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111-4204PBF Infineon Technologies Description: IC REGULATOR SMD
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SIDC73D170E6X1SA2 Infineon Technologies SIDC73D170E6_L4381N.pdf?folderId=db3a304412b407950112b439a93a6e73&fileId=db3a304412b407950112b439a9c76e74 Description: DIODE GEN PURP 1.7KV 100A WAFER
Produkt ist nicht verfügbar
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BBY 56-02W E6127 BBY 56-02W E6127 Infineon Technologies fundamentals-of-power-semiconductors Description: DIODE TUNING 10V 20MA SCD-80
Packaging: Tape & Reel (TR)
Package / Case: SC-80
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 12.1pF @ 4V, 1MHz
Capacitance Ratio Condition: C1/C3
Supplier Device Package: SCD-80
Part Status: Discontinued at Digi-Key
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.3
Produkt ist nicht verfügbar
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TLE7183QUXUMB1 TLE7183QUXUMB1 Infineon Technologies Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd Description: DRIVER_IC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE7183QUXUMA8 TLE7183QUXUMA8 Infineon Technologies Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd Description: DRIVER_IC
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
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TLE7183QUXUMA6 TLE7183QUXUMA6 Infineon Technologies Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd Description: DRIVER_IC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE7183QUXUMA9 TLE7183QUXUMA9 Infineon Technologies Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd Description: DRIVER_IC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE7183QUXUMA7 TLE7183QUXUMA7 Infineon Technologies Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd Description: DRIVER_IC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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FF6MR12W2M1PB11BPSA1 FF6MR12W2M1PB11BPSA1 Infineon Technologies Infineon-FF6MR12W2M1P_B11-DataSheet-v02_00-EN.pdf?fileId=5546d462712ef9b70171541e75135f0b Description: MOSFET 2N-CH 1200V 200A
Part Status: Obsolete
Vgs(th) (Max) @ Id: 5.55V @ 80mA
Gate Charge (Qg) (Max) @ Vgs: 496nC @ 15V
Rds On (Max) @ Id, Vgs: 5.63mOhm @ 200A, 15V
Input Capacitance (Ciss) (Max) @ Vds: 14700pF @ 800V
Current - Continuous Drain (Id) @ 25°C: 200A (Tj)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Technology: Silicon Carbide (SiC)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Dual)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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DF80R12W2H3B11BOMA1 Infineon Technologies INFNS28251-1.pdf?t.download=true&u=5oefqw Description: IGBT MODULE 1200V 50A 190W
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 20A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Dual Boost Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 2.35 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 190 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 50 A
Part Status: Active
NTC Thermistor: Yes
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7+65.29 EUR
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FS100R12KT4GPB11BPSA1 Infineon Technologies infineon-fs200r12kt4rp-b11-datasheet-en.pdf Description: MOD IGBT LOW PWR ECONO3-4
Packaging: Bulk
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DDB6U134N16RRB11BPSA1 DDB6U134N16RRB11BPSA1 Infineon Technologies PressFIT_Portfolio_PB_05-2016.pdf Description: IGBT MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.6V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
Part Status: Active
Current - Collector (Ic) (Max): 125 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 400 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 5.1 nF @ 25 V
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FF225R12ME4B11BPSA1 Infineon Technologies INFNS28365-1.pdf?t.download=true&u=5oefqw Description: FF225R12 - IGBT MODULE
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F4100R17ME4B11BPSA1 Infineon Technologies Infineon-F4-100R17ME4_B11-DS-v03_02-EN.pdf?fileId=5546d462576f34750157ae37f25a7de9 Description: IGBT MODULE 1700V 155A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 155 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
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FF225R17ME4PB11BPSA1 FF225R17ME4PB11BPSA1 Infineon Technologies Infineon-FF225R17ME4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625b10283a015b1ef28594015c Description: IGBT MOD 1700V 450A 20MW
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 225A
Operating Temperature: -40°C ~ 150°C
Configuration: Half Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 450 A
Part Status: Active
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3+183.55 EUR
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FP75R12KT4PB11BPSA1 FP75R12KT4PB11BPSA1 Infineon Technologies Infineon-FP75R12KT4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625b3ca4ec015b60924221652e Description: IGBT MODULE 1200V 150A MODULE
Input Capacitance (Cies) @ Vce: 4.3 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 150 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A
Operating Temperature: -40°C ~ 150°C
Configuration: Three Phase Inverter
Input: Three Phase Bridge Rectifier
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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3+164.18 EUR
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F4250R17MP4B11BPSA1 F4250R17MP4B11BPSA1 Infineon Technologies Infineon-F4-250R17MP4_B11-DS-v03_02-EN.pdf?fileId=5546d462576f34750157ae38a1647df7 Description: IGBT MODULE 1700V 370A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 250A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 370 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 21 nF @ 25 V
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TC364DP64F300WAAKXUMA1 TC364DP64F300WAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 4MB FLASH 144LQFP
Part Status: Active
Supplier Device Package: PG-LQFP-144-22
Peripherals: DMA, I2S, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
DigiKey Programmable: Not Verified
Core Size: 32-Bit Dual-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 672K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TC364DP64F300WAAKXUMA1 TC364DP64F300WAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 4MB FLASH 144LQFP
Core Size: 32-Bit Dual-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 672K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: PG-LQFP-144-22
Peripherals: DMA, I2S, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Produkt ist nicht verfügbar
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IMBG120R140M1HXTMA1 IMBG120R140M1HXTMA1 Infineon Technologies Infineon-IMBG120R140M1H-DataSheet-v02_01-EN.pdf?fileId=5546d462749a7c2d0174b0ecf171326c Description: SICFET N-CH 1.2KV 18A TO263
Input Capacitance (Ciss) (Max) @ Vds: 491 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 13.4 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +18V, -15V
Part Status: Active
Supplier Device Package: PG-TO263-7-12
Vgs(th) (Max) @ Id: 5.7V @ 2.5mA
Power Dissipation (Max): 107W (Tc)
Rds On (Max) @ Id, Vgs: 189mOhm @ 6A, 18V
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IMBG120R220M1HXTMA1 IMBG120R220M1HXTMA1 Infineon Technologies Infineon-IMBG120R220M1H-DataSheet-v02_01-EN.pdf?fileId=5546d462749a7c2d0174b0ecffdf326f Description: SICFET N-CH 1.2KV 13A TO263
Input Capacitance (Ciss) (Max) @ Vds: 312 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 9.4 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +18V, -15V
Part Status: Active
Supplier Device Package: PG-TO263-7-12
Vgs(th) (Max) @ Id: 5.7V @ 1.6mA
Power Dissipation (Max): 83W (Tc)
Rds On (Max) @ Id, Vgs: 294mOhm @ 4A, 18V
Current - Continuous Drain (Id) @ 25°C: 13A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Tape & Reel (TR)
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1000+4.1 EUR
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CY7C1513KV18-250BZXI CY7C1513KV18-250BZXI Infineon Technologies Infineon-CY7C1526KV18_CY7C1513KV18_CY7C1515KV18_72-Mbit_QDR(R)_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v24_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe15e1314b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_gl Description: IC SRAM 72MBIT PAR 165FBGA
Package / Case: 165-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 4M x 18
Memory Interface: Parallel
Supplier Device Package: 165-FBGA (13x15)
Memory Format: SRAM
Clock Frequency: 250 MHz
Technology: SRAM - Synchronous, QDR II
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 72Mbit
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
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IKFW40N65ES5XKSA1 IKFW40N65ES5XKSA1 Infineon Technologies Infineon-IKFW40N65ES5-DataSheet-v02_01-EN.pdf?fileId=5546d46274cf54d50174daaa2bc525ee Description: IGBT TRENCH FS 650V 60A HSIP247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 30A
Supplier Device Package: PG-HSIP247-3-2
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 17ns/124ns
Switching Energy: 560µJ (on), 320µJ (off)
Test Condition: 400V, 30A, 13Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 60 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 120 A
Power - Max: 106 W
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2+15.73 EUR
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IMM101T046MXUMA1 IMM101T046MXUMA1 Infineon Technologies Infineon-IMM100T-DataSheet-v01_00-EN.pdf?fileId=5546d4626b2d8e69016b7012c7993b83 Description: IMOTION
Part Status: Active
Motor Type - AC, DC: Brushless DC (BLDC)
Motor Type - Stepper: Bipolar
Supplier Device Package: PG-IQFN-38-1
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 13.5V ~ 16.5V
Output Configuration: Half Bridge (3)
Operating Temperature: -40°C ~ 115°C (TJ)
Interface: PWM
Current - Output: 4A
Function: Driver
Mounting Type: Surface Mount
Package / Case: 38-PowerVQFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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FS150R12KE3GBOSA1 FS150R12KE3GBOSA1 Infineon Technologies Infineon-FS150R12KE3G-DS-v03_01-en_de.pdf?fileId=db3a304412b407950112b4311e48538c Description: IGBT MOD 1200V 200A 695W
Input Capacitance (Cies) @ Vce: 10.5 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 695 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 200 A
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 150A
Operating Temperature: -40°C ~ 125°C
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
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IPP60R090CFD7 Infineon Technologies Infineon-IPP60R090CFD7-DS-v02_00-EN.pdf?fileId=5546d46261ff57770162002fc9be2bb8 Description: POWER FIELD-EFFECT TRANSISTOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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IPD380P06NMATMA1 IPD380P06NMATMA1 Infineon Technologies Infineon-IPD380P06NM-DS-v02_00-EN.pdf?fileId=5546d46269e1c019016a03e2ea8300b7 Description: MOSFET P-CH 60V 35A TO252-3
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 35A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1.7mA
Supplier Device Package: PG-TO252-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 63 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2500 pF @ 30 V
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10+2.96 EUR
100+2.02 EUR
500+1.62 EUR
1000+1.49 EUR
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DEMOBOARDIFX81481TOBO1 DEMOBOARDIFX81481TOBO1 Infineon Technologies Infineon-Demoboard_Description_IFX81481-UM-v01_00-EN.pdf?fileId=5546d4624bbf60fb014bc64316232d5e Description: DEMOBOARD IFX81481
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EVAL2EDL23N06PJTOBO1 EVAL2EDL23N06PJTOBO1 Infineon Technologies Infineon-2EDL23N06PJ_EVAL-ApplicationNotes-v01_00-EN.pdf?fileId=5546d46145f1f3a401461dcabb831bd1 Description: EVAL BOARD FOR 2EDL23N06PJ
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 2EDL23N06PJ
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
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BAS40-06E6327 BAS40-06E6327 Infineon Technologies INFNS11688-1.pdf?t.download=true&u=5oefqw Description: DIODE ARR SCHOTT 40V 120MA SOT23
Current - Reverse Leakage @ Vr: 1 µA @ 30 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Voltage - DC Reverse (Vr) (Max): 40 V
Part Status: Active
Operating Temperature - Junction: 150°C
Supplier Device Package: PG-SOT23
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Schottky
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Produkt ist nicht verfügbar
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BSO613SPVGXUMA1 BSO613SPVGXUMA1 Infineon Technologies Infineon-BSO613SPVG-DS-v01_04-en.pdf?fileId=db3a304412b407950112b42ae038440c Description: MOSFET P-CH 8-SOIC
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 875 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: PG-DSO-8-6
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 2.5W (Ta)
Rds On (Max) @ Id, Vgs: 130mOhm @ 3.44A, 10V
Current - Continuous Drain (Id) @ 25°C: 3.44A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
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BSO613SPVGXUMA1 BSO613SPVGXUMA1 Infineon Technologies Infineon-BSO613SPVG-DS-v01_04-en.pdf?fileId=db3a304412b407950112b42ae038440c Description: MOSFET P-CH 8-SOIC
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 875 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: PG-DSO-8-6
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 2.5W (Ta)
Rds On (Max) @ Id, Vgs: 130mOhm @ 3.44A, 10V
Current - Continuous Drain (Id) @ 25°C: 3.44A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
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FS660R08A6P2FBBPSA1 FS660R08A6P2FBBPSA1 Infineon Technologies Infineon-FS660R08A6P2FB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d26f98f163372 Description: IGBT MOD 750V 450A AG-HYBRIDD-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A
NTC Thermistor: Yes
Supplier Device Package: AG-HYBRIDD-1
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 750 V
Power - Max: 1053 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 80 nF @ 50 V
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IPG20N10S436AATMA1 IPG20N10S436AATMA1 Infineon Technologies PdfFile_211447.pdf Description: MOSFET 2N-CH 100V 20A 8TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount, Wettable Flank
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 43W
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 20A
Input Capacitance (Ciss) (Max) @ Vds: 990pF @ 25V
Rds On (Max) @ Id, Vgs: 36mOhm @ 17A, 10V
Gate Charge (Qg) (Max) @ Vgs: 15nC @ 10V
Vgs(th) (Max) @ Id: 3.5V @ 16µA
Supplier Device Package: PG-TDSON-8-10
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
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KITXMCPLT2GOXMC4200TOBO1 KITXMCPLT2GOXMC4200TOBO1 Infineon Technologies Infineon-XMC4200_Platform2Go-UserManual-v01_00-EN.pdf?fileId=5546d4626f229553016f8fca76c12c96 Description: XMC4200 PLATFORM2GO
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: XMC4200
Platform: XMC4200 Platform2Go
Part Status: Active
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KITXMCPLT2GOXMC4400TOBO1 KITXMCPLT2GOXMC4400TOBO1 Infineon Technologies Infineon-XMC4400_Platform2Go-UserManual-v01_00-EN.pdf?fileId=5546d4626f229553016f8fc159482c94 Description: XMC4400 PLATFORM2GO
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: XMC4400
Platform: XMC4400 Platform2Go
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XMC1302T038X0064ABXUMA1 XMC1302T038X0064ABXUMA1 Infineon Technologies infineon-xmc1300-ab-datasheet-en.pdf Description: IC MCU 32BIT 64KB FLASH 38TSSOP
Packaging: Cut Tape (CT)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-9
Number of I/O: 26
DigiKey Programmable: Not Verified
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KITA2GTC387MOTORCTRTOBO1 KITA2GTC387MOTORCTRTOBO1 Infineon Technologies Infineon-AURIX_TC3xx_Motor_Control_Power_Board_Preview.-ProductOverview-v01_00-EN.pdf?fileId=5546d4627600a6bc0176045a7c3e7864 Description: EVAL BOARD FOR LE9180D-31QK
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: LE9180D-31QK, TC387, TLF35584
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
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SAK-TC1762-128F80HLAC SAK-TC1762-128F80HLAC Infineon Technologies INFNS12056-1.pdf?t.download=true&u=5oefqw Description: 32-BIT RISC FLASH MCU
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 52K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: TriCore™
Data Converters: A/D 36x8/10/12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Connectivity: ASC, CANbus, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-2
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
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2LS20017E42W34854NOSA1 Infineon Technologies ?redirId=140372 Description: IGBT MODULE 1700V 20A
Voltage - Collector Emitter Breakdown (Max): 1216 V
Current - Collector (Ic) (Max): 1520 A
Part Status: Obsolete
NTC Thermistor: No
Configuration: Half Bridge
Input: Standard
Packaging: Bulk
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TD190N16SOFHPSA2 TD190N16SOFHPSA2 Infineon Technologies Infineon-TT190N16SOF-DS-v03_01-EN.pdf?fileId=5546d46254bdc4f50154dd3d24ae2c9d Description: SCR MODULE 1.6KV 275A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Surface Mount
Operating Temperature: 125°C (TJ)
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 200 mA
Current - Gate Trigger (Igt) (Max): 145 mA
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 190 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Part Status: Active
Current - On State (It (RMS)) (Max): 275 A
Voltage - Off State: 1.6 kV
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IGC50T120T8RQX1SA1 Infineon Technologies Infineon-IGC50T120T8RQ_L7663Q_L7663S-DS-v01_01-en.pdf?fileId=db3a30433c1a8752013c28f8a5992a64 Description: IGBT 1200V 50A DIE
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IGC50T120T8RLX7SA2 Infineon Technologies Infineon-IGC50T120T8RL_L7663V-DS-v01_01-en.pdf?fileId=db3a3043382e8373013832d85bac4b85 Description: IGBT 1200V 50A DIE
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IRFS52N15DTRRP IRFS52N15DTRRP Infineon Technologies irfs52n15dpbf.pdf?fileId=5546d462533600a40153563a562221c1 Description: MOSFET N-CH 150V 51A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 2770 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 89 nC @ 10 V
Drain to Source Voltage (Vdss): 150 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 5V @ 250µA
Power Dissipation (Max): 3.8W (Ta), 230W (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 36A, 10V
Current - Continuous Drain (Id) @ 25°C: 51A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
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IRFS52N15DTRRP IRFS52N15DTRRP Infineon Technologies irfs52n15dpbf.pdf?fileId=5546d462533600a40153563a562221c1 Description: MOSFET N-CH 150V 51A D2PAK
Current - Continuous Drain (Id) @ 25°C: 51A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 2770 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 89 nC @ 10 V
Drain to Source Voltage (Vdss): 150 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 5V @ 250µA
Power Dissipation (Max): 3.8W (Ta), 230W (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 36A, 10V
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TC375TP96F300WAAKXUMA1 TC375TP96F300WAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 6MB FLASH 176LQFP
Part Status: Active
Supplier Device Package: PG-LQFP-176-22
Peripherals: DMA, I2S, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Core Size: 32-Bit Tri-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.1M x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TC375TP96F300WAAKXUMA1 TC375TP96F300WAAKXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 6MB FLASH 176LQFP
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Core Size: 32-Bit Tri-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.1M x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: PG-LQFP-176-22
Peripherals: DMA, I2S, PWM, WDT
DigiKey Programmable: Not Verified
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KITA2GTC375ARDSBTOBO1 KITA2GTC375ARDSBTOBO1 Infineon Technologies Infineon-AURIX_TC37x_Addendum-DataSheet-v01_00-EN.pdf?fileId=5546d46272e49d2a01730574c782647e Description: AURIX TC375 SHIELDBUDDY BRD
Core Processor: TriCore™
Mounting Type: Fixed
Part Status: Active
Platform: AURIX TC375 ShieldBuddy
Utilized IC / Part: TC375
Contents: Board(s)
Type: MCU 32-Bit
Function: Shield Buddy
Packaging: Box
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TC375TP96F300WAALXUMA1 TC375TP96F300WAALXUMA1 Infineon Technologies Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7 Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 1.1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
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KITAURIXTC297TFTTOBO1 KITAURIXTC297TFTTOBO1 Infineon Technologies Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f Description: EVAL TC297 TFT AURIX
Platform: AURIX
Utilized IC / Part: TC297
Core Processor: TriCore™
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
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SAKTC212L8F133FABKXUMA1 SAKTC212L8F133FABKXUMA1 Infineon Technologies INFN-S-A0008597380-1.pdf?t.download=true&u=5oefqw Description: MICROCONTROLLER, 32 BIT, TRICORE
Packaging: Bulk
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 14x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.17V ~ 1.43V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
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SALTC265D40F200WBBLXUMA1 Infineon Technologies Description: 32-BIT TRICORE AURIX MCU
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SAK-TC233LP-16F200FABKXUMA1 Infineon Technologies Description: 32-BIT TRICORE AURIX MCU
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SAKTC237L32F200SACKXUMA1 Infineon Technologies Description: MICROCONTROLLER, 32 BIT, TRICORE
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SAK-TC265DC-40F200WBBKXUMA1 Infineon Technologies Description: 32-BIT TRICORE AURIX MCU
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TC1782F320F180HRBAKXUMA2 TC1782F320F180HRBAKXUMA2 Infineon Technologies Infineon-TC1782-DS-v01_04_01-en.pdf?fileId=db3a3043271faefd01274d48e12d5d56 Description: IC MCU 32BIT 2.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 176K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 8x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.17V ~ 3.63V
Connectivity: ASC, CANbus, FlexRay, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-2
Part Status: Active
Number of I/O: 86
DigiKey Programmable: Not Verified
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TC1782F320F180HRBAKXUMA2 TC1782F320F180HRBAKXUMA2 Infineon Technologies Infineon-TC1782-DS-v01_04_01-en.pdf?fileId=db3a3043271faefd01274d48e12d5d56 Description: IC MCU 32BIT 2.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 176K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 8x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.17V ~ 3.63V
Connectivity: ASC, CANbus, FlexRay, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-2
Part Status: Active
Number of I/O: 86
DigiKey Programmable: Not Verified
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TCA355GGEG TCA355GGEG Infineon Technologies Infineon-TCA305-DS-v01_01-en[1].pdf?fileId=db3a304412b407950112b437b522688a Description: TCA355 PROXIMITY SWITCH
DigiKey Programmable: Not Verified
Proximity Detection: Yes
Supplier Device Package: PG-DSO-8-1
Number of Inputs: 1
Current - Supply: 600µA
Voltage - Supply: 5V ~ 30V
Operating Temperature: -25°C ~ 85°C
Type: Proximity Only
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
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TCA355G TCA355G Infineon Technologies Infineon-TCA305-DS-v01_01-en[1].pdf?fileId=db3a304412b407950112b437b522688a Description: TCA355G - PROXIMITY SWITCH
Proximity Detection: Yes
Supplier Device Package: PG-DSO-8-1
Number of Inputs: 1
Current - Supply: 600µA
Voltage - Supply: 5V ~ 30V
Operating Temperature: -25°C ~ 85°C
Type: Proximity Only
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TCA355GXK TCA355GXK Infineon Technologies Infineon-TCA305-DS-v01_01-en[1].pdf?fileId=db3a304412b407950112b437b522688a Description: TCA355 PROXIMITY SWITCH
DigiKey Programmable: Not Verified
Proximity Detection: Yes
Supplier Device Package: PG-DSO-8-1
Number of Inputs: 1
Current - Supply: 600µA
Voltage - Supply: 5V ~ 30V
Operating Temperature: -25°C ~ 85°C
Type: Proximity Only
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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111-4204PBF
Hersteller: Infineon Technologies
Description: IC REGULATOR SMD
Produkt ist nicht verfügbar
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SIDC73D170E6X1SA2 SIDC73D170E6_L4381N.pdf?folderId=db3a304412b407950112b439a93a6e73&fileId=db3a304412b407950112b439a9c76e74
Hersteller: Infineon Technologies
Description: DIODE GEN PURP 1.7KV 100A WAFER
Produkt ist nicht verfügbar
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BBY 56-02W E6127 fundamentals-of-power-semiconductors
BBY 56-02W E6127
Hersteller: Infineon Technologies
Description: DIODE TUNING 10V 20MA SCD-80
Packaging: Tape & Reel (TR)
Package / Case: SC-80
Mounting Type: Surface Mount
Diode Type: Single
Operating Temperature: -55°C ~ 150°C (TJ)
Capacitance @ Vr, F: 12.1pF @ 4V, 1MHz
Capacitance Ratio Condition: C1/C3
Supplier Device Package: SCD-80
Part Status: Discontinued at Digi-Key
Voltage - Peak Reverse (Max): 10 V
Capacitance Ratio: 3.3
Produkt ist nicht verfügbar
Mindestbestellmenge: 8000 Stücke
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TLE7183QUXUMB1 Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd
TLE7183QUXUMB1
Hersteller: Infineon Technologies
Description: DRIVER_IC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TLE7183QUXUMA8 Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd
TLE7183QUXUMA8
Hersteller: Infineon Technologies
Description: DRIVER_IC
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Produkt ist nicht verfügbar
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TLE7183QUXUMA6 Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd
TLE7183QUXUMA6
Hersteller: Infineon Technologies
Description: DRIVER_IC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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TLE7183QUXUMA9 Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd
TLE7183QUXUMA9
Hersteller: Infineon Technologies
Description: DRIVER_IC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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TLE7183QUXUMA7 Infineon-TLE7183QU-DS-v01_01-EN.pdf?fileId=db3a304334bc9e690134c2a52cac30cd
TLE7183QUXUMA7
Hersteller: Infineon Technologies
Description: DRIVER_IC
Grade: Automotive
Motor Type - AC, DC: Brushless DC (BLDC)
Supplier Device Package: PG-TQFP-48-8
Technology: Power MOSFET
Voltage - Supply: 5.5V ~ 20V
Output Configuration: Pre-Driver - Half Bridge (3)
Operating Temperature: -40°C ~ 150°C (TJ)
Interface: Parallel
Function: Controller - Commutation, Direction Management
Mounting Type: Surface Mount
Package / Case: 48-TQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 2500 Stücke
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FF6MR12W2M1PB11BPSA1 Infineon-FF6MR12W2M1P_B11-DataSheet-v02_00-EN.pdf?fileId=5546d462712ef9b70171541e75135f0b
FF6MR12W2M1PB11BPSA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 1200V 200A
Part Status: Obsolete
Vgs(th) (Max) @ Id: 5.55V @ 80mA
Gate Charge (Qg) (Max) @ Vgs: 496nC @ 15V
Rds On (Max) @ Id, Vgs: 5.63mOhm @ 200A, 15V
Input Capacitance (Ciss) (Max) @ Vds: 14700pF @ 800V
Current - Continuous Drain (Id) @ 25°C: 200A (Tj)
Drain to Source Voltage (Vdss): 1200V (1.2kV)
Technology: Silicon Carbide (SiC)
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: 2 N-Channel (Dual)
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Tray
Produkt ist nicht verfügbar
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DF80R12W2H3B11BOMA1 INFNS28251-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 50A 190W
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 20A
Operating Temperature: -40°C ~ 150°C (TJ)
Configuration: Dual Boost Chopper
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 2.35 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 190 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 50 A
Part Status: Active
NTC Thermistor: Yes
auf Bestellung 285 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
7+65.29 EUR
Mindestbestellmenge: 7 Stücke
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FS100R12KT4GPB11BPSA1 infineon-fs200r12kt4rp-b11-datasheet-en.pdf
Hersteller: Infineon Technologies
Description: MOD IGBT LOW PWR ECONO3-4
Packaging: Bulk
auf Bestellung 38 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+245.43 EUR
Mindestbestellmenge: 2 Stücke
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DDB6U134N16RRB11BPSA1 PressFIT_Portfolio_PB_05-2016.pdf
DDB6U134N16RRB11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single Chopper
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 2.6V @ 15V, 75A
NTC Thermistor: Yes
Supplier Device Package: AG-ECONO2B
Part Status: Active
Current - Collector (Ic) (Max): 125 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 400 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 5.1 nF @ 25 V
auf Bestellung 42 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+106.68 EUR
Mindestbestellmenge: 5 Stücke
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FF225R12ME4B11BPSA1 INFNS28365-1.pdf?t.download=true&u=5oefqw
Hersteller: Infineon Technologies
Description: FF225R12 - IGBT MODULE
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 4 Stücke
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F4100R17ME4B11BPSA1 Infineon-F4-100R17ME4_B11-DS-v03_02-EN.pdf?fileId=5546d462576f34750157ae37f25a7de9
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 155A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 100A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 155 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 9 nF @ 25 V
auf Bestellung 68 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+156 EUR
Mindestbestellmenge: 3 Stücke
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FF225R17ME4PB11BPSA1 Infineon-FF225R17ME4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625b10283a015b1ef28594015c
FF225R17ME4PB11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1700V 450A 20MW
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 225A
Operating Temperature: -40°C ~ 150°C
Configuration: Half Bridge
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
Input Capacitance (Cies) @ Vce: 18.5 nF @ 25 V
Current - Collector Cutoff (Max): 3 mA
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector (Ic) (Max): 450 A
Part Status: Active
auf Bestellung 618 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+183.55 EUR
Mindestbestellmenge: 3 Stücke
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FP75R12KT4PB11BPSA1 Infineon-FP75R12KT4P_B11-DS-v03_00-EN.pdf?fileId=5546d4625b3ca4ec015b60924221652e
FP75R12KT4PB11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1200V 150A MODULE
Input Capacitance (Cies) @ Vce: 4.3 nF @ 25 V
Current - Collector Cutoff (Max): 1 mA
Power - Max: 20 mW
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 150 A
Part Status: Active
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 75A
Operating Temperature: -40°C ~ 150°C
Configuration: Three Phase Inverter
Input: Three Phase Bridge Rectifier
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
auf Bestellung 39 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
3+164.18 EUR
Mindestbestellmenge: 3 Stücke
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F4250R17MP4B11BPSA1 Infineon-F4-250R17MP4_B11-DS-v03_02-EN.pdf?fileId=5546d462576f34750157ae38a1647df7
F4250R17MP4B11BPSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 370A MODULE
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Full Bridge Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.3V @ 15V, 250A
NTC Thermistor: No
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 370 A
Voltage - Collector Emitter Breakdown (Max): 1700 V
Current - Collector Cutoff (Max): 3 mA
Input Capacitance (Cies) @ Vce: 21 nF @ 25 V
auf Bestellung 177 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+307.77 EUR
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TC364DP64F300WAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC364DP64F300WAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Part Status: Active
Supplier Device Package: PG-LQFP-144-22
Peripherals: DMA, I2S, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
DigiKey Programmable: Not Verified
Core Size: 32-Bit Dual-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 672K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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TC364DP64F300WAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC364DP64F300WAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 144LQFP
Core Size: 32-Bit Dual-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 672K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 144-LQFP Exposed Pad
Packaging: Cut Tape (CT)
DigiKey Programmable: Not Verified
Part Status: Active
Supplier Device Package: PG-LQFP-144-22
Peripherals: DMA, I2S, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, I2C, LINbus, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Produkt ist nicht verfügbar
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IMBG120R140M1HXTMA1 Infineon-IMBG120R140M1H-DataSheet-v02_01-EN.pdf?fileId=5546d462749a7c2d0174b0ecf171326c
IMBG120R140M1HXTMA1
Hersteller: Infineon Technologies
Description: SICFET N-CH 1.2KV 18A TO263
Input Capacitance (Ciss) (Max) @ Vds: 491 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 13.4 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +18V, -15V
Part Status: Active
Supplier Device Package: PG-TO263-7-12
Vgs(th) (Max) @ Id: 5.7V @ 2.5mA
Power Dissipation (Max): 107W (Tc)
Rds On (Max) @ Id, Vgs: 189mOhm @ 6A, 18V
Current - Continuous Drain (Id) @ 25°C: 18A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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IMBG120R220M1HXTMA1 Infineon-IMBG120R220M1H-DataSheet-v02_01-EN.pdf?fileId=5546d462749a7c2d0174b0ecffdf326f
IMBG120R220M1HXTMA1
Hersteller: Infineon Technologies
Description: SICFET N-CH 1.2KV 13A TO263
Input Capacitance (Ciss) (Max) @ Vds: 312 pF @ 800 V
Gate Charge (Qg) (Max) @ Vgs: 9.4 nC @ 18 V
Drain to Source Voltage (Vdss): 1200 V
Vgs (Max): +18V, -15V
Part Status: Active
Supplier Device Package: PG-TO263-7-12
Vgs(th) (Max) @ Id: 5.7V @ 1.6mA
Power Dissipation (Max): 83W (Tc)
Rds On (Max) @ Id, Vgs: 294mOhm @ 4A, 18V
Current - Continuous Drain (Id) @ 25°C: 13A (Tc)
FET Type: N-Channel
Technology: SiCFET (Silicon Carbide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-8, D2PAK (7 Leads + Tab), TO-263CA
Packaging: Tape & Reel (TR)
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1000+4.1 EUR
Mindestbestellmenge: 1000 Stücke
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CY7C1513KV18-250BZXI Infineon-CY7C1526KV18_CY7C1513KV18_CY7C1515KV18_72-Mbit_QDR(R)_II_SRAM_Four-Word_Burst_Architecture-DataSheet-v24_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe15e1314b&utm_source=cypress&utm_medium=referral&utm_campaign=202110_gl
CY7C1513KV18-250BZXI
Hersteller: Infineon Technologies
Description: IC SRAM 72MBIT PAR 165FBGA
Package / Case: 165-LBGA
Packaging: Tray
DigiKey Programmable: Not Verified
Memory Organization: 4M x 18
Memory Interface: Parallel
Supplier Device Package: 165-FBGA (13x15)
Memory Format: SRAM
Clock Frequency: 250 MHz
Technology: SRAM - Synchronous, QDR II
Voltage - Supply: 1.7V ~ 1.9V
Operating Temperature: -40°C ~ 85°C (TA)
Memory Type: Volatile
Memory Size: 72Mbit
Mounting Type: Surface Mount
Produkt ist nicht verfügbar
Mindestbestellmenge: 1360 Stücke
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IKFW40N65ES5XKSA1 Infineon-IKFW40N65ES5-DataSheet-v02_01-EN.pdf?fileId=5546d46274cf54d50174daaa2bc525ee
IKFW40N65ES5XKSA1
Hersteller: Infineon Technologies
Description: IGBT TRENCH FS 650V 60A HSIP247
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Reverse Recovery Time (trr): 75 ns
Vce(on) (Max) @ Vge, Ic: 1.7V @ 15V, 30A
Supplier Device Package: PG-HSIP247-3-2
IGBT Type: Trench Field Stop
Td (on/off) @ 25°C: 17ns/124ns
Switching Energy: 560µJ (on), 320µJ (off)
Test Condition: 400V, 30A, 13Ohm, 15V
Gate Charge: 70 nC
Part Status: Active
Current - Collector (Ic) (Max): 60 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 120 A
Power - Max: 106 W
auf Bestellung 15 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2+15.73 EUR
Mindestbestellmenge: 2 Stücke
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IMM101T046MXUMA1 Infineon-IMM100T-DataSheet-v01_00-EN.pdf?fileId=5546d4626b2d8e69016b7012c7993b83
IMM101T046MXUMA1
Hersteller: Infineon Technologies
Description: IMOTION
Part Status: Active
Motor Type - AC, DC: Brushless DC (BLDC)
Motor Type - Stepper: Bipolar
Supplier Device Package: PG-IQFN-38-1
Technology: Power MOSFET
Applications: General Purpose
Voltage - Supply: 13.5V ~ 16.5V
Output Configuration: Half Bridge (3)
Operating Temperature: -40°C ~ 115°C (TJ)
Interface: PWM
Current - Output: 4A
Function: Driver
Mounting Type: Surface Mount
Package / Case: 38-PowerVQFN
Packaging: Cut Tape (CT)
Produkt ist nicht verfügbar
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FS150R12KE3GBOSA1 Infineon-FS150R12KE3G-DS-v03_01-en_de.pdf?fileId=db3a304412b407950112b4311e48538c
FS150R12KE3GBOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 200A 695W
Input Capacitance (Cies) @ Vce: 10.5 nF @ 25 V
Current - Collector Cutoff (Max): 5 mA
Power - Max: 695 W
Voltage - Collector Emitter Breakdown (Max): 1200 V
Current - Collector (Ic) (Max): 200 A
IGBT Type: Trench Field Stop
Supplier Device Package: Module
NTC Thermistor: Yes
Vce(on) (Max) @ Vge, Ic: 2.15V @ 15V, 150A
Operating Temperature: -40°C ~ 125°C
Configuration: Three Phase Inverter
Input: Standard
Mounting Type: Chassis Mount
Package / Case: Module
Packaging: Bulk
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+530.24 EUR
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IPP60R090CFD7 Infineon-IPP60R090CFD7-DS-v02_00-EN.pdf?fileId=5546d46261ff57770162002fc9be2bb8
Hersteller: Infineon Technologies
Description: POWER FIELD-EFFECT TRANSISTOR
Part Status: Active
Packaging: Bulk
Produkt ist nicht verfügbar
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IPD380P06NMATMA1 Infineon-IPD380P06NM-DS-v02_00-EN.pdf?fileId=5546d46269e1c019016a03e2ea8300b7
IPD380P06NMATMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V 35A TO252-3
Packaging: Cut Tape (CT)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 35A (Tc)
Rds On (Max) @ Id, Vgs: 38mOhm @ 35A, 10V
Power Dissipation (Max): 125W (Tc)
Vgs(th) (Max) @ Id: 4V @ 1.7mA
Supplier Device Package: PG-TO252-3
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
Gate Charge (Qg) (Max) @ Vgs: 63 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 2500 pF @ 30 V
auf Bestellung 14252 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
4+4.61 EUR
10+2.96 EUR
100+2.02 EUR
500+1.62 EUR
1000+1.49 EUR
Mindestbestellmenge: 4 Stücke
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DEMOBOARDIFX81481TOBO1 Infineon-Demoboard_Description_IFX81481-UM-v01_00-EN.pdf?fileId=5546d4624bbf60fb014bc64316232d5e
DEMOBOARDIFX81481TOBO1
Hersteller: Infineon Technologies
Description: DEMOBOARD IFX81481
auf Bestellung 4 Stücke:
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EVAL2EDL23N06PJTOBO1 Infineon-2EDL23N06PJ_EVAL-ApplicationNotes-v01_00-EN.pdf?fileId=5546d46145f1f3a401461dcabb831bd1
EVAL2EDL23N06PJTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR 2EDL23N06PJ
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 2EDL23N06PJ
Supplied Contents: Board(s)
Part Status: Active
Contents: Board(s)
auf Bestellung 2 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+136.01 EUR
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BAS40-06E6327 INFNS11688-1.pdf?t.download=true&u=5oefqw
BAS40-06E6327
Hersteller: Infineon Technologies
Description: DIODE ARR SCHOTT 40V 120MA SOT23
Current - Reverse Leakage @ Vr: 1 µA @ 30 V
Voltage - Forward (Vf) (Max) @ If: 1 V @ 40 mA
Voltage - DC Reverse (Vr) (Max): 40 V
Part Status: Active
Operating Temperature - Junction: 150°C
Supplier Device Package: PG-SOT23
Current - Average Rectified (Io) (per Diode): 120mA (DC)
Diode Configuration: 1 Pair Common Anode
Technology: Schottky
Speed: Small Signal =< 200mA (Io), Any Speed
Mounting Type: Surface Mount
Package / Case: TO-236-3, SC-59, SOT-23-3
Packaging: Bulk
Produkt ist nicht verfügbar
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BSO613SPVGXUMA1 Infineon-BSO613SPVG-DS-v01_04-en.pdf?fileId=db3a304412b407950112b42ae038440c
BSO613SPVGXUMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 8-SOIC
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 875 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: PG-DSO-8-6
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 2.5W (Ta)
Rds On (Max) @ Id, Vgs: 130mOhm @ 3.44A, 10V
Current - Continuous Drain (Id) @ 25°C: 3.44A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Tape & Reel (TR)
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
2500+0.56 EUR
Mindestbestellmenge: 2500 Stücke
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BSO613SPVGXUMA1 Infineon-BSO613SPVG-DS-v01_04-en.pdf?fileId=db3a304412b407950112b42ae038440c
BSO613SPVGXUMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 8-SOIC
Qualification: AEC-Q101
Grade: Automotive
Input Capacitance (Ciss) (Max) @ Vds: 875 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 30 nC @ 10 V
Drain to Source Voltage (Vdss): 60 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Active
Supplier Device Package: PG-DSO-8-6
Vgs(th) (Max) @ Id: 4V @ 1mA
Power Dissipation (Max): 2.5W (Ta)
Rds On (Max) @ Id, Vgs: 130mOhm @ 3.44A, 10V
Current - Continuous Drain (Id) @ 25°C: 3.44A (Ta)
FET Type: P-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Cut Tape (CT)
auf Bestellung 17005 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
8+2.36 EUR
12+1.49 EUR
100+0.82 EUR
500+0.73 EUR
1000+0.71 EUR
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FS660R08A6P2FBBPSA1 Infineon-FS660R08A6P2FB-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d26f98f163372
FS660R08A6P2FBBPSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 750V 450A AG-HYBRIDD-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C (TJ)
Vce(on) (Max) @ Vge, Ic: 1.35V @ 15V, 450A
NTC Thermistor: Yes
Supplier Device Package: AG-HYBRIDD-1
IGBT Type: Trench Field Stop
Part Status: Active
Current - Collector (Ic) (Max): 450 A
Voltage - Collector Emitter Breakdown (Max): 750 V
Power - Max: 1053 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 80 nF @ 50 V
auf Bestellung 20 Stücke:
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AnzahlPreis
1+461.56 EUR
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IPG20N10S436AATMA1 PdfFile_211447.pdf
IPG20N10S436AATMA1
Hersteller: Infineon Technologies
Description: MOSFET 2N-CH 100V 20A 8TDSON
Packaging: Cut Tape (CT)
Package / Case: 8-PowerVDFN
Mounting Type: Surface Mount, Wettable Flank
Configuration: 2 N-Channel (Dual)
Operating Temperature: -55°C ~ 175°C (TJ)
Technology: MOSFET (Metal Oxide)
Power - Max: 43W
Drain to Source Voltage (Vdss): 100V
Current - Continuous Drain (Id) @ 25°C: 20A
Input Capacitance (Ciss) (Max) @ Vds: 990pF @ 25V
Rds On (Max) @ Id, Vgs: 36mOhm @ 17A, 10V
Gate Charge (Qg) (Max) @ Vgs: 15nC @ 10V
Vgs(th) (Max) @ Id: 3.5V @ 16µA
Supplier Device Package: PG-TDSON-8-10
Part Status: Active
Grade: Automotive
Qualification: AEC-Q101
auf Bestellung 55536 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
6+3.17 EUR
10+2.03 EUR
100+1.37 EUR
500+1.09 EUR
1000+0.99 EUR
2000+0.95 EUR
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KITXMCPLT2GOXMC4200TOBO1 Infineon-XMC4200_Platform2Go-UserManual-v01_00-EN.pdf?fileId=5546d4626f229553016f8fca76c12c96
KITXMCPLT2GOXMC4200TOBO1
Hersteller: Infineon Technologies
Description: XMC4200 PLATFORM2GO
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Board Type: Evaluation Platform
Utilized IC / Part: XMC4200
Platform: XMC4200 Platform2Go
Part Status: Active
auf Bestellung 18 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+98.98 EUR
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KITXMCPLT2GOXMC4400TOBO1 Infineon-XMC4400_Platform2Go-UserManual-v01_00-EN.pdf?fileId=5546d4626f229553016f8fc159482c94
KITXMCPLT2GOXMC4400TOBO1
Hersteller: Infineon Technologies
Description: XMC4400 PLATFORM2GO
Packaging: Box
Mounting Type: Fixed
Type: MCU 32-Bit
Contents: Board(s)
Core Processor: ARM® Cortex®-M4
Utilized IC / Part: XMC4400
Platform: XMC4400 Platform2Go
auf Bestellung 7 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+105.67 EUR
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XMC1302T038X0064ABXUMA1 infineon-xmc1300-ab-datasheet-en.pdf
XMC1302T038X0064ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 64KB FLASH 38TSSOP
Packaging: Cut Tape (CT)
Package / Case: 38-TFSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-38-9
Number of I/O: 26
DigiKey Programmable: Not Verified
auf Bestellung 7763 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
5+3.98 EUR
10+2.96 EUR
25+2.71 EUR
100+2.43 EUR
250+2.3 EUR
500+2.22 EUR
1000+2.15 EUR
Mindestbestellmenge: 5 Stücke
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KITA2GTC387MOTORCTRTOBO1 Infineon-AURIX_TC3xx_Motor_Control_Power_Board_Preview.-ProductOverview-v01_00-EN.pdf?fileId=5546d4627600a6bc0176045a7c3e7864
KITA2GTC387MOTORCTRTOBO1
Hersteller: Infineon Technologies
Description: EVAL BOARD FOR LE9180D-31QK
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: LE9180D-31QK, TC387, TLF35584
Supplied Contents: Board(s)
Primary Attributes: Motors (BLDC, PMSM)
Secondary Attributes: Graphical User Interface (GUI)
Embedded: Yes, MCU, 32-Bit
Part Status: Active
Produkt ist nicht verfügbar
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SAK-TC1762-128F80HLAC INFNS12056-1.pdf?t.download=true&u=5oefqw
SAK-TC1762-128F80HLAC
Hersteller: Infineon Technologies
Description: 32-BIT RISC FLASH MCU
Packaging: Bulk
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 52K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 16K x 8
Core Processor: TriCore™
Data Converters: A/D 36x8/10/12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Connectivity: ASC, CANbus, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-2
Part Status: Active
Number of I/O: 81
DigiKey Programmable: Not Verified
auf Bestellung 500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
15+29.51 EUR
Mindestbestellmenge: 15 Stücke
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2LS20017E42W34854NOSA1 ?redirId=140372
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 20A
Voltage - Collector Emitter Breakdown (Max): 1216 V
Current - Collector (Ic) (Max): 1520 A
Part Status: Obsolete
NTC Thermistor: No
Configuration: Half Bridge
Input: Standard
Packaging: Bulk
Produkt ist nicht verfügbar
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TD190N16SOFHPSA2 Infineon-TT190N16SOF-DS-v03_01-EN.pdf?fileId=5546d46254bdc4f50154dd3d24ae2c9d
TD190N16SOFHPSA2
Hersteller: Infineon Technologies
Description: SCR MODULE 1.6KV 275A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Surface Mount
Operating Temperature: 125°C (TJ)
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 200 mA
Current - Gate Trigger (Igt) (Max): 145 mA
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 190 A
Voltage - Gate Trigger (Vgt) (Max): 2.5 V
Part Status: Active
Current - On State (It (RMS)) (Max): 275 A
Voltage - Off State: 1.6 kV
auf Bestellung 8 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+100.88 EUR
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IGC50T120T8RQX1SA1 Infineon-IGC50T120T8RQ_L7663Q_L7663S-DS-v01_01-en.pdf?fileId=db3a30433c1a8752013c28f8a5992a64
Hersteller: Infineon Technologies
Description: IGBT 1200V 50A DIE
Produkt ist nicht verfügbar
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IGC50T120T8RLX7SA2 Infineon-IGC50T120T8RL_L7663V-DS-v01_01-en.pdf?fileId=db3a3043382e8373013832d85bac4b85
Hersteller: Infineon Technologies
Description: IGBT 1200V 50A DIE
Produkt ist nicht verfügbar
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IRFS52N15DTRRP irfs52n15dpbf.pdf?fileId=5546d462533600a40153563a562221c1
IRFS52N15DTRRP
Hersteller: Infineon Technologies
Description: MOSFET N-CH 150V 51A D2PAK
Input Capacitance (Ciss) (Max) @ Vds: 2770 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 89 nC @ 10 V
Drain to Source Voltage (Vdss): 150 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 5V @ 250µA
Power Dissipation (Max): 3.8W (Ta), 230W (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 36A, 10V
Current - Continuous Drain (Id) @ 25°C: 51A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IRFS52N15DTRRP irfs52n15dpbf.pdf?fileId=5546d462533600a40153563a562221c1
IRFS52N15DTRRP
Hersteller: Infineon Technologies
Description: MOSFET N-CH 150V 51A D2PAK
Current - Continuous Drain (Id) @ 25°C: 51A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 175°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging: Cut Tape (CT)
Input Capacitance (Ciss) (Max) @ Vds: 2770 pF @ 25 V
Gate Charge (Qg) (Max) @ Vgs: 89 nC @ 10 V
Drain to Source Voltage (Vdss): 150 V
Vgs (Max): ±30V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: D2PAK
Vgs(th) (Max) @ Id: 5V @ 250µA
Power Dissipation (Max): 3.8W (Ta), 230W (Tc)
Rds On (Max) @ Id, Vgs: 32mOhm @ 36A, 10V
Produkt ist nicht verfügbar
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TC375TP96F300WAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC375TP96F300WAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Part Status: Active
Supplier Device Package: PG-LQFP-176-22
Peripherals: DMA, I2S, PWM, WDT
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Core Size: 32-Bit Tri-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.1M x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Tape & Reel (TR)
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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TC375TP96F300WAAKXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC375TP96F300WAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Core Size: 32-Bit Tri-Core
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 1.1M x 8
Program Memory Size: 6MB (6M x 8)
Speed: 300MHz
Mounting Type: Surface Mount
Package / Case: 176-LQFP Exposed Pad
Packaging: Cut Tape (CT)
Part Status: Active
Supplier Device Package: PG-LQFP-176-22
Peripherals: DMA, I2S, PWM, WDT
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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KITA2GTC375ARDSBTOBO1 Infineon-AURIX_TC37x_Addendum-DataSheet-v01_00-EN.pdf?fileId=5546d46272e49d2a01730574c782647e
KITA2GTC375ARDSBTOBO1
Hersteller: Infineon Technologies
Description: AURIX TC375 SHIELDBUDDY BRD
Core Processor: TriCore™
Mounting Type: Fixed
Part Status: Active
Platform: AURIX TC375 ShieldBuddy
Utilized IC / Part: TC375
Contents: Board(s)
Type: MCU 32-Bit
Function: Shield Buddy
Packaging: Box
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+227.69 EUR
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TC375TP96F300WAALXUMA1 Infineon-TriCore_Family_BR-ProductBrochure-v01_00-EN.pdf?fileId=5546d4625d5945ed015dc81f47b436c7
TC375TP96F300WAALXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 6MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 300MHz
Program Memory Size: 6MB (6M x 8)
RAM Size: 1.1M x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: TriCore™
Core Size: 32-Bit Tri-Core
Voltage - Supply (Vcc/Vdd): 3.3V, 5V
Connectivity: ASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI, QSPI, SENT
Peripherals: DMA, I2S, PWM, WDT
Supplier Device Package: PG-LQFP-176-22
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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KITAURIXTC297TFTTOBO1 Infineon-TC29xBC-DS-v01_00-EN.pdf?fileId=5546d462694c98b4016953a048b3047f
KITAURIXTC297TFTTOBO1
Hersteller: Infineon Technologies
Description: EVAL TC297 TFT AURIX
Platform: AURIX
Utilized IC / Part: TC297
Core Processor: TriCore™
Contents: Board(s), LCD
Type: MCU 32-Bit
Mounting Type: Fixed
Packaging: Box
auf Bestellung 10 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPreis
1+451.46 EUR
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SAKTC212L8F133FABKXUMA1 INFN-S-A0008597380-1.pdf?t.download=true&u=5oefqw
SAKTC212L8F133FABKXUMA1
Hersteller: Infineon Technologies
Description: MICROCONTROLLER, 32 BIT, TRICORE
Packaging: Bulk
Package / Case: 80-TQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 133MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 56K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 64K x 8
Core Processor: TriCore™
Data Converters: A/D 14x12b SAR
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.17V ~ 1.43V
Connectivity: CANbus, FlexRay, LINbus, QSPI
Peripherals: DMA, WDT
Supplier Device Package: PG-TQFP-80-7
Part Status: Active
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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SALTC265D40F200WBBLXUMA1
Hersteller: Infineon Technologies
Description: 32-BIT TRICORE AURIX MCU
Produkt ist nicht verfügbar
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SAK-TC233LP-16F200FABKXUMA1
Hersteller: Infineon Technologies
Description: 32-BIT TRICORE AURIX MCU
Produkt ist nicht verfügbar
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SAKTC237L32F200SACKXUMA1
Hersteller: Infineon Technologies
Description: MICROCONTROLLER, 32 BIT, TRICORE
auf Bestellung 818 Stücke:
Lieferzeit 10-14 Tag (e)
Mindestbestellmenge: 32 Stücke
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SAK-TC265DC-40F200WBBKXUMA1
Hersteller: Infineon Technologies
Description: 32-BIT TRICORE AURIX MCU
Produkt ist nicht verfügbar
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TC1782F320F180HRBAKXUMA2 Infineon-TC1782-DS-v01_04_01-en.pdf?fileId=db3a3043271faefd01274d48e12d5d56
TC1782F320F180HRBAKXUMA2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2.5MB FLASH 176LQFP
Packaging: Tape & Reel (TR)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 176K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 8x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.17V ~ 3.63V
Connectivity: ASC, CANbus, FlexRay, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-2
Part Status: Active
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
Mindestbestellmenge: 500 Stücke
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TC1782F320F180HRBAKXUMA2 Infineon-TC1782-DS-v01_04_01-en.pdf?fileId=db3a3043271faefd01274d48e12d5d56
TC1782F320F180HRBAKXUMA2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2.5MB FLASH 176LQFP
Packaging: Cut Tape (CT)
Package / Case: 176-LQFP
Mounting Type: Surface Mount
Speed: 180MHz
Program Memory Size: 2.5MB (2.5M x 8)
RAM Size: 176K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: TriCore™
Data Converters: A/D 8x10b, 32x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.17V ~ 3.63V
Connectivity: ASC, CANbus, FlexRay, MLI, MSC, SSC
Peripherals: DMA, POR, WDT
Supplier Device Package: PG-LQFP-176-2
Part Status: Active
Number of I/O: 86
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TCA355GGEG Infineon-TCA305-DS-v01_01-en[1].pdf?fileId=db3a304412b407950112b437b522688a
TCA355GGEG
Hersteller: Infineon Technologies
Description: TCA355 PROXIMITY SWITCH
DigiKey Programmable: Not Verified
Proximity Detection: Yes
Supplier Device Package: PG-DSO-8-1
Number of Inputs: 1
Current - Supply: 600µA
Voltage - Supply: 5V ~ 30V
Operating Temperature: -25°C ~ 85°C
Type: Proximity Only
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
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TCA355G Infineon-TCA305-DS-v01_01-en[1].pdf?fileId=db3a304412b407950112b437b522688a
TCA355G
Hersteller: Infineon Technologies
Description: TCA355G - PROXIMITY SWITCH
Proximity Detection: Yes
Supplier Device Package: PG-DSO-8-1
Number of Inputs: 1
Current - Supply: 600µA
Voltage - Supply: 5V ~ 30V
Operating Temperature: -25°C ~ 85°C
Type: Proximity Only
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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TCA355GXK Infineon-TCA305-DS-v01_01-en[1].pdf?fileId=db3a304412b407950112b437b522688a
TCA355GXK
Hersteller: Infineon Technologies
Description: TCA355 PROXIMITY SWITCH
DigiKey Programmable: Not Verified
Proximity Detection: Yes
Supplier Device Package: PG-DSO-8-1
Number of Inputs: 1
Current - Supply: 600µA
Voltage - Supply: 5V ~ 30V
Operating Temperature: -25°C ~ 85°C
Type: Proximity Only
Mounting Type: Surface Mount
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Packaging: Bulk
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
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