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IPA90R800C3XKSA1 IPA90R800C3XKSA1 Infineon Technologies IPA90R800C3_1.0.pdf?folderId=db3a3043156fd5730115c736bcc70ff2&fileId=db3a30431b3e89eb011b8cd8a0b90fc6 Description: MOSFET N-CH 900V 6.9A TO220-FP
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.9A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4.1A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 460µA
Supplier Device Package: PG-TO220-FP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
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IPI90R800C3 IPI90R800C3 Infineon Technologies IPI90R800C3_Rev1.0_7-30-08.pdf Description: MOSFET N-CH 900V 6.9A TO262-3
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.9A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4.1A, 10V
Power Dissipation (Max): 104W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 460µA
Supplier Device Package: PG-TO262-3
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
Produkt ist nicht verfügbar
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BGA 758L7 E6327 BGA 758L7 E6327 Infineon Technologies BGA758L7.pdf Description: IC RF AMP WLAN 5GHZ-6GHZ TSLP7-8
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5GHz ~ 6GHz
RF Type: WLAN
Voltage - Supply: 4V
Gain: 12.5dB
Current - Supply: 7mA
Noise Figure: 13dB
P1dB: -3.5dBm
Test Frequency: 5.5GHz
Supplier Device Package: PG-TSLP-7-8
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BGA 758L7 E6327 BGA 758L7 E6327 Infineon Technologies BGA758L7.pdf Description: IC RF AMP WLAN 5GHZ-6GHZ TSLP7-8
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5GHz ~ 6GHz
RF Type: WLAN
Voltage - Supply: 4V
Gain: 12.5dB
Current - Supply: 7mA
Noise Figure: 13dB
P1dB: -3.5dBm
Test Frequency: 5.5GHz
Supplier Device Package: PG-TSLP-7-8
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15+1.24 EUR
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100+1.05 EUR
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TLE8444SLXUMA1 TLE8444SLXUMA1 Infineon Technologies Infineon-TLE8444SL-DS-v01_01-en.pdf?fileId=db3a30431ff98815012060afb566617a Description: IC MOTOR DRIVER BIPOLAR 24SSOP
Packaging: Cut Tape (CT)
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 8V ~ 18V
Technology: BiCDMOS
Voltage - Load: 8V ~ 18V
Supplier Device Package: PG-SSOP-24-7
Motor Type - Stepper: Bipolar, Unipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
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10+3.98 EUR
25+3.76 EUR
100+3.26 EUR
250+3.09 EUR
500+2.94 EUR
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D1030N24TXPSA1 Infineon Technologies D1030N.pdf Description: DIODE GEN PURP 2.4KV 1030A
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PEF 2026 T-S V1.1 Infineon Technologies Part_Number_Guide_Web.pdf Description: IC TELECOM INTERFACE PDSO-20
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: High Voltage Power Controller
Interface: ISDN
Operating Temperature: -40°C ~ 85°C
Current - Supply: 700µA
Supplier Device Package: P-DSO-20-5
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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IRF6614TRPBF IRF6614TRPBF Infineon Technologies IRSDS10487-1.pdf?t.download=true&u=5oefqw Description: IRF6614 - 12V-300V N-CHANNEL POW
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BF776H6327 BF776H6327 Infineon Technologies INFNS14629-1.pdf?t.download=true&u=5oefqw Description: RF TRANSISTOR, NPN
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 24dB
Power - Max: 200mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 4.7V
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 30mA, 3V
Frequency - Transition: 46GHz
Noise Figure (dB Typ @ f): 0.8dB ~ 1.3dB @ 1.8GHz ~ 6GHz
Supplier Device Package: PG-SOT343-4
Part Status: Active
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1757+0.28 EUR
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SIDC03D60C8X1SA2 Infineon Technologies Infineon-SIDC03D60C8_L4014M-DS-v01_02-en.pdf?fileId=db3a30433c8a9179013c8c163a6d01a9 Description: DIODE SWITCHING 600V 10A WAFER
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X97813760 X97813760 Infineon Technologies INFNS13386-1.pdf?t.download=true&u=5oefqw Description: SMALL SIGNAL MOSFET
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FP50R12N2T7PBPSA1 FP50R12N2T7PBPSA1 Infineon Technologies Infineon-FP50R12N2T7P-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018083a42f052e20 Description: 1200 V, 50 A PIM IGBT MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.85V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 4 µA
Input Capacitance (Cies) @ Vce: 11.1 nF @ 25 V
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10+200.81 EUR
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DF1000R17IE4BOSA1 DF1000R17IE4BOSA1 Infineon Technologies Infineon-DF1000R17IE4-DS-v02_02-en_de.pdf?fileId=db3a30431ff9881501201f22cae54be8 Description: IGBT MODULE 1700V 6250W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 1000A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 6250 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 81 nF @ 25 V
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DF1000R17IE4BOSA1 DF1000R17IE4BOSA1 Infineon Technologies Infineon-DF1000R17IE4-DS-v02_02-en_de.pdf?fileId=db3a30431ff9881501201f22cae54be8 Description: IGBT MODULE 1700V 6250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 1000A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 6250 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 81 nF @ 25 V
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FD1000R17IE4BOSA2 FD1000R17IE4BOSA2 Infineon Technologies Infineon-FD1000R17IE4-DS-v02_01-en_de.pdf?fileId=db3a30431ff9881501201f20782f4bd1 Description: IGBT MODULE 1700V 6250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 1000A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Not For New Designs
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 6250 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 81 nF @ 25 V
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FS450R12OE4PBOSA1 FS450R12OE4PBOSA1 Infineon Technologies Infineon-FS450R12OE4P-DS-v03_00-EN.pdf?fileId=5546d462584d1d4a01584efa37760727 Description: IGBT MOD 1200V 900A 20MW
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 450A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 900 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 1.55 nF @ 25 V
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T2851N42TOHXPSA1 Infineon Technologies T2851N.pdf Description: SCR MODULE 5200V 4860A DO200AE
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MA11034081NDSA1 Infineon Technologies Description: A-PCB MA110 34081
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGA9H1MN9E6329XTSA1 BGA9H1MN9E6329XTSA1 Infineon Technologies Infineon-BGA9H1MN9-DataSheet-v02_00-EN.pdf?fileId=5546d46279cccfdb0179f5d464fd1889 Description: RF MMIC 3 TO 6 GHZ PG-TSNP-9
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BGA9H1MN9E6329XTSA1 BGA9H1MN9E6329XTSA1 Infineon Technologies Infineon-BGA9H1MN9-DataSheet-v02_00-EN.pdf?fileId=5546d46279cccfdb0179f5d464fd1889 Description: RF MMIC 3 TO 6 GHZ PG-TSNP-9
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T2251N70TOHXPSA1 T2251N70TOHXPSA1 Infineon Technologies Infineon-T2251N-DS-v06_00-en_de.pdf?fileId=db3a304412b407950112b42fb26d4cfb Description: SCR MODULE 8000V 3550A DO200AE
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T201N70TOHXPSA1 T201N70TOHXPSA1 Infineon Technologies Infineon-T201N-DS-v07_00-en_de.pdf?fileId=db3a304412b407950112b4304bc65006 Description: SCR MODULE 7KV 385A TO-200AB
Packaging: Tray
Package / Case: TO-200AB
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 350 mA
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 4700A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 340 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 385 A
Voltage - Off State: 7 kV
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T1081N70TOHXPSA1 T1081N70TOHXPSA1 Infineon Technologies Infineon-T1081N-DS-v08_00-en_de.pdf?fileId=db3a304412b407950112b43054725012 Description: SCR MODULE 7000V 2040A DO200AE
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T1901N70TS07XPSA1 Infineon Technologies T1901N_Rev9.0_05-02-11.pdf Description: SCR MODULE T15035K-1-1
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SAKX164CM8F40F SAKX164CM8F40F Infineon Technologies INFNS10522-1.pdf?t.download=true&u=5oefqw Description: LEGACY 16-BIT FLASH MCU
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 14x8/10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: ASC, CANbus, SPI, SSC, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
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SAF-XC878M-16FFI5VAC SAF-XC878M-16FFI5VAC Infineon Technologies INFNS15609-1.pdf?t.download=true&u=5oefqw Description: XC800 I-FAMILY MICROCONTROLLER ,
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 3.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: 1Y8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
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IMW120R014M1HXKSA1 IMW120R014M1HXKSA1 Infineon Technologies Infineon-IMW120R014M1H-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017f8783973231b5 Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 127A (Tc)
Rds On (Max) @ Id, Vgs: 18.4mOhm @ 54.3A, 18V
Power Dissipation (Max): 455W (Tc)
Vgs(th) (Max) @ Id: 5.2V @ 23.4mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -5V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 4580 pF @ 800 V
auf Bestellung 243 Stücke:
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1+42.61 EUR
30+27.62 EUR
120+27.28 EUR
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IMW120R020M1HXKSA1 IMW120R020M1HXKSA1 Infineon Technologies Infineon-IMW120R020M1H-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017f8767f7bb318f Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 98A (Tc)
Rds On (Max) @ Id, Vgs: 26.9mOhm @ 41A, 18V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 5.2V @ 17.6mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -5V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 3460 pF @ 800 V
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1+34.58 EUR
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IMW120R040M1HXKSA1 IMW120R040M1HXKSA1 Infineon Technologies Infineon-IMW120R040M1H-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017f8783c06631ca Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Rds On (Max) @ Id, Vgs: 54.4mOhm @ 19.3A, 18V
Power Dissipation (Max): 227W (Tc)
Vgs(th) (Max) @ Id: 5.2V @ 10mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -5V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 51 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1620 pF @ 800 V
auf Bestellung 312 Stücke:
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1+21.28 EUR
30+12.88 EUR
120+11.04 EUR
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SAK-TC297TC-96F300S BC SAK-TC297TC-96F300S BC Infineon Technologies Infineon-TC29xBC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
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SAK-TC297TP-96F300S BB SAK-TC297TP-96F300S BB Infineon Technologies Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Obsolete
Number of I/O: 169
DigiKey Programmable: Not Verified
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SAK-TC297T-96F300S BB SAK-TC297T-96F300S BB Infineon Technologies Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Obsolete
Number of I/O: 169
DigiKey Programmable: Not Verified
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SAK-TC297T-96F300N BC SAK-TC297T-96F300N BC Infineon Technologies Infineon-TC29xBC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
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SAK-TC297TC-96F300S BB SAK-TC297TC-96F300S BB Infineon Technologies Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Obsolete
Number of I/O: 169
DigiKey Programmable: Not Verified
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SAK-TC297TP-96F300N BC SAK-TC297TP-96F300N BC Infineon Technologies Infineon-TC29xBC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC297TP96F300SBBKXUMA1 TC297TP96F300SBBKXUMA1 Infineon Technologies Orderable_Part_Number_OPN_Translation_Table_Web.pdf Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
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TC377TP96F300SAALXUMA1 TC377TP96F300SAALXUMA1 Infineon Technologies 4_cip10525.pdf Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 1.1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
DigiKey Programmable: Not Verified
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IGP01N120H2XKSA1036 IGP01N120H2XKSA1036 Infineon Technologies INFNS16255-1.pdf?t.download=true&u=5oefqw Description: IGP01N120 - DISCRETE IGBT WITHOU
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DD500S33HE3BPSA1 DD500S33HE3BPSA1 Infineon Technologies Infineon-DD500S33HE3-DS-v03_02-EN.pdf?fileId=db3a30433784a0400137990501fd2796 Description: DIODE MOD GP 3300V AGIHVB130-3
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Supplier Device Package: AG-IHVB130-3
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 3300 V
Voltage - Forward (Vf) (Max) @ If: 3.85 V @ 500 A
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CY8C4025LQI-S402 CY8C4025LQI-S402 Infineon Technologies Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
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6+3.29 EUR
10+2.45 EUR
25+2.24 EUR
80+2.04 EUR
230+1.94 EUR
Mindestbestellmenge: 6
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CY8C4025AZI-S403 CY8C4025AZI-S403 Infineon Technologies Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file Description: IC MCU 32BIT 32KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
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10+3.22 EUR
25+2.94 EUR
80+2.68 EUR
250+2.49 EUR
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TLE9012DQUDTRBMS2TOBO1 TLE9012DQUDTRBMS2TOBO1 Infineon Technologies Infineon-Infineon-Infineon-TLE9012DQU_TLE9015DQU-UM-v01_00-EN-UserManual-v01_00-EN-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017f31a598850348&da=t Description: EVAL BOARD FOR TLE9012DQU
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Utilized IC / Part: TLE9012DQU
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 4.75V ~ 60V Supply
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Secondary Attributes: On-Board LEDs
Contents: Board(s), Cable(s)
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T600N95TOFXPSA1 Infineon Technologies T600N.pdf Description: SCR MODULE 9.5KV 930A TO-200AC
Packaging: Tray
Package / Case: TO-200AC
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 350 mA
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 12800A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 830 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 930 A
Voltage - Off State: 9.5 kV
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PEB20256EV2.1-G Infineon Technologies Description: MUNICH256 MULTI CHANNEL NETWORK
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CHL8104-09CRT CHL8104-09CRT Infineon Technologies CHL8102_03_04_13_PB_V1.09_8-28-13.pdf Description: IC REG BUCK 40VQFN
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CHL8212-03CRT Infineon Technologies CHL8203_12_13_14_PB_v1.6_8-28-13.pdf Description: IC REG BUCK 28VQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Output Type: PWM
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: 0°C ~ 85°C
Output Configuration: Positive
Frequency - Switching: 200kHz ~ 1.2MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 3.3V
Supplier Device Package: PG-VQFN-28-902
Synchronous Rectifier: No
Control Features: Enable
Serial Interfaces: I²C
Output Phases: 2
Clock Sync: No
Part Status: Obsolete
Number of Outputs: 3
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TC365DP64F300WAAKXUMA1 TC365DP64F300WAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
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TC365DP64F300WAAKXUMA1 TC365DP64F300WAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
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TC365DP64F300WAALXUMA1 TC365DP64F300WAALXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
DigiKey Programmable: Not Verified
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XDPE14284AXUMA1 Infineon Technologies Description: IFX PRIMARION CNTRLLER PG-VQFN-4
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KP200XTMA2 Infineon Technologies Infineon-KP200-DataSheet-v01_00-EN.pdf?fileId=5546d4627645f87701764cfcdb60583d Description: INTEGRATED PRESSURE SENS PG-DSOF
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BBY51-03W BBY51-03W Infineon Technologies INFNS30155-1.pdf?t.download=true&u=5oefqw Description: VARIABLE CAPACITANCE DIODE
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BBY 51-02W E6327 BBY 51-02W E6327 Infineon Technologies BBY51.pdf Description: DIODE TUNING 7V 20MA SCD-80
Packaging: Tape & Reel (TR)
Package / Case: SC-80
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Capacitance Ratio Condition: C1/C4
Supplier Device Package: SCD-80
Voltage - Peak Reverse (Max): 7 V
Capacitance Ratio: 2.2
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BBY 51-02L E6327 BBY 51-02L E6327 Infineon Technologies BBY51.pdf Description: DIODE TUNING 7V 20MA TSLP-2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Capacitance Ratio Condition: C1/C4
Supplier Device Package: PG-TSLP-2-1
Voltage - Peak Reverse (Max): 7 V
Capacitance Ratio: 2.2
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ESD18VU1B-02LSE6327 Infineon Technologies INFNS19119-1.pdf?t.download=true&u=5oefqw Description: TRANS VOLTAGE SUPPRESSOR DIODE
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 85°C (TA)
Applications: RF Antenna
Capacitance @ Frequency: 0.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2A (8/20µs)
Voltage - Reverse Standoff (Typ): 18.5V (Max)
Supplier Device Package: PG-TSLP-2-17
Bidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 17V (Typ)
Power Line Protection: No
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5189+0.11 EUR
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FP150R12N3T7PB11BPSA1 FP150R12N3T7PB11BPSA1 Infineon Technologies Infineon-FP150R12N3T7P_B11-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018083a48d2d2e29 Description: LOW POWER ECONO
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter with Brake
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 150A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO3
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 150 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 12 µA
Input Capacitance (Cies) @ Vce: 30.1 nF @ 25 V
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IPT008N06NM5LFATMA1 IPT008N06NM5LFATMA1 Infineon Technologies Infineon-IPT008N06NM5LF-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7ba0a117017ba1e0bc6601b5 Description: TRENCH 40<-<100V PG-HSOF-8
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 454A (Tc)
Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 250µA
Supplier Device Package: PG-HSOF-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V
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IPT008N06NM5LFATMA1 IPT008N06NM5LFATMA1 Infineon Technologies Infineon-IPT008N06NM5LF-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7ba0a117017ba1e0bc6601b5 Description: TRENCH 40<-<100V PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 454A (Tc)
Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 250µA
Supplier Device Package: PG-HSOF-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V
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2+12.23 EUR
10+8.31 EUR
100+6.07 EUR
500+5.31 EUR
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FS03MR12A6MA1B Infineon Technologies Infineon-FS03MR12A6MA1B-DataSheet-v01_00-EN.pdf?fileId=5546d4627862c3e501787e48f6ef330c Description: HYBRID PACK DRIVE SIC AG-HYBRIDD
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DDB6U134N16RRB11BPSA2 DDB6U134N16RRB11BPSA2 Infineon Technologies Infineon-DDB6U134N16RR_B11-DS-v03_00-EN.pdf?fileId=5546d4625c167129015c53affc447cd4 Description: LOW POWER ECONO AG-ECONO2B-211
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.6V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
Part Status: Active
Current - Collector (Ic) (Max): 125 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 400 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 5.1 nF @ 25 V
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1+113.22 EUR
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IPA90R800C3XKSA1 IPA90R800C3_1.0.pdf?folderId=db3a3043156fd5730115c736bcc70ff2&fileId=db3a30431b3e89eb011b8cd8a0b90fc6
IPA90R800C3XKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 900V 6.9A TO220-FP
Packaging: Tube
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.9A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4.1A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 460µA
Supplier Device Package: PG-TO220-FP
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
Produkt ist nicht verfügbar
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IPI90R800C3 IPI90R800C3_Rev1.0_7-30-08.pdf
IPI90R800C3
Hersteller: Infineon Technologies
Description: MOSFET N-CH 900V 6.9A TO262-3
Packaging: Bulk
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.9A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 4.1A, 10V
Power Dissipation (Max): 104W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 460µA
Supplier Device Package: PG-TO262-3
Part Status: Obsolete
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 900 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
Produkt ist nicht verfügbar
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BGA 758L7 E6327 BGA758L7.pdf
BGA 758L7 E6327
Hersteller: Infineon Technologies
Description: IC RF AMP WLAN 5GHZ-6GHZ TSLP7-8
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5GHz ~ 6GHz
RF Type: WLAN
Voltage - Supply: 4V
Gain: 12.5dB
Current - Supply: 7mA
Noise Figure: 13dB
P1dB: -3.5dBm
Test Frequency: 5.5GHz
Supplier Device Package: PG-TSLP-7-8
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7500+1.11 EUR
Mindestbestellmenge: 7500
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BGA 758L7 E6327 BGA758L7.pdf
BGA 758L7 E6327
Hersteller: Infineon Technologies
Description: IC RF AMP WLAN 5GHZ-6GHZ TSLP7-8
Packaging: Cut Tape (CT)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 5GHz ~ 6GHz
RF Type: WLAN
Voltage - Supply: 4V
Gain: 12.5dB
Current - Supply: 7mA
Noise Figure: 13dB
P1dB: -3.5dBm
Test Frequency: 5.5GHz
Supplier Device Package: PG-TSLP-7-8
auf Bestellung 18325 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.44 EUR
15+1.24 EUR
25+1.16 EUR
100+1.05 EUR
Mindestbestellmenge: 13
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TLE8444SLXUMA1 Infineon-TLE8444SL-DS-v01_01-en.pdf?fileId=db3a30431ff98815012060afb566617a
TLE8444SLXUMA1
Hersteller: Infineon Technologies
Description: IC MOTOR DRIVER BIPOLAR 24SSOP
Packaging: Cut Tape (CT)
Package / Case: 24-SSOP (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Function: Driver - Fully Integrated, Control and Power Stage
Current - Output: 1A
Interface: Parallel
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Half Bridge (4)
Voltage - Supply: 8V ~ 18V
Technology: BiCDMOS
Voltage - Load: 8V ~ 18V
Supplier Device Package: PG-SSOP-24-7
Motor Type - Stepper: Bipolar, Unipolar
Motor Type - AC, DC: Brushed DC
Part Status: Active
Grade: Automotive
auf Bestellung 25764 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
4+4.42 EUR
10+3.98 EUR
25+3.76 EUR
100+3.26 EUR
250+3.09 EUR
500+2.94 EUR
Mindestbestellmenge: 4
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D1030N24TXPSA1 D1030N.pdf
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 2.4KV 1030A
Produkt ist nicht verfügbar
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PEF 2026 T-S V1.1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: IC TELECOM INTERFACE PDSO-20
Packaging: Tape & Reel (TR)
Package / Case: 20-SOIC (0.433", 11.00mm Width) Exposed Pad
Mounting Type: Surface Mount
Function: High Voltage Power Controller
Interface: ISDN
Operating Temperature: -40°C ~ 85°C
Current - Supply: 700µA
Supplier Device Package: P-DSO-20-5
Part Status: Obsolete
Number of Circuits: 1
Produkt ist nicht verfügbar
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IRF6614TRPBF IRSDS10487-1.pdf?t.download=true&u=5oefqw
IRF6614TRPBF
Hersteller: Infineon Technologies
Description: IRF6614 - 12V-300V N-CHANNEL POW
Produkt ist nicht verfügbar
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BF776H6327 INFNS14629-1.pdf?t.download=true&u=5oefqw
BF776H6327
Hersteller: Infineon Technologies
Description: RF TRANSISTOR, NPN
Packaging: Bulk
Package / Case: SC-82A, SOT-343
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 24dB
Power - Max: 200mW
Current - Collector (Ic) (Max): 50mA
Voltage - Collector Emitter Breakdown (Max): 4.7V
DC Current Gain (hFE) (Min) @ Ic, Vce: 180 @ 30mA, 3V
Frequency - Transition: 46GHz
Noise Figure (dB Typ @ f): 0.8dB ~ 1.3dB @ 1.8GHz ~ 6GHz
Supplier Device Package: PG-SOT343-4
Part Status: Active
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1757+0.28 EUR
Mindestbestellmenge: 1757
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SIDC03D60C8X1SA2 Infineon-SIDC03D60C8_L4014M-DS-v01_02-en.pdf?fileId=db3a30433c8a9179013c8c163a6d01a9
Hersteller: Infineon Technologies
Description: DIODE SWITCHING 600V 10A WAFER
Produkt ist nicht verfügbar
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X97813760 INFNS13386-1.pdf?t.download=true&u=5oefqw
X97813760
Hersteller: Infineon Technologies
Description: SMALL SIGNAL MOSFET
Produkt ist nicht verfügbar
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FP50R12N2T7PBPSA1 Infineon-FP50R12N2T7P-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018083a42f052e20
FP50R12N2T7PBPSA1
Hersteller: Infineon Technologies
Description: 1200 V, 50 A PIM IGBT MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.85V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 50 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 4 µA
Input Capacitance (Cies) @ Vce: 11.1 nF @ 25 V
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+216.94 EUR
10+200.81 EUR
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DF1000R17IE4BOSA1 Infineon-DF1000R17IE4-DS-v02_02-en_de.pdf?fileId=db3a30431ff9881501201f22cae54be8
DF1000R17IE4BOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 6250W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 1000A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 6250 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 81 nF @ 25 V
auf Bestellung 50 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+777.20 EUR
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DF1000R17IE4BOSA1 Infineon-DF1000R17IE4-DS-v02_02-en_de.pdf?fileId=db3a30431ff9881501201f22cae54be8
DF1000R17IE4BOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 6250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 1000A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Active
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 6250 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 81 nF @ 25 V
Produkt ist nicht verfügbar
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FD1000R17IE4BOSA2 Infineon-FD1000R17IE4-DS-v02_01-en_de.pdf?fileId=db3a30431ff9881501201f20782f4bd1
FD1000R17IE4BOSA2
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 6250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 1000A
NTC Thermistor: Yes
Supplier Device Package: Module
Part Status: Not For New Designs
Voltage - Collector Emitter Breakdown (Max): 1700 V
Power - Max: 6250 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 81 nF @ 25 V
Produkt ist nicht verfügbar
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FS450R12OE4PBOSA1 Infineon-FS450R12OE4P-DS-v03_00-EN.pdf?fileId=5546d462584d1d4a01584efa37760727
FS450R12OE4PBOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 900A 20MW
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.1V @ 15V, 450A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 900 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 1.55 nF @ 25 V
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+686.08 EUR
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T2851N42TOHXPSA1 T2851N.pdf
Hersteller: Infineon Technologies
Description: SCR MODULE 5200V 4860A DO200AE
Produkt ist nicht verfügbar
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MA11034081NDSA1
Hersteller: Infineon Technologies
Description: A-PCB MA110 34081
Packaging: Bulk
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGA9H1MN9E6329XTSA1 Infineon-BGA9H1MN9-DataSheet-v02_00-EN.pdf?fileId=5546d46279cccfdb0179f5d464fd1889
BGA9H1MN9E6329XTSA1
Hersteller: Infineon Technologies
Description: RF MMIC 3 TO 6 GHZ PG-TSNP-9
Produkt ist nicht verfügbar
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BGA9H1MN9E6329XTSA1 Infineon-BGA9H1MN9-DataSheet-v02_00-EN.pdf?fileId=5546d46279cccfdb0179f5d464fd1889
BGA9H1MN9E6329XTSA1
Hersteller: Infineon Technologies
Description: RF MMIC 3 TO 6 GHZ PG-TSNP-9
Produkt ist nicht verfügbar
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T2251N70TOHXPSA1 Infineon-T2251N-DS-v06_00-en_de.pdf?fileId=db3a304412b407950112b42fb26d4cfb
T2251N70TOHXPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 8000V 3550A DO200AE
Produkt ist nicht verfügbar
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T201N70TOHXPSA1 Infineon-T201N-DS-v07_00-en_de.pdf?fileId=db3a304412b407950112b4304bc65006
T201N70TOHXPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 7KV 385A TO-200AB
Packaging: Tray
Package / Case: TO-200AB
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 350 mA
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 4700A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 340 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 385 A
Voltage - Off State: 7 kV
Produkt ist nicht verfügbar
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T1081N70TOHXPSA1 Infineon-T1081N-DS-v08_00-en_de.pdf?fileId=db3a304412b407950112b43054725012
T1081N70TOHXPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 7000V 2040A DO200AE
Produkt ist nicht verfügbar
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T1901N70TS07XPSA1 T1901N_Rev9.0_05-02-11.pdf
Hersteller: Infineon Technologies
Description: SCR MODULE T15035K-1-1
Produkt ist nicht verfügbar
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SAKX164CM8F40F INFNS10522-1.pdf?t.download=true&u=5oefqw
SAKX164CM8F40F
Hersteller: Infineon Technologies
Description: LEGACY 16-BIT FLASH MCU
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 6K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 14x8/10b SAR
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: ASC, CANbus, SPI, SSC, UART/USART
Peripherals: PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Part Status: Active
Number of I/O: 47
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF-XC878M-16FFI5VAC INFNS15609-1.pdf?t.download=true&u=5oefqw
SAF-XC878M-16FFI5VAC
Hersteller: Infineon Technologies
Description: XC800 I-FAMILY MICROCONTROLLER ,
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 3.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: 1Y8x10b SAR
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: EBI/EMI, SPI, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-LQFP-64-4
Part Status: Active
Number of I/O: 40
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IMW120R014M1HXKSA1 Infineon-IMW120R014M1H-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017f8783973231b5
IMW120R014M1HXKSA1
Hersteller: Infineon Technologies
Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 127A (Tc)
Rds On (Max) @ Id, Vgs: 18.4mOhm @ 54.3A, 18V
Power Dissipation (Max): 455W (Tc)
Vgs(th) (Max) @ Id: 5.2V @ 23.4mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -5V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 4580 pF @ 800 V
auf Bestellung 243 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+42.61 EUR
30+27.62 EUR
120+27.28 EUR
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IMW120R020M1HXKSA1 Infineon-IMW120R020M1H-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017f8767f7bb318f
IMW120R020M1HXKSA1
Hersteller: Infineon Technologies
Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 98A (Tc)
Rds On (Max) @ Id, Vgs: 26.9mOhm @ 41A, 18V
Power Dissipation (Max): 375W (Tc)
Vgs(th) (Max) @ Id: 5.2V @ 17.6mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -5V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 3460 pF @ 800 V
auf Bestellung 66 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+34.58 EUR
30+22.04 EUR
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IMW120R040M1HXKSA1 Infineon-IMW120R040M1H-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017f8783c06631ca
IMW120R040M1HXKSA1
Hersteller: Infineon Technologies
Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
Rds On (Max) @ Id, Vgs: 54.4mOhm @ 19.3A, 18V
Power Dissipation (Max): 227W (Tc)
Vgs(th) (Max) @ Id: 5.2V @ 10mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -5V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 51 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1620 pF @ 800 V
auf Bestellung 312 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+21.28 EUR
30+12.88 EUR
120+11.04 EUR
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SAK-TC297TC-96F300S BC Infineon-TC29xBC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
SAK-TC297TC-96F300S BC
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAK-TC297TP-96F300S BB
SAK-TC297TP-96F300S BB
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Obsolete
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAK-TC297T-96F300S BB
SAK-TC297T-96F300S BB
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Obsolete
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAK-TC297T-96F300N BC Infineon-TC29xBC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
SAK-TC297T-96F300N BC
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAK-TC297TC-96F300S BB
SAK-TC297TC-96F300S BB
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Obsolete
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAK-TC297TP-96F300N BC Infineon-TC29xBC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
SAK-TC297TP-96F300N BC
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC297TP96F300SBBKXUMA1 Orderable_Part_Number_OPN_Translation_Table_Web.pdf
TC297TP96F300SBBKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 456K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC377TP96F300SAALXUMA1 4_cip10525.pdf
TC377TP96F300SAALXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 1.1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IGP01N120H2XKSA1036 INFNS16255-1.pdf?t.download=true&u=5oefqw
IGP01N120H2XKSA1036
Hersteller: Infineon Technologies
Description: IGP01N120 - DISCRETE IGBT WITHOU
Produkt ist nicht verfügbar
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DD500S33HE3BPSA1 Infineon-DD500S33HE3-DS-v03_02-EN.pdf?fileId=db3a30433784a0400137990501fd2796
DD500S33HE3BPSA1
Hersteller: Infineon Technologies
Description: DIODE MOD GP 3300V AGIHVB130-3
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Supplier Device Package: AG-IHVB130-3
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 3300 V
Voltage - Forward (Vf) (Max) @ If: 3.85 V @ 500 A
auf Bestellung 88 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+1732.54 EUR
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CY8C4025LQI-S402 Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file
CY8C4025LQI-S402
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 4900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
6+3.29 EUR
10+2.45 EUR
25+2.24 EUR
80+2.04 EUR
230+1.94 EUR
Mindestbestellmenge: 6
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CY8C4025AZI-S403 Infineon-PSoC_4_PSoC_4000S_Datasheet_Programmable_System-on-Chip_(PSoC_)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eda97715cf1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-file
CY8C4025AZI-S403
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 439 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5+4.33 EUR
10+3.22 EUR
25+2.94 EUR
80+2.68 EUR
250+2.49 EUR
Mindestbestellmenge: 5
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TLE9012DQUDTRBMS2TOBO1 Infineon-Infineon-Infineon-TLE9012DQU_TLE9015DQU-UM-v01_00-EN-UserManual-v01_00-EN-UserManual-v01_00-EN.pdf?fileId=8ac78c8c7f2a768a017f31a598850348&da=t
TLE9012DQUDTRBMS2TOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR TLE9012DQU
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Utilized IC / Part: TLE9012DQU
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 4.75V ~ 60V Supply
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Secondary Attributes: On-Board LEDs
Contents: Board(s), Cable(s)
auf Bestellung 11 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+408.14 EUR
10+407.20 EUR
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T600N95TOFXPSA1 T600N.pdf
Hersteller: Infineon Technologies
Description: SCR MODULE 9.5KV 930A TO-200AC
Packaging: Tray
Package / Case: TO-200AC
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 350 mA
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 12800A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 830 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 930 A
Voltage - Off State: 9.5 kV
Produkt ist nicht verfügbar
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PEB20256EV2.1-G
Hersteller: Infineon Technologies
Description: MUNICH256 MULTI CHANNEL NETWORK
auf Bestellung 432 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+234.06 EUR
Mindestbestellmenge: 3
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CHL8104-09CRT CHL8102_03_04_13_PB_V1.09_8-28-13.pdf
CHL8104-09CRT
Hersteller: Infineon Technologies
Description: IC REG BUCK 40VQFN
Produkt ist nicht verfügbar
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CHL8212-03CRT CHL8203_12_13_14_PB_v1.6_8-28-13.pdf
Hersteller: Infineon Technologies
Description: IC REG BUCK 28VQFN
Packaging: Tape & Reel (TR)
Package / Case: 28-VFQFN Exposed Pad
Output Type: PWM
Mounting Type: Surface Mount
Function: Step-Down
Operating Temperature: 0°C ~ 85°C
Output Configuration: Positive
Frequency - Switching: 200kHz ~ 1.2MHz
Topology: Buck
Voltage - Supply (Vcc/Vdd): 3.3V
Supplier Device Package: PG-VQFN-28-902
Synchronous Rectifier: No
Control Features: Enable
Serial Interfaces: I²C
Output Phases: 2
Clock Sync: No
Part Status: Obsolete
Number of Outputs: 3
Produkt ist nicht verfügbar
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TC365DP64F300WAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC365DP64F300WAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC365DP64F300WAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC365DP64F300WAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC365DP64F300WAALXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC365DP64F300WAALXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XDPE14284AXUMA1
Hersteller: Infineon Technologies
Description: IFX PRIMARION CNTRLLER PG-VQFN-4
Produkt ist nicht verfügbar
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KP200XTMA2 Infineon-KP200-DataSheet-v01_00-EN.pdf?fileId=5546d4627645f87701764cfcdb60583d
Hersteller: Infineon Technologies
Description: INTEGRATED PRESSURE SENS PG-DSOF
Produkt ist nicht verfügbar
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BBY51-03W INFNS30155-1.pdf?t.download=true&u=5oefqw
BBY51-03W
Hersteller: Infineon Technologies
Description: VARIABLE CAPACITANCE DIODE
Produkt ist nicht verfügbar
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BBY 51-02W E6327 BBY51.pdf
BBY 51-02W E6327
Hersteller: Infineon Technologies
Description: DIODE TUNING 7V 20MA SCD-80
Packaging: Tape & Reel (TR)
Package / Case: SC-80
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Capacitance Ratio Condition: C1/C4
Supplier Device Package: SCD-80
Voltage - Peak Reverse (Max): 7 V
Capacitance Ratio: 2.2
Produkt ist nicht verfügbar
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BBY 51-02L E6327 BBY51.pdf
BBY 51-02L E6327
Hersteller: Infineon Technologies
Description: DIODE TUNING 7V 20MA TSLP-2
Packaging: Tape & Reel (TR)
Package / Case: SOD-882
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 125°C (TJ)
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Capacitance Ratio Condition: C1/C4
Supplier Device Package: PG-TSLP-2-1
Voltage - Peak Reverse (Max): 7 V
Capacitance Ratio: 2.2
Produkt ist nicht verfügbar
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ESD18VU1B-02LSE6327 INFNS19119-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Packaging: Bulk
Package / Case: SOD-882
Mounting Type: Surface Mount
Type: Zener
Operating Temperature: -40°C ~ 85°C (TA)
Applications: RF Antenna
Capacitance @ Frequency: 0.3pF @ 1MHz
Current - Peak Pulse (10/1000µs): 2A (8/20µs)
Voltage - Reverse Standoff (Typ): 18.5V (Max)
Supplier Device Package: PG-TSLP-2-17
Bidirectional Channels: 1
Voltage - Breakdown (Min): 20V
Voltage - Clamping (Max) @ Ipp: 17V (Typ)
Power Line Protection: No
auf Bestellung 13300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
5189+0.11 EUR
Mindestbestellmenge: 5189
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FP150R12N3T7PB11BPSA1 Infineon-FP150R12N3T7P_B11-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd018083a48d2d2e29
FP150R12N3T7PB11BPSA1
Hersteller: Infineon Technologies
Description: LOW POWER ECONO
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter with Brake
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 150A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO3
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 150 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 12 µA
Input Capacitance (Cies) @ Vce: 30.1 nF @ 25 V
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+337.16 EUR
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IPT008N06NM5LFATMA1 Infineon-IPT008N06NM5LF-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7ba0a117017ba1e0bc6601b5
IPT008N06NM5LFATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V PG-HSOF-8
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 454A (Tc)
Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 250µA
Supplier Device Package: PG-HSOF-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V
Produkt ist nicht verfügbar
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IPT008N06NM5LFATMA1 Infineon-IPT008N06NM5LF-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7ba0a117017ba1e0bc6601b5
IPT008N06NM5LFATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 454A (Tc)
Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 250µA
Supplier Device Package: PG-HSOF-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V
auf Bestellung 1327 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+12.23 EUR
10+8.31 EUR
100+6.07 EUR
500+5.31 EUR
Mindestbestellmenge: 2
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FS03MR12A6MA1B Infineon-FS03MR12A6MA1B-DataSheet-v01_00-EN.pdf?fileId=5546d4627862c3e501787e48f6ef330c
Hersteller: Infineon Technologies
Description: HYBRID PACK DRIVE SIC AG-HYBRIDD
Produkt ist nicht verfügbar
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DDB6U134N16RRB11BPSA2 Infineon-DDB6U134N16RR_B11-DS-v03_00-EN.pdf?fileId=5546d4625c167129015c53affc447cd4
DDB6U134N16RRB11BPSA2
Hersteller: Infineon Technologies
Description: LOW POWER ECONO AG-ECONO2B-211
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.6V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
Part Status: Active
Current - Collector (Ic) (Max): 125 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 400 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 5.1 nF @ 25 V
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+113.22 EUR
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