.7-5.5V 16QFN
Motor Type - AC, DC: Brushed DC
Motor Type - Stepper: Bipolar
Supplier Device Package: 16-QFN (3x3)
Voltage - Load: 2.7V ~ 5.5V
Technology: Power MOSFET
Applications: Camera
Voltage - Supply: 2.7V ~ 5.5V
Output Configuration: Half Bridge (4)
Operating Temperature: -20°C ~ 150°C (TJ)
Interface: Parallel
Current - Output: 400mA
Function: Driver - Fully Integrated, Control and Power Stage
Mounting Type: Surface Mount
Package / Case: 16-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC184VFB |
|
Hersteller: NXP USA Inc.
Description: IC SECURITY PROCESSOR 252-MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 252-MAPBGA (21x21)
Type: Security Processor
Mounting Type: Surface Mount
Package / Case: 252-BGA
Packaging: Tray
Description: IC SECURITY PROCESSOR 252-MAPBGA
DigiKey Programmable: Not Verified
Supplier Device Package: 252-MAPBGA (21x21)
Type: Security Processor
Mounting Type: Surface Mount
Package / Case: 252-BGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC18730EPR2 |
|
Hersteller: NXP USA Inc.
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Part Status: Obsolete
Supplier Device Package: 64-QFN (9x9)
Current - Supply: 9mA
Applications: Handheld/Mobile Devices
Voltage - Supply: 0.9V ~ 4.2V
Operating Temperature: -10°C ~ 65°C
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC PMIC PROGR 5-OUTPUTS 64-QFN
Part Status: Obsolete
Supplier Device Package: 64-QFN (9x9)
Current - Supply: 9mA
Applications: Handheld/Mobile Devices
Voltage - Supply: 0.9V ~ 4.2V
Operating Temperature: -10°C ~ 65°C
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC5554MVR132 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 51 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 163.34 EUR |
| 10+ | 136.29 EUR |
| 25+ | 129.54 EUR |
| MPC5554MVR132R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
Number of I/O: 256
Part Status: Obsolete
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 132MHz
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Mounting Type: Surface Mount
Package / Case: 416-BBGA
Packaging: Tape & Reel (TR)
Number of I/O: 256
Part Status: Obsolete
Supplier Device Package: 416-PBGA (27x27)
Peripherals: DMA, POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Core Size: 32-Bit Single-Core
Data Converters: A/D 40x12b
Core Processor: e200z6
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 132MHz
DigiKey Programmable: Not Verified
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| MPC5554MZP132 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 2MB FLASH 416PBGA
Packaging: Tray
Package / Case: 416-BBGA
Mounting Type: Surface Mount
Speed: 132MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: e200z6
Data Converters: A/D 40x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.35V ~ 1.65V
Connectivity: CANbus, EBI/EMI, SCI, SPI
Peripherals: DMA, POR, PWM, WDT
Supplier Device Package: 416-PBGA (27x27)
Part Status: Not For New Designs
Number of I/O: 256
DigiKey Programmable: Not Verified
auf Bestellung 286 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 197.34 EUR |
| 10+ | 165.43 EUR |
| 25+ | 157.47 EUR |
| MPC555LFMZP40R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 448KB FLASH 272PBGA
DigiKey Programmable: Not Verified
Number of I/O: 101
Supplier Device Package: 272-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 26K x 8
Program Memory Size: 448KB (448K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 272-BBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 448KB FLASH 272PBGA
DigiKey Programmable: Not Verified
Number of I/O: 101
Supplier Device Package: 272-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 26K x 8
Program Memory Size: 448KB (448K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 272-BBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MPC561MVR56 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
DigiKey Programmable: Not Verified
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Description: IC MCU 32BIT ROMLESS 388PBGA
DigiKey Programmable: Not Verified
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tray
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Produkt ist nicht verfügbar
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| MPC561MZP56R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Description: IC MCU 32BIT ROMLESS 388PBGA
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 64
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: ROMless
Produkt ist nicht verfügbar
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| MPC562MZP56R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 388PBGA
Packaging: Tape & Reel (TR)
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Speed: 56MHz
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: PowerPC
Data Converters: A/D 32x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 388-PBGA (27x27)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MPC562MZP66R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 388BGA
Description: IC MCU 32BIT ROMLESS 388BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC563MVR56R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Number of I/O: 56
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Number of I/O: 56
Part Status: Not For New Designs
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MPC563MVR66R |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Produkt ist nicht verfügbar
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| MPC563MZP56R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MPC563MZP66R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Number of I/O: 56
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| MPC564CVR66 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Produkt ist nicht verfügbar
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| MPC564MVR56R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Number of I/O: 56
Part Status: Obsolete
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Number of I/O: 56
Part Status: Obsolete
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| MPC564MZP56R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
Number of I/O: 56
Part Status: Obsolete
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Description: IC MCU 32BIT 512KB FLASH 388PBGA
DigiKey Programmable: Not Verified
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 56MHz
Mounting Type: Surface Mount
Package / Case: 388-BBGA
Packaging: Tape & Reel (TR)
Number of I/O: 56
Part Status: Obsolete
Supplier Device Package: 388-PBGA (27x27)
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SCI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 2.7V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: PowerPC
Program Memory Type: FLASH
Produkt ist nicht verfügbar
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| MPC564MZP66R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Description: IC MCU 32BIT 512KB FLASH 388PBGA
Produkt ist nicht verfügbar
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| MPC565MZP56R2 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT 1MB FLASH 388BGA
Description: IC MCU 32BIT 1MB FLASH 388BGA
Produkt ist nicht verfügbar
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| MPC603RRX200TC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 255-FCCBGA (21x21)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 255-BCBGA, FCCBGA
Packaging: Tray
Description: IC MPU MPC6XX 200MHZ 255FCCBGA
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 255-FCCBGA (21x21)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 255-BCBGA, FCCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC603RRX266TC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 255-FCCBGA (21x21)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 255-BCBGA, FCCBGA
Packaging: Tray
Description: IC MPU MPC6XX 266MHZ 255FCCBGA
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 255-FCCBGA (21x21)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 255-BCBGA, FCCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC7410HX450LE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 450MHZ 360FCCBGA
Description: IC MPU MPC74XX 450MHZ 360FCCBGA
Produkt ist nicht verfügbar
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| MPC7410HX500LE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Description: IC MPU MPC74XX 500MHZ 360CBGA
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 500MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC7410THX400LE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 400MHZ 360CBGA
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Description: IC MPU MPC74XX 400MHZ 360CBGA
Graphics Acceleration: No
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 360-CBGA (25x25)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC G4
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 360-BCBGA, FCCBGA
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
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| MPC7410THX500LE |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Description: IC MPU MPC74XX 500MHZ 360CBGA
Packaging: Tray
Package / Case: 360-BCBGA, FCCBGA
Mounting Type: Surface Mount
Speed: 500MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G4
Voltage - I/O: 1.8V, 2.5V, 3.3V
Supplier Device Package: 360-CBGA (25x25)
Number of Cores/Bus Width: 1 Core, 32-Bit
Graphics Acceleration: No
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC823ZQ66B2T |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC8XX 66MHZ 256BGA
Description: IC MPU MPC8XX 66MHZ 256BGA
Produkt ist nicht verfügbar
Mindestbestellmenge: 300 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8245TZU300D |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Description: IC MPU MPC82XX 300MHZ 352TBGA
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 24 Stücke
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| MPC8245TZU333D |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 352TBGA
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Description: IC MPU MPC82XX 333MHZ 352TBGA
Supplier Device Package: 352-TBGA (35x35)
Voltage - I/O: 3.3V
Core Processor: PowerPC 603e
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 352-LBGA
Packaging: Tray
Additional Interfaces: I2C, I²O, PCI, UART
Graphics Acceleration: No
RAM Controllers: SDRAM
Number of Cores/Bus Width: 1 Core, 32-Bit
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8247ZQMIBA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Package / Case: 516-BBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Package / Case: 516-BBGA
Packaging: Tray
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| mpc8250aczqihbc |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 200MHZ PBGA516
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Ethernet: 10/100Mbps (3)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 200MHZ PBGA516
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Ethernet: 10/100Mbps (3)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
Mindestbestellmenge: 40 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8255ACZUMIBB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 42 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8264ACZUMIBB |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8265ACVVMIBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Description: IC MPU MPC82XX 266MHZ 480TBGA
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8265ACZUMHBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 266MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8265ACZUMIBC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Graphics Acceleration: No
Description: IC MPU MPC82XX 266MHZ 480TBGA
Part Status: Obsolete
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Graphics Acceleration: No
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8265AVVPJDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 300MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8265AZUPJDC |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 300MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Part Status: Obsolete
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 21 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8270CZQMIBA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 333MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 333MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Active
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
auf Bestellung 43 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 268.8 EUR |
| 10+ | 227.42 EUR |
| 40+ | 216.23 EUR |
| MPC8270CZUQLDA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8270CZUUPEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8271CZQMIBA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 516BGA
Description: IC MPU MPC82XX 266MHZ 516BGA
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8272CZQMIBA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 266MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 266MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| MPC8272CZQPIEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
Mindestbestellmenge: 40 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| MPC8272CZQTIEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ PBGA516
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
Description: IC MPU MPC82XX 400MHZ PBGA516
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (2)
Supplier Device Package: 516-PBGA (27x27)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 516-BBGA
Packaging: Tray
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| MPC8272ZQMIBA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 266MHZ 516BGA
Description: IC MPU MPC82XX 266MHZ 516BGA
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| MPC8272ZQPIEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 300MHZ PBGA516
Packaging: Tray
Package / Case: 516-BBGA
Mounting Type: Surface Mount
Speed: 300MHz
Operating Temperature: 0°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 516-PBGA (27x27)
Ethernet: 10/100Mbps (2)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM, Security; SEC
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Security Features: Cryptography, Random Number Generator
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Produkt ist nicht verfügbar
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| MPC8272ZQTIEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 400MHZ 516BGA
Description: IC MPU MPC82XX 400MHZ 516BGA
Produkt ist nicht verfügbar
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| MPC8280CZUQLDA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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| MPC8280CZUUPEA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Description: IC MPU MPC82XX 450MHZ 480TBGA
Packaging: Tray
Package / Case: 480-LBGA Exposed Pad
Mounting Type: Surface Mount
Speed: 450MHz
Operating Temperature: -40°C ~ 105°C (TA)
Core Processor: PowerPC G2_LE
Voltage - I/O: 3.3V
Supplier Device Package: 480-TBGA (37.5x37.5)
Ethernet: 10/100Mbps (3)
USB: USB 2.0 (1)
Number of Cores/Bus Width: 1 Core, 32-Bit
Co-Processors/DSP: Communications; RISC CPM
RAM Controllers: DRAM, SDRAM
Graphics Acceleration: No
Part Status: Obsolete
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
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| MPC8280ZUQLDA |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC82XX 333MHZ 480TBGA
Additional Interfaces: I2C, SCC, SMC, SPI, UART, USART
Graphics Acceleration: No
RAM Controllers: DRAM, SDRAM
Co-Processors/DSP: Communications; RISC CPM
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 (1)
Ethernet: 10/100Mbps (3)
Supplier Device Package: 480-TBGA (37.5x37.5)
Voltage - I/O: 3.3V
Core Processor: PowerPC G2_LE
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 333MHz
Mounting Type: Surface Mount
Package / Case: 480-LBGA Exposed Pad
Packaging: Tray
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| MPC8343CVRADD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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| MPC8343CVRAGD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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Stück im Wert von UAH
| MPC8343CZQADD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: -40°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| MPC8343EVRADD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 266MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 266MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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Stück im Wert von UAH
| MPC8343EZQAGD |
|
Hersteller: NXP USA Inc.
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
Description: IC MPU MPC83XX 400MHZ 620HBGA
Additional Interfaces: DUART, I2C, PCI, SPI
Security Features: Cryptography, Random Number Generator
Graphics Acceleration: No
RAM Controllers: DDR, DDR2
Co-Processors/DSP: Security; SEC
Number of Cores/Bus Width: 1 Core, 32-Bit
USB: USB 2.0 + PHY (2)
Ethernet: 10/100/1000Mbps (3)
Supplier Device Package: 620-HBGA (29x29)
Voltage - I/O: 1.8V, 2.5V, 3.3V
Core Processor: PowerPC e300
Operating Temperature: 0°C ~ 105°C (TA)
Speed: 400MHz
Mounting Type: Surface Mount
Package / Case: 620-BBGA Exposed Pad
Packaging: Tray
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