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CY7C63903-PVXC CY7C63903-PVXC Infineon Technologies CY7C63310%2C%20638xx%2C%20639xx.pdf Description: IC USB PERIPHERAL CTRLR 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Function: Controller
Interface: GPIO, SPI
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4V ~ 5.5V
Current - Supply: 40mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 28-SSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 5303 Stücke:
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BSC0924NDIATMA1 BSC0924NDIATMA1 Infineon Technologies Infineon-BSC0924NDI-DS-v02_00-en.pdf?fileId=db3a304336ca04c90136ceae245448f5 Description: MOSFET 2N-CH 30V 17A/32A TISON8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual) Asymmetrical
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 1W
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 17A, 32A
Input Capacitance (Ciss) (Max) @ Vds: 1160pF @ 15V
Rds On (Max) @ Id, Vgs: 5mOhm @ 20A, 10V
Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V
FET Feature: Logic Level Gate, 4.5V Drive
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-TISON-8
Part Status: Active
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12+1.59 EUR
100+1.06 EUR
500+0.83 EUR
1000+0.76 EUR
2000+0.7 EUR
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BSC0993NDATMA1 BSC0993NDATMA1 Infineon Technologies Infineon-BSC0993ND-DS-v02_00-EN.pdf?fileId=5546d46258fc0bc101598dddfb2c616c Description: MOSFET 2N-CH 17A TISON8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 17A (Ta)
Rds On (Max) @ Id, Vgs: 5mOhm @ 7A, 10V
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-TISON-8
Part Status: Not For New Designs
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12+1.54 EUR
100+1.03 EUR
500+0.81 EUR
1000+0.74 EUR
2000+0.72 EUR
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BSC096N10LS5ATMA1 BSC096N10LS5ATMA1 Infineon Technologies Infineon-BSC096N10LS5-DataSheet-v02_01-EN.pdf?fileId=5546d4626bb628d7016bdb78171e20a7 Description: MOSFET N-CH 100V 40A TDSON-8-6
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 9.6mOhm @ 20A, 10V
Power Dissipation (Max): 3W (Ta), 83W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 36µA
Supplier Device Package: PG-TDSON-8-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 14.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 2100 pF @ 50 V
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5000+1.34 EUR
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BSC096N10LS5ATMA1 BSC096N10LS5ATMA1 Infineon Technologies Infineon-BSC096N10LS5-DataSheet-v02_01-EN.pdf?fileId=5546d4626bb628d7016bdb78171e20a7 Description: MOSFET N-CH 100V 40A TDSON-8-6
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 9.6mOhm @ 20A, 10V
Power Dissipation (Max): 3W (Ta), 83W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 36µA
Supplier Device Package: PG-TDSON-8-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 14.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 2100 pF @ 50 V
auf Bestellung 5673 Stücke:
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8+2.27 EUR
10+1.95 EUR
25+1.84 EUR
100+1.69 EUR
250+1.6 EUR
500+1.53 EUR
1000+1.47 EUR
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TLS125D0EJXUMA1 TLS125D0EJXUMA1 Infineon Technologies Infineon-TLS125D0EJ-DataSheet-v01_02-EN.pdf?fileId=5546d46279a6fbb20179ba922605737e Description: IC REG LINEAR POS ADJ 8DSO-52
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 110 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: PG-DSO-8-52
Voltage - Output (Max): 40V
Voltage - Output (Min/Fixed): 2V
Control Features: Enable, Power Good, Soft Start
Grade: Automotive
Part Status: Active
PSRR: 80dB (100Hz)
Voltage Dropout (Max): 0.5V @ 250mA
Protection Features: Over Temperature, Over Voltage, Reverse Polarity, Under Voltage Lockout (UVLO)
Current - Supply (Max): 25 mA
Qualification: AEC-Q100
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2500+1.19 EUR
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TLS125D0EJXUMA1 TLS125D0EJXUMA1 Infineon Technologies Infineon-TLS125D0EJ-DataSheet-v01_02-EN.pdf?fileId=5546d46279a6fbb20179ba922605737e Description: IC REG LINEAR POS ADJ 8DSO-52
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 110 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: PG-DSO-8-52
Voltage - Output (Max): 40V
Voltage - Output (Min/Fixed): 2V
Control Features: Enable, Power Good, Soft Start
Grade: Automotive
Part Status: Active
PSRR: 80dB (100Hz)
Voltage Dropout (Max): 0.5V @ 250mA
Protection Features: Over Temperature, Over Voltage, Reverse Polarity, Under Voltage Lockout (UVLO)
Current - Supply (Max): 25 mA
Qualification: AEC-Q100
auf Bestellung 8449 Stücke:
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7+2.62 EUR
10+1.93 EUR
25+1.75 EUR
100+1.56 EUR
250+1.47 EUR
500+1.41 EUR
1000+1.37 EUR
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XMC4400F100K512ABXUMA1 XMC4400F100K512ABXUMA1 Infineon Technologies Infineon-XMC4400-DS-v01_03-EN.pdf?fileId=5546d462696dbf12016981795855391d Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Discontinued at Digi-Key
Number of I/O: 55
DigiKey Programmable: Not Verified
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TC233L32F200NACKXUMA1 TC233L32F200NACKXUMA1 Infineon Technologies Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC233L32F200NACKXUMA1 TC233L32F200NACKXUMA1 Infineon Technologies Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AUIRFR3806TRL AUIRFR3806TRL Infineon Technologies auirfr3806.pdf?fileId=5546d462533600a4015355b56f981482 Description: MOSFET N-CH 60V 43A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 15.8mOhm @ 25A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 50 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 3000 Stücke:
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3000+1.46 EUR
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AUIRFR3806TRL AUIRFR3806TRL Infineon Technologies auirfr3806.pdf?fileId=5546d462533600a4015355b56f981482 Description: MOSFET N-CH 60V 43A DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 15.8mOhm @ 25A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 50 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 6249 Stücke:
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5+3.85 EUR
10+2.85 EUR
100+2.07 EUR
500+1.7 EUR
1000+1.54 EUR
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TC337LP32F300SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 292LFBGA
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TC337LP32F300SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 292LFBGA
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TC332LP32F300FAAKXUMA1 TC332LP32F300FAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
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TC332LP32F300FAAKXUMA1 TC332LP32F300FAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 80TQFP
Packaging: Cut Tape (CT)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
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TC336LP32F300SAAKXUMA1 TC336LP32F300SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 180LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-180-1
DigiKey Programmable: Not Verified
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TC336LP32F300SAAKXUMA1 TC336LP32F300SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 180LFBGA
Packaging: Cut Tape (CT)
Package / Case: 180-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-180-1
DigiKey Programmable: Not Verified
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10+85.63 EUR
25+82.87 EUR
100+76.79 EUR
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AUIPS7145RTRL AUIPS7145RTRL Infineon Technologies auips7145r.pdf?fileId=5546d462533600a4015355a7ff1a1334 Description: IC PWR SWITCH N-CHANNEL 1:1 DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-5, DPak (4 Leads + Tab), TO-252AD
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 75mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.1A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TO252-5
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q100
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FS950R08A6P2LBBPSA1 FS950R08A6P2LBBPSA1 Infineon Technologies Infineon-FS950R08A6P2LB-DataSheet-v01_00-EN.pdf?fileId=5546d4627aa5d4f5017b5311f6332559 Description: HYBRID PACK DRIVE AG-HYBRIDD-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 3 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A
NTC Thermistor: Yes
Supplier Device Package: AG-HYBRIDD-2
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 750 V
Power - Max: 870 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 80 nF @ 50 V
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1EDI2004ASXUMA1 Infineon Technologies 1EDI2004AS-ISO-DS_v02_10.pdf Description: DGTL ISO 4.5KV 1CH GT DVR DSO36
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 2A
Technology: Magnetic Coupling
Current - Output High, Low: 2A, 2A
Voltage - Isolation: 4500Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-36
Rise / Fall Time (Typ): 120ns, 150ns
Common Mode Transient Immunity (Min): 50kV/µs
Propagation Delay tpLH / tpHL (Max): 255ns, 255ns
Pulse Width Distortion (Max): 40ns
Number of Channels: 1
Voltage - Output Supply: 13.5V ~ 18V
Grade: Automotive
Qualification: AEC-Q100
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SIGC42T60UNX7SA1 Infineon Technologies Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60SNCX1SA2 SIGC42T60SNCX1SA2 Infineon Technologies SIGC42T60SNC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX7SA2 Infineon Technologies Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX1SA1 SIGC42T60UNX1SA1 Infineon Technologies SIGC42T60UN_ed1_13-9-05.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA5 SIGC42T60NCX1SA5 Infineon Technologies SIGC42T60NC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA6 Infineon Technologies SIGC42T60NC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA4 Infineon Technologies SIGC42T60NC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60SNCX1SA1 Infineon Technologies SIGC42T60SNC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60NCX1SA3 Infineon Technologies SIGC42T60NC_ed2_11-28-03.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T60UNX1SA2 Infineon Technologies SIGC42T60UN_ed1_13-9-05.pdf Description: IGBT 3 CHIP 600V WAFER
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SIGC42T120CQX1SA1 Infineon Technologies SIGC42T120CQ_Rev1.1_12-20-05.pdf Description: DIODE GEN PURPOSE 1.2KV
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IDP45E60XKSA2 IDP45E60XKSA2 Infineon Technologies Infineon-IDP45E60-DS-v02_05-en.pdf?fileId=db3a30432313ff5e01237a518c6e7be9 Description: DISCRETE SWITCHES
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TLD1315ELXUMA1 TLD1315ELXUMA1 Infineon Technologies Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532 Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Not For New Designs
Grade: Automotive
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TLD1315ELXUMA1 TLD1315ELXUMA1 Infineon Technologies Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532 Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Cut Tape (CT)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Not For New Designs
Grade: Automotive
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TLD1315ELXUMA1 TLD1315ELXUMA1 Infineon Technologies Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532 Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Bulk
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Not For New Designs
Grade: Automotive
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IR4426STRPBF IR4426STRPBF Infineon Technologies ir4426.pdf?fileId=5546d462533600a4015355d60b491822 Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 6V ~ 20V
Input Type: Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 10ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.7V
Current - Peak Output (Source, Sink): 2.3A, 3.3A
Part Status: Active
DigiKey Programmable: Not Verified
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IR4426STRPBF IR4426STRPBF Infineon Technologies ir4426.pdf?fileId=5546d462533600a4015355d60b491822 Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 6V ~ 20V
Input Type: Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 10ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.7V
Current - Peak Output (Source, Sink): 2.3A, 3.3A
Part Status: Active
DigiKey Programmable: Not Verified
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25+1.79 EUR
100+1.6 EUR
250+1.5 EUR
500+1.45 EUR
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IRS2008MTRPBFXUMA1 IRS2008MTRPBFXUMA1 Infineon Technologies Infineon-IRS2008S-M-DataSheet-v01_00-EN.pdf?fileId=5546d46269e1c019016ae5475e943bd3 Description: IC GATE DRVR HALF-BRIDGE 14MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 200 V
Supplier Device Package: 14-MLPQ (4x4)
Rise / Fall Time (Typ): 70ns, 30ns
Channel Type: Synchronous
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
Part Status: Active
DigiKey Programmable: Not Verified
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CY9AF112NABGL-GE1 CY9AF112NABGL-GE1 Infineon Technologies Infineon-CY9A110A_CY9A110_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eddff4562bb&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fil Description: IC MCU 32BIT 128KB FLSH 112PFBGA
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CY9AF312NABGL-GE1 CY9AF312NABGL-GE1 Infineon Technologies Infineon-CY9A310A_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ede11f262e1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 128KB FLSH 112PFBGA
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ICA22V14X1SA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: CHIP BARE DIE
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ICA22V13X1SA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: CHIP BARE DIE
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TC275TP64F200NDCKXUMA1 TC275TP64F200NDCKXUMA1 Infineon Technologies Infineon-TC27xDC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 40x12b, 6 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
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TC275TP64F200NDCKXUMA1 TC275TP64F200NDCKXUMA1 Infineon Technologies Infineon-TC27xDC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 40x12b, 6 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
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TC275TP64F200WCALXUMA2 TC275TP64F200WCALXUMA2 Infineon Technologies Description: IC MICROCONTROLLER
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TC275TP64F200WCALXUMA1 TC275TP64F200WCALXUMA1 Infineon Technologies Description: IC MICROCONTROLLER
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IPP040N08NF2SAKMA1 IPP040N08NF2SAKMA1 Infineon Technologies Infineon-IPP040N08NF2S-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f70a2eac169b Description: TRENCH 40<-<100V
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Ta), 115A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 80A, 10V
Power Dissipation (Max): 3.8W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 85µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 81 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3800 pF @ 40 V
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IPP016N08NF2SAKMA1 IPP016N08NF2SAKMA1 Infineon Technologies Infineon-IPP016N08NF2S-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f69332aa1057 Description: TRENCH 40<-<100V
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Ta), 196A (Tc)
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 267µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 255 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12000 pF @ 40 V
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TC277T64F200NDCKXUMA2 TC277T64F200NDCKXUMA2 Infineon Technologies Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 60x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
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SAK-TC277T-64F200N DC SAK-TC277T-64F200N DC Infineon Technologies Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 60x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
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TDA5225C TDA5225C Infineon Technologies Infineon-TDA5225-DS-v01_00-EN.pdf?fileId=5546d4625debb399015e285b7e7b3c4f Description: QUAD-CONFIGURATION RECEIVER
Packaging: Bulk
Features: RSSI Equipped
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 300MHz ~ 928MHz
Modulation or Protocol: ASK, FSK
Data Interface: SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Alarm Systems, Communication Systems, RKE
Current - Receiving: 15mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: PG-TSSOP-28
Part Status: Active
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MB95F563HNPFT-G-SNE2 MB95F563HNPFT-G-SNE2 Infineon Technologies Prod_Selector_Guide_11-25-15.pdf Description: IC MCU 8BIT 12KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 6x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: LINbus, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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MB95F563HNPFT-G-SNE2 MB95F563HNPFT-G-SNE2 Infineon Technologies Prod_Selector_Guide_11-25-15.pdf Description: IC MCU 8BIT 12KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 6x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: LINbus, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
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IGT60R070D1ATMA4 IGT60R070D1ATMA4 Infineon Technologies Infineon-IGT60R070D1-DataSheet-v02_13-EN.pdf?fileId=5546d46265f064ff016686028dd56526 Description: GANFET N-CH
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31A (Tc)
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-HSOF-8-3
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
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IGT60R070D1ATMA4 IGT60R070D1ATMA4 Infineon Technologies Infineon-IGT60R070D1-DataSheet-v02_13-EN.pdf?fileId=5546d46265f064ff016686028dd56526 Description: GANFET N-CH
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31A (Tc)
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-HSOF-8-3
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
auf Bestellung 2017 Stücke:
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1+20.87 EUR
10+14.61 EUR
100+12.88 EUR
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IGLD60R070D1AUMA3 IGLD60R070D1AUMA3 Infineon Technologies Infineon-IGLD60R070D1-DataSheet-v02_12-EN.pdf?fileId=5546d46265f064ff016685f03f056511 Description: GANFET N-CH
Packaging: Tape & Reel (TR)
Package / Case: 8-LDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Power Dissipation (Max): 114W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-LSON-8-1
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
auf Bestellung 3000 Stücke:
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3000+10.07 EUR
Mindestbestellmenge: 3000
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IGLD60R070D1AUMA3 IGLD60R070D1AUMA3 Infineon Technologies Infineon-IGLD60R070D1-DataSheet-v02_12-EN.pdf?fileId=5546d46265f064ff016685f03f056511 Description: GANFET N-CH
Packaging: Cut Tape (CT)
Package / Case: 8-LDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Power Dissipation (Max): 114W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-LSON-8-1
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
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EVAL1ED3251MC12HTOBO1 EVAL1ED3251MC12HTOBO1 Infineon Technologies Infineon-UG-2021-25_Eval-1ED32x1MC12H-UserManual-v01_00-EN.pdf?fileId=5546d4627aa5d4f5017b105b58ff307b Description: EVAL BOARD FOR 1ED3251MC12H
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1ED3251MC12H
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: No
Part Status: Active
Secondary Attributes: On-Board LEDs
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1+172.53 EUR
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EVAL1ED3241MC12HTOBO1 EVAL1ED3241MC12HTOBO1 Infineon Technologies Infineon-EiceDRIVER_1ED32xxMC12H-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd01790e8498044865 Description: EVAL BOARD FOR 1ED3241MC12H
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1ED3241MC12H
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: No
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
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CY7C63903-PVXC CY7C63310%2C%20638xx%2C%20639xx.pdf
CY7C63903-PVXC
Hersteller: Infineon Technologies
Description: IC USB PERIPHERAL CTRLR 28SSOP
Packaging: Bulk
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Function: Controller
Interface: GPIO, SPI
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4V ~ 5.5V
Current - Supply: 40mA
Protocol: USB
Standards: USB 2.0
Supplier Device Package: 28-SSOP
Part Status: Obsolete
DigiKey Programmable: Not Verified
auf Bestellung 5303 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
247+2.06 EUR
Mindestbestellmenge: 247
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BSC0924NDIATMA1 Infineon-BSC0924NDI-DS-v02_00-en.pdf?fileId=db3a304336ca04c90136ceae245448f5
BSC0924NDIATMA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 30V 17A/32A TISON8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual) Asymmetrical
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 1W
Drain to Source Voltage (Vdss): 30V
Current - Continuous Drain (Id) @ 25°C: 17A, 32A
Input Capacitance (Ciss) (Max) @ Vds: 1160pF @ 15V
Rds On (Max) @ Id, Vgs: 5mOhm @ 20A, 10V
Gate Charge (Qg) (Max) @ Vgs: 10nC @ 4.5V
FET Feature: Logic Level Gate, 4.5V Drive
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-TISON-8
Part Status: Active
auf Bestellung 74634 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.52 EUR
12+1.59 EUR
100+1.06 EUR
500+0.83 EUR
1000+0.76 EUR
2000+0.7 EUR
Mindestbestellmenge: 7
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BSC0993NDATMA1 Infineon-BSC0993ND-DS-v02_00-EN.pdf?fileId=5546d46258fc0bc101598dddfb2c616c
BSC0993NDATMA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 17A TISON8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
Current - Continuous Drain (Id) @ 25°C: 17A (Ta)
Rds On (Max) @ Id, Vgs: 5mOhm @ 7A, 10V
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-TISON-8
Part Status: Not For New Designs
auf Bestellung 9957 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.38 EUR
12+1.54 EUR
100+1.03 EUR
500+0.81 EUR
1000+0.74 EUR
2000+0.72 EUR
Mindestbestellmenge: 8
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BSC096N10LS5ATMA1 Infineon-BSC096N10LS5-DataSheet-v02_01-EN.pdf?fileId=5546d4626bb628d7016bdb78171e20a7
BSC096N10LS5ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 40A TDSON-8-6
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 9.6mOhm @ 20A, 10V
Power Dissipation (Max): 3W (Ta), 83W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 36µA
Supplier Device Package: PG-TDSON-8-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 14.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 2100 pF @ 50 V
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+1.34 EUR
Mindestbestellmenge: 5000
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BSC096N10LS5ATMA1 Infineon-BSC096N10LS5-DataSheet-v02_01-EN.pdf?fileId=5546d4626bb628d7016bdb78171e20a7
BSC096N10LS5ATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 40A TDSON-8-6
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Tc)
Rds On (Max) @ Id, Vgs: 9.6mOhm @ 20A, 10V
Power Dissipation (Max): 3W (Ta), 83W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 36µA
Supplier Device Package: PG-TDSON-8-6
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 14.6 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 2100 pF @ 50 V
auf Bestellung 5673 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.27 EUR
10+1.95 EUR
25+1.84 EUR
100+1.69 EUR
250+1.6 EUR
500+1.53 EUR
1000+1.47 EUR
Mindestbestellmenge: 8
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TLS125D0EJXUMA1 Infineon-TLS125D0EJ-DataSheet-v01_02-EN.pdf?fileId=5546d46279a6fbb20179ba922605737e
TLS125D0EJXUMA1
Hersteller: Infineon Technologies
Description: IC REG LINEAR POS ADJ 8DSO-52
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 110 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: PG-DSO-8-52
Voltage - Output (Max): 40V
Voltage - Output (Min/Fixed): 2V
Control Features: Enable, Power Good, Soft Start
Grade: Automotive
Part Status: Active
PSRR: 80dB (100Hz)
Voltage Dropout (Max): 0.5V @ 250mA
Protection Features: Over Temperature, Over Voltage, Reverse Polarity, Under Voltage Lockout (UVLO)
Current - Supply (Max): 25 mA
Qualification: AEC-Q100
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+1.19 EUR
Mindestbestellmenge: 2500
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TLS125D0EJXUMA1 Infineon-TLS125D0EJ-DataSheet-v01_02-EN.pdf?fileId=5546d46279a6fbb20179ba922605737e
TLS125D0EJXUMA1
Hersteller: Infineon Technologies
Description: IC REG LINEAR POS ADJ 8DSO-52
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: Adjustable
Mounting Type: Surface Mount
Current - Output: 250mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 110 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: PG-DSO-8-52
Voltage - Output (Max): 40V
Voltage - Output (Min/Fixed): 2V
Control Features: Enable, Power Good, Soft Start
Grade: Automotive
Part Status: Active
PSRR: 80dB (100Hz)
Voltage Dropout (Max): 0.5V @ 250mA
Protection Features: Over Temperature, Over Voltage, Reverse Polarity, Under Voltage Lockout (UVLO)
Current - Supply (Max): 25 mA
Qualification: AEC-Q100
auf Bestellung 8449 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.62 EUR
10+1.93 EUR
25+1.75 EUR
100+1.56 EUR
250+1.47 EUR
500+1.41 EUR
1000+1.37 EUR
Mindestbestellmenge: 7
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XMC4400F100K512ABXUMA1 Infineon-XMC4400-DS-v01_03-EN.pdf?fileId=5546d462696dbf12016981795855391d
XMC4400F100K512ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Discontinued at Digi-Key
Number of I/O: 55
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC233L32F200NACKXUMA1 Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee
TC233L32F200NACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC233L32F200NACKXUMA1 Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee
TC233L32F200NACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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AUIRFR3806TRL auirfr3806.pdf?fileId=5546d462533600a4015355b56f981482
AUIRFR3806TRL
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 43A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 15.8mOhm @ 25A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 50 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+1.46 EUR
Mindestbestellmenge: 3000
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AUIRFR3806TRL auirfr3806.pdf?fileId=5546d462533600a4015355b56f981482
AUIRFR3806TRL
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 43A DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 15.8mOhm @ 25A, 10V
Power Dissipation (Max): 71W (Tc)
Vgs(th) (Max) @ Id: 4V @ 50µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1150 pF @ 50 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 6249 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+3.85 EUR
10+2.85 EUR
100+2.07 EUR
500+1.7 EUR
1000+1.54 EUR
Mindestbestellmenge: 5
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TC337LP32F300SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 292LFBGA
Produkt ist nicht verfügbar
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TC337LP32F300SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 292LFBGA
Produkt ist nicht verfügbar
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TC332LP32F300FAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC332LP32F300FAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 80TQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC332LP32F300FAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC332LP32F300FAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 80TQFP
Packaging: Cut Tape (CT)
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC336LP32F300SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC336LP32F300SAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 180LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 180-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-180-1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC336LP32F300SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC336LP32F300SAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 180LFBGA
Packaging: Cut Tape (CT)
Package / Case: 180-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-180-1
DigiKey Programmable: Not Verified
auf Bestellung 976 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+91.15 EUR
10+85.63 EUR
25+82.87 EUR
100+76.79 EUR
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AUIPS7145RTRL auips7145r.pdf?fileId=5546d462533600a4015355a7ff1a1334
AUIPS7145RTRL
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHANNEL 1:1 DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-5, DPak (4 Leads + Tab), TO-252AD
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 75mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 60V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 2.1A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TO252-5
Fault Protection: Current Limiting (Fixed), Over Temperature
Part Status: Obsolete
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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FS950R08A6P2LBBPSA1 Infineon-FS950R08A6P2LB-DataSheet-v01_00-EN.pdf?fileId=5546d4627aa5d4f5017b5311f6332559
FS950R08A6P2LBBPSA1
Hersteller: Infineon Technologies
Description: HYBRID PACK DRIVE AG-HYBRIDD-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 3 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A
NTC Thermistor: Yes
Supplier Device Package: AG-HYBRIDD-2
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 750 V
Power - Max: 870 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 80 nF @ 50 V
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+523.28 EUR
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1EDI2004ASXUMA1 1EDI2004AS-ISO-DS_v02_10.pdf
Hersteller: Infineon Technologies
Description: DGTL ISO 4.5KV 1CH GT DVR DSO36
Packaging: Tape & Reel (TR)
Package / Case: 36-BSSOP (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C
Current - Peak Output: 2A
Technology: Magnetic Coupling
Current - Output High, Low: 2A, 2A
Voltage - Isolation: 4500Vrms
Approval Agency: UL, VDE
Supplier Device Package: PG-DSO-36
Rise / Fall Time (Typ): 120ns, 150ns
Common Mode Transient Immunity (Min): 50kV/µs
Propagation Delay tpLH / tpHL (Max): 255ns, 255ns
Pulse Width Distortion (Max): 40ns
Number of Channels: 1
Voltage - Output Supply: 13.5V ~ 18V
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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SIGC42T60UNX7SA1
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60SNCX1SA2 SIGC42T60SNC_ed2_11-28-03.pdf
SIGC42T60SNCX1SA2
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60UNX7SA2
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60UNX1SA1 SIGC42T60UN_ed1_13-9-05.pdf
SIGC42T60UNX1SA1
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60NCX1SA5 SIGC42T60NC_ed2_11-28-03.pdf
SIGC42T60NCX1SA5
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60NCX1SA6 SIGC42T60NC_ed2_11-28-03.pdf
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60NCX1SA4 SIGC42T60NC_ed2_11-28-03.pdf
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60SNCX1SA1 SIGC42T60SNC_ed2_11-28-03.pdf
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60NCX1SA3 SIGC42T60NC_ed2_11-28-03.pdf
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T60UNX1SA2 SIGC42T60UN_ed1_13-9-05.pdf
Hersteller: Infineon Technologies
Description: IGBT 3 CHIP 600V WAFER
Produkt ist nicht verfügbar
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SIGC42T120CQX1SA1 SIGC42T120CQ_Rev1.1_12-20-05.pdf
Hersteller: Infineon Technologies
Description: DIODE GEN PURPOSE 1.2KV
Produkt ist nicht verfügbar
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IDP45E60XKSA2 Infineon-IDP45E60-DS-v02_05-en.pdf?fileId=db3a30432313ff5e01237a518c6e7be9
IDP45E60XKSA2
Hersteller: Infineon Technologies
Description: DISCRETE SWITCHES
Produkt ist nicht verfügbar
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TLD1315ELXUMA1 Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532
TLD1315ELXUMA1
Hersteller: Infineon Technologies
Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Tape & Reel (TR)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Not For New Designs
Grade: Automotive
Produkt ist nicht verfügbar
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TLD1315ELXUMA1 Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532
TLD1315ELXUMA1
Hersteller: Infineon Technologies
Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Cut Tape (CT)
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Not For New Designs
Grade: Automotive
Produkt ist nicht verfügbar
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TLD1315ELXUMA1 Infineon-TLD1315EL-DS-v01_01-EN.pdf?fileId=5546d46258fc0bc101596e37d6043532
TLD1315ELXUMA1
Hersteller: Infineon Technologies
Description: IC LED DRVR LIN PWM 120MA 14SSOP
Packaging: Bulk
Package / Case: 14-LSSOP (0.154", 3.90mm Width) Exposed Pad
Voltage - Output: 40V
Mounting Type: Surface Mount
Number of Outputs: 3
Type: Linear
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output / Channel: 120mA
Internal Switch(s): Yes
Supplier Device Package: PG-SSOP-14-5
Dimming: PWM
Voltage - Supply (Min): 5.5V
Voltage - Supply (Max): 40V
Part Status: Not For New Designs
Grade: Automotive
auf Bestellung 17827 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
415+1.19 EUR
Mindestbestellmenge: 415
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IR4426STRPBF ir4426.pdf?fileId=5546d462533600a4015355d60b491822
IR4426STRPBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 6V ~ 20V
Input Type: Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 10ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.7V
Current - Peak Output (Source, Sink): 2.3A, 3.3A
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IR4426STRPBF ir4426.pdf?fileId=5546d462533600a4015355d60b491822
IR4426STRPBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 6V ~ 20V
Input Type: Inverting
Supplier Device Package: 8-SOIC
Rise / Fall Time (Typ): 15ns, 10ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.7V
Current - Peak Output (Source, Sink): 2.3A, 3.3A
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 1745 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.69 EUR
10+1.97 EUR
25+1.79 EUR
100+1.6 EUR
250+1.5 EUR
500+1.45 EUR
1000+1.4 EUR
Mindestbestellmenge: 7
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IRS2008MTRPBFXUMA1 Infineon-IRS2008S-M-DataSheet-v01_00-EN.pdf?fileId=5546d46269e1c019016ae5475e943bd3
IRS2008MTRPBFXUMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 14MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 14-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 10V ~ 20V
Input Type: Non-Inverting
High Side Voltage - Max (Bootstrap): 200 V
Supplier Device Package: 14-MLPQ (4x4)
Rise / Fall Time (Typ): 70ns, 30ns
Channel Type: Synchronous
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF112NABGL-GE1 Infineon-CY9A110A_CY9A110_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eddff4562bb&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fil
CY9AF112NABGL-GE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLSH 112PFBGA
Produkt ist nicht verfügbar
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CY9AF312NABGL-GE1 Infineon-CY9A310A_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ede11f262e1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9AF312NABGL-GE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLSH 112PFBGA
Produkt ist nicht verfügbar
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ICA22V14X1SA1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: CHIP BARE DIE
Produkt ist nicht verfügbar
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ICA22V13X1SA1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: CHIP BARE DIE
Produkt ist nicht verfügbar
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TC275TP64F200NDCKXUMA1 Infineon-TC27xDC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
TC275TP64F200NDCKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 40x12b, 6 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC275TP64F200NDCKXUMA1 Infineon-TC27xDC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
TC275TP64F200NDCKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 40x12b, 6 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
Number of I/O: 112
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC275TP64F200WCALXUMA2
TC275TP64F200WCALXUMA2
Hersteller: Infineon Technologies
Description: IC MICROCONTROLLER
Produkt ist nicht verfügbar
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TC275TP64F200WCALXUMA1
TC275TP64F200WCALXUMA1
Hersteller: Infineon Technologies
Description: IC MICROCONTROLLER
Produkt ist nicht verfügbar
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IPP040N08NF2SAKMA1 Infineon-IPP040N08NF2S-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f70a2eac169b
IPP040N08NF2SAKMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22A (Ta), 115A (Tc)
Rds On (Max) @ Id, Vgs: 4mOhm @ 80A, 10V
Power Dissipation (Max): 3.8W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 85µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 81 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3800 pF @ 40 V
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
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IPP016N08NF2SAKMA1 Infineon-IPP016N08NF2S-DataSheet-v02_00-EN.pdf?fileId=5546d46276c4f5350176f69332aa1057
IPP016N08NF2SAKMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Ta), 196A (Tc)
Rds On (Max) @ Id, Vgs: 1.6mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 267µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 255 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12000 pF @ 40 V
auf Bestellung 260 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+6.85 EUR
50+3.53 EUR
100+3.21 EUR
Mindestbestellmenge: 3
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TC277T64F200NDCKXUMA2 Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
TC277T64F200NDCKXUMA2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 60x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAK-TC277T-64F200N DC Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
SAK-TC277T-64F200N DC
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 60x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Produkt ist nicht verfügbar
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TDA5225C Infineon-TDA5225-DS-v01_00-EN.pdf?fileId=5546d4625debb399015e285b7e7b3c4f
TDA5225C
Hersteller: Infineon Technologies
Description: QUAD-CONFIGURATION RECEIVER
Packaging: Bulk
Features: RSSI Equipped
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Sensitivity: -120dBm
Mounting Type: Surface Mount
Frequency: 300MHz ~ 928MHz
Modulation or Protocol: ASK, FSK
Data Interface: SPI
Operating Temperature: -40°C ~ 105°C
Voltage - Supply: 3V ~ 3.6V, 4.5V ~ 5.5V
Applications: Alarm Systems, Communication Systems, RKE
Current - Receiving: 15mA
Antenna Connector: PCB, Surface Mount
Supplier Device Package: PG-TSSOP-28
Part Status: Active
auf Bestellung 2570 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
213+2.12 EUR
Mindestbestellmenge: 213
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MB95F563HNPFT-G-SNE2 Prod_Selector_Guide_11-25-15.pdf
MB95F563HNPFT-G-SNE2
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 12KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 6x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: LINbus, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
23+0.77 EUR
Mindestbestellmenge: 23
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MB95F563HNPFT-G-SNE2 Prod_Selector_Guide_11-25-15.pdf
MB95F563HNPFT-G-SNE2
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 12KB FLASH 20TSSOP
Packaging: Bulk
Package / Case: 20-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 12KB (12K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 6x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: LINbus, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 20-TSSOP
Number of I/O: 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IGT60R070D1ATMA4 Infineon-IGT60R070D1-DataSheet-v02_13-EN.pdf?fileId=5546d46265f064ff016686028dd56526
IGT60R070D1ATMA4
Hersteller: Infineon Technologies
Description: GANFET N-CH
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31A (Tc)
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-HSOF-8-3
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
IGT60R070D1ATMA4 Infineon-IGT60R070D1-DataSheet-v02_13-EN.pdf?fileId=5546d46265f064ff016686028dd56526
IGT60R070D1ATMA4
Hersteller: Infineon Technologies
Description: GANFET N-CH
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 31A (Tc)
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-HSOF-8-3
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
auf Bestellung 2017 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.87 EUR
10+14.61 EUR
100+12.88 EUR
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IGLD60R070D1AUMA3 Infineon-IGLD60R070D1-DataSheet-v02_12-EN.pdf?fileId=5546d46265f064ff016685f03f056511
IGLD60R070D1AUMA3
Hersteller: Infineon Technologies
Description: GANFET N-CH
Packaging: Tape & Reel (TR)
Package / Case: 8-LDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Power Dissipation (Max): 114W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-LSON-8-1
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+10.07 EUR
Mindestbestellmenge: 3000
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IGLD60R070D1AUMA3 Infineon-IGLD60R070D1-DataSheet-v02_12-EN.pdf?fileId=5546d46265f064ff016685f03f056511
IGLD60R070D1AUMA3
Hersteller: Infineon Technologies
Description: GANFET N-CH
Packaging: Cut Tape (CT)
Package / Case: 8-LDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: GaNFET (Gallium Nitride)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 15A (Tc)
Power Dissipation (Max): 114W (Tc)
Vgs(th) (Max) @ Id: 1.6V @ 2.6mA
Supplier Device Package: PG-LSON-8-1
Part Status: Active
Vgs (Max): -10V
Drain to Source Voltage (Vdss): 600 V
Input Capacitance (Ciss) (Max) @ Vds: 380 pF @ 400 V
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Im Einkaufswagen  Stück im Wert von  UAH
EVAL1ED3251MC12HTOBO1 Infineon-UG-2021-25_Eval-1ED32x1MC12H-UserManual-v01_00-EN.pdf?fileId=5546d4627aa5d4f5017b105b58ff307b
EVAL1ED3251MC12HTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR 1ED3251MC12H
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1ED3251MC12H
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: No
Part Status: Active
Secondary Attributes: On-Board LEDs
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+172.53 EUR
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EVAL1ED3241MC12HTOBO1 Infineon-EiceDRIVER_1ED32xxMC12H-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd01790e8498044865
EVAL1ED3241MC12HTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR 1ED3241MC12H
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1ED3241MC12H
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: No
Part Status: Active
Contents: Board(s)
Secondary Attributes: On-Board LEDs
Produkt ist nicht verfügbar
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