Produkte > INFINEON TECHNOLOGIES > Alle Produkte des Herstellers INFINEON TECHNOLOGIES (128400) > Seite 461 nach 2140
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IMW120R014M1HXKSA1 | Infineon Technologies |
Description: SIC DISCRETEPackaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: SiCFET (Silicon Carbide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 127A (Tc) Rds On (Max) @ Id, Vgs: 18.4mOhm @ 54.3A, 18V Power Dissipation (Max): 455W (Tc) Vgs(th) (Max) @ Id: 5.2V @ 23.4mA Supplier Device Package: PG-TO247-3 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 15V, 18V Vgs (Max): +20V, -5V Drain to Source Voltage (Vdss): 1200 V Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 18 V Input Capacitance (Ciss) (Max) @ Vds: 4580 pF @ 800 V |
auf Bestellung 639 Stücke: Lieferzeit 10-14 Tag (e) |
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IMW120R020M1HXKSA1 | Infineon Technologies |
Description: SIC DISCRETEInput Capacitance (Ciss) (Max) @ Vds: 3460 pF @ 800 V Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 18 V Drain to Source Voltage (Vdss): 1200 V Vgs (Max): +20V, -5V Drive Voltage (Max Rds On, Min Rds On): 15V, 18V Part Status: Active Supplier Device Package: PG-TO247-3 Vgs(th) (Max) @ Id: 5.2V @ 17.6mA Power Dissipation (Max): 375W (Tc) Rds On (Max) @ Id, Vgs: 26.9mOhm @ 41A, 18V Current - Continuous Drain (Id) @ 25°C: 98A (Tc) FET Type: N-Channel Technology: SiCFET (Silicon Carbide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-247-3 Packaging: Tube |
auf Bestellung 1648 Stücke: Lieferzeit 10-14 Tag (e) |
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IMW120R040M1HXKSA1 | Infineon Technologies |
Description: SIC DISCRETEInput Capacitance (Ciss) (Max) @ Vds: 1620 pF @ 800 V Gate Charge (Qg) (Max) @ Vgs: 51 nC @ 18 V Drain to Source Voltage (Vdss): 1200 V Vgs (Max): +20V, -5V Drive Voltage (Max Rds On, Min Rds On): 15V, 18V Part Status: Active Supplier Device Package: PG-TO247-3 Vgs(th) (Max) @ Id: 5.2V @ 10mA Power Dissipation (Max): 227W (Tc) Rds On (Max) @ Id, Vgs: 54.4mOhm @ 19.3A, 18V Current - Continuous Drain (Id) @ 25°C: 55A (Tc) FET Type: N-Channel Technology: SiCFET (Silicon Carbide) Operating Temperature: -55°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-247-3 Packaging: Tube |
auf Bestellung 312 Stücke: Lieferzeit 10-14 Tag (e) |
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SAK-TC297TC-96F300S BC | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGAConnectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 94x12b SAR, Sigma-Delta Core Processor: TriCore™ EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 456K x 8 Program Memory Size: 6MB (6M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) Number of I/O: 169 Part Status: Active Supplier Device Package: PG-LFBGA-292-6 Peripherals: DMA, WDT DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SAK-TC297TP-96F300S BB | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGA Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 94x12b SAR, Sigma-Delta Core Processor: TriCore™ EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 456K x 8 Program Memory Size: 6MB (6M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) Number of I/O: 169 Part Status: Obsolete Supplier Device Package: PG-LFBGA-292-6 Peripherals: DMA, WDT DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SAK-TC297T-96F300S BB | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGA Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 94x12b SAR, Sigma-Delta Core Processor: TriCore™ EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 456K x 8 Program Memory Size: 6MB (6M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) Number of I/O: 169 Part Status: Obsolete Supplier Device Package: PG-LFBGA-292-6 DigiKey Programmable: Not Verified Peripherals: DMA, WDT |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SAK-TC297T-96F300N BC | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGANumber of I/O: 169 Part Status: Active Supplier Device Package: PG-LFBGA-292-6 Core Processor: TriCore™ EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 728K x 8 Program Memory Size: 6MB (6M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) Peripherals: DMA, WDT Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 94x12b SAR, Sigma-Delta DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SAK-TC297TC-96F300S BB | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGA Number of I/O: 169 Part Status: Obsolete Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 94x12b SAR, Sigma-Delta Core Processor: TriCore™ EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 456K x 8 Program Memory Size: 6MB (6M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) Supplier Device Package: PG-LFBGA-292-6 Peripherals: DMA, WDT DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SAK-TC297TP-96F300N BC | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGANumber of I/O: 169 Part Status: Active Supplier Device Package: PG-LFBGA-292-6 Peripherals: DMA, WDT Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V Core Size: 32-Bit Tri-Core Data Converters: A/D 94x12b SAR, Sigma-Delta Core Processor: TriCore™ EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 728K x 8 Program Memory Size: 6MB (6M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TC297TP96F300SBBKXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGACore Size: 32-Bit Tri-Core Data Converters: A/D 94x12b SAR, Sigma-Delta Core Processor: TriCore™ EEPROM Size: 128K x 8 Program Memory Type: FLASH Oscillator Type: External Operating Temperature: -40°C ~ 125°C (TA) RAM Size: 456K x 8 Program Memory Size: 6MB (6M x 8) Speed: 300MHz Mounting Type: Surface Mount Package / Case: 292-LFBGA Packaging: Tape & Reel (TR) Number of I/O: 169 Part Status: Active Supplier Device Package: PG-LFBGA-292-6 Peripherals: DMA, WDT Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TC377TP96F300SAALXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 6MB FLASH 292LFBGAPackaging: Tape & Reel (TR) Package / Case: 292-LFBGA Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 6MB (6M x 8) RAM Size: 1.1M x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: TriCore™ Core Size: 32-Bit Tri-Core Voltage - Supply (Vcc/Vdd): 3.3V, 5V Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: PG-LFBGA-292-6 Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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IGP01N120H2XKSA1036 | Infineon Technologies |
Description: IGP01N120 - DISCRETE IGBT WITHOU |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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DD500S33HE3BPSA1 | Infineon Technologies |
Description: DIODE MODULE GP 3300V AGIHVB1303Packaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Speed: Standard Recovery >500ns, > 200mA (Io) Technology: Standard Diode Configuration: 2 Independent Supplier Device Package: AG-IHVB130-3 Operating Temperature - Junction: -40°C ~ 150°C Voltage - DC Reverse (Vr) (Max): 3300 V Voltage - Forward (Vf) (Max) @ If: 3.85 V @ 500 A |
auf Bestellung 65 Stücke: Lieferzeit 10-14 Tag (e) |
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CY8C4025LQI-S402 | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 32QFNPackaging: Tray Package / Case: 32-UFQFN Exposed Pad Mounting Type: Surface Mount Speed: 24MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT Supplier Device Package: 32-QFN (5x5) Part Status: Active Number of I/O: 27 DigiKey Programmable: Not Verified |
auf Bestellung 4842 Stücke: Lieferzeit 10-14 Tag (e) |
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CY8C4025AZI-S403 | Infineon Technologies |
Description: IC MCU 32BIT 32KB FLASH 48TQFPPackaging: Tray Package / Case: 48-LQFP Mounting Type: Surface Mount Speed: 24MHz Program Memory Size: 32KB (32K x 8) RAM Size: 4K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: ARM® Cortex®-M0+ Data Converters: A/D 1x10b Core Size: 32-Bit Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT Supplier Device Package: 48-TQFP (7x7) Part Status: Active Number of I/O: 36 DigiKey Programmable: Not Verified |
auf Bestellung 427 Stücke: Lieferzeit 10-14 Tag (e) |
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TLE9012DQUDTRBMS2TOBO1 | Infineon Technologies |
Description: EVAL BOARD FOR TLE9012DQUPackaging: Bulk Function: Battery Monitor Type: Power Management Contents: Board(s), Cable(s) Utilized IC / Part: TLE9012DQU Supplied Contents: Board(s), Cable(s) Primary Attributes: 4.75V ~ 60V Supply Secondary Attributes: On-Board LEDs Embedded: Yes, MCU, 32-Bit Part Status: Active |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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| T600N95TOFXPSA1 | Infineon Technologies |
Description: SCR MODULE 9.5KV 930A TO-200ACPackaging: Tray Package / Case: TO-200AC Mounting Type: Clamp On Operating Temperature: -40°C ~ 125°C Structure: Single Current - Hold (Ih) (Max): 350 mA Current - Gate Trigger (Igt) (Max): 350 mA Current - Non Rep. Surge 50, 60Hz (Itsm): 12800A @ 50Hz Number of SCRs, Diodes: 1 SCR Current - On State (It (AV)) (Max): 830 A Voltage - Gate Trigger (Vgt) (Max): 2.5 V Current - On State (It (RMS)) (Max): 930 A Voltage - Off State: 9.5 kV |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| PEB20256EV2.1-G | Infineon Technologies | Description: MUNICH256 MULTI CHANNEL NETWORK |
auf Bestellung 432 Stücke: Lieferzeit 10-14 Tag (e) |
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CHL8104-09CRT | Infineon Technologies |
Description: IC REG BUCK 40VQFN |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| CHL8212-03CRT | Infineon Technologies |
Description: IC REG BUCK 28VQFNNumber of Outputs: 3 Part Status: Obsolete Clock Sync: No Output Phases: 2 Serial Interfaces: I²C Control Features: Enable Synchronous Rectifier: No Supplier Device Package: PG-VQFN-28-902 Voltage - Supply (Vcc/Vdd): 3.3V Topology: Buck Frequency - Switching: 200kHz ~ 1.2MHz Output Configuration: Positive Operating Temperature: 0°C ~ 85°C Function: Step-Down Mounting Type: Surface Mount Output Type: PWM Package / Case: 28-VFQFN Exposed Pad Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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TC365DP64F300WAAKXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 4MB FLASH 176LQFPPackaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 4MB (4M x 8) RAM Size: 672K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: TriCore™ Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.3V, 5V Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: PG-LQFP-176-22 Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TC365DP64F300WAAKXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 4MB FLASH 176LQFPPackaging: Cut Tape (CT) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 4MB (4M x 8) RAM Size: 672K x 8 Operating Temperature: -40°C ~ 125°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: TriCore™ Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.3V, 5V Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: PG-LQFP-176-22 Part Status: Active DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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TC365DP64F300WAALXUMA1 | Infineon Technologies |
Description: IC MCU 32BIT 4MB FLASH 176LQFPPackaging: Tape & Reel (TR) Package / Case: 176-LQFP Exposed Pad Mounting Type: Surface Mount Speed: 300MHz Program Memory Size: 4MB (4M x 8) RAM Size: 672K x 8 Operating Temperature: -40°C ~ 150°C (TA) Oscillator Type: Internal Program Memory Type: FLASH Core Processor: TriCore™ Core Size: 32-Bit Dual-Core Voltage - Supply (Vcc/Vdd): 3.3V, 5V Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT Peripherals: DMA, I2S, PWM, WDT Supplier Device Package: PG-LQFP-176-22 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| XDPE14284AXUMA1 | Infineon Technologies | Description: IFX PRIMARION CNTRLLER PG-VQFN-4 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 4000 Stücke Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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KP200XTMA2 | Infineon Technologies |
Description: SENSOR 15.95PSIA DSOF8Packaging: Tape & Reel (TR) Package / Case: 8-SMD Module Output Type: SPI Mounting Type: Surface Mount Operating Pressure: 7.77PSI ~ 15.95PSI (53.6kPa ~ 110kPa) Pressure Type: Absolute Operating Temperature: -40°C ~ 85°C Termination Style: SMD (SMT) Tab Voltage - Supply: 4.5V ~ 11V Applications: Board Mount Supplier Device Package: PG-DSOF-8-16 Port Style: No Port Grade: Automotive Qualification: AEC-Q100 |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1500 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BBY51-03W | Infineon Technologies |
Description: VARIABLE CAPACITANCE DIODE |
Produkt ist nicht verfügbar |
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BBY 51-02W E6327 | Infineon Technologies |
Description: DIODE TUNING 7V 20MA SCD-80Capacitance Ratio: 2.2 Voltage - Peak Reverse (Max): 7 V Supplier Device Package: SCD-80 Capacitance Ratio Condition: C1/C4 Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz Operating Temperature: -55°C ~ 125°C (TJ) Diode Type: Single Mounting Type: Surface Mount Package / Case: SC-80 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 15000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BBY 51-02L E6327 | Infineon Technologies |
Description: DIODE TUNING 7V 20MA TSLP-2Capacitance Ratio: 2.2 Voltage - Peak Reverse (Max): 7 V Supplier Device Package: PG-TSLP-2-1 Capacitance Ratio Condition: C1/C4 Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz Operating Temperature: -55°C ~ 125°C (TJ) Diode Type: Single Mounting Type: Surface Mount Package / Case: SOD-882 Packaging: Tape & Reel (TR) |
Produkt ist nicht verfügbar |
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| ESD18VU1B-02LSE6327 | Infineon Technologies |
Description: TRANS VOLTAGE SUPPRESSOR DIODEPower Line Protection: No Voltage - Clamping (Max) @ Ipp: 17V (Typ) Voltage - Breakdown (Min): 20V Bidirectional Channels: 1 Supplier Device Package: PG-TSLP-2-17 Voltage - Reverse Standoff (Typ): 18.5V (Max) Current - Peak Pulse (10/1000µs): 2A (8/20µs) Capacitance @ Frequency: 0.3pF @ 1MHz Applications: RF Antenna Operating Temperature: -40°C ~ 85°C (TA) Type: Zener Mounting Type: Surface Mount Package / Case: SOD-882 Packaging: Bulk |
auf Bestellung 13300 Stücke: Lieferzeit 10-14 Tag (e) |
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FP150R12N3T7PB11BPSA1 | Infineon Technologies |
Description: LOW POWER ECONOInput Capacitance (Cies) @ Vce: 30.1 nF @ 25 V Current - Collector Cutoff (Max): 12 µA Power - Max: 20 mW Voltage - Collector Emitter Breakdown (Max): 1200 V Current - Collector (Ic) (Max): 150 A Part Status: Active IGBT Type: Trench Field Stop Supplier Device Package: AG-ECONO3 NTC Thermistor: Yes Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 150A Operating Temperature: -40°C ~ 175°C (TJ) Configuration: Three Phase Inverter with Brake Input: Three Phase Bridge Rectifier Mounting Type: Chassis Mount Package / Case: Module Packaging: Tray |
auf Bestellung 6 Stücke: Lieferzeit 10-14 Tag (e) |
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IPT008N06NM5LFATMA1 | Infineon Technologies |
Description: TRENCH 40<-<100V PG-HSOF-8Packaging: Tape & Reel (TR) Package / Case: 8-PowerSFN Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 454A (Tc) Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V Power Dissipation (Max): 278W (Tc) Vgs(th) (Max) @ Id: 3.6V @ 250µA Supplier Device Package: PG-HSOF-8 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 60 V Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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IPT008N06NM5LFATMA1 | Infineon Technologies |
Description: TRENCH 40<-<100V PG-HSOF-8Packaging: Cut Tape (CT) Package / Case: 8-PowerSFN Mounting Type: Surface Mount Operating Temperature: -55°C ~ 150°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 454A (Tc) Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V Power Dissipation (Max): 278W (Tc) Vgs(th) (Max) @ Id: 3.6V @ 250µA Supplier Device Package: PG-HSOF-8 Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 60 V Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V |
auf Bestellung 6287 Stücke: Lieferzeit 10-14 Tag (e) |
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| FS03MR12A6MA1B | Infineon Technologies |
Description: HYBRID PACK DRIVE SIC AG-HYBRIDD |
Produkt ist nicht verfügbar |
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DDB6U134N16RRB11BPSA2 | Infineon Technologies |
Description: LOW POWER ECONO AG-ECONO2B-211Packaging: Tray Current - Collector (Ic) (Max): 125 A Part Status: Active Supplier Device Package: AG-ECONO2B NTC Thermistor: Yes Vce(on) (Max) @ Vge, Ic: 2.6V @ 15V, 75A Operating Temperature: -40°C ~ 150°C (TJ) Configuration: Single Chopper Input: Standard Mounting Type: Chassis Mount Package / Case: Module Input Capacitance (Cies) @ Vce: 5.1 nF @ 25 V Current - Collector Cutoff (Max): 1 mA Power - Max: 400 W Voltage - Collector Emitter Breakdown (Max): 1200 V |
auf Bestellung 12 Stücke: Lieferzeit 10-14 Tag (e) |
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| DF400R12KE3 | Infineon Technologies |
Description: DFXR12H - IGBT MODULEPackaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Single Operating Temperature: -40°C ~ 125°C (TJ) Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A NTC Thermistor: No Supplier Device Package: Module IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 580 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 2000 W Current - Collector Cutoff (Max): 5 mA Input Capacitance (Cies) @ Vce: 28 nF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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FD300R06KE3HOSA1 | Infineon Technologies |
Description: IGBT MOD 600V 400A 940W |
auf Bestellung 35 Stücke: Lieferzeit 10-14 Tag (e) |
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FD300R06KE3HOSA1 | Infineon Technologies |
Description: IGBT MOD 600V 400A 940W |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 10 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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FP75R12N3T7B11BPSA1 | Infineon Technologies |
Description: IGBT MODULE 1200V 75A AG-ECONO3Packaging: Tray Package / Case: Module Mounting Type: Chassis Mount Input: Three Phase Bridge Rectifier Configuration: Three Phase Inverter Operating Temperature: -40°C ~ 175°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 75A NTC Thermistor: Yes Supplier Device Package: AG-ECONO3 IGBT Type: Trench Field Stop Part Status: Active Current - Collector (Ic) (Max): 75 A Voltage - Collector Emitter Breakdown (Max): 1200 V Power - Max: 20 mW Current - Collector Cutoff (Max): 13 µA Input Capacitance (Cies) @ Vce: 15.1 nF @ 25 V |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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BTS70061EPZXUMA1 | Infineon Technologies |
Description: PROFET PG-TSDSO-14Qualification: AEC-Q100 Grade: Automotive Voltage - Supply (Vcc/Vdd): Not Required Voltage - Load: 6V ~ 18V Input Type: Non-Inverting Rds On (Typ): 6.6mOhm Output Configuration: High Side Operating Temperature: -40°C ~ 175°C (TJ) Switch Type: General Purpose Interface: On/Off Number of Outputs: 1 Mounting Type: Surface Mount Output Type: N-Channel Package / Case: 14-SOIC (0.154", 3.90mm Width) Exposed Pad Features: Slew Rate Controlled Packaging: Tape & Reel (TR) Part Status: Active Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit Supplier Device Package: PG-TDSO-14-11 Ratio - Input:Output: 1:1 Current - Output (Max): 12.5A |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 3000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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BTS70061EPZXUMA1 | Infineon Technologies |
Description: PROFET PG-TSDSO-14Features: Slew Rate Controlled Packaging: Cut Tape (CT) Package / Case: 14-SOIC (0.154", 3.90mm Width) Exposed Pad Output Type: N-Channel Mounting Type: Surface Mount Number of Outputs: 1 Interface: On/Off Switch Type: General Purpose Operating Temperature: -40°C ~ 175°C (TJ) Output Configuration: High Side Rds On (Typ): 6.6mOhm Input Type: Non-Inverting Voltage - Load: 6V ~ 18V Voltage - Supply (Vcc/Vdd): Not Required Current - Output (Max): 12.5A Ratio - Input:Output: 1:1 Supplier Device Package: PG-TDSO-14-11 Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit Grade: Automotive Part Status: Active Qualification: AEC-Q100 |
auf Bestellung 1281 Stücke: Lieferzeit 10-14 Tag (e) |
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TLE9250XSJXUMA1 | Infineon Technologies |
Description: IC TRANSCEIVER 1/1 PGDSO8Part Status: Not For New Designs Receiver Hysteresis: 100 mV Supplier Device Package: PG-DSO-8 Protocol: CANbus Data Rate: 5Mbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Type: Transceiver Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Packaging: Tape & Reel (TR) Qualification: AEC-Q100 Grade: Automotive |
auf Bestellung 10000 Stücke: Lieferzeit 10-14 Tag (e) |
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TLE9250XSJXUMA1 | Infineon Technologies |
Description: IC TRANSCEIVER 1/1 PGDSO8Packaging: Cut Tape (CT) Part Status: Not For New Designs Receiver Hysteresis: 100 mV Supplier Device Package: PG-DSO-8 Protocol: CANbus Data Rate: 5Mbps Number of Drivers/Receivers: 1/1 Voltage - Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 150°C (TJ) Type: Transceiver Mounting Type: Surface Mount Package / Case: 8-SOIC (0.154", 3.90mm Width) Qualification: AEC-Q100 Grade: Automotive |
auf Bestellung 12095 Stücke: Lieferzeit 10-14 Tag (e) |
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STT1400N16P55XPSA1 | Infineon Technologies |
Description: SCR MODULE 1.6KV MODULEVoltage - Off State: 1.6 kV Voltage - Gate Trigger (Vgt) (Max): 2 V Number of SCRs, Diodes: 2 SCRs Current - Non Rep. Surge 50, 60Hz (Itsm): 10500A @ 50Hz Current - Gate Trigger (Igt) (Max): 200 mA Current - Hold (Ih) (Max): 300 mA Structure: 1-Phase Controller - All SCRs Operating Temperature: 125°C (TJ) Mounting Type: Chassis Mount Package / Case: Module Packaging: Tray |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| S71VS064RB0AHT4L3 | Infineon Technologies |
Description: IC FLASH RAM 64MIT PAR 52VFRBGA Packaging: Tape & Reel (TR) Package / Case: 52-VFBGA Mounting Type: Surface Mount Memory Size: 64Mbit (FLASH), 64Mbit (RAM) Memory Type: Non-Volatile, Volatile Operating Temperature: -25°C ~ 85°C (TA) Voltage - Supply: 1.7V ~ 1.95V Technology: FLASH, PSRAM Clock Frequency: 108 MHz Memory Format: FLASH, RAM Supplier Device Package: 52-VFRBGA (6x5) Memory Interface: Parallel DigiKey Programmable: Not Verified |
auf Bestellung 8000 Stücke: Lieferzeit 10-14 Tag (e) |
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AIKQ200N75CP2XKSA1 | Infineon Technologies |
Description: IGBT TRENCH 750V 200A TO-247-3Voltage - Collector Emitter Breakdown (Max): 750 V Current - Collector (Ic) (Max): 200 A Part Status: Active Gate Charge: 1256 nC Switching Energy: 15.3mJ (on), 7mJ (off) Td (on/off) @ 25°C: 89ns/266ns IGBT Type: Trench Supplier Device Package: TO-247-3 Input Type: Standard Operating Temperature: -40°C ~ 175°C (TJ) Mounting Type: Through Hole Package / Case: TO-247-3 Packaging: Tube Power - Max: 576 W Current - Collector Pulsed (Icm): 600 A |
auf Bestellung 225 Stücke: Lieferzeit 10-14 Tag (e) |
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TLS412533VBOARDTOBO1 | Infineon Technologies |
Description: TLS4125 3.3V BOARDMain Purpose: DC/DC, Step Down Supplied Contents: Board(s) Utilized IC / Part: TLS4125D0EPV33 Board Type: Fully Populated Regulator Topology: Buck Current - Output: 2.5A Voltage - Input: 3.7V ~ 35V Voltage - Output: 3.3V Packaging: Bulk Outputs and Type: 1, Non-Isolated |
auf Bestellung 3 Stücke: Lieferzeit 10-14 Tag (e) |
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TLS412033VBOARDTOBO1 | Infineon Technologies |
Description: EVAL BOARD FOR TLS4120D0EPV33Packaging: Bulk Voltage - Output: 3.3V Voltage - Input: 3.7V ~ 35V Current - Output: 2A Regulator Topology: Buck Board Type: Fully Populated Utilized IC / Part: TLS4120D0EPV33 Supplied Contents: Board(s) Main Purpose: DC/DC, Step Down Outputs and Type: 1 Non-Isolated Output Part Status: Active Contents: Board(s) |
auf Bestellung 2 Stücke: Lieferzeit 10-14 Tag (e) |
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IRFS4410PBF-INF | Infineon Technologies |
Description: HEXFET POWER MOSFETPackaging: Bulk Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 88A (Tc) Rds On (Max) @ Id, Vgs: 10mOhm @ 58A, 10V Power Dissipation (Max): 200W (Tc) Vgs(th) (Max) @ Id: 4V @ 150µA Supplier Device Package: PG-TO263-3-2 Part Status: Active Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 180 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 5150 pF @ 50 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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SAF-XC836T-2FRIAB | Infineon Technologies |
Description: XC800 I-FAMILY MICROCONTROLLER ,Packaging: Bulk Package / Case: 28-TSSOP (0.173", 4.40mm Width) Mounting Type: Surface Mount Speed: 24MHz Program Memory Size: 8KB (8K x 8) RAM Size: 512 x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: External, Internal Program Memory Type: FLASH Core Processor: XC800 Data Converters: A/D 8x10b Core Size: 8-Bit Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V Connectivity: I2C, SSC, UART/USART Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT Supplier Device Package: PG-TSSOP-28-1 Part Status: Active Number of I/O: 25 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
| XC8362FRAABFXUMA1 | Infineon Technologies |
Description: IC MCU Packaging: Bulk DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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BAT1504WH2110XTSA1 | Infineon Technologies |
Description: DIODE SCHOTTKY 4V 100MW SOT3233Packaging: Tape & Reel (TR) Package / Case: SC-70, SOT-323 Diode Type: Schottky - 1 Pair Series Connection Operating Temperature: 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 0V, 1MHz Resistance @ If, F: 5.8Ohm @ 50mA, 1MHz Voltage - Peak Reverse (Max): 4V Supplier Device Package: PG-SOT323-3 Part Status: Active Current - Max: 110 mA Power Dissipation (Max): 100 mW |
auf Bestellung 6000 Stücke: Lieferzeit 10-14 Tag (e) |
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BAT1504WH2110XTSA1 | Infineon Technologies |
Description: DIODE SCHOTTKY 4V 100MW SOT3233Packaging: Cut Tape (CT) Package / Case: SC-70, SOT-323 Diode Type: Schottky - 1 Pair Series Connection Operating Temperature: 150°C (TJ) Capacitance @ Vr, F: 0.35pF @ 0V, 1MHz Resistance @ If, F: 5.8Ohm @ 50mA, 1MHz Voltage - Peak Reverse (Max): 4V Supplier Device Package: PG-SOT323-3 Part Status: Active Current - Max: 110 mA Power Dissipation (Max): 100 mW |
auf Bestellung 12348 Stücke: Lieferzeit 10-14 Tag (e) |
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| 6PS04012E4DG36022NOSA1 | Infineon Technologies |
Description: MODULE IGBTPackaging: Bulk Package / Case: Module Input: Standard Configuration: Full Bridge Inverter Operating Temperature: -40°C ~ 85°C Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 200A NTC Thermistor: No Part Status: Obsolete Current - Collector (Ic) (Max): 306 A Voltage - Collector Emitter Breakdown (Max): 3600 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
| F3L75R12W1H3BPSA1 | Infineon Technologies |
Description: LOW POWER EASY AG-EASY1B-311 Packaging: Tray |
auf Bestellung 24 Stücke: Lieferzeit 10-14 Tag (e) |
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| DF400R07PE4R_B6 | Infineon Technologies |
Description: IGBT MOD 650V 450A 1100WPackaging: Bulk Package / Case: Module Mounting Type: Chassis Mount Input: Standard Configuration: Single Chopper Operating Temperature: 150°C (TJ) Vce(on) (Max) @ Vge, Ic: 1.95V @ 15V, 400A NTC Thermistor: Yes Supplier Device Package: Module IGBT Type: NPT Current - Collector (Ic) (Max): 450 A Voltage - Collector Emitter Breakdown (Max): 650 V Power - Max: 1100 W Current - Collector Cutoff (Max): 20 nA Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | |||||||||||||||||
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2PS06017E32G28213NOSA1 | Infineon Technologies |
Description: IGBT MODULE 1100VDC 325A |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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IMBG65R163M1HXTMA1 | Infineon Technologies |
Description: SILICON CARBIDE MOSFET PG-TO263-Packaging: Tape & Reel (TR) Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: SiCFET (Silicon Carbide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 17A (Tc) Rds On (Max) @ Id, Vgs: 217mOhm @ 5.7A, 18V Power Dissipation (Max): 85W (Tc) Vgs(th) (Max) @ Id: 5.7V @ 1.7mA Supplier Device Package: PG-TO263-7-12 Drive Voltage (Max Rds On, Min Rds On): 18V Vgs (Max): +23V, -5V Drain to Source Voltage (Vdss): 650 V Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 18 V Input Capacitance (Ciss) (Max) @ Vds: 320 pF @ 400 V |
Produkt ist nicht verfügbar |
Mindestbestellmenge: 1000 Stücke Im Einkaufswagen Stück im Wert von UAH | ||||||||||||||||
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IMBG65R163M1HXTMA1 | Infineon Technologies |
Description: SILICON CARBIDE MOSFET PG-TO263-Packaging: Cut Tape (CT) Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA Mounting Type: Surface Mount Operating Temperature: -55°C ~ 175°C (TJ) Technology: SiCFET (Silicon Carbide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 17A (Tc) Rds On (Max) @ Id, Vgs: 217mOhm @ 5.7A, 18V Power Dissipation (Max): 85W (Tc) Vgs(th) (Max) @ Id: 5.7V @ 1.7mA Supplier Device Package: PG-TO263-7-12 Drive Voltage (Max Rds On, Min Rds On): 18V Vgs (Max): +23V, -5V Drain to Source Voltage (Vdss): 650 V Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 18 V Input Capacitance (Ciss) (Max) @ Vds: 320 pF @ 400 V |
auf Bestellung 33 Stücke: Lieferzeit 10-14 Tag (e) |
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IRFP4110PBFXKMA1 | Infineon Technologies |
Description: TRENCH >=100V PG-TO247-3Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 180A (Tc) Rds On (Max) @ Id, Vgs: 4.5mOhm @ 75A, 10V Power Dissipation (Max): 370W (Tc) Vgs(th) (Max) @ Id: 4V @ 250µA Supplier Device Package: TO-247AC Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 210 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 9620 pF @ 50 V |
auf Bestellung 1897 Stücke: Lieferzeit 10-14 Tag (e) |
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IRFP4468PBFXKMA1 | Infineon Technologies |
Description: MOSFET N-CH 100V 195A TO247-3Packaging: Tube Package / Case: TO-247-3 Mounting Type: Through Hole Operating Temperature: -55°C ~ 175°C (TJ) Technology: MOSFET (Metal Oxide) FET Type: N-Channel Current - Continuous Drain (Id) @ 25°C: 25A (Ta), 195A (Tc) Rds On (Max) @ Id, Vgs: 2.6mOhm @ 180A, 10V Power Dissipation (Max): 3.8W (Ta), 517W (Tc) Vgs(th) (Max) @ Id: 4V @ 1A Supplier Device Package: TO-247AC Part Status: Active Drive Voltage (Max Rds On, Min Rds On): 10V Vgs (Max): ±20V Drain to Source Voltage (Vdss): 100 V Gate Charge (Qg) (Max) @ Vgs: 540 nC @ 10 V Input Capacitance (Ciss) (Max) @ Vds: 29000 pF @ 50 V |
auf Bestellung 886 Stücke: Lieferzeit 10-14 Tag (e) |
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| IMW120R014M1HXKSA1 |
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Hersteller: Infineon Technologies
Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 127A (Tc)
Rds On (Max) @ Id, Vgs: 18.4mOhm @ 54.3A, 18V
Power Dissipation (Max): 455W (Tc)
Vgs(th) (Max) @ Id: 5.2V @ 23.4mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -5V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 4580 pF @ 800 V
Description: SIC DISCRETE
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 127A (Tc)
Rds On (Max) @ Id, Vgs: 18.4mOhm @ 54.3A, 18V
Power Dissipation (Max): 455W (Tc)
Vgs(th) (Max) @ Id: 5.2V @ 23.4mA
Supplier Device Package: PG-TO247-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Vgs (Max): +20V, -5V
Drain to Source Voltage (Vdss): 1200 V
Gate Charge (Qg) (Max) @ Vgs: 145 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 4580 pF @ 800 V
auf Bestellung 639 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 53.13 EUR |
| 30+ | 34.37 EUR |
| 60+ | 32.14 EUR |
| 120+ | 30.63 EUR |
| IMW120R020M1HXKSA1 |
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Hersteller: Infineon Technologies
Description: SIC DISCRETE
Input Capacitance (Ciss) (Max) @ Vds: 3460 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +20V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Part Status: Active
Supplier Device Package: PG-TO247-3
Vgs(th) (Max) @ Id: 5.2V @ 17.6mA
Power Dissipation (Max): 375W (Tc)
Rds On (Max) @ Id, Vgs: 26.9mOhm @ 41A, 18V
Current - Continuous Drain (Id) @ 25°C: 98A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
Description: SIC DISCRETE
Input Capacitance (Ciss) (Max) @ Vds: 3460 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 109 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +20V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Part Status: Active
Supplier Device Package: PG-TO247-3
Vgs(th) (Max) @ Id: 5.2V @ 17.6mA
Power Dissipation (Max): 375W (Tc)
Rds On (Max) @ Id, Vgs: 26.9mOhm @ 41A, 18V
Current - Continuous Drain (Id) @ 25°C: 98A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
auf Bestellung 1648 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 43.04 EUR |
| 30+ | 27.19 EUR |
| 60+ | 25.3 EUR |
| 120+ | 23.72 EUR |
| 510+ | 21.79 EUR |
| IMW120R040M1HXKSA1 |
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Hersteller: Infineon Technologies
Description: SIC DISCRETE
Input Capacitance (Ciss) (Max) @ Vds: 1620 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 51 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +20V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Part Status: Active
Supplier Device Package: PG-TO247-3
Vgs(th) (Max) @ Id: 5.2V @ 10mA
Power Dissipation (Max): 227W (Tc)
Rds On (Max) @ Id, Vgs: 54.4mOhm @ 19.3A, 18V
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
Description: SIC DISCRETE
Input Capacitance (Ciss) (Max) @ Vds: 1620 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 51 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +20V, -5V
Drive Voltage (Max Rds On, Min Rds On): 15V, 18V
Part Status: Active
Supplier Device Package: PG-TO247-3
Vgs(th) (Max) @ Id: 5.2V @ 10mA
Power Dissipation (Max): 227W (Tc)
Rds On (Max) @ Id, Vgs: 54.4mOhm @ 19.3A, 18V
Current - Continuous Drain (Id) @ 25°C: 55A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
auf Bestellung 312 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 25.32 EUR |
| 30+ | 15.33 EUR |
| 120+ | 13.14 EUR |
| SAK-TC297TC-96F300S BC |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAK-TC297TP-96F300S BB |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 169
Part Status: Obsolete
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 169
Part Status: Obsolete
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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| SAK-TC297T-96F300S BB |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 169
Part Status: Obsolete
Supplier Device Package: PG-LFBGA-292-6
DigiKey Programmable: Not Verified
Peripherals: DMA, WDT
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 169
Part Status: Obsolete
Supplier Device Package: PG-LFBGA-292-6
DigiKey Programmable: Not Verified
Peripherals: DMA, WDT
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SAK-TC297T-96F300N BC |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 728K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Peripherals: DMA, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 728K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Peripherals: DMA, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SAK-TC297TC-96F300S BB |
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Obsolete
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Obsolete
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I²C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| SAK-TC297TP-96F300N BC |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 728K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 728K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TC297TP96F300SBBKXUMA1 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Core Size: 32-Bit Tri-Core
Data Converters: A/D 94x12b SAR, Sigma-Delta
Core Processor: TriCore™
EEPROM Size: 128K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 456K x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 292-LFBGA
Packaging: Tape & Reel (TR)
Number of I/O: 169
Part Status: Active
Supplier Device Package: PG-LFBGA-292-6
Peripherals: DMA, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 2.97V ~ 5.5V
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TC377TP96F300SAALXUMA1 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 1.1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 6MB FLASH 292LFBGA
Packaging: Tape & Reel (TR)
Package / Case: 292-LFBGA
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 1.1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LFBGA-292-6
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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| IGP01N120H2XKSA1036 |
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Hersteller: Infineon Technologies
Description: IGP01N120 - DISCRETE IGBT WITHOU
Description: IGP01N120 - DISCRETE IGBT WITHOU
Produkt ist nicht verfügbar
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| DD500S33HE3BPSA1 |
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Hersteller: Infineon Technologies
Description: DIODE MODULE GP 3300V AGIHVB1303
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Supplier Device Package: AG-IHVB130-3
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 3300 V
Voltage - Forward (Vf) (Max) @ If: 3.85 V @ 500 A
Description: DIODE MODULE GP 3300V AGIHVB1303
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 2 Independent
Supplier Device Package: AG-IHVB130-3
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 3300 V
Voltage - Forward (Vf) (Max) @ If: 3.85 V @ 500 A
auf Bestellung 65 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 1973.83 EUR |
| CY8C4025LQI-S402 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 32QFN
Packaging: Tray
Package / Case: 32-UFQFN Exposed Pad
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 32-QFN (5x5)
Part Status: Active
Number of I/O: 27
DigiKey Programmable: Not Verified
auf Bestellung 4842 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.32 EUR |
| 10+ | 3.21 EUR |
| 25+ | 2.93 EUR |
| 100+ | 2.63 EUR |
| 490+ | 2.39 EUR |
| 980+ | 2.32 EUR |
| 1470+ | 2.28 EUR |
| 2940+ | 2.24 EUR |
| CY8C4025AZI-S403 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 32KB FLASH 48TQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 4K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0+
Data Converters: A/D 1x10b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, IrDA, LINbus, Microwire, SmartCard, SPI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, CapSense, LCD, LVD, POR, PWM, WDT
Supplier Device Package: 48-TQFP (7x7)
Part Status: Active
Number of I/O: 36
DigiKey Programmable: Not Verified
auf Bestellung 427 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5+ | 4.8 EUR |
| 10+ | 3.57 EUR |
| 25+ | 3.26 EUR |
| 100+ | 2.93 EUR |
| 250+ | 2.77 EUR |
| TLE9012DQUDTRBMS2TOBO1 |
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Hersteller: Infineon Technologies
Description: EVAL BOARD FOR TLE9012DQU
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: TLE9012DQU
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 4.75V ~ 60V Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Description: EVAL BOARD FOR TLE9012DQU
Packaging: Bulk
Function: Battery Monitor
Type: Power Management
Contents: Board(s), Cable(s)
Utilized IC / Part: TLE9012DQU
Supplied Contents: Board(s), Cable(s)
Primary Attributes: 4.75V ~ 60V Supply
Secondary Attributes: On-Board LEDs
Embedded: Yes, MCU, 32-Bit
Part Status: Active
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 455.51 EUR |
| 10+ | 454.46 EUR |
| T600N95TOFXPSA1 |
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Hersteller: Infineon Technologies
Description: SCR MODULE 9.5KV 930A TO-200AC
Packaging: Tray
Package / Case: TO-200AC
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 350 mA
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 12800A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 830 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 930 A
Voltage - Off State: 9.5 kV
Description: SCR MODULE 9.5KV 930A TO-200AC
Packaging: Tray
Package / Case: TO-200AC
Mounting Type: Clamp On
Operating Temperature: -40°C ~ 125°C
Structure: Single
Current - Hold (Ih) (Max): 350 mA
Current - Gate Trigger (Igt) (Max): 350 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 12800A @ 50Hz
Number of SCRs, Diodes: 1 SCR
Current - On State (It (AV)) (Max): 830 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Current - On State (It (RMS)) (Max): 930 A
Voltage - Off State: 9.5 kV
Produkt ist nicht verfügbar
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| PEB20256EV2.1-G |
Hersteller: Infineon Technologies
Description: MUNICH256 MULTI CHANNEL NETWORK
Description: MUNICH256 MULTI CHANNEL NETWORK
auf Bestellung 432 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 278.53 EUR |
| CHL8104-09CRT |
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Hersteller: Infineon Technologies
Description: IC REG BUCK 40VQFN
Description: IC REG BUCK 40VQFN
Produkt ist nicht verfügbar
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| CHL8212-03CRT |
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Hersteller: Infineon Technologies
Description: IC REG BUCK 28VQFN
Number of Outputs: 3
Part Status: Obsolete
Clock Sync: No
Output Phases: 2
Serial Interfaces: I²C
Control Features: Enable
Synchronous Rectifier: No
Supplier Device Package: PG-VQFN-28-902
Voltage - Supply (Vcc/Vdd): 3.3V
Topology: Buck
Frequency - Switching: 200kHz ~ 1.2MHz
Output Configuration: Positive
Operating Temperature: 0°C ~ 85°C
Function: Step-Down
Mounting Type: Surface Mount
Output Type: PWM
Package / Case: 28-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Description: IC REG BUCK 28VQFN
Number of Outputs: 3
Part Status: Obsolete
Clock Sync: No
Output Phases: 2
Serial Interfaces: I²C
Control Features: Enable
Synchronous Rectifier: No
Supplier Device Package: PG-VQFN-28-902
Voltage - Supply (Vcc/Vdd): 3.3V
Topology: Buck
Frequency - Switching: 200kHz ~ 1.2MHz
Output Configuration: Positive
Operating Temperature: 0°C ~ 85°C
Function: Step-Down
Mounting Type: Surface Mount
Output Type: PWM
Package / Case: 28-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| TC365DP64F300WAAKXUMA1 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| TC365DP64F300WAAKXUMA1 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
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| TC365DP64F300WAALXUMA1 |
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Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT 4MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 4MB (4M x 8)
RAM Size: 672K x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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| XDPE14284AXUMA1 |
Hersteller: Infineon Technologies
Description: IFX PRIMARION CNTRLLER PG-VQFN-4
Description: IFX PRIMARION CNTRLLER PG-VQFN-4
Produkt ist nicht verfügbar
Mindestbestellmenge: 4000 Stücke
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| KP200XTMA2 |
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Hersteller: Infineon Technologies
Description: SENSOR 15.95PSIA DSOF8
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: SPI
Mounting Type: Surface Mount
Operating Pressure: 7.77PSI ~ 15.95PSI (53.6kPa ~ 110kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.5V ~ 11V
Applications: Board Mount
Supplier Device Package: PG-DSOF-8-16
Port Style: No Port
Grade: Automotive
Qualification: AEC-Q100
Description: SENSOR 15.95PSIA DSOF8
Packaging: Tape & Reel (TR)
Package / Case: 8-SMD Module
Output Type: SPI
Mounting Type: Surface Mount
Operating Pressure: 7.77PSI ~ 15.95PSI (53.6kPa ~ 110kPa)
Pressure Type: Absolute
Operating Temperature: -40°C ~ 85°C
Termination Style: SMD (SMT) Tab
Voltage - Supply: 4.5V ~ 11V
Applications: Board Mount
Supplier Device Package: PG-DSOF-8-16
Port Style: No Port
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
Mindestbestellmenge: 1500 Stücke
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| BBY51-03W |
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Hersteller: Infineon Technologies
Description: VARIABLE CAPACITANCE DIODE
Description: VARIABLE CAPACITANCE DIODE
Produkt ist nicht verfügbar
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| BBY 51-02W E6327 |
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Hersteller: Infineon Technologies
Description: DIODE TUNING 7V 20MA SCD-80
Capacitance Ratio: 2.2
Voltage - Peak Reverse (Max): 7 V
Supplier Device Package: SCD-80
Capacitance Ratio Condition: C1/C4
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-80
Packaging: Tape & Reel (TR)
Description: DIODE TUNING 7V 20MA SCD-80
Capacitance Ratio: 2.2
Voltage - Peak Reverse (Max): 7 V
Supplier Device Package: SCD-80
Capacitance Ratio Condition: C1/C4
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SC-80
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 15000 Stücke
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| BBY 51-02L E6327 |
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Hersteller: Infineon Technologies
Description: DIODE TUNING 7V 20MA TSLP-2
Capacitance Ratio: 2.2
Voltage - Peak Reverse (Max): 7 V
Supplier Device Package: PG-TSLP-2-1
Capacitance Ratio Condition: C1/C4
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Description: DIODE TUNING 7V 20MA TSLP-2
Capacitance Ratio: 2.2
Voltage - Peak Reverse (Max): 7 V
Supplier Device Package: PG-TSLP-2-1
Capacitance Ratio Condition: C1/C4
Capacitance @ Vr, F: 3.7pF @ 4V, 1MHz
Operating Temperature: -55°C ~ 125°C (TJ)
Diode Type: Single
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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| ESD18VU1B-02LSE6327 |
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Hersteller: Infineon Technologies
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Power Line Protection: No
Voltage - Clamping (Max) @ Ipp: 17V (Typ)
Voltage - Breakdown (Min): 20V
Bidirectional Channels: 1
Supplier Device Package: PG-TSLP-2-17
Voltage - Reverse Standoff (Typ): 18.5V (Max)
Current - Peak Pulse (10/1000µs): 2A (8/20µs)
Capacitance @ Frequency: 0.3pF @ 1MHz
Applications: RF Antenna
Operating Temperature: -40°C ~ 85°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Bulk
Description: TRANS VOLTAGE SUPPRESSOR DIODE
Power Line Protection: No
Voltage - Clamping (Max) @ Ipp: 17V (Typ)
Voltage - Breakdown (Min): 20V
Bidirectional Channels: 1
Supplier Device Package: PG-TSLP-2-17
Voltage - Reverse Standoff (Typ): 18.5V (Max)
Current - Peak Pulse (10/1000µs): 2A (8/20µs)
Capacitance @ Frequency: 0.3pF @ 1MHz
Applications: RF Antenna
Operating Temperature: -40°C ~ 85°C (TA)
Type: Zener
Mounting Type: Surface Mount
Package / Case: SOD-882
Packaging: Bulk
auf Bestellung 13300 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 5189+ | 0.13 EUR |
| FP150R12N3T7PB11BPSA1 |
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Hersteller: Infineon Technologies
Description: LOW POWER ECONO
Input Capacitance (Cies) @ Vce: 30.1 nF @ 25 V
Current - Collector Cutoff (Max): 12 µA
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 150 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: AG-ECONO3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 150A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Three Phase Inverter with Brake
Input: Three Phase Bridge Rectifier
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Description: LOW POWER ECONO
Input Capacitance (Cies) @ Vce: 30.1 nF @ 25 V
Current - Collector Cutoff (Max): 12 µA
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 150 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: AG-ECONO3
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 150A
Operating Temperature: -40°C ~ 175°C (TJ)
Configuration: Three Phase Inverter with Brake
Input: Three Phase Bridge Rectifier
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
auf Bestellung 6 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 401.22 EUR |
| IPT008N06NM5LFATMA1 |
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Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V PG-HSOF-8
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 454A (Tc)
Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 250µA
Supplier Device Package: PG-HSOF-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V
Description: TRENCH 40<-<100V PG-HSOF-8
Packaging: Tape & Reel (TR)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 454A (Tc)
Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 250µA
Supplier Device Package: PG-HSOF-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2000+ | 4.51 EUR |
| IPT008N06NM5LFATMA1 |
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Hersteller: Infineon Technologies
Description: TRENCH 40<-<100V PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 454A (Tc)
Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 250µA
Supplier Device Package: PG-HSOF-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V
Description: TRENCH 40<-<100V PG-HSOF-8
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 454A (Tc)
Rds On (Max) @ Id, Vgs: 0.8mOhm @ 150A, 10V
Power Dissipation (Max): 278W (Tc)
Vgs(th) (Max) @ Id: 3.6V @ 250µA
Supplier Device Package: PG-HSOF-8
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 185 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 980 pF @ 30 V
auf Bestellung 6287 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 12.17 EUR |
| 10+ | 8.18 EUR |
| 50+ | 6.46 EUR |
| 100+ | 5.91 EUR |
| 500+ | 5.52 EUR |
| FS03MR12A6MA1B |
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Hersteller: Infineon Technologies
Description: HYBRID PACK DRIVE SIC AG-HYBRIDD
Description: HYBRID PACK DRIVE SIC AG-HYBRIDD
Produkt ist nicht verfügbar
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| DDB6U134N16RRB11BPSA2 |
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Hersteller: Infineon Technologies
Description: LOW POWER ECONO AG-ECONO2B-211
Packaging: Tray
Current - Collector (Ic) (Max): 125 A
Part Status: Active
Supplier Device Package: AG-ECONO2B
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.6V @ 15V, 75A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Single Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Input Capacitance (Cies) @ Vce: 5.1 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 400 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Description: LOW POWER ECONO AG-ECONO2B-211
Packaging: Tray
Current - Collector (Ic) (Max): 125 A
Part Status: Active
Supplier Device Package: AG-ECONO2B
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.6V @ 15V, 75A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Single Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Input Capacitance (Cies) @ Vce: 5.1 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 400 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 134.73 EUR |
| DF400R12KE3 |
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Hersteller: Infineon Technologies
Description: DFXR12H - IGBT MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 580 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 2000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Description: DFXR12H - IGBT MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 400A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 580 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 2000 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 28 nF @ 25 V
Produkt ist nicht verfügbar
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| FD300R06KE3HOSA1 |
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Hersteller: Infineon Technologies
Description: IGBT MOD 600V 400A 940W
Description: IGBT MOD 600V 400A 940W
auf Bestellung 35 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 205.04 EUR |
| FD300R06KE3HOSA1 |
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Hersteller: Infineon Technologies
Description: IGBT MOD 600V 400A 940W
Description: IGBT MOD 600V 400A 940W
Produkt ist nicht verfügbar
Mindestbestellmenge: 10 Stücke
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| FP75R12N3T7B11BPSA1 |
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Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 75A AG-ECONO3
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO3
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 75 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 13 µA
Input Capacitance (Cies) @ Vce: 15.1 nF @ 25 V
Description: IGBT MODULE 1200V 75A AG-ECONO3
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Three Phase Bridge Rectifier
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 175°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.8V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO3
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 75 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 20 mW
Current - Collector Cutoff (Max): 13 µA
Input Capacitance (Cies) @ Vce: 15.1 nF @ 25 V
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 176.39 EUR |
| BTS70061EPZXUMA1 |
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Hersteller: Infineon Technologies
Description: PROFET PG-TSDSO-14
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 6V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 6.6mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 175°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 14-SOIC (0.154", 3.90mm Width) Exposed Pad
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Part Status: Active
Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: PG-TDSO-14-11
Ratio - Input:Output: 1:1
Current - Output (Max): 12.5A
Description: PROFET PG-TSDSO-14
Qualification: AEC-Q100
Grade: Automotive
Voltage - Supply (Vcc/Vdd): Not Required
Voltage - Load: 6V ~ 18V
Input Type: Non-Inverting
Rds On (Typ): 6.6mOhm
Output Configuration: High Side
Operating Temperature: -40°C ~ 175°C (TJ)
Switch Type: General Purpose
Interface: On/Off
Number of Outputs: 1
Mounting Type: Surface Mount
Output Type: N-Channel
Package / Case: 14-SOIC (0.154", 3.90mm Width) Exposed Pad
Features: Slew Rate Controlled
Packaging: Tape & Reel (TR)
Part Status: Active
Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit
Supplier Device Package: PG-TDSO-14-11
Ratio - Input:Output: 1:1
Current - Output (Max): 12.5A
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| BTS70061EPZXUMA1 |
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Hersteller: Infineon Technologies
Description: PROFET PG-TSDSO-14
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 175°C (TJ)
Output Configuration: High Side
Rds On (Typ): 6.6mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 18V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 12.5A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TDSO-14-11
Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
Description: PROFET PG-TSDSO-14
Features: Slew Rate Controlled
Packaging: Cut Tape (CT)
Package / Case: 14-SOIC (0.154", 3.90mm Width) Exposed Pad
Output Type: N-Channel
Mounting Type: Surface Mount
Number of Outputs: 1
Interface: On/Off
Switch Type: General Purpose
Operating Temperature: -40°C ~ 175°C (TJ)
Output Configuration: High Side
Rds On (Typ): 6.6mOhm
Input Type: Non-Inverting
Voltage - Load: 6V ~ 18V
Voltage - Supply (Vcc/Vdd): Not Required
Current - Output (Max): 12.5A
Ratio - Input:Output: 1:1
Supplier Device Package: PG-TDSO-14-11
Fault Protection: Over Current, Over Temperature, Over Voltage, Short Circuit
Grade: Automotive
Part Status: Active
Qualification: AEC-Q100
auf Bestellung 1281 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.77 EUR |
| 10+ | 2.78 EUR |
| 25+ | 2.53 EUR |
| 100+ | 2.26 EUR |
| 250+ | 2.13 EUR |
| 500+ | 2.06 EUR |
| TLE9250XSJXUMA1 |
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Hersteller: Infineon Technologies
Description: IC TRANSCEIVER 1/1 PGDSO8
Part Status: Not For New Designs
Receiver Hysteresis: 100 mV
Supplier Device Package: PG-DSO-8
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
Description: IC TRANSCEIVER 1/1 PGDSO8
Part Status: Not For New Designs
Receiver Hysteresis: 100 mV
Supplier Device Package: PG-DSO-8
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
Qualification: AEC-Q100
Grade: Automotive
auf Bestellung 10000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2500+ | 1.44 EUR |
| 5000+ | 1.4 EUR |
| 7500+ | 1.39 EUR |
| TLE9250XSJXUMA1 |
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Hersteller: Infineon Technologies
Description: IC TRANSCEIVER 1/1 PGDSO8
Packaging: Cut Tape (CT)
Part Status: Not For New Designs
Receiver Hysteresis: 100 mV
Supplier Device Package: PG-DSO-8
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Qualification: AEC-Q100
Grade: Automotive
Description: IC TRANSCEIVER 1/1 PGDSO8
Packaging: Cut Tape (CT)
Part Status: Not For New Designs
Receiver Hysteresis: 100 mV
Supplier Device Package: PG-DSO-8
Protocol: CANbus
Data Rate: 5Mbps
Number of Drivers/Receivers: 1/1
Voltage - Supply: 4.5V ~ 5.5V
Operating Temperature: -40°C ~ 150°C (TJ)
Type: Transceiver
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Qualification: AEC-Q100
Grade: Automotive
auf Bestellung 12095 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 8+ | 2.89 EUR |
| 10+ | 2.12 EUR |
| 25+ | 1.92 EUR |
| 100+ | 1.7 EUR |
| 250+ | 1.61 EUR |
| 500+ | 1.55 EUR |
| 1000+ | 1.5 EUR |
| STT1400N16P55XPSA1 |
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Hersteller: Infineon Technologies
Description: SCR MODULE 1.6KV MODULE
Voltage - Off State: 1.6 kV
Voltage - Gate Trigger (Vgt) (Max): 2 V
Number of SCRs, Diodes: 2 SCRs
Current - Non Rep. Surge 50, 60Hz (Itsm): 10500A @ 50Hz
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Hold (Ih) (Max): 300 mA
Structure: 1-Phase Controller - All SCRs
Operating Temperature: 125°C (TJ)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Description: SCR MODULE 1.6KV MODULE
Voltage - Off State: 1.6 kV
Voltage - Gate Trigger (Vgt) (Max): 2 V
Number of SCRs, Diodes: 2 SCRs
Current - Non Rep. Surge 50, 60Hz (Itsm): 10500A @ 50Hz
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Hold (Ih) (Max): 300 mA
Structure: 1-Phase Controller - All SCRs
Operating Temperature: 125°C (TJ)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
Im Einkaufswagen
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| S71VS064RB0AHT4L3 |
Hersteller: Infineon Technologies
Description: IC FLASH RAM 64MIT PAR 52VFRBGA
Packaging: Tape & Reel (TR)
Package / Case: 52-VFBGA
Mounting Type: Surface Mount
Memory Size: 64Mbit (FLASH), 64Mbit (RAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH, PSRAM
Clock Frequency: 108 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 52-VFRBGA (6x5)
Memory Interface: Parallel
DigiKey Programmable: Not Verified
Description: IC FLASH RAM 64MIT PAR 52VFRBGA
Packaging: Tape & Reel (TR)
Package / Case: 52-VFBGA
Mounting Type: Surface Mount
Memory Size: 64Mbit (FLASH), 64Mbit (RAM)
Memory Type: Non-Volatile, Volatile
Operating Temperature: -25°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.95V
Technology: FLASH, PSRAM
Clock Frequency: 108 MHz
Memory Format: FLASH, RAM
Supplier Device Package: 52-VFRBGA (6x5)
Memory Interface: Parallel
DigiKey Programmable: Not Verified
auf Bestellung 8000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 200+ | 6.25 EUR |
| AIKQ200N75CP2XKSA1 |
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Hersteller: Infineon Technologies
Description: IGBT TRENCH 750V 200A TO-247-3
Voltage - Collector Emitter Breakdown (Max): 750 V
Current - Collector (Ic) (Max): 200 A
Part Status: Active
Gate Charge: 1256 nC
Switching Energy: 15.3mJ (on), 7mJ (off)
Td (on/off) @ 25°C: 89ns/266ns
IGBT Type: Trench
Supplier Device Package: TO-247-3
Input Type: Standard
Operating Temperature: -40°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
Power - Max: 576 W
Current - Collector Pulsed (Icm): 600 A
Description: IGBT TRENCH 750V 200A TO-247-3
Voltage - Collector Emitter Breakdown (Max): 750 V
Current - Collector (Ic) (Max): 200 A
Part Status: Active
Gate Charge: 1256 nC
Switching Energy: 15.3mJ (on), 7mJ (off)
Td (on/off) @ 25°C: 89ns/266ns
IGBT Type: Trench
Supplier Device Package: TO-247-3
Input Type: Standard
Operating Temperature: -40°C ~ 175°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-247-3
Packaging: Tube
Power - Max: 576 W
Current - Collector Pulsed (Icm): 600 A
auf Bestellung 225 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 27.86 EUR |
| 30+ | 17.08 EUR |
| 120+ | 14.72 EUR |
| TLS412533VBOARDTOBO1 |
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Hersteller: Infineon Technologies
Description: TLS4125 3.3V BOARD
Main Purpose: DC/DC, Step Down
Supplied Contents: Board(s)
Utilized IC / Part: TLS4125D0EPV33
Board Type: Fully Populated
Regulator Topology: Buck
Current - Output: 2.5A
Voltage - Input: 3.7V ~ 35V
Voltage - Output: 3.3V
Packaging: Bulk
Outputs and Type: 1, Non-Isolated
Description: TLS4125 3.3V BOARD
Main Purpose: DC/DC, Step Down
Supplied Contents: Board(s)
Utilized IC / Part: TLS4125D0EPV33
Board Type: Fully Populated
Regulator Topology: Buck
Current - Output: 2.5A
Voltage - Input: 3.7V ~ 35V
Voltage - Output: 3.3V
Packaging: Bulk
Outputs and Type: 1, Non-Isolated
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 103.46 EUR |
| TLS412033VBOARDTOBO1 |
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Hersteller: Infineon Technologies
Description: EVAL BOARD FOR TLS4120D0EPV33
Packaging: Bulk
Voltage - Output: 3.3V
Voltage - Input: 3.7V ~ 35V
Current - Output: 2A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: TLS4120D0EPV33
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Contents: Board(s)
Description: EVAL BOARD FOR TLS4120D0EPV33
Packaging: Bulk
Voltage - Output: 3.3V
Voltage - Input: 3.7V ~ 35V
Current - Output: 2A
Regulator Topology: Buck
Board Type: Fully Populated
Utilized IC / Part: TLS4120D0EPV33
Supplied Contents: Board(s)
Main Purpose: DC/DC, Step Down
Outputs and Type: 1 Non-Isolated Output
Part Status: Active
Contents: Board(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 124.39 EUR |
| IRFS4410PBF-INF |
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Hersteller: Infineon Technologies
Description: HEXFET POWER MOSFET
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 88A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 58A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 4V @ 150µA
Supplier Device Package: PG-TO263-3-2
Part Status: Active
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 180 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5150 pF @ 50 V
Description: HEXFET POWER MOSFET
Packaging: Bulk
Package / Case: TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 88A (Tc)
Rds On (Max) @ Id, Vgs: 10mOhm @ 58A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 4V @ 150µA
Supplier Device Package: PG-TO263-3-2
Part Status: Active
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 180 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 5150 pF @ 50 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| SAF-XC836T-2FRIAB |
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Hersteller: Infineon Technologies
Description: XC800 I-FAMILY MICROCONTROLLER ,
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V
Connectivity: I2C, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-1
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Description: XC800 I-FAMILY MICROCONTROLLER ,
Packaging: Bulk
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 24MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V
Connectivity: I2C, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-1
Part Status: Active
Number of I/O: 25
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| XC8362FRAABFXUMA1 |
Hersteller: Infineon Technologies
Description: IC MCU
Packaging: Bulk
DigiKey Programmable: Not Verified
Description: IC MCU
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| BAT1504WH2110XTSA1 |
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Hersteller: Infineon Technologies
Description: DIODE SCHOTTKY 4V 100MW SOT3233
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: Schottky - 1 Pair Series Connection
Operating Temperature: 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 0V, 1MHz
Resistance @ If, F: 5.8Ohm @ 50mA, 1MHz
Voltage - Peak Reverse (Max): 4V
Supplier Device Package: PG-SOT323-3
Part Status: Active
Current - Max: 110 mA
Power Dissipation (Max): 100 mW
Description: DIODE SCHOTTKY 4V 100MW SOT3233
Packaging: Tape & Reel (TR)
Package / Case: SC-70, SOT-323
Diode Type: Schottky - 1 Pair Series Connection
Operating Temperature: 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 0V, 1MHz
Resistance @ If, F: 5.8Ohm @ 50mA, 1MHz
Voltage - Peak Reverse (Max): 4V
Supplier Device Package: PG-SOT323-3
Part Status: Active
Current - Max: 110 mA
Power Dissipation (Max): 100 mW
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3000+ | 0.4 EUR |
| BAT1504WH2110XTSA1 |
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Hersteller: Infineon Technologies
Description: DIODE SCHOTTKY 4V 100MW SOT3233
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: Schottky - 1 Pair Series Connection
Operating Temperature: 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 0V, 1MHz
Resistance @ If, F: 5.8Ohm @ 50mA, 1MHz
Voltage - Peak Reverse (Max): 4V
Supplier Device Package: PG-SOT323-3
Part Status: Active
Current - Max: 110 mA
Power Dissipation (Max): 100 mW
Description: DIODE SCHOTTKY 4V 100MW SOT3233
Packaging: Cut Tape (CT)
Package / Case: SC-70, SOT-323
Diode Type: Schottky - 1 Pair Series Connection
Operating Temperature: 150°C (TJ)
Capacitance @ Vr, F: 0.35pF @ 0V, 1MHz
Resistance @ If, F: 5.8Ohm @ 50mA, 1MHz
Voltage - Peak Reverse (Max): 4V
Supplier Device Package: PG-SOT323-3
Part Status: Active
Current - Max: 110 mA
Power Dissipation (Max): 100 mW
auf Bestellung 12348 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 23+ | 0.94 EUR |
| 32+ | 0.65 EUR |
| 36+ | 0.58 EUR |
| 100+ | 0.51 EUR |
| 250+ | 0.48 EUR |
| 500+ | 0.45 EUR |
| 1000+ | 0.43 EUR |
| 6PS04012E4DG36022NOSA1 |
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Hersteller: Infineon Technologies
Description: MODULE IGBT
Packaging: Bulk
Package / Case: Module
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 85°C
Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 200A
NTC Thermistor: No
Part Status: Obsolete
Current - Collector (Ic) (Max): 306 A
Voltage - Collector Emitter Breakdown (Max): 3600 V
Description: MODULE IGBT
Packaging: Bulk
Package / Case: Module
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 85°C
Vce(on) (Max) @ Vge, Ic: 2.05V @ 15V, 200A
NTC Thermistor: No
Part Status: Obsolete
Current - Collector (Ic) (Max): 306 A
Voltage - Collector Emitter Breakdown (Max): 3600 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| F3L75R12W1H3BPSA1 |
auf Bestellung 24 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 65.56 EUR |
| 24+ | 44.38 EUR |
| DF400R07PE4R_B6 |
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Hersteller: Infineon Technologies
Description: IGBT MOD 650V 450A 1100W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.95V @ 15V, 400A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: NPT
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 1100 W
Current - Collector Cutoff (Max): 20 nA
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
Description: IGBT MOD 650V 450A 1100W
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.95V @ 15V, 400A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: NPT
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Power - Max: 1100 W
Current - Collector Cutoff (Max): 20 nA
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| 2PS06017E32G28213NOSA1 |
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Hersteller: Infineon Technologies
Description: IGBT MODULE 1100VDC 325A
Description: IGBT MODULE 1100VDC 325A
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH
| IMBG65R163M1HXTMA1 |
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Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET PG-TO263-
Packaging: Tape & Reel (TR)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 217mOhm @ 5.7A, 18V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 5.7V @ 1.7mA
Supplier Device Package: PG-TO263-7-12
Drive Voltage (Max Rds On, Min Rds On): 18V
Vgs (Max): +23V, -5V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 320 pF @ 400 V
Description: SILICON CARBIDE MOSFET PG-TO263-
Packaging: Tape & Reel (TR)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 217mOhm @ 5.7A, 18V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 5.7V @ 1.7mA
Supplier Device Package: PG-TO263-7-12
Drive Voltage (Max Rds On, Min Rds On): 18V
Vgs (Max): +23V, -5V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 320 pF @ 400 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
Im Einkaufswagen
Stück im Wert von UAH
| IMBG65R163M1HXTMA1 |
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Hersteller: Infineon Technologies
Description: SILICON CARBIDE MOSFET PG-TO263-
Packaging: Cut Tape (CT)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 217mOhm @ 5.7A, 18V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 5.7V @ 1.7mA
Supplier Device Package: PG-TO263-7-12
Drive Voltage (Max Rds On, Min Rds On): 18V
Vgs (Max): +23V, -5V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 320 pF @ 400 V
Description: SILICON CARBIDE MOSFET PG-TO263-
Packaging: Cut Tape (CT)
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: SiCFET (Silicon Carbide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 17A (Tc)
Rds On (Max) @ Id, Vgs: 217mOhm @ 5.7A, 18V
Power Dissipation (Max): 85W (Tc)
Vgs(th) (Max) @ Id: 5.7V @ 1.7mA
Supplier Device Package: PG-TO263-7-12
Drive Voltage (Max Rds On, Min Rds On): 18V
Vgs (Max): +23V, -5V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 10 nC @ 18 V
Input Capacitance (Ciss) (Max) @ Vds: 320 pF @ 400 V
auf Bestellung 33 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.83 EUR |
| 10+ | 7.24 EUR |
| IRFP4110PBFXKMA1 |
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Hersteller: Infineon Technologies
Description: TRENCH >=100V PG-TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 75A, 10V
Power Dissipation (Max): 370W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-247AC
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 210 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9620 pF @ 50 V
Description: TRENCH >=100V PG-TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 180A (Tc)
Rds On (Max) @ Id, Vgs: 4.5mOhm @ 75A, 10V
Power Dissipation (Max): 370W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-247AC
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 210 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 9620 pF @ 50 V
auf Bestellung 1897 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 10.58 EUR |
| 25+ | 6.1 EUR |
| 50+ | 5.52 EUR |
| 100+ | 5.03 EUR |
| 500+ | 4.18 EUR |
| IRFP4468PBFXKMA1 |
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Hersteller: Infineon Technologies
Description: MOSFET N-CH 100V 195A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Ta), 195A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 180A, 10V
Power Dissipation (Max): 3.8W (Ta), 517W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1A
Supplier Device Package: TO-247AC
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 540 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 29000 pF @ 50 V
Description: MOSFET N-CH 100V 195A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 25A (Ta), 195A (Tc)
Rds On (Max) @ Id, Vgs: 2.6mOhm @ 180A, 10V
Power Dissipation (Max): 3.8W (Ta), 517W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1A
Supplier Device Package: TO-247AC
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 100 V
Gate Charge (Qg) (Max) @ Vgs: 540 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 29000 pF @ 50 V
auf Bestellung 886 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 13.89 EUR |
| 25+ | 8.2 EUR |
| 50+ | 7.47 EUR |
| 100+ | 6.84 EUR |
| 500+ | 5.76 EUR |































