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IR35204MTRPBF IR35204MTRPBF Infineon Technologies pb-ir35204.pdf Description: IC CTRLR PWM MULTIPHASE 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Applications: Multiphase Controller
Supplier Device Package: 40-QFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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IR35204MTRPBF IR35204MTRPBF Infineon Technologies pb-ir35204.pdf Description: IC CTRLR PWM MULTIPHASE 40QFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Applications: Multiphase Controller
Supplier Device Package: 40-QFN (5x5)
Part Status: Active
auf Bestellung 2149 Stücke:
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2+9.12 EUR
10+7 EUR
25+6.46 EUR
100+5.88 EUR
250+5.6 EUR
500+5.43 EUR
1000+5.29 EUR
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IRF60DM206ATMA1 IRF60DM206ATMA1 Infineon Technologies Infineon-IRF60DM206-DataSheet-v01_01-EN.pdf?fileId=5546d462533600a4015355e433aa19ca Description: FET N-CHANNEL
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric ME
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 80A, 10V
Power Dissipation (Max): 96W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 150µA
Supplier Device Package: DirectFET™ Isometric ME
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 200 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6530 pF @ 25 V
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IRF60DM206ATMA1 IRF60DM206ATMA1 Infineon Technologies Infineon-IRF60DM206-DataSheet-v01_01-EN.pdf?fileId=5546d462533600a4015355e433aa19ca Description: FET N-CHANNEL
Packaging: Cut Tape (CT)
Package / Case: DirectFET™ Isometric ME
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 80A, 10V
Power Dissipation (Max): 96W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 150µA
Supplier Device Package: DirectFET™ Isometric ME
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 200 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6530 pF @ 25 V
Produkt ist nicht verfügbar
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TC237L32F200SABLXUMA1 TC237L32F200SABLXUMA1 Infineon Technologies Description: IC MICROCONTROLLER
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TC1762128F80HLACKXUMA2 TC1762128F80HLACKXUMA2 Infineon Technologies INFNS12056-1.pdf?t.download=true&u=5oefqw Description: TC1762 - MICROCONTROLLER, 32-BIT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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TC1791S384F200EPABKXUMA2 Infineon Technologies Description: RISC FLASH MICROCONTROLLER, 32-B
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FF600R12KE4EBOSA2 Infineon Technologies INFNS14530-1.pdf?t.download=true&u=5oefqw Description: FF600R12KE4_E - 1200 V, 600 A CO
Packaging: Bulk
Part Status: Active
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1EDB7275FXUMA1 1EDB7275FXUMA1 Infineon Technologies Infineon-1EDB7275F-DataSheet-v02_02-EN.pdf?fileId=8ac78c8c7d0d8da4017d26f99f1b3376 Description: DIGITAL ISO 3KV 1CH GT DVR DSO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 5.4A, 9.8A
Technology: Magnetic Coupling
Current - Output High, Low: 5.4A, 9.8A
Voltage - Isolation: 3000Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 8.3ns, 5ns
Common Mode Transient Immunity (Min): 300V/ns
Pulse Width Distortion (Max): 2ns
Number of Channels: 1
Voltage - Output Supply: 4.5V ~ 20V
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1EDB7275FXUMA1 1EDB7275FXUMA1 Infineon Technologies Infineon-1EDB7275F-DataSheet-v02_02-EN.pdf?fileId=8ac78c8c7d0d8da4017d26f99f1b3376 Description: DIGITAL ISO 3KV 1CH GT DVR DSO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 5.4A, 9.8A
Technology: Magnetic Coupling
Current - Output High, Low: 5.4A, 9.8A
Voltage - Isolation: 3000Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 8.3ns, 5ns
Common Mode Transient Immunity (Min): 300V/ns
Pulse Width Distortion (Max): 2ns
Number of Channels: 1
Voltage - Output Supply: 4.5V ~ 20V
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T830N12TOFXPSA1 T830N12TOFXPSA1 Infineon Technologies T830N.pdf Description: SCR MODULE 1800V 1500A DO200AB
Packaging: Tray
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 14500A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 844 A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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PEB2236NV2.1 PEB2236NV2.1 Infineon Technologies SIEMD00111-187.pdf?t.download=true&u=5oefqw Description: ISDN PRIMARY ACCESS TRANSCEICER
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PEB2236NV2.1GIPAT-2 PEB2236NV2.1GIPAT-2 Infineon Technologies SIEMD00111-187.pdf?t.download=true&u=5oefqw Description: ISDN PRIMARY ACCESS TRANSCEICER
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PEB2236NV2.1-GIPAT-2 Infineon Technologies SIEMD00111-187.pdf?t.download=true&u=5oefqw Description: ISDN PRIMARY ACCESS TRANSCEICER
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TLE4997A8DXUMA1 TLE4997A8DXUMA1 Infineon Technologies Infineon-TLE4997A8D_DS-DS-v01_00-EN.pdf?fileId=5546d4625b62cd8a015bc87f823f319f Description: SENSOR HALL EFFECT ANALOG TDSO-8
Features: Programmable
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Bandwidth: 1.32kHz
Technology: Hall Effect
Resolution: 12 b
Sensing Range: ±50mT ~ ±200mT
Current - Output (Max): 1mA
Current - Supply (Max): 10mA
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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2500+4.35 EUR
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TLE4997A8DXUMA1 TLE4997A8DXUMA1 Infineon Technologies Infineon-TLE4997A8D_DS-DS-v01_00-EN.pdf?fileId=5546d4625b62cd8a015bc87f823f319f Description: SENSOR HALL EFFECT ANALOG TDSO-8
Features: Programmable
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Bandwidth: 1.32kHz
Technology: Hall Effect
Resolution: 12 b
Sensing Range: ±50mT ~ ±200mT
Current - Output (Max): 1mA
Current - Supply (Max): 10mA
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
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3+7.59 EUR
5+6.8 EUR
10+6.51 EUR
25+6.17 EUR
50+5.93 EUR
100+5.72 EUR
500+5.33 EUR
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SAL-TC290TC-96F300 BC SAL-TC290TC-96F300 BC Infineon Technologies Infineon-TC29xBC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 6MB FLASH DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 170°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: Die
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA38820AUMA1 TDA38820AUMA1 Infineon Technologies Infineon-TDA38820-DataSheet-v02_40-EN.pdf?fileId=8ac78c8c7c03edb4017c0fcf29b21166&ack=t Description: IC REG BUCK ADJ 20A IQFN-29-1
Packaging: Tape & Reel (TR)
Package / Case: 29-PowerVFQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 20A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz ~ 2MHz
Voltage - Input (Max): 17V
Topology: Buck
Supplier Device Package: PG-IQFN-29-1
Synchronous Rectifier: Yes
Voltage - Output (Max): 6V
Voltage - Input (Min): 2V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
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TDA38820AUMA1 TDA38820AUMA1 Infineon Technologies Infineon-TDA38820-DataSheet-v02_40-EN.pdf?fileId=8ac78c8c7c03edb4017c0fcf29b21166&ack=t Description: IC REG BUCK ADJ 20A IQFN-29-1
Packaging: Cut Tape (CT)
Package / Case: 29-PowerVFQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 20A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz ~ 2MHz
Voltage - Input (Max): 17V
Topology: Buck
Supplier Device Package: PG-IQFN-29-1
Synchronous Rectifier: Yes
Voltage - Output (Max): 6V
Voltage - Input (Min): 2V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
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3+6.51 EUR
10+4.93 EUR
25+4.53 EUR
100+4.09 EUR
250+3.88 EUR
500+3.75 EUR
1000+3.65 EUR
2500+3.54 EUR
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FS600R07A2E3B32BOSA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: IGBT MODULES
Packaging: Bulk
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FS600R07A2E3B32BOSA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: IGBT MODULES
Packaging: Tray
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BFP520FH6327XTSA1 BFP520FH6327XTSA1 Infineon Technologies Infineon-BFP540ESD-DS-v02_00-EN.pdf?fileId=5546d462689a790c01690f0382ea3920 Description: RF TRANS NPN 3.5V 45GHZ 4-TSFP
Packaging: Bulk
Package / Case: 4-SMD, Flat Leads
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 22.5dB
Power - Max: 100mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 3.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 20mA, 2V
Frequency - Transition: 45GHz
Noise Figure (dB Typ @ f): 0.95dB @ 1.8GHz
Supplier Device Package: 4-TSFP
Part Status: Active
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1517+0.31 EUR
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IRF150DM115XTMA1 IRF150DM115XTMA1 Infineon Technologies Infineon-IRF150DM115-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c8eeb092c018f84c543dc4d4e Description: TRENCH >=100V DIRECTFET
Packaging: Tape & Reel (TR)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Drain to Source Voltage (Vdss): 150 V
Produkt ist nicht verfügbar
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MB89F202P-G-SH-SNE1 Infineon Technologies Description: IC MCU 8BIT 16KB FLASH 32-SH-DIP
Packaging: Bulk
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
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MB89F202AP-G-SH-SNE1 Infineon Technologies Description: IC MCU 8BIT 16KB FLASH 32-SH-DIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
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MB89202P-G-115-SH-CNE1 Infineon Technologies Description: IC MCU 8BIT 16KB MROM 32-SH-DIP
Packaging: Bulk
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
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MB89F202RAP-G-SH-SNE1 Infineon Technologies Description: IC MCU 8BIT 16KB FLASH 32-SH-DIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
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MB89202P-G-119-SH-CNE1 Infineon Technologies Description: IC MCU 8BIT 16KB MROM 32-SH-DIP
Packaging: Bulk
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DHP1140N08P5AUMA1 Infineon Technologies Description: IC GATE DRVR
Packaging: Tape & Reel (TR)
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
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DHP0140N08P5AUMA1 Infineon Technologies Description: IC GATE DRVR
Packaging: Tape & Reel (TR)
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPU50R3K0CEBKMA1 IPU50R3K0CEBKMA1 Infineon Technologies IPx50R3K0CE.pdf Description: MOSFET N-CH 500V 1.7A TO251-3
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Tc)
Rds On (Max) @ Id, Vgs: 3Ohm @ 400mA, 13V
Power Dissipation (Max): 18W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 30µA
Supplier Device Package: PG-TO251-3
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 4.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 84 pF @ 100 V
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BPLUSOFFLOADBOARDTOBO1 BPLUSOFFLOADBOARDTOBO1 Infineon Technologies Infineon-LITIX_Basic+_Offload_Board-PP-v01_00-EN.pdf?fileId=5546d462677d0f460167a839aa5c15e3 Description: EVAL BOARD FOR TLD1114-1EP
Features: Dimmable
Packaging: Bulk
Voltage - Output: 5V ~ 7V
Voltage - Input: 8V ~ 16V
Contents: Board(s)
Current - Output / Channel: 360mA
Utilized IC / Part: TLD1114-1EP
Supplied Contents: Board(s)
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
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XC2286M104F66LABHXUMA1 XC2286M104F66LABHXUMA1 Infineon Technologies Infineon-SAK-XC2287M-104F80LR%20AB-DataSheet-v02_12-EN.pdf?fileId=5546d4626b2d8e69016b4684591f3042 Description: 16-BIT C166 MICROCONTROLLER - XC
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CY8C3666LTI-050 CY8C3666LTI-050 Infineon Technologies #!?fileId=8ac78c8c7d0d8da4017d0ec73d263e88 Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 8051
Data Converters: A/D 16x12b; D/A 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
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SAK-XC2234L20F66LRAAKXUMA1 SAK-XC2234L20F66LRAAKXUMA1 Infineon Technologies Infineon-XC223XL-DS-v01_03-EN.pdf?fileId=5546d4624bcaebcf014c30fa4491268b Description: 16 BIT C166 MICROXC2200 FAMILY (
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 19x12b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-22
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
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XMC1404F064X0200AAXUMA1 XMC1404F064X0200AAXUMA1 Infineon Technologies Infineon-XMC1400-DS-v01_03-EN.pdf?fileId=5546d46250cc1fdf015110a2596343b2 Description: IC MCU 32BIT 200KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 200KB (200K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-26
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
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SAF-XC164CM-16F20F BA SAF-XC164CM-16F20F BA Infineon Technologies xc164cm_ds_v1.4_2007_03.pdf?fileId=db3a304412b407950112b40c0f3c0a1b&ack=t Description: IC MCU 16BIT 128KB FLASH 64LQFP
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SAF-XC164SM-16F40F BA SAF-XC164SM-16F40F BA Infineon Technologies XC164SM.pdf Description: IC MCU 16BIT 128KB FLASH 64LQFP
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SAX-XC878-16FFA 5V AA SAX-XC878-16FFA 5V AA Infineon Technologies Infineon-XC87X-DS-v01_05-en.pdf?fileId=db3a30432239cccd01231293d56908b1&ack=t Description: IC MCU 8BIT 64KB FLASH 64LQFP
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IPB05N03LB G IPB05N03LB G Infineon Technologies IPB05N03LB_Rev0.94_G.pdf Description: MOSFET N-CH 30V 80A TO263-3
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IPB05N03LA IPB05N03LA Infineon Technologies IPB05N03LA_Rev1.7_G.pdf Description: MOSFET N-CH 25V 80A TO263-3
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 80A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 55A, 10V
Power Dissipation (Max): 94W (Tc)
Vgs(th) (Max) @ Id: 2V @ 50µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3110 pF @ 15 V
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IPB05N03LA G IPB05N03LA G Infineon Technologies IPB05N03LA_Rev1.7_G.pdf Description: MOSFET N-CH 25V 80A TO263-3
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CY9BF164KPMC-G-JNE2 CY9BF164KPMC-G-JNE2 Infineon Technologies Infineon-MB9B160L_Series_32-Bit_ARM_Cortex_-M4F_FM4_Microcontroller-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c81fb7ad20182159c3fb45f28 Description: IC MCU 32BIT 288KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 33
DigiKey Programmable: Not Verified
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DD1000S33HE3B60BOSA1 Infineon Technologies Description: DIODE MODULE GP 3300V AGIHVB1303
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 1000A (DC)
Supplier Device Package: AG-IHVB130-3
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 3300 V
Voltage - Forward (Vf) (Max) @ If: 3.85 V @ 1000 A
Current - Reverse Leakage @ Vr: 1000 A @ 1800 V
Produkt ist nicht verfügbar
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PXF4333EV1.1 Infineon Technologies Description: ABM 3G ATM BUFFER MANAGER
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BGB717L7ESDE6327XTSA1 BGB717L7ESDE6327XTSA1 Infineon Technologies BGB717L7ESD.pdf Description: IC AMP FM 76MHZ-108MHZ TSLP7-1
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 76MHz ~ 108MHz
RF Type: FM
Voltage - Supply: 1.8V ~ 4V
Gain: 12dB
Current - Supply: 3mA
Noise Figure: 1dB
P1dB: -5.5dBm
Test Frequency: 100MHz
Supplier Device Package: PG-TSLP-7-1
Part Status: Obsolete
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550+0.83 EUR
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PTFA091503ELV4R0XTMA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: RF MOSFET LDMOS 30V H-33288-6
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CY7C1480BV25-200BZXC CY7C1480BV25-200BZXC Infineon Technologies Infineon-CY7C1480BV25_72-Mbit_(2_M_36)_Pipelined_Sync_SRAM-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec4514c39be Description: IC SRAM 72MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 72Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 200 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (15x17)
Memory Interface: Parallel
Access Time: 3 ns
Memory Organization: 2M x 36
DigiKey Programmable: Not Verified
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CY7C1513KV18-250BZXC CY7C1513KV18-250BZXC Infineon Technologies Infineon-CY7C1526KV18_CY7C1513KV18_CY7C1515KV18_72-Mbit_QDR(R)_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v24_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe15e1314b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_gl Description: IC SRAM 72MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 72Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 4M x 18
DigiKey Programmable: Not Verified
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40+50.78 EUR
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CY7C1262XV18-450BZXC CY7C1262XV18-450BZXC Infineon Technologies Infineon-CY7C1262XV18_CY7C1264XV18_36-Mbit_QDR_II+_Xtreme_SRAM_Two-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)-DataSheet-v08_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec27b0d376c&utm_source=cypress&utm_medium=referral&utm_ca Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 450 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 2M x 18
DigiKey Programmable: Not Verified
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CY7C1321KV18-250BZXC CY7C1321KV18-250BZXC Infineon Technologies download Description: IC SRAM 18MBIT PARALLEL 165FBGA
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CY7C2663KV18-550BZXC CY7C2663KV18-550BZXC Infineon Technologies Infineon-CY7C2663KV18_CY7C2665KV18_144-Mbit_QDR_II+_SRAM_Four-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)_with_ODT-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec22b793711 Description: IC SRAM 144MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 144Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 550 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (15x17)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 8M x 18
DigiKey Programmable: Not Verified
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IKD08N65ET6ARMA1 IKD08N65ET6ARMA1 Infineon Technologies Infineon-IKD08N65ET6-DataSheet-v02_03-EN.pdf?fileId=5546d462766a0c1701766c3586b20ddb Description: IGBT TRENCH FS 650V 15A TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 43 ns
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 5A
Supplier Device Package: PG-TO252-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 20ns/59ns
Switching Energy: 110µJ (on), 40µJ (off)
Test Condition: 400V, 5A, 47Ohm, 15V
Gate Charge: 17 nC
Part Status: Not For New Designs
Current - Collector (Ic) (Max): 15 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 25 A
Power - Max: 47 W
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IKD08N65ET6ARMA1 IKD08N65ET6ARMA1 Infineon Technologies Infineon-IKD08N65ET6-DataSheet-v02_03-EN.pdf?fileId=5546d462766a0c1701766c3586b20ddb Description: IGBT TRENCH FS 650V 15A TO252-3
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 43 ns
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 5A
Supplier Device Package: PG-TO252-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 20ns/59ns
Switching Energy: 110µJ (on), 40µJ (off)
Test Condition: 400V, 5A, 47Ohm, 15V
Gate Charge: 17 nC
Part Status: Not For New Designs
Current - Collector (Ic) (Max): 15 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 25 A
Power - Max: 47 W
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4+4.95 EUR
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100+2.23 EUR
500+1.81 EUR
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FZ1800R45HL4BPSA1 FZ1800R45HL4BPSA1 Infineon Technologies Infineon-FZ1800R45HL4-DataSheet-v01_00-EN.pdf?fileId=5546d46278d64ffd0178f97d00ef0572 Description: IHV IHM T XHP 3 3-6 5K AG-IHVB19
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 3 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.8V @ 15V, 1.8kA
NTC Thermistor: No
Supplier Device Package: AG-IHVB190
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1800 A
Voltage - Collector Emitter Breakdown (Max): 4500 V
Power - Max: 4000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 297 nF @ 25 V
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FZ1800R45HL4S7BPSA1 FZ1800R45HL4S7BPSA1 Infineon Technologies Infineon-FZ1800R45HL4_S7-DataSheet-v01_00-EN.pdf?fileId=5546d46278d64ffd0178f97d2610057b Description: IGBT MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.6V @ 25V, 1800A
NTC Thermistor: No
Supplier Device Package: AG-IHVB190
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1800 A
Voltage - Collector Emitter Breakdown (Max): 4500 V
Power - Max: 4000000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 297 nF @ 25 V
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FZ1800R16KF4NOSA1 Infineon Technologies Description: FZ1800R16 - IGBT MODULE
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FZ1800R16KF4S1NOSA1 Infineon Technologies Description: IGBT MODULE
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TLE4250G Infineon Technologies Infineon-TLE4250-2G-DS-v01_00-EN.pdf?fileId=5546d46259d9a4bf0159f9180c1e39fc Description: IC REG LIN PWR SUPPLY SUP CIRC
Packaging: Bulk
Part Status: Active
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TLE42502GHTMA2 Infineon Technologies Description: IC REG LINEAR VOLTAGE REG
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IR35204MTRPBF pb-ir35204.pdf
IR35204MTRPBF
Hersteller: Infineon Technologies
Description: IC CTRLR PWM MULTIPHASE 40QFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Applications: Multiphase Controller
Supplier Device Package: 40-QFN (5x5)
Part Status: Active
Produkt ist nicht verfügbar
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IR35204MTRPBF pb-ir35204.pdf
IR35204MTRPBF
Hersteller: Infineon Technologies
Description: IC CTRLR PWM MULTIPHASE 40QFN
Packaging: Cut Tape (CT)
Package / Case: 40-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3.3V
Applications: Multiphase Controller
Supplier Device Package: 40-QFN (5x5)
Part Status: Active
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2+9.12 EUR
10+7 EUR
25+6.46 EUR
100+5.88 EUR
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1000+5.29 EUR
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IRF60DM206ATMA1 Infineon-IRF60DM206-DataSheet-v01_01-EN.pdf?fileId=5546d462533600a4015355e433aa19ca
IRF60DM206ATMA1
Hersteller: Infineon Technologies
Description: FET N-CHANNEL
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric ME
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 80A, 10V
Power Dissipation (Max): 96W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 150µA
Supplier Device Package: DirectFET™ Isometric ME
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 200 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6530 pF @ 25 V
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IRF60DM206ATMA1 Infineon-IRF60DM206-DataSheet-v01_01-EN.pdf?fileId=5546d462533600a4015355e433aa19ca
IRF60DM206ATMA1
Hersteller: Infineon Technologies
Description: FET N-CHANNEL
Packaging: Cut Tape (CT)
Package / Case: DirectFET™ Isometric ME
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 130A (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 80A, 10V
Power Dissipation (Max): 96W (Tc)
Vgs(th) (Max) @ Id: 3.7V @ 150µA
Supplier Device Package: DirectFET™ Isometric ME
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 200 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6530 pF @ 25 V
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TC237L32F200SABLXUMA1
TC237L32F200SABLXUMA1
Hersteller: Infineon Technologies
Description: IC MICROCONTROLLER
Produkt ist nicht verfügbar
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TC1762128F80HLACKXUMA2 INFNS12056-1.pdf?t.download=true&u=5oefqw
TC1762128F80HLACKXUMA2
Hersteller: Infineon Technologies
Description: TC1762 - MICROCONTROLLER, 32-BIT
Packaging: Bulk
Part Status: Active
DigiKey Programmable: Not Verified
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12+42.47 EUR
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TC1791S384F200EPABKXUMA2
Hersteller: Infineon Technologies
Description: RISC FLASH MICROCONTROLLER, 32-B
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FF600R12KE4EBOSA2 INFNS14530-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: FF600R12KE4_E - 1200 V, 600 A CO
Packaging: Bulk
Part Status: Active
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1EDB7275FXUMA1 Infineon-1EDB7275F-DataSheet-v02_02-EN.pdf?fileId=8ac78c8c7d0d8da4017d26f99f1b3376
1EDB7275FXUMA1
Hersteller: Infineon Technologies
Description: DIGITAL ISO 3KV 1CH GT DVR DSO8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 5.4A, 9.8A
Technology: Magnetic Coupling
Current - Output High, Low: 5.4A, 9.8A
Voltage - Isolation: 3000Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 8.3ns, 5ns
Common Mode Transient Immunity (Min): 300V/ns
Pulse Width Distortion (Max): 2ns
Number of Channels: 1
Voltage - Output Supply: 4.5V ~ 20V
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1EDB7275FXUMA1 Infineon-1EDB7275F-DataSheet-v02_02-EN.pdf?fileId=8ac78c8c7d0d8da4017d26f99f1b3376
1EDB7275FXUMA1
Hersteller: Infineon Technologies
Description: DIGITAL ISO 3KV 1CH GT DVR DSO8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 5.4A, 9.8A
Technology: Magnetic Coupling
Current - Output High, Low: 5.4A, 9.8A
Voltage - Isolation: 3000Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 8.3ns, 5ns
Common Mode Transient Immunity (Min): 300V/ns
Pulse Width Distortion (Max): 2ns
Number of Channels: 1
Voltage - Output Supply: 4.5V ~ 20V
auf Bestellung 305 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.66 EUR
10+1.96 EUR
25+1.78 EUR
100+1.58 EUR
250+1.49 EUR
Mindestbestellmenge: 7
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T830N12TOFXPSA1 T830N.pdf
T830N12TOFXPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1800V 1500A DO200AB
Packaging: Tray
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 14500A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 844 A
Voltage - Gate Trigger (Vgt) (Max): 1.5 V
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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PEB2236NV2.1 SIEMD00111-187.pdf?t.download=true&u=5oefqw
PEB2236NV2.1
Hersteller: Infineon Technologies
Description: ISDN PRIMARY ACCESS TRANSCEICER
Produkt ist nicht verfügbar
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PEB2236NV2.1GIPAT-2 SIEMD00111-187.pdf?t.download=true&u=5oefqw
PEB2236NV2.1GIPAT-2
Hersteller: Infineon Technologies
Description: ISDN PRIMARY ACCESS TRANSCEICER
Produkt ist nicht verfügbar
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PEB2236NV2.1-GIPAT-2 SIEMD00111-187.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: ISDN PRIMARY ACCESS TRANSCEICER
Produkt ist nicht verfügbar
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TLE4997A8DXUMA1 Infineon-TLE4997A8D_DS-DS-v01_00-EN.pdf?fileId=5546d4625b62cd8a015bc87f823f319f
TLE4997A8DXUMA1
Hersteller: Infineon Technologies
Description: SENSOR HALL EFFECT ANALOG TDSO-8
Features: Programmable
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Bandwidth: 1.32kHz
Technology: Hall Effect
Resolution: 12 b
Sensing Range: ±50mT ~ ±200mT
Current - Output (Max): 1mA
Current - Supply (Max): 10mA
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+4.35 EUR
Mindestbestellmenge: 2500
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TLE4997A8DXUMA1 Infineon-TLE4997A8D_DS-DS-v01_00-EN.pdf?fileId=5546d4625b62cd8a015bc87f823f319f
TLE4997A8DXUMA1
Hersteller: Infineon Technologies
Description: SENSOR HALL EFFECT ANALOG TDSO-8
Features: Programmable
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: Analog Voltage
Mounting Type: Surface Mount
Axis: Single
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 4.5V ~ 5.5V
Bandwidth: 1.32kHz
Technology: Hall Effect
Resolution: 12 b
Sensing Range: ±50mT ~ ±200mT
Current - Output (Max): 1mA
Current - Supply (Max): 10mA
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 9585 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.59 EUR
5+6.8 EUR
10+6.51 EUR
25+6.17 EUR
50+5.93 EUR
100+5.72 EUR
500+5.33 EUR
Mindestbestellmenge: 3
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SAL-TC290TC-96F300 BC Infineon-TC29xBC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
SAL-TC290TC-96F300 BC
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH DIE
Packaging: Tape & Reel (TR)
Package / Case: Die
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 170°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: Die
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TDA38820AUMA1 Infineon-TDA38820-DataSheet-v02_40-EN.pdf?fileId=8ac78c8c7c03edb4017c0fcf29b21166&ack=t
TDA38820AUMA1
Hersteller: Infineon Technologies
Description: IC REG BUCK ADJ 20A IQFN-29-1
Packaging: Tape & Reel (TR)
Package / Case: 29-PowerVFQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 20A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz ~ 2MHz
Voltage - Input (Max): 17V
Topology: Buck
Supplier Device Package: PG-IQFN-29-1
Synchronous Rectifier: Yes
Voltage - Output (Max): 6V
Voltage - Input (Min): 2V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
Produkt ist nicht verfügbar
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TDA38820AUMA1 Infineon-TDA38820-DataSheet-v02_40-EN.pdf?fileId=8ac78c8c7c03edb4017c0fcf29b21166&ack=t
TDA38820AUMA1
Hersteller: Infineon Technologies
Description: IC REG BUCK ADJ 20A IQFN-29-1
Packaging: Cut Tape (CT)
Package / Case: 29-PowerVFQFN
Output Type: Adjustable
Mounting Type: Surface Mount
Number of Outputs: 1
Function: Step-Down
Current - Output: 20A
Operating Temperature: -40°C ~ 125°C (TJ)
Output Configuration: Positive
Frequency - Switching: 600kHz ~ 2MHz
Voltage - Input (Max): 17V
Topology: Buck
Supplier Device Package: PG-IQFN-29-1
Synchronous Rectifier: Yes
Voltage - Output (Max): 6V
Voltage - Input (Min): 2V
Voltage - Output (Min/Fixed): 0.6V
Part Status: Active
auf Bestellung 4550 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.51 EUR
10+4.93 EUR
25+4.53 EUR
100+4.09 EUR
250+3.88 EUR
500+3.75 EUR
1000+3.65 EUR
2500+3.54 EUR
Mindestbestellmenge: 3
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FS600R07A2E3B32BOSA1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: IGBT MODULES
Packaging: Bulk
auf Bestellung 305 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1166.26 EUR
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FS600R07A2E3B32BOSA1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: IGBT MODULES
Packaging: Tray
Produkt ist nicht verfügbar
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BFP520FH6327XTSA1 Infineon-BFP540ESD-DS-v02_00-EN.pdf?fileId=5546d462689a790c01690f0382ea3920
BFP520FH6327XTSA1
Hersteller: Infineon Technologies
Description: RF TRANS NPN 3.5V 45GHZ 4-TSFP
Packaging: Bulk
Package / Case: 4-SMD, Flat Leads
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 22.5dB
Power - Max: 100mW
Current - Collector (Ic) (Max): 40mA
Voltage - Collector Emitter Breakdown (Max): 3.5V
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 20mA, 2V
Frequency - Transition: 45GHz
Noise Figure (dB Typ @ f): 0.95dB @ 1.8GHz
Supplier Device Package: 4-TSFP
Part Status: Active
auf Bestellung 599723 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1517+0.31 EUR
Mindestbestellmenge: 1517
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IRF150DM115XTMA1 Infineon-IRF150DM115-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c8eeb092c018f84c543dc4d4e
IRF150DM115XTMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V DIRECTFET
Packaging: Tape & Reel (TR)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Part Status: Active
Drain to Source Voltage (Vdss): 150 V
Produkt ist nicht verfügbar
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MB89F202P-G-SH-SNE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 32-SH-DIP
Packaging: Bulk
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB89F202AP-G-SH-SNE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 32-SH-DIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB89202P-G-115-SH-CNE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB MROM 32-SH-DIP
Packaging: Bulk
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB89F202RAP-G-SH-SNE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 32-SH-DIP
Packaging: Tube
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB89202P-G-119-SH-CNE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB MROM 32-SH-DIP
Packaging: Bulk
Package / Case: 32-SDIP (0.400", 10.16mm)
Mounting Type: Through Hole
Speed: 12.5MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: Mask ROM
Core Processor: F²MC-8L
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: Serial I/O, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-SDIP
Number of I/O: 26
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DHP1140N08P5AUMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR
Packaging: Tape & Reel (TR)
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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DHP0140N08P5AUMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR
Packaging: Tape & Reel (TR)
Part Status: Not For New Designs
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPU50R3K0CEBKMA1 IPx50R3K0CE.pdf
IPU50R3K0CEBKMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 1.7A TO251-3
Packaging: Tube
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 1.7A (Tc)
Rds On (Max) @ Id, Vgs: 3Ohm @ 400mA, 13V
Power Dissipation (Max): 18W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 30µA
Supplier Device Package: PG-TO251-3
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 4.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 84 pF @ 100 V
auf Bestellung 25539 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2597+0.19 EUR
Mindestbestellmenge: 2597
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BPLUSOFFLOADBOARDTOBO1 Infineon-LITIX_Basic+_Offload_Board-PP-v01_00-EN.pdf?fileId=5546d462677d0f460167a839aa5c15e3
BPLUSOFFLOADBOARDTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR TLD1114-1EP
Features: Dimmable
Packaging: Bulk
Voltage - Output: 5V ~ 7V
Voltage - Input: 8V ~ 16V
Contents: Board(s)
Current - Output / Channel: 360mA
Utilized IC / Part: TLD1114-1EP
Supplied Contents: Board(s)
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+231.26 EUR
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XC2286M104F66LABHXUMA1 Infineon-SAK-XC2287M-104F80LR%20AB-DataSheet-v02_12-EN.pdf?fileId=5546d4626b2d8e69016b4684591f3042
XC2286M104F66LABHXUMA1
Hersteller: Infineon Technologies
Description: 16-BIT C166 MICROCONTROLLER - XC
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
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CY8C3666LTI-050 #!?fileId=8ac78c8c7d0d8da4017d0ec73d263e88
CY8C3666LTI-050
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 64KB FLASH 48QFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 8051
Data Converters: A/D 16x12b; D/A 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: EBI/EMI, I²C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAK-XC2234L20F66LRAAKXUMA1 Infineon-XC223XL-DS-v01_03-EN.pdf?fileId=5546d4624bcaebcf014c30fa4491268b
SAK-XC2234L20F66LRAAKXUMA1
Hersteller: Infineon Technologies
Description: 16 BIT C166 MICROXC2200 FAMILY (
Packaging: Bulk
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 66MHz
Program Memory Size: 160KB (160K x 8)
RAM Size: 10K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 19x12b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-22
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC1404F064X0200AAXUMA1 Infineon-XMC1400-DS-v01_03-EN.pdf?fileId=5546d46250cc1fdf015110a2596343b2
XMC1404F064X0200AAXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 200KB FLASH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 200KB (200K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 12x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-26
Part Status: Active
Number of I/O: 48
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF-XC164CM-16F20F BA xc164cm_ds_v1.4_2007_03.pdf?fileId=db3a304412b407950112b40c0f3c0a1b&ack=t
SAF-XC164CM-16F20F BA
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
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SAF-XC164SM-16F40F BA XC164SM.pdf
SAF-XC164SM-16F40F BA
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 64LQFP
Produkt ist nicht verfügbar
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SAX-XC878-16FFA 5V AA Infineon-XC87X-DS-v01_05-en.pdf?fileId=db3a30432239cccd01231293d56908b1&ack=t
SAX-XC878-16FFA 5V AA
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 64KB FLASH 64LQFP
Produkt ist nicht verfügbar
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IPB05N03LB G IPB05N03LB_Rev0.94_G.pdf
IPB05N03LB G
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 80A TO263-3
Produkt ist nicht verfügbar
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IPB05N03LA IPB05N03LA_Rev1.7_G.pdf
IPB05N03LA
Hersteller: Infineon Technologies
Description: MOSFET N-CH 25V 80A TO263-3
Packaging: Bulk
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 80A (Tc)
Rds On (Max) @ Id, Vgs: 4.6mOhm @ 55A, 10V
Power Dissipation (Max): 94W (Tc)
Vgs(th) (Max) @ Id: 2V @ 50µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3110 pF @ 15 V
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
507+0.99 EUR
Mindestbestellmenge: 507
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IPB05N03LA G IPB05N03LA_Rev1.7_G.pdf
IPB05N03LA G
Hersteller: Infineon Technologies
Description: MOSFET N-CH 25V 80A TO263-3
Produkt ist nicht verfügbar
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CY9BF164KPMC-G-JNE2 Infineon-MB9B160L_Series_32-Bit_ARM_Cortex_-M4F_FM4_Microcontroller-DataSheet-v03_00-EN.pdf?fileId=8ac78c8c81fb7ad20182159c3fb45f28
CY9BF164KPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 8x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 33
DigiKey Programmable: Not Verified
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DD1000S33HE3B60BOSA1
Hersteller: Infineon Technologies
Description: DIODE MODULE GP 3300V AGIHVB1303
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Current - Average Rectified (Io) (per Diode): 1000A (DC)
Supplier Device Package: AG-IHVB130-3
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 3300 V
Voltage - Forward (Vf) (Max) @ If: 3.85 V @ 1000 A
Current - Reverse Leakage @ Vr: 1000 A @ 1800 V
Produkt ist nicht verfügbar
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PXF4333EV1.1
Hersteller: Infineon Technologies
Description: ABM 3G ATM BUFFER MANAGER
Produkt ist nicht verfügbar
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BGB717L7ESDE6327XTSA1 BGB717L7ESD.pdf
BGB717L7ESDE6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP FM 76MHZ-108MHZ TSLP7-1
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 76MHz ~ 108MHz
RF Type: FM
Voltage - Supply: 1.8V ~ 4V
Gain: 12dB
Current - Supply: 3mA
Noise Figure: 1dB
P1dB: -5.5dBm
Test Frequency: 100MHz
Supplier Device Package: PG-TSLP-7-1
Part Status: Obsolete
auf Bestellung 202500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
550+0.83 EUR
Mindestbestellmenge: 550
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PTFA091503ELV4R0XTMA1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: RF MOSFET LDMOS 30V H-33288-6
Produkt ist nicht verfügbar
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CY7C1480BV25-200BZXC Infineon-CY7C1480BV25_72-Mbit_(2_M_36)_Pipelined_Sync_SRAM-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec4514c39be
CY7C1480BV25-200BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 72MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 72Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 2.375V ~ 2.625V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 200 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (15x17)
Memory Interface: Parallel
Access Time: 3 ns
Memory Organization: 2M x 36
DigiKey Programmable: Not Verified
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Anzahl Preis
1+87.6 EUR
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CY7C1513KV18-250BZXC Infineon-CY7C1526KV18_CY7C1513KV18_CY7C1515KV18_72-Mbit_QDR(R)_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v24_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe15e1314b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_gl
CY7C1513KV18-250BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 72MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 72Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 4M x 18
DigiKey Programmable: Not Verified
auf Bestellung 233 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+64.47 EUR
10+55.37 EUR
25+52.26 EUR
40+50.78 EUR
136+47.24 EUR
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CY7C1262XV18-450BZXC Infineon-CY7C1262XV18_CY7C1264XV18_36-Mbit_QDR_II+_Xtreme_SRAM_Two-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)-DataSheet-v08_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec27b0d376c&utm_source=cypress&utm_medium=referral&utm_ca
CY7C1262XV18-450BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 450 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 2M x 18
DigiKey Programmable: Not Verified
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+49.74 EUR
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CY7C1321KV18-250BZXC download
CY7C1321KV18-250BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.4 EUR
Mindestbestellmenge: 2
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CY7C2663KV18-550BZXC Infineon-CY7C2663KV18_CY7C2665KV18_144-Mbit_QDR_II+_SRAM_Four-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)_with_ODT-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec22b793711
CY7C2663KV18-550BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 144MBIT PAR 165FBGA
Packaging: Bulk
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 144Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 550 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (15x17)
Part Status: Active
Memory Interface: Parallel
Memory Organization: 8M x 18
DigiKey Programmable: Not Verified
auf Bestellung 19 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+745.84 EUR
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IKD08N65ET6ARMA1 Infineon-IKD08N65ET6-DataSheet-v02_03-EN.pdf?fileId=5546d462766a0c1701766c3586b20ddb
IKD08N65ET6ARMA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 15A TO252-3
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 43 ns
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 5A
Supplier Device Package: PG-TO252-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 20ns/59ns
Switching Energy: 110µJ (on), 40µJ (off)
Test Condition: 400V, 5A, 47Ohm, 15V
Gate Charge: 17 nC
Part Status: Not For New Designs
Current - Collector (Ic) (Max): 15 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 25 A
Power - Max: 47 W
Produkt ist nicht verfügbar
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IKD08N65ET6ARMA1 Infineon-IKD08N65ET6-DataSheet-v02_03-EN.pdf?fileId=5546d462766a0c1701766c3586b20ddb
IKD08N65ET6ARMA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 15A TO252-3
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 43 ns
Vce(on) (Max) @ Vge, Ic: 1.9V @ 15V, 5A
Supplier Device Package: PG-TO252-3
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 20ns/59ns
Switching Energy: 110µJ (on), 40µJ (off)
Test Condition: 400V, 5A, 47Ohm, 15V
Gate Charge: 17 nC
Part Status: Not For New Designs
Current - Collector (Ic) (Max): 15 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 25 A
Power - Max: 47 W
auf Bestellung 2994 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.95 EUR
10+3.22 EUR
100+2.23 EUR
500+1.81 EUR
1000+1.68 EUR
Mindestbestellmenge: 4
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FZ1800R45HL4BPSA1 Infineon-FZ1800R45HL4-DataSheet-v01_00-EN.pdf?fileId=5546d46278d64ffd0178f97d00ef0572
FZ1800R45HL4BPSA1
Hersteller: Infineon Technologies
Description: IHV IHM T XHP 3 3-6 5K AG-IHVB19
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 3 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.8V @ 15V, 1.8kA
NTC Thermistor: No
Supplier Device Package: AG-IHVB190
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1800 A
Voltage - Collector Emitter Breakdown (Max): 4500 V
Power - Max: 4000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 297 nF @ 25 V
auf Bestellung 3 Stücke:
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Anzahl Preis
1+3641.81 EUR
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FZ1800R45HL4S7BPSA1 Infineon-FZ1800R45HL4_S7-DataSheet-v01_00-EN.pdf?fileId=5546d46278d64ffd0178f97d2610057b
FZ1800R45HL4S7BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.6V @ 25V, 1800A
NTC Thermistor: No
Supplier Device Package: AG-IHVB190
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 1800 A
Voltage - Collector Emitter Breakdown (Max): 4500 V
Power - Max: 4000000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 297 nF @ 25 V
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+3805.42 EUR
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FZ1800R16KF4NOSA1
Hersteller: Infineon Technologies
Description: FZ1800R16 - IGBT MODULE
Produkt ist nicht verfügbar
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FZ1800R16KF4S1NOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE
Produkt ist nicht verfügbar
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TLE4250G Infineon-TLE4250-2G-DS-v01_00-EN.pdf?fileId=5546d46259d9a4bf0159f9180c1e39fc
Hersteller: Infineon Technologies
Description: IC REG LIN PWR SUPPLY SUP CIRC
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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TLE42502GHTMA2
Hersteller: Infineon Technologies
Description: IC REG LINEAR VOLTAGE REG
Produkt ist nicht verfügbar
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