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IMZC140R019M2HXKSA1 IMZC140R019M2HXKSA1 Infineon Technologies infineon-imzc140r019m2h-datasheet-en.pdf Description: IMZC140R019M2HXKSA1
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 92A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 40.4A, 18V
Power Dissipation (Max): 380W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 12.7mA
Supplier Device Package: PG-TO247-4-17
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1400 V
Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2860 pF @ 1000 V
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IMZC140R024M2HXKSA1 IMZC140R024M2HXKSA1 Infineon Technologies infineon-imzc140r024m2h-datasheet-en.pdf Description: IMZC140R024M2HXKSA1
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 74A (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 32.1A, 18V
Power Dissipation (Max): 330W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 10.1mA
Supplier Device Package: PG-TO247-4-17
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1400 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2290 pF @ 1000 V
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EB2ED24103D1BCSPTOBO1 EB2ED24103D1BCSPTOBO1 Infineon Technologies Description: EB 2ED2410 3D 1BCSP
Packaging: Bulk
Function: MOSFET
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 2ED2410-EM
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DD800S17K3_B2 Infineon Technologies DD800S17K3_B2.pdf Description: DIODE MODULE GEN PURP 1700V
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Operating Temperature - Junction: -40°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 800 A
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IMZA120R012M2HXKSA1 IMZA120R012M2HXKSA1 Infineon Technologies infineon-imza120r012m2h-datasheet-en.pdf?fileId=8ac78c8c9625080601968fde0d5f5dc5 Description: IMZA120R012M2HXKSA1
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 129A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 57A, 18V
Power Dissipation (Max): 480W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 17.8mA
Supplier Device Package: PG-TO247-4-8
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 4050 pF @ 800 V
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IM66D130MV01XTMA1 IM66D130MV01XTMA1 Infineon Technologies Description: IM66D130MV01XTMA1
Packaging: Tape & Reel (TR)
Frequency Range: 35 Hz
Voltage Range: 1.6 V ~ 3.465 V
Current - Supply: 640 µA
Voltage - Rated: 1.8 V
Height (Max): 0.039" (0.98mm)
Port Location: Bottom
Ratings: IP57 - Dust Protected, Waterproof
Direction: Omnidirectional
Termination: Solder Pads
S/N Ratio: 66dB
Type: MEMS (Silicon)
Shape: Rectangular
Sensitivity: -37dB ±1dB @ 94dB SPL
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Output Type: Digital, PDM
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IM66D130MV01XTMA1 IM66D130MV01XTMA1 Infineon Technologies Description: IM66D130MV01XTMA1
Frequency Range: 35 Hz
Voltage Range: 1.6 V ~ 3.465 V
Current - Supply: 640 µA
Voltage - Rated: 1.8 V
Height (Max): 0.039" (0.98mm)
Port Location: Bottom
Ratings: IP57 - Dust Protected, Waterproof
Direction: Omnidirectional
Termination: Solder Pads
Packaging: Cut Tape (CT)
S/N Ratio: 66dB
Type: MEMS (Silicon)
Shape: Rectangular
Sensitivity: -37dB ±1dB @ 94dB SPL
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Output Type: Digital, PDM
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KITIM68D121JV01FLEXTOBO1 KITIM68D121JV01FLEXTOBO1 Infineon Technologies infineon-xensiv-sensor-solutions-product-selection-guide-en.pdf Description: KITIM68D121JV01FLEXTOBO1
Packaging: Box
Function: MEMS Omnidirectional Microphones
Type: Audio
Contents: Board(s)
Utilized IC / Part: IM68D121JV01
Secondary Attributes: Analog Output
Embedded: No
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IMDQ75R008M1HXUMA1 IMDQ75R008M1HXUMA1 Infineon Technologies Infineon-IMDQ75R008M1H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8afe5bd0018b6132fe9921f4 Description: SILICON CARBIDE MOSFET
Packaging: Tape & Reel (TR)
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IMDQ75R008M1HXUMA1 IMDQ75R008M1HXUMA1 Infineon Technologies Infineon-IMDQ75R008M1H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8afe5bd0018b6132fe9921f4 Description: SILICON CARBIDE MOSFET
Packaging: Cut Tape (CT)
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ISC025N06LM6ATMA1 Infineon Technologies Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Ta), 143A (Tc)
Rds On (Max) @ Id, Vgs: 2.5mOhm @ 20A, 10V
Power Dissipation (Max): 3W (Ta), 100W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 38µA
Supplier Device Package: PG-TDSON-8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 61 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4200 pF @ 30 V
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IRAMS06UP60A-2 IRAMS06UP60A-2 Infineon Technologies IRAMS06UP60A.pdf Description: IGBT IPM 600V 6A 23-PWRSIP MOD
Voltage: 600 V
Current: 6 A
Voltage - Isolation: 2000Vrms
Configuration: 3 Phase
Type: IGBT
Mounting Type: Through Hole
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Packaging: Tube
Produkt ist nicht verfügbar
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7GA830343H0 Infineon Technologies Description: IC MCU
DigiKey Programmable: Not Verified
Packaging: Bulk
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CY8C29866-24AXIT CY8C29866-24AXIT Infineon Technologies Infineon-CY8C29466_CY8C29566_CY8C29666_CY8C29866_PSoC_Programmable_System-on-Chip-DataSheet-v31_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec690c03ce1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integra Description: IC MCU 8BIT 32KB FLASH 100TQFP
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-TQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 12x14b; D/A 4x9b
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CY8C4146AZE-S275T CY8C4146AZE-S275T Infineon Technologies Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8 Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
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CYAT81689-100AS71Z CYAT81689-100AS71Z Infineon Technologies CYAT8168x.pdf Description: TrueTouch
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Resolution (Bits): 32 b
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
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AIMBG75R025M2HXTMA1 AIMBG75R025M2HXTMA1 Infineon Technologies Description: AIMBG75R025M2HXTMA1
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 1729 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 49 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -7V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-TO263-7-12
Vgs(th) (Max) @ Id: 5.6V @ 8.1mA
Power Dissipation (Max): 234W (Tc)
Rds On (Max) @ Id, Vgs: 22mOhm @ 36.7A, 20V
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
FET Type: N-Channel
Technology: SiC (Silicon Carbide Junction Transistor)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Tape & Reel (TR)
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AIMBG75R025M2HXTMA1 AIMBG75R025M2HXTMA1 Infineon Technologies Description: AIMBG75R025M2HXTMA1
Vgs(th) (Max) @ Id: 5.6V @ 8.1mA
Power Dissipation (Max): 234W (Tc)
Rds On (Max) @ Id, Vgs: 22mOhm @ 36.7A, 20V
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
FET Type: N-Channel
Technology: SiC (Silicon Carbide Junction Transistor)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 1729 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 49 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -7V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-TO263-7-12
Packaging: Cut Tape (CT)
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IMTA65R033M2HXTMA1 IMTA65R033M2HXTMA1 Infineon Technologies Infineon-IMTA65R033M2H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c93dda25b0194fb2d51436735 Description: SILICON CARBIDE MOSFET
Packaging: Tape & Reel (TR)
Package / Case: 4-PowerLSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 27.9A, 20V
Power Dissipation (Max): 315W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 5.7mA
Supplier Device Package: PG-LHSOF-4-1
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1214 pF @ 400 V
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IMTA65R033M2HXTMA1 IMTA65R033M2HXTMA1 Infineon Technologies Infineon-IMTA65R033M2H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c93dda25b0194fb2d51436735 Description: SILICON CARBIDE MOSFET
Packaging: Cut Tape (CT)
Package / Case: 4-PowerLSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 27.9A, 20V
Power Dissipation (Max): 315W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 5.7mA
Supplier Device Package: PG-LHSOF-4-1
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1214 pF @ 400 V
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TLE9018DQKXUMA1 TLE9018DQKXUMA1 Infineon Technologies infineon-tle9018dqk-datasheet-en.pdf Description: BATTERYMANAGEMENT_ICS
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Battery Chemistry: Lithium Ion
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Qualification: AEC-Q100
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TLE9018DQKXUMA1 TLE9018DQKXUMA1 Infineon Technologies infineon-tle9018dqk-datasheet-en.pdf Description: BATTERYMANAGEMENT_ICS
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Battery Chemistry: Lithium Ion
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Qualification: AEC-Q100
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TLE9189QVWSXUMA1 TLE9189QVWSXUMA1 Infineon Technologies Infineon-TLE9189QV-DataSheet-v01_00-EN.pdf Description: BLDC_MOTOR_CONTROL
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Current Management
Interface: PWM, SPI
Operating Temperature: -40°C ~ 175°C
Output Configuration: Half Bridge (3)
Voltage - Supply: 4.2V ~ 36V
Applications: General Purpose
Technology: NMOS
Voltage - Load: 4.2V ~ 36V
Supplier Device Package: PG-VQFN-48-79
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Qualification: AEC-Q100
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BGSX33MA16E6327XTSA1 Infineon Technologies Description: ANTENNA DEVICES
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY7C1061G30-10ZXE CY7C1061G30-10ZXE Infineon Technologies Infineon-CY7C1061G_Automotive_16-Mbit_(1_M_words_x_16_bit)_Static_RAM_with_Error-Correcting_Code_(ECC)-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed74055586f&utm_source=cypress&utm_medium=referral&utm_campaign=202110 Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
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IRF7328TR IRF7328TR Infineon Technologies irf7328pbf.pdf?fileId=5546d462533600a4015355f60f931b53 Description: MOSFET 2P-CH 30V 8A 8SO
Supplier Device Package: 8-SO
Vgs(th) (Max) @ Id: 2.5V @ 250µA
FET Feature: Logic Level Gate
Gate Charge (Qg) (Max) @ Vgs: 78nC @ 10V
Rds On (Max) @ Id, Vgs: 21mOhm @ 8A, 10V
Input Capacitance (Ciss) (Max) @ Vds: 2675pF @ 25V
Current - Continuous Drain (Id) @ 25°C: 8A
Drain to Source Voltage (Vdss): 30V
Power - Max: 2W
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Configuration: 2 P-Channel (Dual)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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IMT44R015M2HXTMA2 IMT44R015M2HXTMA2 Infineon Technologies infineon-imt44r015m2h-datasheet-en.pdf Description: SICFET N-CH 440V 111A PG-HSOF-8
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11.7A (Ta), 111A (Tc)
Rds On (Max) @ Id, Vgs: 19.1mOhm @ 27.1A, 18V
Power Dissipation (Max): 3.8W (Ta), 341W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 9.7mA
Supplier Device Package: PG-HSOF-8
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +25V, -10V
Drain to Source Voltage (Vdss): 440 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2730 pF @ 200 V
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IMT44R015M2HXTMA2 IMT44R015M2HXTMA2 Infineon Technologies infineon-imt44r015m2h-datasheet-en.pdf Description: SICFET N-CH 440V 111A PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11.7A (Ta), 111A (Tc)
Rds On (Max) @ Id, Vgs: 19.1mOhm @ 27.1A, 18V
Power Dissipation (Max): 3.8W (Ta), 341W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 9.7mA
Supplier Device Package: PG-HSOF-8
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +25V, -10V
Drain to Source Voltage (Vdss): 440 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2730 pF @ 200 V
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TLE42794GXUMA1 TLE42794GXUMA1 Infineon Technologies Infineon-TLE42794-DS-v01_20-EN.pdf?fileId=5546d46258fc0bc101595f8e494d1f80 Description: IC REG LINEAR 5V 150MA 8DSO
Supplier Device Package: PG-DSO-8
Number of Regulators: 1
Voltage - Input (Max): 45V
Current - Quiescent (Iq): 280 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 150°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Current - Supply (Max): 8 mA
Protection Features: Over Current, Over Temperature, Reverse Polarity, Short Circuit
Voltage Dropout (Max): 0.5V @ 100mA
PSRR: 70dB (100Hz)
Grade: Automotive
Control Features: Reset
Voltage - Output (Min/Fixed): 5V
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TLE42794GXUMA1 TLE42794GXUMA1 Infineon Technologies Infineon-TLE42794-DS-v01_20-EN.pdf?fileId=5546d46258fc0bc101595f8e494d1f80 Description: IC REG LINEAR 5V 150MA 8DSO
Qualification: AEC-Q100
Current - Supply (Max): 8 mA
Protection Features: Over Current, Over Temperature, Reverse Polarity, Short Circuit
Voltage Dropout (Max): 0.5V @ 100mA
PSRR: 70dB (100Hz)
Grade: Automotive
Control Features: Reset
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: PG-DSO-8
Number of Regulators: 1
Voltage - Input (Max): 45V
Current - Quiescent (Iq): 280 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 150°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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ISC031N08NM6SCATMA1 ISC031N08NM6SCATMA1 Infineon Technologies Infineon-ISC031N08NM6SC-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c962508060196a72e2b7d7f04 Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerWDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Ta), 145A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 65µA
Supplier Device Package: PG-WSON-8-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 44 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 40 V
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ISC009N06NM6SCATMA1 ISC009N06NM6SCATMA1 Infineon Technologies Infineon-ISC009N06NM6SC-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c962508060196a72e39af7f07 Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerWDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 344A (Tc)
Rds On (Max) @ Id, Vgs: 0.9mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 221W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 118µA
Supplier Device Package: PG-WSON-8-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 121 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8300 pF @ 30 V
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ISC018N08NM6SCATMA1 ISC018N08NM6SCATMA1 Infineon Technologies Infineon-ISC018N08NM6SC-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c962508060196a72e1d697f01 Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerWDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 27A (Ta), 230A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 217W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 114µA
Supplier Device Package: PG-WSON-8-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 76 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5400 pF @ 40 V
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XMC1402Q064X0200AAXTMA1 XMC1402Q064X0200AAXTMA1 Infineon Technologies Infineon-XMC1400-DataSheet-v01_06-EN.pdf?fileId=5546d46250cc1fdf015110a2596343b2 Description: XMC1000
Number of I/O: 48
Supplier Device Package: PG-VQFN-64-6
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 200KB (200K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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EB2ED24103D1BCSTOBO1 EB2ED24103D1BCSTOBO1 Infineon Technologies Description: EB 2ED2410 3D 1BCS
Packaging: Bulk
Function: MOSFET
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 2ED2410-EM
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TLD40203DBTOBO1 Infineon Technologies infineon-tld4020-3std-kit-ug-usermanual-en.pdf Description: TLD40203DBTOBO1
Packaging: Box
Function: LED Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TLD4020-3
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BTS700151ESPXUMA2 BTS700151ESPXUMA2 Infineon Technologies Infineon-BTS70015-1ESP-DataSheet-v01_20-EN.pdf?fileId=5546d462758f5bd101759850638039aa Description: PROFET PG-TSDSO-24
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, UVLO
Supplier Device Package: PG-TSDSO-24-32
Ratio - Input:Output: 1:1
Current - Output (Max): 27.6A
Voltage - Supply (Vcc/Vdd): 4.1V ~ 28V
Voltage - Load: 4.1V ~ 28V
Input Type: Non-Inverting
Rds On (Typ): 1.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: USB Switch
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
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100+4.44 EUR
250+4.21 EUR
500+4.08 EUR
1000+3.96 EUR
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BGA8G1BN6E6327XTSA1 BGA8G1BN6E6327XTSA1 Infineon Technologies Description: IC RF AMP 1.452GHZ-1.61GHZ TSNP6
Voltage - Supply: 1.6V ~ 3.1V
Frequency: 1.452GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Supplier Device Package: PG-TSNP-6-2
Test Frequency: 1.452GHz ~ 1.61GHz
P1dB: 8dBm
Noise Figure: 0.8dB ~ 4.1dB
Current - Supply: 4.7mA
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IDWD75G120C5XKSA1 IDWD75G120C5XKSA1 Infineon Technologies Infineon-IDWD75G120C5-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c93dda25b019547353c661aba Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 4243pF @ 1V, 100kHz
Current - Average Rectified (Io): 186A
Supplier Device Package: PG-TO247-2-U01
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 75 A
Current - Reverse Leakage @ Vr: 600 µA @ 1.2 kV
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DF80R07W1H5S8B11BOMA1 Infineon Technologies Description: EASY STANDARD
Packaging: Tray
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IMZC120R017M2HXKSA1 IMZC120R017M2HXKSA1 Infineon Technologies IMZC120R017M2HXKSA1.pdf Description: SICFET N-CH 1200V 97A TO247
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 40A, 18V
Power Dissipation (Max): 382W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 12.7mA
Supplier Device Package: PG-TO247-4-17
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 89 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2910 pF @ 800 V
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CY8C4146LDSS243XQLA1 Infineon Technologies infineon-automotive-psoc-4100s-plus-datasheet-en-09018a9080860d3f.pdf Description: PSOC4 - GENERAL
Packaging: Tray
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 40-QFN (6x6)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
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CY8C4146LDSS243TXUMA1 Infineon Technologies infineon-automotive-psoc-4100s-plus-datasheet-en-09018a9080860d3f.pdf Description: PSOC4 - GENERAL
Packaging: Tape & Reel (TR)
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 40-QFN (6x6)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
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CY8C4147LDSS243XQLA1 CY8C4147LDSS243XQLA1 Infineon Technologies infineon-automotive-psoc-4100s-plus-datasheet-en-09018a9080860d3f.pdf Description: PSOC4 - GENERAL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
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CY8C4147LDSS243TXUMA1 CY8C4147LDSS243TXUMA1 Infineon Technologies infineon-automotive-psoc-4100s-plus-datasheet-en-09018a9080860d3f.pdf Description: PSOC4 - GENERAL
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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IM68D128BV01XTMA1 IM68D128BV01XTMA1 Infineon Technologies Infineon-IM68D128B-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c9625080601969ef5753044c3 Description: IM68D128BV01XTMA1
Packaging: Tape & Reel (TR)
Output Type: Digital, PDM
Size / Dimension: 0.138" L x 0.104" W (3.50mm x 2.65mm)
Sensitivity: -37dB ±1dB @ 94dB SPL
Shape: Rectangular
Type: MEMS (Silicon)
S/N Ratio: 67.5dB
Termination: Solder Pads
Direction: Omnidirectional
Ratings: IP67 - Dust Tight, Waterproof
Port Location: Bottom
Height (Max): 0.043" (1.08mm)
Voltage - Rated: 1.8 V
Current - Supply: 5 µA
Voltage Range: 1.6 V ~ 3.465 V
Frequency Range: 10 Hz ~ 10 kHz
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IM68D128BV01XTMA1 IM68D128BV01XTMA1 Infineon Technologies Infineon-IM68D128B-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c9625080601969ef5753044c3 Description: IM68D128BV01XTMA1
Packaging: Cut Tape (CT)
Output Type: Digital, PDM
Size / Dimension: 0.138" L x 0.104" W (3.50mm x 2.65mm)
Sensitivity: -37dB ±1dB @ 94dB SPL
Shape: Rectangular
Type: MEMS (Silicon)
S/N Ratio: 67.5dB
Termination: Solder Pads
Direction: Omnidirectional
Ratings: IP67 - Dust Tight, Waterproof
Port Location: Bottom
Height (Max): 0.043" (1.08mm)
Voltage - Rated: 1.8 V
Current - Supply: 5 µA
Voltage Range: 1.6 V ~ 3.465 V
Frequency Range: 10 Hz ~ 10 kHz
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9+2.46 EUR
10+2.34 EUR
25+2.2 EUR
50+2.11 EUR
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1000+1.77 EUR
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IMZA120R022M2HXKSA1 IMZA120R022M2HXKSA1 Infineon Technologies infineon-imza120r022m2h-datasheet-en.pdf?fileId=8ac78c8c9625080601968fddf0bb5dbf Description: IMZA120R022M2HXKSA1
Current - Continuous Drain (Id) @ 25°C: 80A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-4
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 2330 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 71 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +25V, -10V
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Supplier Device Package: PG-TO247-4-8
Vgs(th) (Max) @ Id: 5.1V @ 10.1mA
Power Dissipation (Max): 329W (Tc)
Rds On (Max) @ Id, Vgs: 29mOhm @ 32A, 18V
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TLE95633QXWJXUMA1 Infineon Technologies Description: BLDC_MOTOR_CONTROL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IRFBL3315 IRFBL3315 Infineon Technologies IR_PartNumberingSystem.pdf Description: MOSFET N-CH 150V 21A SUPER D2PAK
Current - Continuous Drain (Id) @ 25°C: 21A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Super D2-Pak
Packaging: Tube
Drain to Source Voltage (Vdss): 150 V
Supplier Device Package: Super D2-Pak
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TDA22561XUMA1 Infineon Technologies Description: POWERSTAGE CE
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY7C1361C-100AXC CY7C1361C-100AXC Infineon Technologies Infineon-CY7C1361C_CY7C1363C_9-Mbit_(256_K_36_512_K_18)_Flow-Through_SRAM-DataSheet-v22_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebdc53d30a8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fil Description: IC SRAM 9MBIT PAR 100TQFP
DigiKey Programmable: Not Verified
Memory Organization: 256K x 36
Access Time: 8.5 ns
Memory Interface: Parallel
Supplier Device Package: 100-TQFP (14x20)
Memory Format: SRAM
Clock Frequency: 100 MHz
Technology: SRAM - Synchronous, SDR
Voltage - Supply: 3.135V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Volatile
Memory Size: 9Mbit
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
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FF06MR12A04MA2AKSA1 FF06MR12A04MA2AKSA1 Infineon Technologies infineon-ff06mr12a04ma2-datasheet-en.pdf Description: HYBRIDPACK DSC S MODULE WITH SIC
Packaging: Tube
Package / Case: 11-PowerDIP Module (2.091", 53.10mm)
Mounting Type: Through Hole
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 20mW
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 190A
Input Capacitance (Ciss) (Max) @ Vds: 10100pF @ 850V
Rds On (Max) @ Id, Vgs: 5.56mOhm @ 190A, 18V
Gate Charge (Qg) (Max) @ Vgs: 420nC @ 18V
Vgs(th) (Max) @ Id: 4.55V @ 60mA
Supplier Device Package: PG-MDIP-11-1
Grade: Automotive
Qualification: AEC-Q101
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IPB65R420CFDATMA1 IPB65R420CFDATMA1 Infineon Technologies IPx65R420CFD.pdf Description: MOSFET N-CH 650V 8.7A D2PAK
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 870 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 10 V
Drain to Source Voltage (Vdss): 650 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: PG-TO263-3
Vgs(th) (Max) @ Id: 4.5V @ 340µA
Power Dissipation (Max): 83.3W (Tc)
Rds On (Max) @ Id, Vgs: 420mOhm @ 3.4A, 10V
Current - Continuous Drain (Id) @ 25°C: 8.7A (Tc)
Produkt ist nicht verfügbar
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CYT3DLABABQ1AESGS CYT3DLABABQ1AESGS Infineon Technologies Infineon-CYT3DL_TRAVEO_TM_T2G_32-BIT_AUTOMOTIVE_MCU_BASED_ON_ARM_R_CORTEX_R_-M7_SINGLE-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c869190210186f0ccf72f3fd3 Description: TRAVEO-2 CLUST.2.5DGRAPH
Number of I/O: 108
Supplier Device Package: 216-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 4.0625MB (4.0625M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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CYT4DNJBACQ1BZSGS CYT4DNJBACQ1BZSGS Infineon Technologies Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0 Description: TRAVEO-2 CLUST.2.5DGRAPH
Number of I/O: 168
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tray
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Produkt ist nicht verfügbar
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CYT4DNJBACQ1BZSGST CYT4DNJBACQ1BZSGST Infineon Technologies Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0 Description: TRAVEO-2 CLUST.2.5DGRAPH
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
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CYT4DNJBBCQ1BZSGS CYT4DNJBBCQ1BZSGS Infineon Technologies Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0 Description: TRAVEO-2 CLUST.2.5DGRAPH
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CYT4DNJBBCQ1BZSGST CYT4DNJBBCQ1BZSGST Infineon Technologies Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0 Description: TRAVEO-2 CLUST.2.5DGRAPH
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
Produkt ist nicht verfügbar
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CYT4DNJBGCQ1BZSGS CYT4DNJBGCQ1BZSGS Infineon Technologies Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0 Description: TRAVEO-2 CLUST.2.5DGRAPH
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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IMZC140R019M2HXKSA1 infineon-imzc140r019m2h-datasheet-en.pdf
IMZC140R019M2HXKSA1
Hersteller: Infineon Technologies
Description: IMZC140R019M2HXKSA1
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 92A (Tc)
Rds On (Max) @ Id, Vgs: 19mOhm @ 40.4A, 18V
Power Dissipation (Max): 380W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 12.7mA
Supplier Device Package: PG-TO247-4-17
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1400 V
Gate Charge (Qg) (Max) @ Vgs: 78 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2860 pF @ 1000 V
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30+20.37 EUR
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IMZC140R024M2HXKSA1 infineon-imzc140r024m2h-datasheet-en.pdf
IMZC140R024M2HXKSA1
Hersteller: Infineon Technologies
Description: IMZC140R024M2HXKSA1
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 74A (Tc)
Rds On (Max) @ Id, Vgs: 24mOhm @ 32.1A, 18V
Power Dissipation (Max): 330W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 10.1mA
Supplier Device Package: PG-TO247-4-17
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1400 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2290 pF @ 1000 V
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1+28.49 EUR
30+17.4 EUR
120+14.97 EUR
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EB2ED24103D1BCSPTOBO1
EB2ED24103D1BCSPTOBO1
Hersteller: Infineon Technologies
Description: EB 2ED2410 3D 1BCSP
Packaging: Bulk
Function: MOSFET
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 2ED2410-EM
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DD800S17K3_B2 DD800S17K3_B2.pdf
Hersteller: Infineon Technologies
Description: DIODE MODULE GEN PURP 1700V
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Operating Temperature - Junction: -40°C ~ 125°C
Voltage - DC Reverse (Vr) (Max): 1700 V
Voltage - Forward (Vf) (Max) @ If: 2.2 V @ 800 A
Produkt ist nicht verfügbar
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IMZA120R012M2HXKSA1 infineon-imza120r012m2h-datasheet-en.pdf?fileId=8ac78c8c9625080601968fde0d5f5dc5
IMZA120R012M2HXKSA1
Hersteller: Infineon Technologies
Description: IMZA120R012M2HXKSA1
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 129A (Tc)
Rds On (Max) @ Id, Vgs: 16mOhm @ 57A, 18V
Power Dissipation (Max): 480W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 17.8mA
Supplier Device Package: PG-TO247-4-8
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 124 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 4050 pF @ 800 V
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1+42.54 EUR
30+27.19 EUR
120+26.12 EUR
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IM66D130MV01XTMA1
IM66D130MV01XTMA1
Hersteller: Infineon Technologies
Description: IM66D130MV01XTMA1
Packaging: Tape & Reel (TR)
Frequency Range: 35 Hz
Voltage Range: 1.6 V ~ 3.465 V
Current - Supply: 640 µA
Voltage - Rated: 1.8 V
Height (Max): 0.039" (0.98mm)
Port Location: Bottom
Ratings: IP57 - Dust Protected, Waterproof
Direction: Omnidirectional
Termination: Solder Pads
S/N Ratio: 66dB
Type: MEMS (Silicon)
Shape: Rectangular
Sensitivity: -37dB ±1dB @ 94dB SPL
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Output Type: Digital, PDM
Produkt ist nicht verfügbar
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IM66D130MV01XTMA1
IM66D130MV01XTMA1
Hersteller: Infineon Technologies
Description: IM66D130MV01XTMA1
Frequency Range: 35 Hz
Voltage Range: 1.6 V ~ 3.465 V
Current - Supply: 640 µA
Voltage - Rated: 1.8 V
Height (Max): 0.039" (0.98mm)
Port Location: Bottom
Ratings: IP57 - Dust Protected, Waterproof
Direction: Omnidirectional
Termination: Solder Pads
Packaging: Cut Tape (CT)
S/N Ratio: 66dB
Type: MEMS (Silicon)
Shape: Rectangular
Sensitivity: -37dB ±1dB @ 94dB SPL
Size / Dimension: 0.118" L x 0.079" W (3.00mm x 2.00mm)
Output Type: Digital, PDM
Produkt ist nicht verfügbar
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KITIM68D121JV01FLEXTOBO1 infineon-xensiv-sensor-solutions-product-selection-guide-en.pdf
KITIM68D121JV01FLEXTOBO1
Hersteller: Infineon Technologies
Description: KITIM68D121JV01FLEXTOBO1
Packaging: Box
Function: MEMS Omnidirectional Microphones
Type: Audio
Contents: Board(s)
Utilized IC / Part: IM68D121JV01
Secondary Attributes: Analog Output
Embedded: No
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IMDQ75R008M1HXUMA1 Infineon-IMDQ75R008M1H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8afe5bd0018b6132fe9921f4
IMDQ75R008M1HXUMA1
Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IMDQ75R008M1HXUMA1 Infineon-IMDQ75R008M1H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c8afe5bd0018b6132fe9921f4
IMDQ75R008M1HXUMA1
Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET
Packaging: Cut Tape (CT)
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ISC025N06LM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Ta), 143A (Tc)
Rds On (Max) @ Id, Vgs: 2.5mOhm @ 20A, 10V
Power Dissipation (Max): 3W (Ta), 100W (Tc)
Vgs(th) (Max) @ Id: 2.3V @ 38µA
Supplier Device Package: PG-TDSON-8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 61 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 4200 pF @ 30 V
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5000+1.49 EUR
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IRAMS06UP60A-2 IRAMS06UP60A.pdf
IRAMS06UP60A-2
Hersteller: Infineon Technologies
Description: IGBT IPM 600V 6A 23-PWRSIP MOD
Voltage: 600 V
Current: 6 A
Voltage - Isolation: 2000Vrms
Configuration: 3 Phase
Type: IGBT
Mounting Type: Through Hole
Package / Case: 23-PowerSIP Module, 19 Leads, Formed Leads
Packaging: Tube
Produkt ist nicht verfügbar
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7GA830343H0
Hersteller: Infineon Technologies
Description: IC MCU
DigiKey Programmable: Not Verified
Packaging: Bulk
Produkt ist nicht verfügbar
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CY8C29866-24AXIT Infineon-CY8C29466_CY8C29566_CY8C29666_CY8C29866_PSoC_Programmable_System-on-Chip-DataSheet-v31_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec690c03ce1&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integra
CY8C29866-24AXIT
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH 100TQFP
Core Processor: M8C
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 2K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Number of I/O: 64
Supplier Device Package: 100-TQFP (14x14)
Peripherals: POR, PWM, WDT
Connectivity: I2C, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Core Size: 8-Bit
Data Converters: A/D 12x14b; D/A 4x9b
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AnzahlPrivatkunde
1500+18.78 EUR
Mindestbestellmenge: 1500 Stücke
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CY8C4146AZE-S275T Infineon-Automotive_PSoC_4_PSoC_4100S_Plus_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee7ff0b70e8
CY8C4146AZE-S275T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 64TQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, LCD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 64-TQFP (10x10)
Grade: Automotive
Number of I/O: 54
DigiKey Programmable: Not Verified
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CYAT81689-100AS71Z CYAT8168x.pdf
CYAT81689-100AS71Z
Hersteller: Infineon Technologies
Description: TrueTouch
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I2C, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Resolution (Bits): 32 b
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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AIMBG75R025M2HXTMA1
AIMBG75R025M2HXTMA1
Hersteller: Infineon Technologies
Description: AIMBG75R025M2HXTMA1
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 1729 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 49 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -7V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-TO263-7-12
Vgs(th) (Max) @ Id: 5.6V @ 8.1mA
Power Dissipation (Max): 234W (Tc)
Rds On (Max) @ Id, Vgs: 22mOhm @ 36.7A, 20V
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
FET Type: N-Channel
Technology: SiC (Silicon Carbide Junction Transistor)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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AIMBG75R025M2HXTMA1
AIMBG75R025M2HXTMA1
Hersteller: Infineon Technologies
Description: AIMBG75R025M2HXTMA1
Vgs(th) (Max) @ Id: 5.6V @ 8.1mA
Power Dissipation (Max): 234W (Tc)
Rds On (Max) @ Id, Vgs: 22mOhm @ 36.7A, 20V
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
FET Type: N-Channel
Technology: SiC (Silicon Carbide Junction Transistor)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Qualification: AEC-Q101
Input Capacitance (Ciss) (Max) @ Vds: 1729 pF @ 500 V
Gate Charge (Qg) (Max) @ Vgs: 49 nC @ 18 V
Drain to Source Voltage (Vdss): 750 V
Vgs (Max): +23V, -7V
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Grade: Automotive
Supplier Device Package: PG-TO263-7-12
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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IMTA65R033M2HXTMA1 Infineon-IMTA65R033M2H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c93dda25b0194fb2d51436735
IMTA65R033M2HXTMA1
Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET
Packaging: Tape & Reel (TR)
Package / Case: 4-PowerLSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 27.9A, 20V
Power Dissipation (Max): 315W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 5.7mA
Supplier Device Package: PG-LHSOF-4-1
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1214 pF @ 400 V
Produkt ist nicht verfügbar
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IMTA65R033M2HXTMA1 Infineon-IMTA65R033M2H-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c93dda25b0194fb2d51436735
IMTA65R033M2HXTMA1
Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET
Packaging: Cut Tape (CT)
Package / Case: 4-PowerLSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 68A (Tc)
Rds On (Max) @ Id, Vgs: 30mOhm @ 27.9A, 20V
Power Dissipation (Max): 315W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 5.7mA
Supplier Device Package: PG-LHSOF-4-1
Drive Voltage (Max Rds On, Min Rds On): 15V, 20V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 34 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 1214 pF @ 400 V
auf Bestellung 24 Stücke:
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AnzahlPrivatkunde
2+19.87 EUR
10+13.68 EUR
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TLE9018DQKXUMA1 infineon-tle9018dqk-datasheet-en.pdf
TLE9018DQKXUMA1
Hersteller: Infineon Technologies
Description: BATTERYMANAGEMENT_ICS
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Battery Chemistry: Lithium Ion
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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TLE9018DQKXUMA1 infineon-tle9018dqk-datasheet-en.pdf
TLE9018DQKXUMA1
Hersteller: Infineon Technologies
Description: BATTERYMANAGEMENT_ICS
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP Exposed Pad
Number of Cells: 18
Mounting Type: Surface Mount
Function: Multi-Function Controller
Battery Chemistry: Lithium Ion
Supplier Device Package: PG-LQFP-64-28
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 342 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+18.1 EUR
10+14.11 EUR
25+13.13 EUR
100+12.03 EUR
250+11.51 EUR
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TLE9189QVWSXUMA1 Infineon-TLE9189QV-DataSheet-v01_00-EN.pdf
TLE9189QVWSXUMA1
Hersteller: Infineon Technologies
Description: BLDC_MOTOR_CONTROL
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount
Function: Controller - Current Management
Interface: PWM, SPI
Operating Temperature: -40°C ~ 175°C
Output Configuration: Half Bridge (3)
Voltage - Supply: 4.2V ~ 36V
Applications: General Purpose
Technology: NMOS
Voltage - Load: 4.2V ~ 36V
Supplier Device Package: PG-VQFN-48-79
Motor Type - AC, DC: Brushless DC (BLDC)
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BGSX33MA16E6327XTSA1
Hersteller: Infineon Technologies
Description: ANTENNA DEVICES
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY7C1061G30-10ZXE Infineon-CY7C1061G_Automotive_16-Mbit_(1_M_words_x_16_bit)_Static_RAM_with_Error-Correcting_Code_(ECC)-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed74055586f&utm_source=cypress&utm_medium=referral&utm_campaign=202110
CY7C1061G30-10ZXE
Hersteller: Infineon Technologies
Description: IC SRAM 16MBIT PARALLEL 48TSOP I
Packaging: Tray
Package / Case: 48-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.2V ~ 3.6V
Technology: SRAM - Asynchronous
Memory Format: SRAM
Supplier Device Package: 48-TSOP I
Write Cycle Time - Word, Page: 10ns
Memory Interface: Parallel
Access Time: 10 ns
Memory Organization: 1M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IRF7328TR irf7328pbf.pdf?fileId=5546d462533600a4015355f60f931b53
IRF7328TR
Hersteller: Infineon Technologies
Description: MOSFET 2P-CH 30V 8A 8SO
Supplier Device Package: 8-SO
Vgs(th) (Max) @ Id: 2.5V @ 250µA
FET Feature: Logic Level Gate
Gate Charge (Qg) (Max) @ Vgs: 78nC @ 10V
Rds On (Max) @ Id, Vgs: 21mOhm @ 8A, 10V
Input Capacitance (Ciss) (Max) @ Vds: 2675pF @ 25V
Current - Continuous Drain (Id) @ 25°C: 8A
Drain to Source Voltage (Vdss): 30V
Power - Max: 2W
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Configuration: 2 P-Channel (Dual)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IMT44R015M2HXTMA2 infineon-imt44r015m2h-datasheet-en.pdf
IMT44R015M2HXTMA2
Hersteller: Infineon Technologies
Description: SICFET N-CH 440V 111A PG-HSOF-8
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11.7A (Ta), 111A (Tc)
Rds On (Max) @ Id, Vgs: 19.1mOhm @ 27.1A, 18V
Power Dissipation (Max): 3.8W (Ta), 341W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 9.7mA
Supplier Device Package: PG-HSOF-8
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +25V, -10V
Drain to Source Voltage (Vdss): 440 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2730 pF @ 200 V
Produkt ist nicht verfügbar
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IMT44R015M2HXTMA2 infineon-imt44r015m2h-datasheet-en.pdf
IMT44R015M2HXTMA2
Hersteller: Infineon Technologies
Description: SICFET N-CH 440V 111A PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 11.7A (Ta), 111A (Tc)
Rds On (Max) @ Id, Vgs: 19.1mOhm @ 27.1A, 18V
Power Dissipation (Max): 3.8W (Ta), 341W (Tc)
Vgs(th) (Max) @ Id: 5.6V @ 9.7mA
Supplier Device Package: PG-HSOF-8
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +25V, -10V
Drain to Source Voltage (Vdss): 440 V
Gate Charge (Qg) (Max) @ Vgs: 62 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2730 pF @ 200 V
auf Bestellung 1960 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+27.62 EUR
10+19.39 EUR
100+16.14 EUR
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TLE42794GXUMA1 Infineon-TLE42794-DS-v01_20-EN.pdf?fileId=5546d46258fc0bc101595f8e494d1f80
TLE42794GXUMA1
Hersteller: Infineon Technologies
Description: IC REG LINEAR 5V 150MA 8DSO
Supplier Device Package: PG-DSO-8
Number of Regulators: 1
Voltage - Input (Max): 45V
Current - Quiescent (Iq): 280 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 150°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Current - Supply (Max): 8 mA
Protection Features: Over Current, Over Temperature, Reverse Polarity, Short Circuit
Voltage Dropout (Max): 0.5V @ 100mA
PSRR: 70dB (100Hz)
Grade: Automotive
Control Features: Reset
Voltage - Output (Min/Fixed): 5V
Produkt ist nicht verfügbar
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TLE42794GXUMA1 Infineon-TLE42794-DS-v01_20-EN.pdf?fileId=5546d46258fc0bc101595f8e494d1f80
TLE42794GXUMA1
Hersteller: Infineon Technologies
Description: IC REG LINEAR 5V 150MA 8DSO
Qualification: AEC-Q100
Current - Supply (Max): 8 mA
Protection Features: Over Current, Over Temperature, Reverse Polarity, Short Circuit
Voltage Dropout (Max): 0.5V @ 100mA
PSRR: 70dB (100Hz)
Grade: Automotive
Control Features: Reset
Voltage - Output (Min/Fixed): 5V
Supplier Device Package: PG-DSO-8
Number of Regulators: 1
Voltage - Input (Max): 45V
Current - Quiescent (Iq): 280 µA
Output Configuration: Positive
Operating Temperature: -40°C ~ 150°C
Current - Output: 150mA
Mounting Type: Surface Mount
Output Type: Fixed
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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ISC031N08NM6SCATMA1 Infineon-ISC031N08NM6SC-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c962508060196a72e2b7d7f04
ISC031N08NM6SCATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerWDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 21A (Ta), 145A (Tc)
Rds On (Max) @ Id, Vgs: 3.1mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 150W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 65µA
Supplier Device Package: PG-WSON-8-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 44 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3100 pF @ 40 V
Produkt ist nicht verfügbar
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ISC009N06NM6SCATMA1 Infineon-ISC009N06NM6SC-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c962508060196a72e39af7f07
ISC009N06NM6SCATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerWDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 40A (Ta), 344A (Tc)
Rds On (Max) @ Id, Vgs: 0.9mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 221W (Tc)
Vgs(th) (Max) @ Id: 3.3V @ 118µA
Supplier Device Package: PG-WSON-8-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 121 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 8300 pF @ 30 V
Produkt ist nicht verfügbar
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ISC018N08NM6SCATMA1 Infineon-ISC018N08NM6SC-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c962508060196a72e1d697f01
ISC018N08NM6SCATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerWDFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 27A (Ta), 230A (Tc)
Rds On (Max) @ Id, Vgs: 1.8mOhm @ 50A, 10V
Power Dissipation (Max): 3W (Ta), 217W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 114µA
Supplier Device Package: PG-WSON-8-2
Drive Voltage (Max Rds On, Min Rds On): 8V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 80 V
Gate Charge (Qg) (Max) @ Vgs: 76 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5400 pF @ 40 V
Produkt ist nicht verfügbar
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XMC1402Q064X0200AAXTMA1 Infineon-XMC1400-DataSheet-v01_06-EN.pdf?fileId=5546d46250cc1fdf015110a2596343b2
XMC1402Q064X0200AAXTMA1
Hersteller: Infineon Technologies
Description: XMC1000
Number of I/O: 48
Supplier Device Package: PG-VQFN-64-6
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Connectivity: I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Core Size: 32-Bit
Data Converters: A/D 12x12b SAR
Core Processor: ARM® Cortex®-M0
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 16K x 8
Program Memory Size: 200KB (200K x 8)
Speed: 48MHz
Mounting Type: Surface Mount
Package / Case: 64-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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EB2ED24103D1BCSTOBO1
EB2ED24103D1BCSTOBO1
Hersteller: Infineon Technologies
Description: EB 2ED2410 3D 1BCS
Packaging: Bulk
Function: MOSFET
Type: Power Management
Contents: Board(s)
Utilized IC / Part: 2ED2410-EM
auf Bestellung 1 Stücke:
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AnzahlPrivatkunde
1+170.48 EUR
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TLD40203DBTOBO1 infineon-tld4020-3std-kit-ug-usermanual-en.pdf
Hersteller: Infineon Technologies
Description: TLD40203DBTOBO1
Packaging: Box
Function: LED Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TLD4020-3
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2+13.95 EUR
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BTS700151ESPXUMA2 Infineon-BTS70015-1ESP-DataSheet-v01_20-EN.pdf?fileId=5546d462758f5bd101759850638039aa
BTS700151ESPXUMA2
Hersteller: Infineon Technologies
Description: PROFET PG-TSDSO-24
Fault Protection: Current Limiting (Fixed), Open Load Detect, Over Temperature, Over Voltage, Reverse Battery, UVLO
Supplier Device Package: PG-TSDSO-24-32
Ratio - Input:Output: 1:1
Current - Output (Max): 27.6A
Voltage - Supply (Vcc/Vdd): 4.1V ~ 28V
Voltage - Load: 4.1V ~ 28V
Input Type: Non-Inverting
Rds On (Typ): 1.7mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 150°C (TJ)
Switch Type: USB Switch
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 24-TSSOP (0.154", 3.90mm Width) Exposed Pad
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
auf Bestellung 2912 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3+7.08 EUR
10+5.36 EUR
25+4.91 EUR
100+4.44 EUR
250+4.21 EUR
500+4.08 EUR
1000+3.96 EUR
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BGA8G1BN6E6327XTSA1
BGA8G1BN6E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF AMP 1.452GHZ-1.61GHZ TSNP6
Voltage - Supply: 1.6V ~ 3.1V
Frequency: 1.452GHz ~ 1.61GHz
Mounting Type: Surface Mount
Package / Case: 6-XFDFN
Packaging: Tape & Reel (TR)
Supplier Device Package: PG-TSNP-6-2
Test Frequency: 1.452GHz ~ 1.61GHz
P1dB: 8dBm
Noise Figure: 0.8dB ~ 4.1dB
Current - Supply: 4.7mA
Produkt ist nicht verfügbar
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IDWD75G120C5XKSA1 Infineon-IDWD75G120C5-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c93dda25b019547353c661aba
IDWD75G120C5XKSA1
Hersteller: Infineon Technologies
Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-2
Mounting Type: Through Hole
Speed: No Recovery Time > 500mA (Io)
Reverse Recovery Time (trr): 0 ns
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 4243pF @ 1V, 100kHz
Current - Average Rectified (Io): 186A
Supplier Device Package: PG-TO247-2-U01
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 1200 V
Voltage - Forward (Vf) (Max) @ If: 1.8 V @ 75 A
Current - Reverse Leakage @ Vr: 600 µA @ 1.2 kV
auf Bestellung 89 Stücke:
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AnzahlPrivatkunde
1+38.75 EUR
30+24.51 EUR
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DF80R07W1H5S8B11BOMA1
Hersteller: Infineon Technologies
Description: EASY STANDARD
Packaging: Tray
Produkt ist nicht verfügbar
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IMZC120R017M2HXKSA1 IMZC120R017M2HXKSA1.pdf
IMZC120R017M2HXKSA1
Hersteller: Infineon Technologies
Description: SICFET N-CH 1200V 97A TO247
Packaging: Tube
Package / Case: TO-247-4
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 97A (Tc)
Rds On (Max) @ Id, Vgs: 17mOhm @ 40A, 18V
Power Dissipation (Max): 382W (Tc)
Vgs(th) (Max) @ Id: 5.1V @ 12.7mA
Supplier Device Package: PG-TO247-4-17
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +23V, -7V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 89 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 2910 pF @ 800 V
auf Bestellung 739 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+35.77 EUR
30+22.36 EUR
120+19.42 EUR
510+18.56 EUR
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CY8C4146LDSS243XQLA1 infineon-automotive-psoc-4100s-plus-datasheet-en-09018a9080860d3f.pdf
Hersteller: Infineon Technologies
Description: PSOC4 - GENERAL
Packaging: Tray
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 40-QFN (6x6)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4146LDSS243TXUMA1 infineon-automotive-psoc-4100s-plus-datasheet-en-09018a9080860d3f.pdf
Hersteller: Infineon Technologies
Description: PSOC4 - GENERAL
Packaging: Tape & Reel (TR)
Package / Case: 40-UFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 40-QFN (6x6)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4147LDSS243XQLA1 infineon-automotive-psoc-4100s-plus-datasheet-en-09018a9080860d3f.pdf
CY8C4147LDSS243XQLA1
Hersteller: Infineon Technologies
Description: PSOC4 - GENERAL
Packaging: Tray
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY8C4147LDSS243TXUMA1 infineon-automotive-psoc-4100s-plus-datasheet-en-09018a9080860d3f.pdf
CY8C4147LDSS243TXUMA1
Hersteller: Infineon Technologies
Description: PSOC4 - GENERAL
Packaging: Tape & Reel (TR)
Package / Case: 48-VFQFN Exposed Pad
Mounting Type: Surface Mount, Wettable Flank
Speed: 48MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10/16x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, Temp Sensor, TRNG, WDT
Supplier Device Package: 48-QFN (7x7)
Grade: Automotive
Number of I/O: 40
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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IM68D128BV01XTMA1 Infineon-IM68D128B-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c9625080601969ef5753044c3
IM68D128BV01XTMA1
Hersteller: Infineon Technologies
Description: IM68D128BV01XTMA1
Packaging: Tape & Reel (TR)
Output Type: Digital, PDM
Size / Dimension: 0.138" L x 0.104" W (3.50mm x 2.65mm)
Sensitivity: -37dB ±1dB @ 94dB SPL
Shape: Rectangular
Type: MEMS (Silicon)
S/N Ratio: 67.5dB
Termination: Solder Pads
Direction: Omnidirectional
Ratings: IP67 - Dust Tight, Waterproof
Port Location: Bottom
Height (Max): 0.043" (1.08mm)
Voltage - Rated: 1.8 V
Current - Supply: 5 µA
Voltage Range: 1.6 V ~ 3.465 V
Frequency Range: 10 Hz ~ 10 kHz
Produkt ist nicht verfügbar
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IM68D128BV01XTMA1 Infineon-IM68D128B-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c9625080601969ef5753044c3
IM68D128BV01XTMA1
Hersteller: Infineon Technologies
Description: IM68D128BV01XTMA1
Packaging: Cut Tape (CT)
Output Type: Digital, PDM
Size / Dimension: 0.138" L x 0.104" W (3.50mm x 2.65mm)
Sensitivity: -37dB ±1dB @ 94dB SPL
Shape: Rectangular
Type: MEMS (Silicon)
S/N Ratio: 67.5dB
Termination: Solder Pads
Direction: Omnidirectional
Ratings: IP67 - Dust Tight, Waterproof
Port Location: Bottom
Height (Max): 0.043" (1.08mm)
Voltage - Rated: 1.8 V
Current - Supply: 5 µA
Voltage Range: 1.6 V ~ 3.465 V
Frequency Range: 10 Hz ~ 10 kHz
auf Bestellung 2546 Stücke:
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AnzahlPrivatkunde
8+2.78 EUR
9+2.46 EUR
10+2.34 EUR
25+2.2 EUR
50+2.11 EUR
100+2.01 EUR
500+1.83 EUR
1000+1.77 EUR
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IMZA120R022M2HXKSA1 infineon-imza120r022m2h-datasheet-en.pdf?fileId=8ac78c8c9625080601968fddf0bb5dbf
IMZA120R022M2HXKSA1
Hersteller: Infineon Technologies
Description: IMZA120R022M2HXKSA1
Current - Continuous Drain (Id) @ 25°C: 80A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-4
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 2330 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 71 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +25V, -10V
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Supplier Device Package: PG-TO247-4-8
Vgs(th) (Max) @ Id: 5.1V @ 10.1mA
Power Dissipation (Max): 329W (Tc)
Rds On (Max) @ Id, Vgs: 29mOhm @ 32A, 18V
auf Bestellung 199 Stücke:
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AnzahlPrivatkunde
1+27.86 EUR
30+17.15 EUR
120+15.18 EUR
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TLE95633QXWJXUMA1
Hersteller: Infineon Technologies
Description: BLDC_MOTOR_CONTROL
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IRFBL3315 IR_PartNumberingSystem.pdf
IRFBL3315
Hersteller: Infineon Technologies
Description: MOSFET N-CH 150V 21A SUPER D2PAK
Current - Continuous Drain (Id) @ 25°C: 21A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Mounting Type: Surface Mount
Package / Case: Super D2-Pak
Packaging: Tube
Drain to Source Voltage (Vdss): 150 V
Supplier Device Package: Super D2-Pak
Produkt ist nicht verfügbar
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TDA22561XUMA1
Hersteller: Infineon Technologies
Description: POWERSTAGE CE
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY7C1361C-100AXC Infineon-CY7C1361C_CY7C1363C_9-Mbit_(256_K_36_512_K_18)_Flow-Through_SRAM-DataSheet-v22_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebdc53d30a8&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-fil
CY7C1361C-100AXC
Hersteller: Infineon Technologies
Description: IC SRAM 9MBIT PAR 100TQFP
DigiKey Programmable: Not Verified
Memory Organization: 256K x 36
Access Time: 8.5 ns
Memory Interface: Parallel
Supplier Device Package: 100-TQFP (14x20)
Memory Format: SRAM
Clock Frequency: 100 MHz
Technology: SRAM - Synchronous, SDR
Voltage - Supply: 3.135V ~ 3.6V
Operating Temperature: 0°C ~ 70°C (TA)
Memory Type: Volatile
Memory Size: 9Mbit
Mounting Type: Surface Mount
Package / Case: 100-LQFP
Packaging: Tray
Produkt ist nicht verfügbar
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FF06MR12A04MA2AKSA1 infineon-ff06mr12a04ma2-datasheet-en.pdf
FF06MR12A04MA2AKSA1
Hersteller: Infineon Technologies
Description: HYBRIDPACK DSC S MODULE WITH SIC
Packaging: Tube
Package / Case: 11-PowerDIP Module (2.091", 53.10mm)
Mounting Type: Through Hole
Configuration: 2 N-Channel (Half Bridge)
Operating Temperature: -40°C ~ 175°C (TJ)
Technology: Silicon Carbide (SiC)
Power - Max: 20mW
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Current - Continuous Drain (Id) @ 25°C: 190A
Input Capacitance (Ciss) (Max) @ Vds: 10100pF @ 850V
Rds On (Max) @ Id, Vgs: 5.56mOhm @ 190A, 18V
Gate Charge (Qg) (Max) @ Vgs: 420nC @ 18V
Vgs(th) (Max) @ Id: 4.55V @ 60mA
Supplier Device Package: PG-MDIP-11-1
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 69 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+293.16 EUR
12+245.95 EUR
36+233.53 EUR
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IPB65R420CFDATMA1 IPx65R420CFD.pdf
IPB65R420CFDATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 8.7A D2PAK
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Input Capacitance (Ciss) (Max) @ Vds: 870 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 10 V
Drain to Source Voltage (Vdss): 650 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: PG-TO263-3
Vgs(th) (Max) @ Id: 4.5V @ 340µA
Power Dissipation (Max): 83.3W (Tc)
Rds On (Max) @ Id, Vgs: 420mOhm @ 3.4A, 10V
Current - Continuous Drain (Id) @ 25°C: 8.7A (Tc)
Produkt ist nicht verfügbar
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CYT3DLABABQ1AESGS Infineon-CYT3DL_TRAVEO_TM_T2G_32-BIT_AUTOMOTIVE_MCU_BASED_ON_ARM_R_CORTEX_R_-M7_SINGLE-DataSheet-v10_00-EN.pdf?fileId=8ac78c8c869190210186f0ccf72f3fd3
CYT3DLABABQ1AESGS
Hersteller: Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH
Number of I/O: 108
Supplier Device Package: 216-TEQFP (24x24)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Dual-Core
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 384K x 8
Program Memory Size: 4.0625MB (4.0625M x 8)
Speed: 240MHz
Mounting Type: Surface Mount
Package / Case: 216-LQFP Exposed Pad
Packaging: Tray
Produkt ist nicht verfügbar
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CYT4DNJBACQ1BZSGS Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0
CYT4DNJBACQ1BZSGS
Hersteller: Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH
Number of I/O: 168
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tray
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Produkt ist nicht verfügbar
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CYT4DNJBACQ1BZSGST Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0
CYT4DNJBACQ1BZSGST
Hersteller: Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Produkt ist nicht verfügbar
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CYT4DNJBBCQ1BZSGS Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0
CYT4DNJBBCQ1BZSGS
Hersteller: Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
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CYT4DNJBBCQ1BZSGST Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0
CYT4DNJBBCQ1BZSGST
Hersteller: Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
Produkt ist nicht verfügbar
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CYT4DNJBGCQ1BZSGS Infineon-TRAVEO_T2G_CYT4DN-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c869190210186f0cceff43fd0
CYT4DNJBGCQ1BZSGS
Hersteller: Infineon Technologies
Description: TRAVEO-2 CLUST.2.5DGRAPH
Peripherals: DMA, I2S, LVD, Temp Sensor, WDT
Connectivity: CANbus, Ethernet, I2C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 48x12b SAR
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M7F
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External, Internal
Operating Temperature: -40°C ~ 105°C (TA)
RAM Size: 640K x 8
Program Memory Size: 6.19MB (6.19M x 8)
Speed: 100MHz, 320MHz
Number of I/O: 168
Supplier Device Package: 327-FBGA (17x17)
Mounting Type: Surface Mount
Package / Case: 327-LFBGA
Packaging: Tray
Produkt ist nicht verfügbar
Mindestbestellmenge: 900 Stücke
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