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CY22394FXC CY22394FXC Infineon Technologies Infineon-CY22393_CY223931_CY22394_CY22395_THREE_PLL_SERIAL_PROGRAMMABLE_FLASH_PROGRAMMABLE_CLOCK_GENERATOR-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec0b89e3555&utm_source=cypress&utm_medium=referral&utm_campaign=20 Description: IC CLOCK GENERATOR 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: CMOS, PECL
Frequency - Max: 200MHz, 400MHz
Type: Clock Generator, Fanout Distribution
Input: LVTTL, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:5
Differential - Input:Output: No/Yes
Supplier Device Package: 16-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Verified
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CY22394FXC CY22394FXC Infineon Technologies Infineon-CY22393_CY223931_CY22394_CY22395_THREE_PLL_SERIAL_PROGRAMMABLE_FLASH_PROGRAMMABLE_CLOCK_GENERATOR-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec0b89e3555&utm_source=cypress&utm_medium=referral&utm_campaign=20 Description: IC CLOCK GENERATOR 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: CMOS, PECL
Frequency - Max: 200MHz, 400MHz
Type: Clock Generator, Fanout Distribution
Input: LVTTL, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:5
Differential - Input:Output: No/Yes
Supplier Device Package: 16-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Verified
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10+20.56 EUR
25+19.02 EUR
100+17.55 EUR
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S25FL164K0XNFA010 S25FL164K0XNFA010 Infineon Technologies S25FL116K_132K_164K__RevH_5-19-17.pdf Description: IC FLASH 64MBIT SPI/QUAD 8WSON
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 3ms
Grade: Automotive
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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CY8C6137FDI-F02T CY8C6137FDI-F02T Infineon Technologies Infineon-PSoC_6_MCU_PSoC_61_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee513576c97 Description: IC MCU 32BIT 1MB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b SAR; D/A 2x7b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Capsense, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (3.68x3.19)
Number of I/O: 62
DigiKey Programmable: Not Verified
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CY8C6136FTI-F42T Infineon Technologies Infineon-PSoC_6_MCU_PSoC_61_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee513576c97 Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b SAR; D/A 2x7b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Capsense, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (3.68x3.19)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6337BZI-BLF13T CY8C6337BZI-BLF13T Infineon Technologies Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37 Description: IC MCU 32BIT 1MB FLASH 116BGA
Packaging: Tape & Reel (TR)
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6316BZI-BLF53T CY8C6316BZI-BLF53T Infineon Technologies Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37 Description: IC MCU 32BIT 512KB FLASH 116BGA
Packaging: Tape & Reel (TR)
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6336BZI-BLF04 CY8C6336BZI-BLF04 Infineon Technologies Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37 Description: IC MCU 32BIT 512KB FLSH 124VFBGA
Packaging: Tray
Package / Case: 124-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 124-VFBGA (9x9)
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6316BZI-BLF04 CY8C6316BZI-BLF04 Infineon Technologies Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37 Description: IC MCU 32BIT 512KB FLSH 124VFBGA
Packaging: Tray
Package / Case: 124-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 124-VFBGA (9x9)
Number of I/O: 84
DigiKey Programmable: Not Verified
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CY8C6347BZI-BLD53T CY8C6347BZI-BLD53T Infineon Technologies Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37 Description: IC MCU 32BIT 1MB FLASH 116BGA
Packaging: Tape & Reel (TR)
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
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CY8C6347BZI-BLD54T CY8C6347BZI-BLD54T Infineon Technologies infineon-psoc-6-mcu-cy8c63x6-cy8c63x7-datasheet-psoc-63-mcu-with-bluetooth-le-datasheet-en.pdf Description: IC MCU 32BIT 1MB FLASH 124BGA
Packaging: Tape & Reel (TR)
Package / Case: 124-VFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2, 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 124-VFBGA (9x9)
Number of I/O: 84
Produkt ist nicht verfügbar
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IMBG120R234M2HXTMA1 IMBG120R234M2HXTMA1 Infineon Technologies infineon-imbg120r234m2h-datasheet-en.pdf Description: SICFET N-CH 1200V 8.1A TO263
Packaging: Tape & Reel (TR)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8.1A (Tc)
Rds On (Max) @ Id, Vgs: 233.9mOhm @ 3A, 18V
Power Dissipation (Max): 80W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 900µA
Supplier Device Package: PG-TO263-7-12
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 7.9 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 290 pF @ 800 V
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IMBG120R234M2HXTMA1 IMBG120R234M2HXTMA1 Infineon Technologies infineon-imbg120r234m2h-datasheet-en.pdf Description: SICFET N-CH 1200V 8.1A TO263
Packaging: Cut Tape (CT)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8.1A (Tc)
Rds On (Max) @ Id, Vgs: 233.9mOhm @ 3A, 18V
Power Dissipation (Max): 80W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 900µA
Supplier Device Package: PG-TO263-7-12
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 7.9 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 290 pF @ 800 V
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3+9.59 EUR
10+6.35 EUR
100+4.52 EUR
500+4.03 EUR
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SLB9672AU20FW1613XTMA1 SLB9672AU20FW1613XTMA1 Infineon Technologies SLB9672XU20FW1612XTMA1.pdf Description: OPTIGA TPM SLB9672 FW17
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
RAM Size: 51KB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Controller Series: SLB 9672
Program Memory Type: NVSRAM
Applications: Embedded Security Trusted Computing
Core Processor: 32-Bit
Supplier Device Package: PG-UQFN-32-1
Number of I/O: 3
Produkt ist nicht verfügbar
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SLB9672AU20FW1613XTMA1 SLB9672AU20FW1613XTMA1 Infineon Technologies SLB9672XU20FW1612XTMA1.pdf Description: OPTIGA TPM SLB9672 FW17
Packaging: Cut Tape (CT)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
RAM Size: 51KB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Controller Series: SLB 9672
Program Memory Type: NVSRAM
Applications: Embedded Security Trusted Computing
Core Processor: 32-Bit
Supplier Device Package: PG-UQFN-32-1
Number of I/O: 3
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2+11.33 EUR
10+8.63 EUR
25+7.96 EUR
100+7.22 EUR
250+6.88 EUR
500+6.66 EUR
1000+6.49 EUR
2500+6.31 EUR
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SLB9672XU20FW1523XTMA1 SLB9672XU20FW1523XTMA1 Infineon Technologies infineon-slb9672-tpm20-spi-fw15xx-ds-rev1-5-2024-11-13-datasheet-en.pdf Description: SECURITY CONTROLLER OPTIGA TPM S
Packaging: Cut Tape (CT)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
RAM Size: 51K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Controller Series: SLB 9672
Program Memory Type: NVSRAM
Applications: Embedded Security Trusted Computing
Core Processor: 32-Bit
Supplier Device Package: PG-UQFN-32-1
Number of I/O: 3
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TPM9672FW1613RPIEBTOBO1 TPM9672FW1613RPIEBTOBO1 Infineon Technologies Infineon-OPTIGA%20TPM%20SLB%209672%20FW15-DataSheet-v01_20-EN.pdf?fileId=8ac78c8c7f2a768a017f89965f764432 Description: OPTIGA TPM SLB 9672 RPI EVALUATI
Packaging: Bulk
Function: Trusted Platform Module (TPM)
Type: Interface
Contents: Board(s)
Utilized IC / Part: SLB 9672
Produkt ist nicht verfügbar
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TPM9672FW1523PCEBTOBO1 TPM9672FW1523PCEBTOBO1 Infineon Technologies Infineon-OPTIGA%20TPM%20SLB%209672%20KIT-DataSheet-v01_02-EN.pdf?fileId=8ac78c8c7fb5929e017ff76b3b3d1059 Description: OPTIGA TPM SLB 9672 PC EVALUATIO
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SLB 9672
Produkt ist nicht verfügbar
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TPM72FW1521XENONTOBO1 Infineon Technologies Description: OPTIGA TPM SLB 9672 PC EVALUATIO
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SLB 9672
Produkt ist nicht verfügbar
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D950N18TXPSA1 D950N18TXPSA1 Infineon Technologies Infineon-D950N-DS-v03_01-en_de.pdf?fileId=db3a3043284aacd8012863ac15a953a3 Description: DIODE GEN PURP 1.8KV 950A
Packaging: Bulk
Package / Case: DO-200AA, A-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 950A
Operating Temperature - Junction: -40°C ~ 180°C
Voltage - DC Reverse (Vr) (Max): 1800 V
Voltage - Forward (Vf) (Max) @ If: 1.12 V @ 650 A
Current - Reverse Leakage @ Vr: 40 mA @ 1800 V
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IQE018N06NM6CGATMA1 Infineon Technologies infineon-iqe018n06nm6cg-datasheet-en.pdf Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IQE018N06NM6ATMA1 Infineon Technologies infineon-iqe018n06nm6-datasheet-en.pdf Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
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IQE018N06NM6CGSCATMA1 Infineon Technologies Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IQE018N06NM6SCATMA1 IQE018N06NM6SCATMA1 Infineon Technologies infineon-iqe018n06nm6sc-datasheet-en.pdf Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerWDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Ta), 178A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 30A, 10V
Power Dissipation (Max): 2.5W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 51µA
Supplier Device Package: PG-WHSON-8-1
Drive Voltage (Max Rds On, Min Rds On): 8V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3600 pF @ 30 V
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IPC218N06N3X1SA2 Infineon Technologies DS_IPC218N06N3_2_5.pdf?fileId=db3a3043442f820901442fcafed80052 Description: MOSFET N-CH 60V 3A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3A (Tj)
Rds On (Max) @ Id, Vgs: 100mOhm @ 2A, 10V
Vgs(th) (Max) @ Id: 4V @ 196µA
Supplier Device Package: Sawn on foil
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 60 V
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ROTATEKNOBANGLE2GOTOBO1 ROTATEKNOBANGLE2GOTOBO1 Infineon Technologies Infineon-SensorSelectionGuide-ProductSelectionGuide-v01_00-EN.pdf?fileId=5546d462636cc8fb0164229c09f51bbe&utm_medium=email&utm_campaign=202108_glob_en_atv_sensor+guide&utm_source=N308&elq_mid=5838&elq_cid=428256 Description: ROTATE KNOB 3D 2 GO KIT
Packaging: Box
For Use With/Related Products: 3D Magnetic Sensor
Accessory Type: Kit
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IHFW40N65R5SXKSA1 IHFW40N65R5SXKSA1 Infineon Technologies Infineon-IHFW40N65R5S-DataSheet-v02_01-EN.pdf?fileId=5546d46274cf54d50174d969bc751ef7 Description: IGBT TRENCH FS 650V 61A HSIP247
Packaging: Bulk
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 103 ns
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 40A
Supplier Device Package: PG-HSIP247-3-2
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 44ns/363ns
Switching Energy: 1.52mJ (on), 700µJ (off)
Test Condition: 400V, 40A, 23.1Ohm, 15V
Gate Charge: 142 nC
Current - Collector (Ic) (Max): 61 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 120 A
Power - Max: 108 W
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IGO60R042D1AUMA2 IGO60R042D1AUMA2 Infineon Technologies Description: GAN HV
Drain to Source Voltage (Vdss): 600 V
Supplier Device Package: PG-DSO-20-85
Technology: GaNFET (Gallium Nitride)
Mounting Type: Surface Mount
Package / Case: 20-PowerSOIC (0.433", 11.00mm Width)
Packaging: Tape & Reel (TR)
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TC299T128F300SBCKXUMA1 TC299T128F300SBCKXUMA1 Infineon Technologies Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 8MB FLASH 516LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-516-5
Number of I/O: 263
DigiKey Programmable: Not Verified
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TC299TP128F300NBCKXUMA1 TC299TP128F300NBCKXUMA1 Infineon Technologies Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 8MB FLASH 516LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-516-5
Number of I/O: 263
DigiKey Programmable: Not Verified
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TC267D40F200SBCKXUMA1 TC267D40F200SBCKXUMA1 Infineon Technologies Infineon-TC26xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b40169538e06030445 Description: IC MCU 32BIT 2.5MB FLSH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 240K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 50x12b, 3 x Sigma-Delta
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Number of I/O: 169
DigiKey Programmable: Not Verified
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TC297TX128F300SBCKXUMA1 TC297TX128F300SBCKXUMA1 Infineon Technologies Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Number of I/O: 169
DigiKey Programmable: Not Verified
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TC297TA128F300SBCKXUMA1 TC297TA128F300SBCKXUMA1 Infineon Technologies Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 2.75M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Number of I/O: 169
DigiKey Programmable: Not Verified
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TC297TA64F300SBCKXUMA1 TC297TA64F300SBCKXUMA1 Infineon Technologies Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.75M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Number of I/O: 169
DigiKey Programmable: Not Verified
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BGSX33MU16E6327XTSA1 Infineon Technologies Description: IC RF SWITCH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BGSX33MU16E6327XTSA1 Infineon Technologies Description: IC RF SWITCH
Packaging: Cut Tape (CT)
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TLE4973EVALSTDPCBTOBO1 Infineon Technologies Description: TLE4973 EVAL STD PCB
Packaging: Bulk
Interface: Analog
Voltage - Supply: 4.5V ~ 5.5V
Sensor Type: Current Sensor
Utilized IC / Part: TLE4973
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 221A
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BGMC1210E6327XUMA1 BGMC1210E6327XUMA1 Infineon Technologies Infineon-BGMC1210-DataSheet-v01_05-EN.pdf?fileId=8ac78c8c8a44f57b018a45a2c3530295 Description: WIRELESS INFRASTRUCTURE
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
RF Type: Cellular
Voltage - Supply: 3.1V ~ 5.5V
Current - Supply: 4.2mA
Supplier Device Package: PG-VQFN-32-24
Produkt ist nicht verfügbar
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BFP182RE7764HTSA1 BFP182RE7764HTSA1 Infineon Technologies bfp182r.pdf?folderId=db3a30431400ef68011425b1354605c1&fileId=db3a30431400ef680114266cb9c9060a Description: RF TRANS NPN 12V 8GHZ SOT143R-4
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 22dB
Power - Max: 250mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 10mA, 8V
Frequency - Transition: 8GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.3dB @ 900MHz ~ 1.8GHz
Supplier Device Package: PG-SOT143-4-1
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IPA037N08N3GXKSA1 IPA037N08N3GXKSA1 Infineon Technologies IPA037N08N3_Rev2.0.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431d8a6b3c011dce12d2e1353d Description: MOSFET N-CH 80V 75A TO220-FP
Input Capacitance (Ciss) (Max) @ Vds: 8110 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 117 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Supplier Device Package: PG-TO220-FP
Vgs(th) (Max) @ Id: 3.5V @ 155µA
Power Dissipation (Max): 41W (Tc)
Rds On (Max) @ Id, Vgs: 3.7mOhm @ 75A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack
Packaging: Bulk
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IPB339N20NM6ATMA1 IPB339N20NM6ATMA1 Infineon Technologies Infineon-IPB339N20NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d326b4a120c7a Description: MOSFET
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.8A (Ta), 39A (Tc)
Rds On (Max) @ Id, Vgs: 31.8mOhm @ 26A, 15V
Power Dissipation (Max): 3.8W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 52µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V, 15V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1600 pF @ 100 V
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IPB339N20NM6ATMA1 IPB339N20NM6ATMA1 Infineon Technologies Infineon-IPB339N20NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d326b4a120c7a Description: MOSFET
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.8A (Ta), 39A (Tc)
Rds On (Max) @ Id, Vgs: 31.8mOhm @ 26A, 15V
Power Dissipation (Max): 3.8W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 52µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V, 15V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1600 pF @ 100 V
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IPT129N20NM6ATMA1 IPT129N20NM6ATMA1 Infineon Technologies infineon-ipt129n20nm6-datasheet-en.pdf Description: TRENCH >=100V
Input Capacitance (Ciss) (Max) @ Vds: 3800 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 10 V
Drain to Source Voltage (Vdss): 200 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V, 15V
Supplier Device Package: PG-HSOF-8-1
Vgs(th) (Max) @ Id: 4.5V @ 129µA
Power Dissipation (Max): 3.8W (Ta), 234W (Tc)
Rds On (Max) @ Id, Vgs: 12mOhm @ 65A, 15V
Current - Continuous Drain (Id) @ 25°C: 11A (Ta), 87A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerSFN
Packaging: Tape & Reel (TR)
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IPT129N20NM6ATMA1 IPT129N20NM6ATMA1 Infineon Technologies infineon-ipt129n20nm6-datasheet-en.pdf Description: TRENCH >=100V
Input Capacitance (Ciss) (Max) @ Vds: 3800 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 10 V
Drain to Source Voltage (Vdss): 200 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V, 15V
Supplier Device Package: PG-HSOF-8-1
Vgs(th) (Max) @ Id: 4.5V @ 129µA
Power Dissipation (Max): 3.8W (Ta), 234W (Tc)
Rds On (Max) @ Id, Vgs: 12mOhm @ 65A, 15V
Current - Continuous Drain (Id) @ 25°C: 11A (Ta), 87A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerSFN
Packaging: Cut Tape (CT)
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TT500N12KOFHPSA2 Infineon Technologies Infineon-TT500N-DataSheet-v03_04-EN.pdf?fileId=db3a30434486a89301448d34d0f7790d Description: SCR MODULE 1.2KV 900A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - All SCRs
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 17000A @ 50Hz
Number of SCRs, Diodes: 2 SCRs
Current - On State (It (AV)) (Max): 500 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (RMS)) (Max): 900 A
Voltage - Off State: 1.2 kV
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TT500N18KOFXPSA1 Infineon Technologies Infineon-TT500N-DataSheet-v03_04-EN.pdf?fileId=db3a30434486a89301448d34d0f7790d Description: THYR / DIODE MODULE DK
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: 125°C (TJ)
Structure: Series Connection - All SCRs
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 17000A @ 50Hz
Number of SCRs, Diodes: 2 SCRs
Current - On State (It (AV)) (Max): 500 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (RMS)) (Max): 900 A
Voltage - Off State: 1.8 kV
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TT570N16KOFXPSA1 Infineon Technologies Infineon-TT570N16KOF-DataSheet-v03_02-EN.pdf?fileId=db3a304412b407950112b42f96354c4e Description: THYR / DIODE MODULE DK
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 900 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (AV)) (Max): 600 A
Number of SCRs, Diodes: 2 SCRs
Current - Non Rep. Surge 50, 60Hz (Itsm): 17000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Series Connection - All SCRs
Operating Temperature: 125°C (TJ)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
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IM72D128VV01XTMA1 IM72D128VV01XTMA1 Infineon Technologies Infineon-IM72D128V-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c919c9f9d0191b2ac79c30af8 Description: MIC SDM DIGITAL
Packaging: Cut Tape (CT)
Output Type: Digital, PDM
Size / Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Sensitivity: -36dB ±1dB @ 94dB SPL
Shape: Rectangular
Type: MEMS (Silicon)
S/N Ratio: 71.5dB
Termination: Solder Pads
Direction: Omnidirectional
Port Location: Bottom
Height (Max): 0.051" (1.30mm)
Voltage - Rated: 1.8 V
Current - Supply: 525 µA
Voltage Range: 1.62 V ~ 3.6 V
Frequency Range: 10 Hz ~ 15 kHz
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1000+2.45 EUR
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IMLT65R033M2HXTMA1 IMLT65R033M2HXTMA1 Infineon Technologies Infineon-IMLT65R033M2H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c92416ca5019294a134832a48 Description: SILICON CARBIDE MOSFET
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 27.9A, 20V
Power Dissipation (Max): 312W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 5.7mA
Supplier Device Package: PG-HDSOP-16-6
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1213 pF @ 400 V
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IMLT65R026M2HXTMA1 IMLT65R026M2HXTMA1 Infineon Technologies Infineon-IMLT65R026M2H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c92416ca5019294a1439e2a4b Description: SILICON CARBIDE MOSFET
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 82A (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 34.5A, 20V
Power Dissipation (Max): 365W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 7mA
Supplier Device Package: PG-HDSOP-16-6
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1499 pF @ 400 V
Produkt ist nicht verfügbar
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IPTC025N15NM6ATMA1 IPTC025N15NM6ATMA1 Infineon Technologies Infineon-IPTC025N15NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c90530b3a01907740b75c7021 Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 26A (Ta), 264A (Tc)
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 120A, 15V
Power Dissipation (Max): 3.8W (Ta), 395W (Tc)
Vgs(th) (Max) @ Id: 4V @ 275µA
Supplier Device Package: PG-HDSOP-16-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 15V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 150 V
Gate Charge (Qg) (Max) @ Vgs: 137 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9800 pF @ 75 V
Produkt ist nicht verfügbar
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IPTC025N15NM6ATMA1 IPTC025N15NM6ATMA1 Infineon Technologies Infineon-IPTC025N15NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c90530b3a01907740b75c7021 Description: TRENCH >=100V
Packaging: Cut Tape (CT)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 26A (Ta), 264A (Tc)
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 120A, 15V
Power Dissipation (Max): 3.8W (Ta), 395W (Tc)
Vgs(th) (Max) @ Id: 4V @ 275µA
Supplier Device Package: PG-HDSOP-16-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 15V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 150 V
Gate Charge (Qg) (Max) @ Vgs: 137 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9800 pF @ 75 V
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IMWH170R1K0M1XKSA1 IMWH170R1K0M1XKSA1 Infineon Technologies Infineon-IMWH170R1K0M1-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8eeb092c018f1a6bb0031500 Description: IMWH170R1K0M1XKSA1
Input Capacitance (Ciss) (Max) @ Vds: 233 pF @ 1000 V
Gate Charge (Qg) (Max) @ Vgs: 5.5 nC @ 12 V
Drain to Source Voltage (Vdss): 1700 V
Vgs (Max): 15V, 12V
Drive Voltage (Max Rds On, Min Rds On): 12V, 15V
Supplier Device Package: PG-TO247-3-U04
Vgs(th) (Max) @ Id: 5.7V @ 1.2mA
Power Dissipation (Max): 70W (Tc)
Rds On (Max) @ Id, Vgs: 880mOhm @ 1A, 15V
Current - Continuous Drain (Id) @ 25°C: 5.4A (Tj)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tray
auf Bestellung 173 Stücke:
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3+8.69 EUR
10+6.6 EUR
30+5.99 EUR
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IMWH170R650M1XKSA1 IMWH170R650M1XKSA1 Infineon Technologies Infineon-IMWH170R650M1-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8eeb092c018f1a6c06fe151a Description: IMWH170R650M1XKSA1
Input Capacitance (Ciss) (Max) @ Vds: 337 pF @ 1000 V
Gate Charge (Qg) (Max) @ Vgs: 8.1 nC @ 12 V
Drain to Source Voltage (Vdss): 1700 V
Vgs (Max): 15V, 12V
Drive Voltage (Max Rds On, Min Rds On): 12V, 15V
Supplier Device Package: PG-TO247-3-U04
Vgs(th) (Max) @ Id: 5.7V @ 1.7mA
Power Dissipation (Max): 88W (Tc)
Rds On (Max) @ Id, Vgs: 580mOhm @ 1.5A, 15V
Current - Continuous Drain (Id) @ 25°C: 7.5A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
auf Bestellung 133 Stücke:
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30+7.24 EUR
120+6.03 EUR
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TLE4973R120T5US0010XUMA1 TLE4973R120T5US0010XUMA1 Infineon Technologies TLE4973-RyyyT5-S0010_Rev3.10_11-30-23.pdf Description: CURRENT SENSOR HE PG-TISON-8-6
Number of Channels: 1
Supplier Device Package: PG-TISON-8-6
Current - Supply (Max): 25mA
For Measuring: DC
Sensor Type: Hall Effect
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C
Frequency: 210kHz
Output: Analog Voltage
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE4973R120T5US0010XUMA1 TLE4973R120T5US0010XUMA1 Infineon Technologies TLE4973-RyyyT5-S0010_Rev3.10_11-30-23.pdf Description: CURRENT SENSOR HE PG-TISON-8-6
Number of Channels: 1
Supplier Device Package: PG-TISON-8-6
Current - Supply (Max): 25mA
For Measuring: DC
Sensor Type: Hall Effect
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C
Frequency: 210kHz
Output: Analog Voltage
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Cut Tape (CT)
auf Bestellung 2440 Stücke:
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5+9.81 EUR
10+9.4 EUR
25+8.91 EUR
50+8.58 EUR
100+8.28 EUR
500+7.85 EUR
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EVAL6ED2742S01QM1TOBO1 Infineon Technologies Description: EVALUATION BOARD FOR 160 V THREE
Embedded: Yes, MCU
Secondary Attributes: On-Board LEDs, Test Points
Primary Attributes: 24V Operating Voltage
Utilized IC / Part: 6ED2742S01Q
Contents: Board(s)
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Produkt ist nicht verfügbar
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IPP60R016CM8XKSA1 IPP60R016CM8XKSA1 Infineon Technologies Infineon-IPP60R016CM8-DataSheet-v02_02-EN.pdf?fileId=8ac78c8c8d2fe47b018d8e21f7f33cd1 Description: IPP60R016CM8XKSA1
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 135A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 62.5A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 1.48mA
Supplier Device Package: PG-TO220-3-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 171 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7545 pF @ 400 V
auf Bestellung 1585 Stücke:
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1+25.49 EUR
50+14.53 EUR
100+13.47 EUR
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BBY 59-02V E6327 BBY 59-02V E6327 Infineon Technologies BBY_59_Apr2007.pdf Description: DIODE VARACTOR 15V SGL PG-SC79-2
Capacitance Ratio: 4.6
Voltage - Peak Reverse (Max): 15 V
Supplier Device Package: PG-SC79-2
Capacitance Ratio Condition: C1/C4
Capacitance @ Vr, F: 7.8pF @ 4V, 1MHz
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY7C1265KV18-450BZXC CY7C1265KV18-450BZXC Infineon Technologies download Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 450 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY22394FXC Infineon-CY22393_CY223931_CY22394_CY22395_THREE_PLL_SERIAL_PROGRAMMABLE_FLASH_PROGRAMMABLE_CLOCK_GENERATOR-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec0b89e3555&utm_source=cypress&utm_medium=referral&utm_campaign=20
CY22394FXC
Hersteller: Infineon Technologies
Description: IC CLOCK GENERATOR 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: CMOS, PECL
Frequency - Max: 200MHz, 400MHz
Type: Clock Generator, Fanout Distribution
Input: LVTTL, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:5
Differential - Input:Output: No/Yes
Supplier Device Package: 16-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Verified
auf Bestellung 1632 Stücke:
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29+20.3 EUR
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CY22394FXC Infineon-CY22393_CY223931_CY22394_CY22395_THREE_PLL_SERIAL_PROGRAMMABLE_FLASH_PROGRAMMABLE_CLOCK_GENERATOR-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec0b89e3555&utm_source=cypress&utm_medium=referral&utm_campaign=20
CY22394FXC
Hersteller: Infineon Technologies
Description: IC CLOCK GENERATOR 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: CMOS, PECL
Frequency - Max: 200MHz, 400MHz
Type: Clock Generator, Fanout Distribution
Input: LVTTL, Crystal
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.135V ~ 3.465V
Ratio - Input:Output: 1:5
Differential - Input:Output: No/Yes
Supplier Device Package: 16-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: Yes/No
Number of Circuits: 1
DigiKey Programmable: Verified
auf Bestellung 474 Stücke:
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1+26.79 EUR
10+20.56 EUR
25+19.02 EUR
100+17.55 EUR
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S25FL164K0XNFA010 S25FL116K_132K_164K__RevH_5-19-17.pdf
S25FL164K0XNFA010
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 8WSON
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O
Write Cycle Time - Word, Page: 3ms
Grade: Automotive
Supplier Device Package: 8-WSON (5x6)
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 8-WDFN Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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CY8C6137FDI-F02T Infineon-PSoC_6_MCU_PSoC_61_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee513576c97
CY8C6137FDI-F02T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b SAR; D/A 2x7b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Capsense, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (3.68x3.19)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6136FTI-F42T Infineon-PSoC_6_MCU_PSoC_61_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v15_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee513576c97
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 16x12b SAR; D/A 2x7b, 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, Capsense, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (3.68x3.19)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6337BZI-BLF13T Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37
CY8C6337BZI-BLF13T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 116BGA
Packaging: Tape & Reel (TR)
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6316BZI-BLF53T Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37
CY8C6316BZI-BLF53T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 116BGA
Packaging: Tape & Reel (TR)
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6336BZI-BLF04 Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37
CY8C6336BZI-BLF04
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLSH 124VFBGA
Packaging: Tray
Package / Case: 124-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 124-VFBGA (9x9)
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6316BZI-BLF04 Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37
CY8C6316BZI-BLF04
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLSH 124VFBGA
Packaging: Tray
Package / Case: 124-VFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 124-VFBGA (9x9)
Number of I/O: 84
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6347BZI-BLD53T Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37
CY8C6347BZI-BLD53T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 116BGA
Packaging: Tape & Reel (TR)
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2x7b, 1x8/12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, RSA, SHA, Temp Sensor, TRNG, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6347BZI-BLD54T infineon-psoc-6-mcu-cy8c63x6-cy8c63x7-datasheet-psoc-63-mcu-with-bluetooth-le-datasheet-en.pdf
CY8C6347BZI-BLD54T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 124BGA
Packaging: Tape & Reel (TR)
Package / Case: 124-VFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 16x10b SAR, 16x12b Sigma-Delta; D/A 2, 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: FIFO, I2C, IrDA, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, Crypto - AES, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 124-VFBGA (9x9)
Number of I/O: 84
Produkt ist nicht verfügbar
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IMBG120R234M2HXTMA1 infineon-imbg120r234m2h-datasheet-en.pdf
IMBG120R234M2HXTMA1
Hersteller: Infineon Technologies
Description: SICFET N-CH 1200V 8.1A TO263
Packaging: Tape & Reel (TR)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8.1A (Tc)
Rds On (Max) @ Id, Vgs: 233.9mOhm @ 3A, 18V
Power Dissipation (Max): 80W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 900µA
Supplier Device Package: PG-TO263-7-12
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 7.9 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 290 pF @ 800 V
Produkt ist nicht verfügbar
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IMBG120R234M2HXTMA1 infineon-imbg120r234m2h-datasheet-en.pdf
IMBG120R234M2HXTMA1
Hersteller: Infineon Technologies
Description: SICFET N-CH 1200V 8.1A TO263
Packaging: Cut Tape (CT)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 8.1A (Tc)
Rds On (Max) @ Id, Vgs: 233.9mOhm @ 3A, 18V
Power Dissipation (Max): 80W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 900µA
Supplier Device Package: PG-TO263-7-12
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 7.9 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 290 pF @ 800 V
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3+9.59 EUR
10+6.35 EUR
100+4.52 EUR
500+4.03 EUR
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SLB9672AU20FW1613XTMA1 SLB9672XU20FW1612XTMA1.pdf
SLB9672AU20FW1613XTMA1
Hersteller: Infineon Technologies
Description: OPTIGA TPM SLB9672 FW17
Packaging: Tape & Reel (TR)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
RAM Size: 51KB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Controller Series: SLB 9672
Program Memory Type: NVSRAM
Applications: Embedded Security Trusted Computing
Core Processor: 32-Bit
Supplier Device Package: PG-UQFN-32-1
Number of I/O: 3
Produkt ist nicht verfügbar
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SLB9672AU20FW1613XTMA1 SLB9672XU20FW1612XTMA1.pdf
SLB9672AU20FW1613XTMA1
Hersteller: Infineon Technologies
Description: OPTIGA TPM SLB9672 FW17
Packaging: Cut Tape (CT)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
RAM Size: 51KB
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Controller Series: SLB 9672
Program Memory Type: NVSRAM
Applications: Embedded Security Trusted Computing
Core Processor: 32-Bit
Supplier Device Package: PG-UQFN-32-1
Number of I/O: 3
auf Bestellung 4155 Stücke:
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AnzahlPrivatkunde
2+11.33 EUR
10+8.63 EUR
25+7.96 EUR
100+7.22 EUR
250+6.88 EUR
500+6.66 EUR
1000+6.49 EUR
2500+6.31 EUR
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SLB9672XU20FW1523XTMA1 infineon-slb9672-tpm20-spi-fw15xx-ds-rev1-5-2024-11-13-datasheet-en.pdf
SLB9672XU20FW1523XTMA1
Hersteller: Infineon Technologies
Description: SECURITY CONTROLLER OPTIGA TPM S
Packaging: Cut Tape (CT)
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: SPI
RAM Size: 51K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 1.95V, 3V ~ 3.6V
Controller Series: SLB 9672
Program Memory Type: NVSRAM
Applications: Embedded Security Trusted Computing
Core Processor: 32-Bit
Supplier Device Package: PG-UQFN-32-1
Number of I/O: 3
Produkt ist nicht verfügbar
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TPM9672FW1613RPIEBTOBO1 Infineon-OPTIGA%20TPM%20SLB%209672%20FW15-DataSheet-v01_20-EN.pdf?fileId=8ac78c8c7f2a768a017f89965f764432
TPM9672FW1613RPIEBTOBO1
Hersteller: Infineon Technologies
Description: OPTIGA TPM SLB 9672 RPI EVALUATI
Packaging: Bulk
Function: Trusted Platform Module (TPM)
Type: Interface
Contents: Board(s)
Utilized IC / Part: SLB 9672
Produkt ist nicht verfügbar
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TPM9672FW1523PCEBTOBO1 Infineon-OPTIGA%20TPM%20SLB%209672%20KIT-DataSheet-v01_02-EN.pdf?fileId=8ac78c8c7fb5929e017ff76b3b3d1059
TPM9672FW1523PCEBTOBO1
Hersteller: Infineon Technologies
Description: OPTIGA TPM SLB 9672 PC EVALUATIO
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SLB 9672
Produkt ist nicht verfügbar
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TPM72FW1521XENONTOBO1
Hersteller: Infineon Technologies
Description: OPTIGA TPM SLB 9672 PC EVALUATIO
Packaging: Bulk
Function: Security
Type: Interface
Contents: Board(s)
Utilized IC / Part: SLB 9672
Produkt ist nicht verfügbar
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D950N18TXPSA1 Infineon-D950N-DS-v03_01-en_de.pdf?fileId=db3a3043284aacd8012863ac15a953a3
D950N18TXPSA1
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 1.8KV 950A
Packaging: Bulk
Package / Case: DO-200AA, A-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 950A
Operating Temperature - Junction: -40°C ~ 180°C
Voltage - DC Reverse (Vr) (Max): 1800 V
Voltage - Forward (Vf) (Max) @ If: 1.12 V @ 650 A
Current - Reverse Leakage @ Vr: 40 mA @ 1800 V
auf Bestellung 19 Stücke:
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3+221.7 EUR
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IQE018N06NM6CGATMA1 infineon-iqe018n06nm6cg-datasheet-en.pdf
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IQE018N06NM6ATMA1 infineon-iqe018n06nm6-datasheet-en.pdf
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IQE018N06NM6CGSCATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IQE018N06NM6SCATMA1 infineon-iqe018n06nm6sc-datasheet-en.pdf
IQE018N06NM6SCATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerWDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Ta), 178A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 30A, 10V
Power Dissipation (Max): 2.5W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 51µA
Supplier Device Package: PG-WHSON-8-1
Drive Voltage (Max Rds On, Min Rds On): 8V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3600 pF @ 30 V
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6000+2.06 EUR
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IPC218N06N3X1SA2 DS_IPC218N06N3_2_5.pdf?fileId=db3a3043442f820901442fcafed80052
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 3A SAWN ON FOIL
Packaging: Bulk
Package / Case: Die
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3A (Tj)
Rds On (Max) @ Id, Vgs: 100mOhm @ 2A, 10V
Vgs(th) (Max) @ Id: 4V @ 196µA
Supplier Device Package: Sawn on foil
Drive Voltage (Max Rds On, Min Rds On): 10V
Drain to Source Voltage (Vdss): 60 V
Produkt ist nicht verfügbar
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ROTATEKNOBANGLE2GOTOBO1 Infineon-SensorSelectionGuide-ProductSelectionGuide-v01_00-EN.pdf?fileId=5546d462636cc8fb0164229c09f51bbe&utm_medium=email&utm_campaign=202108_glob_en_atv_sensor+guide&utm_source=N308&elq_mid=5838&elq_cid=428256
ROTATEKNOBANGLE2GOTOBO1
Hersteller: Infineon Technologies
Description: ROTATE KNOB 3D 2 GO KIT
Packaging: Box
For Use With/Related Products: 3D Magnetic Sensor
Accessory Type: Kit
auf Bestellung 3 Stücke:
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AnzahlPrivatkunde
1+53.74 EUR
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IHFW40N65R5SXKSA1 Infineon-IHFW40N65R5S-DataSheet-v02_01-EN.pdf?fileId=5546d46274cf54d50174d969bc751ef7
IHFW40N65R5SXKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 61A HSIP247
Packaging: Bulk
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 103 ns
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 40A
Supplier Device Package: PG-HSIP247-3-2
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 44ns/363ns
Switching Energy: 1.52mJ (on), 700µJ (off)
Test Condition: 400V, 40A, 23.1Ohm, 15V
Gate Charge: 142 nC
Current - Collector (Ic) (Max): 61 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 120 A
Power - Max: 108 W
auf Bestellung 8340 Stücke:
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89+6.08 EUR
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IGO60R042D1AUMA2
IGO60R042D1AUMA2
Hersteller: Infineon Technologies
Description: GAN HV
Drain to Source Voltage (Vdss): 600 V
Supplier Device Package: PG-DSO-20-85
Technology: GaNFET (Gallium Nitride)
Mounting Type: Surface Mount
Package / Case: 20-PowerSOIC (0.433", 11.00mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TC299T128F300SBCKXUMA1 Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
TC299T128F300SBCKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 516LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-516-5
Number of I/O: 263
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC299TP128F300NBCKXUMA1 Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
TC299TP128F300NBCKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 516LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 516-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-516-5
Number of I/O: 263
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC267D40F200SBCKXUMA1 Infineon-TC26xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b40169538e06030445
TC267D40F200SBCKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2.5MB FLSH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 240K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 96K x 8
Core Processor: TriCore™
Data Converters: A/D 50x12b, 3 x Sigma-Delta
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC297TX128F300SBCKXUMA1 Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
TC297TX128F300SBCKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 728K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TC297TA128F300SBCKXUMA1 Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
TC297TA128F300SBCKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 8MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 8MB (8M x 8)
RAM Size: 2.75M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC297TA64F300SBCKXUMA1 Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
TC297TA64F300SBCKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 2.75M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 384K x 8
Core Processor: TriCore™
Data Converters: A/D 84x12b, 10 x Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, WDT
Supplier Device Package: PG-LFBGA-292-6
Number of I/O: 169
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BGSX33MU16E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BGSX33MU16E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH
Packaging: Cut Tape (CT)
auf Bestellung 600 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7+3.08 EUR
10+2.65 EUR
25+2.5 EUR
100+2.3 EUR
250+2.18 EUR
500+2.08 EUR
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TLE4973EVALSTDPCBTOBO1
Hersteller: Infineon Technologies
Description: TLE4973 EVAL STD PCB
Packaging: Bulk
Interface: Analog
Voltage - Supply: 4.5V ~ 5.5V
Sensor Type: Current Sensor
Utilized IC / Part: TLE4973
Supplied Contents: Board(s)
Embedded: No
Sensing Range: 221A
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1+194.59 EUR
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BGMC1210E6327XUMA1 Infineon-BGMC1210-DataSheet-v01_05-EN.pdf?fileId=8ac78c8c8a44f57b018a45a2c3530295
BGMC1210E6327XUMA1
Hersteller: Infineon Technologies
Description: WIRELESS INFRASTRUCTURE
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
RF Type: Cellular
Voltage - Supply: 3.1V ~ 5.5V
Current - Supply: 4.2mA
Supplier Device Package: PG-VQFN-32-24
Produkt ist nicht verfügbar
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BFP182RE7764HTSA1 bfp182r.pdf?folderId=db3a30431400ef68011425b1354605c1&fileId=db3a30431400ef680114266cb9c9060a
BFP182RE7764HTSA1
Hersteller: Infineon Technologies
Description: RF TRANS NPN 12V 8GHZ SOT143R-4
Packaging: Bulk
Package / Case: SOT-143R
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Gain: 22dB
Power - Max: 250mW
Current - Collector (Ic) (Max): 35mA
Voltage - Collector Emitter Breakdown (Max): 12V
DC Current Gain (hFE) (Min) @ Ic, Vce: 70 @ 10mA, 8V
Frequency - Transition: 8GHz
Noise Figure (dB Typ @ f): 0.9dB ~ 1.3dB @ 900MHz ~ 1.8GHz
Supplier Device Package: PG-SOT143-4-1
auf Bestellung 259459 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2453+0.24 EUR
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IPA037N08N3GXKSA1 IPA037N08N3_Rev2.0.pdf?folderId=db3a304313b8b5a60113cee8763b02d7&fileId=db3a30431d8a6b3c011dce12d2e1353d
IPA037N08N3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 80V 75A TO220-FP
Input Capacitance (Ciss) (Max) @ Vds: 8110 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 117 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Supplier Device Package: PG-TO220-FP
Vgs(th) (Max) @ Id: 3.5V @ 155µA
Power Dissipation (Max): 41W (Tc)
Rds On (Max) @ Id, Vgs: 3.7mOhm @ 75A, 10V
Current - Continuous Drain (Id) @ 25°C: 75A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3 Full Pack
Packaging: Bulk
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105+5.24 EUR
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IPB339N20NM6ATMA1 Infineon-IPB339N20NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d326b4a120c7a
IPB339N20NM6ATMA1
Hersteller: Infineon Technologies
Description: MOSFET
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.8A (Ta), 39A (Tc)
Rds On (Max) @ Id, Vgs: 31.8mOhm @ 26A, 15V
Power Dissipation (Max): 3.8W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 52µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V, 15V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1600 pF @ 100 V
Produkt ist nicht verfügbar
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IPB339N20NM6ATMA1 Infineon-IPB339N20NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8d2fe47b018d326b4a120c7a
IPB339N20NM6ATMA1
Hersteller: Infineon Technologies
Description: MOSFET
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.8A (Ta), 39A (Tc)
Rds On (Max) @ Id, Vgs: 31.8mOhm @ 26A, 15V
Power Dissipation (Max): 3.8W (Ta), 125W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 52µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V, 15V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Gate Charge (Qg) (Max) @ Vgs: 24 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1600 pF @ 100 V
auf Bestellung 439 Stücke:
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10+4.33 EUR
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IPT129N20NM6ATMA1 infineon-ipt129n20nm6-datasheet-en.pdf
IPT129N20NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Input Capacitance (Ciss) (Max) @ Vds: 3800 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 10 V
Drain to Source Voltage (Vdss): 200 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V, 15V
Supplier Device Package: PG-HSOF-8-1
Vgs(th) (Max) @ Id: 4.5V @ 129µA
Power Dissipation (Max): 3.8W (Ta), 234W (Tc)
Rds On (Max) @ Id, Vgs: 12mOhm @ 65A, 15V
Current - Continuous Drain (Id) @ 25°C: 11A (Ta), 87A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerSFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPT129N20NM6ATMA1 infineon-ipt129n20nm6-datasheet-en.pdf
IPT129N20NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Input Capacitance (Ciss) (Max) @ Vds: 3800 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 56 nC @ 10 V
Drain to Source Voltage (Vdss): 200 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V, 15V
Supplier Device Package: PG-HSOF-8-1
Vgs(th) (Max) @ Id: 4.5V @ 129µA
Power Dissipation (Max): 3.8W (Ta), 234W (Tc)
Rds On (Max) @ Id, Vgs: 12mOhm @ 65A, 15V
Current - Continuous Drain (Id) @ 25°C: 11A (Ta), 87A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerSFN
Packaging: Cut Tape (CT)
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2+11.08 EUR
10+7.39 EUR
100+5.31 EUR
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TT500N12KOFHPSA2 Infineon-TT500N-DataSheet-v03_04-EN.pdf?fileId=db3a30434486a89301448d34d0f7790d
Hersteller: Infineon Technologies
Description: SCR MODULE 1.2KV 900A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - All SCRs
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 17000A @ 50Hz
Number of SCRs, Diodes: 2 SCRs
Current - On State (It (AV)) (Max): 500 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (RMS)) (Max): 900 A
Voltage - Off State: 1.2 kV
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TT500N18KOFXPSA1 Infineon-TT500N-DataSheet-v03_04-EN.pdf?fileId=db3a30434486a89301448d34d0f7790d
Hersteller: Infineon Technologies
Description: THYR / DIODE MODULE DK
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: 125°C (TJ)
Structure: Series Connection - All SCRs
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 17000A @ 50Hz
Number of SCRs, Diodes: 2 SCRs
Current - On State (It (AV)) (Max): 500 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (RMS)) (Max): 900 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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TT570N16KOFXPSA1 Infineon-TT570N16KOF-DataSheet-v03_02-EN.pdf?fileId=db3a304412b407950112b42f96354c4e
Hersteller: Infineon Technologies
Description: THYR / DIODE MODULE DK
Voltage - Off State: 1.6 kV
Current - On State (It (RMS)) (Max): 900 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (AV)) (Max): 600 A
Number of SCRs, Diodes: 2 SCRs
Current - Non Rep. Surge 50, 60Hz (Itsm): 17000A @ 50Hz
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Hold (Ih) (Max): 300 mA
Structure: Series Connection - All SCRs
Operating Temperature: 125°C (TJ)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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IM72D128VV01XTMA1 Infineon-IM72D128V-DataSheet-v01_10-EN.pdf?fileId=8ac78c8c919c9f9d0191b2ac79c30af8
IM72D128VV01XTMA1
Hersteller: Infineon Technologies
Description: MIC SDM DIGITAL
Packaging: Cut Tape (CT)
Output Type: Digital, PDM
Size / Dimension: 0.157" L x 0.118" W (4.00mm x 3.00mm)
Sensitivity: -36dB ±1dB @ 94dB SPL
Shape: Rectangular
Type: MEMS (Silicon)
S/N Ratio: 71.5dB
Termination: Solder Pads
Direction: Omnidirectional
Port Location: Bottom
Height (Max): 0.051" (1.30mm)
Voltage - Rated: 1.8 V
Current - Supply: 525 µA
Voltage Range: 1.62 V ~ 3.6 V
Frequency Range: 10 Hz ~ 15 kHz
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6+3.8 EUR
7+3.36 EUR
10+3.2 EUR
25+3.01 EUR
50+2.89 EUR
100+2.77 EUR
500+2.53 EUR
1000+2.45 EUR
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IMLT65R033M2HXTMA1 Infineon-IMLT65R033M2H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c92416ca5019294a134832a48
IMLT65R033M2HXTMA1
Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 27.9A, 20V
Power Dissipation (Max): 312W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 5.7mA
Supplier Device Package: PG-HDSOP-16-6
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1213 pF @ 400 V
Produkt ist nicht verfügbar
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IMLT65R026M2HXTMA1 Infineon-IMLT65R026M2H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c92416ca5019294a1439e2a4b
IMLT65R026M2HXTMA1
Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 82A (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 34.5A, 20V
Power Dissipation (Max): 365W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 7mA
Supplier Device Package: PG-HDSOP-16-6
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1499 pF @ 400 V
Produkt ist nicht verfügbar
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IPTC025N15NM6ATMA1 Infineon-IPTC025N15NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c90530b3a01907740b75c7021
IPTC025N15NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 26A (Ta), 264A (Tc)
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 120A, 15V
Power Dissipation (Max): 3.8W (Ta), 395W (Tc)
Vgs(th) (Max) @ Id: 4V @ 275µA
Supplier Device Package: PG-HDSOP-16-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 15V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 150 V
Gate Charge (Qg) (Max) @ Vgs: 137 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9800 pF @ 75 V
Produkt ist nicht verfügbar
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IPTC025N15NM6ATMA1 Infineon-IPTC025N15NM6-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c90530b3a01907740b75c7021
IPTC025N15NM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Cut Tape (CT)
Package / Case: 16-PowerSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 26A (Ta), 264A (Tc)
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 120A, 15V
Power Dissipation (Max): 3.8W (Ta), 395W (Tc)
Vgs(th) (Max) @ Id: 4V @ 275µA
Supplier Device Package: PG-HDSOP-16-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 15V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 150 V
Gate Charge (Qg) (Max) @ Vgs: 137 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9800 pF @ 75 V
auf Bestellung 182 Stücke:
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2+15.21 EUR
10+10.32 EUR
100+7.56 EUR
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IMWH170R1K0M1XKSA1 Infineon-IMWH170R1K0M1-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8eeb092c018f1a6bb0031500
IMWH170R1K0M1XKSA1
Hersteller: Infineon Technologies
Description: IMWH170R1K0M1XKSA1
Input Capacitance (Ciss) (Max) @ Vds: 233 pF @ 1000 V
Gate Charge (Qg) (Max) @ Vgs: 5.5 nC @ 12 V
Drain to Source Voltage (Vdss): 1700 V
Vgs (Max): 15V, 12V
Drive Voltage (Max Rds On, Min Rds On): 12V, 15V
Supplier Device Package: PG-TO247-3-U04
Vgs(th) (Max) @ Id: 5.7V @ 1.2mA
Power Dissipation (Max): 70W (Tc)
Rds On (Max) @ Id, Vgs: 880mOhm @ 1A, 15V
Current - Continuous Drain (Id) @ 25°C: 5.4A (Tj)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tray
auf Bestellung 173 Stücke:
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3+8.69 EUR
10+6.6 EUR
30+5.99 EUR
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IMWH170R650M1XKSA1 Infineon-IMWH170R650M1-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8eeb092c018f1a6c06fe151a
IMWH170R650M1XKSA1
Hersteller: Infineon Technologies
Description: IMWH170R650M1XKSA1
Input Capacitance (Ciss) (Max) @ Vds: 337 pF @ 1000 V
Gate Charge (Qg) (Max) @ Vgs: 8.1 nC @ 12 V
Drain to Source Voltage (Vdss): 1700 V
Vgs (Max): 15V, 12V
Drive Voltage (Max Rds On, Min Rds On): 12V, 15V
Supplier Device Package: PG-TO247-3-U04
Vgs(th) (Max) @ Id: 5.7V @ 1.7mA
Power Dissipation (Max): 88W (Tc)
Rds On (Max) @ Id, Vgs: 580mOhm @ 1.5A, 15V
Current - Continuous Drain (Id) @ 25°C: 7.5A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
auf Bestellung 133 Stücke:
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2+12.7 EUR
30+7.24 EUR
120+6.03 EUR
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TLE4973R120T5US0010XUMA1 TLE4973-RyyyT5-S0010_Rev3.10_11-30-23.pdf
TLE4973R120T5US0010XUMA1
Hersteller: Infineon Technologies
Description: CURRENT SENSOR HE PG-TISON-8-6
Number of Channels: 1
Supplier Device Package: PG-TISON-8-6
Current - Supply (Max): 25mA
For Measuring: DC
Sensor Type: Hall Effect
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C
Frequency: 210kHz
Output: Analog Voltage
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE4973R120T5US0010XUMA1 TLE4973-RyyyT5-S0010_Rev3.10_11-30-23.pdf
TLE4973R120T5US0010XUMA1
Hersteller: Infineon Technologies
Description: CURRENT SENSOR HE PG-TISON-8-6
Number of Channels: 1
Supplier Device Package: PG-TISON-8-6
Current - Supply (Max): 25mA
For Measuring: DC
Sensor Type: Hall Effect
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C
Frequency: 210kHz
Output: Analog Voltage
Mounting Type: Surface Mount
Package / Case: 8-PowerTDFN
Packaging: Cut Tape (CT)
auf Bestellung 2440 Stücke:
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2+10.89 EUR
5+9.81 EUR
10+9.4 EUR
25+8.91 EUR
50+8.58 EUR
100+8.28 EUR
500+7.85 EUR
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EVAL6ED2742S01QM1TOBO1
Hersteller: Infineon Technologies
Description: EVALUATION BOARD FOR 160 V THREE
Embedded: Yes, MCU
Secondary Attributes: On-Board LEDs, Test Points
Primary Attributes: 24V Operating Voltage
Utilized IC / Part: 6ED2742S01Q
Contents: Board(s)
Type: Power Management
Function: Gate Driver
Packaging: Bulk
Produkt ist nicht verfügbar
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IPP60R016CM8XKSA1 Infineon-IPP60R016CM8-DataSheet-v02_02-EN.pdf?fileId=8ac78c8c8d2fe47b018d8e21f7f33cd1
IPP60R016CM8XKSA1
Hersteller: Infineon Technologies
Description: IPP60R016CM8XKSA1
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 135A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 62.5A, 10V
Power Dissipation (Max): 625W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 1.48mA
Supplier Device Package: PG-TO220-3-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 171 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 7545 pF @ 400 V
auf Bestellung 1585 Stücke:
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1+25.49 EUR
50+14.53 EUR
100+13.47 EUR
500+11.89 EUR
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BBY 59-02V E6327 BBY_59_Apr2007.pdf
BBY 59-02V E6327
Hersteller: Infineon Technologies
Description: DIODE VARACTOR 15V SGL PG-SC79-2
Capacitance Ratio: 4.6
Voltage - Peak Reverse (Max): 15 V
Supplier Device Package: PG-SC79-2
Capacitance Ratio Condition: C1/C4
Capacitance @ Vr, F: 7.8pF @ 4V, 1MHz
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-79, SOD-523
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY7C1265KV18-450BZXC download
CY7C1265KV18-450BZXC
Hersteller: Infineon Technologies
Description: IC SRAM 36MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 36Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 450 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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