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SAK-TC275TC-64F200N DC SAK-TC275TC-64F200N DC Infineon Technologies Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 424K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 24K x 8
Core Processor: TriCore™
Data Converters: A/D 48x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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64-2084PBF Infineon Technologies Description: IRF2907ZSPBF - HEXFET N-CHANNEL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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AUIRGS4062D1 AUIRGS4062D1 Infineon Technologies AUIRGB%2CS%2CSL4062D1.pdf Description: IGBT TRENCH 600V 59A D2PAK
Packaging: Tube
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 102 ns
Vce(on) (Max) @ Vge, Ic: 1.77V @ 15V, 24A
Supplier Device Package: D2PAK
IGBT Type: Trench
Td (on/off) @ 25°C: 19ns/90ns
Switching Energy: 532µJ (on), 311µJ (off)
Test Condition: 400V, 24A, 10Ohm, 15V
Gate Charge: 77 nC
Part Status: Obsolete
Current - Collector (Ic) (Max): 59 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 72 A
Power - Max: 246 W
Produkt ist nicht verfügbar
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IPP90R800C3XKSA2 IPP90R800C3XKSA2 Infineon Technologies Infineon-IPP90R800C3-DS-v01_00-en.pdf?fileId=db3a30432313ff5e0123a8b1344d5c34 Description: MOSFET N-CH 900V 6.9A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.9A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4.1A, 10V
Power Dissipation (Max): 104W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 460µA
Supplier Device Package: PG-TO220-3-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
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IPA90R800C3XKSA2 IPA90R800C3XKSA2 Infineon Technologies Infineon-IPA90R800C3-DS-v01_00-en.pdf?fileId=db3a30431b3e89eb011b8cd8a0b90fc6 Description: MOSFET N-CH 900V 6.9A TO220
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.9A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4.1A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 460µA
Supplier Device Package: PG-TO220-FP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
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AUIRL7736M2TR AUIRL7736M2TR Infineon Technologies auirl7736m2.pdf?fileId=5546d462533600a4015355bad363154c Description: MOSFET N-CH 40V 179A DIRECTFET
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric M4
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 179A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 67A, 10V
Power Dissipation (Max): 2.5W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 150µA
Supplier Device Package: DirectFET™ Isometric M4
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 5055 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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AUIRL7736M2TR AUIRL7736M2TR Infineon Technologies auirl7736m2.pdf?fileId=5546d462533600a4015355bad363154c Description: MOSFET N-CH 40V 179A DIRECTFET
Packaging: Cut Tape (CT)
Package / Case: DirectFET™ Isometric M4
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 179A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 67A, 10V
Power Dissipation (Max): 2.5W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 150µA
Supplier Device Package: DirectFET™ Isometric M4
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 5055 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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AUIRLR2905Z AUIRLR2905Z Infineon Technologies AUIRLR2905Z.pdf Description: MOSFET N-CH 55V 42A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 13.5mOhm @ 36A, 10V
Power Dissipation (Max): 110W (Tc)
Vgs(th) (Max) @ Id: 3V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 35 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1570 pF @ 25 V
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 5
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 25
Grade: Automotive
Qualification: AEC-Q101
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BTS133BKSA1 BTS133BKSA1 Infineon Technologies Infineon-BTS133-DS-v01_04-EN.pdf?fileId=5546d4625a888733015aa335436b0fae Description: IC PWR SWITCH N-CHAN 1:1 TO220-3
Packaging: Tube
Package / Case: TO-220-3
Output Type: N-Channel
Mounting Type: Through Hole
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 40mOhm
Input Type: Non-Inverting
Voltage - Load: 60V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 7A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TO220-3-1
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Not For New Designs
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TZ740N22KOFB1HPSA2 TZ740N22KOFB1HPSA2 Infineon Technologies Infineon-TZ740N-DS-v03_03-EN.pdf?fileId=db3a304412b407950112b42f88224c15&ack=t Description: SCR MODULE 2.2KV 1500A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 500 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 30000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 819 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 2.2 kV
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BTS61101SJAXUMA2 BTS61101SJAXUMA2 Infineon Technologies Infineon-BTS6110-1SJA-DS-v01_01-EN.pdf?fileId=5546d4625a888733015aa3e344b71032 Description: IC PWR SWITCH N-CHAN 1:1 DSO-8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 80mOhm
Voltage - Load: 9V ~ 16V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 20A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-DSO-8-49
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Active
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BTS61101SJAXUMA2 BTS61101SJAXUMA2 Infineon Technologies Infineon-BTS6110-1SJA-DS-v01_01-EN.pdf?fileId=5546d4625a888733015aa3e344b71032 Description: IC PWR SWITCH N-CHAN 1:1 DSO-8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 80mOhm
Voltage - Load: 9V ~ 16V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 20A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-DSO-8-49
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Active
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IRG4RC10KDTRPBF IRG4RC10KDTRPBF Infineon Technologies IRG4RC10KDPbF.pdf Description: IGBT 600V 9A 38W DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 28 ns
Vce(on) (Max) @ Vge, Ic: 2.62V @ 15V, 5A
Supplier Device Package: D-Pak
Td (on/off) @ 25°C: 49ns/97ns
Switching Energy: 250µJ (on), 140µJ (off)
Test Condition: 480V, 5A, 100Ohm, 15V
Gate Charge: 19 nC
Part Status: Obsolete
Current - Collector (Ic) (Max): 9 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 18 A
Power - Max: 38 W
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IRG4RC10KDTRPBF IRG4RC10KDTRPBF Infineon Technologies IRG4RC10KDPbF.pdf Description: IGBT 600V 9A 38W DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 28 ns
Vce(on) (Max) @ Vge, Ic: 2.62V @ 15V, 5A
Supplier Device Package: D-Pak
Td (on/off) @ 25°C: 49ns/97ns
Switching Energy: 250µJ (on), 140µJ (off)
Test Condition: 480V, 5A, 100Ohm, 15V
Gate Charge: 19 nC
Part Status: Obsolete
Current - Collector (Ic) (Max): 9 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 18 A
Power - Max: 38 W
Produkt ist nicht verfügbar
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IRSM005-301MHTR IRSM005-301MHTR Infineon Technologies infineon-irsm005-301mh-ds-en.pdf?fileId=5546d462533600a40153567bbfdf2860 Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
Part Status: Active
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IRSM005-301MHTR IRSM005-301MHTR Infineon Technologies infineon-irsm005-301mh-ds-en.pdf?fileId=5546d462533600a40153567bbfdf2860 Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Cut Tape (CT)
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
Part Status: Active
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AUIRLR2905TRL AUIRLR2905TRL Infineon Technologies AUIRLR2905.pdf Description: MOSFET N-CH 55V 42A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 25A, 10V
Power Dissipation (Max): 110W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 48 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1700 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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S25FL164K0XMFA001 S25FL164K0XMFA001 Infineon Technologies S25FL116K_132K_164K__RevH_5-19-17.pdf Description: IC FLASH 64MBIT SPI/QUAD 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Write Cycle Time - Word, Page: 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 8M x 8
Produkt ist nicht verfügbar
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CY88121CPMC1-GSE2 CY88121CPMC1-GSE2 Infineon Technologies MB88121.pdf Description: IC MCU 16BIT 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: Parallel Host, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 5.5V
Program Memory Type: External Program Memory
Applications: Automotive
Core Processor: External
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
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XMC1100Q024F0008ABXUMA1 XMC1100Q024F0008ABXUMA1 Infineon Technologies XMC1100.pdf Description: IC MCU 32BIT 8KB FLASH 24VQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-VQFN-24-19
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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XMC1100Q024F0008ABXUMA1 XMC1100Q024F0008ABXUMA1 Infineon Technologies XMC1100.pdf Description: IC MCU 32BIT 8KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-VQFN-24-19
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
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CY9BF466MPMC1-G-JNE2 CY9BF466MPMC1-G-JNE2 Infineon Technologies Description: IC MCU 32BIT 544KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 544KB (544K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 63
DigiKey Programmable: Not Verified
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TC223L16F133FACKXUMA1 TC223L16F133FACKXUMA1 Infineon Technologies Power_Sensing_Selection_Guide_2021.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
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TC223L16F133FACKXUMA1 TC223L16F133FACKXUMA1 Infineon Technologies Power_Sensing_Selection_Guide_2021.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+18.62 EUR
10+14.63 EUR
25+13.63 EUR
100+12.54 EUR
250+12.01 EUR
500+11.7 EUR
Im Einkaufswagen  Stück im Wert von  UAH
TC233L32F200FABKXUMA1 TC233L32F200FABKXUMA1 Infineon Technologies Infineon-TC23xL-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed76015697b2244d2457 Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TC233L32F200FABKXUMA1 TC233L32F200FABKXUMA1 Infineon Technologies Infineon-TC23xL-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed76015697b2244d2457 Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 973 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.2 EUR
10+15.1 EUR
25+14.07 EUR
100+12.95 EUR
250+12.41 EUR
500+12.08 EUR
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TC213L8F133FACKXUMA1 TC213L8F133FACKXUMA1 Infineon Technologies Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TC213L8F133FACKXUMA1 TC213L8F133FACKXUMA1 Infineon Technologies Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 988 Stücke:
Lieferzeit 10-14 Tag (e)
1+17.76 EUR
10+13.93 EUR
25+12.97 EUR
100+11.92 EUR
250+11.41 EUR
500+11.11 EUR
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TC213L8F133NACKXUMA1 TC213L8F133NACKXUMA1 Infineon Technologies Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TC213L8F133NACKXUMA1 TC213L8F133NACKXUMA1 Infineon Technologies Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 896 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.57 EUR
10+16.22 EUR
25+15.13 EUR
100+13.93 EUR
250+13.36 EUR
500+13.01 EUR
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TC233L32F200FACKXUMA1 TC233L32F200FACKXUMA1 Infineon Technologies SAK-TC233L-32F200F_AC_Web.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-3
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+11.63 EUR
Mindestbestellmenge: 1000
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TC233L32F200FACKXUMA1 TC233L32F200FACKXUMA1 Infineon Technologies SAK-TC233L-32F200F_AC_Web.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-3
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1896 Stücke:
Lieferzeit 10-14 Tag (e)
1+20.47 EUR
10+16.13 EUR
25+15.05 EUR
100+13.85 EUR
250+13.28 EUR
500+12.94 EUR
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TC223S16F133FACKXUMA1 TC223S16F133FACKXUMA1 Infineon Technologies Power_Sensing_Selection_Guide_2021.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TC223S16F133FACKXUMA1 TC223S16F133FACKXUMA1 Infineon Technologies Power_Sensing_Selection_Guide_2021.pdf Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)
2+17.34 EUR
10+13.59 EUR
25+12.65 EUR
100+11.62 EUR
250+11.13 EUR
500+10.83 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
TC223L16F133FABKXUMA1 TC223L16F133FABKXUMA1 Infineon Technologies Infineon-TC22xL-S-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed760156979fcbe72048 Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TC223L16F133FABKXUMA1 TC223L16F133FABKXUMA1 Infineon Technologies Infineon-TC22xL-S-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed760156979fcbe72048 Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 995 Stücke:
Lieferzeit 10-14 Tag (e)
1+19.62 EUR
10+15.44 EUR
25+14.4 EUR
100+13.25 EUR
250+12.7 EUR
500+12.37 EUR
Im Einkaufswagen  Stück im Wert von  UAH
TC233L32F200FACLXUMA1 TC233L32F200FACLXUMA1 Infineon Technologies Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1000+13.41 EUR
Mindestbestellmenge: 1000
Im Einkaufswagen  Stück im Wert von  UAH
TC233L32F200FACLXUMA1 TC233L32F200FACLXUMA1 Infineon Technologies Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
1+21.6 EUR
10+17.05 EUR
25+15.91 EUR
100+14.66 EUR
250+14.06 EUR
500+13.71 EUR
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TC333LP32F200FAAKXUMA1 TC333LP32F200FAAKXUMA1 Infineon Technologies 4_cip10529.pdf Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.86 EUR
10+25.48 EUR
25+23.88 EUR
100+22.13 EUR
250+21.29 EUR
500+20.79 EUR
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F3L225R12W3H3B11BPSA1 F3L225R12W3H3B11BPSA1 Infineon Technologies Infineon-F3L225R12W3H3_B11-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8779172a018820ed5ffc75b0 Description: IGBT MODULE
Packaging: Tray
Part Status: Active
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.55V @ 15V, 225A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 13100 pF @ 25 V
auf Bestellung 16 Stücke:
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1+227.81 EUR
16+213.37 EUR
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S29GL512T12DHVV23 S29GL512T12DHVV23 Infineon Technologies Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S6J32GELTPSC20000 S6J32GELTPSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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S6J32FELSNSC20000 S6J32FELSNSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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S6J32KEKSMSE20000 S6J32KEKSMSE20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
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S6J32KELSMSC20000 S6J32KELSMSC20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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S6J32GEKSMSE2000A S6J32GEKSMSE2000A Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
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S6J32LEKSMSE20000 S6J32LEKSMSE20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
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S6J32MEKSMSE20000 S6J32MEKSMSE20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
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S6J32LELSMSC20000 S6J32LELSMSC20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
1+67.37 EUR
10+55.12 EUR
40+50.78 EUR
120+48.35 EUR
280+46.93 EUR
Im Einkaufswagen  Stück im Wert von  UAH
S6J32FELTNSC20000 S6J32FELTNSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32HELTNSC20000 S6J32HELTNSC20000 Infineon Technologies Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7 Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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MB91F469GBPB-GS-K6E1 MB91F469GBPB-GS-K6E1 Infineon Technologies Description: IC MCU 32BIT 2MB FLASH 320BBGA
Packaging: Tray
Package / Case: 320-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Data Converters: A/D 40x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, WDT
Supplier Device Package: 320-PBGA (27x27)
Part Status: Active
Number of I/O: 205
Core Processor: FR60 RISC
Produkt ist nicht verfügbar
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CY9AF344MAPMC1-G-JNE2 Infineon Technologies Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I²C, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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CY9AF344MPMC-G-JNE1 CY9AF344MPMC-G-JNE1 Infineon Technologies Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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CY9BF306NBPMC-G-UNE1 CY9BF306NBPMC-G-UNE1 Infineon Technologies CY9B300B.PDF Description: IC MCU 32BIT 512KB 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
1+31.68 EUR
10+25.22 EUR
25+23.61 EUR
80+22.08 EUR
230+21.07 EUR
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CY9BF314NPMC-GE1 CY9BF314NPMC-GE1 Infineon Technologies Infineon-CY9B310R_Series_32_Bit_ARM_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edf3ea06447 Description: IC MCU 32BIT 288KB 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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CYW43012TC0EKUBGT Infineon Technologies Infineon-CYW43012-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee89f18715f Description: WI-FI AND WI-FI+BT COMBO
Packaging: Tape & Reel (TR)
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Data Rate: 78Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0
Antenna Type: Antenna Not Included
RF Family/Standard: Bluetooth
Serial Interfaces: UART
Part Status: Active
Produkt ist nicht verfügbar
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CY9AFA41MAPMC-G-JNE2 CY9AFA41MAPMC-G-JNE2 Infineon Technologies infineon-bit-microcontroller-fm3-family-peripheral-manual-timer-part-trm-v04-00-en-usermanual-en.pdf?fileId=8ac78c8c7ddc01d7017e2a0a44a80188 Description: IC MCU 32BIT 96KB 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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CYW43012C0WKWBGT CYW43012C0WKWBGT Infineon Technologies infineon-cyw43012-product-overview-productbrief-en.pdf?fileId=8ac78c8c7d0d8da4017d0f662eb353fe Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tape & Reel (TR)
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Data Rate: 78Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0
Antenna Type: Antenna Not Included
RF Family/Standard: Bluetooth
Serial Interfaces: UART
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
5000+8.29 EUR
Mindestbestellmenge: 5000
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CY9AFA41MAPMC1-G-JNE2 Infineon Technologies infineon-bit-microcontroller-fm3-family-peripheral-manual-timer-part-trm-v04-00-en-usermanual-en.pdf?fileId=8ac78c8c7ddc01d7017e2a0a44a80188 Description: IC MCU 32BIT 96KB 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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SAK-TC275TC-64F200N DC Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
SAK-TC275TC-64F200N DC
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 424K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 24K x 8
Core Processor: TriCore™
Data Converters: A/D 48x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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64-2084PBF
Hersteller: Infineon Technologies
Description: IRF2907ZSPBF - HEXFET N-CHANNEL
Packaging: Bulk
Part Status: Active
Produkt ist nicht verfügbar
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AUIRGS4062D1 AUIRGB%2CS%2CSL4062D1.pdf
AUIRGS4062D1
Hersteller: Infineon Technologies
Description: IGBT TRENCH 600V 59A D2PAK
Packaging: Tube
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 102 ns
Vce(on) (Max) @ Vge, Ic: 1.77V @ 15V, 24A
Supplier Device Package: D2PAK
IGBT Type: Trench
Td (on/off) @ 25°C: 19ns/90ns
Switching Energy: 532µJ (on), 311µJ (off)
Test Condition: 400V, 24A, 10Ohm, 15V
Gate Charge: 77 nC
Part Status: Obsolete
Current - Collector (Ic) (Max): 59 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 72 A
Power - Max: 246 W
Produkt ist nicht verfügbar
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IPP90R800C3XKSA2 Infineon-IPP90R800C3-DS-v01_00-en.pdf?fileId=db3a30432313ff5e0123a8b1344d5c34
IPP90R800C3XKSA2
Hersteller: Infineon Technologies
Description: MOSFET N-CH 900V 6.9A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.9A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4.1A, 10V
Power Dissipation (Max): 104W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 460µA
Supplier Device Package: PG-TO220-3-1
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
auf Bestellung 484 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.17 EUR
10+3.47 EUR
100+2.76 EUR
Mindestbestellmenge: 5
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IPA90R800C3XKSA2 Infineon-IPA90R800C3-DS-v01_00-en.pdf?fileId=db3a30431b3e89eb011b8cd8a0b90fc6
IPA90R800C3XKSA2
Hersteller: Infineon Technologies
Description: MOSFET N-CH 900V 6.9A TO220
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.9A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4.1A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 460µA
Supplier Device Package: PG-TO220-FP
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
auf Bestellung 494 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.14 EUR
10+3.44 EUR
100+2.74 EUR
Mindestbestellmenge: 5
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AUIRL7736M2TR auirl7736m2.pdf?fileId=5546d462533600a4015355bad363154c
AUIRL7736M2TR
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 179A DIRECTFET
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric M4
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 179A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 67A, 10V
Power Dissipation (Max): 2.5W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 150µA
Supplier Device Package: DirectFET™ Isometric M4
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 5055 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4800+2.7 EUR
Mindestbestellmenge: 4800
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AUIRL7736M2TR auirl7736m2.pdf?fileId=5546d462533600a4015355bad363154c
AUIRL7736M2TR
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 179A DIRECTFET
Packaging: Cut Tape (CT)
Package / Case: DirectFET™ Isometric M4
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 179A (Tc)
Rds On (Max) @ Id, Vgs: 3mOhm @ 67A, 10V
Power Dissipation (Max): 2.5W (Ta), 63W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 150µA
Supplier Device Package: DirectFET™ Isometric M4
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 5055 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 4800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+7.41 EUR
10+4.89 EUR
100+3.47 EUR
500+2.86 EUR
1000+2.7 EUR
Mindestbestellmenge: 3
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AUIRLR2905Z AUIRLR2905Z.pdf
AUIRLR2905Z
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 42A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 13.5mOhm @ 36A, 10V
Power Dissipation (Max): 110W (Tc)
Vgs(th) (Max) @ Id: 3V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 35 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1570 pF @ 25 V
Voltage Coupled to Gate Charge (Qg) (Max) @ Vgs: 5
Voltage Coupled to Input Capacitance (Ciss) (Max) @ Vds: 25
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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BTS133BKSA1 Infineon-BTS133-DS-v01_04-EN.pdf?fileId=5546d4625a888733015aa335436b0fae
BTS133BKSA1
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 TO220-3
Packaging: Tube
Package / Case: TO-220-3
Output Type: N-Channel
Mounting Type: Through Hole
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Low Side
Rds On (Typ): 40mOhm
Input Type: Non-Inverting
Voltage - Load: 60V (Max)
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 7A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TO220-3-1
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Not For New Designs
Produkt ist nicht verfügbar
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TZ740N22KOFB1HPSA2 Infineon-TZ740N-DS-v03_03-EN.pdf?fileId=db3a304412b407950112b42f88224c15&ack=t
TZ740N22KOFB1HPSA2
Hersteller: Infineon Technologies
Description: SCR MODULE 2.2KV 1500A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 500 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 30000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 819 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Part Status: Active
Current - On State (It (RMS)) (Max): 1500 A
Voltage - Off State: 2.2 kV
auf Bestellung 1 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+710.35 EUR
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BTS61101SJAXUMA2 Infineon-BTS6110-1SJA-DS-v01_01-EN.pdf?fileId=5546d4625a888733015aa3e344b71032
BTS61101SJAXUMA2
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 DSO-8
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 80mOhm
Voltage - Load: 9V ~ 16V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 20A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-DSO-8-49
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Active
Produkt ist nicht verfügbar
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BTS61101SJAXUMA2 Infineon-BTS6110-1SJA-DS-v01_01-EN.pdf?fileId=5546d4625a888733015aa3e344b71032
BTS61101SJAXUMA2
Hersteller: Infineon Technologies
Description: IC PWR SWITCH N-CHAN 1:1 DSO-8
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 80mOhm
Voltage - Load: 9V ~ 16V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 20A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-DSO-8-49
Fault Protection: Current Limiting (Fixed), Over Temperature, Over Voltage
Part Status: Active
auf Bestellung 2487 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.27 EUR
10+2.42 EUR
25+2.2 EUR
100+1.96 EUR
250+1.85 EUR
500+1.78 EUR
1000+1.73 EUR
Mindestbestellmenge: 6
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IRG4RC10KDTRPBF IRG4RC10KDPbF.pdf
IRG4RC10KDTRPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 9A 38W DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 28 ns
Vce(on) (Max) @ Vge, Ic: 2.62V @ 15V, 5A
Supplier Device Package: D-Pak
Td (on/off) @ 25°C: 49ns/97ns
Switching Energy: 250µJ (on), 140µJ (off)
Test Condition: 480V, 5A, 100Ohm, 15V
Gate Charge: 19 nC
Part Status: Obsolete
Current - Collector (Ic) (Max): 9 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 18 A
Power - Max: 38 W
Produkt ist nicht verfügbar
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IRG4RC10KDTRPBF IRG4RC10KDPbF.pdf
IRG4RC10KDTRPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 9A 38W DPAK
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 28 ns
Vce(on) (Max) @ Vge, Ic: 2.62V @ 15V, 5A
Supplier Device Package: D-Pak
Td (on/off) @ 25°C: 49ns/97ns
Switching Energy: 250µJ (on), 140µJ (off)
Test Condition: 480V, 5A, 100Ohm, 15V
Gate Charge: 19 nC
Part Status: Obsolete
Current - Collector (Ic) (Max): 9 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 18 A
Power - Max: 38 W
Produkt ist nicht verfügbar
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IRSM005-301MHTR infineon-irsm005-301mh-ds-en.pdf?fileId=5546d462533600a40153567bbfdf2860
IRSM005-301MHTR
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
Part Status: Active
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2000+2.47 EUR
Mindestbestellmenge: 2000
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IRSM005-301MHTR infineon-irsm005-301mh-ds-en.pdf?fileId=5546d462533600a40153567bbfdf2860
IRSM005-301MHTR
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Cut Tape (CT)
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
Part Status: Active
auf Bestellung 2465 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.61 EUR
10+3.45 EUR
25+3.17 EUR
100+2.85 EUR
250+2.69 EUR
500+2.6 EUR
1000+2.53 EUR
Mindestbestellmenge: 4
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AUIRLR2905TRL AUIRLR2905.pdf
AUIRLR2905TRL
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 42A DPAK
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 42A (Tc)
Rds On (Max) @ Id, Vgs: 27mOhm @ 25A, 10V
Power Dissipation (Max): 110W (Tc)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 4V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 48 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 1700 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S25FL164K0XMFA001 S25FL116K_132K_164K__RevH_5-19-17.pdf
S25FL164K0XMFA001
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 108 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Obsolete
Write Cycle Time - Word, Page: 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 8M x 8
Produkt ist nicht verfügbar
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CY88121CPMC1-GSE2 MB88121.pdf
CY88121CPMC1-GSE2
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Interface: Parallel Host, SPI
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3V ~ 5.5V
Program Memory Type: External Program Memory
Applications: Automotive
Core Processor: External
Supplier Device Package: 64-LQFP (10x10)
Part Status: Obsolete
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC1100Q024F0008ABXUMA1 XMC1100.pdf
XMC1100Q024F0008ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8KB FLASH 24VQFN
Packaging: Tape & Reel (TR)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-VQFN-24-19
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC1100Q024F0008ABXUMA1 XMC1100.pdf
XMC1100Q024F0008ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8KB FLASH 24VQFN
Packaging: Cut Tape (CT)
Package / Case: 24-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 8x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-VQFN-24-19
Part Status: Active
Number of I/O: 18
DigiKey Programmable: Not Verified
auf Bestellung 2400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.06 EUR
10+2.27 EUR
25+2.06 EUR
100+1.84 EUR
250+1.74 EUR
500+1.67 EUR
1000+1.62 EUR
Mindestbestellmenge: 6
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CY9BF466MPMC1-G-JNE2
CY9BF466MPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 544KB FLASH 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 544KB (544K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 63
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC223L16F133FACKXUMA1 Power_Sensing_Selection_Guide_2021.pdf
TC223L16F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+11.44 EUR
Mindestbestellmenge: 1000
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TC223L16F133FACKXUMA1 Power_Sensing_Selection_Guide_2021.pdf
TC223L16F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+18.62 EUR
10+14.63 EUR
25+13.63 EUR
100+12.54 EUR
250+12.01 EUR
500+11.7 EUR
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TC233L32F200FABKXUMA1 Infineon-TC23xL-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed76015697b2244d2457
TC233L32F200FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC233L32F200FABKXUMA1 Infineon-TC23xL-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed76015697b2244d2457
TC233L32F200FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 973 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.2 EUR
10+15.1 EUR
25+14.07 EUR
100+12.95 EUR
250+12.41 EUR
500+12.08 EUR
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TC213L8F133FACKXUMA1 Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac
TC213L8F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC213L8F133FACKXUMA1 Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac
TC213L8F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 988 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+17.76 EUR
10+13.93 EUR
25+12.97 EUR
100+11.92 EUR
250+11.41 EUR
500+11.11 EUR
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TC213L8F133NACKXUMA1 Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac
TC213L8F133NACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC213L8F133NACKXUMA1 Infineon-TC21x22x_AC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695304b96c03ac
TC213L8F133NACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 896 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.57 EUR
10+16.22 EUR
25+15.13 EUR
100+13.93 EUR
250+13.36 EUR
500+13.01 EUR
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TC233L32F200FACKXUMA1 SAK-TC233L-32F200F_AC_Web.pdf
TC233L32F200FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-3
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+11.63 EUR
Mindestbestellmenge: 1000
Im Einkaufswagen  Stück im Wert von  UAH
TC233L32F200FACKXUMA1 SAK-TC233L-32F200F_AC_Web.pdf
TC233L32F200FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-3
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1896 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.47 EUR
10+16.13 EUR
25+15.05 EUR
100+13.85 EUR
250+13.28 EUR
500+12.94 EUR
Im Einkaufswagen  Stück im Wert von  UAH
TC223S16F133FACKXUMA1 Power_Sensing_Selection_Guide_2021.pdf
TC223S16F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TC223S16F133FACKXUMA1 Power_Sensing_Selection_Guide_2021.pdf
TC223S16F133FACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.34 EUR
10+13.59 EUR
25+12.65 EUR
100+11.62 EUR
250+11.13 EUR
500+10.83 EUR
Mindestbestellmenge: 2
Im Einkaufswagen  Stück im Wert von  UAH
TC223L16F133FABKXUMA1 Infineon-TC22xL-S-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed760156979fcbe72048
TC223L16F133FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
TC223L16F133FABKXUMA1 Infineon-TC22xL-S-AURIX_Family-PB-v01_00-EN.pdf?fileId=5546d4625696ed760156979fcbe72048
TC223L16F133FABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 995 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.62 EUR
10+15.44 EUR
25+14.4 EUR
100+13.25 EUR
250+12.7 EUR
500+12.37 EUR
Im Einkaufswagen  Stück im Wert von  UAH
TC233L32F200FACLXUMA1 Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee
TC233L32F200FACLXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+13.41 EUR
Mindestbestellmenge: 1000
Im Einkaufswagen  Stück im Wert von  UAH
TC233L32F200FACLXUMA1 Infineon-TC23xAC_DS-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b401695316f3d103ee
TC233L32F200FACLXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 192K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 24x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
Number of I/O: 78
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.6 EUR
10+17.05 EUR
25+15.91 EUR
100+14.66 EUR
250+14.06 EUR
500+13.71 EUR
Im Einkaufswagen  Stück im Wert von  UAH
TC333LP32F200FAAKXUMA1 4_cip10529.pdf
TC333LP32F200FAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2MB (2M x 8)
RAM Size: 248K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: DMA, I2S, PWM, WDT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-TQFP-100-23
Part Status: Active
DigiKey Programmable: Not Verified
auf Bestellung 999 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.86 EUR
10+25.48 EUR
25+23.88 EUR
100+22.13 EUR
250+21.29 EUR
500+20.79 EUR
Im Einkaufswagen  Stück im Wert von  UAH
F3L225R12W3H3B11BPSA1 Infineon-F3L225R12W3H3_B11-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8779172a018820ed5ffc75b0
F3L225R12W3H3B11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE
Packaging: Tray
Part Status: Active
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.55V @ 15V, 225A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 225 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 13100 pF @ 25 V
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+227.81 EUR
16+213.37 EUR
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S29GL512T12DHVV23 Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in
S29GL512T12DHVV23
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Part Status: Active
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32GELTPSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32GELTPSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32FELSNSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32FELSNSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32KEKSMSE20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32KEKSMSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32KELSMSC20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32KELSMSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32GEKSMSE2000A Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32GEKSMSE2000A
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32LEKSMSE20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32LEKSMSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32MEKSMSE20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32MEKSMSE20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Part Status: Active
Number of I/O: 120
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32LELSMSC20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670
S6J32LELSMSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 3M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.15V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
auf Bestellung 400 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+67.37 EUR
10+55.12 EUR
40+50.78 EUR
120+48.35 EUR
280+46.93 EUR
Im Einkaufswagen  Stück im Wert von  UAH
S6J32FELTNSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32FELTNSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
S6J32HELTNSC20000 Infineon-S6J32E_S6J32F_S6J32G_S6J32H_Series_32-bit_Microcontroller_TRAVEO_T1G-AdditionalTechnicalInformation-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee2533f68c7
S6J32HELTNSC20000
Hersteller: Infineon Technologies
Description: TRAVEO-55NM
Packaging: Tray
Package / Case: 216-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 4.171875MB (4.171875M x 8)
RAM Size: 2.125M x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 50x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.1V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 216-TEQFP (24x24)
Part Status: Active
Number of I/O: 128
Produkt ist nicht verfügbar
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MB91F469GBPB-GS-K6E1
MB91F469GBPB-GS-K6E1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 320BBGA
Packaging: Tray
Package / Case: 320-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Data Converters: A/D 40x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, WDT
Supplier Device Package: 320-PBGA (27x27)
Part Status: Active
Number of I/O: 205
Core Processor: FR60 RISC
Produkt ist nicht verfügbar
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CY9AF344MAPMC1-G-JNE2
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I²C, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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CY9AF344MPMC-G-JNE1
CY9AF344MPMC-G-JNE1
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, I2C, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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CY9BF306NBPMC-G-UNE1 CY9B300B.PDF
CY9BF306NBPMC-G-UNE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, Ethernet, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 80
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.68 EUR
10+25.22 EUR
25+23.61 EUR
80+22.08 EUR
230+21.07 EUR
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CY9BF314NPMC-GE1 Infineon-CY9B310R_Series_32_Bit_ARM_Cortex_M3_FM3_Microcontroller-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edf3ea06447
CY9BF314NPMC-GE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 288KB (288K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Part Status: Active
Number of I/O: 83
Produkt ist nicht verfügbar
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CYW43012TC0EKUBGT Infineon-CYW43012-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee89f18715f
Hersteller: Infineon Technologies
Description: WI-FI AND WI-FI+BT COMBO
Packaging: Tape & Reel (TR)
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Data Rate: 78Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0
Antenna Type: Antenna Not Included
RF Family/Standard: Bluetooth
Serial Interfaces: UART
Part Status: Active
Produkt ist nicht verfügbar
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CY9AFA41MAPMC-G-JNE2 infineon-bit-microcontroller-fm3-family-peripheral-manual-timer-part-trm-v04-00-en-usermanual-en.pdf?fileId=8ac78c8c7ddc01d7017e2a0a44a80188
CY9AFA41MAPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (12x12)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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CYW43012C0WKWBGT infineon-cyw43012-product-overview-productbrief-en.pdf?fileId=8ac78c8c7d0d8da4017d0f662eb353fe
CYW43012C0WKWBGT
Hersteller: Infineon Technologies
Description: RF TXRX MODULE BLUETOOTH SMD
Packaging: Tape & Reel (TR)
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Data Rate: 78Mbps
Protocol: 802.11a/b/g/n, Bluetooth v5.0
Antenna Type: Antenna Not Included
RF Family/Standard: Bluetooth
Serial Interfaces: UART
Part Status: Active
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5000+8.29 EUR
Mindestbestellmenge: 5000
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CY9AFA41MAPMC1-G-JNE2 infineon-bit-microcontroller-fm3-family-peripheral-manual-timer-part-trm-v04-00-en-usermanual-en.pdf?fileId=8ac78c8c7ddc01d7017e2a0a44a80188
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 96KB 80LQFP
Packaging: Tray
Package / Case: 80-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 96KB (96K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 17x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Connectivity: CSIO, EBI/EMI, FIFO, I2C, UART/USART
Peripherals: DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 80-LQFP (14x14)
Part Status: Active
Number of I/O: 66
Produkt ist nicht verfügbar
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