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CY7C60323-LFXC CY7C60323-LFXC Infineon Technologies Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
auf Bestellung 6606 Stücke:
Lieferzeit 10-14 Tag (e)
161+3.16 EUR
Mindestbestellmenge: 161
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ISC008N06LM6ATMA1 Infineon Technologies Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPP70N04S406AKSA1 IPP70N04S406AKSA1 Infineon Technologies Infineon-IPP_B_I70N04S4_06-DS-v01_00-en.pdf?fileId=db3a304328c6bd5c01291c501db65d98 Description: MOSFET N-CH 40V 70A TO220-3-1
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 6.5mOhm @ 70A, 10V
Power Dissipation (Max): 58W (Tc)
Vgs(th) (Max) @ Id: 4V @ 26µA
Supplier Device Package: PG-TO220-3-1
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2550 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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CY8C4148AZES558XQLA1 CY8C4148AZES558XQLA1 Infineon Technologies Infineon-CY8C4149AZS-S575-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
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IDYH80G200C5XKSA1 IDYH80G200C5XKSA1 Infineon Technologies Infineon-IDYH80G200C5-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c914a3ac801917f09c7ac3973 Description: DIODE SIC 2000V 157A PGTO247U04
Packaging: Tube
Package / Case: TO-247-4 Variant
Mounting Type: Through Hole
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 9100pF @ 1V, 100kHz
Current - Average Rectified (Io): 157A
Supplier Device Package: PG-TO247-U04
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 2000 V
Voltage - Forward (Vf) (Max) @ If: 1.75 V @ 80 A
Current - Reverse Leakage @ Vr: 1.2 A @ 2000 V
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30+90.12 EUR
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CY9AF112NPMC-G-104E1 CY9AF112NPMC-G-104E1 Infineon Technologies Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S25HS512TFAMHB010 S25HS512TFAMHB010 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: IC FLASH 512MBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYT2B63BADR0AZSGST CYT2B63BADR0AZSGST Infineon Technologies Description: IC MCU 32BIT 576KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 22x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
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CYT2B63CADQ0AZSGST CYT2B63CADQ0AZSGST Infineon Technologies Infineon-TRAVEO_T2G_CYT2B6_Series-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd0180d1dabfe2770b Description: IC MCU 32BIT 576KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 22x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7B9910-5SC CY7B9910-5SC Infineon Technologies CY7B9910_20.pdf Description: IC FANOUT BUFFER 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Output: TTL
Frequency - Max: 80MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: Clock
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 24-SOIC
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF104NAPMC-G-UNE1 CY9AF104NAPMC-G-UNE1 Infineon Technologies Description: IC MCU 32BIT 384KB 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
Produkt ist nicht verfügbar
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TDA22590XUMA1 TDA22590XUMA1 Infineon Technologies Infineon-TDA22590-FITReport-v01_00-EN.pdf?fileId=8ac78c8c8eeb092c018f404b48691873 Description: POWERSTAGE CE
Packaging: Cut Tape (CT)
Package / Case: 34-PowerUFLGA
Voltage - Output: 0.225V ~ 5.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 4.25V ~ 16V
Operating Temperature: -40°C ~ 125°C
Applications: Converter, CPU GPU
Supplier Device Package: PG-UFLGA-34
Produkt ist nicht verfügbar
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2EDN8523FXTMA1 2EDN8523FXTMA1 Infineon Technologies Infineon-2EDN752x-2EDN852x-DS--DS-v02_03-EN.pdf?fileId=5546d462525dbac40152abcc7dbb1727 Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Inverting
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 5.3ns, 4.5ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.2V, 1.9V
Current - Peak Output (Source, Sink): 5A, 5A
DigiKey Programmable: Not Verified
auf Bestellung 160000 Stücke:
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T1081N70TOHPRXPSA1 T1081N70TOHPRXPSA1 Infineon Technologies Description: SCR MODULE 7KV 2040A TO-200AF
Packaging: Tray
Package / Case: TO-200AF
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C (TC)
Structure: Single
Current - Hold (Ih) (Max): 350 mA
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 1800 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 2040 A
Voltage - Off State: 7 kV
Produkt ist nicht verfügbar
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CYPM1322-97BZXIT CYPM1322-97BZXIT Infineon Technologies Infineon-EZ-PD_TM_PMG1-S3_Datasheet_Power_Delivery_Microcontroller_Gen1-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7ddc01d7017ddd0263aa58f3 Description: IC MCU 32BIT 256KB FLASH 97BGA
Packaging: Tape & Reel (TR)
Package / Case: 97-VFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x8/12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, WDT
Supplier Device Package: 97-BGA (6x6)
Number of I/O: 50
DigiKey Programmable: Not Verified
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ISZ24DP10LMATMA1 ISZ24DP10LMATMA1 Infineon Technologies Infineon-ISZ24DP10LM-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee0185a9f6e21736f9 Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 9.7A
Supplier Device Package: PG-TDSON-8-25
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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ISZ24DP10LMATMA1 ISZ24DP10LMATMA1 Infineon Technologies Infineon-ISZ24DP10LM-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee0185a9f6e21736f9 Description: TRENCH >=100V
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 9.7A
Supplier Device Package: PG-TDSON-8-25
Drain to Source Voltage (Vdss): 100 V
auf Bestellung 3686 Stücke:
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8+2.48 EUR
12+1.56 EUR
100+1.04 EUR
500+0.82 EUR
1000+0.74 EUR
2000+0.68 EUR
Mindestbestellmenge: 8
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CY2308ZI-1H CY2308ZI-1H Infineon Technologies CY2308.pdf Description: IC FANOUT BUFFER 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P6SWPREMIUMSOFT1 Infineon Technologies Description: SOFTWARE
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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BSG0812NDATMA1 Infineon Technologies fundamentals-of-power-semiconductors Description: MOSFET N-CH 8TISON
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CYW88550CUBGTXTMA1 Infineon Technologies Description: WIRELESS AUTOMOTIVE
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY8C4124PVE-S412T CY8C4124PVE-S412T Infineon Technologies Description: IC MCU 32BIT 16KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 12x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BUZ73A BUZ73A Infineon Technologies BUZ73A.pdf Description: MOSFET N-CH 200V 5.5A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 600mOhm @ 4.5A, 10V
Power Dissipation (Max): 40W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: PG-TO220-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Input Capacitance (Ciss) (Max) @ Vds: 530 pF @ 25 V
Produkt ist nicht verfügbar
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SI4435DY SI4435DY Infineon Technologies si4435dypbf.pdf?fileId=5546d462533600a4015356847c882983 Description: MOSFET P-CH 30V 8A 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 155°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 8.8A (Ta)
Rds On (Max) @ Id, Vgs: 20mOhm @ 8.8A, 10V
Power Dissipation (Max): 2.5W (Ta)
Vgs(th) (Max) @ Id: 3V @ 250µA
Supplier Device Package: 8-SOIC
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 60 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2320 pF @ 15 V
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BCM856SH6327XTSA1 BCM856SH6327XTSA1 Infineon Technologies bcm856s.pdf?folderId=db3a30431441fb5d011449d262020243&fileId=db3a30431441fb5d011449d4974a0245 Description: TRANS 2PNP 65V 0.1A PG-SOT363-PO
Packaging: Cut Tape (CT)
Package / Case: 6-VSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP (Dual)
Operating Temperature: 150°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 65V
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SOT363-PO
auf Bestellung 71630 Stücke:
Lieferzeit 10-14 Tag (e)
24+0.74 EUR
40+0.45 EUR
100+0.28 EUR
500+0.21 EUR
1000+0.19 EUR
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CY8C4248LQI-BL583T CY8C4248LQI-BL583T Infineon Technologies ?utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 256KB FLASH 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR; D/A 2xIDAC
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Supplier Device Package: 56-QFN (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
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2+13.53 EUR
10+10.47 EUR
25+9.71 EUR
100+8.87 EUR
250+8.47 EUR
500+8.23 EUR
1000+8.03 EUR
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CY7C68033-56LFXC CY7C68033-56LFXC Infineon Technologies CY7C68033_34.pdf Description: IC USB NX2LP NAND CNTRLR 56VQFN
Packaging: Bag
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Controller Type: NAND Flash - USB
Supplier Device Package: 56-QFN (8x8)
Produkt ist nicht verfügbar
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CY7C68014A-56LFXC CY7C68014A-56LFXC Infineon Technologies download Description: IC MCU USB PERIPH HI SPD 56VQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, USB, USART
RAM Size: 16K x 8
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Controller Series: CY7C680xx
Program Memory Type: ROMless
Applications: USB Microcontroller
Core Processor: 8051
Supplier Device Package: 56-QFN (8x8)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C68014A-56BAXC CY7C68014A-56BAXC Infineon Technologies download Description: IC MCU USB PERIPH HI SPD 56VFBGA
Packaging: Tray
Package / Case: 56-VFBGA
Mounting Type: Surface Mount
Interface: I2C, USB, USART
RAM Size: 16K x 8
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Controller Series: CY7C680xx
Program Memory Type: ROMless
Applications: USB Microcontroller
Core Processor: 8051
Supplier Device Package: 56-VFBGA (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
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TTB6C95N12LOF_B1 Infineon Technologies INFNS20693-1.pdf?t.download=true&u=5oefqw Description: BRIDGE RECTIFIER & AC-SWITCHES
Packaging: Bulk
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TTB6C135N16LOFHOSA1 TTB6C135N16LOFHOSA1 Infineon Technologies Infineon-TTB6C135N16XX-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b43136dd53db Description: SCR MODULE 1.6KV 100A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Bridge, 3-Phase - All SCRs
Current - Hold (Ih) (Max): 200 mA
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 1000A @ 50Hz
Number of SCRs, Diodes: 6 SCRs
Current - On State (It (AV)) (Max): 173 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 100 A
Voltage - Off State: 1.6 kV
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TTB6C135N16LOFHOSA1 TTB6C135N16LOFHOSA1 Infineon Technologies Infineon-TTB6C135N16XX-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b43136dd53db Description: SCR MODULE 1.6KV 100A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Bridge, 3-Phase - All SCRs
Current - Hold (Ih) (Max): 200 mA
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 1000A @ 50Hz
Number of SCRs, Diodes: 6 SCRs
Current - On State (It (AV)) (Max): 173 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 100 A
Voltage - Off State: 1.6 kV
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TTB6C165N16LOFHOSA1 TTB6C165N16LOFHOSA1 Infineon Technologies Infineon-TTB6C165N16XX-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b4313a6053df Description: SCR MODULE 1.6KV 120A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Bridge, 3-Phase - All SCRs
Current - Hold (Ih) (Max): 200 mA
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 1250A @ 50Hz
Number of SCRs, Diodes: 6 SCRs
Current - On State (It (AV)) (Max): 208 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 120 A
Voltage - Off State: 1.6 kV
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TLE4959CFXHAMA1 TLE4959CFXHAMA1 Infineon Technologies Infineon-TLE4959C-FX-DS-v01_00-EN.pdf?fileId=5546d462636cc8fb01644595e0ce38a4 Description: SENSOR ROTARY PC PIN
Packaging: Bulk
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage, PWM
Operating Temperature: -40°C ~ 175°C (TJ)
Termination Style: PC Pin
Voltage - Supply: 4V ~ 16V
Actuator Type: External Magnet, Not Included
Technology: Hall Effect
For Measuring: Linear, Rotary Position
Supplier Device Package: PG-SSO-3-52
Grade: Automotive
Qualification: AEC-Q100
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TLE49SRP3XTMA1 TLE49SRP3XTMA1 Infineon Technologies Description: TLE49SRP3XTMA1
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module, Formed Leads
Mounting Type: Through Hole
Output: PWM, SENT
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle, Rotary Position
Supplier Device Package: PG-SSO-3-41
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
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TLE49SRP3XTMA1 TLE49SRP3XTMA1 Infineon Technologies Description: TLE49SRP3XTMA1
Packaging: Cut Tape (CT)
Package / Case: 3-SIP Module, Formed Leads
Mounting Type: Through Hole
Output: PWM, SENT
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle, Rotary Position
Supplier Device Package: PG-SSO-3-41
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
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500+5.26 EUR
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CY7C1347G-166AXC CY7C1347G-166AXC Infineon Technologies Infineon-CY7C1347G_4_MBIT_(128K_X_36)_PIPELINED_SYNC_SRAM-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd1d7d2f3a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC SRAM 4.5MBIT PAR 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 4.5Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.15V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128K x 36
DigiKey Programmable: Not Verified
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CYW55571MIUBGT CYW55571MIUBGT Infineon Technologies Description: WI-FI COMBO IOT
Packaging: Tape & Reel (TR)
Package / Case: 225-BGA, WLBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz, 6GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.8V
Power - Output: 20dBm
Protocol: 802.11ax, Bluetooth v5.2
Data Rate (Max): 1.2Gbps
Supplier Device Package: SG-UFWLB-225
Modulation: 1024-QAM, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCIe, PCM, SDIO, UART
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CYW55573MIUBGT CYW55573MIUBGT Infineon Technologies Description: WI-FI COMBO IOT
Packaging: Tape & Reel (TR)
Package / Case: 225-BGA, WLBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz, 6GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.8V
Power - Output: 20dBm
Protocol: 802.11ax, Bluetooth v5.2
Data Rate (Max): 1.2Gbps
Supplier Device Package: SG-UFWLB-225
Modulation: 1024-QAM, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCIe, PCM, SDIO, UART
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CY39200V208-125NTC CY39200V208-125NTC Infineon Technologies Description: IC CPLD 3072MC 10NS 208QFP
Packaging: Bag
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In-System Reprogrammable™ (ISR™) Flash
Number of Gates: 288000
Number of Macrocells: 3072
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 208-PQFP (28x28)
Voltage Supply - Internal: 2.5V, 3.3V
Number of I/O: 136
DigiKey Programmable: Not Verified
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CY39200V388-125MGC Infineon Technologies Description: IC CPLD 3072MC 10NS 388BGA
Packaging: Bag
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Programmable Type: In-System Reprogrammable™ (ISR™) Flash
Number of Gates: 288000
Number of Macrocells: 3072
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 388-BGA (35x35)
Voltage Supply - Internal: 2.5V, 3.3V
Number of I/O: 294
DigiKey Programmable: Not Verified
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CY8C5468LTI-037 CY8C5468LTI-037 Infineon Technologies CY8C54.pdf Description: IC MCU 32BIT 256KB FLASH 68QFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 2x12b; D/A 4x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
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CY8C5468LTI-037 CY8C5468LTI-037 Infineon Technologies CY8C54.pdf Description: IC MCU 32BIT 256KB FLASH 68QFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 2x12b; D/A 4x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
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IS26KS512S-DPBLA200 Infineon Technologies Description: IC FLASH 512MBIT HYPERBUS 24FBGA
Packaging: Bulk
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: HyperFlash
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 24-VFBGA (6x8)
Memory Interface: HyperBus
Access Time: 96 ns
Memory Organization: 64M x 8
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IS26KS256S-DPBLA200-TR Infineon Technologies Description: IC FLASH 256MBIT HYPERBUS
Packaging: Bulk
Memory Size: 256Mbit
Memory Format: FLASH
Memory Interface: HyperBus
Memory Organization: 32M x 8
Produkt ist nicht verfügbar
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CY8C6148LQI-S2F02 CY8C6148LQI-S2F02 Infineon Technologies Infineon-PSoC_6_MCU_CY8C61x8_CY8C61xA-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea1f6b72fa Description: IC MCU 32BIT 1MB FLASH 68QFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 53
DigiKey Programmable: Not Verified
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IR3513ZMTRPBF IR3513ZMTRPBF Infineon Technologies IR3513.pdf Description: IC CTRL XPHASE3 POL 32-MLPQ
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 16V
Applications: Processor
Current - Supply: 3mA
Supplier Device Package: 32-MLPQ (5x5)
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IR3505ZMTRPBF IR3505ZMTRPBF Infineon Technologies IR3505Z.pdf Description: IC XPHASE3 CTLR 2.5A 16-MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 16V
Applications: Processor
Current - Supply: 3mA
Supplier Device Package: 16-MLPQ (3x3)
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IR3505ZMTRPBF IR3505ZMTRPBF Infineon Technologies IR3505Z.pdf Description: IC XPHASE3 CTLR 2.5A 16-MLPQ
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 16V
Applications: Processor
Current - Supply: 3mA
Supplier Device Package: 16-MLPQ (3x3)
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IR3505ZMTRPBF IR3505ZMTRPBF Infineon Technologies IR3505Z.pdf Description: IC XPHASE3 CTLR 2.5A 16-MLPQ
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 16V
Applications: Processor
Current - Supply: 3mA
Supplier Device Package: 16-MLPQ (3x3)
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IR3508ZMTRPBF IR3508ZMTRPBF Infineon Technologies IR3508Z.pdf Description: IC CTRL XPHASE3 20-MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 28V
Applications: Processor
Current - Supply: 4mA
Supplier Device Package: 20-MLPQ (4x4)
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IR3508ZMTRPBF IR3508ZMTRPBF Infineon Technologies IR3508Z.pdf Description: IC CTRL XPHASE3 20-MLPQ
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 28V
Applications: Processor
Current - Supply: 4mA
Supplier Device Package: 20-MLPQ (4x4)
Produkt ist nicht verfügbar
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IR3500VMTRPBF IR3500VMTRPBF Infineon Technologies IR3500V.pdf Description: IC XPHASE3 CTLR VR11.1 32-MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C
Voltage - Supply: 4.75V ~ 7.5V
Applications: Processor
Current - Supply: 6.5mA
Supplier Device Package: 32-MLPQ (5x5)
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IR3500VMTRPBF IR3500VMTRPBF Infineon Technologies IR3500V.pdf Description: IC XPHASE3 CTLR VR11.1 32-MLPQ
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C
Voltage - Supply: 4.75V ~ 7.5V
Applications: Processor
Current - Supply: 6.5mA
Supplier Device Package: 32-MLPQ (5x5)
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IPQC60T010S7AXTMA1 IPQC60T010S7AXTMA1 Infineon Technologies Description: AUTOMOTIVE_COOLMOS
Packaging: Tape & Reel (TR)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 174A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 50A, 12V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.06mA
Supplier Device Package: PG-HDSOP-22-101
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 12V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 318 nC @ 12 V
Input Capacitance (Ciss) (Max) @ Vds: 11986 pF @ 300 V
Qualification: AEC-Q101
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IPQC60T010S7AXTMA1 IPQC60T010S7AXTMA1 Infineon Technologies Description: AUTOMOTIVE_COOLMOS
Packaging: Cut Tape (CT)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 174A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 50A, 12V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.06mA
Supplier Device Package: PG-HDSOP-22-101
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 12V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 318 nC @ 12 V
Input Capacitance (Ciss) (Max) @ Vds: 11986 pF @ 300 V
Qualification: AEC-Q101
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TLE493DP3XXMS2GOTOBO1 TLE493DP3XXMS2GOTOBO1 Infineon Technologies Description: TLE493DP3XXMS2GOTOBO1
Packaging: Box
Interface: I2C, SPI
Sensor Type: Magnetic, Hall Effect
Utilized IC / Part: TLE493D-P3B6, TLE493D-P3I8
Embedded: Yes, MCU
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TLE493DP3I8XTMA1 Infineon Technologies Description: TLE493DP3I8XTMA1
Packaging: Tape & Reel (TR)
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TLE493DP3I8XTMA1 Infineon Technologies Description: TLE493DP3I8XTMA1
Packaging: Cut Tape (CT)
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TLE493DW3B6B0HTSA1 Infineon Technologies Description: POSITION SENS ATV
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY7C60323-LFXC
CY7C60323-LFXC
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 3.6V
Connectivity: I2C, SPI
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Number of I/O: 28
DigiKey Programmable: Not Verified
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161+3.16 EUR
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ISC008N06LM6ATMA1
Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPP70N04S406AKSA1 Infineon-IPP_B_I70N04S4_06-DS-v01_00-en.pdf?fileId=db3a304328c6bd5c01291c501db65d98
IPP70N04S406AKSA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 40V 70A TO220-3-1
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 70A (Tc)
Rds On (Max) @ Id, Vgs: 6.5mOhm @ 70A, 10V
Power Dissipation (Max): 58W (Tc)
Vgs(th) (Max) @ Id: 4V @ 26µA
Supplier Device Package: PG-TO220-3-1
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 40 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2550 pF @ 25 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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CY8C4148AZES558XQLA1 Infineon-CY8C4149AZS-S575-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c8929aa4d018a21719a00247e
CY8C4148AZES558XQLA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Grade: Automotive
Number of I/O: 84
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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IDYH80G200C5XKSA1 Infineon-IDYH80G200C5-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c914a3ac801917f09c7ac3973
IDYH80G200C5XKSA1
Hersteller: Infineon Technologies
Description: DIODE SIC 2000V 157A PGTO247U04
Packaging: Tube
Package / Case: TO-247-4 Variant
Mounting Type: Through Hole
Technology: SiC (Silicon Carbide) Schottky
Capacitance @ Vr, F: 9100pF @ 1V, 100kHz
Current - Average Rectified (Io): 157A
Supplier Device Package: PG-TO247-U04
Operating Temperature - Junction: -55°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 2000 V
Voltage - Forward (Vf) (Max) @ If: 1.75 V @ 80 A
Current - Reverse Leakage @ Vr: 1.2 A @ 2000 V
auf Bestellung 240 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+117.29 EUR
30+90.12 EUR
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CY9AF112NPMC-G-104E1
CY9AF112NPMC-G-104E1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 128KB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 128KB (128K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b SAR
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CSIO, EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 83
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S25HS512TFAMHB010 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
S25HS512TFAMHB010
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT SPI/QUAD 16SOIC
Packaging: Tray
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 2V
Technology: FLASH - NOR (SLC)
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYT2B63BADR0AZSGST
CYT2B63BADR0AZSGST
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 576KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 22x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYT2B63CADQ0AZSGST Infineon-TRAVEO_T2G_CYT2B6_Series-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c80027ecd0180d1dabfe2770b
CYT2B63CADQ0AZSGST
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 576KB FLASH 64LQFP
Packaging: Tape & Reel (TR)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 22x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7B9910-5SC CY7B9910_20.pdf
CY7B9910-5SC
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 24SOIC
Packaging: Tube
Package / Case: 24-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Output: TTL
Frequency - Max: 80MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: Clock
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 4.5V ~ 5.5V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 24-SOIC
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9AF104NAPMC-G-UNE1
CY9AF104NAPMC-G-UNE1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 384KB 100LQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 40MHz
Program Memory Size: 384KB (384K x 8)
RAM Size: 48K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
Produkt ist nicht verfügbar
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TDA22590XUMA1 Infineon-TDA22590-FITReport-v01_00-EN.pdf?fileId=8ac78c8c8eeb092c018f404b48691873
TDA22590XUMA1
Hersteller: Infineon Technologies
Description: POWERSTAGE CE
Packaging: Cut Tape (CT)
Package / Case: 34-PowerUFLGA
Voltage - Output: 0.225V ~ 5.5V
Mounting Type: Surface Mount
Number of Outputs: 1
Voltage - Input: 4.25V ~ 16V
Operating Temperature: -40°C ~ 125°C
Applications: Converter, CPU GPU
Supplier Device Package: PG-UFLGA-34
Produkt ist nicht verfügbar
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2EDN8523FXTMA1 Infineon-2EDN752x-2EDN852x-DS--DS-v02_03-EN.pdf?fileId=5546d462525dbac40152abcc7dbb1727
2EDN8523FXTMA1
Hersteller: Infineon Technologies
Description: IC GATE DRVR LOW-SIDE 8SOIC
Packaging: Bulk
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Inverting
Supplier Device Package: PG-DSO-8
Rise / Fall Time (Typ): 5.3ns, 4.5ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.2V, 1.9V
Current - Peak Output (Source, Sink): 5A, 5A
DigiKey Programmable: Not Verified
auf Bestellung 160000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
744+0.68 EUR
Mindestbestellmenge: 744
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T1081N70TOHPRXPSA1
T1081N70TOHPRXPSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 7KV 2040A TO-200AF
Packaging: Tray
Package / Case: TO-200AF
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C (TC)
Structure: Single
Current - Hold (Ih) (Max): 350 mA
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 35000A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 1800 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 2040 A
Voltage - Off State: 7 kV
Produkt ist nicht verfügbar
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CYPM1322-97BZXIT Infineon-EZ-PD_TM_PMG1-S3_Datasheet_Power_Delivery_Microcontroller_Gen1-DataSheet-v05_00-EN.pdf?fileId=8ac78c8c7ddc01d7017ddd0263aa58f3
CYPM1322-97BZXIT
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 97BGA
Packaging: Tape & Reel (TR)
Package / Case: 97-VFBGA
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 10x8/12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: FIFO, I2C, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, DMA, POR, PWM, WDT
Supplier Device Package: 97-BGA (6x6)
Number of I/O: 50
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ISZ24DP10LMATMA1 Infineon-ISZ24DP10LM-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee0185a9f6e21736f9
ISZ24DP10LMATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 9.7A
Supplier Device Package: PG-TDSON-8-25
Drain to Source Voltage (Vdss): 100 V
Produkt ist nicht verfügbar
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ISZ24DP10LMATMA1 Infineon-ISZ24DP10LM-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c850f4bee0185a9f6e21736f9
ISZ24DP10LMATMA1
Hersteller: Infineon Technologies
Description: TRENCH >=100V
Packaging: Cut Tape (CT)
Package / Case: 8-PowerTDFN
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 9.7A
Supplier Device Package: PG-TDSON-8-25
Drain to Source Voltage (Vdss): 100 V
auf Bestellung 3686 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.48 EUR
12+1.56 EUR
100+1.04 EUR
500+0.82 EUR
1000+0.74 EUR
2000+0.68 EUR
Mindestbestellmenge: 8
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CY2308ZI-1H CY2308.pdf
CY2308ZI-1H
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 16TSSOP
Packaging: Tube
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Output: LVCMOS
Frequency - Max: 133.3MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: LVCMOS, LVTTL
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:8
Differential - Input:Output: No/No
Supplier Device Package: 16-TSSOP
PLL: Yes with Bypass
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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P6SWPREMIUMSOFT1
Hersteller: Infineon Technologies
Description: SOFTWARE
Packaging: Electronic Delivery
Produkt ist nicht verfügbar
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BSG0812NDATMA1 fundamentals-of-power-semiconductors
Hersteller: Infineon Technologies
Description: MOSFET N-CH 8TISON
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CYW88550CUBGTXTMA1
Hersteller: Infineon Technologies
Description: WIRELESS AUTOMOTIVE
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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CY8C4124PVE-S412T
CY8C4124PVE-S412T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 16KB FLASH 28SSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 16x10b, 12x12b SAR; D/A 2x7b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Grade: Automotive
Number of I/O: 24
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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BUZ73A BUZ73A.pdf
BUZ73A
Hersteller: Infineon Technologies
Description: MOSFET N-CH 200V 5.5A TO220-3
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.5A (Tc)
Rds On (Max) @ Id, Vgs: 600mOhm @ 4.5A, 10V
Power Dissipation (Max): 40W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1mA
Supplier Device Package: PG-TO220-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 200 V
Input Capacitance (Ciss) (Max) @ Vds: 530 pF @ 25 V
Produkt ist nicht verfügbar
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SI4435DY si4435dypbf.pdf?fileId=5546d462533600a4015356847c882983
SI4435DY
Hersteller: Infineon Technologies
Description: MOSFET P-CH 30V 8A 8SO
Packaging: Tube
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 155°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 8.8A (Ta)
Rds On (Max) @ Id, Vgs: 20mOhm @ 8.8A, 10V
Power Dissipation (Max): 2.5W (Ta)
Vgs(th) (Max) @ Id: 3V @ 250µA
Supplier Device Package: 8-SOIC
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 60 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2320 pF @ 15 V
Produkt ist nicht verfügbar
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BCM856SH6327XTSA1 bcm856s.pdf?folderId=db3a30431441fb5d011449d262020243&fileId=db3a30431441fb5d011449d4974a0245
BCM856SH6327XTSA1
Hersteller: Infineon Technologies
Description: TRANS 2PNP 65V 0.1A PG-SOT363-PO
Packaging: Cut Tape (CT)
Package / Case: 6-VSSOP, SC-88, SOT-363
Mounting Type: Surface Mount
Transistor Type: 2 PNP (Dual)
Operating Temperature: 150°C (TJ)
Power - Max: 250mW
Current - Collector (Ic) (Max): 100mA
Voltage - Collector Emitter Breakdown (Max): 65V
Vce Saturation (Max) @ Ib, Ic: 650mV @ 5mA, 100mA
Current - Collector Cutoff (Max): 15nA (ICBO)
DC Current Gain (hFE) (Min) @ Ic, Vce: 200 @ 2mA, 5V
Frequency - Transition: 250MHz
Supplier Device Package: PG-SOT363-PO
auf Bestellung 71630 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
24+0.74 EUR
40+0.45 EUR
100+0.28 EUR
500+0.21 EUR
1000+0.19 EUR
Mindestbestellmenge: 24
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CY8C4248LQI-BL583T ?utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY8C4248LQI-BL583T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 56QFN
Packaging: Cut Tape (CT)
Package / Case: 56-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 48MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 32K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b SAR; D/A 2xIDAC
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA LCD, LVD, POR, PWM, SmartCard, SmartSense, WDT
Supplier Device Package: 56-QFN (7x7)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+13.53 EUR
10+10.47 EUR
25+9.71 EUR
100+8.87 EUR
250+8.47 EUR
500+8.23 EUR
1000+8.03 EUR
Mindestbestellmenge: 2
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CY7C68033-56LFXC CY7C68033_34.pdf
CY7C68033-56LFXC
Hersteller: Infineon Technologies
Description: IC USB NX2LP NAND CNTRLR 56VQFN
Packaging: Bag
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Controller Type: NAND Flash - USB
Supplier Device Package: 56-QFN (8x8)
Produkt ist nicht verfügbar
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CY7C68014A-56LFXC download
CY7C68014A-56LFXC
Hersteller: Infineon Technologies
Description: IC MCU USB PERIPH HI SPD 56VQFN
Packaging: Tray
Package / Case: 56-VFQFN Exposed Pad
Mounting Type: Surface Mount
Interface: I2C, USB, USART
RAM Size: 16K x 8
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Controller Series: CY7C680xx
Program Memory Type: ROMless
Applications: USB Microcontroller
Core Processor: 8051
Supplier Device Package: 56-QFN (8x8)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C68014A-56BAXC download
CY7C68014A-56BAXC
Hersteller: Infineon Technologies
Description: IC MCU USB PERIPH HI SPD 56VFBGA
Packaging: Tray
Package / Case: 56-VFBGA
Mounting Type: Surface Mount
Interface: I2C, USB, USART
RAM Size: 16K x 8
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Controller Series: CY7C680xx
Program Memory Type: ROMless
Applications: USB Microcontroller
Core Processor: 8051
Supplier Device Package: 56-VFBGA (5x5)
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TTB6C95N12LOF_B1 INFNS20693-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: BRIDGE RECTIFIER & AC-SWITCHES
Packaging: Bulk
auf Bestellung 206 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+210.61 EUR
Mindestbestellmenge: 3
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TTB6C135N16LOFHOSA1 Infineon-TTB6C135N16XX-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b43136dd53db
TTB6C135N16LOFHOSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1.6KV 100A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Bridge, 3-Phase - All SCRs
Current - Hold (Ih) (Max): 200 mA
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 1000A @ 50Hz
Number of SCRs, Diodes: 6 SCRs
Current - On State (It (AV)) (Max): 173 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 100 A
Voltage - Off State: 1.6 kV
auf Bestellung 296 Stücke:
Lieferzeit 10-14 Tag (e)
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2+337.35 EUR
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TTB6C135N16LOFHOSA1 Infineon-TTB6C135N16XX-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b43136dd53db
TTB6C135N16LOFHOSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1.6KV 100A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Bridge, 3-Phase - All SCRs
Current - Hold (Ih) (Max): 200 mA
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 1000A @ 50Hz
Number of SCRs, Diodes: 6 SCRs
Current - On State (It (AV)) (Max): 173 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 100 A
Voltage - Off State: 1.6 kV
Produkt ist nicht verfügbar
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TTB6C165N16LOFHOSA1 Infineon-TTB6C165N16XX-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b4313a6053df
TTB6C165N16LOFHOSA1
Hersteller: Infineon Technologies
Description: SCR MODULE 1.6KV 120A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Bridge, 3-Phase - All SCRs
Current - Hold (Ih) (Max): 200 mA
Current - Gate Trigger (Igt) (Max): 150 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 1250A @ 50Hz
Number of SCRs, Diodes: 6 SCRs
Current - On State (It (AV)) (Max): 208 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 120 A
Voltage - Off State: 1.6 kV
Produkt ist nicht verfügbar
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TLE4959CFXHAMA1 Infineon-TLE4959C-FX-DS-v01_00-EN.pdf?fileId=5546d462636cc8fb01644595e0ce38a4
TLE4959CFXHAMA1
Hersteller: Infineon Technologies
Description: SENSOR ROTARY PC PIN
Packaging: Bulk
Package / Case: 3-SIP Module
Mounting Type: Through Hole
Output: Analog Voltage, PWM
Operating Temperature: -40°C ~ 175°C (TJ)
Termination Style: PC Pin
Voltage - Supply: 4V ~ 16V
Actuator Type: External Magnet, Not Included
Technology: Hall Effect
For Measuring: Linear, Rotary Position
Supplier Device Package: PG-SSO-3-52
Grade: Automotive
Qualification: AEC-Q100
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172+2.94 EUR
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TLE49SRP3XTMA1
TLE49SRP3XTMA1
Hersteller: Infineon Technologies
Description: TLE49SRP3XTMA1
Packaging: Tape & Reel (TR)
Package / Case: 3-SIP Module, Formed Leads
Mounting Type: Through Hole
Output: PWM, SENT
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle, Rotary Position
Supplier Device Package: PG-SSO-3-41
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
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2000+4.93 EUR
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TLE49SRP3XTMA1
TLE49SRP3XTMA1
Hersteller: Infineon Technologies
Description: TLE49SRP3XTMA1
Packaging: Cut Tape (CT)
Package / Case: 3-SIP Module, Formed Leads
Mounting Type: Through Hole
Output: PWM, SENT
Operating Temperature: -40°C ~ 150°C
Termination Style: PC Pin
Voltage - Supply: 4.5V ~ 5.5V
Actuator Type: External Magnet, Not Included
Technology: Magnetoresistive
For Measuring: Angle, Rotary Position
Supplier Device Package: PG-SSO-3-41
Rotation Angle - Electrical, Mechanical: 0° ~ 360°
Output Signal: Clockwise Increase
Grade: Automotive
Qualification: AEC-Q100
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.11 EUR
5+7.09 EUR
10+6.72 EUR
25+6.30 EUR
50+6.01 EUR
100+5.76 EUR
500+5.26 EUR
1000+5.09 EUR
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CY7C1347G-166AXC Infineon-CY7C1347G_4_MBIT_(128K_X_36)_PIPELINED_SYNC_SRAM-DataSheet-v21_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebd1d7d2f3a&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY7C1347G-166AXC
Hersteller: Infineon Technologies
Description: IC SRAM 4.5MBIT PAR 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 4.5Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.15V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 166 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 3.5 ns
Memory Organization: 128K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW55571MIUBGT
CYW55571MIUBGT
Hersteller: Infineon Technologies
Description: WI-FI COMBO IOT
Packaging: Tape & Reel (TR)
Package / Case: 225-BGA, WLBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz, 6GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.8V
Power - Output: 20dBm
Protocol: 802.11ax, Bluetooth v5.2
Data Rate (Max): 1.2Gbps
Supplier Device Package: SG-UFWLB-225
Modulation: 1024-QAM, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCIe, PCM, SDIO, UART
Produkt ist nicht verfügbar
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CYW55573MIUBGT
CYW55573MIUBGT
Hersteller: Infineon Technologies
Description: WI-FI COMBO IOT
Packaging: Tape & Reel (TR)
Package / Case: 225-BGA, WLBGA
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz, 6GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 3V ~ 4.8V
Power - Output: 20dBm
Protocol: 802.11ax, Bluetooth v5.2
Data Rate (Max): 1.2Gbps
Supplier Device Package: SG-UFWLB-225
Modulation: 1024-QAM, OFDM
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I2S, PCIe, PCM, SDIO, UART
Produkt ist nicht verfügbar
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CY39200V208-125NTC
CY39200V208-125NTC
Hersteller: Infineon Technologies
Description: IC CPLD 3072MC 10NS 208QFP
Packaging: Bag
Package / Case: 208-BFQFP
Mounting Type: Surface Mount
Programmable Type: In-System Reprogrammable™ (ISR™) Flash
Number of Gates: 288000
Number of Macrocells: 3072
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 208-PQFP (28x28)
Voltage Supply - Internal: 2.5V, 3.3V
Number of I/O: 136
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY39200V388-125MGC
Hersteller: Infineon Technologies
Description: IC CPLD 3072MC 10NS 388BGA
Packaging: Bag
Package / Case: 388-BBGA
Mounting Type: Surface Mount
Programmable Type: In-System Reprogrammable™ (ISR™) Flash
Number of Gates: 288000
Number of Macrocells: 3072
Operating Temperature: 0°C ~ 70°C (TA)
Delay Time tpd(1) Max: 10 ns
Supplier Device Package: 388-BGA (35x35)
Voltage Supply - Internal: 2.5V, 3.3V
Number of I/O: 294
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C5468LTI-037 CY8C54.pdf
CY8C5468LTI-037
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 68QFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 2x12b; D/A 4x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 46 Stücke:
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Anzahl Preis
16+32.79 EUR
Mindestbestellmenge: 16
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CY8C5468LTI-037 CY8C54.pdf
CY8C5468LTI-037
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 256KB FLASH 68QFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 256KB (256K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 2x12b; D/A 4x8b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART, USB
Peripherals: CapSense, DMA, LCD, POR, PWM, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IS26KS512S-DPBLA200
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT HYPERBUS 24FBGA
Packaging: Bulk
Package / Case: 24-VBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: HyperFlash
Clock Frequency: 166 MHz
Memory Format: FLASH
Supplier Device Package: 24-VFBGA (6x8)
Memory Interface: HyperBus
Access Time: 96 ns
Memory Organization: 64M x 8
Produkt ist nicht verfügbar
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IS26KS256S-DPBLA200-TR
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT HYPERBUS
Packaging: Bulk
Memory Size: 256Mbit
Memory Format: FLASH
Memory Interface: HyperBus
Memory Organization: 32M x 8
Produkt ist nicht verfügbar
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CY8C6148LQI-S2F02 Infineon-PSoC_6_MCU_CY8C61x8_CY8C61xA-DataSheet-v04_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0eea1f6b72fa
CY8C6148LQI-S2F02
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 68QFN
Packaging: Tray
Package / Case: 68-VFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 512K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 16x8b, 16x10/12b SAR, Sigma-Delta; D/A 2x7/8b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: eMMC/SD/SDIO, I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, LCD, LVD, POR, PWM, Temp Sensor, WDT
Supplier Device Package: 68-QFN (8x8)
Number of I/O: 53
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IR3513ZMTRPBF IR3513.pdf
IR3513ZMTRPBF
Hersteller: Infineon Technologies
Description: IC CTRL XPHASE3 POL 32-MLPQ
Packaging: Bulk
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 16V
Applications: Processor
Current - Supply: 3mA
Supplier Device Package: 32-MLPQ (5x5)
auf Bestellung 150 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
100+5.09 EUR
Mindestbestellmenge: 100
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IR3505ZMTRPBF IR3505Z.pdf
IR3505ZMTRPBF
Hersteller: Infineon Technologies
Description: IC XPHASE3 CTLR 2.5A 16-MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 16V
Applications: Processor
Current - Supply: 3mA
Supplier Device Package: 16-MLPQ (3x3)
Produkt ist nicht verfügbar
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IR3505ZMTRPBF IR3505Z.pdf
IR3505ZMTRPBF
Hersteller: Infineon Technologies
Description: IC XPHASE3 CTLR 2.5A 16-MLPQ
Packaging: Cut Tape (CT)
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 16V
Applications: Processor
Current - Supply: 3mA
Supplier Device Package: 16-MLPQ (3x3)
Produkt ist nicht verfügbar
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IR3505ZMTRPBF IR3505Z.pdf
IR3505ZMTRPBF
Hersteller: Infineon Technologies
Description: IC XPHASE3 CTLR 2.5A 16-MLPQ
Packaging: Bulk
Package / Case: 16-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 16V
Applications: Processor
Current - Supply: 3mA
Supplier Device Package: 16-MLPQ (3x3)
auf Bestellung 1324 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
136+3.74 EUR
Mindestbestellmenge: 136
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IR3508ZMTRPBF IR3508Z.pdf
IR3508ZMTRPBF
Hersteller: Infineon Technologies
Description: IC CTRL XPHASE3 20-MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 28V
Applications: Processor
Current - Supply: 4mA
Supplier Device Package: 20-MLPQ (4x4)
Produkt ist nicht verfügbar
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IR3508ZMTRPBF IR3508Z.pdf
IR3508ZMTRPBF
Hersteller: Infineon Technologies
Description: IC CTRL XPHASE3 20-MLPQ
Packaging: Cut Tape (CT)
Package / Case: 20-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 125°C
Voltage - Supply: 8V ~ 28V
Applications: Processor
Current - Supply: 4mA
Supplier Device Package: 20-MLPQ (4x4)
Produkt ist nicht verfügbar
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IR3500VMTRPBF IR3500V.pdf
IR3500VMTRPBF
Hersteller: Infineon Technologies
Description: IC XPHASE3 CTLR VR11.1 32-MLPQ
Packaging: Tape & Reel (TR)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C
Voltage - Supply: 4.75V ~ 7.5V
Applications: Processor
Current - Supply: 6.5mA
Supplier Device Package: 32-MLPQ (5x5)
Produkt ist nicht verfügbar
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IR3500VMTRPBF IR3500V.pdf
IR3500VMTRPBF
Hersteller: Infineon Technologies
Description: IC XPHASE3 CTLR VR11.1 32-MLPQ
Packaging: Cut Tape (CT)
Package / Case: 32-VFQFN Exposed Pad
Mounting Type: Surface Mount
Operating Temperature: 0°C ~ 100°C
Voltage - Supply: 4.75V ~ 7.5V
Applications: Processor
Current - Supply: 6.5mA
Supplier Device Package: 32-MLPQ (5x5)
Produkt ist nicht verfügbar
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IPQC60T010S7AXTMA1
IPQC60T010S7AXTMA1
Hersteller: Infineon Technologies
Description: AUTOMOTIVE_COOLMOS
Packaging: Tape & Reel (TR)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 174A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 50A, 12V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.06mA
Supplier Device Package: PG-HDSOP-22-101
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 12V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 318 nC @ 12 V
Input Capacitance (Ciss) (Max) @ Vds: 11986 pF @ 300 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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IPQC60T010S7AXTMA1
IPQC60T010S7AXTMA1
Hersteller: Infineon Technologies
Description: AUTOMOTIVE_COOLMOS
Packaging: Cut Tape (CT)
Package / Case: 22-PowerBSOP Module
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 174A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 50A, 12V
Power Dissipation (Max): 694W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 3.06mA
Supplier Device Package: PG-HDSOP-22-101
Grade: Automotive
Drive Voltage (Max Rds On, Min Rds On): 12V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 318 nC @ 12 V
Input Capacitance (Ciss) (Max) @ Vds: 11986 pF @ 300 V
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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TLE493DP3XXMS2GOTOBO1
TLE493DP3XXMS2GOTOBO1
Hersteller: Infineon Technologies
Description: TLE493DP3XXMS2GOTOBO1
Packaging: Box
Interface: I2C, SPI
Sensor Type: Magnetic, Hall Effect
Utilized IC / Part: TLE493D-P3B6, TLE493D-P3I8
Embedded: Yes, MCU
auf Bestellung 5 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+92.49 EUR
5+83.66 EUR
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TLE493DP3I8XTMA1
Hersteller: Infineon Technologies
Description: TLE493DP3I8XTMA1
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE493DP3I8XTMA1
Hersteller: Infineon Technologies
Description: TLE493DP3I8XTMA1
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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TLE493DW3B6B0HTSA1
Hersteller: Infineon Technologies
Description: POSITION SENS ATV
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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