Produkte > INFINEON TECHNOLOGIES > Alle Produkte des Herstellers INFINEON TECHNOLOGIES (121482) > Seite 84 nach 2025
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Preis |
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SAF-XC164N-8F40F BB | Infineon Technologies |
 Description: IC MCU 16BIT 64KB FLASH 100TQFPPackaging: Tape & Reel (TR) Package / Case: 100-LQFP Mounting Type: Surface Mount Speed: 40MHz Program Memory Size: 64KB (64K x 8) RAM Size: 6K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: C166SV2 Core Size: 16-Bit Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V Connectivity: EBI/EMI, SPI, UART/USART Peripherals: PWM, WDT Supplier Device Package: PG-TQFP-100-5 Number of I/O: 79 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 540 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAF-XC164S-8F40F BB | Infineon Technologies |
Description: IC MCU 16BIT 64KB FLASH 100TQFP Number of I/O: 79 Part Status: Obsolete Supplier Device Package: PG-TQFP-100-5 Peripherals: PWM, WDT Connectivity: EBI/EMI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V Core Size: 16-Bit Data Converters: A/D 14x8/10b Core Processor: C166SV2 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 6K x 8 Program Memory Size: 64KB (64K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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XC167CI16F40FBBFXQMA1 | Infineon Technologies |
Description: IC MCU 16BIT 128KB FLASH 144TQFP Part Status: Last Time Buy Supplier Device Package: PG-TQFP-144-7 Peripherals: PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V Core Size: 16-Bit Data Converters: A/D 16x8/10b Core Processor: C166SV2 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) Number of I/O: 103 RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tray DigiKey Programmable: Not Verified |
auf Bestellung 104 Stücke: Lieferzeit 10-14 Tag (e) |
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| XC167CI32F40FBBAFXUMA1 | Infineon Technologies |
Description: IC MCU 16BIT 256KB FLASH 144TQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
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XC886C8FFI5VACFXUMA1 | Infineon Technologies |
Description: IC MCU 8BIT 32KB FLASH 48TQFP Number of I/O: 34 Part Status: Last Time Buy Supplier Device Package: PG-TQFP-48 Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: CANbus, SSI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: XC800 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1.75K x 8 Program Memory Size: 32KB (32K x 8) Speed: 24MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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XC886CM8FFI5VACFXUMA1 | Infineon Technologies |
Description: IC MCU 8BIT 32KB FLASH 48TQFP Number of I/O: 34 Part Status: Last Time Buy Supplier Device Package: PG-TQFP-48 Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: CANbus, SSI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: XC800 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1.75K x 8 Program Memory Size: 32KB (32K x 8) Speed: 24MHz Mounting Type: Surface Mount Package / Case: 48-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1800 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAF-XC888CLM-8FFA 5V AC | Infineon Technologies |
Description: IC MCU 8BIT 32KB FLASH 64TQFP Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1.75K x 8 Program Memory Size: 32KB (32K x 8) Speed: 24MHz Mounting Type: Surface Mount Package / Case: 64-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: PG-TQFP-64 Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: CANbus, LINbus, SSI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: XC800 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAF-XC888CM-8FFA 5V AC | Infineon Technologies |
Description: IC MCU 8BIT 32KB FLASH 64TQFP Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: XC800 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 85°C (TA) RAM Size: 1.75K x 8 Program Memory Size: 32KB (32K x 8) Speed: 24MHz Mounting Type: Surface Mount DigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: PG-TQFP-64 Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: CANbus, SSI, UART/USART Package / Case: 64-LQFP Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAF 82525 N V2.2 | Infineon Technologies |
Description: IC INTERFACE SPECIALIZED 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Interface: Serial Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: P-LCC-44-1 Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAF 82526 N V2.2 | Infineon Technologies |
Description: IC INTERFACE SPECIALIZED 44PLCC Packaging: Tube Package / Case: 44-LCC (J-Lead) Mounting Type: Surface Mount Interface: Serial Voltage - Supply: 4.75V ~ 5.25V Supplier Device Package: P-LCC-44-1 Part Status: Obsolete |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 750 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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C161JCLFCAKXQMA1 | Infineon Technologies |
Description: IC MCU 16BIT ROMLESS 128TQFP Number of I/O: 93 Part Status: Obsolete Supplier Device Package: PG-TQFP-128-2 Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 12x10b Core Processor: C166 Program Memory Type: ROMless Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 10K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 128-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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C164CIL25MCAKXUMA1 | Infineon Technologies |
Description: IC MCU 16BIT ROMLESS 80MQFP Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 4K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 80-QFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 59 Supplier Device Package: PG-MQFP-80-7 Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 8x10b Core Processor: C166 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAK-C167CR-L33M HA+ | Infineon Technologies |
Description: IC MCU 16BIT 2KB XRAM 144MQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 168 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAK-C167CR-LM HA+ | Infineon Technologies |
Description: IC MCU 16BIT 2KB XRAM 144-MQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 168 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAK-C167CS-L33M CA+ | Infineon Technologies |
Description: IC MCU 16BIT 33MHZ MQFP-144 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 200 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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C167CSL40MCAKXQLA1 | Infineon Technologies |
Description: IC MCU 16BIT ROMLESS 144MQFP DigiKey Programmable: Not Verified Number of I/O: 111 Part Status: Discontinued at Digi-Key Supplier Device Package: P-MQFP-144-8 Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 16-Bit Data Converters: A/D 24x10b Core Processor: C166 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 11K x 8 Speed: 40MHz Mounting Type: Surface Mount Package / Case: 144-BQFP Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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K167CSLMCAZNP | Infineon Technologies |
Description: IC MCU 16BIT ROMLESS 144MQFP Core Size: 16-Bit Data Converters: A/D 24x10b Core Processor: C166 Program Memory Type: ROMless Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 11K x 8 Speed: 25MHz Mounting Type: Surface Mount Package / Case: 144-BQFP Packaging: Tray DigiKey Programmable: Not Verified Number of I/O: 111 Part Status: Obsolete Supplier Device Package: P-MQFP-144-6 Peripherals: POR, PWM, WDT Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 168 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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C167SRLMHAKXQLA1 | Infineon Technologies |
Description: IC MCU 16BIT 144MQFP |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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TC1796256F150EBCKDUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 2MB FLASH 416BGA DigiKey Programmable: Not Verified Number of I/O: 123 Part Status: Obsolete Supplier Device Package: PG-BGA-416 Peripherals: DMA, POR, WDT Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V Core Size: 32-Bit Single-Core Data Converters: A/D 44x12b Core Processor: TriCore™ Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 256K x 8 Program Memory Size: 2MB (2M x 8) Speed: 150MHz Mounting Type: Surface Mount Package / Case: 416-BGA Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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XC161CJ16F40FBBKXUMA1 | Infineon Technologies |
Description: IC MCU 16BIT 128KB FLASH 144TQFP DigiKey Programmable: Not Verified Number of I/O: 99 Part Status: Last Time Buy Supplier Device Package: PG-TQFP-144-7 Peripherals: PWM, WDT Connectivity: CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V Core Size: 16-Bit Data Converters: A/D 12x8/10b Core Processor: C166SV2 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 40MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) |
auf Bestellung 1000 Stücke: Lieferzeit 10-14 Tag (e) |
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SAK-XC161CS-32F20F BB-A | Infineon Technologies |
Description: IC MCU 16BIT 256KB FLASH 144TQFP Core Size: 16-Bit Data Converters: A/D 12x8/10b Core Processor: C166SV2 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 12K x 8 Program Memory Size: 256KB (256K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 144-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 99 Part Status: Discontinued at Digi-Key Supplier Device Package: PG-TQFP-144-7 Peripherals: PWM, WDT Connectivity: CANbus, EBI/EMI, I²C, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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XC164CS16F20FBBKXUMA1 | Infineon Technologies |
Description: IC MCU 16BIT 128KB FLASH 100TQFP Number of I/O: 79 Part Status: Discontinued at Digi-Key Supplier Device Package: PG-TQFP-100-5 Peripherals: PWM, WDT Connectivity: CANbus, EBI/EMI, SPI, UART/USART Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V Core Size: 16-Bit Data Converters: A/D 14x8/10b Core Processor: C166SV2 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 8K x 8 Program Memory Size: 128KB (128K x 8) Speed: 20MHz Mounting Type: Surface Mount Package / Case: 100-LQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1400 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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XC167CI16F40FBBKXUMA1 | Infineon Technologies |
Description: IC MCU 16BIT 128KB FLASH 144TQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
| XC167CI32F40FBBAKXUMA1 | Infineon Technologies |
Description: IC MCU 16BIT 256KB FLASH 144TQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
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SAK-XC888C-8FFA 5V AC | Infineon Technologies |
Description: IC MCU 8BIT FLASH TQFP-64 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SAK-XC888CM-8FFA AB | Infineon Technologies |
Description: IC MCU 8BIT 32KB FLASH 64TQFP Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified Number of I/O: 48 Supplier Device Package: PG-TQFP-64 Peripherals: Brown-out Detect/Reset, POR, PWM, WDT Connectivity: CANbus, SSI, UART/USART Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V Core Size: 8-Bit Data Converters: A/D 8x10b Core Processor: XC800 Program Memory Type: FLASH Oscillator Type: Internal Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 1.75K x 8 Program Memory Size: 32KB (32K x 8) Speed: 24MHz Mounting Type: Surface Mount Package / Case: 64-LQFP |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1900 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SDB06S60 | Infineon Technologies |
Description: DIODE SIL CARB 600V 6A TO263 Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 6 A Voltage - DC Reverse (Vr) (Max): 600 V Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: PG-TO263-2 Current - Average Rectified (Io): 6A Capacitance @ Vr, F: 300pF @ 0V, 1MHz Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Surface Mount Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Packaging: Tape & Reel (TR) Current - Reverse Leakage @ Vr: 200 µA @ 600 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SDB20S30 | Infineon Technologies |
Description: DIODE ARRAY SIC 300V TO220-3-45 Current - Reverse Leakage @ Vr: 200 µA @ 300 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A Voltage - DC Reverse (Vr) (Max): 300 V Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: PG-TO220-3-45 Current - Average Rectified (Io) (per Diode): 10A (DC) Diode Configuration: 1 Pair Common Cathode Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Surface Mount Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SDD04S60 | Infineon Technologies |
Description: DIODE SIL CARB 600V 4A TO252-31 Current - Reverse Leakage @ Vr: 200 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 4 A Voltage - DC Reverse (Vr) (Max): 600 V Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: PG-TO252-3-11 Current - Average Rectified (Io): 4A Capacitance @ Vr, F: 150pF @ 0V, 1MHz Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Surface Mount Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SDP10S30 | Infineon Technologies |
Description: DIODE SIL CARB 300V 10A PGTO2203 Packaging: Tube Package / Case: TO-220-3 Mounting Type: Through Hole Speed: No Recovery Time > 500mA (Io) Reverse Recovery Time (trr): 0 ns Technology: SiC (Silicon Carbide) Schottky Capacitance @ Vr, F: 600pF @ 0V, 1MHz Current - Average Rectified (Io): 10A Supplier Device Package: PG-TO220-3 Operating Temperature - Junction: -55°C ~ 175°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 300 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A Current - Reverse Leakage @ Vr: 200 µA @ 300 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SDT05S60 | Infineon Technologies |
Description: DIODE SIL CARB 600V 5A PGTO2202 Packaging: Tube Package / Case: TO-220-2 Mounting Type: Through Hole Speed: No Recovery Time > 500mA (Io) Reverse Recovery Time (trr): 0 ns Technology: SiC (Silicon Carbide) Schottky Capacitance @ Vr, F: 170pF @ 1V, 1MHz Current - Average Rectified (Io): 5A Supplier Device Package: PG-TO220-2-2 Operating Temperature - Junction: -55°C ~ 175°C Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 5 A Current - Reverse Leakage @ Vr: 200 µA @ 600 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SDT08S60 | Infineon Technologies |
Description: DIODE SIL CARB 600V 8A PGTO2202 Current - Reverse Leakage @ Vr: 300 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 8 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Obsolete Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: PG-TO220-2-2 Current - Average Rectified (Io): 8A Capacitance @ Vr, F: 280pF @ 0V, 1MHz Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Through Hole Package / Case: TO-220-2 Packaging: Tube |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
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SDT10S60 | Infineon Technologies |
Description: DIODE SIL CARB 600V 10A TO220-2 Capacitance @ Vr, F: 350pF @ 0V, 1MHz Technology: SiC (Silicon Carbide) Schottky Reverse Recovery Time (trr): 0 ns Speed: No Recovery Time > 500mA (Io) Mounting Type: Through Hole Package / Case: TO-220-2 Packaging: Tube Current - Reverse Leakage @ Vr: 350 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A Voltage - DC Reverse (Vr) (Max): 600 V Operating Temperature - Junction: -55°C ~ 175°C Supplier Device Package: PG-TO220-2-2 Current - Average Rectified (Io): 10A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||
| SFH 551/1-1 | Infineon Technologies |
Description: MOD PHOTO DETECT RCVR 700NM TTL Current - Supply: 4 mA Part Status: Obsolete Power - Minimum Receivable: -22dBm Data Rate: 5Mbps Applications: General Purpose Voltage - Supply: 4.75V ~ 5.25V Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SFH 551/1V-1 | Infineon Technologies |
Description: MOD PHOTO DETECT RCVR 700NM TTL Current - Supply: 4 mA Part Status: Obsolete Power - Minimum Receivable: -22dBm Data Rate: 50Mbps Applications: General Purpose Voltage - Supply: 4.75V ~ 5.25V Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SFH 757 | Infineon Technologies |
Description: TRANSMITTER DIODE FIBER OPTIC |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 70 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC01D120H6 | Infineon Technologies |
Description: DIODE GP 1.2KV 600MA WAFER Current - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 600 mA Voltage - DC Reverse (Vr) (Max): 1200 V Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 600mA Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC01D60C6 | Infineon Technologies | Description: DIODE GEN PURP WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2346 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC02D60C6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 6A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1752 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC02D60F6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 3A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3634 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC03D120F6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 2A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1251 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC03D120H6 | Infineon Technologies |
Description: DIODE GEN PURP 1.2KV 3A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1251 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC03D60C6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 10A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1223 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC03D60F6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 6A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 2414 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC04D60F6X1SA3 | Infineon Technologies |
Description: DIODE STD 600V 9A SAWN ON FOIL Current - Reverse Leakage @ Vr: 27 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 9 A Voltage - DC Reverse (Vr) (Max): 600 V Operating Temperature - Junction: -40°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 9A Technology: Standard Speed: Fast Recovery =< 500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC05D60C6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 15A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 900 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC06D120E6X1SA3 | Infineon Technologies |
Description: DIODE GP 1.2KV 5A WAFER Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 5A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 1200 V Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 5 A Current - Reverse Leakage @ Vr: 27 µA @ 1200 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC06D120F6X1SA2 | Infineon Technologies |
Description: DIODE GP 1.2KV 5A WAFER Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 5A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 1200 V Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 5 A Current - Reverse Leakage @ Vr: 27 µA @ 1200 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC06D120H6X1SA4 | Infineon Technologies |
Description: DIODE GP 1.2KV 7.5A WAFER Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk Current - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 7.5 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 7.5A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC06D60AC6X1SA1 | Infineon Technologies |
Description: DIODE GP 600V 20A WAFER Current - Reverse Leakage @ Vr: 27 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 20 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -40°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 20A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC06D60C6 | Infineon Technologies |
Description: DIODE GP 600V 20A WAFER Current - Reverse Leakage @ Vr: 27 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 20 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -40°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 20A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC06D60E6X1SA3 | Infineon Technologies |
Description: DIODE STD 600V 10A SAWN ON FOIL Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 10A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -55°C ~ 150°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 10 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC06D60F6X1SA3 | Infineon Technologies |
Description: DIODE STD 600V 15A SAWN ON FOIL Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Fast Recovery =< 500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 15A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -40°C ~ 150°C Part Status: Obsolete Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 15 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC07D60AF6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 22.5A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 927 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC07D60E6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 15A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 577 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC07D60F6 | Infineon Technologies |
Description: DIODE GEN PURP 600V 22.5A WAFER |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 561 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC08D120F6X1SA3 | Infineon Technologies |
Description: DIODE GP 1.2KV 7A WAFER Current - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 7 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 7A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC08D120H6X1SA1 | Infineon Technologies |
Description: DIODE GP 1.2KV 10A WAFER Current - Reverse Leakage @ Vr: 27 µA @ 1200 V Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 10 A Voltage - DC Reverse (Vr) (Max): 1200 V Part Status: Discontinued at Digi-Key Operating Temperature - Junction: -55°C ~ 150°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 10A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC08D60C6 | Infineon Technologies |
Description: DIODE STD 600V 30A SAWN ON FOIL Packaging: Bulk Package / Case: Die Mounting Type: Surface Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Current - Average Rectified (Io): 30A Supplier Device Package: Sawn on foil Operating Temperature - Junction: -40°C ~ 175°C Part Status: Discontinued at Digi-Key Voltage - DC Reverse (Vr) (Max): 600 V Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 30 A Current - Reverse Leakage @ Vr: 27 µA @ 600 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||
| SIDC08D60C6Y | Infineon Technologies |
Description: DIODE GP 600V 30A WAFER Mounting Type: Surface Mount Package / Case: Die Packaging: Bulk Operating Temperature - Junction: -40°C ~ 175°C Supplier Device Package: Sawn on foil Current - Average Rectified (Io): 30A Technology: Standard Speed: Standard Recovery >500ns, > 200mA (Io) Current - Reverse Leakage @ Vr: 27 µA @ 600 V Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 30 A Voltage - DC Reverse (Vr) (Max): 600 V Part Status: Discontinued at Digi-Key |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| SAF-XC164N-8F40F BB |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 64KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-TQFP-100-5
Number of I/O: 79
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Connectivity: EBI/EMI, SPI, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-TQFP-100-5
Number of I/O: 79
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 540 Stücke
Im Einkaufswagen
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| SAF-XC164S-8F40F BB |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 64KB FLASH 100TQFP
Number of I/O: 79
Part Status: Obsolete
Supplier Device Package: PG-TQFP-100-5
Peripherals: PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Core Size: 16-Bit
Data Converters: A/D 14x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 6K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 64KB FLASH 100TQFP
Number of I/O: 79
Part Status: Obsolete
Supplier Device Package: PG-TQFP-100-5
Peripherals: PWM, WDT
Connectivity: EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Core Size: 16-Bit
Data Converters: A/D 14x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 6K x 8
Program Memory Size: 64KB (64K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC167CI16F40FBBFXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 144TQFP
Part Status: Last Time Buy
Supplier Device Package: PG-TQFP-144-7
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Core Size: 16-Bit
Data Converters: A/D 16x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Number of I/O: 103
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 144TQFP
Part Status: Last Time Buy
Supplier Device Package: PG-TQFP-144-7
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Core Size: 16-Bit
Data Converters: A/D 16x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
Number of I/O: 103
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
DigiKey Programmable: Not Verified
auf Bestellung 104 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1+ | 44.79 EUR |
| 10+ | 41.31 EUR |
| 25+ | 39.45 EUR |
| 80+ | 35.27 EUR |
| XC167CI32F40FBBAFXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 256KB FLASH 144TQFP
Description: IC MCU 16BIT 256KB FLASH 144TQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| XC886C8FFI5VACFXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 48TQFP
Number of I/O: 34
Part Status: Last Time Buy
Supplier Device Package: PG-TQFP-48
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48TQFP
Number of I/O: 34
Part Status: Last Time Buy
Supplier Device Package: PG-TQFP-48
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
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Stück im Wert von UAH
| XC886CM8FFI5VACFXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 48TQFP
Number of I/O: 34
Part Status: Last Time Buy
Supplier Device Package: PG-TQFP-48
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 8BIT 32KB FLASH 48TQFP
Number of I/O: 34
Part Status: Last Time Buy
Supplier Device Package: PG-TQFP-48
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 48-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1800 Stücke
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| SAF-XC888CLM-8FFA 5V AC |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 64TQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: PG-TQFP-64
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, LINbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Description: IC MCU 8BIT 32KB FLASH 64TQFP
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: PG-TQFP-64
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, LINbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Produkt ist nicht verfügbar
Mindestbestellmenge: 1900 Stücke
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| SAF-XC888CM-8FFA 5V AC |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 64TQFP
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: PG-TQFP-64
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 8BIT 32KB FLASH 64TQFP
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: PG-TQFP-64
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Package / Case: 64-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1900 Stücke
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Stück im Wert von UAH
| SAF 82525 N V2.2 |
|
Hersteller: Infineon Technologies
Description: IC INTERFACE SPECIALIZED 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: P-LCC-44-1
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: P-LCC-44-1
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
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Stück im Wert von UAH
| SAF 82526 N V2.2 |
|
Hersteller: Infineon Technologies
Description: IC INTERFACE SPECIALIZED 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: P-LCC-44-1
Part Status: Obsolete
Description: IC INTERFACE SPECIALIZED 44PLCC
Packaging: Tube
Package / Case: 44-LCC (J-Lead)
Mounting Type: Surface Mount
Interface: Serial
Voltage - Supply: 4.75V ~ 5.25V
Supplier Device Package: P-LCC-44-1
Part Status: Obsolete
Produkt ist nicht verfügbar
Mindestbestellmenge: 750 Stücke
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Stück im Wert von UAH
| C161JCLFCAKXQMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 128TQFP
Number of I/O: 93
Part Status: Obsolete
Supplier Device Package: PG-TQFP-128-2
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 10K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT ROMLESS 128TQFP
Number of I/O: 93
Part Status: Obsolete
Supplier Device Package: PG-TQFP-128-2
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 12x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 10K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 128-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| C164CIL25MCAKXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 80MQFP
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: PG-MQFP-80-7
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: C166
Description: IC MCU 16BIT ROMLESS 80MQFP
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 4K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 80-QFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 59
Supplier Device Package: PG-MQFP-80-7
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART
Voltage - Supply (Vcc/Vdd): 4.75V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 8x10b
Core Processor: C166
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| SAK-C167CR-L33M HA+ |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 2KB XRAM 144MQFP
Description: IC MCU 16BIT 2KB XRAM 144MQFP
Produkt ist nicht verfügbar
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| SAK-C167CR-LM HA+ |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 2KB XRAM 144-MQFP
Description: IC MCU 16BIT 2KB XRAM 144-MQFP
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| SAK-C167CS-L33M CA+ |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 33MHZ MQFP-144
Description: IC MCU 16BIT 33MHZ MQFP-144
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| C167CSL40MCAKXQLA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 144MQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Discontinued at Digi-Key
Supplier Device Package: P-MQFP-144-8
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 11K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 144-BQFP
Packaging: Tray
Description: IC MCU 16BIT ROMLESS 144MQFP
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Discontinued at Digi-Key
Supplier Device Package: P-MQFP-144-8
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 24x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 11K x 8
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 144-BQFP
Packaging: Tray
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| K167CSLMCAZNP |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT ROMLESS 144MQFP
Core Size: 16-Bit
Data Converters: A/D 24x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 11K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Obsolete
Supplier Device Package: P-MQFP-144-6
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Description: IC MCU 16BIT ROMLESS 144MQFP
Core Size: 16-Bit
Data Converters: A/D 24x10b
Core Processor: C166
Program Memory Type: ROMless
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 11K x 8
Speed: 25MHz
Mounting Type: Surface Mount
Package / Case: 144-BQFP
Packaging: Tray
DigiKey Programmable: Not Verified
Number of I/O: 111
Part Status: Obsolete
Supplier Device Package: P-MQFP-144-6
Peripherals: POR, PWM, WDT
Connectivity: CANbus, EBI/EMI, SPI, SSC, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Produkt ist nicht verfügbar
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| C167SRLMHAKXQLA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 144MQFP
Description: IC MCU 16BIT 144MQFP
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| TC1796256F150EBCKDUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 416BGA
DigiKey Programmable: Not Verified
Number of I/O: 123
Part Status: Obsolete
Supplier Device Package: PG-BGA-416
Peripherals: DMA, POR, WDT
Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Core Size: 32-Bit Single-Core
Data Converters: A/D 44x12b
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Description: IC MCU 32BIT 2MB FLASH 416BGA
DigiKey Programmable: Not Verified
Number of I/O: 123
Part Status: Obsolete
Supplier Device Package: PG-BGA-416
Peripherals: DMA, POR, WDT
Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Core Size: 32-Bit Single-Core
Data Converters: A/D 44x12b
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
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| XC161CJ16F40FBBKXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Last Time Buy
Supplier Device Package: PG-TQFP-144-7
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Core Size: 16-Bit
Data Converters: A/D 12x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
Description: IC MCU 16BIT 128KB FLASH 144TQFP
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Last Time Buy
Supplier Device Package: PG-TQFP-144-7
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, SLDM, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Core Size: 16-Bit
Data Converters: A/D 12x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 1000+ | 46.07 EUR |
| SAK-XC161CS-32F20F BB-A |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 256KB FLASH 144TQFP
Core Size: 16-Bit
Data Converters: A/D 12x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Discontinued at Digi-Key
Supplier Device Package: PG-TQFP-144-7
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Description: IC MCU 16BIT 256KB FLASH 144TQFP
Core Size: 16-Bit
Data Converters: A/D 12x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 12K x 8
Program Memory Size: 256KB (256K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 99
Part Status: Discontinued at Digi-Key
Supplier Device Package: PG-TQFP-144-7
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, I²C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
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| XC164CS16F20FBBKXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 100TQFP
Number of I/O: 79
Part Status: Discontinued at Digi-Key
Supplier Device Package: PG-TQFP-100-5
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Core Size: 16-Bit
Data Converters: A/D 14x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 16BIT 128KB FLASH 100TQFP
Number of I/O: 79
Part Status: Discontinued at Digi-Key
Supplier Device Package: PG-TQFP-100-5
Peripherals: PWM, WDT
Connectivity: CANbus, EBI/EMI, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.35V ~ 2.7V
Core Size: 16-Bit
Data Converters: A/D 14x8/10b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 8K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 20MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| XC167CI16F40FBBKXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 128KB FLASH 144TQFP
Description: IC MCU 16BIT 128KB FLASH 144TQFP
Produkt ist nicht verfügbar
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| XC167CI32F40FBBAKXUMA1 |
|
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 256KB FLASH 144TQFP
Description: IC MCU 16BIT 256KB FLASH 144TQFP
Produkt ist nicht verfügbar
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| SAK-XC888C-8FFA 5V AC |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT FLASH TQFP-64
Description: IC MCU 8BIT FLASH TQFP-64
Produkt ist nicht verfügbar
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| SAK-XC888CM-8FFA AB |
|
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: PG-TQFP-64
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Description: IC MCU 8BIT 32KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 48
Supplier Device Package: PG-TQFP-64
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Produkt ist nicht verfügbar
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| SDB06S60 |
|
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 600V 6A TO263
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 6 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO263-2
Current - Average Rectified (Io): 6A
Capacitance @ Vr, F: 300pF @ 0V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Description: DIODE SIL CARB 600V 6A TO263
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 6 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO263-2
Current - Average Rectified (Io): 6A
Capacitance @ Vr, F: 300pF @ 0V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
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| SDB20S30 |
|
Hersteller: Infineon Technologies
Description: DIODE ARRAY SIC 300V TO220-3-45
Current - Reverse Leakage @ Vr: 200 µA @ 300 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 300 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO220-3-45
Current - Average Rectified (Io) (per Diode): 10A (DC)
Diode Configuration: 1 Pair Common Cathode
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Description: DIODE ARRAY SIC 300V TO220-3-45
Current - Reverse Leakage @ Vr: 200 µA @ 300 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 300 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO220-3-45
Current - Average Rectified (Io) (per Diode): 10A (DC)
Diode Configuration: 1 Pair Common Cathode
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SDD04S60 |
|
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 600V 4A TO252-31
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 4 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO252-3-11
Current - Average Rectified (Io): 4A
Capacitance @ Vr, F: 150pF @ 0V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
Description: DIODE SIL CARB 600V 4A TO252-31
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 4 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO252-3-11
Current - Average Rectified (Io): 4A
Capacitance @ Vr, F: 150pF @ 0V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SDP10S30 |
|
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 300V 10A PGTO2203
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 600pF @ 0V, 1MHz
Current - Average Rectified (Io): 10A
Supplier Device Package: PG-TO220-3
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Current - Reverse Leakage @ Vr: 200 µA @ 300 V
Description: DIODE SIL CARB 300V 10A PGTO2203
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 600pF @ 0V, 1MHz
Current - Average Rectified (Io): 10A
Supplier Device Package: PG-TO220-3
Operating Temperature - Junction: -55°C ~ 175°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 300 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Current - Reverse Leakage @ Vr: 200 µA @ 300 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SDT05S60 |
|
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 600V 5A PGTO2202
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 170pF @ 1V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: PG-TO220-2-2
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Description: DIODE SIL CARB 600V 5A PGTO2202
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 170pF @ 1V, 1MHz
Current - Average Rectified (Io): 5A
Supplier Device Package: PG-TO220-2-2
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 5 A
Current - Reverse Leakage @ Vr: 200 µA @ 600 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SDT08S60 |
|
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 600V 8A PGTO2202
Current - Reverse Leakage @ Vr: 300 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 8 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Obsolete
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO220-2-2
Current - Average Rectified (Io): 8A
Capacitance @ Vr, F: 280pF @ 0V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
Description: DIODE SIL CARB 600V 8A PGTO2202
Current - Reverse Leakage @ Vr: 300 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 8 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Obsolete
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO220-2-2
Current - Average Rectified (Io): 8A
Capacitance @ Vr, F: 280pF @ 0V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SDT10S60 |
|
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 600V 10A TO220-2
Capacitance @ Vr, F: 350pF @ 0V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
Current - Reverse Leakage @ Vr: 350 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO220-2-2
Current - Average Rectified (Io): 10A
Description: DIODE SIL CARB 600V 10A TO220-2
Capacitance @ Vr, F: 350pF @ 0V, 1MHz
Technology: SiC (Silicon Carbide) Schottky
Reverse Recovery Time (trr): 0 ns
Speed: No Recovery Time > 500mA (Io)
Mounting Type: Through Hole
Package / Case: TO-220-2
Packaging: Tube
Current - Reverse Leakage @ Vr: 350 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.7 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -55°C ~ 175°C
Supplier Device Package: PG-TO220-2-2
Current - Average Rectified (Io): 10A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SFH 551/1-1 |
|
Hersteller: Infineon Technologies
Description: MOD PHOTO DETECT RCVR 700NM TTL
Current - Supply: 4 mA
Part Status: Obsolete
Power - Minimum Receivable: -22dBm
Data Rate: 5Mbps
Applications: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Packaging: Bulk
Description: MOD PHOTO DETECT RCVR 700NM TTL
Current - Supply: 4 mA
Part Status: Obsolete
Power - Minimum Receivable: -22dBm
Data Rate: 5Mbps
Applications: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SFH 551/1V-1 |
|
Hersteller: Infineon Technologies
Description: MOD PHOTO DETECT RCVR 700NM TTL
Current - Supply: 4 mA
Part Status: Obsolete
Power - Minimum Receivable: -22dBm
Data Rate: 50Mbps
Applications: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Packaging: Bulk
Description: MOD PHOTO DETECT RCVR 700NM TTL
Current - Supply: 4 mA
Part Status: Obsolete
Power - Minimum Receivable: -22dBm
Data Rate: 50Mbps
Applications: General Purpose
Voltage - Supply: 4.75V ~ 5.25V
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SFH 757 |
|
Hersteller: Infineon Technologies
Description: TRANSMITTER DIODE FIBER OPTIC
Description: TRANSMITTER DIODE FIBER OPTIC
Produkt ist nicht verfügbar
Mindestbestellmenge: 70 Stücke
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| SIDC01D120H6 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 1.2KV 600MA WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 600 mA
Voltage - DC Reverse (Vr) (Max): 1200 V
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 600mA
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 600MA WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 600 mA
Voltage - DC Reverse (Vr) (Max): 1200 V
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 600mA
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC01D60C6 |
Hersteller: Infineon Technologies
Description: DIODE GEN PURP WAFER
Description: DIODE GEN PURP WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 2346 Stücke
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Stück im Wert von UAH
| SIDC02D60C6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 600V 6A WAFER
Description: DIODE GEN PURP 600V 6A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 1752 Stücke
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Stück im Wert von UAH
| SIDC02D60F6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 600V 3A WAFER
Description: DIODE GEN PURP 600V 3A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 3634 Stücke
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Stück im Wert von UAH
| SIDC03D120F6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 2A WAFER
Description: DIODE GEN PURP 1.2KV 2A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 1251 Stücke
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Stück im Wert von UAH
| SIDC03D120H6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 1.2KV 3A WAFER
Description: DIODE GEN PURP 1.2KV 3A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 1251 Stücke
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| SIDC03D60C6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 600V 10A WAFER
Description: DIODE GEN PURP 600V 10A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 1223 Stücke
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Stück im Wert von UAH
| SIDC03D60F6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 600V 6A WAFER
Description: DIODE GEN PURP 600V 6A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 2414 Stücke
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Stück im Wert von UAH
| SIDC04D60F6X1SA3 |
|
Hersteller: Infineon Technologies
Description: DIODE STD 600V 9A SAWN ON FOIL
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 9 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -40°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 9A
Technology: Standard
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE STD 600V 9A SAWN ON FOIL
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 9 A
Voltage - DC Reverse (Vr) (Max): 600 V
Operating Temperature - Junction: -40°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 9A
Technology: Standard
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC05D60C6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 600V 15A WAFER
Description: DIODE GEN PURP 600V 15A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
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Stück im Wert von UAH
| SIDC06D120E6X1SA3 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 1.2KV 5A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 5 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Description: DIODE GP 1.2KV 5A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.9 V @ 5 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC06D120F6X1SA2 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 1.2KV 5A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 5 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Description: DIODE GP 1.2KV 5A WAFER
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 5A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 5 A
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC06D120H6X1SA4 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 1.2KV 7.5A WAFER
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 7.5 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 7.5A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Description: DIODE GP 1.2KV 7.5A WAFER
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 7.5 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 7.5A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC06D60AC6X1SA1 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 600V 20A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 20A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 600V 20A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 20A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC06D60C6 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 600V 20A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 20A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 600V 20A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 20 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 20A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC06D60E6X1SA3 |
|
Hersteller: Infineon Technologies
Description: DIODE STD 600V 10A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 10 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE STD 600V 10A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 10A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -55°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 10 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC06D60F6X1SA3 |
|
Hersteller: Infineon Technologies
Description: DIODE STD 600V 15A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 15A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 15 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE STD 600V 15A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 15A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 150°C
Part Status: Obsolete
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 15 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC07D60AF6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 600V 22.5A WAFER
Description: DIODE GEN PURP 600V 22.5A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 927 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SIDC07D60E6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 600V 15A WAFER
Description: DIODE GEN PURP 600V 15A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 577 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SIDC07D60F6 |
|
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 600V 22.5A WAFER
Description: DIODE GEN PURP 600V 22.5A WAFER
Produkt ist nicht verfügbar
Mindestbestellmenge: 561 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| SIDC08D120F6X1SA3 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 1.2KV 7A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 7 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 7A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 7A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 2.1 V @ 7 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 7A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC08D120H6X1SA1 |
|
Hersteller: Infineon Technologies
Description: DIODE GP 1.2KV 10A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 10A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Description: DIODE GP 1.2KV 10A WAFER
Current - Reverse Leakage @ Vr: 27 µA @ 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.6 V @ 10 A
Voltage - DC Reverse (Vr) (Max): 1200 V
Part Status: Discontinued at Digi-Key
Operating Temperature - Junction: -55°C ~ 150°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 10A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC08D60C6 |
|
Hersteller: Infineon Technologies
Description: DIODE STD 600V 30A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 30A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 30 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Description: DIODE STD 600V 30A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 30A
Supplier Device Package: Sawn on foil
Operating Temperature - Junction: -40°C ~ 175°C
Part Status: Discontinued at Digi-Key
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 30 A
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SIDC08D60C6Y |
|
Hersteller: Infineon Technologies
Description: DIODE GP 600V 30A WAFER
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 30A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 30 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Description: DIODE GP 600V 30A WAFER
Mounting Type: Surface Mount
Package / Case: Die
Packaging: Bulk
Operating Temperature - Junction: -40°C ~ 175°C
Supplier Device Package: Sawn on foil
Current - Average Rectified (Io): 30A
Technology: Standard
Speed: Standard Recovery >500ns, > 200mA (Io)
Current - Reverse Leakage @ Vr: 27 µA @ 600 V
Voltage - Forward (Vf) (Max) @ If: 1.95 V @ 30 A
Voltage - DC Reverse (Vr) (Max): 600 V
Part Status: Discontinued at Digi-Key
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH