Produkte > INFINEON TECHNOLOGIES > Alle Produkte des Herstellers INFINEON TECHNOLOGIES (126518) > Seite 553 nach 2109
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CY9AF344MBPMC-G-JNE2 | Infineon Technologies |
 Description: IC MCU 32BIT 288KB FLASH 80LQFPDigiKey Programmable: Not Verified Number of I/O: 66 Part Status: Active Supplier Device Package: 80-LQFP (12x12) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 17x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1190 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9AF344MBPMC1-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 80LQFP DigiKey Programmable: Not Verified Number of I/O: 66 Part Status: Active Supplier Device Package: 80-LQFP (14x14) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 17x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 80-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9AF344LBPMC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 51 Part Status: Active Supplier Device Package: 64-LQFP (12x12) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, I2C, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1190 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9AF344LBQN-G-AVE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 64QFN DigiKey Programmable: Not Verified Number of I/O: 51 Part Status: Active Supplier Device Package: 64-QFN (9x9) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, I2C, UART/USART, USB Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S25FS064SAGNFV033 | Infineon Technologies |
Description: IC FLASH 64MBIT SPI/QUAD 8LGA DigiKey Programmable: Not Verified Memory Organization: 8M x 8 Memory Interface: SPI - Quad I/O, QPI Part Status: Active Supplier Device Package: 8-LGA (5x6) Memory Format: FLASH Clock Frequency: 133 MHz Technology: FLASH - NOR Voltage - Supply: 1.7V ~ 2V Operating Temperature: -40°C ~ 105°C (TA) Memory Type: Non-Volatile Memory Size: 64Mbit Mounting Type: Surface Mount Package / Case: 8-WLGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S29AL008J70BFN010 | Infineon Technologies |
Description: IC FLASH 8MBIT PARALLEL 48FBGA DigiKey Programmable: Not Verified Memory Organization: 1M x 8, 512K x 16 Access Time: 70 ns Memory Interface: Parallel Write Cycle Time - Word, Page: 70ns Part Status: Active Supplier Device Package: 48-FBGA (8.15x6.15) Memory Format: FLASH Technology: FLASH - NOR Voltage - Supply: 2.7V ~ 3.6V Operating Temperature: -40°C ~ 125°C (TA) Memory Type: Non-Volatile Memory Size: 8Mbit Mounting Type: Surface Mount Package / Case: 48-VFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 676 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9BF314NPMC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 83 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 144MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
auf Bestellung 877 Stücke: Lieferzeit 10-14 Tag (e) |
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CY9BF306NBPMC-G-UNE2 | Infineon Technologies |
Description: IC MCU 32BIT 512KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 80 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 64K x 8 Program Memory Size: 512KB (512K x 8) Speed: 80MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9BF312NPMC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 160KB FLASH 100LQFP DigiKey Programmable: Not Verified Number of I/O: 83 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 160KB (160K x 8) Speed: 144MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9BF314NPQC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 100PQFP DigiKey Programmable: Not Verified Number of I/O: 83 Part Status: Active Supplier Device Package: 100-PQFP (14x20) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 144MHz Mounting Type: Surface Mount Package / Case: 100-BQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 660 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9BF312NPQC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 160KB FLASH 100PQFP DigiKey Programmable: Not Verified Number of I/O: 83 Part Status: Active Supplier Device Package: 100-PQFP (14x20) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 160KB (160K x 8) Speed: 144MHz Mounting Type: Surface Mount Package / Case: 100-BQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 660 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9BF312RPMC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 160KB FLASH 120LQFP DigiKey Programmable: Not Verified Number of I/O: 103 Part Status: Active Supplier Device Package: 120-LQFP (16x16) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 16x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 160KB (160K x 8) Speed: 144MHz Mounting Type: Surface Mount Package / Case: 120-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| CYW20835PB1KML1G | Infineon Technologies |
Description: Bluetooth, BLE and IEEE 802.15.4 Part Status: Discontinued at Digi-Key Serial Interfaces: ADC, I²C, PWM, SPI, UART RF Family/Standard: Bluetooth Modulation: GFSK GPIO: 24 Supplier Device Package: 60-QFN (7x7) Current - Transmitting: 18mA Data Rate (Max): 2Mbps Current - Receiving: 8mA Protocol: Bluetooth v5.2 Power - Output: 12dBm Voltage - Supply: 1.62V ~ 3.63V Operating Temperature: 0°C ~ 70°C Type: TxRx + MCU Memory Size: 384kB RAM, 2MB ROM Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -94.5dBm Package / Case: 60-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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CY9AFA41MABGL-GK9E1 | Infineon Technologies |
Description: IC MCU 32BIT 96KB FLASH 96FBGA DigiKey Programmable: Not Verified Number of I/O: 66 Part Status: Active Supplier Device Package: 96-FBGA (6x6) Peripherals: DMA, LCD, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, UART/USART Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Core Size: 32-Bit Data Converters: A/D 17x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 96KB (96K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 96-LFBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9BF464KPMC-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 48LQFP Number of I/O: 33 Part Status: Active Supplier Device Package: 48-LQFP (7x7) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CANbus, CSIO, I²C, LINbus, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Single-Core Data Converters: A/D 8x12b; D/A 2x12b Core Processor: ARM® Cortex®-M4F Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 160MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9AFA41LBPMC1-G-JNE2 | Infineon Technologies |
Description: IC MCU 32BIT 96KB FLASH 64LQFP DigiKey Programmable: Not Verified Number of I/O: 51 Part Status: Active Supplier Device Package: 64-LQFP (10x10) Peripherals: DMA, LCD, LVD, POR, PWM, WDT Connectivity: CSIO, I2C, UART/USART Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 96KB (96K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY9AFA41LBQN-G-AVE2 | Infineon Technologies |
Description: IC MCU 32BIT 96KB FLASH 64QFN DigiKey Programmable: Not Verified Number of I/O: 51 Part Status: Active Supplier Device Package: 64-QFN (9x9) Peripherals: DMA, LCD, LVD, POR, PWM, WDT Connectivity: CSIO, I2C, UART/USART Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V Core Size: 32-Bit Single-Core Data Converters: A/D 12x12b Core Processor: ARM® Cortex®-M3 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 16K x 8 Program Memory Size: 96KB (96K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 64-VFQFN Exposed Pad Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2600 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S29AL016J70FFI012 | Infineon Technologies |
Description: IC FLASH 16MBIT PARALLEL 64FBGA Packaging: Tape & Reel (TR) Package / Case: 64-LBGA Mounting Type: Surface Mount Memory Size: 16Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Memory Format: FLASH Supplier Device Package: 64-FBGA (13x11) Part Status: Active Write Cycle Time - Word, Page: 70ns Memory Interface: Parallel Access Time: 70 ns Memory Organization: 2M x 8, 1M x 16 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CYW43242KFFBG | Infineon Technologies |
Description: IC RF TXRX+MCU WIFI 252FCFBGA Part Status: Active Serial Interfaces: I²C, I²S, SPI, UART, USB RF Family/Standard: WiFi Modulation: GFSK GPIO: 13 Supplier Device Package: 252-FCFBGA (10x10) Current - Transmitting: 23.7mA Data Rate (Max): 54Mbps Current - Receiving: 23.8mA Protocol: 802.11a/b/g/n Power - Output: 19.5dBm Voltage - Supply: 3.3V Operating Temperature: 0°C ~ 70°C Type: TxRx + MCU Frequency: 2.4GHz Mounting Type: Surface Mount Sensitivity: -99dBm Package / Case: 252-TFBGA, FCBGA Packaging: Tray |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1680 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CYW43243KFFBG | Infineon Technologies |
Description: IC RF TXRX+MCU WIFI 252FCFBGA Part Status: Active Serial Interfaces: JTAG, SPI, UART RF Family/Standard: WiFi GPIO: 13 Supplier Device Package: 252-FCFBGA (10x10) Current - Transmitting: 23mA Data Rate (Max): 300Mbps Current - Receiving: 23mA Protocol: 802.11a/b/g/n Power - Output: 20dBm Voltage - Supply: 1.2V ~ 3.3V Operating Temperature: -10°C ~ 70°C Type: TxRx + MCU Frequency: 2.4GHz, 5GHz Mounting Type: Surface Mount Sensitivity: -94dBm Package / Case: 252-TFBGA, FCBGA Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1840 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| CYW43236BKMLGT | Infineon Technologies |
Description: IC RF WIFI 88QFN Part Status: Obsolete Supplier Device Package: 88-QFN (10x10) Mounting Type: Surface Mount Package / Case: 88-VFQFN Exposed Pad Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| CYW43236BKMLG | Infineon Technologies |
Description: IC RF WIFI 88QFN Supplier Device Package: 88-QFN (10x10) Mounting Type: Surface Mount Package / Case: 88-VFQFN Exposed Pad Packaging: Tray DigiKey Programmable: Not Verified Part Status: Obsolete |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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IDH10G65C6XKSA1 | Infineon Technologies |
Description: DIODE SIL CARB 650V 24A PGTO220 Packaging: Tube Package / Case: TO-220-2 Mounting Type: Through Hole Speed: Zero Recovery Time > 500mA (Io) Reverse Recovery Time (trr): 0 ns Technology: SiC (Silicon Carbide) Schottky Capacitance @ Vr, F: 495pF @ 1V, 1MHz Current - Average Rectified (Io): 24A Supplier Device Package: PG-TO220-2 Operating Temperature - Junction: -55°C ~ 175°C Part Status: Active Voltage - DC Reverse (Vr) (Max): 650 V Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 10 A Current - Reverse Leakage @ Vr: 33 µA @ 420 V |
auf Bestellung 1957 Stücke: Lieferzeit 10-14 Tag (e) |
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BGA9H1BN6E6327XTSA1 | Infineon Technologies |
Description: IC AMP 4G/5G 2.3GHZ-2.7GHZ TSNP6 Packaging: Cut Tape (CT) Package / Case: 6-XFDFN Mounting Type: Surface Mount Frequency: 2.3GHz ~ 2.7GHz RF Type: 4G, 5G Voltage - Supply: 1.1V ~ 3.3V Gain: 21.8dB Current - Supply: 5.5mA Noise Figure: 1.1dB P1dB: 5dBm Test Frequency: 2.6GHz Supplier Device Package: PG-TSNP-6-10 Part Status: Active |
auf Bestellung 13765 Stücke: Lieferzeit 10-14 Tag (e) |
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CYPD2103-20FNXIT | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 20WLCSP Packaging: Tape & Reel (TR) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C, SPI, UART/USART, USB RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 5.5V Program Memory Type: FLASH (32kB) Applications: USB Type C Core Processor: ARM® Cortex®-M0 Supplier Device Package: 20-WLCSP (1.63x2.03) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
auf Bestellung 118 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 118 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CYPD2103-20FNXIT | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 20WLCSP Packaging: Cut Tape (CT) Package / Case: 20-UFBGA, WLCSP Mounting Type: Surface Mount Interface: I2C, SPI, UART/USART, USB RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 5.5V Program Memory Type: FLASH (32kB) Applications: USB Type C Core Processor: ARM® Cortex®-M0 Supplier Device Package: 20-WLCSP (1.63x2.03) Part Status: Active Number of I/O: 9 DigiKey Programmable: Not Verified |
auf Bestellung 147 Stücke: Lieferzeit 10-14 Tag (e) |
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CYPD2134-24LQXIT | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-UFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C, SPI, UART/USART, USB RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 5.5V Program Memory Type: FLASH (32kB) Applications: USB Type C Core Processor: ARM® Cortex®-M0 Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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CYPD2134-24LQXIT | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 24QFN Packaging: Cut Tape (CT) Package / Case: 24-UFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C, SPI, UART/USART, USB RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 5.5V Program Memory Type: FLASH (32kB) Applications: USB Type C Core Processor: ARM® Cortex®-M0 Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
auf Bestellung 4900 Stücke: Lieferzeit 10-14 Tag (e) |
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| CYPD2154A1-12FNXIT | Infineon Technologies |
Description: CCG2 Part Status: Active Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| CYPD2154A1-12FNXIT | Infineon Technologies |
Description: CCG2 Part Status: Active Packaging: Cut Tape (CT) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| CYPD2103-14LHXI | Infineon Technologies |
Description: CCG2 DigiKey Programmable: Not Verified Number of I/O: 7 Part Status: Active Supplier Device Package: 14-DFN-EP (2.5x3.5) Core Processor: ARM® Cortex®-M0 Applications: USB Type C Voltage - Supply: 1.71V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 4K x 8 Interface: I²C, SPI, UART/USART, USB Mounting Type: Surface Mount Package / Case: 14-UFDFN Exposed Pad Packaging: Tray Program Memory Type: FLASH (32kB) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4900 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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CYPD2120-24LQXIT | Infineon Technologies |
Description: IC USB TYPE C 1-PORT 24QFN Packaging: Tape & Reel (TR) Package / Case: 24-UFQFN Exposed Pad Mounting Type: Surface Mount Interface: I2C, SPI, UART/USART, USB RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 1.71V ~ 5.5V Program Memory Type: FLASH (32kB) Applications: USB Type C Core Processor: ARM® Cortex®-M0 Supplier Device Package: 24-QFN (4x4) Part Status: Active Number of I/O: 14 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CYPM132197BZXIXQMA1 | Infineon Technologies |
Description: POWER DELIVERY MICROCONTROLLER Packaging: Tray Package / Case: 97-VFBGA Mounting Type: Surface Mount Interface: GPIO, I2C, SPI, UART, USB Type C RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 5.5V Program Memory Type: FLASH (256kB) Applications: USB Power Delivery (PD) Controller Core Processor: ARM® Cortex®-M0+ Supplier Device Package: 97-BGA (6x6) Part Status: Active Number of I/O: 50 |
auf Bestellung 2422 Stücke: Lieferzeit 10-14 Tag (e) |
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CYPM132197BZXITXUMA1 | Infineon Technologies |
Description: POWER DELIVERY MICROCONTROLLER Packaging: Tape & Reel (TR) Package / Case: 97-VFBGA Mounting Type: Surface Mount Interface: GPIO, I2C, SPI, UART, USB Type C RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 5.5V Program Memory Type: FLASH (256kB) Applications: USB Power Delivery (PD) Controller Core Processor: ARM® Cortex®-M0+ Supplier Device Package: 97-BGA (6x6) Part Status: Active Number of I/O: 50 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CYPM132197BZXITXUMA1 | Infineon Technologies |
Description: POWER DELIVERY MICROCONTROLLER Packaging: Cut Tape (CT) Package / Case: 97-VFBGA Mounting Type: Surface Mount Interface: GPIO, I2C, SPI, UART, USB Type C RAM Size: 32K x 8 Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.8V ~ 5.5V Program Memory Type: FLASH (256kB) Applications: USB Power Delivery (PD) Controller Core Processor: ARM® Cortex®-M0+ Supplier Device Package: 97-BGA (6x6) Part Status: Active Number of I/O: 50 |
auf Bestellung 525 Stücke: Lieferzeit 10-14 Tag (e) |
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KP201XTMA1 | Infineon Technologies |
Description: SENSOR 15.95PSIA DSOF8 Packaging: Cut Tape (CT) Package / Case: 8-SMD Module Output Type: SPI Mounting Type: Surface Mount Operating Pressure: 7.77PSI ~ 15.95PSI (53.6kPa ~ 110kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 125°C Termination Style: SMD (SMT) Tab Voltage - Supply: 4.5V ~ 11V Applications: Board Mount Supplier Device Package: PG-DSOF-8-16 Port Style: No Port Part Status: Active Grade: Automotive Qualification: AEC-Q100 |
auf Bestellung 1445 Stücke: Lieferzeit 10-14 Tag (e) |
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XDPS2221XUMA1 | Infineon Technologies |
Description: DIGITAL COMBO CONTROLLER FOR PFC Part Status: Active Supplier Device Package: PG-DSO-14 Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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XDPS2221XUMA1 | Infineon Technologies |
Description: DIGITAL COMBO CONTROLLER FOR PFC Part Status: Active Supplier Device Package: PG-DSO-14 Mounting Type: Surface Mount Package / Case: 14-SOIC (0.154", 3.90mm Width) Packaging: Cut Tape (CT) |
auf Bestellung 2474 Stücke: Lieferzeit 10-14 Tag (e) |
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ICE2QR1765ZXKLA1 | Infineon Technologies |
Description: IC OFFLINE SWITCH FLYBACK 7DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm), 7 Leads Mounting Type: Through Hole Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 50% Frequency - Switching: 52kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V Supplier Device Package: PG-DIP-7-1 Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Voltage - Start Up: 18 V Part Status: Active Power (Watts): 54.8 W |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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ICE2QR1765GXUMA1 | Infineon Technologies |
Description: IC OFFLINE SWITCH FLYBACK 12DSO Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 50% Frequency - Switching: 52kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V Supplier Device Package: PG-DSO-12-10 Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Voltage - Start Up: 18 V Part Status: Active Power (Watts): 49 W |
auf Bestellung 2500 Stücke: Lieferzeit 10-14 Tag (e) |
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ICE2QR1765GXUMA1 | Infineon Technologies |
Description: IC OFFLINE SWITCH FLYBACK 12DSO Packaging: Cut Tape (CT) Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads Mounting Type: Surface Mount Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 50% Frequency - Switching: 52kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V Supplier Device Package: PG-DSO-12-10 Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Voltage - Start Up: 18 V Part Status: Active Power (Watts): 49 W |
auf Bestellung 3993 Stücke: Lieferzeit 10-14 Tag (e) |
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ICE2QR1765XKLA1 | Infineon Technologies |
Description: IC OFFLINE SWITCH FLYBACK 8DIP Packaging: Tube Package / Case: 8-DIP (0.300", 7.62mm) Mounting Type: Through Hole Operating Temperature: -40°C ~ 150°C (TJ) Duty Cycle: 50% Frequency - Switching: 52kHz Internal Switch(s): Yes Voltage - Breakdown: 650V Output Isolation: Isolated Topology: Flyback Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V Supplier Device Package: PG-DIP-8 Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage Voltage - Start Up: 18 V Part Status: Active Power (Watts): 56.4 W |
auf Bestellung 1500 Stücke: Lieferzeit 10-14 Tag (e) |
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S6E2H14F0AGV2000M | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 100LQFP Number of I/O: 80 Part Status: Active Supplier Device Package: 100-LQFP (14x14) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b; D/A 2x12b Core Processor: ARM® Cortex®-M4F Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 160MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 900 Stücke: Lieferzeit 10-14 Tag (e) |
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S6E2H14G0AGV2000M | Infineon Technologies |
Description: IC MCU 32BIT 288KB FLASH 120LQFP Number of I/O: 100 Part Status: Active Supplier Device Package: 120-LQFP (16x16) Peripherals: DMA, LVD, POR, PWM, WDT Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V Core Size: 32-Bit Data Converters: A/D 24x12b; D/A 2x12b Core Processor: ARM® Cortex®-M4F Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TJ) RAM Size: 32K x 8 Program Memory Size: 288KB (288K x 8) Speed: 160MHz Mounting Type: Surface Mount Package / Case: 120-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 840 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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S25FL064LABMFA003 | Infineon Technologies |
Description: IC FLASH 64MBIT SPI/QUAD 16SOIC Packaging: Tape & Reel (TR) Package / Case: 16-SOIC (0.295", 7.50mm Width) Mounting Type: Surface Mount Memory Size: 64Mbit Memory Type: Non-Volatile Operating Temperature: -40°C ~ 85°C (TA) Voltage - Supply: 2.7V ~ 3.6V Technology: FLASH - NOR Clock Frequency: 108 MHz Memory Format: FLASH Supplier Device Package: 16-SOIC Part Status: Active Memory Interface: SPI - Quad I/O, QPI Memory Organization: 8M x 8 DigiKey Programmable: Not Verified Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1450 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CY8C4025AZQ-S413 | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 48TQFP Packaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 24MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 105°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 16x10b Sigma-Delta; D/A 2x7/8b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 233 Stücke: Lieferzeit 10-14 Tag (e) |
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IPP320N20N3GXKSA1 | Infineon Technologies |
Description: MOSFET N-CH 200V 34A TO220-3 Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 34A (Tc) Rds On (Max) @ Id, Vgs: 32mOhm @ 34A, 10V Power Dissipation (Max): 136W (Tc) Vgs(th) (Max) @ Id: 4V @ 90µA Supplier Device Package: PG-TO220-3 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 200 V Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 2350 pF @ 100 V |
auf Bestellung 2254 Stücke: Lieferzeit 10-14 Tag (e) |
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IPP600N25N3GXKSA1 | Infineon Technologies |
Description: MOSFET N-CH 250V 25A TO220-3 Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 25A (Tc) Rds On (Max) @ Id, Vgs: 60mOhm @ 25A, 10V Power Dissipation (Max): 136W (Tc) Vgs(th) (Max) @ Id: 4V @ 90µA Supplier Device Package: PG-TO220-3-1 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 250 V Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 2350 pF @ 100 V |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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IPA045N10N3GXKSA1 | Infineon Technologies |
Description: MOSFET N-CH 100V 64A TO220-FP Packaging: Tube Package / Case: TO-220-3 Full Pack Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 64A (Tc) Rds On (Max) @ Id, Vgs: 4.5mOhm @ 64A, 10V Power Dissipation (Max): 39W (Tc) Vgs(th) (Max) @ Id: 3.5V @ 150µA Supplier Device Package: PG-TO220-FP Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 6V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 117 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 8410 pF @ 50 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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IPP045N10N3GXKSA1 | Infineon Technologies |
Description: MOSFET N-CH 100V 100A TO220-3 Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 155°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 100A (Tc) Rds On (Max) @ Id, Vgs: 4.5mOhm @ 100A, 10V Power Dissipation (Max): 214W (Tc) Vgs(th) (Max) @ Id: 3.5V @ 150µA Supplier Device Package: PG-TO220-3 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 6V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 117 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 8410 pF @ 50 V |
auf Bestellung 3336 Stücke: Lieferzeit 10-14 Tag (e) |
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IAUA180N08S5N026AUMA1 | Infineon Technologies |
Description: MOSFET_(75V 120V( PG-HSOF-5 Packaging: Cut Tape (CT) Package / Case: 5-PowerSFN Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 180A (Tj) Rds On (Max) @ Id, Vgs: 2.6mOhm @ 90A, 10V Power Dissipation (Max): 179W (Tc) Vgs(th) (Max) @ Id: 3.8V @ 100µA Supplier Device Package: PG-HSOF-5-4 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 6V, 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 80 V Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5980 pF @ 40 V Grade: Automotive Qualification: AEC-Q101 |
auf Bestellung 1879 Stücke: Lieferzeit 10-14 Tag (e) |
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CYW54591RKUBGT | Infineon Technologies |
Description: IC RF TXRX+MCU BLE 194WLBGA Packaging: Tape & Reel (TR) Package / Case: 194-UFBGA, WLBGA Sensitivity: -98.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Memory Size: 896kB RAM, 896kB ROM Type: TxRx + MCU Operating Temperature: -20°C ~ 70°C (TA) Voltage - Supply: 3V ~ 4.8V Power - Output: 21dBm Protocol: 802.11a/b/g/-c, Bluetooth v5.0 Data Rate (Max): 433.3Mbps Supplier Device Package: 194-WLBGA (5.16x7.7) Modulation: 16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: I2S, PCM, UART, USB Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 5000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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CYW54591RKUBGT | Infineon Technologies |
Description: IC RF TXRX+MCU BLE 194WLBGA Packaging: Cut Tape (CT) Package / Case: 194-UFBGA, WLBGA Sensitivity: -98.8dBm Mounting Type: Surface Mount Frequency: 2.4GHz, 5GHz Memory Size: 896kB RAM, 896kB ROM Type: TxRx + MCU Operating Temperature: -20°C ~ 70°C (TA) Voltage - Supply: 3V ~ 4.8V Power - Output: 21dBm Protocol: 802.11a/b/g/-c, Bluetooth v5.0 Data Rate (Max): 433.3Mbps Supplier Device Package: 194-WLBGA (5.16x7.7) Modulation: 16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM RF Family/Standard: Bluetooth, WiFi Serial Interfaces: I2S, PCM, UART, USB Part Status: Active DigiKey Programmable: Not Verified |
auf Bestellung 4920 Stücke: Lieferzeit 10-14 Tag (e) |
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TC223L16F133NACLXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 1MB FLASH 100TQFP Packaging: Tape & Reel (TR) Package / Case: 100-TQFP Exposed Pad Mounting Type: Surface Mount Speed: 133MHz Program Memory Size: 1MB (1M x 8) RAM Size: 96K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 96K x 8 Core Processor: TriCore™ Data Converters: A/D 24x12b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 3.3V Connectivity: CANbus, FlexRay, LINbus, QSPI Peripherals: DMA, WDT Supplier Device Package: PG-TQFP-100-23 Part Status: Active Number of I/O: 78 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SAK-TC297TP-128F300N BC | Infineon Technologies |
Description: IC MCU 32BIT 8MB FLASH 292LFBGA Number of I/O: 169 Part Status: Active Supplier Device Package: PG-LFBGA-292-6 Peripherals: DMA, WDT Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 94x12b SAR, Sigma-Delta Core Processor: TriCore™ EEPROM Size: 768K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 728K x 8 Program Memory Size: 8MB (8M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TC297TP128F300SBBKXUMA2 | Infineon Technologies |
Description: IC MCU 32BIT 8MB FLASH 292LFBGA Number of I/O: 169 Part Status: Active Supplier Device Package: PG-LFBGA-292-6 Peripherals: DMA, POR, WDT Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 72x12b SAR, Sigma-Delta Core Processor: TriCore™ EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 728K x 8 Program Memory Size: 8MB (8M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TC297TP128F300SBCKXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 8MB FLASH 292LFBGA Packaging: Tape & Reel (TR) Package / Case: 292-LFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 8MB (8M x 8) RAM Size: 728K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: External Program Memory Type: FLASH EEPROM Size: 384K x 8 Core Processor: TriCore™ Data Converters: A/D 84x12b, 10 x Sigma-Delta Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.3V, 5V Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Peripherals: DMA, WDT Supplier Device Package: PG-LFBGA-292-6 Part Status: Discontinued at Digi-Key Number of I/O: 169 DigiKey Programmable: Not Verified |
auf Bestellung 4000 Stücke: Lieferzeit 10-14 Tag (e) |
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| FS10R06VL4_B2 | Infineon Technologies |
Description: IGBT MODULE Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Three Phase Inverter Operating Temperature: -40°C ~ 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 10A NTC Thermistor: Yes Supplier Device Package: AG-EASY750-1-1 Part Status: Active Current - Collector (Ic) (Max): 16 A Voltage - Collector Emitter Breakdown (Max): 600 V Power - Max: 50 W Current - Collector Cutoff (Max): 1 mA Input Capacitance (Cies) @ Vce: 550 pF @ 25 V |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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SCREWCLAMPEASY750GEXOXA1 | Infineon Technologies |
Description: EASY ACCESSORY Packaging: Tray Type: Mount Part Status: Active |
auf Bestellung 200 Stücke: Lieferzeit 10-14 Tag (e) |
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IPB023N04NF2SATMA1 | Infineon Technologies |
Description: TRENCH <= 40V Rds On (Max) @ Id, Vgs: 2.35mOhm @ 70A, 10V Current - Continuous Drain (Id) @ 25°C: 30A (Ta), 122A (Tc) FET Type: N-Channel Technology: MOSFET (Metal Oxide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Surface Mount Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB Packaging: Tape & Reel (TR) Input Capacitance (Ciss) (Max) @ Vds: 4800 pF @ 20 V Gate Charge (Qg) (Max) @ Vgs: 102 nC @ 10 V Drain to Source Voltage (Vdss): 40 V Vgs (Max): ±20V Drive Voltage (Max Rds On, Min Rds On): 6V, 10V Part Status: Active Supplier Device Package: PG-TO263-3 Vgs(th) (Max) @ Id: 3.4V @ 81µA Power Dissipation (Max): 3.8W (Ta), 150W (Tc) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 800 Stücke Im Einkaufswagen Stück im Wert von UAH |
| CY9AF344MBPMC-G-JNE2 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 17x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Description: IC MCU 32BIT 288KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 17x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 1190 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CY9AF344MBPMC1-G-JNE2 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 17x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Description: IC MCU 32BIT 288KB FLASH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 80-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 17x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CY9AF344LBPMC-G-JNE2 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 288KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (12x12)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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| CY9AF344LBQN-G-AVE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-QFN (9x9)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 288KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-QFN (9x9)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
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| S25FS064SAGNFV033 |
|
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 8LGA
DigiKey Programmable: Not Verified
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 8-LGA (5x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.7V ~ 2V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 8-WLGA
Packaging: Tape & Reel (TR)
Description: IC FLASH 64MBIT SPI/QUAD 8LGA
DigiKey Programmable: Not Verified
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O, QPI
Part Status: Active
Supplier Device Package: 8-LGA (5x6)
Memory Format: FLASH
Clock Frequency: 133 MHz
Technology: FLASH - NOR
Voltage - Supply: 1.7V ~ 2V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 8-WLGA
Packaging: Tape & Reel (TR)
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| S29AL008J70BFN010 |
|
Hersteller: Infineon Technologies
Description: IC FLASH 8MBIT PARALLEL 48FBGA
DigiKey Programmable: Not Verified
Memory Organization: 1M x 8, 512K x 16
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 70ns
Part Status: Active
Supplier Device Package: 48-FBGA (8.15x6.15)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Mbit
Mounting Type: Surface Mount
Package / Case: 48-VFBGA
Packaging: Tray
Description: IC FLASH 8MBIT PARALLEL 48FBGA
DigiKey Programmable: Not Verified
Memory Organization: 1M x 8, 512K x 16
Access Time: 70 ns
Memory Interface: Parallel
Write Cycle Time - Word, Page: 70ns
Part Status: Active
Supplier Device Package: 48-FBGA (8.15x6.15)
Memory Format: FLASH
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 125°C (TA)
Memory Type: Non-Volatile
Memory Size: 8Mbit
Mounting Type: Surface Mount
Package / Case: 48-VFBGA
Packaging: Tray
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| CY9BF314NPMC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 288KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
auf Bestellung 877 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 19.04 EUR |
| 10+ | 14.95 EUR |
| 25+ | 13.92 EUR |
| 90+ | 13.36 EUR |
| CY9BF306NBPMC-G-UNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 512KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 64K x 8
Program Memory Size: 512KB (512K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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| CY9BF312NPMC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 160KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Description: IC MCU 32BIT 160KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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| CY9BF314NPQC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 100PQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-PQFP (14x20)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Description: IC MCU 32BIT 288KB FLASH 100PQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-PQFP (14x20)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
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| CY9BF312NPQC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 160KB FLASH 100PQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-PQFP (14x20)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
Description: IC MCU 32BIT 160KB FLASH 100PQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Part Status: Active
Supplier Device Package: 100-PQFP (14x20)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 100-BQFP
Packaging: Tray
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| CY9BF312RPMC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 160KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 103
Part Status: Active
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
Description: IC MCU 32BIT 160KB FLASH 120LQFP
DigiKey Programmable: Not Verified
Number of I/O: 103
Part Status: Active
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 16x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 144MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
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| CYW20835PB1KML1G |
|
Hersteller: Infineon Technologies
Description: Bluetooth, BLE and IEEE 802.15.4
Part Status: Discontinued at Digi-Key
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
Modulation: GFSK
GPIO: 24
Supplier Device Package: 60-QFN (7x7)
Current - Transmitting: 18mA
Data Rate (Max): 2Mbps
Current - Receiving: 8mA
Protocol: Bluetooth v5.2
Power - Output: 12dBm
Voltage - Supply: 1.62V ~ 3.63V
Operating Temperature: 0°C ~ 70°C
Type: TxRx + MCU
Memory Size: 384kB RAM, 2MB ROM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -94.5dBm
Package / Case: 60-VFQFN Exposed Pad
Packaging: Tray
Description: Bluetooth, BLE and IEEE 802.15.4
Part Status: Discontinued at Digi-Key
Serial Interfaces: ADC, I²C, PWM, SPI, UART
RF Family/Standard: Bluetooth
Modulation: GFSK
GPIO: 24
Supplier Device Package: 60-QFN (7x7)
Current - Transmitting: 18mA
Data Rate (Max): 2Mbps
Current - Receiving: 8mA
Protocol: Bluetooth v5.2
Power - Output: 12dBm
Voltage - Supply: 1.62V ~ 3.63V
Operating Temperature: 0°C ~ 70°C
Type: TxRx + MCU
Memory Size: 384kB RAM, 2MB ROM
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -94.5dBm
Package / Case: 60-VFQFN Exposed Pad
Packaging: Tray
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| CY9AFA41MABGL-GK9E1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB FLASH 96FBGA
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 96-FBGA (6x6)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Packaging: Tray
Description: IC MCU 32BIT 96KB FLASH 96FBGA
DigiKey Programmable: Not Verified
Number of I/O: 66
Part Status: Active
Supplier Device Package: 96-FBGA (6x6)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit
Data Converters: A/D 17x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 96-LFBGA
Packaging: Tray
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| CY9BF464KPMC-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 48LQFP
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, I²C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Description: IC MCU 32BIT 288KB FLASH 48LQFP
Number of I/O: 33
Part Status: Active
Supplier Device Package: 48-LQFP (7x7)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CANbus, CSIO, I²C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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| CY9AFA41LBPMC1-G-JNE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Description: IC MCU 32BIT 96KB FLASH 64LQFP
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-LQFP (10x10)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
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| CY9AFA41LBQN-G-AVE2 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-QFN (9x9)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Description: IC MCU 32BIT 96KB FLASH 64QFN
DigiKey Programmable: Not Verified
Number of I/O: 51
Part Status: Active
Supplier Device Package: 64-QFN (9x9)
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CSIO, I2C, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 12x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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| S29AL016J70FFI012 |
|
Hersteller: Infineon Technologies
Description: IC FLASH 16MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Description: IC FLASH 16MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (13x11)
Part Status: Active
Write Cycle Time - Word, Page: 70ns
Memory Interface: Parallel
Access Time: 70 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| CYW43242KFFBG |
|
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU WIFI 252FCFBGA
Part Status: Active
Serial Interfaces: I²C, I²S, SPI, UART, USB
RF Family/Standard: WiFi
Modulation: GFSK
GPIO: 13
Supplier Device Package: 252-FCFBGA (10x10)
Current - Transmitting: 23.7mA
Data Rate (Max): 54Mbps
Current - Receiving: 23.8mA
Protocol: 802.11a/b/g/n
Power - Output: 19.5dBm
Voltage - Supply: 3.3V
Operating Temperature: 0°C ~ 70°C
Type: TxRx + MCU
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -99dBm
Package / Case: 252-TFBGA, FCBGA
Packaging: Tray
Description: IC RF TXRX+MCU WIFI 252FCFBGA
Part Status: Active
Serial Interfaces: I²C, I²S, SPI, UART, USB
RF Family/Standard: WiFi
Modulation: GFSK
GPIO: 13
Supplier Device Package: 252-FCFBGA (10x10)
Current - Transmitting: 23.7mA
Data Rate (Max): 54Mbps
Current - Receiving: 23.8mA
Protocol: 802.11a/b/g/n
Power - Output: 19.5dBm
Voltage - Supply: 3.3V
Operating Temperature: 0°C ~ 70°C
Type: TxRx + MCU
Frequency: 2.4GHz
Mounting Type: Surface Mount
Sensitivity: -99dBm
Package / Case: 252-TFBGA, FCBGA
Packaging: Tray
Produkt ist nicht verfügbar
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| CYW43243KFFBG |
|
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU WIFI 252FCFBGA
Part Status: Active
Serial Interfaces: JTAG, SPI, UART
RF Family/Standard: WiFi
GPIO: 13
Supplier Device Package: 252-FCFBGA (10x10)
Current - Transmitting: 23mA
Data Rate (Max): 300Mbps
Current - Receiving: 23mA
Protocol: 802.11a/b/g/n
Power - Output: 20dBm
Voltage - Supply: 1.2V ~ 3.3V
Operating Temperature: -10°C ~ 70°C
Type: TxRx + MCU
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Sensitivity: -94dBm
Package / Case: 252-TFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU WIFI 252FCFBGA
Part Status: Active
Serial Interfaces: JTAG, SPI, UART
RF Family/Standard: WiFi
GPIO: 13
Supplier Device Package: 252-FCFBGA (10x10)
Current - Transmitting: 23mA
Data Rate (Max): 300Mbps
Current - Receiving: 23mA
Protocol: 802.11a/b/g/n
Power - Output: 20dBm
Voltage - Supply: 1.2V ~ 3.3V
Operating Temperature: -10°C ~ 70°C
Type: TxRx + MCU
Frequency: 2.4GHz, 5GHz
Mounting Type: Surface Mount
Sensitivity: -94dBm
Package / Case: 252-TFBGA, FCBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1840 Stücke
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| CYW43236BKMLGT |
|
Hersteller: Infineon Technologies
Description: IC RF WIFI 88QFN
Part Status: Obsolete
Supplier Device Package: 88-QFN (10x10)
Mounting Type: Surface Mount
Package / Case: 88-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC RF WIFI 88QFN
Part Status: Obsolete
Supplier Device Package: 88-QFN (10x10)
Mounting Type: Surface Mount
Package / Case: 88-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| CYW43236BKMLG |
|
Hersteller: Infineon Technologies
Description: IC RF WIFI 88QFN
Supplier Device Package: 88-QFN (10x10)
Mounting Type: Surface Mount
Package / Case: 88-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Part Status: Obsolete
Description: IC RF WIFI 88QFN
Supplier Device Package: 88-QFN (10x10)
Mounting Type: Surface Mount
Package / Case: 88-VFQFN Exposed Pad
Packaging: Tray
DigiKey Programmable: Not Verified
Part Status: Obsolete
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IDH10G65C6XKSA1 |
|
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 650V 24A PGTO220
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 495pF @ 1V, 1MHz
Current - Average Rectified (Io): 24A
Supplier Device Package: PG-TO220-2
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 10 A
Current - Reverse Leakage @ Vr: 33 µA @ 420 V
Description: DIODE SIL CARB 650V 24A PGTO220
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: Zero Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 495pF @ 1V, 1MHz
Current - Average Rectified (Io): 24A
Supplier Device Package: PG-TO220-2
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Active
Voltage - DC Reverse (Vr) (Max): 650 V
Voltage - Forward (Vf) (Max) @ If: 1.35 V @ 10 A
Current - Reverse Leakage @ Vr: 33 µA @ 420 V
auf Bestellung 1957 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.65 EUR |
| 50+ | 4.45 EUR |
| 100+ | 4.05 EUR |
| 500+ | 3.33 EUR |
| 1000+ | 3.11 EUR |
| BGA9H1BN6E6327XTSA1 |
|
Hersteller: Infineon Technologies
Description: IC AMP 4G/5G 2.3GHZ-2.7GHZ TSNP6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: 4G, 5G
Voltage - Supply: 1.1V ~ 3.3V
Gain: 21.8dB
Current - Supply: 5.5mA
Noise Figure: 1.1dB
P1dB: 5dBm
Test Frequency: 2.6GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
Description: IC AMP 4G/5G 2.3GHZ-2.7GHZ TSNP6
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 2.3GHz ~ 2.7GHz
RF Type: 4G, 5G
Voltage - Supply: 1.1V ~ 3.3V
Gain: 21.8dB
Current - Supply: 5.5mA
Noise Figure: 1.1dB
P1dB: 5dBm
Test Frequency: 2.6GHz
Supplier Device Package: PG-TSNP-6-10
Part Status: Active
auf Bestellung 13765 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 21+ | 1 EUR |
| 25+ | 0.87 EUR |
| 26+ | 0.82 EUR |
| 100+ | 0.75 EUR |
| 250+ | 0.71 EUR |
| 500+ | 0.68 EUR |
| 1000+ | 0.65 EUR |
| 5000+ | 0.6 EUR |
| CYPD2103-20FNXIT |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 20-WLCSP (1.63x2.03)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 20-WLCSP (1.63x2.03)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
auf Bestellung 118 Stücke:
Lieferzeit 10-14 Tag (e)
| CYPD2103-20FNXIT |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 20-WLCSP (1.63x2.03)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 20WLCSP
Packaging: Cut Tape (CT)
Package / Case: 20-UFBGA, WLCSP
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 20-WLCSP (1.63x2.03)
Part Status: Active
Number of I/O: 9
DigiKey Programmable: Not Verified
auf Bestellung 147 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.89 EUR |
| 10+ | 2.12 EUR |
| 25+ | 1.93 EUR |
| 100+ | 1.71 EUR |
| CYPD2134-24LQXIT |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 1.92 EUR |
| CYPD2134-24LQXIT |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
auf Bestellung 4900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.75 EUR |
| 10+ | 2.77 EUR |
| 25+ | 2.52 EUR |
| 100+ | 2.25 EUR |
| 250+ | 2.13 EUR |
| 500+ | 2.05 EUR |
| 1000+ | 1.99 EUR |
| CYPD2154A1-12FNXIT |
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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Stück im Wert von UAH
| CYPD2103-14LHXI |
|
Hersteller: Infineon Technologies
Description: CCG2
DigiKey Programmable: Not Verified
Number of I/O: 7
Part Status: Active
Supplier Device Package: 14-DFN-EP (2.5x3.5)
Core Processor: ARM® Cortex®-M0
Applications: USB Type C
Voltage - Supply: 1.71V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Interface: I²C, SPI, UART/USART, USB
Mounting Type: Surface Mount
Package / Case: 14-UFDFN Exposed Pad
Packaging: Tray
Program Memory Type: FLASH (32kB)
Description: CCG2
DigiKey Programmable: Not Verified
Number of I/O: 7
Part Status: Active
Supplier Device Package: 14-DFN-EP (2.5x3.5)
Core Processor: ARM® Cortex®-M0
Applications: USB Type C
Voltage - Supply: 1.71V ~ 5.5V
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Interface: I²C, SPI, UART/USART, USB
Mounting Type: Surface Mount
Package / Case: 14-UFDFN Exposed Pad
Packaging: Tray
Program Memory Type: FLASH (32kB)
Produkt ist nicht verfügbar
Mindestbestellmenge: 4900 Stücke
Im Einkaufswagen
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| CYPD2120-24LQXIT |
|
Hersteller: Infineon Technologies
Description: IC USB TYPE C 1-PORT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Description: IC USB TYPE C 1-PORT 24QFN
Packaging: Tape & Reel (TR)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Program Memory Type: FLASH (32kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Part Status: Active
Number of I/O: 14
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CYPM132197BZXIXQMA1 |
|
Hersteller: Infineon Technologies
Description: POWER DELIVERY MICROCONTROLLER
Packaging: Tray
Package / Case: 97-VFBGA
Mounting Type: Surface Mount
Interface: GPIO, I2C, SPI, UART, USB Type C
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Program Memory Type: FLASH (256kB)
Applications: USB Power Delivery (PD) Controller
Core Processor: ARM® Cortex®-M0+
Supplier Device Package: 97-BGA (6x6)
Part Status: Active
Number of I/O: 50
Description: POWER DELIVERY MICROCONTROLLER
Packaging: Tray
Package / Case: 97-VFBGA
Mounting Type: Surface Mount
Interface: GPIO, I2C, SPI, UART, USB Type C
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Program Memory Type: FLASH (256kB)
Applications: USB Power Delivery (PD) Controller
Core Processor: ARM® Cortex®-M0+
Supplier Device Package: 97-BGA (6x6)
Part Status: Active
Number of I/O: 50
auf Bestellung 2422 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.84 EUR |
| 10+ | 10.65 EUR |
| 50+ | 9.37 EUR |
| 100+ | 8.97 EUR |
| 490+ | 8.31 EUR |
| 980+ | 8.1 EUR |
| CYPM132197BZXITXUMA1 |
|
Hersteller: Infineon Technologies
Description: POWER DELIVERY MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 97-VFBGA
Mounting Type: Surface Mount
Interface: GPIO, I2C, SPI, UART, USB Type C
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Program Memory Type: FLASH (256kB)
Applications: USB Power Delivery (PD) Controller
Core Processor: ARM® Cortex®-M0+
Supplier Device Package: 97-BGA (6x6)
Part Status: Active
Number of I/O: 50
Description: POWER DELIVERY MICROCONTROLLER
Packaging: Tape & Reel (TR)
Package / Case: 97-VFBGA
Mounting Type: Surface Mount
Interface: GPIO, I2C, SPI, UART, USB Type C
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Program Memory Type: FLASH (256kB)
Applications: USB Power Delivery (PD) Controller
Core Processor: ARM® Cortex®-M0+
Supplier Device Package: 97-BGA (6x6)
Part Status: Active
Number of I/O: 50
Produkt ist nicht verfügbar
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Im Einkaufswagen
Stück im Wert von UAH
| CYPM132197BZXITXUMA1 |
|
Hersteller: Infineon Technologies
Description: POWER DELIVERY MICROCONTROLLER
Packaging: Cut Tape (CT)
Package / Case: 97-VFBGA
Mounting Type: Surface Mount
Interface: GPIO, I2C, SPI, UART, USB Type C
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Program Memory Type: FLASH (256kB)
Applications: USB Power Delivery (PD) Controller
Core Processor: ARM® Cortex®-M0+
Supplier Device Package: 97-BGA (6x6)
Part Status: Active
Number of I/O: 50
Description: POWER DELIVERY MICROCONTROLLER
Packaging: Cut Tape (CT)
Package / Case: 97-VFBGA
Mounting Type: Surface Mount
Interface: GPIO, I2C, SPI, UART, USB Type C
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.8V ~ 5.5V
Program Memory Type: FLASH (256kB)
Applications: USB Power Delivery (PD) Controller
Core Processor: ARM® Cortex®-M0+
Supplier Device Package: 97-BGA (6x6)
Part Status: Active
Number of I/O: 50
auf Bestellung 525 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.04 EUR |
| 10+ | 10.04 EUR |
| 50+ | 8.84 EUR |
| 100+ | 8.46 EUR |
| 500+ | 7.83 EUR |
| KP201XTMA1 |
|
Hersteller: Infineon Technologies
Description: SENSOR 15.95PSIA DSOF8
Packaging: Cut Tape (CT)
Package / Case: 8-SMD Module
Output Type: SPI
Mounting Type: Surface Mount
Operating Pressure: 7.77PSI ~ 15.95PSI (53.6kPa ~ 110kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.5V ~ 11V
Applications: Board Mount
Supplier Device Package: PG-DSOF-8-16
Port Style: No Port
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
Description: SENSOR 15.95PSIA DSOF8
Packaging: Cut Tape (CT)
Package / Case: 8-SMD Module
Output Type: SPI
Mounting Type: Surface Mount
Operating Pressure: 7.77PSI ~ 15.95PSI (53.6kPa ~ 110kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 125°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.5V ~ 11V
Applications: Board Mount
Supplier Device Package: PG-DSOF-8-16
Port Style: No Port
Part Status: Active
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 1445 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 10.39 EUR |
| 10+ | 8.19 EUR |
| 25+ | 7.46 EUR |
| 50+ | 6.96 EUR |
| 100+ | 6.81 EUR |
| XDPS2221XUMA1 |
Hersteller: Infineon Technologies
Description: DIGITAL COMBO CONTROLLER FOR PFC
Part Status: Active
Supplier Device Package: PG-DSO-14
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Description: DIGITAL COMBO CONTROLLER FOR PFC
Part Status: Active
Supplier Device Package: PG-DSO-14
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| XDPS2221XUMA1 |
Hersteller: Infineon Technologies
Description: DIGITAL COMBO CONTROLLER FOR PFC
Part Status: Active
Supplier Device Package: PG-DSO-14
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Description: DIGITAL COMBO CONTROLLER FOR PFC
Part Status: Active
Supplier Device Package: PG-DSO-14
Mounting Type: Surface Mount
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 2474 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.68 EUR |
| 10+ | 5.03 EUR |
| 25+ | 4.63 EUR |
| 100+ | 4.18 EUR |
| 250+ | 3.96 EUR |
| 500+ | 3.83 EUR |
| 1000+ | 3.72 EUR |
| ICE2QR1765ZXKLA1 |
|
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 7DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm), 7 Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DIP-7-1
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 54.8 W
Description: IC OFFLINE SWITCH FLYBACK 7DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm), 7 Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DIP-7-1
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 54.8 W
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| ICE2QR1765GXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 49 W
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 49 W
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 2.11 EUR |
| ICE2QR1765GXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 49 W
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Packaging: Cut Tape (CT)
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DSO-12-10
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 49 W
auf Bestellung 3993 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 4.08 EUR |
| 10+ | 3.03 EUR |
| 25+ | 2.77 EUR |
| 100+ | 2.48 EUR |
| 250+ | 2.34 EUR |
| 500+ | 2.27 EUR |
| ICE2QR1765XKLA1 |
|
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DIP-8
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 56.4 W
Description: IC OFFLINE SWITCH FLYBACK 8DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm)
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 50%
Frequency - Switching: 52kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 27V
Supplier Device Package: PG-DIP-8
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Active
Power (Watts): 56.4 W
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.21 EUR |
| 10+ | 3.13 EUR |
| 50+ | 2.69 EUR |
| 100+ | 2.55 EUR |
| 250+ | 2.4 EUR |
| 500+ | 2.32 EUR |
| 1000+ | 2.25 EUR |
| S6E2H14F0AGV2000M |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 100LQFP
Number of I/O: 80
Part Status: Active
Supplier Device Package: 100-LQFP (14x14)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.91 EUR |
| 10+ | 10.82 EUR |
| 90+ | 9.25 EUR |
| 180+ | 8.94 EUR |
| S6E2H14G0AGV2000M |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 120LQFP
Number of I/O: 100
Part Status: Active
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 288KB FLASH 120LQFP
Number of I/O: 100
Part Status: Active
Supplier Device Package: 120-LQFP (16x16)
Peripherals: DMA, LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b; D/A 2x12b
Core Processor: ARM® Cortex®-M4F
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TJ)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 160MHz
Mounting Type: Surface Mount
Package / Case: 120-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 840 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| S25FL064LABMFA003 |
|
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 8M x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Description: IC FLASH 64MBIT SPI/QUAD 16SOIC
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 8M x 8
DigiKey Programmable: Not Verified
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1450 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CY8C4025AZQ-S413 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b Sigma-Delta; D/A 2x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b Sigma-Delta; D/A 2x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 233 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.12 EUR |
| 10+ | 4.61 EUR |
| 25+ | 4.22 EUR |
| 100+ | 3.81 EUR |
| IPP320N20N3GXKSA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CH 200V 34A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 34A, 10V
Power Dissipation (Max): 136W (Tc)
Vgs(th) (Max) @ Id: 4V @ 90µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2350 pF @ 100 V
Description: MOSFET N-CH 200V 34A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 34A (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 34A, 10V
Power Dissipation (Max): 136W (Tc)
Vgs(th) (Max) @ Id: 4V @ 90µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2350 pF @ 100 V
auf Bestellung 2254 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.51 EUR |
| 10+ | 4.24 EUR |
| 50+ | 3.25 EUR |
| 100+ | 2.93 EUR |
| 500+ | 2.38 EUR |
| IPP600N25N3GXKSA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CH 250V 25A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Tc)
Rds On (Max) @ Id, Vgs: 60mOhm @ 25A, 10V
Power Dissipation (Max): 136W (Tc)
Vgs(th) (Max) @ Id: 4V @ 90µA
Supplier Device Package: PG-TO220-3-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 250 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2350 pF @ 100 V
Description: MOSFET N-CH 250V 25A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Tc)
Rds On (Max) @ Id, Vgs: 60mOhm @ 25A, 10V
Power Dissipation (Max): 136W (Tc)
Vgs(th) (Max) @ Id: 4V @ 90µA
Supplier Device Package: PG-TO220-3-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 250 V
Gate Charge (Qg) (Max) @ Vgs: 29 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2350 pF @ 100 V
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.33 EUR |
| 50+ | 3.17 EUR |
| 100+ | 2.86 EUR |
| 500+ | 2.32 EUR |
| 1000+ | 2.14 EUR |
| IPA045N10N3GXKSA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 64A TO220-FP
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 64A, 10V
Power Dissipation (Max): 39W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 150µA
Supplier Device Package: PG-TO220-FP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 117 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8410 pF @ 50 V
Description: MOSFET N-CH 100V 64A TO220-FP
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 64A, 10V
Power Dissipation (Max): 39W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 150µA
Supplier Device Package: PG-TO220-FP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 117 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8410 pF @ 50 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IPP045N10N3GXKSA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 100A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 155°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 100A, 10V
Power Dissipation (Max): 214W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 150µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 117 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8410 pF @ 50 V
Description: MOSFET N-CH 100V 100A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 155°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 100A, 10V
Power Dissipation (Max): 214W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 150µA
Supplier Device Package: PG-TO220-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 117 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8410 pF @ 50 V
auf Bestellung 3336 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.64 EUR |
| 50+ | 3.88 EUR |
| 100+ | 3.52 EUR |
| 500+ | 2.88 EUR |
| 1000+ | 2.68 EUR |
| 2000+ | 2.5 EUR |
| IAUA180N08S5N026AUMA1 |
|
Hersteller: Infineon Technologies
Description: MOSFET_(75V 120V( PG-HSOF-5
Packaging: Cut Tape (CT)
Package / Case: 5-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180A (Tj)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 90A, 10V
Power Dissipation (Max): 179W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 100µA
Supplier Device Package: PG-HSOF-5-4
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5980 pF @ 40 V
Grade: Automotive
Qualification: AEC-Q101
Description: MOSFET_(75V 120V( PG-HSOF-5
Packaging: Cut Tape (CT)
Package / Case: 5-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180A (Tj)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 90A, 10V
Power Dissipation (Max): 179W (Tc)
Vgs(th) (Max) @ Id: 3.8V @ 100µA
Supplier Device Package: PG-HSOF-5-4
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 87 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5980 pF @ 40 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1879 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.5 EUR |
| 10+ | 4.25 EUR |
| 100+ | 2.98 EUR |
| 500+ | 2.61 EUR |
| CYW54591RKUBGT |
|
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 194WLBGA
Packaging: Tape & Reel (TR)
Package / Case: 194-UFBGA, WLBGA
Sensitivity: -98.8dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Memory Size: 896kB RAM, 896kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 4.8V
Power - Output: 21dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.0
Data Rate (Max): 433.3Mbps
Supplier Device Package: 194-WLBGA (5.16x7.7)
Modulation: 16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 194WLBGA
Packaging: Tape & Reel (TR)
Package / Case: 194-UFBGA, WLBGA
Sensitivity: -98.8dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Memory Size: 896kB RAM, 896kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 4.8V
Power - Output: 21dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.0
Data Rate (Max): 433.3Mbps
Supplier Device Package: 194-WLBGA (5.16x7.7)
Modulation: 16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 5000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| CYW54591RKUBGT |
|
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 194WLBGA
Packaging: Cut Tape (CT)
Package / Case: 194-UFBGA, WLBGA
Sensitivity: -98.8dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Memory Size: 896kB RAM, 896kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 4.8V
Power - Output: 21dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.0
Data Rate (Max): 433.3Mbps
Supplier Device Package: 194-WLBGA (5.16x7.7)
Modulation: 16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC RF TXRX+MCU BLE 194WLBGA
Packaging: Cut Tape (CT)
Package / Case: 194-UFBGA, WLBGA
Sensitivity: -98.8dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Memory Size: 896kB RAM, 896kB ROM
Type: TxRx + MCU
Operating Temperature: -20°C ~ 70°C (TA)
Voltage - Supply: 3V ~ 4.8V
Power - Output: 21dBm
Protocol: 802.11a/b/g/-c, Bluetooth v5.0
Data Rate (Max): 433.3Mbps
Supplier Device Package: 194-WLBGA (5.16x7.7)
Modulation: 16QAM, 64QAM, 256QAM, BPSK, CCK, DSSS, GFSK, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCM, UART, USB
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 4920 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 22.6 EUR |
| 10+ | 19.64 EUR |
| 25+ | 18.61 EUR |
| 100+ | 17.21 EUR |
| 250+ | 16.36 EUR |
| 500+ | 15.77 EUR |
| 1000+ | 15.33 EUR |
| TC223L16F133NACLXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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Stück im Wert von UAH
| SAK-TC297TP-128F300N BC |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 768K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 728K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 768K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 728K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TC297TP128F300SBBKXUMA2 |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, POR, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 72x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 728K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, POR, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 72x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 728K x 8
Program Memory Size: 8MB (8M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| TC297TP128F300SBCKXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Discontinued at Digi-Key
Number of I/O: 169
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Discontinued at Digi-Key
Number of I/O: 169
DigiKey Programmable: Not Verified
auf Bestellung 4000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1000+ | 57.87 EUR |
| FS10R06VL4_B2 |
|
Hersteller: Infineon Technologies
Description: IGBT MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 10A
NTC Thermistor: Yes
Supplier Device Package: AG-EASY750-1-1
Part Status: Active
Current - Collector (Ic) (Max): 16 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 50 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 550 pF @ 25 V
Description: IGBT MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 10A
NTC Thermistor: Yes
Supplier Device Package: AG-EASY750-1-1
Part Status: Active
Current - Collector (Ic) (Max): 16 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 50 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 550 pF @ 25 V
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 24+ | 27.52 EUR |
| SCREWCLAMPEASY750GEXOXA1 |
|
Hersteller: Infineon Technologies
Description: EASY ACCESSORY
Packaging: Tray
Type: Mount
Part Status: Active
Description: EASY ACCESSORY
Packaging: Tray
Type: Mount
Part Status: Active
auf Bestellung 200 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 11+ | 2.03 EUR |
| 15+ | 1.46 EUR |
| 25+ | 1.32 EUR |
| 200+ | 1.11 EUR |
| IPB023N04NF2SATMA1 |
|
Hersteller: Infineon Technologies
Description: TRENCH <= 40V
Rds On (Max) @ Id, Vgs: 2.35mOhm @ 70A, 10V
Current - Continuous Drain (Id) @ 25°C: 30A (Ta), 122A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 4800 pF @ 20 V
Gate Charge (Qg) (Max) @ Vgs: 102 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-TO263-3
Vgs(th) (Max) @ Id: 3.4V @ 81µA
Power Dissipation (Max): 3.8W (Ta), 150W (Tc)
Description: TRENCH <= 40V
Rds On (Max) @ Id, Vgs: 2.35mOhm @ 70A, 10V
Current - Continuous Drain (Id) @ 25°C: 30A (Ta), 122A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 4800 pF @ 20 V
Gate Charge (Qg) (Max) @ Vgs: 102 nC @ 10 V
Drain to Source Voltage (Vdss): 40 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Part Status: Active
Supplier Device Package: PG-TO263-3
Vgs(th) (Max) @ Id: 3.4V @ 81µA
Power Dissipation (Max): 3.8W (Ta), 150W (Tc)
Produkt ist nicht verfügbar
Mindestbestellmenge: 800 Stücke
Im Einkaufswagen
Stück im Wert von UAH