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BGA7M1N6E6327XTSA1 BGA7M1N6E6327XTSA1 Infineon Technologies Infineon-BGA7M1N6-DS-v03_01-en.pdf?fileId=db3a304344e406b50144e46550b502d7 Description: IC AMP LTE 1.8GHZ-2.2GHZ TSNP6
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.3V
Gain: 13dB
Current - Supply: 4.4mA
Noise Figure: 0.6dB
P1dB: -7dBm
Supplier Device Package: PG-TSNP-6-2
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BGA777L7E6327XTSA1 BGA777L7E6327XTSA1 Infineon Technologies BGA777L7.pdf Description: IC AMP UMTS 2.3/2.7GHZ TSLP7-1
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz, 2.7GHz
RF Type: UMTS
Voltage - Supply: 2.6V ~ 3V
Gain: 16.8dB
Current - Supply: 10mA
Noise Figure: 1.2dB
P1dB: -11dBm
Test Frequency: 2.3GHz
Supplier Device Package: PG-TSLP-7-1
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BGA 700L16 E6327 BGA 700L16 E6327 Infineon Technologies BGA700L16_PB.pdf Description: IC AMP GSM 500MHZ-6GHZ TSLP7-1
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 500MHz ~ 6GHz
RF Type: GSM, DCS, PCS
Voltage - Supply: 2.75V
Gain: 17.5dB
Noise Figure: 0.95dB
P1dB: -20dBm
Test Frequency: 1.575GHz
Supplier Device Package: PG-TSLP-7-1
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IPTA60R180CM8XTMA1 IPTA60R180CM8XTMA1 Infineon Technologies Description: IPTA60R180CM8XTMA1
Packaging: Tape & Reel (TR)
Package / Case: 4-PowerLSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tj)
Rds On (Max) @ Id, Vgs: 180mOhm @ 5.6A, 10V
Power Dissipation (Max): 119W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 140µA
Supplier Device Package: PG-LHSOF-4-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 743 pF @ 400 V
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IPTA60R180CM8XTMA1 IPTA60R180CM8XTMA1 Infineon Technologies Description: IPTA60R180CM8XTMA1
Packaging: Cut Tape (CT)
Package / Case: 4-PowerLSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tj)
Rds On (Max) @ Id, Vgs: 180mOhm @ 5.6A, 10V
Power Dissipation (Max): 119W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 140µA
Supplier Device Package: PG-LHSOF-4-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 743 pF @ 400 V
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CY8C4128LQI-BL543 CY8C4128LQI-BL543 Infineon Technologies Infineon-PSoC_4_PSoC_4100_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5e6f46dbe&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fi Description: IC RF TXRX+MCU BLE 56QFN
Packaging: Tray
Package / Case: 56-UFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 8kB ROM, 32kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Power - Output: 3dBm
Protocol: Bluetooth v4.2
Current - Receiving: 16.4mA ~ 21.5mA
Data Rate (Max): 8Mbps
Current - Transmitting: 12.5mA ~ 20mA
Supplier Device Package: 56-QFN (7x7)
GPIO: 36
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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CY8C4248FNI-BL573T CY8C4248FNI-BL573T Infineon Technologies Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd Description: IC MCU 32BIT 256KB FLASH 76WLCSP
Packaging: Cut Tape (CT)
Package / Case: 76-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b; D/A 1x7b, 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA , LVD, POR, PWM, SmartCard, SmartSense, WDT
Supplier Device Package: 76-WLCSP (4.04x3.87)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IRF6712STRPBF IRF6712STRPBF Infineon Technologies irf6712spbf.pdf?fileId=5546d462533600a4015355ecf4331a7c Description: MOSFET N-CH 25V 17A DIRECTFET
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric SQ
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Ta), 68A (Tc)
Rds On (Max) @ Id, Vgs: 4.9mOhm @ 17A, 10V
Power Dissipation (Max): 2.2W (Ta), 36W (Tc)
Vgs(th) (Max) @ Id: 2.4V @ 50µA
Supplier Device Package: DIRECTFET™ SQ
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 18 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1570 pF @ 13 V
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DZ800S17K3HOSA1 DZ800S17K3HOSA1 Infineon Technologies Infineon-DZ800S17K3-DS-v02_02-en_de.pdf?fileId=db3a304317a748360117c9d5c27b2974 Description: DIODE MODULE GP 1700V AG62MM-2
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Supplier Device Package: AG-62MM-2
Operating Temperature - Junction: -40°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 800 A
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56DN06B02ELEMXPSA1 56DN06B02ELEMXPSA1 Infineon Technologies Infineon-56DN06B02-DataSheet-v03_01-EN.pdf?fileId=5546d4627506bb320175079eeb79038e Description: DIODE STD 600V 11140A EEUPEC0
Packaging: Bulk
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 11140A
Supplier Device Package: E-EUPEC-0
Operating Temperature - Junction: 180°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 940 mV @ 8000 A
Current - Reverse Leakage @ Vr: 60 mA @ 600 V
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CY8C3665LTI-044 CY8C3665LTI-044 Infineon Technologies #!?fileId=8ac78c8c7d0d8da4017d0ec73d263e88 Description: IC MCU 8BIT 32KB FLASH 68QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 68-QFN (8x8)
Peripherals: CapSense, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b; D/A 4x8b
Core Processor: 8051
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 67MHz
Mounting Type: Surface Mount
Package / Case: 68-VFQFN Exposed Pad
Packaging: Tray
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80+16.83 EUR
260+15.94 EUR
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BAS21E6433HTMA1 BAS21E6433HTMA1 Infineon Technologies bas21series.pdf?folderId=db3a30431400ef6801141b5844e103ea&fileId=db3a30431400ef6801141bed353f040f Description: DIODE GEN PURP 200V 250MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: PG-SOT23
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
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BC849CE6327HTSA1 BC849CE6327HTSA1 Infineon Technologies bc846%2Cbc847%2Cbc848%2Cbc849%2Cbc850.pdf Description: TRANS NPN 30V 0.1A PG-SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SOT23
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 330 mW
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KIT2K5WCCMTOLLTOBO1 KIT2K5WCCMTOLLTOBO1 Infineon Technologies Infineon-General_description_evaluation_kit_KIT_2K5W_CCM_TOLL-ATI-v01_00-EN.pdf?fileId=5546d462602a9dc80160452044a718a7 Description: TO LEADLESS ADAPTER
Packaging: Bulk
Accessory Type: Upgrade Kit
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REF3K3WTPSICTOLLTOBO1 REF3K3WTPSICTOLLTOBO1 Infineon Technologies Description: REF3K3WTPSICTOLLTOBO1
Packaging: Box
Function: Power Factor Correction
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Primary Attributes: Isolated
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
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CY8C20324-12LQXI CY8C20324-12LQXI Infineon Technologies Infineon-CY8C20224_CY8C20324_CY8C20424_CY8C20524_CAPSENSE_PSOC_PROGRAMMABLE_SYSTEM_ON_CHIP-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecae11743f6 Description: IC MCU 8BIT 8KB FLASH 24SQFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
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BTG7016A1EPWDBTOBO1 Infineon Technologies Description: BTG7016A-1EPW DB
Packaging: Bulk
Function: Switch
Type: Power Management
Contents: Board(s)
Utilized IC / Part: BTG7016A-1EPW
Platform: Arduino
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IMW65R040M2HXKSA1 IMW65R040M2HXKSA1 Infineon Technologies infineon-imw65r040m2h-datasheet-en.pdf Description: SILICON CARBIDE MOSFET
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Rds On (Max) @ Id, Vgs: 36mOhm @ 22.9A, 20V
Power Dissipation (Max): 172W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 4.6mA
Supplier Device Package: PG-TO247-3-40
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 997 pF @ 400 V
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TLS805B1LDVXUMA1 TLS805B1LDVXUMA1 Infineon Technologies Infineon-TLS805B1-DS-v01_20-EN.pdf?fileId=5546d46258fc0bc1015969ed6e11424b Description: IC REG LIN POS ADJ 50MA TSON-10
Qualification: AEC-Q100
Current - Supply (Max): 11 µA
Protection Features: Over Current, Over Temperature, Short Circuit
Voltage Dropout (Max): 0.3V @ 50mA
PSRR: 60dB (100Hz)
Grade: Automotive
Control Features: Enable
Voltage - Output (Min/Fixed): 1.2V
Voltage - Output (Max): 41.7V
Supplier Device Package: PG-TSON-10
Number of Regulators: 1
Voltage - Input (Max): 42V
Current - Quiescent (Iq): 1 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output: 50mA
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-TFDFN Exposed Pad
Packaging: Tape & Reel (TR)
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IPP029N06NXKSA1 IPP029N06NXKSA1 Infineon Technologies Infineon-IPP029N06N-DS-v02_06-EN.pdf?fileId=db3a3043345a30bc013465bff03f62ec Description: TRENCH 40<-<100V
Input Capacitance (Ciss) (Max) @ Vds: 5125 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Supplier Device Package: PG-TO220-3-1
Vgs(th) (Max) @ Id: 3.3V @ 75µA
Power Dissipation (Max): 3W (Ta), 136W (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 100A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
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S25HL512TFABHB010 S25HL512TFABHB010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 512MBIT SPI/QUAD 24BGA
DigiKey Programmable: Not Verified
Memory Organization: 64M x 8
Memory Interface: SPI - Quad I/O, QPI
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 512Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
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CY9AF144NBPMC-G-JNE2 CY9AF144NBPMC-G-JNE2 Infineon Technologies Infineon-CY9A140NB_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee002d66576&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 288KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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IDH03SG60CXKSA2 IDH03SG60CXKSA2 Infineon Technologies IDH03SG60C_rev2.1.pdf?folderId=db3a30431ddc9372011ed0010fda1bd3&fileId=db3a30431ff98815012019e44a933f33 Description: DIODE SIL CARB 600V 3A TO220-2-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 60pF @ 1V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.3 V @ 3 A
Current - Reverse Leakage @ Vr: 15 µA @ 600 V
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CYT2B74CADR0AZSGST CYT2B74CADR0AZSGST Infineon Technologies Description: IC MCU 32BT 1.0625MB FLSH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 63
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 52x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
EEPROM Size: 96K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.0625MB (1.0625M x 8)
Speed: 100MHz, 160MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
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SABC5042EMCCBXQMA1 Infineon Technologies Description: LEGACY 8-BIT MCU
Packaging: Bulk
DigiKey Programmable: Not Verified
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IR3828MTRPBF Infineon Technologies Infineon-IR3828MTRPBF-DS-v01_00-EN.pdf?fileId=5546d4625696ed760156c8b10c602738 Description: IC REG BUCK CTRLR PQFN
Packaging: Tape & Reel (TR)
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CY9BFD18SPMC-GK7FKCGE1 CY9BFD18SPMC-GK7FKCGE1 Infineon Technologies Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 122
DigiKey Programmable: Not Verified
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FZ1500R33HL3BPSA3 Infineon Technologies FZ1500R33HL3.pdf?t.download=true&u=ovmfp3 Description: FZ1500R33 - INSULATED GATE BIPOL
Packaging: Bulk
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DF120R12W2H3B27BOMA1 DF120R12W2H3B27BOMA1 Infineon Technologies Infineon-DF120R12W2H3_B27-DS-v03_01-EN.pdf?fileId=db3a304340e762c80140e886ef5e0142 Description: IGBT MOD 1200V 50A 180W MOD
Input Capacitance (Cies) @ Vce: 2.35 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 180 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 50 A
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 40A
Operating Temperature: -40°C ~ 150°C
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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CY8C4148LDSS563XQLA1 CY8C4148LDSS563XQLA1 Infineon Technologies infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
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CY8C4147AZSS565XQLA1 CY8C4147AZSS565XQLA1 Infineon Technologies infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
Qualification: AEC-Q100
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CY8C4149LDSS563XQLA1 CY8C4149LDSS563XQLA1 Infineon Technologies infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 384KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
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CY8C4148AZSS565XQLA1 CY8C4148AZSS565XQLA1 Infineon Technologies infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
Qualification: AEC-Q100
Produkt ist nicht verfügbar
 Mindestbestellmenge: 1600 Stücke
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CY8C4149AZSS565XQLA1 CY8C4149AZSS565XQLA1 Infineon Technologies infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4147AZSS568XQLA1 CY8C4147AZSS568XQLA1 Infineon Technologies infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 128KB FLASH 100LQFP
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY8C4148AZSS568XQLA1 CY8C4148AZSS568XQLA1 Infineon Technologies infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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10+11.96 EUR
90+10.2 EUR
180+9.84 EUR
270+9.66 EUR
540+9.39 EUR
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CY8C4149AZSS568XQLA1 CY8C4149AZSS568XQLA1 Infineon Technologies infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 384KB FLASH 100LQFP
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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MB91F467TAPMC-GSK5E2 MB91F467TAPMC-GSK5E2 Infineon Technologies Infineon-CY91460T_Series_FR60_32_bit_Microcontroller_Datasheet-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edcb58760b1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integ Description: IC MCU 32B 1.0625MB FLSH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 109
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: FR60 RISC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 72K x 8
Program Memory Size: 1.0625MB (1.0625M x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
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IPL65R340CFDAUMA2 IPL65R340CFDAUMA2 Infineon Technologies INFN-S-A0003614925-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 650V 10.9A 4VSON
Packaging: Tape & Reel (TR)
Package / Case: 4-PowerTSFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 10.9A (Tc)
Rds On (Max) @ Id, Vgs: 340mOhm @ 4.4A, 10V
Power Dissipation (Max): 104.2W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 400µA
Supplier Device Package: PG-VSON-4
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 41 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
Produkt ist nicht verfügbar
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FD800R17KE3B2NOSA1 FD800R17KE3B2NOSA1 Infineon Technologies Infineon-FD800R17KE3_B2-DS-v02_02-en_de.pdf?fileId=db3a304412b407950112b431012e5304 Description: IGBT MODULE 1700V 800A
Input Capacitance (Cies) @ Vce: 72 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 5200 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 1200 A
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 800A
Operating Temperature: -40°C ~ 125°C (TJ)
Configuration: Single Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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IPTG018N08NM5ATMA1 IPTG018N08NM5ATMA1 Infineon Technologies Infineon-IPTG018N08NM5-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd0179176bd925115f Description: TRENCH 40<-<100V PG-HSOG-8
Input Capacitance (Ciss) (Max) @ Vds: 9200 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 127 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Supplier Device Package: PG-HSOG-8-1
Vgs(th) (Max) @ Id: 3.8V @ 159µA
Power Dissipation (Max): 3.8W (Ta), 231W (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 150A, 10V
Current - Continuous Drain (Id) @ 25°C: 32A (Ta), 253A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerSMD, Gull Wing
Packaging: Cut Tape (CT)
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100+3.6 EUR
500+2.98 EUR
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IPP028N08N3GXKSA1 IPP028N08N3GXKSA1 Infineon Technologies IPP028N08N3_Rev1%5B1%5D.0.pdf?fileId=db3a30432313ff5e0123a3c08e7326b5&folderId=db3a304313b8b5a60113cee8763b02d7 Description: MOSFET N-CH 80V 100A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 14200 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 206 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Supplier Device Package: PG-TO220-3
Vgs(th) (Max) @ Id: 3.5V @ 270µA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 2.8mOhm @ 100A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Produkt ist nicht verfügbar
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TC357TH64F300SABKXUMA1 Infineon Technologies Infineon-TC35x_AB-step_DataSheet-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c82ce566401833cdf8d5f2dc7 Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 960K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 16x8b SAR
Core Size: 32-Bit 5-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: PG-LFBGA-292-13
DigiKey Programmable: Not Verified
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TC357TA64F300SABKXUMA1 TC357TA64F300SABKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 3.6M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Peripherals: DMA, I2S, LVDS, PWM, WDT
Supplier Device Package: PG-LFBGA-292-6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPD60R180CM8XTMA1 IPD60R180CM8XTMA1 Infineon Technologies Infineon-IPD60R180CM8-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c8d2fe47b018d8cd870c30405 Description: IPD60R180CM8XTMA1
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tj)
Rds On (Max) @ Id, Vgs: 180mOhm @ 5.6A, 10V
Power Dissipation (Max): 127W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 140µA
Supplier Device Package: PG-TO252-3-313
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 743 pF @ 400 V
Produkt ist nicht verfügbar
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IPD60R180CM8XTMA1 IPD60R180CM8XTMA1 Infineon Technologies Infineon-IPD60R180CM8-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c8d2fe47b018d8cd870c30405 Description: IPD60R180CM8XTMA1
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tj)
Rds On (Max) @ Id, Vgs: 180mOhm @ 5.6A, 10V
Power Dissipation (Max): 127W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 140µA
Supplier Device Package: PG-TO252-3-313
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 743 pF @ 400 V
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100+1.68 EUR
500+1.34 EUR
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PVN012APBF PVN012APBF Infineon Technologies pvn012apbf.pdf?fileId=5546d462533600a401535683f9ec2950 Description: SSR RELAY SPST-NO 4A 0-20V
On-State Resistance (Max): 50 mOhms
Voltage - Load: 0 V ~ 20 V
Supplier Device Package: 6-DIP
Load Current: 4 A
Termination Style: PC Pin
Circuit: SPST-NO (1 Form A)
Voltage - Input: 1.2VDC
Mounting Type: Through Hole
Output Type: AC, DC
Package / Case: 6-DIP (0.300", 7.62mm)
Packaging: Tube
Approval Agency: UL
Operating Temperature: -40°C ~ 85°C
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FF225R12MS4BOSA1 FF225R12MS4BOSA1 Infineon Technologies Infineon-FF225R12MS4-DS-v02_01-en_de.pdf?fileId=db3a304313b8b5a60113ba985a0e00b0 Description: IGBT MOD 1200V 275A 1450W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 225A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 275 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1450 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 15 nF @ 25 V
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CY8C4247LWA-M464 CY8C4247LWA-M464 Infineon Technologies Description: IC MCU 32BIT 128KB FLASH 56VFQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 24x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Number of I/O: 46
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4247LWA-M464T CY8C4247LWA-M464T Infineon Technologies Description: IC MCU 32BIT 128KB FLASH 56VFQFN
Qualification: AEC-Q100
Number of I/O: 46
Grade: Automotive
Supplier Device Package: 56-QFN-EP (8x8)
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR; D/A 4x7/8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE4241SYSSHIELDTOBO1 Infineon Technologies Description: Eval
Platform: Arduino
Utilized IC / Part: TLE4241GM
Contents: Board(s)
Type: Interface
Function: Extension Board
Packaging: Bulk
Produkt ist nicht verfügbar
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FZ1500R33HL3B60BPSA1 Infineon Technologies Description: IGBT MOD 3300V 1500A AG-IHVB190
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2400000 W
Voltage - Collector Emitter Breakdown (Max): 3300 V
Current - Collector (Ic) (Max): 1500 A
IGBT Type: Trench Field Stop
Supplier Device Package: AG-IHVB190
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.85V @ 15V, 1.5kA
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Single Switch
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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TLE9274QXV33XUMA1 Infineon Technologies Infineon-TLE9274QX%20V33-DataSheet-v01_50-EN.pdf?fileId=5546d4627762291e01776d6101847b85 Description: OPTIREG SYST BASIS CHIPS PG-VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 4
Voltage - Input: 4.5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: PG-VQFN-48-31
Grade: Automotive
Produkt ist nicht verfügbar
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TD170N12KOFHPSA1 TD170N12KOFHPSA1 Infineon Technologies TT170N.pdf Description: SCR MODULE 1.8KV 350A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 5200A @ 50Hz
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 223 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (RMS)) (Max): 350 A
Voltage - Off State: 1.8 kV
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TD170N12KOFHPSA1 TD170N12KOFHPSA1 Infineon Technologies TT170N.pdf Description: SCR MODULE 1.8KV 350A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 5200A @ 50Hz
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 223 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (RMS)) (Max): 350 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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TC337DA32F200SAAKXUMA1 TC337DA32F200SAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 2MB FLASH 292LFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, I2S, LVDS, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Core Size: 32-Bit Single-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.54K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FD600R12KF4NOSA1 Infineon Technologies FD600R12KF4_v02_Jan98.pdf Description: IGBT MODULE 1200V 600A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.2V @ 15V, 600A
NTC Thermistor: No
Current - Collector (Ic) (Max): 600 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 3900 W
Current - Collector Cutoff (Max): 8 mA
Input Capacitance (Cies) @ Vce: 45 nF @ 25 V
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CY14V101QS-BK108XIT CY14V101QS-BK108XIT Infineon Technologies Infineon-CY14V101QS_1-Mbit_(128K_8)_Quad_SPI_nvSRAM-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed151594d8a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC NVSRAM 1MBIT SPI 24FBGA
Packaging: Tape & Reel (TR)
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: NVSRAM (Non-Volatile SRAM)
Clock Frequency: 108 MHz
Memory Format: NVSRAM
Supplier Device Package: 24-FBGA (6x8)
Memory Interface: SPI
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SLF9620M51XHSA1 Infineon Technologies Description: IC SECURITY CHIP CARD CTLR SMD
Packaging: Tape & Reel (TR)
Interface: ISO/IEC 7816 Interface
Operating Temperature: -25°C ~ 70°C (TA)
Applications: Security
Core Processor: ARM® Cortex®-M4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FP35R12W2T4PB11BPSA1 FP35R12W2T4PB11BPSA1 Infineon Technologies Infineon-FP35R12W2T4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625bd71aa0015bfb8803656ea3 Description: IGBT MODULE 1200V 70A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 2 nF @ 25 V
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6+79.39 EUR
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BGA7M1N6E6327XTSA1 Infineon-BGA7M1N6-DS-v03_01-en.pdf?fileId=db3a304344e406b50144e46550b502d7
BGA7M1N6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP LTE 1.8GHZ-2.2GHZ TSNP6
Packaging: Bulk
Package / Case: 6-XFDFN
Mounting Type: Surface Mount
Frequency: 1.8GHz ~ 2.2GHz
RF Type: LTE
Voltage - Supply: 1.5V ~ 3.3V
Gain: 13dB
Current - Supply: 4.4mA
Noise Figure: 0.6dB
P1dB: -7dBm
Supplier Device Package: PG-TSNP-6-2
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BGA777L7E6327XTSA1 BGA777L7.pdf
BGA777L7E6327XTSA1
Hersteller: Infineon Technologies
Description: IC AMP UMTS 2.3/2.7GHZ TSLP7-1
Packaging: Bulk
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 2.3GHz, 2.7GHz
RF Type: UMTS
Voltage - Supply: 2.6V ~ 3V
Gain: 16.8dB
Current - Supply: 10mA
Noise Figure: 1.2dB
P1dB: -11dBm
Test Frequency: 2.3GHz
Supplier Device Package: PG-TSLP-7-1
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AnzahlPreis
799+0.63 EUR
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BGA 700L16 E6327 BGA700L16_PB.pdf
BGA 700L16 E6327
Hersteller: Infineon Technologies
Description: IC AMP GSM 500MHZ-6GHZ TSLP7-1
Packaging: Tape & Reel (TR)
Package / Case: 6-XFDFN Exposed Pad
Mounting Type: Surface Mount
Frequency: 500MHz ~ 6GHz
RF Type: GSM, DCS, PCS
Voltage - Supply: 2.75V
Gain: 17.5dB
Noise Figure: 0.95dB
P1dB: -20dBm
Test Frequency: 1.575GHz
Supplier Device Package: PG-TSLP-7-1
Produkt ist nicht verfügbar
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IPTA60R180CM8XTMA1
IPTA60R180CM8XTMA1
Hersteller: Infineon Technologies
Description: IPTA60R180CM8XTMA1
Packaging: Tape & Reel (TR)
Package / Case: 4-PowerLSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tj)
Rds On (Max) @ Id, Vgs: 180mOhm @ 5.6A, 10V
Power Dissipation (Max): 119W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 140µA
Supplier Device Package: PG-LHSOF-4-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 743 pF @ 400 V
Produkt ist nicht verfügbar
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IPTA60R180CM8XTMA1
IPTA60R180CM8XTMA1
Hersteller: Infineon Technologies
Description: IPTA60R180CM8XTMA1
Packaging: Cut Tape (CT)
Package / Case: 4-PowerLSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tj)
Rds On (Max) @ Id, Vgs: 180mOhm @ 5.6A, 10V
Power Dissipation (Max): 119W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 140µA
Supplier Device Package: PG-LHSOF-4-1
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 743 pF @ 400 V
Produkt ist nicht verfügbar
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CY8C4128LQI-BL543 Infineon-PSoC_4_PSoC_4100_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5e6f46dbe&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fi
CY8C4128LQI-BL543
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 56QFN
Packaging: Tray
Package / Case: 56-UFQFN Exposed Pad
Sensitivity: -92dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 256kB Flash, 8kB ROM, 32kB SRAM
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.71V ~ 5.5V
Power - Output: 3dBm
Protocol: Bluetooth v4.2
Current - Receiving: 16.4mA ~ 21.5mA
Data Rate (Max): 8Mbps
Current - Transmitting: 12.5mA ~ 20mA
Supplier Device Package: 56-QFN (7x7)
GPIO: 36
Modulation: GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C4248FNI-BL573T Infineon-PSoC_4_4200_BLE_Family_Datasheet_Programmable_System-on-Chip-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee5f2a26ddd
CY8C4248FNI-BL573T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 76WLCSP
Packaging: Cut Tape (CT)
Package / Case: 76-UFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b; D/A 1x7b, 1x8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Bluetooth, Brown-out Detect/Reset, CapSense, DMA , LVD, POR, PWM, SmartCard, SmartSense, WDT
Supplier Device Package: 76-WLCSP (4.04x3.87)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IRF6712STRPBF irf6712spbf.pdf?fileId=5546d462533600a4015355ecf4331a7c
IRF6712STRPBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 25V 17A DIRECTFET
Packaging: Tape & Reel (TR)
Package / Case: DirectFET™ Isometric SQ
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Ta), 68A (Tc)
Rds On (Max) @ Id, Vgs: 4.9mOhm @ 17A, 10V
Power Dissipation (Max): 2.2W (Ta), 36W (Tc)
Vgs(th) (Max) @ Id: 2.4V @ 50µA
Supplier Device Package: DIRECTFET™ SQ
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 25 V
Gate Charge (Qg) (Max) @ Vgs: 18 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1570 pF @ 13 V
Produkt ist nicht verfügbar
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DZ800S17K3HOSA1 Infineon-DZ800S17K3-DS-v02_02-en_de.pdf?fileId=db3a304317a748360117c9d5c27b2974
DZ800S17K3HOSA1
Hersteller: Infineon Technologies
Description: DIODE MODULE GP 1700V AG62MM-2
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Supplier Device Package: AG-62MM-2
Operating Temperature - Junction: -40°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 800 A
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1+224.96 EUR
10+200.38 EUR
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56DN06B02ELEMXPSA1 Infineon-56DN06B02-DataSheet-v03_01-EN.pdf?fileId=5546d4627506bb320175079eeb79038e
56DN06B02ELEMXPSA1
Hersteller: Infineon Technologies
Description: DIODE STD 600V 11140A EEUPEC0
Packaging: Bulk
Package / Case: DO-200AB, B-PUK
Mounting Type: Clamp On
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Current - Average Rectified (Io): 11140A
Supplier Device Package: E-EUPEC-0
Operating Temperature - Junction: 180°C (Max)
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 940 mV @ 8000 A
Current - Reverse Leakage @ Vr: 60 mA @ 600 V
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1+496.94 EUR
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CY8C3665LTI-044 #!?fileId=8ac78c8c7d0d8da4017d0ec73d263e88
CY8C3665LTI-044
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 68QFN
DigiKey Programmable: Not Verified
Number of I/O: 38
Supplier Device Package: 68-QFN (8x8)
Peripherals: CapSense, DMA, POR, PWM, WDT
Connectivity: EBI/EMI, I2C, LINbus, SPI, UART/USART, USB
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 16x12b; D/A 4x8b
Core Processor: 8051
EEPROM Size: 1K x 8
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 4K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 67MHz
Mounting Type: Surface Mount
Package / Case: 68-VFQFN Exposed Pad
Packaging: Tray
auf Bestellung 750 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+24.48 EUR
10+19.34 EUR
25+18.05 EUR
80+16.83 EUR
260+15.94 EUR
520+15.54 EUR
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BAS21E6433HTMA1 bas21series.pdf?folderId=db3a30431400ef6801141b5844e103ea&fileId=db3a30431400ef6801141bed353f040f
BAS21E6433HTMA1
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 200V 250MA SOT23
Packaging: Tape & Reel (TR)
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 50 ns
Technology: Standard
Capacitance @ Vr, F: 5pF @ 0V, 1MHz
Current - Average Rectified (Io): 250mA
Supplier Device Package: PG-SOT23
Operating Temperature - Junction: 150°C (Max)
Voltage - DC Reverse (Vr) (Max): 200 V
Voltage - Forward (Vf) (Max) @ If: 1.25 V @ 200 mA
Current - Reverse Leakage @ Vr: 100 nA @ 200 V
Produkt ist nicht verfügbar
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BC849CE6327HTSA1 bc846%2Cbc847%2Cbc848%2Cbc849%2Cbc850.pdf
BC849CE6327HTSA1
Hersteller: Infineon Technologies
Description: TRANS NPN 30V 0.1A PG-SOT23
Packaging: Bulk
Package / Case: TO-236-3, SC-59, SOT-23-3
Mounting Type: Surface Mount
Transistor Type: NPN
Operating Temperature: 150°C (TJ)
Vce Saturation (Max) @ Ib, Ic: 600mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 420 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SOT23
Current - Collector (Ic) (Max): 100 mA
Voltage - Collector Emitter Breakdown (Max): 30 V
Power - Max: 330 mW
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Lieferzeit 10-14 Tag (e)
AnzahlPreis
5926+0.075 EUR
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KIT2K5WCCMTOLLTOBO1 Infineon-General_description_evaluation_kit_KIT_2K5W_CCM_TOLL-ATI-v01_00-EN.pdf?fileId=5546d462602a9dc80160452044a718a7
KIT2K5WCCMTOLLTOBO1
Hersteller: Infineon Technologies
Description: TO LEADLESS ADAPTER
Packaging: Bulk
Accessory Type: Upgrade Kit
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AnzahlPreis
1+160.32 EUR
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REF3K3WTPSICTOLLTOBO1
REF3K3WTPSICTOLLTOBO1
Hersteller: Infineon Technologies
Description: REF3K3WTPSICTOLLTOBO1
Packaging: Box
Function: Power Factor Correction
Type: Power Management
Contents: Board(s)
Supplied Contents: Board(s)
Primary Attributes: Isolated
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+1023.04 EUR
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CY8C20324-12LQXI Infineon-CY8C20224_CY8C20324_CY8C20424_CY8C20524_CAPSENSE_PSOC_PROGRAMMABLE_SYSTEM_ON_CHIP-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ecae11743f6
CY8C20324-12LQXI
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 24SQFN
Packaging: Tray
Package / Case: 24-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.25V
Connectivity: I2C, SPI
Peripherals: LVD, POR, WDT
Supplier Device Package: 24-QFN (4x4)
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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BTG7016A1EPWDBTOBO1
Hersteller: Infineon Technologies
Description: BTG7016A-1EPW DB
Packaging: Bulk
Function: Switch
Type: Power Management
Contents: Board(s)
Utilized IC / Part: BTG7016A-1EPW
Platform: Arduino
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+77.3 EUR
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IMW65R040M2HXKSA1 infineon-imw65r040m2h-datasheet-en.pdf
IMW65R040M2HXKSA1
Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 46A (Tc)
Rds On (Max) @ Id, Vgs: 36mOhm @ 22.9A, 20V
Power Dissipation (Max): 172W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 4.6mA
Supplier Device Package: PG-TO247-3-40
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 28 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 997 pF @ 400 V
auf Bestellung 267 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+12.94 EUR
30+7.58 EUR
120+6.41 EUR
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TLS805B1LDVXUMA1 Infineon-TLS805B1-DS-v01_20-EN.pdf?fileId=5546d46258fc0bc1015969ed6e11424b
TLS805B1LDVXUMA1
Hersteller: Infineon Technologies
Description: IC REG LIN POS ADJ 50MA TSON-10
Qualification: AEC-Q100
Current - Supply (Max): 11 µA
Protection Features: Over Current, Over Temperature, Short Circuit
Voltage Dropout (Max): 0.3V @ 50mA
PSRR: 60dB (100Hz)
Grade: Automotive
Control Features: Enable
Voltage - Output (Min/Fixed): 1.2V
Voltage - Output (Max): 41.7V
Supplier Device Package: PG-TSON-10
Number of Regulators: 1
Voltage - Input (Max): 42V
Current - Quiescent (Iq): 1 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 150°C (TJ)
Current - Output: 50mA
Mounting Type: Surface Mount
Output Type: Adjustable
Package / Case: 10-TFDFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPP029N06NXKSA1 Infineon-IPP029N06N-DS-v02_06-EN.pdf?fileId=db3a3043345a30bc013465bff03f62ec
IPP029N06NXKSA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Input Capacitance (Ciss) (Max) @ Vds: 5125 pF @ 30 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Supplier Device Package: PG-TO220-3-1
Vgs(th) (Max) @ Id: 3.3V @ 75µA
Power Dissipation (Max): 3W (Ta), 136W (Tc)
Rds On (Max) @ Id, Vgs: 2.9mOhm @ 100A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Produkt ist nicht verfügbar
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S25HL512TFABHB010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
S25HL512TFABHB010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 24BGA
DigiKey Programmable: Not Verified
Memory Organization: 64M x 8
Memory Interface: SPI - Quad I/O, QPI
Supplier Device Package: 24-BGA (8x6)
Memory Format: FLASH
Clock Frequency: 166 MHz
Technology: FLASH - NOR (SLC)
Voltage - Supply: 2.7V ~ 3.6V
Operating Temperature: -40°C ~ 105°C (TA)
Memory Type: Non-Volatile
Memory Size: 512Mbit
Mounting Type: Surface Mount
Package / Case: 24-TBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CY9AF144NBPMC-G-JNE2 Infineon-CY9A140NB_Series_32_Bit_Arm_Cortex_M3_FM3_Microcontroller-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee002d66576&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY9AF144NBPMC-G-JNE2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 288KB FLASH 100LQFP
DigiKey Programmable: Not Verified
Number of I/O: 83
Supplier Device Package: 100-LQFP (14x14)
Peripherals: LVD, POR, PWM, WDT
Connectivity: CSIO, EBI/EMI, I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.65V ~ 3.6V
Core Size: 32-Bit Single-Core
Data Converters: A/D 24x12b
Core Processor: ARM® Cortex®-M3
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 32K x 8
Program Memory Size: 288KB (288K x 8)
Speed: 40MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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IDH03SG60CXKSA2 IDH03SG60C_rev2.1.pdf?folderId=db3a30431ddc9372011ed0010fda1bd3&fileId=db3a30431ff98815012019e44a933f33
IDH03SG60CXKSA2
Hersteller: Infineon Technologies
Description: DIODE SIL CARB 600V 3A TO220-2-1
Packaging: Tube
Package / Case: TO-220-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 60pF @ 1V, 1MHz
Current - Average Rectified (Io): 3A
Supplier Device Package: PG-TO220-2-1
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2.3 V @ 3 A
Current - Reverse Leakage @ Vr: 15 µA @ 600 V
Produkt ist nicht verfügbar
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CYT2B74CADR0AZSGST
CYT2B74CADR0AZSGST
Hersteller: Infineon Technologies
Description: IC MCU 32BT 1.0625MB FLSH 80LQFP
DigiKey Programmable: Not Verified
Number of I/O: 63
Supplier Device Package: 80-LQFP (12x12)
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Data Converters: A/D 52x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
EEPROM Size: 96K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 128K x 8
Program Memory Size: 1.0625MB (1.0625M x 8)
Speed: 100MHz, 160MHz
Mounting Type: Surface Mount
Package / Case: 80-LQFP
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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SABC5042EMCCBXQMA1
Hersteller: Infineon Technologies
Description: LEGACY 8-BIT MCU
Packaging: Bulk
DigiKey Programmable: Not Verified
auf Bestellung 6323 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
46+9.89 EUR
Mindestbestellmenge: 46 Stücke
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IR3828MTRPBF Infineon-IR3828MTRPBF-DS-v01_00-EN.pdf?fileId=5546d4625696ed760156c8b10c602738
Hersteller: Infineon Technologies
Description: IC REG BUCK CTRLR PQFN
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY9BFD18SPMC-GK7FKCGE1
CY9BFD18SPMC-GK7FKCGE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 144LQFP
Packaging: Tray
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 24x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, Ethernet, I2C, LINbus, SD, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 122
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FZ1500R33HL3BPSA3 FZ1500R33HL3.pdf?t.download=true&u=ovmfp3
Hersteller: Infineon Technologies
Description: FZ1500R33 - INSULATED GATE BIPOL
Packaging: Bulk
auf Bestellung 16 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+2355.95 EUR
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DF120R12W2H3B27BOMA1 Infineon-DF120R12W2H3_B27-DS-v03_01-EN.pdf?fileId=db3a304340e762c80140e886ef5e0142
DF120R12W2H3B27BOMA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 50A 180W MOD
Input Capacitance (Cies) @ Vce: 2.35 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 180 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 50 A
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.4V @ 15V, 40A
Operating Temperature: -40°C ~ 150°C
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
auf Bestellung 696 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
8+58.9 EUR
Mindestbestellmenge: 8 Stücke
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CY8C4148LDSS563XQLA1 infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4148LDSS563XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4147AZSS565XQLA1 infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4147AZSS565XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4149LDSS563XQLA1 infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4149LDSS563XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 384KB FLASH 48VFQFN
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4148AZSS565XQLA1 infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4148AZSS565XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1600 Stücke
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CY8C4149AZSS565XQLA1 infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4149AZSS565XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 384KB FLASH 64LQFP
Packaging: Tray
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4147AZSS568XQLA1 infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4147AZSS568XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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CY8C4148AZSS568XQLA1 infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4148AZSS568XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+15.42 EUR
10+11.96 EUR
90+10.2 EUR
180+9.84 EUR
270+9.66 EUR
540+9.39 EUR
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CY8C4149AZSS568XQLA1 infineon-cy8c41xx-psoc-automotive-4100s-max-based-on-arm-cortex--m0-cpu-datasheet-en.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4149AZSS568XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 384KB FLASH 100LQFP
Qualification: AEC-Q100
Number of I/O: 84
Grade: Automotive
Supplier Device Package: 100-TQFP (14x14)
Peripherals: Brown-out Detect/Reset, DMA, LCD, LVD, POR, PWM, WDT
Connectivity: CANbus, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 16x12b SAR
Core Processor: ARM® Cortex®-M0+
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 32K x 8
Program Memory Size: 384KB (384K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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MB91F467TAPMC-GSK5E2 Infineon-CY91460T_Series_FR60_32_bit_Microcontroller_Datasheet-AdditionalTechnicalInformation-v02_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0edcb58760b1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integ
MB91F467TAPMC-GSK5E2
Hersteller: Infineon Technologies
Description: IC MCU 32B 1.0625MB FLSH 144LQFP
DigiKey Programmable: Not Verified
Number of I/O: 109
Supplier Device Package: 144-LQFP (20x20)
Peripherals: DMA, LVD, PWM, WDT
Connectivity: CANbus, EBI/EMI, I2C, LINbus, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 32-Bit Single-Core
Data Converters: A/D 32x10b
Core Processor: FR60 RISC
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 72K x 8
Program Memory Size: 1.0625MB (1.0625M x 8)
Speed: 100MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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IPL65R340CFDAUMA2 INFN-S-A0003614925-1.pdf?t.download=true&u=5oefqw
IPL65R340CFDAUMA2
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 10.9A 4VSON
Packaging: Tape & Reel (TR)
Package / Case: 4-PowerTSFN
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 10.9A (Tc)
Rds On (Max) @ Id, Vgs: 340mOhm @ 4.4A, 10V
Power Dissipation (Max): 104.2W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 400µA
Supplier Device Package: PG-VSON-4
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 41 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1100 pF @ 100 V
Produkt ist nicht verfügbar
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FD800R17KE3B2NOSA1 Infineon-FD800R17KE3_B2-DS-v02_02-en_de.pdf?fileId=db3a304412b407950112b431012e5304
FD800R17KE3B2NOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 800A
Input Capacitance (Cies) @ Vce: 72 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 5200 W
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 1200 A
Supplier Device Package: Module
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.45V @ 15V, 800A
Operating Temperature: -40°C ~ 125°C (TJ)
Configuration: Single Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
auf Bestellung 9 Stücke:
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AnzahlPreis
1+1997.34 EUR
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IPTG018N08NM5ATMA1 Infineon-IPTG018N08NM5-DataSheet-v02_00-EN.pdf?fileId=5546d46278d64ffd0179176bd925115f
IPTG018N08NM5ATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V PG-HSOG-8
Input Capacitance (Ciss) (Max) @ Vds: 9200 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 127 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Supplier Device Package: PG-HSOG-8-1
Vgs(th) (Max) @ Id: 3.8V @ 159µA
Power Dissipation (Max): 3.8W (Ta), 231W (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 150A, 10V
Current - Continuous Drain (Id) @ 25°C: 32A (Ta), 253A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-PowerSMD, Gull Wing
Packaging: Cut Tape (CT)
auf Bestellung 1784 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+7.6 EUR
10+5.04 EUR
100+3.6 EUR
500+2.98 EUR
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IPP028N08N3GXKSA1 IPP028N08N3_Rev1%5B1%5D.0.pdf?fileId=db3a30432313ff5e0123a3c08e7326b5&folderId=db3a304313b8b5a60113cee8763b02d7
IPP028N08N3GXKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 80V 100A TO220-3
Input Capacitance (Ciss) (Max) @ Vds: 14200 pF @ 40 V
Gate Charge (Qg) (Max) @ Vgs: 206 nC @ 10 V
Drain to Source Voltage (Vdss): 80 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 6V, 10V
Supplier Device Package: PG-TO220-3
Vgs(th) (Max) @ Id: 3.5V @ 270µA
Power Dissipation (Max): 300W (Tc)
Rds On (Max) @ Id, Vgs: 2.8mOhm @ 100A, 10V
Current - Continuous Drain (Id) @ 25°C: 100A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-220-3
Packaging: Tube
Produkt ist nicht verfügbar
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TC357TH64F300SABKXUMA1 Infineon-TC35x_AB-step_DataSheet-DataSheet-v01_01-EN.pdf?fileId=8ac78c8c82ce566401833cdf8d5f2dc7
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 960K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 16x8b SAR
Core Size: 32-Bit 5-Core
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: PG-LFBGA-292-13
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC357TA64F300SABKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC357TA64F300SABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 3.6M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Peripherals: DMA, I2S, LVDS, PWM, WDT
Supplier Device Package: PG-LFBGA-292-6
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPD60R180CM8XTMA1 Infineon-IPD60R180CM8-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c8d2fe47b018d8cd870c30405
IPD60R180CM8XTMA1
Hersteller: Infineon Technologies
Description: IPD60R180CM8XTMA1
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tj)
Rds On (Max) @ Id, Vgs: 180mOhm @ 5.6A, 10V
Power Dissipation (Max): 127W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 140µA
Supplier Device Package: PG-TO252-3-313
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 743 pF @ 400 V
Produkt ist nicht verfügbar
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IPD60R180CM8XTMA1 Infineon-IPD60R180CM8-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c8d2fe47b018d8cd870c30405
IPD60R180CM8XTMA1
Hersteller: Infineon Technologies
Description: IPD60R180CM8XTMA1
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 18A (Tj)
Rds On (Max) @ Id, Vgs: 180mOhm @ 5.6A, 10V
Power Dissipation (Max): 127W (Tc)
Vgs(th) (Max) @ Id: 4.7V @ 140µA
Supplier Device Package: PG-TO252-3-313
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 17 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 743 pF @ 400 V
auf Bestellung 2465 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.84 EUR
10+2.46 EUR
100+1.68 EUR
500+1.34 EUR
1000+1.23 EUR
Mindestbestellmenge: 5 Stücke
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PVN012APBF pvn012apbf.pdf?fileId=5546d462533600a401535683f9ec2950
PVN012APBF
Hersteller: Infineon Technologies
Description: SSR RELAY SPST-NO 4A 0-20V
On-State Resistance (Max): 50 mOhms
Voltage - Load: 0 V ~ 20 V
Supplier Device Package: 6-DIP
Load Current: 4 A
Termination Style: PC Pin
Circuit: SPST-NO (1 Form A)
Voltage - Input: 1.2VDC
Mounting Type: Through Hole
Output Type: AC, DC
Package / Case: 6-DIP (0.300", 7.62mm)
Packaging: Tube
Approval Agency: UL
Operating Temperature: -40°C ~ 85°C
Produkt ist nicht verfügbar
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FF225R12MS4BOSA1 Infineon-FF225R12MS4-DS-v02_01-en_de.pdf?fileId=db3a304313b8b5a60113ba985a0e00b0
FF225R12MS4BOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 275A 1450W MOD
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: 2 Independent
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 3.7V @ 15V, 225A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 275 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1450 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 15 nF @ 25 V
auf Bestellung 131 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+248.17 EUR
Mindestbestellmenge: 2 Stücke
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CY8C4247LWA-M464
CY8C4247LWA-M464
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56VFQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 24x12b SAR; D/A 4x7/8b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Supplier Device Package: 56-QFN-EP (8x8)
Grade: Automotive
Number of I/O: 46
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4247LWA-M464T
CY8C4247LWA-M464T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 56VFQFN
Qualification: AEC-Q100
Number of I/O: 46
Grade: Automotive
Supplier Device Package: 56-QFN-EP (8x8)
Peripherals: Brown-out Detect/Reset, Cap Sense, LCD, LVD, POR, PWM, SmartSense, WDT
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 24x12b SAR; D/A 4x7/8b
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 16K x 8
Program Memory Size: 128KB (128K x 8)
Speed: 48MHz
Mounting Type: Surface Mount, Wettable Flank
Package / Case: 56-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE4241SYSSHIELDTOBO1
Hersteller: Infineon Technologies
Description: Eval
Platform: Arduino
Utilized IC / Part: TLE4241GM
Contents: Board(s)
Type: Interface
Function: Extension Board
Packaging: Bulk
Produkt ist nicht verfügbar
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FZ1500R33HL3B60BPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 3300V 1500A AG-IHVB190
Input Capacitance (Cies) @ Vce: 280 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 2400000 W
Voltage - Collector Emitter Breakdown (Max): 3300 V
Current - Collector (Ic) (Max): 1500 A
IGBT Type: Trench Field Stop
Supplier Device Package: AG-IHVB190
NTC Thermistor: No
Vce(on) (Max) @ Vge, Ic: 2.85V @ 15V, 1.5kA
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Single Switch
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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TLE9274QXV33XUMA1 Infineon-TLE9274QX%20V33-DataSheet-v01_50-EN.pdf?fileId=5546d4627762291e01776d6101847b85
Hersteller: Infineon Technologies
Description: OPTIREG SYST BASIS CHIPS PG-VQFN
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Voltage - Output: Multiple
Mounting Type: Surface Mount
Number of Outputs: 4
Voltage - Input: 4.5V ~ 28V
Operating Temperature: -40°C ~ 150°C (TJ)
Supplier Device Package: PG-VQFN-48-31
Grade: Automotive
Produkt ist nicht verfügbar
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TD170N12KOFHPSA1 TT170N.pdf
TD170N12KOFHPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1.8KV 350A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 5200A @ 50Hz
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 223 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (RMS)) (Max): 350 A
Voltage - Off State: 1.8 kV
auf Bestellung 6 Stücke:
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AnzahlPreis
2+202.7 EUR
Mindestbestellmenge: 2 Stücke
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TD170N12KOFHPSA1 TT170N.pdf
TD170N12KOFHPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1.8KV 350A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 5200A @ 50Hz
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 223 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (RMS)) (Max): 350 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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TC337DA32F200SAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC337DA32F200SAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 292LFBGA
DigiKey Programmable: Not Verified
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, I2S, LVDS, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Core Size: 32-Bit Single-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.54K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 200MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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FD600R12KF4NOSA1 FD600R12KF4_v02_Jan98.pdf
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 600A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 3.2V @ 15V, 600A
NTC Thermistor: No
Current - Collector (Ic) (Max): 600 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 3900 W
Current - Collector Cutoff (Max): 8 mA
Input Capacitance (Cies) @ Vce: 45 nF @ 25 V
auf Bestellung 4 Stücke:
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AnzahlPreis
1+1234.31 EUR
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CY14V101QS-BK108XIT Infineon-CY14V101QS_1-Mbit_(128K_8)_Quad_SPI_nvSRAM-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed151594d8a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY14V101QS-BK108XIT
Hersteller: Infineon Technologies
Description: IC NVSRAM 1MBIT SPI 24FBGA
Packaging: Tape & Reel (TR)
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: NVSRAM (Non-Volatile SRAM)
Clock Frequency: 108 MHz
Memory Format: NVSRAM
Supplier Device Package: 24-FBGA (6x8)
Memory Interface: SPI
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SLF9620M51XHSA1
Hersteller: Infineon Technologies
Description: IC SECURITY CHIP CARD CTLR SMD
Packaging: Tape & Reel (TR)
Interface: ISO/IEC 7816 Interface
Operating Temperature: -25°C ~ 70°C (TA)
Applications: Security
Core Processor: ARM® Cortex®-M4
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FP35R12W2T4PB11BPSA1 Infineon-FP35R12W2T4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625bd71aa0015bfb8803656ea3
FP35R12W2T4PB11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 70A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 35A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 2 nF @ 25 V
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
6+79.39 EUR
Mindestbestellmenge: 6 Stücke
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