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TLE9255WSKXUMA1 TLE9255WSKXUMA1 Infineon Technologies Infineon-TLE9255W-DS-v01_01-EN.pdf?fileId=5546d4625bd71aa0015c10eaeaf93ee5 Description: IC TRANSCEIVER FULL PGDSO14
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Data Rate: 1Mbps
Protocol: CANbus
Supplier Device Package: PG-DSO-14
Duplex: Full
Grade: Automotive
Part Status: Active
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TLE9255WSKXUMA1 TLE9255WSKXUMA1 Infineon Technologies Infineon-TLE9255W-DS-v01_01-EN.pdf?fileId=5546d4625bd71aa0015c10eaeaf93ee5 Description: IC TRANSCEIVER FULL PGDSO14
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Data Rate: 1Mbps
Protocol: CANbus
Supplier Device Package: PG-DSO-14
Duplex: Full
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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BGF106CE6328XTSA1 BGF106CE6328XTSA1 Infineon Technologies BGF106C.pdf Description: FILTER RC 290MHZ ESD SMD
Packaging: Tape & Reel (TR)
Voltage - Rated: 5.5V
Package / Case: 8-UFBGA, WLCSP
Size / Dimension: 0.047" L x 0.047" W (1.20mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 47Ohms, 100Ohms, C = 16.5pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 16.9dB @ 800MHz ~ 4GHz
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC
Center / Cutoff Frequency: 290MHz (Cutoff)
Resistance - Channel (Ohms): 47, 100
ESD Protection: Yes
Number of Channels: 3
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D2700U45X122XOSA1 D2700U45X122XOSA1 Infineon Technologies Infineon-D2700U45X122-DS-v01_01-EN.pdf?fileId=5546d4625f96303e015fa5df75323970 Description: DIODE GP 4.5KV 2900A D12026K-1
Packaging: Tray
Package / Case: DO-200AE
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 2900A
Supplier Device Package: BG-D12026K-1
Operating Temperature - Junction: 140°C (Max)
Voltage - DC Reverse (Vr) (Max): 4500 V
Current - Reverse Leakage @ Vr: 150 mA @ 4500 V
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IRLR4132TRPBF IRLR4132TRPBF Infineon Technologies fundamentals-of-power-semiconductors Description: MOSFET N-CH 30V 160A DPAK
Packaging: Tape & Reel (TR)
Part Status: Active
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IRLR4132TRPBF IRLR4132TRPBF Infineon Technologies fundamentals-of-power-semiconductors Description: MOSFET N-CH 30V 160A DPAK
Packaging: Cut Tape (CT)
Part Status: Active
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IPP026N04NF2SAKMA1 IPP026N04NF2SAKMA1 Infineon Technologies Infineon-IPP026N04NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c82ce566401833b43474c5666 Description: TRENCH PG-TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 29A (Ta), 121A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 70A, 10V
Power Dissipation (Max): 3.8W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 3.4V @ 81µA
Supplier Device Package: PG-TO220-3-U05
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 102 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4800 pF @ 20 V
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IPP013N04NF2SAKMA1 IPP013N04NF2SAKMA1 Infineon Technologies Infineon-IPP013N04NF2S-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401831736c4a75b41 Description: TRENCH PG-TO220-3
Packaging: Tube
Part Status: Active
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IPP014N06NF2SAKMA1 Infineon Technologies Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 39A (Ta), 198A (Tc)
Rds On (Max) @ Id, Vgs: 1.4mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 246µA
Supplier Device Package: PG-TO220-3-U05
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 305 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13800 pF @ 30 V
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IPF016N06NF2SATMA1 IPF016N06NF2SATMA1 Infineon Technologies Infineon-IPF016N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851d1298c66aee Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Ta), 223A (Tc)
Rds On (Max) @ Id, Vgs: 1.7mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 188W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 129µA
Supplier Device Package: PG-TO263-7-U02
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 162 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7300 pF @ 30 V
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IPF016N06NF2SATMA1 IPF016N06NF2SATMA1 Infineon Technologies Infineon-IPF016N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851d1298c66aee Description: TRENCH 40<-<100V
Packaging: Cut Tape (CT)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Ta), 223A (Tc)
Rds On (Max) @ Id, Vgs: 1.7mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 188W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 129µA
Supplier Device Package: PG-TO263-7-U02
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 162 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7300 pF @ 30 V
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S25HL512TDPMHB010 S25HL512TDPMHB010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 512MBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
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S25HL512TDPNHI010 S25HL512TDPNHI010 Infineon Technologies 002-12345_rev-AF.pdf Description: IC FLASH 512MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Memory Interface: SPI - Quad I/O
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
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S25HL512TDPNHB010 S25HL512TDPNHB010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 512MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
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CY9BF116TPMC-GK7FKCGE1 Infineon Technologies Description: IC MCU 32BIT 512KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 154
DigiKey Programmable: Not Verified
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CY91F469GBPB-GS-UJE1KR Infineon Technologies Description: IC MCU 32BT 2.0625MB FLSH 320BGA
Packaging: Tray
Package / Case: 320-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: FR60 RISC
Data Converters: A/D 32x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 320-BGA (27x27)
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
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IM241S6S1BAUMA1 IM241S6S1BAUMA1 Infineon Technologies Infineon-IM241_Series_2A-DataSheet-v01_06-EN.pdf?fileId=8ac78c8c81ae03fc0181f110b5c77f8e Description: CIPOS MICRO PG-DIP-23
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 2 A
Voltage: 600 V
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IM241S6S1BAUMA1 IM241S6S1BAUMA1 Infineon Technologies Infineon-IM241_Series_2A-DataSheet-v01_06-EN.pdf?fileId=8ac78c8c81ae03fc0181f110b5c77f8e Description: CIPOS MICRO PG-DIP-23
Packaging: Cut Tape (CT)
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 2 A
Voltage: 600 V
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IM241M6S1JAUMA1 IM241M6S1JAUMA1 Infineon Technologies Infineon-IM241_Series_4A-DataSheet-v01_06-EN.pdf?fileId=8ac78c8c81ae03fc0181f110aa4c7f88 Description: CIPOS MICRO PG-DIP-23
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 4 A
Voltage: 600 V
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IM241M6S1JAUMA1 IM241M6S1JAUMA1 Infineon Technologies Infineon-IM241_Series_4A-DataSheet-v01_06-EN.pdf?fileId=8ac78c8c81ae03fc0181f110aa4c7f88 Description: CIPOS MICRO PG-DIP-23
Packaging: Cut Tape (CT)
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 4 A
Voltage: 600 V
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IRSM515-025DAAKMA1 Infineon Technologies Description: CIPOS MICRO DIP23
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IRSM515-055DA2AKMA1 Infineon Technologies Description: CIPOS MICRO DIP23
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IRSM505-035PAALMA1 Infineon Technologies Description: CIPOS MICRO SOP23
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IRSM505-065PATRAUMA1 Infineon Technologies Description: IC HALF BRIDGE DRIVER 2.6A SOP23
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Interface: Logic, PWM
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 13.5V ~ 16.5V
Rds On (Typ): 1Ohm LS, 1Ohm HS
Applications: AC Motors
Current - Output / Channel: 2.6A
Technology: MOSFET (Metal Oxide)
Voltage - Load: 400V (Max)
Supplier Device Package: PG-DIP-23-901/SOP 29x12F
Fault Protection: UVLO
Load Type: Inductive
Part Status: Obsolete
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XDPS21061XUMA1 XDPS21061XUMA1 Infineon Technologies 2020108ACorr.pdf Description: AC/DC DIGITAL PLATFORM
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PVT422S-TPBF PVT422S-TPBF Infineon Technologies pvt422.pdf?fileId=5546d462533600a401535684473f2973 Description: SSR RELAY SPST-NO 120MA 0-400V
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD (0.300", 7.62mm)
Output Type: AC, DC
Mounting Type: Surface Mount
Voltage - Input: 1.2VDC
Circuit: SPST-NO (1 Form A) x 2
Termination Style: Gull Wing
Load Current: 120 mA
Supplier Device Package: 8-SMD
Part Status: Active
Voltage - Load: 0 V ~ 400 V
On-State Resistance (Max): 35 Ohms
Operating Temperature: -40°C ~ 85°C
Approval Agency: UL
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PVT422S-TPBF PVT422S-TPBF Infineon Technologies pvt422.pdf?fileId=5546d462533600a401535684473f2973 Description: SSR RELAY SPST-NO 120MA 0-400V
Packaging: Cut Tape (CT)
Package / Case: 8-SMD (0.300", 7.62mm)
Output Type: AC, DC
Mounting Type: Surface Mount
Voltage - Input: 1.2VDC
Circuit: SPST-NO (1 Form A) x 2
Termination Style: Gull Wing
Load Current: 120 mA
Supplier Device Package: 8-SMD
Part Status: Active
Voltage - Load: 0 V ~ 400 V
On-State Resistance (Max): 35 Ohms
Operating Temperature: -40°C ~ 85°C
Approval Agency: UL
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CY9AFAA2NPF-G-SNE1 CY9AFAA2NPF-G-SNE1 Infineon Technologies Infineon-CY9AAA0N_SERIES_32_BIT_Arm_Cortex_M3_FM3_MICROCONTROLLER-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee0a9a66657&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 128KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CSIO, I2C, UART/USART
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-QFP (14x20)
Part Status: Obsolete
Number of I/O: 84
DigiKey Programmable: Not Verified
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TLS850F3TUV50ATMA1 TLS850F3TUV50ATMA1 Infineon Technologies Infineon-TLS850F3TUV50-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8929aa4d0189daf49d383c09 Description: IC REG LINEAR OPTIREG
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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S6AE101A0DGNAB000 S6AE101A0DGNAB000 Infineon Technologies Description: IC PMIC ENERGY HARVESTING 10SON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Applications: Energy Harvesting
Supplier Device Package: 10-SON (3x3)
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S6AE101A0DGNAB000 S6AE101A0DGNAB000 Infineon Technologies Description: IC PMIC ENERGY HARVESTING 10SON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Applications: Energy Harvesting
Supplier Device Package: 10-SON (3x3)
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250+7.19 EUR
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CY7C1371KV33-100AXI CY7C1371KV33-100AXI Infineon Technologies Infineon-CY7C1371KV33_CY7C1371KVE33_CY7C1373KV33_18-Mbit_(512_K_36_1_M_18)_Flow-Through_SRAM_with_NoBL_Architecture_(With_ECC)-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed99c465b40&utm_source=cypress&utm_medium=refe Description: IC SRAM 18MBIT PAR 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Part Status: Active
Memory Interface: Parallel
Access Time: 8.5 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
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CY8C4126AXI-S445 CY8C4126AXI-S445 Infineon Technologies PSoC_4100S_Plus_RevH_9-14-18.pdf Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
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FS200R12KT4RPB51BPSA1 Infineon Technologies INFNS28545-1.pdf?t.download=true&u=5oefqw Description: FS200R12 - IGBT MODULE
Packaging: Bulk
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FS200R12KT4RPB11BPSA1 FS200R12KT4RPB11BPSA1 Infineon Technologies Infineon-FS200R12KT4RP_B11-DS-v03_00-EN.pdf?fileId=5546d462689a790c016939d8cb276b4d Description: IGBT MODULE LOW PWR ECONO3-4
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DD89N16KAHPSA1 Infineon Technologies INFNS29284-1.pdf?t.download=true&u=5oefqw Description: DIODE MOD GP 1600V 89A POWRBLOK
Packaging: Bulk
Package / Case: POW-R-BLOK™ Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 89A
Supplier Device Package: POW-R-BLOK™ Module
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 1600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 300 A
Current - Reverse Leakage @ Vr: 20 mA @ 1600 V
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DD89N16KAHPSA1 Infineon Technologies INFNS29284-1.pdf?t.download=true&u=5oefqw Description: DIODE MOD GP 1600V 89A POWRBLOK
Packaging: Tray
Package / Case: POW-R-BLOK™ Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 89A
Supplier Device Package: POW-R-BLOK™ Module
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 1600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 300 A
Current - Reverse Leakage @ Vr: 20 mA @ 1600 V
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DD89N16KKHPSA1 DD89N16KKHPSA1 Infineon Technologies INFNS29284-1.pdf?t.download=true&u=5oefqw Description: DIODE ARRAY MOD 1200V 140A
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BSL802SNL6327HTSA1 BSL802SNL6327HTSA1 Infineon Technologies BSL802SN_Rev2.1.pdf?folderId=db3a3043156fd573011622e10b5c1f67&fileId=db3a30431b0626df011b129ef9177bd1 Description: MOSFET N-CH 20V 7.5A TSOP-6
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BSL802SNL6327HTSA1 BSL802SNL6327HTSA1 Infineon Technologies BSL802SN_Rev2.1.pdf?folderId=db3a3043156fd573011622e10b5c1f67&fileId=db3a30431b0626df011b129ef9177bd1 Description: MOSFET N-CH 20V 7.5A TSOP-6
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S25FL256SAGMFI010 S25FL256SAGMFI010 Infineon Technologies Infineon-S25FL128S_S25FL256S_128_Mb_(16_MB)_256_Mb_(32_MB)_3.0V_SPI_Flash_Memory-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfb6a64a17 Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
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CY62167EV30LL-45BVXIT CY62167EV30LL-45BVXIT Infineon Technologies Infineon-CY62167EV30_MoBL_16-Mbit_(1M_x_16_2M_x_8)_Static_RAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe4ea831c9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 16MBIT PARALLEL 48VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
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CY62167EV30LL-45BVXIT CY62167EV30LL-45BVXIT Infineon Technologies Infineon-CY62167EV30_MoBL_16-Mbit_(1M_x_16_2M_x_8)_Static_RAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe4ea831c9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 16MBIT PARALLEL 48VFBGA
Packaging: Cut Tape (CT)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
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CY62167EV30LL-45ZXIT CY62167EV30LL-45ZXIT Infineon Technologies Infineon-CY62167EV30_MoBL_16-Mbit_(1M_x_16_2M_x_8)_Static_RAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe4ea831c9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
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CY62167EV30LL-45ZXIT CY62167EV30LL-45ZXIT Infineon Technologies Infineon-CY62167EV30_MoBL_16-Mbit_(1M_x_16_2M_x_8)_Static_RAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe4ea831c9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
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BSM100GD60DLCBOSA1 Infineon Technologies Description: IGBT MOD 600V 130A 430W
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BSM100GD60DLCBOSA1 Infineon Technologies Description: IGBT MOD 600V 130A 430W
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CYPD5236-40LQXI Infineon Technologies Description: IC MCU 32BIT 40QFN
Packaging: Tray
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
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CYPD5236-40LQXIT Infineon Technologies Description: IC MCU 32BIT 40QFN
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
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TC387TP128F300SAEKXUMA1 TC387TP128F300SAEKXUMA1 Infineon Technologies Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512K x 8
Core Processor: TriCore™
Data Converters: A/D 84 SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: PG-LFBGA-292-11
DigiKey Programmable: Not Verified
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TC299TP128F300SBBKXUMA1 TC299TP128F300SBBKXUMA1 Infineon Technologies Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 8MB FLASH 516LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-516-5
Number of I/O: 263
DigiKey Programmable: Not Verified
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CYPAS111A1-24LQXQ CYPAS111A1-24LQXQ Infineon Technologies Infineon-PAG1S_CYPAS111_Datasheet_USB-PD_Power_Adapter_Secondary_Side_Controller-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9bbf07290 Description: IC OFFLINE SWITCH FLYBACK 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Frequency - Switching: 20kHz ~ 150kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Supplier Device Package: 24-QFN (4x4)
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CY29774AXI CY29774AXI Infineon Technologies Description: IC FANOUT DIST 52TQFP
Packaging: Tray
Package / Case: 52-TQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 125MHz
Type: Fanout Distribution, Multiplexer, Zero Delay Buffer
Input: LVCMOS
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:14
Differential - Input:Output: No/No
Supplier Device Package: 52-TQFP (10x10)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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IGQ75N120S7XKSA1 IGQ75N120S7XKSA1 Infineon Technologies Infineon-IGQ75N120S7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c850f4bee0185a59a17a3786a Description: IGBT TRENCH 1200V 154A TO247-55
Packaging: Tube
Part Status: Active
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Supplier Device Package: PG-TO247-3-55
IGBT Type: Trench
Td (on/off) @ 25°C: 38ns/190ns
Switching Energy: 5.13mJ (on), 3.48mJ (off)
Test Condition: 600V, 75A, 2.1Ohm, 15V
Gate Charge: 450 nC
Current - Collector (Ic) (Max): 154 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 225 A
Power - Max: 630 W
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IKQ75N120CS7XKSA1 IKQ75N120CS7XKSA1 Infineon Technologies Infineon-IKQ75N120CS7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c850f4bee0185a559ec887495 Description: IGBT TRENCH 1200V 154A TO247-46
Packaging: Tube
Part Status: Active
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Supplier Device Package: PG-TO247-3-46
IGBT Type: Trench
Td (on/off) @ 25°C: 38ns/190ns
Switching Energy: 5.13mJ (on), 3.48mJ (off)
Test Condition: 600V, 75A, 2.1Ohm, 15V
Gate Charge: 450 nC
Current - Collector (Ic) (Max): 154 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 225 A
Power - Max: 630 W
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CYUSB3KIT-003 CYUSB3KIT-003 Infineon Technologies Infineon-SuperSpeed_Explorer_Kit_User_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ef82cf70d57&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: EVAL BOARD FOR CYUSB301X
Packaging: Box
Function: USB 3.0 Host/Controller
Type: Interface
Utilized IC / Part: CYUSB301x
Supplied Contents: Board(s), Cable(s), Accessories
Part Status: Active
Contents: Board(s), Cable(s), Accessories
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KP236N6165 Infineon Technologies INFNS15313-1.pdf?t.download=true&u=5oefqw Description: ANALOG ABSOLUTE PRESSURE SENSOR
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IPA50R520CP Infineon Technologies INFNS15801-1.pdf?t.download=true&u=5oefqw Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.1A (Tc)
Rds On (Max) @ Id, Vgs: 520mOhm @ 3.8A, 10V
Power Dissipation (Max): 66W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 250µA
Supplier Device Package: PG-TO220-3-31
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 680 pF @ 100 V
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IPA50R520CPXKSA1 IPA50R520CPXKSA1 Infineon Technologies IPA50R520CP.pdf Description: MOSFET N-CH 500V 7.1A TO220-FP
Packaging: Bulk
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.1A (Tc)
Rds On (Max) @ Id, Vgs: 520mOhm @ 3.8A, 10V
Power Dissipation (Max): 66W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 250µA
Supplier Device Package: PG-TO220-3-31
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 680 pF @ 100 V
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IPA50R350CPXKSA1 IPA50R350CPXKSA1 Infineon Technologies IPA50R350CP_rev2.1.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b42db39548cb Description: MOSFET N-CH 500V 10A TO220-FP
Packaging: Bulk
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 10A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 5.6A, 10V
Power Dissipation (Max): 32W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 370µA
Supplier Device Package: PG-TO220-3-31
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 100 V
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275+1.71 EUR
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TLE9255WSKXUMA1 Infineon-TLE9255W-DS-v01_01-EN.pdf?fileId=5546d4625bd71aa0015c10eaeaf93ee5
TLE9255WSKXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER FULL PGDSO14
Packaging: Tape & Reel (TR)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Data Rate: 1Mbps
Protocol: CANbus
Supplier Device Package: PG-DSO-14
Duplex: Full
Grade: Automotive
Part Status: Active
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TLE9255WSKXUMA1 Infineon-TLE9255W-DS-v01_01-EN.pdf?fileId=5546d4625bd71aa0015c10eaeaf93ee5
TLE9255WSKXUMA1
Hersteller: Infineon Technologies
Description: IC TRANSCEIVER FULL PGDSO14
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: Transceiver
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 4.75V ~ 5.25V
Data Rate: 1Mbps
Protocol: CANbus
Supplier Device Package: PG-DSO-14
Duplex: Full
Grade: Automotive
Part Status: Active
Produkt ist nicht verfügbar
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BGF106CE6328XTSA1 BGF106C.pdf
BGF106CE6328XTSA1
Hersteller: Infineon Technologies
Description: FILTER RC 290MHZ ESD SMD
Packaging: Tape & Reel (TR)
Voltage - Rated: 5.5V
Package / Case: 8-UFBGA, WLCSP
Size / Dimension: 0.047" L x 0.047" W (1.20mm x 1.20mm)
Mounting Type: Surface Mount
Type: Low Pass
Operating Temperature: -40°C ~ 85°C
Values: R = 47Ohms, 100Ohms, C = 16.5pF (Total)
Height: 0.026" (0.65mm)
Attenuation Value: 16.9dB @ 800MHz ~ 4GHz
Filter Order: 2nd
Applications: Data Lines for Mobile Devices
Technology: RC
Center / Cutoff Frequency: 290MHz (Cutoff)
Resistance - Channel (Ohms): 47, 100
ESD Protection: Yes
Number of Channels: 3
Produkt ist nicht verfügbar
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D2700U45X122XOSA1 Infineon-D2700U45X122-DS-v01_01-EN.pdf?fileId=5546d4625f96303e015fa5df75323970
D2700U45X122XOSA1
Hersteller: Infineon Technologies
Description: DIODE GP 4.5KV 2900A D12026K-1
Packaging: Tray
Package / Case: DO-200AE
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 2900A
Supplier Device Package: BG-D12026K-1
Operating Temperature - Junction: 140°C (Max)
Voltage - DC Reverse (Vr) (Max): 4500 V
Current - Reverse Leakage @ Vr: 150 mA @ 4500 V
auf Bestellung 2 Stücke:
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Anzahl Preis
1+3107.19 EUR
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IRLR4132TRPBF fundamentals-of-power-semiconductors
IRLR4132TRPBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 160A DPAK
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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IRLR4132TRPBF fundamentals-of-power-semiconductors
IRLR4132TRPBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 160A DPAK
Packaging: Cut Tape (CT)
Part Status: Active
Produkt ist nicht verfügbar
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IPP026N04NF2SAKMA1 Infineon-IPP026N04NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c82ce566401833b43474c5666
IPP026N04NF2SAKMA1
Hersteller: Infineon Technologies
Description: TRENCH PG-TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 29A (Ta), 121A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 70A, 10V
Power Dissipation (Max): 3.8W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 3.4V @ 81µA
Supplier Device Package: PG-TO220-3-U05
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 102 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4800 pF @ 20 V
Produkt ist nicht verfügbar
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IPP013N04NF2SAKMA1 Infineon-IPP013N04NF2S-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401831736c4a75b41
IPP013N04NF2SAKMA1
Hersteller: Infineon Technologies
Description: TRENCH PG-TO220-3
Packaging: Tube
Part Status: Active
auf Bestellung 826 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.09 EUR
50+2.56 EUR
100+2.31 EUR
500+1.87 EUR
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IPP014N06NF2SAKMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 39A (Ta), 198A (Tc)
Rds On (Max) @ Id, Vgs: 1.4mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 300W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 246µA
Supplier Device Package: PG-TO220-3-U05
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 305 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 13800 pF @ 30 V
Produkt ist nicht verfügbar
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IPF016N06NF2SATMA1 Infineon-IPF016N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851d1298c66aee
IPF016N06NF2SATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Ta), 223A (Tc)
Rds On (Max) @ Id, Vgs: 1.7mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 188W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 129µA
Supplier Device Package: PG-TO263-7-U02
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 162 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7300 pF @ 30 V
auf Bestellung 800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
800+1.61 EUR
Mindestbestellmenge: 800
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IPF016N06NF2SATMA1 Infineon-IPF016N06NF2S-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee01851d1298c66aee
IPF016N06NF2SATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Cut Tape (CT)
Package / Case: TO-263-7, D2PAK (6 Leads + Tab)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Ta), 223A (Tc)
Rds On (Max) @ Id, Vgs: 1.7mOhm @ 100A, 10V
Power Dissipation (Max): 3.8W (Ta), 188W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 129µA
Supplier Device Package: PG-TO263-7-U02
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 162 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7300 pF @ 30 V
auf Bestellung 989 Stücke:
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Anzahl Preis
4+4.84 EUR
10+3.25 EUR
100+2.26 EUR
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S25HL512TDPMHB010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
S25HL512TDPMHB010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
auf Bestellung 436 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.49 EUR
10+9.75 EUR
25+9.45 EUR
50+9.23 EUR
240+8.72 EUR
Mindestbestellmenge: 2
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S25HL512TDPNHI010 002-12345_rev-AF.pdf
S25HL512TDPNHI010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Memory Interface: SPI - Quad I/O
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
auf Bestellung 119 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.49 EUR
10+9.76 EUR
25+9.46 EUR
50+9.24 EUR
100+9.02 EUR
Mindestbestellmenge: 2
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S25HL512TDPNHB010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
S25HL512TDPNHB010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 8WSON
Packaging: Tray
Package / Case: 8-WDFN Exposed Pad
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 8-WSON (6x8)
Part Status: Active
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
auf Bestellung 71 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.39 EUR
10+10.58 EUR
25+10.26 EUR
50+10.02 EUR
Mindestbestellmenge: 2
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CY9BF116TPMC-GK7FKCGE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 176LQFP
Packaging: Tray
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 176-LQFP (24x24)
Part Status: Active
Number of I/O: 154
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY91F469GBPB-GS-UJE1KR
Hersteller: Infineon Technologies
Description: IC MCU 32BT 2.0625MB FLSH 320BGA
Packaging: Tray
Package / Case: 320-BBGA
Mounting Type: Surface Mount
Speed: 100MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 96K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: FR60 RISC
Data Converters: A/D 32x10b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, UART/USART
Peripherals: DMA, LVD, PWM, WDT
Supplier Device Package: 320-BGA (27x27)
Part Status: Obsolete
Number of I/O: 205
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IM241S6S1BAUMA1 Infineon-IM241_Series_2A-DataSheet-v01_06-EN.pdf?fileId=8ac78c8c81ae03fc0181f110b5c77f8e
IM241S6S1BAUMA1
Hersteller: Infineon Technologies
Description: CIPOS MICRO PG-DIP-23
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 2 A
Voltage: 600 V
Produkt ist nicht verfügbar
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IM241S6S1BAUMA1 Infineon-IM241_Series_2A-DataSheet-v01_06-EN.pdf?fileId=8ac78c8c81ae03fc0181f110b5c77f8e
IM241S6S1BAUMA1
Hersteller: Infineon Technologies
Description: CIPOS MICRO PG-DIP-23
Packaging: Cut Tape (CT)
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 2 A
Voltage: 600 V
auf Bestellung 13 Stücke:
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Anzahl Preis
2+12.23 EUR
10+9.45 EUR
Mindestbestellmenge: 2
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IM241M6S1JAUMA1 Infineon-IM241_Series_4A-DataSheet-v01_06-EN.pdf?fileId=8ac78c8c81ae03fc0181f110aa4c7f88
IM241M6S1JAUMA1
Hersteller: Infineon Technologies
Description: CIPOS MICRO PG-DIP-23
Packaging: Tape & Reel (TR)
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 4 A
Voltage: 600 V
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IM241M6S1JAUMA1 Infineon-IM241_Series_4A-DataSheet-v01_06-EN.pdf?fileId=8ac78c8c81ae03fc0181f110aa4c7f88
IM241M6S1JAUMA1
Hersteller: Infineon Technologies
Description: CIPOS MICRO PG-DIP-23
Packaging: Cut Tape (CT)
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Type: IGBT
Configuration: 3 Phase Inverter
Voltage - Isolation: 2000Vrms
Part Status: Active
Current: 4 A
Voltage: 600 V
auf Bestellung 29 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.39 EUR
10+10.39 EUR
25+9.63 EUR
Mindestbestellmenge: 2
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IRSM515-025DAAKMA1
Hersteller: Infineon Technologies
Description: CIPOS MICRO DIP23
Produkt ist nicht verfügbar
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IRSM515-055DA2AKMA1
Hersteller: Infineon Technologies
Description: CIPOS MICRO DIP23
Produkt ist nicht verfügbar
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IRSM505-035PAALMA1
Hersteller: Infineon Technologies
Description: CIPOS MICRO SOP23
Produkt ist nicht verfügbar
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IRSM505-065PATRAUMA1
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 2.6A SOP23
Packaging: Tape & Reel (TR)
Features: Bootstrap Circuit
Package / Case: 23-PowerSMD Module
Mounting Type: Surface Mount
Interface: Logic, PWM
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (3)
Voltage - Supply: 13.5V ~ 16.5V
Rds On (Typ): 1Ohm LS, 1Ohm HS
Applications: AC Motors
Current - Output / Channel: 2.6A
Technology: MOSFET (Metal Oxide)
Voltage - Load: 400V (Max)
Supplier Device Package: PG-DIP-23-901/SOP 29x12F
Fault Protection: UVLO
Load Type: Inductive
Part Status: Obsolete
Produkt ist nicht verfügbar
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XDPS21061XUMA1 2020108ACorr.pdf
XDPS21061XUMA1
Hersteller: Infineon Technologies
Description: AC/DC DIGITAL PLATFORM
auf Bestellung 32508 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
264+1.83 EUR
Mindestbestellmenge: 264
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PVT422S-TPBF pvt422.pdf?fileId=5546d462533600a401535684473f2973
PVT422S-TPBF
Hersteller: Infineon Technologies
Description: SSR RELAY SPST-NO 120MA 0-400V
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD (0.300", 7.62mm)
Output Type: AC, DC
Mounting Type: Surface Mount
Voltage - Input: 1.2VDC
Circuit: SPST-NO (1 Form A) x 2
Termination Style: Gull Wing
Load Current: 120 mA
Supplier Device Package: 8-SMD
Part Status: Active
Voltage - Load: 0 V ~ 400 V
On-State Resistance (Max): 35 Ohms
Operating Temperature: -40°C ~ 85°C
Approval Agency: UL
Produkt ist nicht verfügbar
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PVT422S-TPBF pvt422.pdf?fileId=5546d462533600a401535684473f2973
PVT422S-TPBF
Hersteller: Infineon Technologies
Description: SSR RELAY SPST-NO 120MA 0-400V
Packaging: Cut Tape (CT)
Package / Case: 8-SMD (0.300", 7.62mm)
Output Type: AC, DC
Mounting Type: Surface Mount
Voltage - Input: 1.2VDC
Circuit: SPST-NO (1 Form A) x 2
Termination Style: Gull Wing
Load Current: 120 mA
Supplier Device Package: 8-SMD
Part Status: Active
Voltage - Load: 0 V ~ 400 V
On-State Resistance (Max): 35 Ohms
Operating Temperature: -40°C ~ 85°C
Approval Agency: UL
auf Bestellung 625 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.32 EUR
10+14.52 EUR
25+13.87 EUR
50+13.39 EUR
100+12.93 EUR
250+12.35 EUR
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CY9AFAA2NPF-G-SNE1 Infineon-CY9AAA0N_SERIES_32_BIT_Arm_Cortex_M3_FM3_MICROCONTROLLER-DataSheet-v06_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee0a9a66657&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9AFAA2NPF-G-SNE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 100QFP
Packaging: Tray
Package / Case: 100-BQFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b; D/A 2x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: CSIO, I2C, UART/USART
Peripherals: LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-QFP (14x20)
Part Status: Obsolete
Number of I/O: 84
DigiKey Programmable: Not Verified
auf Bestellung 137 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.35 EUR
10+11.95 EUR
25+11.09 EUR
132+10.01 EUR
Mindestbestellmenge: 2
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TLS850F3TUV50ATMA1 Infineon-TLS850F3TUV50-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c8929aa4d0189daf49d383c09
TLS850F3TUV50ATMA1
Hersteller: Infineon Technologies
Description: IC REG LINEAR OPTIREG
Packaging: Tape & Reel (TR)
Part Status: Active
Produkt ist nicht verfügbar
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S6AE101A0DGNAB000
S6AE101A0DGNAB000
Hersteller: Infineon Technologies
Description: IC PMIC ENERGY HARVESTING 10SON
Packaging: Tape & Reel (TR)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Applications: Energy Harvesting
Supplier Device Package: 10-SON (3x3)
Produkt ist nicht verfügbar
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S6AE101A0DGNAB000
S6AE101A0DGNAB000
Hersteller: Infineon Technologies
Description: IC PMIC ENERGY HARVESTING 10SON
Packaging: Cut Tape (CT)
Package / Case: 10-VFDFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2V ~ 5.5V
Applications: Energy Harvesting
Supplier Device Package: 10-SON (3x3)
auf Bestellung 381 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.07 EUR
10+9.10 EUR
25+8.67 EUR
100+7.53 EUR
250+7.19 EUR
Mindestbestellmenge: 2
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CY7C1371KV33-100AXI Infineon-CY7C1371KV33_CY7C1371KVE33_CY7C1373KV33_18-Mbit_(512_K_36_1_M_18)_Flow-Through_SRAM_with_NoBL_Architecture_(With_ECC)-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed99c465b40&utm_source=cypress&utm_medium=refe
CY7C1371KV33-100AXI
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PAR 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Part Status: Active
Memory Interface: Parallel
Access Time: 8.5 ns
Memory Organization: 512K x 36
DigiKey Programmable: Not Verified
auf Bestellung 75 Stücke:
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Anzahl Preis
1+55.05 EUR
10+48.88 EUR
25+46.61 EUR
72+44.12 EUR
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CY8C4126AXI-S445 PSoC_4100S_Plus_RevH_9-14-18.pdf
CY8C4126AXI-S445
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b Slope, 16x12b SAR; D/A 2xIDAC
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (14x14)
Part Status: Active
Number of I/O: 54
DigiKey Programmable: Not Verified
auf Bestellung 180 Stücke:
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Anzahl Preis
4+5.83 EUR
10+4.42 EUR
25+4.07 EUR
90+3.70 EUR
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FS200R12KT4RPB51BPSA1 INFNS28545-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: FS200R12 - IGBT MODULE
Packaging: Bulk
auf Bestellung 71 Stücke:
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Anzahl Preis
2+339.76 EUR
Mindestbestellmenge: 2
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FS200R12KT4RPB11BPSA1 Infineon-FS200R12KT4RP_B11-DS-v03_00-EN.pdf?fileId=5546d462689a790c016939d8cb276b4d
FS200R12KT4RPB11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE LOW PWR ECONO3-4
Produkt ist nicht verfügbar
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DD89N16KAHPSA1 INFNS29284-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: DIODE MOD GP 1600V 89A POWRBLOK
Packaging: Bulk
Package / Case: POW-R-BLOK™ Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 89A
Supplier Device Package: POW-R-BLOK™ Module
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 1600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 300 A
Current - Reverse Leakage @ Vr: 20 mA @ 1600 V
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Anzahl Preis
3+207.78 EUR
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DD89N16KAHPSA1 INFNS29284-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: DIODE MOD GP 1600V 89A POWRBLOK
Packaging: Tray
Package / Case: POW-R-BLOK™ Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 89A
Supplier Device Package: POW-R-BLOK™ Module
Operating Temperature - Junction: 150°C
Voltage - DC Reverse (Vr) (Max): 1600 V
Voltage - Forward (Vf) (Max) @ If: 1.5 V @ 300 A
Current - Reverse Leakage @ Vr: 20 mA @ 1600 V
Produkt ist nicht verfügbar
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DD89N16KKHPSA1 INFNS29284-1.pdf?t.download=true&u=5oefqw
DD89N16KKHPSA1
Hersteller: Infineon Technologies
Description: DIODE ARRAY MOD 1200V 140A
auf Bestellung 10 Stücke:
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Anzahl Preis
3+193.03 EUR
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BSL802SNL6327HTSA1 BSL802SN_Rev2.1.pdf?folderId=db3a3043156fd573011622e10b5c1f67&fileId=db3a30431b0626df011b129ef9177bd1
BSL802SNL6327HTSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 20V 7.5A TSOP-6
Produkt ist nicht verfügbar
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BSL802SNL6327HTSA1 BSL802SN_Rev2.1.pdf?folderId=db3a3043156fd573011622e10b5c1f67&fileId=db3a30431b0626df011b129ef9177bd1
BSL802SNL6327HTSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 20V 7.5A TSOP-6
Produkt ist nicht verfügbar
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S25FL256SAGMFI010 Infineon-S25FL128S_S25FL256S_128_Mb_(16_MB)_256_Mb_(32_MB)_3.0V_SPI_Flash_Memory-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecfb6a64a17
S25FL256SAGMFI010
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Part Status: Active
Memory Interface: SPI - Quad I/O
Memory Organization: 32M x 8
DigiKey Programmable: Not Verified
auf Bestellung 247 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.73 EUR
10+8.87 EUR
25+8.70 EUR
40+8.64 EUR
80+7.75 EUR
240+7.72 EUR
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CY62167EV30LL-45BVXIT Infineon-CY62167EV30_MoBL_16-Mbit_(1M_x_16_2M_x_8)_Static_RAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe4ea831c9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY62167EV30LL-45BVXIT
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PARALLEL 48VFBGA
Packaging: Tape & Reel (TR)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY62167EV30LL-45BVXIT Infineon-CY62167EV30_MoBL_16-Mbit_(1M_x_16_2M_x_8)_Static_RAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe4ea831c9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY62167EV30LL-45BVXIT
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PARALLEL 48VFBGA
Packaging: Cut Tape (CT)
Package / Case: 48-VFBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-VFBGA (6x8)
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1987 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+22.76 EUR
10+21.12 EUR
25+20.46 EUR
50+19.97 EUR
100+19.47 EUR
250+18.83 EUR
500+18.36 EUR
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CY62167EV30LL-45ZXIT Infineon-CY62167EV30_MoBL_16-Mbit_(1M_x_16_2M_x_8)_Static_RAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe4ea831c9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY62167EV30LL-45ZXIT
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Tape & Reel (TR)
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
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Anzahl Preis
1000+25.38 EUR
Mindestbestellmenge: 1000
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CY62167EV30LL-45ZXIT Infineon-CY62167EV30_MoBL_16-Mbit_(1M_x_16_2M_x_8)_Static_RAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe4ea831c9&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY62167EV30LL-45ZXIT
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Cut Tape (CT)
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Part Status: Active
Write Cycle Time - Word, Page: 45ns
Memory Interface: Parallel
Access Time: 45 ns
Memory Organization: 2M x 8, 1M x 16
DigiKey Programmable: Not Verified
auf Bestellung 1581 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+31.49 EUR
10+29.16 EUR
25+28.24 EUR
50+27.55 EUR
100+26.87 EUR
250+26.83 EUR
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BSM100GD60DLCBOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 600V 130A 430W
auf Bestellung 50 Stücke:
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Anzahl Preis
2+266.18 EUR
Mindestbestellmenge: 2
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BSM100GD60DLCBOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 600V 130A 430W
Produkt ist nicht verfügbar
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CYPD5236-40LQXI
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 40QFN
Packaging: Tray
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYPD5236-40LQXIT
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 40QFN
Packaging: Tape & Reel (TR)
Part Status: Discontinued at Digi-Key
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC387TP128F300SAEKXUMA1
TC387TP128F300SAEKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 512K x 8
Core Processor: TriCore™
Data Converters: A/D 84 SAR, Sigma-Delta
Core Size: 32-Bit Quad-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I²S, PWM, WDT
Supplier Device Package: PG-LFBGA-292-11
DigiKey Programmable: Not Verified
auf Bestellung 1000 Stücke:
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Anzahl Preis
1000+223.53 EUR
Mindestbestellmenge: 1000
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TC299TP128F300SBBKXUMA1 Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
TC299TP128F300SBBKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 516LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-516-5
Number of I/O: 263
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYPAS111A1-24LQXQ Infineon-PAG1S_CYPAS111_Datasheet_USB-PD_Power_Adapter_Secondary_Side_Controller-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9bbf07290
CYPAS111A1-24LQXQ
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 24QFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Frequency - Switching: 20kHz ~ 150kHz
Internal Switch(s): No
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Supplier Device Package: 24-QFN (4x4)
auf Bestellung 37 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+5.14 EUR
10+3.84 EUR
25+3.52 EUR
Mindestbestellmenge: 4
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CY29774AXI
CY29774AXI
Hersteller: Infineon Technologies
Description: IC FANOUT DIST 52TQFP
Packaging: Tray
Package / Case: 52-TQFP
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 125MHz
Type: Fanout Distribution, Multiplexer, Zero Delay Buffer
Input: LVCMOS
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 2.375V ~ 3.465V
Ratio - Input:Output: 2:14
Differential - Input:Output: No/No
Supplier Device Package: 52-TQFP (10x10)
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IGQ75N120S7XKSA1 Infineon-IGQ75N120S7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c850f4bee0185a59a17a3786a
IGQ75N120S7XKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH 1200V 154A TO247-55
Packaging: Tube
Part Status: Active
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Supplier Device Package: PG-TO247-3-55
IGBT Type: Trench
Td (on/off) @ 25°C: 38ns/190ns
Switching Energy: 5.13mJ (on), 3.48mJ (off)
Test Condition: 600V, 75A, 2.1Ohm, 15V
Gate Charge: 450 nC
Current - Collector (Ic) (Max): 154 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 225 A
Power - Max: 630 W
auf Bestellung 718 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+17.65 EUR
30+10.47 EUR
120+9.01 EUR
510+8.46 EUR
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IKQ75N120CS7XKSA1 Infineon-IKQ75N120CS7-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c850f4bee0185a559ec887495
IKQ75N120CS7XKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH 1200V 154A TO247-46
Packaging: Tube
Part Status: Active
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Supplier Device Package: PG-TO247-3-46
IGBT Type: Trench
Td (on/off) @ 25°C: 38ns/190ns
Switching Energy: 5.13mJ (on), 3.48mJ (off)
Test Condition: 600V, 75A, 2.1Ohm, 15V
Gate Charge: 450 nC
Current - Collector (Ic) (Max): 154 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector Pulsed (Icm): 225 A
Power - Max: 630 W
auf Bestellung 285 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+19.78 EUR
30+11.96 EUR
120+10.24 EUR
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CYUSB3KIT-003 Infineon-SuperSpeed_Explorer_Kit_User_Guide-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ef82cf70d57&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CYUSB3KIT-003
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR CYUSB301X
Packaging: Box
Function: USB 3.0 Host/Controller
Type: Interface
Utilized IC / Part: CYUSB301x
Supplied Contents: Board(s), Cable(s), Accessories
Part Status: Active
Contents: Board(s), Cable(s), Accessories
auf Bestellung 383 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+79.22 EUR
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KP236N6165 INFNS15313-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: ANALOG ABSOLUTE PRESSURE SENSOR
Produkt ist nicht verfügbar
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IPA50R520CP INFNS15801-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: N-CHANNEL POWER MOSFET
Packaging: Bulk
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.1A (Tc)
Rds On (Max) @ Id, Vgs: 520mOhm @ 3.8A, 10V
Power Dissipation (Max): 66W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 250µA
Supplier Device Package: PG-TO220-3-31
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 680 pF @ 100 V
Produkt ist nicht verfügbar
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IPA50R520CPXKSA1 IPA50R520CP.pdf
IPA50R520CPXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 7.1A TO220-FP
Packaging: Bulk
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.1A (Tc)
Rds On (Max) @ Id, Vgs: 520mOhm @ 3.8A, 10V
Power Dissipation (Max): 66W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 250µA
Supplier Device Package: PG-TO220-3-31
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 680 pF @ 100 V
auf Bestellung 17824 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
416+1.17 EUR
Mindestbestellmenge: 416
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IPA50R350CPXKSA1 IPA50R350CP_rev2.1.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b42db39548cb
IPA50R350CPXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 10A TO220-FP
Packaging: Bulk
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 10A (Tc)
Rds On (Max) @ Id, Vgs: 350mOhm @ 5.6A, 10V
Power Dissipation (Max): 32W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 370µA
Supplier Device Package: PG-TO220-3-31
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 25 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1020 pF @ 100 V
auf Bestellung 86300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
275+1.71 EUR
Mindestbestellmenge: 275
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