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IPB60R250CPATMA1 IPB60R250CPATMA1 Infineon Technologies IPB60R250CP_rev2.1.pdf?folderId=db3a30431ff98815012019af55de3f2c&fileId=db3a304320896aa201208b2fd3ce0087 Description: MOSFET N-CH 600V 12A TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
Rds On (Max) @ Id, Vgs: 250mOhm @ 7.8A, 10V
Power Dissipation (Max): 104W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 440µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 35 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1200 pF @ 100 V
Produkt ist nicht verfügbar
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BSP603S2LHUMA1 BSP603S2LHUMA1 Infineon Technologies Infineon-BSP603S2L-DS-v01_01-en.pdf?fileId=db3a30431a47d73d011a49742afe014f&ack=t Description: MOSFET N-CH 55V 5.2A SOT223-4
Input Capacitance (Ciss) (Max) @ Vds: 1390 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: PG-SOT223-4
Vgs(th) (Max) @ Id: 2V @ 50µA
Power Dissipation (Max): 1.8W (Ta)
Rds On (Max) @ Id, Vgs: 33mOhm @ 2.6A, 10V
Current - Continuous Drain (Id) @ 25°C: 5.2A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
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S25FL064LABBHA020 S25FL064LABBHA020 Infineon Technologies INFN-S-A0017271261-1.pdf Description: IC FLASH 64MBIT SPI/QUAD 24BGA
Grade: Automotive
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O, QPI
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
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S25FL064LABBHA023 S25FL064LABBHA023 Infineon Technologies INFN-S-A0017271261-1.pdf Description: IC FLASH 64MBIT SPI/QUAD 24BGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O, QPI
Grade: Automotive
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tape & Reel (TR)
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S25FL064LABBHB020 S25FL064LABBHB020 Infineon Technologies INFN-S-A0017271261-1.pdf Description: IC FLASH 64MBIT SPI/QUAD 24BGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O, QPI
Grade: Automotive
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
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IRS2530DPBF IRS2530DPBF Infineon Technologies irs2530d.pdf?fileId=5546d462533600a40153567af4f52821 description Description: IC BALLAST CNTRL 115KHZ 8DIP
Type: Ballast Controller
Frequency: 34.2kHz ~ 115kHz
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
Current - Supply: 5 mA
Dimming: Yes
Supplier Device Package: 8-PDIP
Voltage - Supply: 11.5V ~ 16.6V
Operating Temperature: -40°C ~ 125°C
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BTS244ZE3062AATMA2 BTS244ZE3062AATMA2 Infineon Technologies INFNS27930-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 55V 35A TO263-5
Qualification: AEC-Q101
Grade: Automotive
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 2660 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 130 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: PG-TO263-5-2
Vgs(th) (Max) @ Id: 2V @ 130µA
Power Dissipation (Max): 170W (Tc)
FET Feature: Temperature Sensing Diode
Rds On (Max) @ Id, Vgs: 13mOhm @ 19A, 10V
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SAK-TC275TP-64F200N DC SAK-TC275TP-64F200N DC Infineon Technologies Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 48x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-22
Number of I/O: 169
DigiKey Programmable: Not Verified
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MMBTA92LT1 MMBTA92LT1 Infineon Technologies smbta92-mmbta92.pdf?folderId=db3a30431441fb5d011449af3ad90232&fileId=db3a30431441fb5d011449c5cd03023b description Description: TRANS PNP 300V 0.5A PG-SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 2mA, 20mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 30mA, 10V
Frequency - Transition: 50MHz
Supplier Device Package: PG-SOT23
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 360 mW
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MMBTA92LT1 MMBTA92LT1 Infineon Technologies smbta92-mmbta92.pdf?folderId=db3a30431441fb5d011449af3ad90232&fileId=db3a30431441fb5d011449c5cd03023b description Description: TRANS PNP 300V 0.5A PG-SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 2mA, 20mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 30mA, 10V
Frequency - Transition: 50MHz
Supplier Device Package: PG-SOT23
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 360 mW
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CY24271ZXC CY24271ZXC Infineon Technologies download Description: IC CLOCK GENERATOR 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 1.067MHz
Type: Clock Generator, Fanout Distribution
Input: Clock
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 28-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
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CY24270ZXC Infineon Technologies Description: IC CLOCK MEDIACLOCK 28-TSSOP
Packaging: Tube
DigiKey Programmable: Not Verified
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TLF42772EPXUMA1 TLF42772EPXUMA1 Infineon Technologies Infineon-TLF4277-2EP-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8779172a01879f897ec10936 Description: OPTIREG LINEAR
Packaging: Tape & Reel (TR)
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TLF42772EPXUMA1 TLF42772EPXUMA1 Infineon Technologies Infineon-TLF4277-2EP-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8779172a01879f897ec10936 Description: OPTIREG LINEAR
Packaging: Cut Tape (CT)
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CY8C21634B-24LTXI CY8C21634B-24LTXI Infineon Technologies download Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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64-9146 64-9146 Infineon Technologies DirectFET%20MOSFET%204Ps%20Checklist.pdf Description: MOSFET N-CH 20V 32A DIRECTFET
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric MT
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 32A (Ta), 180A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 15A, 10V
Power Dissipation (Max): 2.8W (Ta), 89W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: DIRECTFET™ MT
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 71 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 6580 pF @ 10 V
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PVI5050NSPBF PVI5050NSPBF Infineon Technologies Infineon-PVI1050N-DS-v01_00-EN.pdf?fileId=5546d462602a9dc801607b6ff00c5cca Description: OPTOISOLTR 4KV 1CH PHVOLT 8-SMD
Packaging: Tube
Package / Case: 8-SMD, Gull Wing, 4 Leads
Output Type: Photovoltaic
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Input Type: DC
Current - Output / Channel: 5µA
Voltage - Isolation: 4000Vrms
Supplier Device Package: 8-SMD
Voltage - Output (Max): 5V
Turn On / Turn Off Time (Typ): 300µs, 220µs (Max)
Number of Channels: 1
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500+6.38 EUR
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CYPD3174-24LQXQT CYPD3174-24LQXQT Infineon Technologies Infineon-EZ-PD(TM)_CCG3PA_Datasheet_USB_Type-C_Port_Controller-DataSheet-v08_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee438366ac0&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC USB TYPE-C CONTROLLER 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 24.5V
Program Memory Type: FLASH (64kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 12
DigiKey Programmable: Not Verified
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FF2000UXTR33T2M1BPSA1 FF2000UXTR33T2M1BPSA1 Infineon Technologies Infineon-FF2600UXTR33T2M1-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c018fe3442aa75dc7 Description: MOSFET 2N-CH 3300V 9AG-XHP2K33
Packaging: Box
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 3300V (3.3kV)
Current - Continuous Drain (Id) @ 25°C: 925A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 203000pF @ 1.8kV
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 1kA, 15V
Gate Charge (Qg) (Max) @ Vgs: 5000nC @ 15V
Vgs(th) (Max) @ Id: 5.55V @ 900mA
Supplier Device Package: AG-XHP2K33
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CYT2B98BACQ0AZEGS CYT2B98BACQ0AZEGS Infineon Technologies Infineon-CYT2B9_Datasheet_32-bit_Arm_Cortex-M4F_Microcontroller_TRAVEO_T2G_Family-AdditionalTechnicalInformation-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9c191729c Description: IC MCU 32BT 2.0625MB FLSH 176QFP
DigiKey Programmable: Not Verified
Number of I/O: 152
Supplier Device Package: 176-LQFP (24x24)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 82x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2.0625MB (2.0625M x 8)
Speed: 100MHz, 160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
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IPA093N06N3GXKSA1 IPA093N06N3GXKSA1 Infineon Technologies IPA093N06N3_Rev2+0.pdf?folderId=db3a30431441fb5d01148ca9f1be0e77&fileId=db3a3043284aacd8012882bf84115438 Description: MOSFET N-CH 60V 43A TO220-3-31
Packaging: Bulk
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 9.3mOhm @ 40A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 4V @ 34µA
Supplier Device Package: PG-TO220-3-31
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 48 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3900 pF @ 30 V
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CY7C1361C-100AXE CY7C1361C-100AXE Infineon Technologies Infineon-CY7C1361C_CY7C1363C_9-Mbit_(256_K_36_512_K_18)_Flow-Through_SRAM-DataSheet-v22_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebdc53d30a8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fil Description: IC SRAM 9MBIT PAR 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 8.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
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CY7C1360C-166BZC CY7C1360C-166BZC Infineon Technologies download Description: IC SRAM 9MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
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CY7C1367A-150AJC CY7C1367A-150AJC Infineon Technologies CY7C1366A_67A.pdf Description: IC SRAM 9MBIT 150MHZ 100LQFP
Packaging: Bag
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 150 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512K x 18
DigiKey Programmable: Not Verified
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CY7C1361KVE33-133AXI CY7C1361KVE33-133AXI Infineon Technologies Infineon-CY7C1361KVE33-133AXI-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee26c1468ee&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 9MBIT PARALLEL 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 133 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 6.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
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IPQC65R017CFD7AXTMA1 IPQC65R017CFD7AXTMA1 Infineon Technologies Infineon-IPQC65R017CFD7A-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c869190210186cb925e3f33bd Description: AUTOMOTIVE_COOLMOS
Packaging: Tape & Reel (TR)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 136A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 61.6A, 10V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.08mA
Supplier Device Package: PG-HDSOP-22
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 236 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12338 pF @ 400 V
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IPQC65R017CFD7AXTMA1 IPQC65R017CFD7AXTMA1 Infineon Technologies Infineon-IPQC65R017CFD7A-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c869190210186cb925e3f33bd Description: AUTOMOTIVE_COOLMOS
Packaging: Cut Tape (CT)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 136A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 61.6A, 10V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.08mA
Supplier Device Package: PG-HDSOP-22
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 236 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12338 pF @ 400 V
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AIMBG75R090M1HXTMA1 AIMBG75R090M1HXTMA1 Infineon Technologies Description: AIMBG75R090M1HXTMA1
Current - Continuous Drain (Id) @ 25°C: 24A (Tj)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 542 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-TO263-7
Vgs(th) (Max) @ Id: 5.6V @ 2.6mA
Power Dissipation (Max): 128W (Tc)
Rds On (Max) @ Id, Vgs: 83mOhm @ 7.4A, 20V
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AIMBG75R090M1HXTMA1 AIMBG75R090M1HXTMA1 Infineon Technologies Description: AIMBG75R090M1HXTMA1
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Cut Tape (CT)
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 542 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-TO263-7
Vgs(th) (Max) @ Id: 5.6V @ 2.6mA
Power Dissipation (Max): 128W (Tc)
Rds On (Max) @ Id, Vgs: 83mOhm @ 7.4A, 20V
Current - Continuous Drain (Id) @ 25°C: 24A (Tj)
FET Type: N-Channel
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250+7.32 EUR
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AIMDQ75R090M1HXUMA1 AIMDQ75R090M1HXUMA1 Infineon Technologies Description: AIMDQ75R090M1HXUMA1
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 542 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-HDSOP-22
Vgs(th) (Max) @ Id: 5.6V @ 2.6mA
Power Dissipation (Max): 128W (Tc)
Rds On (Max) @ Id, Vgs: 83mOhm @ 7.4A, 20V
Current - Continuous Drain (Id) @ 25°C: 24A (Tj)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 22-PowerBSOP Module
Packaging: Tape & Reel (TR)
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AIMDQ75R090M1HXUMA1 AIMDQ75R090M1HXUMA1 Infineon Technologies Description: AIMDQ75R090M1HXUMA1
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 542 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-HDSOP-22
Vgs(th) (Max) @ Id: 5.6V @ 2.6mA
Power Dissipation (Max): 128W (Tc)
Rds On (Max) @ Id, Vgs: 83mOhm @ 7.4A, 20V
Current - Continuous Drain (Id) @ 25°C: 24A (Tj)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 22-PowerBSOP Module
Packaging: Cut Tape (CT)
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250+8.6 EUR
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IR2520DSTRPBF IR2520DSTRPBF Infineon Technologies ir2520d.pdf?fileId=5546d462533600a4015355c9af7e16e4 Description: IC BALLAST CNTRL 86KHZ 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 34kHz ~ 86kHz
Type: Ballast Controller
Operating Temperature: -25°C ~ 125°C
Voltage - Supply: 11.4V ~ 15.4V
Supplier Device Package: 8-SOIC
Dimming: No
Current - Supply: 10 mA
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CURSENSORPROGRAMMERTOBO1 CURSENSORPROGRAMMERTOBO1 Infineon Technologies PdfFile204455.pdf Description: CUR SENSOR PROGRAMMER
Packaging: Bulk
Interface: Analog
Contents: Board(s)
Voltage - Supply: 3.3V
Sensor Type: Current Sensor
Utilized IC / Part: TLE4972, TLI4971
Supplied Contents: Board(s)
Embedded: Yes, MCU
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CURSENSORPROGGEN2TOBO1 CURSENSORPROGGEN2TOBO1 Infineon Technologies Infineon-TLE4973_current_sensor_programmer_gen2-GettingStarted-v01_00-EN.pdf?fileId=8ac78c8c8ada5435018ae225bc6f5b53 Description: CUR SENSOR PROG GEN2
Packaging: Bulk
Contents: Board(s)
Sensor Type: Current Sensor
Utilized IC / Part: TLE4973
Embedded: No
Produkt ist nicht verfügbar
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TUA 6030 TUA 6030 Infineon Technologies TUA6030%2C32.pdf Description: IC VIDEO TUNER 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 4.5V ~ 5.5V
Applications: Consumer Video
Standards: NTSC, PAL
Supplier Device Package: PG-TSSOP-38
Control Interface: I2C
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SAF-XC866-1FRA AB SAF-XC866-1FRA AB Infineon Technologies Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t Description: IC MCU 8BIT 4KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 19
DigiKey Programmable: Not Verified
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SAF-C868-1SR BA SAF-C868-1SR BA Infineon Technologies DataSheetC868_BA_v1.0.pdf?folderId=db3a304412b407950112b419ecef2939&fileId=db3a304412b407950112b419ed3e293a Description: IC MCU 8BIT 8KB RAM 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: RAM
Core Processor: C800
Data Converters: A/D 5x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 18
DigiKey Programmable: Not Verified
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XMC1302T038X0064ABXUMA3 Infineon Technologies Description: IC MCU 32BIT 64KB 38TFSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-9
Number of I/O: 26
Produkt ist nicht verfügbar
 Mindestbestellmenge: 3000 Stücke
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SAF-C868P-1SR BA SAF-C868P-1SR BA Infineon Technologies DataSheetC868_BA_v1.0.pdf?folderId=db3a304412b407950112b419ecef2939&fileId=db3a304412b407950112b419ed3e293a Description: IC MCU 8BIT 8KB RAM 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: RAM
Core Processor: C800
Data Converters: A/D 5x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPBE65R190CFD7AATMA1 IPBE65R190CFD7AATMA1 Infineon Technologies Infineon-IPBE65R190CFD7A-DataSheet-v02_00-EN.pdf?fileId=5546d4627506bb3201751c53259942c6 Description: MOSFET N-CH 650V 14A TO263-7
Packaging: Bulk
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 6.4A, 10V
Power Dissipation (Max): 77W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 320µA
Supplier Device Package: PG-TO263-7-11
Grade: Automotive
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1291 pF @ 400 V
Qualification: AEC-Q101
auf Bestellung 9670 Stücke:
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IPT65R190CFD7XTMA1 IPT65R190CFD7XTMA1 Infineon Technologies Infineon-IPT65R190CFD7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c85ecb3470186794f257f78b6 Description: MOSFET N-CH 650V 8HSOF
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: PG-HSOF-8-2
Drain to Source Voltage (Vdss): 650 V
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ISP25DP06LMXTSA1 ISP25DP06LMXTSA1 Infineon Technologies Infineon-ISP25DP06LM-DS-v02_00-EN.pdf?fileId=5546d46269e1c019016a0727f4cd7396 Description: MOSFET P-CH 60V 1.9A SOT223-4
Rds On (Max) @ Id, Vgs: 250mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 13.9 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: PG-SOT223-4
Vgs(th) (Max) @ Id: 2V @ 270µA
Power Dissipation (Max): 1.8W (Ta), 5W (Tc)
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ISP25DP06LMXTSA1 ISP25DP06LMXTSA1 Infineon Technologies Infineon-ISP25DP06LM-DS-v02_00-EN.pdf?fileId=5546d46269e1c019016a0727f4cd7396 Description: MOSFET P-CH 60V 1.9A SOT223-4
Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 13.9 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: PG-SOT223-4
Vgs(th) (Max) @ Id: 2V @ 270µA
Power Dissipation (Max): 1.8W (Ta), 5W (Tc)
Rds On (Max) @ Id, Vgs: 250mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Cut Tape (CT)
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FF600R17ME4PB11BOSA1 FF600R17ME4PB11BOSA1 Infineon Technologies Infineon-FF600R17ME4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625d5945ed015d5fdf582a53b8 Description: IGBT MODULE 1700V 600A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 600A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 600 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 48 nF @ 25 V
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IRMCK311TY IRMCK311TY Infineon Technologies irmck311.pdf?fileId=5546d462533600a401535672bd5c2759 Description: IC MTRDRV 1.62-1.98/3-3.6V 64QFP
Voltage - Supply: 1.62V ~ 1.98V, 3V ~ 3.6V
Output Configuration: Pre-Driver - Half Bridge (6)
Operating Temperature: -40°C ~ 85°C (TA)
Interface: I2C, RS-232, SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Motor Type - AC, DC: AC, Synchronous
Supplier Device Package: 64-QFP (10x10)
Technology: Power MOSFET, IGBT
Applications: Appliance
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CG9026ATT Infineon Technologies Description: IC MEMORY
Packaging: Tape & Reel (TR)
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CG9026AT Infineon Technologies Description: IC MEMORY
Packaging: Tray
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CY8CTST200A-32LQXIT CY8CTST200A-32LQXIT Infineon Technologies CY8CTMG20x%2C%20CY8CTMG20xA%2C.pdf Description: IC MCU PSOC SINGLE-TOUCH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Controller Series: CY8CT
Program Memory Type: FLASH (32kB)
Applications: Touchscreen Controller
Core Processor: M8C
Supplier Device Package: 32-QFN
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY15B016Q-SXET CY15B016Q-SXET Infineon Technologies Infineon-CY15B016Q_16_KBIT_(2K_X_8)_SERIAL_(SPI)_AUTOMOTIVE-E_F-RAM-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee3f9176a99&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FRAM 16KBIT SPI 16MHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.65V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 16 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Grade: Automotive
Memory Interface: SPI
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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CY15B016Q-SXET CY15B016Q-SXET Infineon Technologies Infineon-CY15B016Q_16_KBIT_(2K_X_8)_SERIAL_(SPI)_AUTOMOTIVE-E_F-RAM-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee3f9176a99&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FRAM 16KBIT SPI 16MHZ 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.65V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 16 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Grade: Automotive
Memory Interface: SPI
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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25+3.75 EUR
50+3.67 EUR
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1000+3.3 EUR
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D5000U45X172XPSA1 D5000U45X172XPSA1 Infineon Technologies Description: HIGH POWER THYR / DIO
Packaging: Tray
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CY9AF010AQN-G-XXX-AVE2 Infineon Technologies Description: IC MCU
Packaging: Tray
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FS3L200R10W3S7FB11BPSA1 FS3L200R10W3S7FB11BPSA1 Infineon Technologies Infineon-FS3L200R10W3S7F_B11-DataSheet-v03_00-EN.pdf?fileId=5546d46271bf4f920172079cc70479ac Description: IGBT MODULE 950V 70A AG-EASY3B
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Level Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.55V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: AG-EASY3B
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 950 V
Current - Collector Cutoff (Max): 31 µA
Input Capacitance (Cies) @ Vce: 6.48 nF @ 25 V
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BGSA403ML10E6327XTSA1 BGSA403ML10E6327XTSA1 Infineon Technologies Infineon-BGSA403ML10-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7e7124d1017ef8c9beb25c34 Description: IC RF SW 4XSPST 7.125GHZ TSLP10
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 4 x SPST
Frequency Range: 400MHz ~ 7.125GHz
Supplier Device Package: PG-TSLP-10-3
Produkt ist nicht verfügbar
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BGSA403ML10E6327XTSA1 BGSA403ML10E6327XTSA1 Infineon Technologies Infineon-BGSA403ML10-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7e7124d1017ef8c9beb25c34 Description: IC RF SW 4XSPST 7.125GHZ TSLP10
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 4 x SPST
Frequency Range: 400MHz ~ 7.125GHz
Supplier Device Package: PG-TSLP-10-3
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19+1.12 EUR
25+1 EUR
100+0.86 EUR
250+0.79 EUR
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IRS21084SPBF IRS21084SPBF Infineon Technologies IRSDS08085-1.pdf?t.download=true&u=5oefqw description Description: IC GATE DRVR HALF-BRIDGE 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Inverting, Non-Inverting
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 14-SOIC
Rise / Fall Time (Typ): 100ns, 35ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
DigiKey Programmable: Not Verified
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BTS500071LUAAUMA1 BTS500071LUAAUMA1 Infineon Technologies Infineon-BTS50007-1LUA-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8afe5bd0018b1e92a4171dc1 Description: MULTICHIP PROFET & GD
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 700mOhm
Input Type: Non-Inverting
Voltage - Load: 3.1V ~ 28V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 28V
Current - Output (Max): 55A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-HSOF-8-5
Fault Protection: Open Load Detect, Over Load, Over Temperature, Reverse Battery, Short Circuit
Grade: Automotive
Qualification: AEC-Q100
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250+6.05 EUR
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IPI04N03LA IPI04N03LA Infineon Technologies IPI04N03LA%2C%20IPP04N03LA.pdf Description: MOSFET N-CH 25V 80A TO262-3
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 80A (Tc)
Rds On (Max) @ Id, Vgs: 4.2mOhm @ 55A, 10V
Power Dissipation (Max): 107W (Tc)
Vgs(th) (Max) @ Id: 2V @ 60µA
Supplier Device Package: PG-TO262-3
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3877 pF @ 15 V
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CY3280-CPM1 CY3280-CPM1 Infineon Technologies download Description: MODULE CAPSENSE PLUS
Packaging: Box
For Use With/Related Products: CY3280 Module Board
Accessory Type: Expansion Module
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CY7C4121KV13-633FCXI CY7C4121KV13-633FCXI Infineon Technologies Infineon-CY7C4121KV13_CY7C4141KV13_144-Mbit_QDR-IV_HP_SRAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec49bd53a19&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 144MBIT PAR 361FCBGA
Packaging: Tray
Package / Case: 361-BBGA, FCBGA
Mounting Type: Surface Mount
Memory Size: 144Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.26V ~ 1.34V
Technology: SRAM - Synchronous, QDR IV
Clock Frequency: 633 MHz
Memory Format: SRAM
Supplier Device Package: 361-FCBGA (21x21)
Memory Interface: Parallel
Memory Organization: 8M x 18
DigiKey Programmable: Not Verified
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IPB60R250CPATMA1 IPB60R250CP_rev2.1.pdf?folderId=db3a30431ff98815012019af55de3f2c&fileId=db3a304320896aa201208b2fd3ce0087
IPB60R250CPATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 600V 12A TO263-3
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 12A (Tc)
Rds On (Max) @ Id, Vgs: 250mOhm @ 7.8A, 10V
Power Dissipation (Max): 104W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 440µA
Supplier Device Package: PG-TO263-3-2
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 35 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1200 pF @ 100 V
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BSP603S2LHUMA1 Infineon-BSP603S2L-DS-v01_01-en.pdf?fileId=db3a30431a47d73d011a49742afe014f&ack=t
BSP603S2LHUMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 5.2A SOT223-4
Input Capacitance (Ciss) (Max) @ Vds: 1390 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 42 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: PG-SOT223-4
Vgs(th) (Max) @ Id: 2V @ 50µA
Power Dissipation (Max): 1.8W (Ta)
Rds On (Max) @ Id, Vgs: 33mOhm @ 2.6A, 10V
Current - Continuous Drain (Id) @ 25°C: 5.2A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Grade: Automotive
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S25FL064LABBHA020 INFN-S-A0017271261-1.pdf
S25FL064LABBHA020
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 24BGA
Grade: Automotive
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O, QPI
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S25FL064LABBHA023 INFN-S-A0017271261-1.pdf
S25FL064LABBHA023
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 24BGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O, QPI
Grade: Automotive
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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S25FL064LABBHB020 INFN-S-A0017271261-1.pdf
S25FL064LABBHB020
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 24BGA
Qualification: AEC-Q100
DigiKey Programmable: Not Verified
Memory Organization: 8M x 8
Memory Interface: SPI - Quad I/O, QPI
Grade: Automotive
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 108 MHz
Technology: FLASH - NOR
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 64Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
Produkt ist nicht verfügbar
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IRS2530DPBF description irs2530d.pdf?fileId=5546d462533600a40153567af4f52821
IRS2530DPBF
Hersteller: Infineon Technologies
Description: IC BALLAST CNTRL 115KHZ 8DIP
Type: Ballast Controller
Frequency: 34.2kHz ~ 115kHz
Mounting Type: Through Hole
Package / Case: 8-DIP (0.300", 7.62mm)
Packaging: Tube
Current - Supply: 5 mA
Dimming: Yes
Supplier Device Package: 8-PDIP
Voltage - Supply: 11.5V ~ 16.6V
Operating Temperature: -40°C ~ 125°C
Produkt ist nicht verfügbar
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BTS244ZE3062AATMA2 INFNS27930-1.pdf?t.download=true&u=5oefqw
BTS244ZE3062AATMA2
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 35A TO263-5
Qualification: AEC-Q101
Grade: Automotive
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-5, D2PAK (4 Leads + Tab), TO-263BB
Packaging: Bulk
Input Capacitance (Ciss) (Max) @ Vds: 2660 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 130 nC @ 10 V
Drain to Source Voltage (Vdss): 55 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: PG-TO263-5-2
Vgs(th) (Max) @ Id: 2V @ 130µA
Power Dissipation (Max): 170W (Tc)
FET Feature: Temperature Sensing Diode
Rds On (Max) @ Id, Vgs: 13mOhm @ 19A, 10V
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104+5.34 EUR
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SAK-TC275TP-64F200N DC Infineon-TC27xDC-DataSheet-v01_00-EN.pdf?fileId=5546d462694c98b4016953972c57046a
SAK-TC275TP-64F200N DC
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 200MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 472K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 48x12b SAR, Sigma-Delta
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 1.17V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-22
Number of I/O: 169
DigiKey Programmable: Not Verified
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MMBTA92LT1 description smbta92-mmbta92.pdf?folderId=db3a30431441fb5d011449af3ad90232&fileId=db3a30431441fb5d011449c5cd03023b
MMBTA92LT1
Hersteller: Infineon Technologies
Description: TRANS PNP 300V 0.5A PG-SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 2mA, 20mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 30mA, 10V
Frequency - Transition: 50MHz
Supplier Device Package: PG-SOT23
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 360 mW
Produkt ist nicht verfügbar
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MMBTA92LT1 description smbta92-mmbta92.pdf?folderId=db3a30431441fb5d011449af3ad90232&fileId=db3a30431441fb5d011449c5cd03023b
MMBTA92LT1
Hersteller: Infineon Technologies
Description: TRANS PNP 300V 0.5A PG-SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: PNP
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 500mV @ 2mA, 20mA
Current - Collector Cutoff (Max): 100nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 25 @ 30mA, 10V
Frequency - Transition: 50MHz
Supplier Device Package: PG-SOT23
Current - Collector (Ic) (Max): 500 mA
Voltage - Collector Emitter Breakdown (Max): 300 V
Power - Max: 360 mW
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7059+0.074 EUR
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CY24271ZXC download
CY24271ZXC
Hersteller: Infineon Technologies
Description: IC CLOCK GENERATOR 28TSSOP
Packaging: Tube
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 1.067MHz
Type: Clock Generator, Fanout Distribution
Input: Clock
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 2.375V ~ 2.625V
Ratio - Input:Output: 1:4
Differential - Input:Output: Yes/Yes
Supplier Device Package: 28-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: No/Yes
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY24270ZXC
Hersteller: Infineon Technologies
Description: IC CLOCK MEDIACLOCK 28-TSSOP
Packaging: Tube
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TLF42772EPXUMA1 Infineon-TLF4277-2EP-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8779172a01879f897ec10936
TLF42772EPXUMA1
Hersteller: Infineon Technologies
Description: OPTIREG LINEAR
Packaging: Tape & Reel (TR)
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3000+2.2 EUR
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TLF42772EPXUMA1 Infineon-TLF4277-2EP-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8779172a01879f897ec10936
TLF42772EPXUMA1
Hersteller: Infineon Technologies
Description: OPTIREG LINEAR
Packaging: Cut Tape (CT)
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5+4.8 EUR
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25+4.07 EUR
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CY8C21634B-24LTXI download
CY8C21634B-24LTXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 28x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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12+1.87 EUR
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64-9146 DirectFET%20MOSFET%204Ps%20Checklist.pdf
64-9146
Hersteller: Infineon Technologies
Description: MOSFET N-CH 20V 32A DIRECTFET
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric MT
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 32A (Ta), 180A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 15A, 10V
Power Dissipation (Max): 2.8W (Ta), 89W (Tc)
Vgs(th) (Max) @ Id: 2.5V @ 250µA
Supplier Device Package: DIRECTFET™ MT
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±12V
Drain to Source Voltage (Vdss): 20 V
Gate Charge (Qg) (Max) @ Vgs: 71 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 6580 pF @ 10 V
Produkt ist nicht verfügbar
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PVI5050NSPBF Infineon-PVI1050N-DS-v01_00-EN.pdf?fileId=5546d462602a9dc801607b6ff00c5cca
PVI5050NSPBF
Hersteller: Infineon Technologies
Description: OPTOISOLTR 4KV 1CH PHVOLT 8-SMD
Packaging: Tube
Package / Case: 8-SMD, Gull Wing, 4 Leads
Output Type: Photovoltaic
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 85°C
Input Type: DC
Current - Output / Channel: 5µA
Voltage - Isolation: 4000Vrms
Supplier Device Package: 8-SMD
Voltage - Output (Max): 5V
Turn On / Turn Off Time (Typ): 300µs, 220µs (Max)
Number of Channels: 1
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2+11.73 EUR
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100+7.12 EUR
500+6.38 EUR
1000+6.14 EUR
2000+5.94 EUR
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CYPD3174-24LQXQT Infineon-EZ-PD(TM)_CCG3PA_Datasheet_USB_Type-C_Port_Controller-DataSheet-v08_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee438366ac0&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CYPD3174-24LQXQT
Hersteller: Infineon Technologies
Description: IC USB TYPE-C CONTROLLER 24QFN
Packaging: Cut Tape (CT)
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 3V ~ 24.5V
Program Memory Type: FLASH (64kB)
Applications: USB Type C
Core Processor: ARM® Cortex®-M0
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 12
DigiKey Programmable: Not Verified
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FF2000UXTR33T2M1BPSA1 Infineon-FF2600UXTR33T2M1-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8fc2dd9c018fe3442aa75dc7
FF2000UXTR33T2M1BPSA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 3300V 9AG-XHP2K33
Packaging: Box
Package / Case: Module
Mounting Type: Chassis Mount
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Drain to Source Voltage (Vdss): 3300V (3.3kV)
Current - Continuous Drain (Id) @ 25°C: 925A (Tc)
Input Capacitance (Ciss) (Max) @ Vds: 203000pF @ 1.8kV
Rds On (Max) @ Id, Vgs: 2.4mOhm @ 1kA, 15V
Gate Charge (Qg) (Max) @ Vgs: 5000nC @ 15V
Vgs(th) (Max) @ Id: 5.55V @ 900mA
Supplier Device Package: AG-XHP2K33
auf Bestellung 1 Stücke:
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1+13958.55 EUR
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CYT2B98BACQ0AZEGS Infineon-CYT2B9_Datasheet_32-bit_Arm_Cortex-M4F_Microcontroller_TRAVEO_T2G_Family-AdditionalTechnicalInformation-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9c191729c
CYT2B98BACQ0AZEGS
Hersteller: Infineon Technologies
Description: IC MCU 32BT 2.0625MB FLSH 176QFP
DigiKey Programmable: Not Verified
Number of I/O: 152
Supplier Device Package: 176-LQFP (24x24)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 82x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2.0625MB (2.0625M x 8)
Speed: 100MHz, 160MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP
Packaging: Tray
auf Bestellung 400 Stücke:
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AnzahlPrivatkunde
1+23.37 EUR
10+17.95 EUR
25+17.53 EUR
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IPA093N06N3GXKSA1 IPA093N06N3_Rev2+0.pdf?folderId=db3a30431441fb5d01148ca9f1be0e77&fileId=db3a3043284aacd8012882bf84115438
IPA093N06N3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 43A TO220-3-31
Packaging: Bulk
Package / Case: TO-220-3 Full Pack
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 43A (Tc)
Rds On (Max) @ Id, Vgs: 9.3mOhm @ 40A, 10V
Power Dissipation (Max): 33W (Tc)
Vgs(th) (Max) @ Id: 4V @ 34µA
Supplier Device Package: PG-TO220-3-31
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 48 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3900 pF @ 30 V
auf Bestellung 950 Stücke:
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AnzahlPrivatkunde
343+1.62 EUR
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CY7C1361C-100AXE Infineon-CY7C1361C_CY7C1363C_9-Mbit_(256_K_36_512_K_18)_Flow-Through_SRAM-DataSheet-v22_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebdc53d30a8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fil
CY7C1361C-100AXE
Hersteller: Infineon Technologies
Description: IC SRAM 9MBIT PAR 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 100 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 8.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
auf Bestellung 679 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+16.09 EUR
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CY7C1360C-166BZC download
CY7C1360C-166BZC
Hersteller: Infineon Technologies
Description: IC SRAM 9MBIT PARALLEL 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1367A-150AJC CY7C1366A_67A.pdf
CY7C1367A-150AJC
Hersteller: Infineon Technologies
Description: IC SRAM 9MBIT 150MHZ 100LQFP
Packaging: Bag
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 150 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 512K x 18
DigiKey Programmable: Not Verified
auf Bestellung 1896 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
45+12.77 EUR
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CY7C1361KVE33-133AXI Infineon-CY7C1361KVE33-133AXI-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee26c1468ee&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY7C1361KVE33-133AXI
Hersteller: Infineon Technologies
Description: IC SRAM 9MBIT PARALLEL 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 9Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 133 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 6.5 ns
Memory Organization: 256K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPQC65R017CFD7AXTMA1 Infineon-IPQC65R017CFD7A-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c869190210186cb925e3f33bd
IPQC65R017CFD7AXTMA1
Hersteller: Infineon Technologies
Description: AUTOMOTIVE_COOLMOS
Packaging: Tape & Reel (TR)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 136A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 61.6A, 10V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.08mA
Supplier Device Package: PG-HDSOP-22
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 236 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12338 pF @ 400 V
auf Bestellung 550 Stücke:
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IPQC65R017CFD7AXTMA1 Infineon-IPQC65R017CFD7A-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c869190210186cb925e3f33bd
IPQC65R017CFD7AXTMA1
Hersteller: Infineon Technologies
Description: AUTOMOTIVE_COOLMOS
Packaging: Cut Tape (CT)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 136A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 61.6A, 10V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.08mA
Supplier Device Package: PG-HDSOP-22
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 236 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 12338 pF @ 400 V
auf Bestellung 623 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+35 EUR
10+27.86 EUR
25+26.07 EUR
100+24.36 EUR
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AIMBG75R090M1HXTMA1
AIMBG75R090M1HXTMA1
Hersteller: Infineon Technologies
Description: AIMBG75R090M1HXTMA1
Current - Continuous Drain (Id) @ 25°C: 24A (Tj)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Tape & Reel (TR)
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 542 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-TO263-7
Vgs(th) (Max) @ Id: 5.6V @ 2.6mA
Power Dissipation (Max): 128W (Tc)
Rds On (Max) @ Id, Vgs: 83mOhm @ 7.4A, 20V
Produkt ist nicht verfügbar
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AIMBG75R090M1HXTMA1
AIMBG75R090M1HXTMA1
Hersteller: Infineon Technologies
Description: AIMBG75R090M1HXTMA1
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Cut Tape (CT)
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 542 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-TO263-7
Vgs(th) (Max) @ Id: 5.6V @ 2.6mA
Power Dissipation (Max): 128W (Tc)
Rds On (Max) @ Id, Vgs: 83mOhm @ 7.4A, 20V
Current - Continuous Drain (Id) @ 25°C: 24A (Tj)
FET Type: N-Channel
auf Bestellung 980 Stücke:
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2+11.94 EUR
10+9.14 EUR
25+8.45 EUR
100+7.69 EUR
250+7.32 EUR
500+7.09 EUR
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AIMDQ75R090M1HXUMA1
AIMDQ75R090M1HXUMA1
Hersteller: Infineon Technologies
Description: AIMDQ75R090M1HXUMA1
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 542 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-HDSOP-22
Vgs(th) (Max) @ Id: 5.6V @ 2.6mA
Power Dissipation (Max): 128W (Tc)
Rds On (Max) @ Id, Vgs: 83mOhm @ 7.4A, 20V
Current - Continuous Drain (Id) @ 25°C: 24A (Tj)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 22-PowerBSOP Module
Packaging: Tape & Reel (TR)
auf Bestellung 750 Stücke:
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AnzahlPrivatkunde
750+8.16 EUR
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AIMDQ75R090M1HXUMA1
AIMDQ75R090M1HXUMA1
Hersteller: Infineon Technologies
Description: AIMDQ75R090M1HXUMA1
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 542 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-HDSOP-22
Vgs(th) (Max) @ Id: 5.6V @ 2.6mA
Power Dissipation (Max): 128W (Tc)
Rds On (Max) @ Id, Vgs: 83mOhm @ 7.4A, 20V
Current - Continuous Drain (Id) @ 25°C: 24A (Tj)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 22-PowerBSOP Module
Packaging: Cut Tape (CT)
auf Bestellung 750 Stücke:
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AnzahlPrivatkunde
2+14.83 EUR
10+11.07 EUR
25+10.13 EUR
100+9.09 EUR
250+8.6 EUR
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IR2520DSTRPBF ir2520d.pdf?fileId=5546d462533600a4015355c9af7e16e4
IR2520DSTRPBF
Hersteller: Infineon Technologies
Description: IC BALLAST CNTRL 86KHZ 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Frequency: 34kHz ~ 86kHz
Type: Ballast Controller
Operating Temperature: -25°C ~ 125°C
Voltage - Supply: 11.4V ~ 15.4V
Supplier Device Package: 8-SOIC
Dimming: No
Current - Supply: 10 mA
auf Bestellung 3439 Stücke:
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AnzahlPrivatkunde
169+3.19 EUR
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CURSENSORPROGRAMMERTOBO1 PdfFile204455.pdf
CURSENSORPROGRAMMERTOBO1
Hersteller: Infineon Technologies
Description: CUR SENSOR PROGRAMMER
Packaging: Bulk
Interface: Analog
Contents: Board(s)
Voltage - Supply: 3.3V
Sensor Type: Current Sensor
Utilized IC / Part: TLE4972, TLI4971
Supplied Contents: Board(s)
Embedded: Yes, MCU
auf Bestellung 2 Stücke:
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CURSENSORPROGGEN2TOBO1 Infineon-TLE4973_current_sensor_programmer_gen2-GettingStarted-v01_00-EN.pdf?fileId=8ac78c8c8ada5435018ae225bc6f5b53
CURSENSORPROGGEN2TOBO1
Hersteller: Infineon Technologies
Description: CUR SENSOR PROG GEN2
Packaging: Bulk
Contents: Board(s)
Sensor Type: Current Sensor
Utilized IC / Part: TLE4973
Embedded: No
Produkt ist nicht verfügbar
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TUA 6030 TUA6030%2C32.pdf
TUA 6030
Hersteller: Infineon Technologies
Description: IC VIDEO TUNER 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Function: Tuner
Voltage - Supply: 4.5V ~ 5.5V
Applications: Consumer Video
Standards: NTSC, PAL
Supplier Device Package: PG-TSSOP-38
Control Interface: I2C
Produkt ist nicht verfügbar
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SAF-XC866-1FRA AB Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t
SAF-XC866-1FRA AB
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 4KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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SAF-C868-1SR BA DataSheetC868_BA_v1.0.pdf?folderId=db3a304412b407950112b419ecef2939&fileId=db3a304412b407950112b419ed3e293a
SAF-C868-1SR BA
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB RAM 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: RAM
Core Processor: C800
Data Converters: A/D 5x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC1302T038X0064ABXUMA3
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB 38TFSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-9
Number of I/O: 26
Produkt ist nicht verfügbar
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SAF-C868P-1SR BA DataSheetC868_BA_v1.0.pdf?folderId=db3a304412b407950112b419ecef2939&fileId=db3a304412b407950112b419ed3e293a
SAF-C868P-1SR BA
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB RAM 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: RAM
Core Processor: C800
Data Converters: A/D 5x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: UART/USART
Peripherals: Brown-out Detect/Reset, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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IPBE65R190CFD7AATMA1 Infineon-IPBE65R190CFD7A-DataSheet-v02_00-EN.pdf?fileId=5546d4627506bb3201751c53259942c6
IPBE65R190CFD7AATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 14A TO263-7
Packaging: Bulk
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14A (Tc)
Rds On (Max) @ Id, Vgs: 190mOhm @ 6.4A, 10V
Power Dissipation (Max): 77W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 320µA
Supplier Device Package: PG-TO263-7-11
Grade: Automotive
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 7 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1291 pF @ 400 V
Qualification: AEC-Q101
auf Bestellung 9670 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
140+3.93 EUR
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IPT65R190CFD7XTMA1 Infineon-IPT65R190CFD7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c85ecb3470186794f257f78b6
IPT65R190CFD7XTMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 8HSOF
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: PG-HSOF-8-2
Drain to Source Voltage (Vdss): 650 V
auf Bestellung 1140 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.6 EUR
10+4.99 EUR
100+3.5 EUR
500+2.9 EUR
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ISP25DP06LMXTSA1 Infineon-ISP25DP06LM-DS-v02_00-EN.pdf?fileId=5546d46269e1c019016a0727f4cd7396
ISP25DP06LMXTSA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V 1.9A SOT223-4
Rds On (Max) @ Id, Vgs: 250mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 13.9 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: PG-SOT223-4
Vgs(th) (Max) @ Id: 2V @ 270µA
Power Dissipation (Max): 1.8W (Ta), 5W (Tc)
auf Bestellung 1000 Stücke:
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1000+0.67 EUR
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ISP25DP06LMXTSA1 Infineon-ISP25DP06LM-DS-v02_00-EN.pdf?fileId=5546d46269e1c019016a0727f4cd7396
ISP25DP06LMXTSA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V 1.9A SOT223-4
Input Capacitance (Ciss) (Max) @ Vds: 420 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 13.9 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Supplier Device Package: PG-SOT223-4
Vgs(th) (Max) @ Id: 2V @ 270µA
Power Dissipation (Max): 1.8W (Ta), 5W (Tc)
Rds On (Max) @ Id, Vgs: 250mOhm @ 1.9A, 10V
Current - Continuous Drain (Id) @ 25°C: 1.9A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-261-4, TO-261AA
Packaging: Cut Tape (CT)
auf Bestellung 1229 Stücke:
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15+1.44 EUR
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FF600R17ME4PB11BOSA1 Infineon-FF600R17ME4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625d5945ed015d5fdf582a53b8
FF600R17ME4PB11BOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 600A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Half Bridge Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 600A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 600 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 48 nF @ 25 V
auf Bestellung 321 Stücke:
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IRMCK311TY irmck311.pdf?fileId=5546d462533600a401535672bd5c2759
IRMCK311TY
Hersteller: Infineon Technologies
Description: IC MTRDRV 1.62-1.98/3-3.6V 64QFP
Voltage - Supply: 1.62V ~ 1.98V, 3V ~ 3.6V
Output Configuration: Pre-Driver - Half Bridge (6)
Operating Temperature: -40°C ~ 85°C (TA)
Interface: I2C, RS-232, SPI
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 64-LQFP
Packaging: Tray
Motor Type - AC, DC: AC, Synchronous
Supplier Device Package: 64-QFP (10x10)
Technology: Power MOSFET, IGBT
Applications: Appliance
Produkt ist nicht verfügbar
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CG9026ATT
Hersteller: Infineon Technologies
Description: IC MEMORY
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CG9026AT
Hersteller: Infineon Technologies
Description: IC MEMORY
Packaging: Tray
Produkt ist nicht verfügbar
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CY8CTST200A-32LQXIT CY8CTMG20x%2C%20CY8CTMG20xA%2C.pdf
CY8CTST200A-32LQXIT
Hersteller: Infineon Technologies
Description: IC MCU PSOC SINGLE-TOUCH 32QFN
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, SPI, UART/USART, USB
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V
Controller Series: CY8CT
Program Memory Type: FLASH (32kB)
Applications: Touchscreen Controller
Core Processor: M8C
Supplier Device Package: 32-QFN
Number of I/O: 28
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY15B016Q-SXET Infineon-CY15B016Q_16_KBIT_(2K_X_8)_SERIAL_(SPI)_AUTOMOTIVE-E_F-RAM-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee3f9176a99&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY15B016Q-SXET
Hersteller: Infineon Technologies
Description: IC FRAM 16KBIT SPI 16MHZ 8SOIC
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.65V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 16 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Grade: Automotive
Memory Interface: SPI
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 7500 Stücke:
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2500+3.46 EUR
5000+3.38 EUR
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CY15B016Q-SXET Infineon-CY15B016Q_16_KBIT_(2K_X_8)_SERIAL_(SPI)_AUTOMOTIVE-E_F-RAM-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee3f9176a99&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY15B016Q-SXET
Hersteller: Infineon Technologies
Description: IC FRAM 16KBIT SPI 16MHZ 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Memory Size: 16Kbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.65V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 16 MHz
Memory Format: FRAM
Supplier Device Package: 8-SOIC
Grade: Automotive
Memory Interface: SPI
Memory Organization: 2K x 8
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
auf Bestellung 7793 Stücke:
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6+4.13 EUR
10+3.86 EUR
25+3.75 EUR
50+3.67 EUR
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250+3.46 EUR
500+3.38 EUR
1000+3.3 EUR
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D5000U45X172XPSA1
D5000U45X172XPSA1
Hersteller: Infineon Technologies
Description: HIGH POWER THYR / DIO
Packaging: Tray
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CY9AF010AQN-G-XXX-AVE2
Hersteller: Infineon Technologies
Description: IC MCU
Packaging: Tray
Produkt ist nicht verfügbar
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FS3L200R10W3S7FB11BPSA1 Infineon-FS3L200R10W3S7F_B11-DataSheet-v03_00-EN.pdf?fileId=5546d46271bf4f920172079cc70479ac
FS3L200R10W3S7FB11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 950V 70A AG-EASY3B
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Level Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.55V @ 15V, 25A
NTC Thermistor: Yes
Supplier Device Package: AG-EASY3B
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 950 V
Current - Collector Cutoff (Max): 31 µA
Input Capacitance (Cies) @ Vce: 6.48 nF @ 25 V
auf Bestellung 3 Stücke:
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2+257.19 EUR
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BGSA403ML10E6327XTSA1 Infineon-BGSA403ML10-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7e7124d1017ef8c9beb25c34
BGSA403ML10E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SW 4XSPST 7.125GHZ TSLP10
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 4 x SPST
Frequency Range: 400MHz ~ 7.125GHz
Supplier Device Package: PG-TSLP-10-3
Produkt ist nicht verfügbar
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BGSA403ML10E6327XTSA1 Infineon-BGSA403ML10-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7e7124d1017ef8c9beb25c34
BGSA403ML10E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SW 4XSPST 7.125GHZ TSLP10
Packaging: Cut Tape (CT)
Package / Case: 10-XFQFN
Mounting Type: Surface Mount
Circuit: 4 x SPST
Frequency Range: 400MHz ~ 7.125GHz
Supplier Device Package: PG-TSLP-10-3
auf Bestellung 4750 Stücke:
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15+1.46 EUR
19+1.12 EUR
25+1 EUR
100+0.86 EUR
250+0.79 EUR
500+0.73 EUR
1000+0.69 EUR
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IRS21084SPBF description IRSDS08085-1.pdf?t.download=true&u=5oefqw
IRS21084SPBF
Hersteller: Infineon Technologies
Description: IC GATE DRVR HALF-BRIDGE 14SOIC
Packaging: Tube
Package / Case: 14-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 10V ~ 20V
Input Type: Inverting, Non-Inverting
High Side Voltage - Max (Bootstrap): 600 V
Supplier Device Package: 14-SOIC
Rise / Fall Time (Typ): 100ns, 35ns
Channel Type: Independent
Driven Configuration: Half-Bridge
Number of Drivers: 2
Gate Type: IGBT, MOSFET (N-Channel)
Logic Voltage - VIL, VIH: 0.8V, 2.5V
Current - Peak Output (Source, Sink): 290mA, 600mA
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTS500071LUAAUMA1 Infineon-BTS50007-1LUA-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8afe5bd0018b1e92a4171dc1
BTS500071LUAAUMA1
Hersteller: Infineon Technologies
Description: MULTICHIP PROFET & GD
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Switch Type: General Purpose
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: High Side
Rds On (Typ): 700mOhm
Input Type: Non-Inverting
Voltage - Load: 3.1V ~ 28V
Voltage - Supply (Vcc/Vdd): 3.1V ~ 28V
Current - Output (Max): 55A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-HSOF-8-5
Fault Protection: Open Load Detect, Over Load, Over Temperature, Reverse Battery, Short Circuit
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 3336 Stücke:
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3+9.92 EUR
10+7.58 EUR
25+7 EUR
100+6.35 EUR
250+6.05 EUR
500+5.85 EUR
1000+5.71 EUR
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IPI04N03LA IPI04N03LA%2C%20IPP04N03LA.pdf
IPI04N03LA
Hersteller: Infineon Technologies
Description: MOSFET N-CH 25V 80A TO262-3
Packaging: Tube
Package / Case: TO-262-3 Long Leads, I2PAK, TO-262AA
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 80A (Tc)
Rds On (Max) @ Id, Vgs: 4.2mOhm @ 55A, 10V
Power Dissipation (Max): 107W (Tc)
Vgs(th) (Max) @ Id: 2V @ 60µA
Supplier Device Package: PG-TO262-3
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 5 V
Input Capacitance (Ciss) (Max) @ Vds: 3877 pF @ 15 V
auf Bestellung 836 Stücke:
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461+1.17 EUR
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CY3280-CPM1 download
CY3280-CPM1
Hersteller: Infineon Technologies
Description: MODULE CAPSENSE PLUS
Packaging: Box
For Use With/Related Products: CY3280 Module Board
Accessory Type: Expansion Module
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1+170.17 EUR
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CY7C4121KV13-633FCXI Infineon-CY7C4121KV13_CY7C4141KV13_144-Mbit_QDR-IV_HP_SRAM-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec49bd53a19&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY7C4121KV13-633FCXI
Hersteller: Infineon Technologies
Description: IC SRAM 144MBIT PAR 361FCBGA
Packaging: Tray
Package / Case: 361-BBGA, FCBGA
Mounting Type: Surface Mount
Memory Size: 144Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.26V ~ 1.34V
Technology: SRAM - Synchronous, QDR IV
Clock Frequency: 633 MHz
Memory Format: SRAM
Supplier Device Package: 361-FCBGA (21x21)
Memory Interface: Parallel
Memory Organization: 8M x 18
DigiKey Programmable: Not Verified
auf Bestellung 61 Stücke:
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