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CY2305CSXC-1T CY2305CSXC-1T Infineon Technologies Infineon-CY2305C_CY2309C_3.3_V_Zero_Delay_Clock_Buffer-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec649ec3c6d&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FANOUT BUFFER 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 133.33MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: Clock
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:5
Differential - Input:Output: No/No
Supplier Device Package: 8-SOIC
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
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IKWH100N65EH7XKSA1 IKWH100N65EH7XKSA1 Infineon Technologies Infineon-IKWH100N65EH7-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8900bb5701892508418a2054 Description: IGBT TRENCH FS 650V 140A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Supplier Device Package: PG-TO247-3-32
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 106 ns
Vce(on) (Max) @ Vge, Ic: 1.65V @ 15V, 100A
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 32ns/240ns
Switching Energy: 3.58mJ (on), 2.37mJ (off)
Test Condition: 400V, 100A, 10Ohm, 15V
Gate Charge: 199 nC
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 400 A
Power - Max: 427 W
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CY7C1312KV18-250BZCT CY7C1312KV18-250BZCT Infineon Technologies download Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
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CY7C1312KV18-300BZXIT Infineon Technologies Infineon-CY7C1312KV18_CY7C1314KV18_18-Mbit_QDR(R)_II_SRAM_Two-Word_Burst_Architecture-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1cfce36ab Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Dual Port, Synchronous
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Access Time: 0.45 ns
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
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CY7C1312KV18-300BZXCT CY7C1312KV18-300BZXCT Infineon Technologies download Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
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TLE4986CXASM47HAMA1 TLE4986CXASM47HAMA1 Infineon Technologies Infineon-TLE4986C-XAS-M47-DS-v01_10-EN.pdf?fileId=5546d4625d5945ed015dadb1296e242a Description: MAG SWITCH SPEED SENSOR 3SSO
Packaging: Cut Tape (CT)
Package / Case: 3-SIP Module
Output Type: Open Drain
Polarization: North Pole, South Pole
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 175°C
Technology: Hall Effect
Current - Output (Max): 20mA
Supplier Device Package: PG-SSO-3-52
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TLE4986CXASM47HAMA1 TLE4986CXASM47HAMA1 Infineon Technologies Infineon-TLE4986C-XAS-M47-DS-v01_10-EN.pdf?fileId=5546d4625d5945ed015dadb1296e242a Description: MAG SWITCH SPEED SENSOR 3SSO
Packaging: Tape & Box (TB)
Package / Case: 3-SIP Module
Output Type: Open Drain
Polarization: North Pole, South Pole
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 175°C
Technology: Hall Effect
Current - Output (Max): 20mA
Supplier Device Package: PG-SSO-3-52
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TLE4986CXTSM47HAMA1 Infineon Technologies Infineon-TLE4986C-XTS-M47-DS-v01_10-EN.pdf?fileId=5546d4625d5945ed015dadb1228e2428 Description: MAG SWITCH SPEED SENSOR 3SSO
Packaging: Tape & Box (TB)
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IRSM005-301MH IRSM005-301MH Infineon Technologies irsm005-301mh.pdf?fileId=5546d462533600a40153567bbfdf2860 Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Tray
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
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IPD90N06S405ATMA2 IPD90N06S405ATMA2 Infineon Technologies INFNS14108-1.pdf?t.download=true&u=5oefqw Description: MOSFET N-CH 60V 90A TO252-31
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.1mOhm @ 90A, 10V
Power Dissipation (Max): 107W (Tc)
Vgs(th) (Max) @ Id: 4V @ 60µA
Supplier Device Package: PG-TO252-3-11
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 81 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6500 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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IRFR6215PBF IRFR6215PBF Infineon Technologies irfr6215pbf.pdf?fileId=5546d462533600a40153563595592114 description Description: MOSFET P-CH 150V 13A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 13A (Tc)
Rds On (Max) @ Id, Vgs: 295mOhm @ 6.6A, 10V
Power Dissipation (Max): 110W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 150 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 860 pF @ 25 V
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XMC1202Q024X0016ABXUMA1 XMC1202Q024X0016ABXUMA1 Infineon Technologies XMC1200.pdf Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 13x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I²S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-8
Number of I/O: 18
DigiKey Programmable: Not Verified
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CYW4330GKWBGT Infineon Technologies BCM4330_RevE_Sep19,2016.pdf Description: IC RF TXRX+MCU BLUETOOTH
Packaging: Tape & Reel (TR)
Package / Case: 225-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.3V ~ 4.8V
Power - Output: 12dBm
Protocol: 802.11a/b/g/n, Bluetooth v4.0
Current - Receiving: 52mA ~ 60mA
Data Rate (Max): 72Mbps
Current - Transmitting: 300mA ~ 325mA
Supplier Device Package: 225-WLCSP (4.89x5.33)
GPIO: 7
Modulation: 4DQPSK, 8DPSK, GFSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I²S, JTAG, SPI, UART, USB
DigiKey Programmable: Not Verified
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IRG4PC50SPBF IRG4PC50SPBF Infineon Technologies irg4pc50spbf.pdf?fileId=5546d462533600a4015356447adc22f0 description Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.36V @ 15V, 41A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 33ns/650ns
Switching Energy: 720µJ (on), 8.27mJ (off)
Test Condition: 480V, 41A, 5Ohm, 15V
Gate Charge: 180 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 140 A
Power - Max: 200 W
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IRG4PC50FPBF IRG4PC50FPBF Infineon Technologies irg4pc50fpbf.pdf?fileId=5546d462533600a401535644598722e8 description Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 39A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 31ns/240ns
Switching Energy: 370µJ (on), 2.1mJ (off)
Test Condition: 480V, 39A, 5Ohm, 15V
Gate Charge: 190 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 280 A
Power - Max: 200 W
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irg4pc50uPBF irg4pc50uPBF Infineon Technologies irg4pc50upbf.pdf?fileId=5546d462533600a401535647c56222f9 description Description: IGBT 600V 55A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 27A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 32ns/170ns
Switching Energy: 120µJ (on), 540µJ (off)
Test Condition: 480V, 27A, 5Ohm, 15V
Gate Charge: 180 nC
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 220 A
Power - Max: 200 W
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IRG4PC50FDPBF IRG4PC50FDPBF Infineon Technologies IRG4PC50FD.pdf Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 50 ns
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 39A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 55ns/240ns
Switching Energy: 1.5mJ (on), 2.4mJ (off)
Test Condition: 480V, 39A, 5Ohm, 15V
Gate Charge: 190 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 280 A
Power - Max: 200 W
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IRG4PC50FD-EPBF IRG4PC50FD-EPBF Infineon Technologies fundamentals-of-power-semiconductors Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 50 ns
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 39A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 55ns/240ns
Switching Energy: 1.5mJ (on), 2.4mJ (off)
Test Condition: 480V, 39A, 5Ohm, 15V
Gate Charge: 190 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 280 A
Power - Max: 200 W
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IRG4PC50F-EPBF IRG4PC50F-EPBF Infineon Technologies fundamentals-of-power-semiconductors Description: IGBT 600V 70A TO-247AD
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 39A
Supplier Device Package: TO-247AD
Td (on/off) @ 25°C: 31ns/240ns
Switching Energy: 370µJ (on), 2.1mJ (off)
Test Condition: 480V, 39A, 5Ohm, 15V
Gate Charge: 190 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 280 A
Power - Max: 200 W
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IRG4PC50SDPBF IRG4PC50SDPBF Infineon Technologies irg4pc50sdpbf.pdf?fileId=5546d462533600a401535644729d22ee Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 50 ns
Vce(on) (Max) @ Vge, Ic: 1.36V @ 15V, 41A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 33ns/650ns
Switching Energy: 720µJ (on), 8.27mJ (off)
Test Condition: 480V, 41A, 5Ohm, 15V
Gate Charge: 180 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 140 A
Power - Max: 200 W
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CYUSB3ACC-002 CYUSB3ACC-002 Infineon Technologies download Description: XILINX FMC TO EZ-USB FX3 BOARD
Packaging: Bulk
For Use With/Related Products: EZ-USB® FX3™
Accessory Type: Interface Board
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MB95F474KPMC1-G-SNE2 Infineon Technologies MB95410H_470H_Series_RevA_4-4-16.pdf Description: IC MCU 8BIT 20KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 20KB (20K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 8x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 59
DigiKey Programmable: Not Verified
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MB95F474KPMC2-G-SNE2 Infineon Technologies MB95410H_470H_Series_RevA_4-4-16.pdf Description: IC MCU 8BIT 20KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 20KB (20K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 8x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (12x12)
Number of I/O: 59
DigiKey Programmable: Not Verified
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FB20R06W1E3B11HOMA1 Infineon Technologies Infineon-FB20R06W1E3_B11-DS-v03_00-en_de.pdf?fileId=db3a30433ba77ced013bae8cad193ad7 Description: IGBT MODULE 600V 29A 94W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 20A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 29 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 94 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.1 nF @ 25 V
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FS20R06VE3BOMA1 FS20R06VE3BOMA1 Infineon Technologies Infineon-FS20R06VE3-DS-v02_00-en_de.pdf?fileId=db3a304325afd6e0012655b43df85129 Description: IGBT MOD 600V 25A 71.5W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 20A
NTC Thermistor: No
Supplier Device Package: Module
Current - Collector (Ic) (Max): 25 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 71.5 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.1 nF @ 25 V
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FS20R06VE3B2BOMA1 FS20R06VE3B2BOMA1 Infineon Technologies Infineon-FS20R06VE3_B2-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b4347b16603d Description: IGBT MOD 600V 25A 71.5W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 20A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 25 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 71.5 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.14 nF @ 25 V
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DD230S26KHPSA1 DD230S26KHPSA1 Infineon Technologies DD230S.pdf Description: DIODE MODULE GP 2600V 261A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 261A
Supplier Device Package: Module
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 2600 V
Voltage - Forward (Vf) (Max) @ If: 1.74 V @ 800 A
Current - Reverse Leakage @ Vr: 160 mA @ 2600 V
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CY8C6247FDI-D02T CY8C6247FDI-D02T Infineon Technologies Infineon-CY8C62x6_CY8C62x7_PSoC_62_MCU_Arm_Cortex_-M4-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4c9386bff Description: IC MCU 32BIT 1MB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b, 16x12b SAR; D/A 2x7b, 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (3.68x3.19)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6247FDI-D02T CY8C6247FDI-D02T Infineon Technologies Infineon-CY8C62x6_CY8C62x7_PSoC_62_MCU_Arm_Cortex_-M4-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4c9386bff Description: IC MCU 32BIT 1MB FLASH 80WLCSP
Packaging: Cut Tape (CT)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b, 16x12b SAR; D/A 2x7b, 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (3.68x3.19)
Number of I/O: 62
DigiKey Programmable: Not Verified
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10+11.50 EUR
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100+9.78 EUR
250+9.35 EUR
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FD200R12KE3HOSA1 FD200R12KE3HOSA1 Infineon Technologies Infineon-FD200R12KE3-DS-v03_03-en_de.pdf?fileId=db3a304412b407950112b431aac45508 Description: IGBT MODULE 1200V 1050W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1050 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
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AUIRF4905 AUIRF4905 Infineon Technologies auirf4905.pdf?fileId=5546d462533600a4015355acc8c413be Description: MOSFET P-CH 55V 74A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 74A (Tc)
Rds On (Max) @ Id, Vgs: 20mOhm @ 38A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 180 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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S29GL128S10DHB023 S29GL128S10DHB023 Infineon Technologies Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5 Description: IC FLASH 128MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
auf Bestellung 2200 Stücke:
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S29GL128S10DHB023 S29GL128S10DHB023 Infineon Technologies Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5 Description: IC FLASH 128MBIT PARALLEL 64FBGA
Packaging: Cut Tape (CT)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
auf Bestellung 4300 Stücke:
Lieferzeit 10-14 Tag (e)
2+11.05 EUR
10+9.82 EUR
25+9.37 EUR
50+9.04 EUR
100+8.72 EUR
250+8.31 EUR
500+8.02 EUR
1000+7.73 EUR
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IRG4PF50WPBF IRG4PF50WPBF Infineon Technologies irg4pf50wpbf.pdf?fileId=5546d462533600a401535647f7e32307 Description: IGBT 900V 51A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.7V @ 15V, 28A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 29ns/110ns
Switching Energy: 190µJ (on), 1.06mJ (off)
Test Condition: 720V, 28A, 5Ohm, 15V
Gate Charge: 160 nC
Current - Collector (Ic) (Max): 51 A
Voltage - Collector Emitter Breakdown (Max): 900 V
Current - Collector Pulsed (Icm): 204 A
Power - Max: 200 W
Produkt ist nicht verfügbar
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SAK-XC824M-1FGIAA SAK-XC824M-1FGIAA Infineon Technologies INFNS19723-1.pdf?t.download=true&u=5oefqw Description: 8051 COMPATIBLE 8-BIT MCU
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 25.6MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V
Connectivity: I²C, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: PG-DSO-20-45
Number of I/O: 17
DigiKey Programmable: Not Verified
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SAF-XC87816FFI5VACFXUMA1 SAF-XC87816FFI5VACFXUMA1 Infineon Technologies INFNS15609-1.pdf?t.download=true&u=5oefqw Description: XC800 I-FAMILY MICROCONTROLLER ,
Packaging: Bulk
DigiKey Programmable: Not Verified
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XC8662FRIBEFXUMA1 XC8662FRIBEFXUMA1 Infineon Technologies Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t Description: IC MCU 8BIT 8KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 19
DigiKey Programmable: Not Verified
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XC8664FRABEKXUMA1 XC8664FRABEKXUMA1 Infineon Technologies Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-4
Number of I/O: 19
DigiKey Programmable: Not Verified
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XC866L4FRABEKXUMA1 XC866L4FRABEKXUMA1 Infineon Technologies Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 19
DigiKey Programmable: Not Verified
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XC866L4FRA3VBEKXUMA1 XC866L4FRA3VBEKXUMA1 Infineon Technologies Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 27
DigiKey Programmable: Not Verified
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XC8664FRA5VBELXUMA1 XC8664FRA5VBELXUMA1 Infineon Technologies Infineon-SAL_XC866-DS-v01_01-cn.pdf?fileId=db3a30433004641301306564e09f0366 Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-4
Number of I/O: 27
DigiKey Programmable: Not Verified
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XC866L4FRA3VBELXUMA1 XC866L4FRA3VBELXUMA1 Infineon Technologies Infineon-SAL_XC866-DS-v01_01-cn.pdf?fileId=db3a30433004641301306564e09f0366 Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 27
DigiKey Programmable: Not Verified
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IRL3103PBF IRL3103PBF Infineon Technologies irl3103pbf.pdf?fileId=5546d462533600a40153565baf6b2514 description Description: MOSFET N-CH 30V 64A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 12mOhm @ 34A, 10V
Power Dissipation (Max): 94W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 33 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1650 pF @ 25 V
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IRL3103STRLPBF IRL3103STRLPBF Infineon Technologies irl3103spbf.pdf?fileId=5546d462533600a40153565bb8702516 Description: MOSFET N-CH 30V 64A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 12mOhm @ 34A, 10V
Power Dissipation (Max): 94W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 33 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1650 pF @ 25 V
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RJK5035DPP-E0#T2 Infineon Technologies Description: RJK5035DPPNSINGPOWMOSF501850MOTO
Packaging: Tube
Produkt ist nicht verfügbar
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AUIRFZ48ZS AUIRFZ48ZS Infineon Technologies auirfz48z.pdf?fileId=5546d462533600a4015355ba11e01510 Description: MOSFET N-CH 55V 61A D2PAK
Packaging: Tube
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 61A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 37A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 64 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1720 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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CY25404ZXI217T CY25404ZXI217T Infineon Technologies Infineon-CY25404_QUAD_PLL_PROGRAMMABLE_CLOCK_GENERATOR_WITH_SPREAD_SPECTRUM-AdditionalTechnicalInformation-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec65e4e3c93&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe Description: TSBU
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
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CY8C6316BZI-BLF03 CY8C6316BZI-BLF03 Infineon Technologies Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integra Description: IC MCU 32BIT 512KB FLASH 116BGA
Packaging: Tray
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Bluetooth, Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
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CY8C6337BZI-BLF13 CY8C6337BZI-BLF13 Infineon Technologies Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integra Description: IC MCU 32BIT 1MB FLASH 116BGA
Packaging: Tray
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
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CY8C6246BZI-D04 CY8C6246BZI-D04 Infineon Technologies Infineon-PSoC_6_MCU_CY8C62x6_CY8C62x7-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4c9386bff&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC MCU 32BIT 512KB FLASH 124BGA
Packaging: Tray
Package / Case: 124-VFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 124-VFBGA (9x9)
Number of I/O: 104
DigiKey Programmable: Not Verified
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IPB65R150CFDATMA1 IPB65R150CFDATMA1 Infineon Technologies Infineon-IPX65R150CFD-DS-v02_00-en.pdf?fileId=db3a3043338c8ac80133ace218433063 Description: MOSFET N-CH 650V 22.4A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22.4A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 9.3A, 10V
Power Dissipation (Max): 195.3W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 900µA
Supplier Device Package: PG-TO263-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 86 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 100 V
Produkt ist nicht verfügbar
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IPB65R150CFDAATMA1 IPB65R150CFDAATMA1 Infineon Technologies Infineon-IPX65R150CFDA-DS-v02_00-en.pdf?fileId=db3a3043399628450139af71b2a12046 Description: MOSFET N-CH 650V 22.4A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22.4A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 9.3A, 10V
Power Dissipation (Max): 195.3W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 900µA
Supplier Device Package: PG-TO263-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 86 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 100 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1000 Stücke:
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1000+3.43 EUR
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IPB65R150CFDAATMA1 IPB65R150CFDAATMA1 Infineon Technologies Infineon-IPX65R150CFDA-DS-v02_00-en.pdf?fileId=db3a3043399628450139af71b2a12046 Description: MOSFET N-CH 650V 22.4A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22.4A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 9.3A, 10V
Power Dissipation (Max): 195.3W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 900µA
Supplier Device Package: PG-TO263-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 86 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 100 V
Grade: Automotive
Qualification: AEC-Q101
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S29GL512S12DHIV10 S29GL512S12DHIV10 Infineon Technologies Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium=referral&utm_campai Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
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S29GL256S90DHSS10 S29GL256S90DHSS10 Infineon Technologies Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL256S90DHSS40 S29GL256S90DHSS40 Infineon Technologies Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1351G-133AXC CY7C1351G-133AXC Infineon Technologies Infineon-CY7C1351G_4-Mbit_(128_K_36)_Flow-through_SRAM_with_NoBL_Architecture-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec0f16b359c Description: IC SRAM 4.5MBIT PAR 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 4.5Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 133 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 6.5 ns
Memory Organization: 128K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITLGCAPBOM006TOBO1 KITLGCAPBOM006TOBO1 Infineon Technologies Infineon-UserManual_LVDSPD_low_voltage_drives_scalable_power_demonstration_board-UserManual-v02_00-EN.pdf?fileId=5546d462696dbf120169b58bda49538e Description: KIT_LGCAP_BOM006
Packaging: Bulk
For Use With/Related Products: XMC4400
Accessory Type: Interface Board
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S25HL01GTDPMHM013 S25HL01GTDPMHM013 Infineon Technologies en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24 Description: Nor
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IDD15E60BUMA1 IDD15E60BUMA1 Infineon Technologies Infineon-IDD15E60-DS-v02_04-EN.pdf?fileId=5546d4624ad04ef9014ade16efd87a9f Description: DIODE GP 600V 29.2A TO252-3
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 87 ns
Technology: Standard
Current - Average Rectified (Io): 29.2A
Supplier Device Package: PG-TO252-3
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
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CY2305CSXC-1T Infineon-CY2305C_CY2309C_3.3_V_Zero_Delay_Clock_Buffer-DataSheet-v18_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec649ec3c6d&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY2305CSXC-1T
Hersteller: Infineon Technologies
Description: IC FANOUT BUFFER 8SOIC
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Output: Clock
Frequency - Max: 133.33MHz
Type: Fanout Buffer (Distribution), Zero Delay Buffer
Input: Clock
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V ~ 3.6V
Ratio - Input:Output: 1:5
Differential - Input:Output: No/No
Supplier Device Package: 8-SOIC
PLL: Yes
Divider/Multiplier: No/No
Number of Circuits: 1
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IKWH100N65EH7XKSA1 Infineon-IKWH100N65EH7-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c8900bb5701892508418a2054
IKWH100N65EH7XKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 140A TO247-3
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Supplier Device Package: PG-TO247-3-32
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 106 ns
Vce(on) (Max) @ Vge, Ic: 1.65V @ 15V, 100A
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 32ns/240ns
Switching Energy: 3.58mJ (on), 2.37mJ (off)
Test Condition: 400V, 100A, 10Ohm, 15V
Gate Charge: 199 nC
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 400 A
Power - Max: 427 W
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2+16.37 EUR
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CY7C1312KV18-250BZCT download
CY7C1312KV18-250BZCT
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PAR 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 250 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1312KV18-300BZXIT Infineon-CY7C1312KV18_CY7C1314KV18_18-Mbit_QDR(R)_II_SRAM_Two-Word_Burst_Architecture-DataSheet-v12_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec1cfce36ab
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Dual Port, Synchronous
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Access Time: 0.45 ns
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1312KV18-300BZXCT download
CY7C1312KV18-300BZXCT
Hersteller: Infineon Technologies
Description: IC SRAM 18MBIT PARALLEL 165FBGA
Packaging: Tape & Reel (TR)
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 18Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II
Clock Frequency: 300 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 1M x 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TLE4986CXASM47HAMA1 Infineon-TLE4986C-XAS-M47-DS-v01_10-EN.pdf?fileId=5546d4625d5945ed015dadb1296e242a
TLE4986CXASM47HAMA1
Hersteller: Infineon Technologies
Description: MAG SWITCH SPEED SENSOR 3SSO
Packaging: Cut Tape (CT)
Package / Case: 3-SIP Module
Output Type: Open Drain
Polarization: North Pole, South Pole
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 175°C
Technology: Hall Effect
Current - Output (Max): 20mA
Supplier Device Package: PG-SSO-3-52
Produkt ist nicht verfügbar
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TLE4986CXASM47HAMA1 Infineon-TLE4986C-XAS-M47-DS-v01_10-EN.pdf?fileId=5546d4625d5945ed015dadb1296e242a
TLE4986CXASM47HAMA1
Hersteller: Infineon Technologies
Description: MAG SWITCH SPEED SENSOR 3SSO
Packaging: Tape & Box (TB)
Package / Case: 3-SIP Module
Output Type: Open Drain
Polarization: North Pole, South Pole
Mounting Type: Through Hole
Function: Special Purpose
Operating Temperature: -40°C ~ 175°C
Technology: Hall Effect
Current - Output (Max): 20mA
Supplier Device Package: PG-SSO-3-52
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1500+2.23 EUR
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TLE4986CXTSM47HAMA1 Infineon-TLE4986C-XTS-M47-DS-v01_10-EN.pdf?fileId=5546d4625d5945ed015dadb1228e2428
Hersteller: Infineon Technologies
Description: MAG SWITCH SPEED SENSOR 3SSO
Packaging: Tape & Box (TB)
Produkt ist nicht verfügbar
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IRSM005-301MH irsm005-301mh.pdf?fileId=5546d462533600a40153567bbfdf2860
IRSM005-301MH
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 30A 27QFN
Packaging: Tray
Features: Bootstrap Circuit
Package / Case: 27-PowerVQFN
Mounting Type: Surface Mount
Interface: Logic
Operating Temperature: 150°C (TJ)
Output Configuration: Half Bridge
Voltage - Supply: 10V ~ 20V
Rds On (Typ): 16mOhm
Applications: AC Motors, DC Motors, DC-DC Converters, General Purpose
Current - Output / Channel: 30A
Technology: Power MOSFET
Voltage - Load: 100V (Max)
Supplier Device Package: 27-PQFN (7x8)
Fault Protection: UVLO
Load Type: Inductive, Capacitive
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4+5.33 EUR
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80+3.35 EUR
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IPD90N06S405ATMA2 INFNS14108-1.pdf?t.download=true&u=5oefqw
IPD90N06S405ATMA2
Hersteller: Infineon Technologies
Description: MOSFET N-CH 60V 90A TO252-31
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 90A (Tc)
Rds On (Max) @ Id, Vgs: 5.1mOhm @ 90A, 10V
Power Dissipation (Max): 107W (Tc)
Vgs(th) (Max) @ Id: 4V @ 60µA
Supplier Device Package: PG-TO252-3-11
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 81 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 6500 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
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Anzahl Preis
359+1.30 EUR
Mindestbestellmenge: 359
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IRFR6215PBF description irfr6215pbf.pdf?fileId=5546d462533600a40153563595592114
IRFR6215PBF
Hersteller: Infineon Technologies
Description: MOSFET P-CH 150V 13A DPAK
Packaging: Tube
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 13A (Tc)
Rds On (Max) @ Id, Vgs: 295mOhm @ 6.6A, 10V
Power Dissipation (Max): 110W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-252AA (DPAK)
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 150 V
Gate Charge (Qg) (Max) @ Vgs: 66 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 860 pF @ 25 V
Produkt ist nicht verfügbar
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XMC1202Q024X0016ABXUMA1 XMC1200.pdf
XMC1202Q024X0016ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 16KB FLASH 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 13x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I²C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I²S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-16-8
Number of I/O: 18
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW4330GKWBGT BCM4330_RevE_Sep19,2016.pdf
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLUETOOTH
Packaging: Tape & Reel (TR)
Package / Case: 225-XFBGA, WLCSP
Sensitivity: -95dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.3V ~ 4.8V
Power - Output: 12dBm
Protocol: 802.11a/b/g/n, Bluetooth v4.0
Current - Receiving: 52mA ~ 60mA
Data Rate (Max): 72Mbps
Current - Transmitting: 300mA ~ 325mA
Supplier Device Package: 225-WLCSP (4.89x5.33)
GPIO: 7
Modulation: 4DQPSK, 8DPSK, GFSK
RF Family/Standard: Bluetooth, WiFi
Serial Interfaces: I²S, JTAG, SPI, UART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IRG4PC50SPBF description irg4pc50spbf.pdf?fileId=5546d462533600a4015356447adc22f0
IRG4PC50SPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.36V @ 15V, 41A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 33ns/650ns
Switching Energy: 720µJ (on), 8.27mJ (off)
Test Condition: 480V, 41A, 5Ohm, 15V
Gate Charge: 180 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 140 A
Power - Max: 200 W
Produkt ist nicht verfügbar
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IRG4PC50FPBF description irg4pc50fpbf.pdf?fileId=5546d462533600a401535644598722e8
IRG4PC50FPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 39A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 31ns/240ns
Switching Energy: 370µJ (on), 2.1mJ (off)
Test Condition: 480V, 39A, 5Ohm, 15V
Gate Charge: 190 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 280 A
Power - Max: 200 W
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irg4pc50uPBF description irg4pc50upbf.pdf?fileId=5546d462533600a401535647c56222f9
irg4pc50uPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 55A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 27A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 32ns/170ns
Switching Energy: 120µJ (on), 540µJ (off)
Test Condition: 480V, 27A, 5Ohm, 15V
Gate Charge: 180 nC
Current - Collector (Ic) (Max): 55 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 220 A
Power - Max: 200 W
Produkt ist nicht verfügbar
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IRG4PC50FDPBF IRG4PC50FD.pdf
IRG4PC50FDPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 50 ns
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 39A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 55ns/240ns
Switching Energy: 1.5mJ (on), 2.4mJ (off)
Test Condition: 480V, 39A, 5Ohm, 15V
Gate Charge: 190 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 280 A
Power - Max: 200 W
Produkt ist nicht verfügbar
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IRG4PC50FD-EPBF fundamentals-of-power-semiconductors
IRG4PC50FD-EPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 50 ns
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 39A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 55ns/240ns
Switching Energy: 1.5mJ (on), 2.4mJ (off)
Test Condition: 480V, 39A, 5Ohm, 15V
Gate Charge: 190 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 280 A
Power - Max: 200 W
Produkt ist nicht verfügbar
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IRG4PC50F-EPBF fundamentals-of-power-semiconductors
IRG4PC50F-EPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 70A TO-247AD
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 39A
Supplier Device Package: TO-247AD
Td (on/off) @ 25°C: 31ns/240ns
Switching Energy: 370µJ (on), 2.1mJ (off)
Test Condition: 480V, 39A, 5Ohm, 15V
Gate Charge: 190 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 280 A
Power - Max: 200 W
Produkt ist nicht verfügbar
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IRG4PC50SDPBF irg4pc50sdpbf.pdf?fileId=5546d462533600a401535644729d22ee
IRG4PC50SDPBF
Hersteller: Infineon Technologies
Description: IGBT 600V 70A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 50 ns
Vce(on) (Max) @ Vge, Ic: 1.36V @ 15V, 41A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 33ns/650ns
Switching Energy: 720µJ (on), 8.27mJ (off)
Test Condition: 480V, 41A, 5Ohm, 15V
Gate Charge: 180 nC
Current - Collector (Ic) (Max): 70 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Current - Collector Pulsed (Icm): 140 A
Power - Max: 200 W
Produkt ist nicht verfügbar
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CYUSB3ACC-002 download
CYUSB3ACC-002
Hersteller: Infineon Technologies
Description: XILINX FMC TO EZ-USB FX3 BOARD
Packaging: Bulk
For Use With/Related Products: EZ-USB® FX3™
Accessory Type: Interface Board
Produkt ist nicht verfügbar
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MB95F474KPMC1-G-SNE2 MB95410H_470H_Series_RevA_4-4-16.pdf
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 20KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 20KB (20K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 8x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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MB95F474KPMC2-G-SNE2 MB95410H_470H_Series_RevA_4-4-16.pdf
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 20KB FLASH 64LQFP
Packaging: Bulk
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 20KB (20K x 8)
RAM Size: 496 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-8FX
Data Converters: A/D 8x8/10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.4V ~ 5.5V
Connectivity: I²C, SIO, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 64-LQFP (12x12)
Number of I/O: 59
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FB20R06W1E3B11HOMA1 Infineon-FB20R06W1E3_B11-DS-v03_00-en_de.pdf?fileId=db3a30433ba77ced013bae8cad193ad7
Hersteller: Infineon Technologies
Description: IGBT MODULE 600V 29A 94W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 20A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 29 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 94 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.1 nF @ 25 V
Produkt ist nicht verfügbar
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FS20R06VE3BOMA1 Infineon-FS20R06VE3-DS-v02_00-en_de.pdf?fileId=db3a304325afd6e0012655b43df85129
FS20R06VE3BOMA1
Hersteller: Infineon Technologies
Description: IGBT MOD 600V 25A 71.5W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 20A
NTC Thermistor: No
Supplier Device Package: Module
Current - Collector (Ic) (Max): 25 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 71.5 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.1 nF @ 25 V
Produkt ist nicht verfügbar
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FS20R06VE3B2BOMA1 Infineon-FS20R06VE3_B2-DS-v02_00-en_de.pdf?fileId=db3a304412b407950112b4347b16603d
FS20R06VE3B2BOMA1
Hersteller: Infineon Technologies
Description: IGBT MOD 600V 25A 71.5W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 20A
NTC Thermistor: Yes
Supplier Device Package: Module
Current - Collector (Ic) (Max): 25 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 71.5 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 1.14 nF @ 25 V
Produkt ist nicht verfügbar
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DD230S26KHPSA1 DD230S.pdf
DD230S26KHPSA1
Hersteller: Infineon Technologies
Description: DIODE MODULE GP 2600V 261A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Speed: Standard Recovery >500ns, > 200mA (Io)
Technology: Standard
Diode Configuration: 1 Pair Series Connection
Current - Average Rectified (Io) (per Diode): 261A
Supplier Device Package: Module
Operating Temperature - Junction: -40°C ~ 150°C
Voltage - DC Reverse (Vr) (Max): 2600 V
Voltage - Forward (Vf) (Max) @ If: 1.74 V @ 800 A
Current - Reverse Leakage @ Vr: 160 mA @ 2600 V
Produkt ist nicht verfügbar
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CY8C6247FDI-D02T Infineon-CY8C62x6_CY8C62x7_PSoC_62_MCU_Arm_Cortex_-M4-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4c9386bff
CY8C6247FDI-D02T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 80WLCSP
Packaging: Tape & Reel (TR)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b, 16x12b SAR; D/A 2x7b, 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (3.68x3.19)
Number of I/O: 62
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6247FDI-D02T Infineon-CY8C62x6_CY8C62x7_PSoC_62_MCU_Arm_Cortex_-M4-DataSheet-v17_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4c9386bff
CY8C6247FDI-D02T
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 80WLCSP
Packaging: Cut Tape (CT)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 16x10b, 16x12b SAR; D/A 2x7b, 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, CapSense, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 80-WLCSP (3.68x3.19)
Number of I/O: 62
DigiKey Programmable: Not Verified
auf Bestellung 1913 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.78 EUR
10+11.50 EUR
25+10.68 EUR
100+9.78 EUR
250+9.35 EUR
500+9.09 EUR
1000+8.88 EUR
Mindestbestellmenge: 2
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FD200R12KE3HOSA1 Infineon-FD200R12KE3-DS-v03_03-en_de.pdf?fileId=db3a304412b407950112b431aac45508
FD200R12KE3HOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 1050W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 200A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 1050 W
Current - Collector Cutoff (Max): 5 mA
Input Capacitance (Cies) @ Vce: 14 nF @ 25 V
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+165.39 EUR
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AUIRF4905 auirf4905.pdf?fileId=5546d462533600a4015355acc8c413be
AUIRF4905
Hersteller: Infineon Technologies
Description: MOSFET P-CH 55V 74A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 74A (Tc)
Rds On (Max) @ Id, Vgs: 20mOhm @ 38A, 10V
Power Dissipation (Max): 200W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 180 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 3400 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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S29GL128S10DHB023 Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5
S29GL128S10DHB023
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
auf Bestellung 2200 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2200+6.60 EUR
Mindestbestellmenge: 2200
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S29GL128S10DHB023 Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5
S29GL128S10DHB023
Hersteller: Infineon Technologies
Description: IC FLASH 128MBIT PARALLEL 64FBGA
Packaging: Cut Tape (CT)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 128Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 8M x 16
DigiKey Programmable: Not Verified
auf Bestellung 4300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+11.05 EUR
10+9.82 EUR
25+9.37 EUR
50+9.04 EUR
100+8.72 EUR
250+8.31 EUR
500+8.02 EUR
1000+7.73 EUR
Mindestbestellmenge: 2
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IRG4PF50WPBF irg4pf50wpbf.pdf?fileId=5546d462533600a401535647f7e32307
IRG4PF50WPBF
Hersteller: Infineon Technologies
Description: IGBT 900V 51A TO-247AC
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 150°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2.7V @ 15V, 28A
Supplier Device Package: TO-247AC
Td (on/off) @ 25°C: 29ns/110ns
Switching Energy: 190µJ (on), 1.06mJ (off)
Test Condition: 720V, 28A, 5Ohm, 15V
Gate Charge: 160 nC
Current - Collector (Ic) (Max): 51 A
Voltage - Collector Emitter Breakdown (Max): 900 V
Current - Collector Pulsed (Icm): 204 A
Power - Max: 200 W
Produkt ist nicht verfügbar
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SAK-XC824M-1FGIAA INFNS19723-1.pdf?t.download=true&u=5oefqw
SAK-XC824M-1FGIAA
Hersteller: Infineon Technologies
Description: 8051 COMPATIBLE 8-BIT MCU
Packaging: Bulk
Package / Case: 20-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Speed: 25.6MHz
Program Memory Size: 4KB (4K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 4x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V
Connectivity: I²C, SSC, UART/USART
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Supplier Device Package: PG-DSO-20-45
Number of I/O: 17
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SAF-XC87816FFI5VACFXUMA1 INFNS15609-1.pdf?t.download=true&u=5oefqw
SAF-XC87816FFI5VACFXUMA1
Hersteller: Infineon Technologies
Description: XC800 I-FAMILY MICROCONTROLLER ,
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC8662FRIBEFXUMA1 Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t
XC8662FRIBEFXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC8664FRABEKXUMA1 Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t
XC8664FRABEKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-4
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC866L4FRABEKXUMA1 Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t
XC866L4FRABEKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 86MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 19
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC866L4FRA3VBEKXUMA1 Infineon-XC866-DS-v01_02-en.pdf?folderId=db3a304412b407950112b408e8c90004&fileId=db3a304412b407950112b4198e7528a5&ack=t
XC866L4FRA3VBEKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38
Number of I/O: 27
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC8664FRA5VBELXUMA1 Infineon-SAL_XC866-DS-v01_01-cn.pdf?fileId=db3a30433004641301306564e09f0366
XC8664FRA5VBELXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-4
Number of I/O: 27
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XC866L4FRA3VBELXUMA1 Infineon-SAL_XC866-DS-v01_01-cn.pdf?fileId=db3a30433004641301306564e09f0366
XC866L4FRA3VBELXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 16KB FLASH 38TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 25MHz
Program Memory Size: 16KB (16K x 8)
RAM Size: 768 x 8
Operating Temperature: -40°C ~ 150°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: XC800
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 3.6V
Connectivity: LINbus, SSI, UART/USART
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O: 27
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IRL3103PBF description irl3103pbf.pdf?fileId=5546d462533600a40153565baf6b2514
IRL3103PBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 64A TO220AB
Packaging: Tube
Package / Case: TO-220-3
Mounting Type: Through Hole
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 12mOhm @ 34A, 10V
Power Dissipation (Max): 94W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: TO-220AB
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 33 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1650 pF @ 25 V
Produkt ist nicht verfügbar
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IRL3103STRLPBF irl3103spbf.pdf?fileId=5546d462533600a40153565bb8702516
IRL3103STRLPBF
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 64A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 64A (Tc)
Rds On (Max) @ Id, Vgs: 12mOhm @ 34A, 10V
Power Dissipation (Max): 94W (Tc)
Vgs(th) (Max) @ Id: 1V @ 250µA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±16V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 33 nC @ 4.5 V
Input Capacitance (Ciss) (Max) @ Vds: 1650 pF @ 25 V
Produkt ist nicht verfügbar
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RJK5035DPP-E0#T2
Hersteller: Infineon Technologies
Description: RJK5035DPPNSINGPOWMOSF501850MOTO
Packaging: Tube
Produkt ist nicht verfügbar
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AUIRFZ48ZS auirfz48z.pdf?fileId=5546d462533600a4015355ba11e01510
AUIRFZ48ZS
Hersteller: Infineon Technologies
Description: MOSFET N-CH 55V 61A D2PAK
Packaging: Tube
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 61A (Tc)
Rds On (Max) @ Id, Vgs: 11mOhm @ 37A, 10V
Power Dissipation (Max): 91W (Tc)
Vgs(th) (Max) @ Id: 4V @ 250µA
Supplier Device Package: D2PAK
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 55 V
Gate Charge (Qg) (Max) @ Vgs: 64 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1720 pF @ 25 V
Grade: Automotive
Qualification: AEC-Q101
Produkt ist nicht verfügbar
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CY25404ZXI217T Infineon-CY25404_QUAD_PLL_PROGRAMMABLE_CLOCK_GENERATOR_WITH_SPREAD_SPECTRUM-AdditionalTechnicalInformation-v09_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec65e4e3c93&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe
CY25404ZXI217T
Hersteller: Infineon Technologies
Description: TSBU
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6316BZI-BLF03 Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integra
CY8C6316BZI-BLF03
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 116BGA
Packaging: Tray
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 50MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 160K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Bluetooth, Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6337BZI-BLF13 Infineon-PSoC_6_MCU_PSoC_63_with_BLE_Datasheet_Programmable_System-on-Chip_(PSoC)-DataSheet-v16_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4efe46c37&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integra
CY8C6337BZI-BLF13
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 116BGA
Packaging: Tray
Package / Case: 116-WFBGA
Mounting Type: Surface Mount
Speed: 150MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 288K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 8x12b SAR; D/A 1x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Bluetooth, Brown-out Detect/Reset, Cap Sense, DMA, I2S, LCD, POR, PWM, WDT
Supplier Device Package: 116-BGA (5.2x6.4)
Number of I/O: 78
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY8C6246BZI-D04 Infineon-PSoC_6_MCU_CY8C62x6_CY8C62x7-DataSheet-v14_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee4c9386bff&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
CY8C6246BZI-D04
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 512KB FLASH 124BGA
Packaging: Tray
Package / Case: 124-VFBGA
Mounting Type: Surface Mount
Speed: 100MHz, 150MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 32K x 8
Core Processor: ARM® Cortex®-M4/M0
Data Converters: A/D 8x12b SAR; D/A 1x12b
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 1.7V ~ 3.6V
Connectivity: I2C, LINbus, QSPI, SPI, UART/USART, USB
Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT
Supplier Device Package: 124-VFBGA (9x9)
Number of I/O: 104
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IPB65R150CFDATMA1 Infineon-IPX65R150CFD-DS-v02_00-en.pdf?fileId=db3a3043338c8ac80133ace218433063
IPB65R150CFDATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 22.4A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22.4A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 9.3A, 10V
Power Dissipation (Max): 195.3W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 900µA
Supplier Device Package: PG-TO263-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 86 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 100 V
Produkt ist nicht verfügbar
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IPB65R150CFDAATMA1 Infineon-IPX65R150CFDA-DS-v02_00-en.pdf?fileId=db3a3043399628450139af71b2a12046
IPB65R150CFDAATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 22.4A D2PAK
Packaging: Tape & Reel (TR)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22.4A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 9.3A, 10V
Power Dissipation (Max): 195.3W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 900µA
Supplier Device Package: PG-TO263-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 86 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 100 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1000+3.43 EUR
Mindestbestellmenge: 1000
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IPB65R150CFDAATMA1 Infineon-IPX65R150CFDA-DS-v02_00-en.pdf?fileId=db3a3043399628450139af71b2a12046
IPB65R150CFDAATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 22.4A D2PAK
Packaging: Cut Tape (CT)
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 22.4A (Tc)
Rds On (Max) @ Id, Vgs: 150mOhm @ 9.3A, 10V
Power Dissipation (Max): 195.3W (Tc)
Vgs(th) (Max) @ Id: 4.5V @ 900µA
Supplier Device Package: PG-TO263-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 86 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2340 pF @ 100 V
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 1192 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+8.04 EUR
10+5.83 EUR
100+4.23 EUR
500+3.43 EUR
Mindestbestellmenge: 3
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S29GL512S12DHIV10 Infineon-1_GBIT_(128_MBYTE)_512_MBIT_(64_MBYTE)_256_MBIT_(32_MBYTE)_128_MBIT_(16_MBYTE)_3.0_V_GL-S_FLASH_MEMORY-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed07ac14bd5&utm_source=cypress&utm_medium=referral&utm_campai
S29GL512S12DHIV10
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 120 ns
Memory Organization: 32M x 16
DigiKey Programmable: Not Verified
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+16.76 EUR
10+15.52 EUR
25+15.17 EUR
40+15.09 EUR
80+13.28 EUR
260+12.62 EUR
520+12.50 EUR
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S29GL256S90DHSS10
S29GL256S90DHSS10
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL256S90DHSS40
S29GL256S90DHSS40
Hersteller: Infineon Technologies
Description: IC FLASH 256MBIT PARALLEL 64FBGA
Packaging: Tray
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 256Mbit
Memory Type: Non-Volatile
Operating Temperature: 0°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 90 ns
Memory Organization: 16M x 16
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1351G-133AXC Infineon-CY7C1351G_4-Mbit_(128_K_36)_Flow-through_SRAM_with_NoBL_Architecture-DataSheet-v19_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ec0f16b359c
CY7C1351G-133AXC
Hersteller: Infineon Technologies
Description: IC SRAM 4.5MBIT PAR 100TQFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Memory Size: 4.5Mbit
Memory Type: Volatile
Operating Temperature: 0°C ~ 70°C (TA)
Voltage - Supply: 3.135V ~ 3.6V
Technology: SRAM - Synchronous, SDR
Clock Frequency: 133 MHz
Memory Format: SRAM
Supplier Device Package: 100-TQFP (14x20)
Memory Interface: Parallel
Access Time: 6.5 ns
Memory Organization: 128K x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITLGCAPBOM006TOBO1 Infineon-UserManual_LVDSPD_low_voltage_drives_scalable_power_demonstration_board-UserManual-v02_00-EN.pdf?fileId=5546d462696dbf120169b58bda49538e
KITLGCAPBOM006TOBO1
Hersteller: Infineon Technologies
Description: KIT_LGCAP_BOM006
Packaging: Bulk
For Use With/Related Products: XMC4400
Accessory Type: Interface Board
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+71.24 EUR
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S25HL01GTDPMHM013 en?dcId=8a8181663431cb50013431cb500b0000&downloadTitle=Infineon-S25HS256T_S25HS512T_S25HS01GT_S25HL256T_S25HL512T_S25HL01GT_256Mb_512Mb_1Gb_SEMPER_TM_Flash_Quad_SPI_1_8V_3-DataSheet-v68_00-EN.pdf&download=L2RnZGwvSW5maW5lb24
S25HL01GTDPMHM013
Hersteller: Infineon Technologies
Description: Nor
Packaging: Tape & Reel (TR)
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR (SLC)
Clock Frequency: 133 MHz
Memory Format: FLASH
Supplier Device Package: 16-SOIC
Memory Interface: SPI - Quad I/O, QPI
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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IDD15E60BUMA1 Infineon-IDD15E60-DS-v02_04-EN.pdf?fileId=5546d4624ad04ef9014ade16efd87a9f
IDD15E60BUMA1
Hersteller: Infineon Technologies
Description: DIODE GP 600V 29.2A TO252-3
Packaging: Bulk
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Speed: Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr): 87 ns
Technology: Standard
Current - Average Rectified (Io): 29.2A
Supplier Device Package: PG-TO252-3
Operating Temperature - Junction: -40°C ~ 175°C
Voltage - DC Reverse (Vr) (Max): 600 V
Voltage - Forward (Vf) (Max) @ If: 2 V @ 15 A
Current - Reverse Leakage @ Vr: 50 µA @ 600 V
auf Bestellung 14802 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
544+0.97 EUR
Mindestbestellmenge: 544
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