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F3L300R12ME4B22BOSA1 F3L300R12ME4B22BOSA1 Infineon Technologies Infineon-F3L300R12ME4_B22-DS-v03_00-en_de.pdf?fileId=db3a304333b8a7ca0133fa5e35d4447b Description: IGBT MOD 1200V 450A 1550W MOD
Input Capacitance (Cies) @ Vce: 19 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 1550 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 450 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 300A
Operating Temperature: -40°C ~ 150°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FS450R17OE4PBOSA1 FS450R17OE4PBOSA1 Infineon Technologies Infineon-FS450R17OE4P-DS-v03_00-EN.pdf?fileId=5546d4625696ed760156e0a6fafc0bcc Description: IGBT MOD 1700V 900A 20MW
Input Capacitance (Cies) @ Vce: 36 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 900 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Operating Temperature: -40°C ~ 150°C
Configuration: Full Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 450A
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FZ1200R45KL3B5NOSA1 FZ1200R45KL3B5NOSA1 Infineon Technologies Infineon-FZ1200R45KL3_B5-DS-v03_00-en_de.pdf?fileId=db3a30433dd42dcf013dd5609e070303 Description: IGBT MODULE 4500V 1200A
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 13500 W
Voltage - Collector Emitter Breakdown (Max): 4500 V
Current - Collector (Ic) (Max): 1200 A
Part Status: Active
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.85V @ 15V, 1200A
Operating Temperature: -50°C ~ 125°C
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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FF450R12ME4 Infineon Technologies INFNS28405-1.pdf?t.download=true&u=5oefqw Description: INSULATED GATE BIPOLAR TRANSISTO
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 450 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: AG-ECONOD
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Half Bridge Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Produkt ist nicht verfügbar
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FF450R12KT4HOSA1 FF450R12KT4HOSA1 Infineon Technologies Infineon-FF450R12KT4-DS-v03_00-en_de.pdf?fileId=db3a3043156fd573011619a84a5e1de5 Description: IGBT MOD 1200V 450A 2400W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 450A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 2400 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
auf Bestellung 436 Stücke:
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FF300R12ME4BOSA1 FF300R12ME4BOSA1 Infineon Technologies Infineon-FF300R12ME4-DS-v03_01-en_de.pdf?fileId=db3a30431a5c32f2011a76a01c216c55 Description: IGBT MOD 1200V 450A 1600W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 300A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1600 W
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
auf Bestellung 68 Stücke:
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FF450R12ME4PB11BOSA1 FF450R12ME4PB11BOSA1 Infineon Technologies Infineon-FF450R12ME4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625b3ca4ec015b3e418861068a Description: IGBT MODULE 1200V 450A
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 450 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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FF300R12ME4B11BPSA2 FF300R12ME4B11BPSA2 Infineon Technologies Infineon-FF300R12ME4_B11-DS-v02_00-en_de.pdf?fileId=db3a30432fbc32ee012fbf6ae2df3a5f Description: IGBT MODULE 1200V 450A AG-ECONOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 300A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONOD
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1600 W
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
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FF450R12ME4B61BPSA1 Infineon Technologies INFNS28406-1.pdf?t.download=true&u=5oefqw Description: FF450R12ME4 - INSULATED GATE BIP
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Power - Max: 2250 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 675 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: AG-ECONOD-3-2
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Half Bridge Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Produkt ist nicht verfügbar
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FF450R17ME4BOSA1 FF450R17ME4BOSA1 Infineon Technologies Infineon-FF450R17ME4-DS-v02_05-en_de.pdf?fileId=db3a30431ce5fb52011d70f86f916ee9 Description: IGBT MOD 1700V 600A 2500W MOD
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Input Capacitance (Cies) @ Vce: 36 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Power - Max: 2500 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 600 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
auf Bestellung 15 Stücke:
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10+277.12 EUR
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S25FL256SAGMFV003 S25FL256SAGMFV003 Infineon Technologies 001-98283%20Rev%20T.pdf Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
DigiKey Programmable: Verified
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S25FL256SAGMFV003 S25FL256SAGMFV003 Infineon Technologies 001-98283%20Rev%20T.pdf Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
DigiKey Programmable: Verified
auf Bestellung 1448 Stücke:
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500+9.76 EUR
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S25FL128SAGBHM200 S25FL128SAGBHM200 Infineon Technologies Infineon-S25FL128S_S25FL256S_128_Mb_(16_MB)_256_Mb_(32_MB)_3.0V_SPI_Flash_Memory-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfb6a64a17 Description: IC FLASH 128MBIT SPI/QUAD 24BGA
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
auf Bestellung 349 Stücke:
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2+13.83 EUR
10+12.72 EUR
25+12.45 EUR
40+12.41 EUR
80+11.14 EUR
338+10.79 EUR
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CY95F011HNPMC-G101UN-YE2 Infineon Technologies Description: IC MCU
Packaging: Tray
Part Status: Active
auf Bestellung 1190 Stücke:
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119+3.75 EUR
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595+3.44 EUR
1071+3.37 EUR
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TLV49611TAXBXA1 TLV49611TAXBXA1 Infineon Technologies Infineon-Infineon-TLV4961-1TAB_Hall_Switch-DS-v01_00-DS-v01_00-EN.pdf?fileId=5546d4624e765da5014ede3a726e0b89 Description: MAGNETIC SWITCH LATCH TO92-3
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Test Condition: 25°C
Supplier Device Package: TO-92-3
Current - Supply (Max): 2.5mA
Current - Output (Max): 25mA
Sensing Range: 2mT Trip, -2mT Release
Technology: Hall Effect
Voltage - Supply: 3V ~ 26V
Operating Temperature: -40°C ~ 125°C (TA)
Function: Latch
Mounting Type: Through Hole
Polarization: South Pole
Output Type: Open Drain
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Features: Temperature Compensated
Packaging: Bulk
auf Bestellung 2198 Stücke:
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22+0.96 EUR
25+0.83 EUR
27+0.8 EUR
29+0.74 EUR
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100+0.67 EUR
500+0.61 EUR
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MB89193APF-G-443-BND-RE1 Infineon Technologies Description: IC MCU 8BIT 8KB MROM 28SOP
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: POR, WDT
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MB89193APF-G-443-BND-R MB89193APF-G-443-BND-R Infineon Technologies Description: IC MCU 8BIT 8KB MROM 28SOP
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: POR, WDT
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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2EDN7424RXTMA1 2EDN7424RXTMA1 Infineon Technologies Infineon-2EDN7424R-DS-v02_00-EN.pdf?fileId=5546d4625c54d85b015c5e5812b13f6b Description: IC GATE DRVR LOW-SIDE 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: PG-TSSOP-8
Rise / Fall Time (Typ): 6.4ns, 5.4ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.2V, 1.9V
Current - Peak Output (Source, Sink): 4A, 4A
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4348 Stücke:
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14+1.52 EUR
19+1.11 EUR
25+0.99 EUR
100+0.87 EUR
250+0.81 EUR
500+0.79 EUR
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FZ2400R12HP4HOSA2 FZ2400R12HP4HOSA2 Infineon Technologies Infineon-FZ2400R12HP4-DS-v02_02-en_de.pdf?fileId=db3a30432313ff5e0123942e580d04a2 Description: IGBT MOD 1200V 3460A 12500W MOD
Input Capacitance (Cies) @ Vce: 150 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 12500 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 3460 A
Part Status: Active
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 2400A
Operating Temperature: -40°C ~ 150°C
Configuration: Single Switch
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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S25HL512TFANHI010 S25HL512TFANHI010 Infineon Technologies 002-12345_rev-AF.pdf Description: IC FLASH 512MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Memory Interface: SPI - Quad I/O
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
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2+15.54 EUR
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25+14.02 EUR
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S25FL256SAGMFVG03 S25FL256SAGMFVG03 Infineon Technologies 001-98283%20Rev%20T.pdf Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Memory Type: Non-Volatile
Memory Size: 256Mbit
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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S25FL256SAGMFVG03 S25FL256SAGMFVG03 Infineon Technologies 001-98283%20Rev%20T.pdf Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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2+11.33 EUR
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50+10 EUR
100+9.76 EUR
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500+9.21 EUR
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CY9AF005PMC-G-UNE2 CY9AF005PMC-G-UNE2 Infineon Technologies Description: IC MCU FLASH MICOM 100LQFP
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
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2+15.48 EUR
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90+11.58 EUR
270+11.06 EUR
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S25FL256SAGMFVR03 S25FL256SAGMFVR03 Infineon Technologies 001-98283%20Rev%20T.pdf Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S25FL256SAGMFVR03 S25FL256SAGMFVR03 Infineon Technologies 001-98283%20Rev%20T.pdf Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
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2+12.02 EUR
10+11.19 EUR
25+10.85 EUR
50+10.59 EUR
100+10.34 EUR
250+10.01 EUR
500+9.76 EUR
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S25FL256SAGMFV013 S25FL256SAGMFV013 Infineon Technologies 001-98283%20Rev%20T.pdf Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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S25FL256SAGMFV013 S25FL256SAGMFV013 Infineon Technologies 001-98283%20Rev%20T.pdf Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
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IPB0401NM5SATMA1 Infineon Technologies Description: TRENCH >=100V
Part Status: Active
Packaging: Cut Tape (CT)
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CY95F334KTPMC-G-UNE2 Infineon Technologies Description: IC MCU 16BIT LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Tray
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IKP30N65H5XKSA1 IKP30N65H5XKSA1 Infineon Technologies Infineon-IKP30N65H5-DS-v02_02-EN.pdf?fileId=5546d461464245d30146a51a2ca36d28 Description: IGBT TRENCH 650V 55A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 51 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO220-3
IGBT Type: Trench
Td (on/off) @ 25°C: 19ns/177ns
Switching Energy: 280µJ (on), 100µJ (off)
Test Condition: 400V, 15A, 23Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
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IAUA170N10S5N031AUMA1 IAUA170N10S5N031AUMA1 Infineon Technologies Infineon-IAUA170N10S5N031-DataSheet-v01_00-EN.pdf?fileId=5546d4627956d53f01798e39952b0b32 Description: MOSFET_(75V 120V( PG-HSOF-5
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 6405 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 88 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-HSOF-5-4
Vgs(th) (Max) @ Id: 3.8V @ 110µA
Power Dissipation (Max): 197W (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 85A, 10V
Current - Continuous Drain (Id) @ 25°C: 170A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 5-PowerSFN
Packaging: Cut Tape (CT)
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CY95F636KPMC-G-UNK1E2 CY95F636KPMC-G-UNK1E2 Infineon Technologies infineon-cy95630h-series-new-8fx-8-bit-microcontrollers-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0edd859f61fe&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration Description: IC MCU 8BIT 36KB FLASH 32LQFP
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 36KB (36K x 8)
Number of I/O: 29
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
DigiKey Programmable: Not Verified
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FS300R12N3E7BPSA1 FS300R12N3E7BPSA1 Infineon Technologies Infineon-FS300R12N3E7-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8900bb57018901d6e6f6124b Description: IGBT MOD 1200V 300A AG-ECONO3B
Packaging: Tray
Part Status: Active
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.75V @ 15V, 300A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO3B
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 300 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Cutoff (Max): 100 µA
Input Capacitance (Cies) @ Vce: 46000 pF @ 25 V
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XMC4800F100K2048AAXQMA1 XMC4800F100K2048AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
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XMC4502F100F768ACXQMA1 XMC4502F100F768ACXQMA1 Infineon Technologies Infineon-XMC4500-DS-v01_05-EN.pdf?fileId=5546d46254e133b40154e1b56cbe0123 Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-11
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
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XMC4400F64K512BAXQMA1 XMC4400F64K512BAXQMA1 Infineon Technologies Infineon-XMC4400-DS-v01_03-EN.pdf?fileId=5546d462696dbf12016981795855391d Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-19
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
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KITXMC48IOTAWSWIFITOBO1 KITXMC48IOTAWSWIFITOBO1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_01-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IOT AMAZON FREERTOS CONNECTIVITY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Board Type: Evaluation Platform
Utilized IC / Part: XMC4800
Platform: IoT Amazon FreeRTOS Connectivity
Part Status: Active
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XMC4700F100F1536AAXQMA1 XMC4700F100F1536AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
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XMC4200F64K256BAXQSA1 XMC4200F64K256BAXQSA1 Infineon Technologies Infineon-XMC4100_XMC4200_DS-DS-v01_04-EN.pdf?fileId=5546d462696dbf120169817056f938ff Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-19
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
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XMC4800F144K1024AAXQMA1 XMC4800F144K1024AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 200K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 119
Part Status: Active
Supplier Device Package: PG-LQFP-144-24
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 32x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
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XMC4200Q48F256BAXUMA1 XMC4200Q48F256BAXUMA1 Infineon Technologies Infineon-XMC4100_XMC4200_DS-DS-v01_04-EN.pdf?fileId=5546d462696dbf120169817056f938ff Description: IC MCU 32BIT 256KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-71
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC4200Q48F256BAXUMA1 XMC4200Q48F256BAXUMA1 Infineon Technologies Infineon-XMC4100_XMC4200_DS-DS-v01_04-EN.pdf?fileId=5546d462696dbf120169817056f938ff Description: IC MCU 32BIT 256KB FLASH 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-71
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
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IRG7PH42UDPBF IRG7PH42UDPBF Infineon Technologies fundamentals-of-power-semiconductors Description: IGBT TRENCH 1200V 85A TO-247AC
Power - Max: 320 W
Current - Collector Pulsed (Icm): 90 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 85 A
Part Status: Obsolete
Gate Charge: 157 nC
Test Condition: 600V, 30A, 10Ohm, 15V
Switching Energy: 2.11mJ (on), 1.18mJ (off)
Td (on/off) @ 25°C: 25ns/229ns
IGBT Type: Trench
Supplier Device Package: TO-247AC
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 30A
Reverse Recovery Time (trr): 153 ns
Input Type: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
Produkt ist nicht verfügbar
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IPB043N10NF2SATMA1 IPB043N10NF2SATMA1 Infineon Technologies Infineon-IPB043N10NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c83cd30810183f4dc08991b18 Description: AUTOMOTIVE MOSFET
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Ta), 135A (Tc)
Rds On (Max) @ Id, Vgs: 4.35mOhm @ 80A, 10V
Power Dissipation (Max): 3.8W (Ta), 167W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 93µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 85 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4000 pF @ 50 V
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IPB043N10NF2SATMA1 IPB043N10NF2SATMA1 Infineon Technologies Infineon-IPB043N10NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c83cd30810183f4dc08991b18 Description: AUTOMOTIVE MOSFET
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Ta), 135A (Tc)
Rds On (Max) @ Id, Vgs: 4.35mOhm @ 80A, 10V
Power Dissipation (Max): 3.8W (Ta), 167W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 93µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 85 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4000 pF @ 50 V
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CY8C4146AZI-S463 CY8C4146AZI-S463 Infineon Technologies PSoC_4100S_Plus_RevH_9-14-18.pdf Description: IC MCU 32BIT 64KB FLASH 48TQFP
Number of I/O: 38
Part Status: Active
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b, 16x12b SAR; D/A 2x7b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
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S29GL064S80TFV030 S29GL064S80TFV030 Infineon Technologies infineon-s29gl064s-64-mbit8-mbyte3-datasheet-en.pdf Description: IC FLASH 64MBIT PARALLEL 48TSOP
Memory Organization: 8M x 8, 4M x 16
Access Time: 80 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Packaging: Tray
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CY9BF366KPMC-G-JNE2 CY9BF366KPMC-G-JNE2 Infineon Technologies download Description: IC MCU 32BIT 544KB FLASH 48LQFP
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 544KB (544K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF329TABGL-GK7E1 CY9BF329TABGL-GK7E1 Infineon Technologies Infineon-CY9B320TA_Series_32_bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ede43db632b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32B 1.5625MB FLSH 192FBGA
Number of I/O: 154
Part Status: Active
Supplier Device Package: 192-FBGA (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5625MB (1.5625M x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 192-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF365LPMC1-G-JNE2 CY9BF365LPMC1-G-JNE2 Infineon Technologies download Description: IC MCU 32BIT 416KB FLASH 64LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 416KB (416K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF365LPMC-G-JNE2 CY9BF365LPMC-G-JNE2 Infineon Technologies download Description: IC MCU 32BIT 416KB FLASH 64LQFP
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 416KB (416K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF364LQN-G-AVE2 CY9BF364LQN-G-AVE2 Infineon Technologies download Description: IC MCU 32BIT 288KB FLASH 64QFN
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-QFN (9x9)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF365KQN-G-AVE2 CY9BF365KQN-G-AVE2 Infineon Technologies download Description: IC MCU 32BIT 416KB FLASH 48QFN
RAM Size: 48K x 8
Program Memory Size: 416KB (416K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
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CY9BF364KQN-G-AVE2 CY9BF364KQN-G-AVE2 Infineon Technologies download Description: IC MCU 32BIT 288KB FLASH 48QFN
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
DigiKey Programmable: Not Verified
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 2x12b
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CY9BF365LQN-G-AVE2 CY9BF365LQN-G-AVE2 Infineon Technologies download Description: IC MCU 32BIT 416KB FLASH 64QFN
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-QFN (9x9)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 416KB (416K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF364LPMC-G-JNE2 CY9BF364LPMC-G-JNE2 Infineon Technologies download Description: IC MCU 32BIT 288KB FLASH 64LQFP
Supplier Device Package: 64-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 48
Part Status: Active
Produkt ist nicht verfügbar
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CY9BF364LPMC1-G-JNE2 CY9BF364LPMC1-G-JNE2 Infineon Technologies download Description: IC MCU 32BIT 288KB FLASH 64LQFP
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
DigiKey Programmable: Not Verified
Packaging: Tray
auf Bestellung 1599 Stücke:
Lieferzeit 10-14 Tag (e)
2+14.3 EUR
10+11.13 EUR
25+10.33 EUR
160+9.75 EUR
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S29GL064S90FHVV10 S29GL064S90FHVV10 Infineon Technologies Infineon-S29GL064S_64-MBIT_(8_MBYTE)_3.0_V_FLASH_MEMORY-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed12bd84d2d&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 64MBIT PARALLEL 64FBGA
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
Memory Organization: 8M x 8, 4M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL064S80TFIV63 S29GL064S80TFIV63 Infineon Technologies Infineon-S29GL064S_64-MBIT_(8_MBYTE)_3.0_V_FLASH_MEMORY-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed12bd84d2d&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 64MBIT PARALLEL 56TSOP
Memory Organization: 4M x 16
Access Time: 80 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Produkt ist nicht verfügbar
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S29GL064S90TFVV20 S29GL064S90TFVV20 Infineon Technologies Infineon-S29GL064S_64-MBIT_(8_MBYTE)_3.0_V_FLASH_MEMORY-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed12bd84d2d&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 64MBIT PARALLEL 56TSOP
Memory Organization: 4M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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F3L300R12ME4B22BOSA1 Infineon-F3L300R12ME4_B22-DS-v03_00-en_de.pdf?fileId=db3a304333b8a7ca0133fa5e35d4447b
F3L300R12ME4B22BOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 450A 1550W MOD
Input Capacitance (Cies) @ Vce: 19 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 1550 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 450 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 300A
Operating Temperature: -40°C ~ 150°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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FS450R17OE4PBOSA1 Infineon-FS450R17OE4P-DS-v03_00-EN.pdf?fileId=5546d4625696ed760156e0a6fafc0bcc
FS450R17OE4PBOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1700V 900A 20MW
Input Capacitance (Cies) @ Vce: 36 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 900 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Operating Temperature: -40°C ~ 150°C
Configuration: Full Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 450A
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FZ1200R45KL3B5NOSA1 Infineon-FZ1200R45KL3_B5-DS-v03_00-en_de.pdf?fileId=db3a30433dd42dcf013dd5609e070303
FZ1200R45KL3B5NOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 4500V 1200A
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 13500 W
Voltage - Collector Emitter Breakdown (Max): 4500 V
Current - Collector (Ic) (Max): 1200 A
Part Status: Active
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.85V @ 15V, 1200A
Operating Temperature: -50°C ~ 125°C
Configuration: Single
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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1+4814.78 EUR
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FF450R12ME4 INFNS28405-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: INSULATED GATE BIPOLAR TRANSISTO
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 450 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: AG-ECONOD
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Half Bridge Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Produkt ist nicht verfügbar
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FF450R12KT4HOSA1 Infineon-FF450R12KT4-DS-v03_00-en_de.pdf?fileId=db3a3043156fd573011619a84a5e1de5
FF450R12KT4HOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 450A 2400W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 450A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 2400 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
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1+291.5 EUR
10+246.13 EUR
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FF300R12ME4BOSA1 Infineon-FF300R12ME4-DS-v03_01-en_de.pdf?fileId=db3a30431a5c32f2011a76a01c216c55
FF300R12ME4BOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 450A 1600W MOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 300A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1600 W
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
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1+254.3 EUR
10+209.55 EUR
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FF450R12ME4PB11BOSA1 Infineon-FF450R12ME4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625b3ca4ec015b3e418861068a
FF450R12ME4PB11BOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 450A
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 450 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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FF300R12ME4B11BPSA2 Infineon-FF300R12ME4_B11-DS-v02_00-en_de.pdf?fileId=db3a30432fbc32ee012fbf6ae2df3a5f
FF300R12ME4B11BPSA2
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 450A AG-ECONOD
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 300A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONOD
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1600 W
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
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1+249.89 EUR
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FF450R12ME4B61BPSA1 INFNS28406-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: FF450R12ME4 - INSULATED GATE BIP
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Power - Max: 2250 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 675 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: AG-ECONOD-3-2
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Half Bridge Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Produkt ist nicht verfügbar
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FF450R17ME4BOSA1 Infineon-FF450R17ME4-DS-v02_05-en_de.pdf?fileId=db3a30431ce5fb52011d70f86f916ee9
FF450R17ME4BOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1700V 600A 2500W MOD
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 450A
Operating Temperature: -40°C ~ 150°C
Configuration: 2 Independent
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Input Capacitance (Cies) @ Vce: 36 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Power - Max: 2500 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 600 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
auf Bestellung 15 Stücke:
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AnzahlPrivatkunde
1+320.55 EUR
10+277.12 EUR
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S25FL256SAGMFV003 001-98283%20Rev%20T.pdf
S25FL256SAGMFV003
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
DigiKey Programmable: Verified
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S25FL256SAGMFV003 001-98283%20Rev%20T.pdf
S25FL256SAGMFV003
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
DigiKey Programmable: Verified
auf Bestellung 1448 Stücke:
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2+12.02 EUR
10+11.19 EUR
25+10.85 EUR
50+10.59 EUR
100+10.34 EUR
250+10.01 EUR
500+9.76 EUR
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S25FL128SAGBHM200 Infineon-S25FL128S_S25FL256S_128_Mb_(16_MB)_256_Mb_(32_MB)_3.0V_SPI_Flash_Memory-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfb6a64a17
S25FL128SAGBHM200
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT SPI/QUAD 24BGA
Qualification: AEC-Q100
Grade: Automotive
DigiKey Programmable: Not Verified
Memory Organization: 16M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 128Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
auf Bestellung 349 Stücke:
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2+13.83 EUR
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40+12.41 EUR
80+11.14 EUR
338+10.79 EUR
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CY95F011HNPMC-G101UN-YE2
Hersteller: Infineon Technologies
Description: IC MCU
Packaging: Tray
Part Status: Active
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4+6.09 EUR
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595+3.44 EUR
1071+3.37 EUR
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TLV49611TAXBXA1 Infineon-Infineon-TLV4961-1TAB_Hall_Switch-DS-v01_00-DS-v01_00-EN.pdf?fileId=5546d4624e765da5014ede3a726e0b89
TLV49611TAXBXA1
Hersteller: Infineon Technologies
Description: MAGNETIC SWITCH LATCH TO92-3
Qualification: AEC-Q100
Grade: Automotive
Part Status: Active
Test Condition: 25°C
Supplier Device Package: TO-92-3
Current - Supply (Max): 2.5mA
Current - Output (Max): 25mA
Sensing Range: 2mT Trip, -2mT Release
Technology: Hall Effect
Voltage - Supply: 3V ~ 26V
Operating Temperature: -40°C ~ 125°C (TA)
Function: Latch
Mounting Type: Through Hole
Polarization: South Pole
Output Type: Open Drain
Package / Case: TO-226-3, TO-92-3 (TO-226AA)
Features: Temperature Compensated
Packaging: Bulk
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22+0.96 EUR
25+0.83 EUR
27+0.8 EUR
29+0.74 EUR
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100+0.67 EUR
500+0.61 EUR
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MB89193APF-G-443-BND-RE1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB MROM 28SOP
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: POR, WDT
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Tube
Produkt ist nicht verfügbar
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MB89193APF-G-443-BND-R
MB89193APF-G-443-BND-R
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB MROM 28SOP
Number of I/O: 16
Part Status: Obsolete
Supplier Device Package: 28-SOP
Peripherals: POR, WDT
Connectivity: Serial I/O
Voltage - Supply (Vcc/Vdd): 2.2V ~ 6V
Core Size: 8-Bit
Data Converters: A/D 8x8b
Core Processor: F²MC-8L
Program Memory Type: Mask ROM
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 256 x 8
Program Memory Size: 8KB (8K x 8)
Speed: 4.2MHz
Mounting Type: Surface Mount
Package / Case: 28-SOIC (0.342", 8.69mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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2EDN7424RXTMA1 Infineon-2EDN7424R-DS-v02_00-EN.pdf?fileId=5546d4625c54d85b015c5e5812b13f6b
2EDN7424RXTMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR LOW-SIDE 8TSSOP
Packaging: Cut Tape (CT)
Package / Case: 8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Non-Inverting
Supplier Device Package: PG-TSSOP-8
Rise / Fall Time (Typ): 6.4ns, 5.4ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 1.2V, 1.9V
Current - Peak Output (Source, Sink): 4A, 4A
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4348 Stücke:
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14+1.52 EUR
19+1.11 EUR
25+0.99 EUR
100+0.87 EUR
250+0.81 EUR
500+0.79 EUR
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FZ2400R12HP4HOSA2 Infineon-FZ2400R12HP4-DS-v02_02-en_de.pdf?fileId=db3a30432313ff5e0123942e580d04a2
FZ2400R12HP4HOSA2
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 3460A 12500W MOD
Input Capacitance (Cies) @ Vce: 150 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 12500 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 3460 A
Part Status: Active
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 2400A
Operating Temperature: -40°C ~ 150°C
Configuration: Single Switch
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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1+927.77 EUR
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S25HL512TFANHI010 002-12345_rev-AF.pdf
S25HL512TFANHI010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Memory Interface: SPI - Quad I/O
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
auf Bestellung 71 Stücke:
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2+15.54 EUR
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S25FL256SAGMFVG03 001-98283%20Rev%20T.pdf
S25FL256SAGMFVG03
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
Memory Type: Non-Volatile
Memory Size: 256Mbit
DigiKey Programmable: Not Verified
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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S25FL256SAGMFVG03 001-98283%20Rev%20T.pdf
S25FL256SAGMFVG03
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 1437 Stücke:
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2+11.33 EUR
10+10.56 EUR
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CY9AF005PMC-G-UNE2
CY9AF005PMC-G-UNE2
Hersteller: Infineon Technologies
Description: IC MCU FLASH MICOM 100LQFP
Packaging: Tray
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
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2+15.48 EUR
10+13.98 EUR
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90+11.58 EUR
270+11.06 EUR
450+10.08 EUR
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S25FL256SAGMFVR03 001-98283%20Rev%20T.pdf
S25FL256SAGMFVR03
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S25FL256SAGMFVR03 001-98283%20Rev%20T.pdf
S25FL256SAGMFVR03
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
auf Bestellung 1250 Stücke:
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2+12.02 EUR
10+11.19 EUR
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S25FL256SAGMFV013 001-98283%20Rev%20T.pdf
S25FL256SAGMFV013
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
auf Bestellung 1450 Stücke:
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1450+8.85 EUR
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S25FL256SAGMFV013 001-98283%20Rev%20T.pdf
S25FL256SAGMFV013
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Part Status: Active
Supplier Device Package: 16-SOIC
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 256Mbit
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Memory Organization: 32M x 8
Memory Interface: SPI - Quad I/O
auf Bestellung 1450 Stücke:
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2+11.33 EUR
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500+9.21 EUR
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IPB0401NM5SATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Part Status: Active
Packaging: Cut Tape (CT)
auf Bestellung 988 Stücke:
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3+7.08 EUR
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CY95F334KTPMC-G-UNE2
Hersteller: Infineon Technologies
Description: IC MCU 16BIT LQFP
DigiKey Programmable: Not Verified
Part Status: Active
Packaging: Tray
auf Bestellung 2500 Stücke:
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3+9.03 EUR
10+8.12 EUR
25+7.68 EUR
80+6.65 EUR
250+6.31 EUR
500+5.65 EUR
1000+4.77 EUR
2500+4.55 EUR
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IKP30N65H5XKSA1 Infineon-IKP30N65H5-DS-v02_02-EN.pdf?fileId=5546d461464245d30146a51a2ca36d28
IKP30N65H5XKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH 650V 55A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 51 ns
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 30A
Supplier Device Package: PG-TO220-3
IGBT Type: Trench
Td (on/off) @ 25°C: 19ns/177ns
Switching Energy: 280µJ (on), 100µJ (off)
Test Condition: 400V, 15A, 23Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 90 A
Power - Max: 188 W
Produkt ist nicht verfügbar
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IAUA170N10S5N031AUMA1 Infineon-IAUA170N10S5N031-DataSheet-v01_00-EN.pdf?fileId=5546d4627956d53f01798e39952b0b32
IAUA170N10S5N031AUMA1
Hersteller: Infineon Technologies
Description: MOSFET_(75V 120V( PG-HSOF-5
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 6405 pF @ 50 V
Gate Charge (Qg) (Max) @ Vgs: 88 nC @ 10 V
Drain to Source Voltage (Vdss): 100 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-HSOF-5-4
Vgs(th) (Max) @ Id: 3.8V @ 110µA
Power Dissipation (Max): 197W (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 85A, 10V
Current - Continuous Drain (Id) @ 25°C: 170A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 5-PowerSFN
Packaging: Cut Tape (CT)
auf Bestellung 1472 Stücke:
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3+7.2 EUR
10+4.84 EUR
100+3.43 EUR
500+3.13 EUR
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CY95F636KPMC-G-UNK1E2 infineon-cy95630h-series-new-8fx-8-bit-microcontrollers-datasheet-en.pdf?fileId=8ac78c8c7d0d8da4017d0edd859f61fe&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration
CY95F636KPMC-G-UNK1E2
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 36KB FLASH 32LQFP
Speed: 16MHz
Mounting Type: Surface Mount
Package / Case: 32-LQFP
Packaging: Tray
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1K x 8
Program Memory Size: 36KB (36K x 8)
Number of I/O: 29
Part Status: Active
Supplier Device Package: 32-LQFP (7x7)
Peripherals: LVD, POR, PWM, WDT
Connectivity: I2C, LINbus, SIO, UART/USART
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x8/10b
Core Processor: F²MC-8FX
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FS300R12N3E7BPSA1 Infineon-FS300R12N3E7-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8900bb57018901d6e6f6124b
FS300R12N3E7BPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 300A AG-ECONO3B
Packaging: Tray
Part Status: Active
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.75V @ 15V, 300A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO3B
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 300 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Cutoff (Max): 100 µA
Input Capacitance (Cies) @ Vce: 46000 pF @ 25 V
Produkt ist nicht verfügbar
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XMC4800F100K2048AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800F100K2048AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 352K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
auf Bestellung 533 Stücke:
Lieferzeit 10-14 Tag (e)
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1+47.02 EUR
10+37.76 EUR
90+33.06 EUR
180+32.08 EUR
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XMC4502F100F768ACXQMA1 Infineon-XMC4500-DS-v01_05-EN.pdf?fileId=5546d46254e133b40154e1b56cbe0123
XMC4502F100F768ACXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 768KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 768KB (768K x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-11
Part Status: Active
Number of I/O: 55
DigiKey Programmable: Not Verified
auf Bestellung 205 Stücke:
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AnzahlPrivatkunde
1+23.23 EUR
10+18.22 EUR
90+15.7 EUR
180+15.16 EUR
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XMC4400F64K512BAXQMA1 Infineon-XMC4400-DS-v01_03-EN.pdf?fileId=5546d462696dbf12016981795855391d
XMC4400F64K512BAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 120MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 80K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 14x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-19
Part Status: Active
Number of I/O: 31
DigiKey Programmable: Not Verified
auf Bestellung 1920 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.87 EUR
10+17.96 EUR
50+15.98 EUR
100+15.36 EUR
160+15.02 EUR
640+14.21 EUR
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KITXMC48IOTAWSWIFITOBO1 Infineon-XMC4700-XMC4800-DS-v01_01-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
KITXMC48IOTAWSWIFITOBO1
Hersteller: Infineon Technologies
Description: IOT AMAZON FREERTOS CONNECTIVITY
Packaging: Bulk
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4F
Board Type: Evaluation Platform
Utilized IC / Part: XMC4800
Platform: IoT Amazon FreeRTOS Connectivity
Part Status: Active
Produkt ist nicht verfügbar
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XMC4700F100F1536AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4700F100F1536AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
auf Bestellung 436 Stücke:
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1+33.68 EUR
10+26.74 EUR
90+23.22 EUR
180+22.49 EUR
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XMC4200F64K256BAXQSA1 Infineon-XMC4100_XMC4200_DS-DS-v01_04-EN.pdf?fileId=5546d462696dbf120169817056f938ff
XMC4200F64K256BAXQSA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-19
Part Status: Active
Number of I/O: 35
DigiKey Programmable: Not Verified
auf Bestellung 110 Stücke:
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2+17.47 EUR
10+13.54 EUR
50+11.98 EUR
100+11.5 EUR
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XMC4800F144K1024AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800F144K1024AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 144LQFP
DigiKey Programmable: Not Verified
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 200K x 8
Program Memory Size: 1MB (1M x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tray
Number of I/O: 119
Part Status: Active
Supplier Device Package: PG-LQFP-144-24
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Core Size: 32-Bit
Data Converters: A/D 32x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4
auf Bestellung 357 Stücke:
Lieferzeit 10-14 Tag (e)
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1+41.94 EUR
10+33.56 EUR
60+29.92 EUR
120+28.93 EUR
300+27.89 EUR
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XMC4200Q48F256BAXUMA1 Infineon-XMC4100_XMC4200_DS-DS-v01_04-EN.pdf?fileId=5546d462696dbf120169817056f938ff
XMC4200Q48F256BAXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 48VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-71
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC4200Q48F256BAXUMA1 Infineon-XMC4100_XMC4200_DS-DS-v01_04-EN.pdf?fileId=5546d462696dbf120169817056f938ff
XMC4200Q48F256BAXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 48VQFN
Packaging: Cut Tape (CT)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 40K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, I2C, LINbus, SPI, UART/USART, USB
Peripherals: DMA, I2S, LED, POR, PWM, WDT
Supplier Device Package: PG-VQFN-48-71
Part Status: Active
Number of I/O: 21
DigiKey Programmable: Not Verified
auf Bestellung 1207 Stücke:
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2+14.27 EUR
10+11.01 EUR
50+9.7 EUR
100+9.29 EUR
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IRG7PH42UDPBF fundamentals-of-power-semiconductors
IRG7PH42UDPBF
Hersteller: Infineon Technologies
Description: IGBT TRENCH 1200V 85A TO-247AC
Power - Max: 320 W
Current - Collector Pulsed (Icm): 90 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 85 A
Part Status: Obsolete
Gate Charge: 157 nC
Test Condition: 600V, 30A, 10Ohm, 15V
Switching Energy: 2.11mJ (on), 1.18mJ (off)
Td (on/off) @ 25°C: 25ns/229ns
IGBT Type: Trench
Supplier Device Package: TO-247AC
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 30A
Reverse Recovery Time (trr): 153 ns
Input Type: Standard
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
Produkt ist nicht verfügbar
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IPB043N10NF2SATMA1 Infineon-IPB043N10NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c83cd30810183f4dc08991b18
IPB043N10NF2SATMA1
Hersteller: Infineon Technologies
Description: AUTOMOTIVE MOSFET
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Ta), 135A (Tc)
Rds On (Max) @ Id, Vgs: 4.35mOhm @ 80A, 10V
Power Dissipation (Max): 3.8W (Ta), 167W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 93µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 85 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4000 pF @ 50 V
Produkt ist nicht verfügbar
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IPB043N10NF2SATMA1 Infineon-IPB043N10NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c83cd30810183f4dc08991b18
IPB043N10NF2SATMA1
Hersteller: Infineon Technologies
Description: AUTOMOTIVE MOSFET
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Ta), 135A (Tc)
Rds On (Max) @ Id, Vgs: 4.35mOhm @ 80A, 10V
Power Dissipation (Max): 3.8W (Ta), 167W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 93µA
Supplier Device Package: PG-TO263-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 85 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4000 pF @ 50 V
auf Bestellung 22 Stücke:
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4+5.24 EUR
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CY8C4146AZI-S463 PSoC_4100S_Plus_RevH_9-14-18.pdf
CY8C4146AZI-S463
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 48TQFP
Number of I/O: 38
Part Status: Active
Supplier Device Package: 48-TQFP (7x7)
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Connectivity: I²C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x10b, 16x12b SAR; D/A 2x7b
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 8K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
auf Bestellung 500 Stücke:
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AnzahlPrivatkunde
2+13.34 EUR
10+11.98 EUR
25+11.33 EUR
80+9.82 EUR
250+9.32 EUR
500+8.37 EUR
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S29GL064S80TFV030 infineon-s29gl064s-64-mbit8-mbyte3-datasheet-en.pdf
S29GL064S80TFV030
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT PARALLEL 48TSOP
Memory Organization: 8M x 8, 4M x 16
Access Time: 80 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 48-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Packaging: Tray
auf Bestellung 95 Stücke:
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2+12.23 EUR
10+11.4 EUR
25+11.06 EUR
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CY9BF366KPMC-G-JNE2 download
CY9BF366KPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 544KB FLASH 48LQFP
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 64K x 8
Program Memory Size: 544KB (544K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF329TABGL-GK7E1 Infineon-CY9B320TA_Series_32_bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ede43db632b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9BF329TABGL-GK7E1
Hersteller: Infineon Technologies
Description: IC MCU 32B 1.5625MB FLSH 192FBGA
Number of I/O: 154
Part Status: Active
Supplier Device Package: 192-FBGA (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 192K x 8
Program Memory Size: 1.5625MB (1.5625M x 8)
Speed: 60MHz
Mounting Type: Surface Mount
Package / Case: 192-LFBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF365LPMC1-G-JNE2 download
CY9BF365LPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 416KB FLASH 64LQFP
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 416KB (416K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF365LPMC-G-JNE2 download
CY9BF365LPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 416KB FLASH 64LQFP
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 416KB (416K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF364LQN-G-AVE2 download
CY9BF364LQN-G-AVE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 64QFN
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-QFN (9x9)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF365KQN-G-AVE2 download
CY9BF365KQN-G-AVE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 416KB FLASH 48QFN
RAM Size: 48K x 8
Program Memory Size: 416KB (416K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
Produkt ist nicht verfügbar
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CY9BF364KQN-G-AVE2 download
CY9BF364KQN-G-AVE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 48QFN
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-QFN (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
DigiKey Programmable: Not Verified
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tray
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 2x12b
Produkt ist nicht verfügbar
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CY9BF365LQN-G-AVE2 download
CY9BF365LQN-G-AVE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 416KB FLASH 64QFN
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-QFN (9x9)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 48K x 8
Program Memory Size: 416KB (416K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF364LPMC-G-JNE2 download
CY9BF364LPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 64LQFP
Supplier Device Package: 64-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 48
Part Status: Active
Produkt ist nicht verfügbar
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CY9BF364LPMC1-G-JNE2 download
CY9BF364LPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 64LQFP
Number of I/O: 48
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 15x12b; D/A 2x10b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
DigiKey Programmable: Not Verified
Packaging: Tray
auf Bestellung 1599 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+14.3 EUR
10+11.13 EUR
25+10.33 EUR
160+9.75 EUR
Mindestbestellmenge: 2 Stücke
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S29GL064S90FHVV10 Infineon-S29GL064S_64-MBIT_(8_MBYTE)_3.0_V_FLASH_MEMORY-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed12bd84d2d&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S29GL064S90FHVV10
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT PARALLEL 64FBGA
Supplier Device Package: 64-FBGA (13x11)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 64-LBGA
Packaging: Tray
Memory Organization: 8M x 8, 4M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 360 Stücke
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S29GL064S80TFIV63 Infineon-S29GL064S_64-MBIT_(8_MBYTE)_3.0_V_FLASH_MEMORY-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed12bd84d2d&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S29GL064S80TFIV63
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT PARALLEL 56TSOP
Memory Organization: 4M x 16
Access Time: 80 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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S29GL064S90TFVV20 Infineon-S29GL064S_64-MBIT_(8_MBYTE)_3.0_V_FLASH_MEMORY-DataSheet-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed12bd84d2d&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S29GL064S90TFVV20
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT PARALLEL 56TSOP
Memory Organization: 4M x 16
Access Time: 90 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 60ns
Part Status: Active
Supplier Device Package: 56-TSOP
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 1.65V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 910 Stücke
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