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CG8838AM Infineon Technologies Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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CYAT81685-100AS61Z Infineon Technologies Infineon-CYAT81682-100AA61Z-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837edabc100b8b Description: PSOC BASED - TRUETOUCH
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY15B116QN-40BKXIT CY15B116QN-40BKXIT Infineon Technologies Description: IC FRAM 16MBIT SPI 24FBGA
Packaging: Tape & Reel (TR)
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 24-FBGA (6x8)
Memory Interface: SPI
Access Time: 9 ns
Memory Organization: 2M x 8
Produkt ist nicht verfügbar
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CYT2B93CACQ0AZSGST CYT2B93CACQ0AZSGST Infineon Technologies Infineon-CYT2B9_Datasheet_32-bit_Arm_Cortex-M4F_Microcontroller_TRAVEO_T2G_Family-AdditionalTechnicalInformation-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9c191729c Description: IC MCU 32BT 2.0625MB FLSH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 45x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 2865 Stücke:
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1+24.38 EUR
10+19.25 EUR
25+17.97 EUR
100+16.56 EUR
250+15.89 EUR
500+15.49 EUR
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CYT2B97CACQ0AZSGST CYT2B97CACQ0AZSGST Infineon Technologies Infineon-CYT2B9_Datasheet_32-bit_Arm_Cortex-M4F_Microcontroller_TRAVEO_T2G_Family-AdditionalTechnicalInformation-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9c191729c Description: IC MCU 32BT 2.0625MB FLSH 144QFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 72x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 122
DigiKey Programmable: Not Verified
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CYT2B97CACQ0AZSGST CYT2B97CACQ0AZSGST Infineon Technologies Infineon-CYT2B9_Datasheet_32-bit_Arm_Cortex-M4F_Microcontroller_TRAVEO_T2G_Family-AdditionalTechnicalInformation-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9c191729c Description: IC MCU 32BT 2.0625MB FLSH 144QFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 72x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 122
DigiKey Programmable: Not Verified
auf Bestellung 529 Stücke:
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ISP13DP06NMSATMA1 ISP13DP06NMSATMA1 Infineon Technologies Infineon-ISP13DP06NMS-DataSheet-v02_01-EN.pdf?fileId=5546d46269e1c019016ae951b44b1ccc Description: MOSFET P-CH 60V SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta)
Supplier Device Package: PG-SOT223
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
auf Bestellung 3000 Stücke:
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ISP13DP06NMSATMA1 ISP13DP06NMSATMA1 Infineon Technologies Infineon-ISP13DP06NMS-DataSheet-v02_01-EN.pdf?fileId=5546d46269e1c019016ae951b44b1ccc Description: MOSFET P-CH 60V SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta)
Supplier Device Package: PG-SOT223
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
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13+1.41 EUR
19+0.94 EUR
100+0.61 EUR
500+0.47 EUR
1000+0.43 EUR
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S29GL512T10TFI020 S29GL512T10TFI020 Infineon Technologies Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in Description: IC FLASH 512MBIT PARALLEL 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
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2+17.07 EUR
10+15.85 EUR
25+15.36 EUR
40+15.11 EUR
91+14.68 EUR
273+14.1 EUR
455+13.84 EUR
1001+13.44 EUR
Mindestbestellmenge: 2
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TD330N16KOFHPSA2 Infineon Technologies Infineon-TT330N-DS-v03_04-EN.pdf?fileId=5546d46269e1c019016a0c69cb4f4b54 Description: TD330PhaContrThyristModule
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: 130°C (TJ)
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 12500A
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 330 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (RMS)) (Max): 520 A
Voltage - Off State: 1.6 kV
Produkt ist nicht verfügbar
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KTY21-5 KTY21-5 Infineon Technologies KT%2CKTY.pdf Description: THERMISTOR PTC 985 OHM 3% TO92
Packaging: Bulk
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -50°C ~ 150°C
Resistance Tolerance: ±3%
Supplier Device Package: TO-92MINI
Resistance @ 25°C: 985 Ohms
Produkt ist nicht verfügbar
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LWLR10LR50L15000AHPSA1 Infineon Technologies Description: ACCY LIGHT FIBER FOR LTT
Packaging: Tray
Produkt ist nicht verfügbar
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LWLR10LR50L3000AHPSA1 LWLR10LR50L3000AHPSA1 Infineon Technologies Infineon-LIGHT%20FIBER%20LWL%20R10-LR50-DS-v02_01-EN.pdf?fileId=5546d462525dbac401532cc246cd74e5 Description: FIBER OPTIC CBL 3M
Packaging: Tray
Cable Diameter: 0.12" (3.0mm), 0.14" (3.6mm)
Length - Overall: 9.8' (3.0m)
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CY90F455SPMCR-G-JNE1 CY90F455SPMCR-G-JNE1 Infineon Technologies Description: IC MCU 16BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-16LX
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
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CY9BF468NPMC-GNE2 CY9BF468NPMC-GNE2 Infineon Technologies Infineon-CY9B460R_Series_32-bit_Arm_Cortex_-MF4_FM4_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c81fb7ad201821501ca6c7d04 Description: IC MCU 32B 1.03125MB FLSH 100QFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.03125MB (1.03125M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
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2+15.86 EUR
10+12.48 EUR
90+11.23 EUR
Mindestbestellmenge: 2
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CY14B101I-SFXI CY14B101I-SFXI Infineon Technologies download Description: IC NVSRAM 1MBIT I2C 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: NVSRAM (Non-Volatile SRAM)
Clock Frequency: 3.4 MHz
Memory Format: NVSRAM
Supplier Device Package: 16-SOIC
Memory Interface: I2C
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
auf Bestellung 406 Stücke:
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1+20.01 EUR
10+18.58 EUR
46+17.62 EUR
92+17.19 EUR
138+16.94 EUR
276+16.51 EUR
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CY8C21512-12PVXE CY8C21512-12PVXE Infineon Technologies download Description: IC MCU 8BIT 8KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
DigiKey Programmable: Not Verified
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CY7C1565KV18-450BZI CY7C1565KV18-450BZI Infineon Technologies Infineon-CY7C1565KV18_72-Mbit_QDR(R)_II+_SRAM_Four-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)-DataSheet-v20_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe0b293135&utm_source=cypress&utm_medium=referral&utm_campaign=202110_gl Description: IC SRAM 72MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 72Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 450 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 2M x 36
DigiKey Programmable: Not Verified
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051GL512S10TFI010 Infineon Technologies Description: INFINEON
Packaging: Bulk
Produkt ist nicht verfügbar
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S29GL01GT13DHNV23 S29GL01GT13DHNV23 Infineon Technologies Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 130 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
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S29GL01GT13TFNV23 S29GL01GT13TFNV23 Infineon Technologies Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in Description: IC FLASH 1GBIT PARALLEL 56TSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 130 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
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CP7935ATT Infineon Technologies Description: INFINEON
Packaging: Bulk
Produkt ist nicht verfügbar
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CP7936ATT Infineon Technologies Description: INFINEON
Packaging: Bulk
Produkt ist nicht verfügbar
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TLE42742DV50NTMA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: IC REG LINEAR 5V 400MA
Packaging: Bulk
Output Type: Fixed
Current - Output: 400mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Voltage - Output (Min/Fixed): 5V
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.5V @ 250mA
Protection Features: Over Current, Over Temperature, Reverse Polarity, Short Circuit
Current - Supply (Max): 30 mA
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TLE4274GV85ATMA1 TLE4274GV85ATMA1 Infineon Technologies TLE4274_v1.7_01-20-11.pdf Description: IC REG LIN 8.5V 400MA TO263-3-1
Packaging: Tape & Reel (TR)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 400mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: PG-TO263-3-1
Voltage - Output (Min/Fixed): 8.5V
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.5V @ 250mA
Protection Features: Over Current, Over Temperature, Reverse Polarity, Short Circuit
Current - Supply (Max): 30 mA
Grade: Automotive
Qualification: AEC-Q100
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DF75R12W1H4FB11BOMA1 Infineon Technologies DF75R12W1H4F_B11_Rev3.0_2013-11-25.pdf Description: MOD DIODE BRIDGE EASY1B-2-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: Standard
Voltage - Peak Reverse (Max): 1.2 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 50 A
Current - Reverse Leakage @ Vr: 100 µA @ 1200 V
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6MS16017P43W40383NOSA1 6MS16017P43W40383NOSA1 Infineon Technologies Infineon-6MS16017P43W40383-DS-v02_00-EN.pdf?fileId=5546d462525dbac40152cace93b1645b Description: IGBT MODULE 1700V 880A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -25°C ~ 55°C
NTC Thermistor: Yes
Supplier Device Package: Module
Voltage - Collector Emitter Breakdown (Max): 1700 V
Produkt ist nicht verfügbar
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CY8C3666AXI-052T CY8C3666AXI-052T Infineon Technologies #!?fileId=8ac78c8c7d0d8da4017d0ec73d263e88 Description: IC MCU 8BIT 64KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 8051
Data Converters: A/D 16x12b; D/A 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: CapSense, DMA, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 62
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
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1500+15.88 EUR
Mindestbestellmenge: 1500
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CY8C3666AXI-052T CY8C3666AXI-052T Infineon Technologies #!?fileId=8ac78c8c7d0d8da4017d0ec73d263e88 Description: IC MCU 8BIT 64KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 8051
Data Converters: A/D 16x12b; D/A 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: CapSense, DMA, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 62
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
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1+25.08 EUR
10+23.05 EUR
25+22.09 EUR
100+19.47 EUR
250+18.51 EUR
500+17.32 EUR
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315-0649-000AAA Infineon Technologies Description: INFINEON
Packaging: Bulk
Produkt ist nicht verfügbar
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XC2263M72F80LRABKXUMA1 Infineon Technologies Description: IC MCU 16/32B 576KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-8
Number of I/O: 76
DigiKey Programmable: Not Verified
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FD600R06ME3S2BOSA1 FD600R06ME3S2BOSA1 Infineon Technologies Infineon-FD600R06ME3_S2-DS-v02_04-en_de.pdf?fileId=db3a30431a5c32f2011aa4c3b2034d8c Description: IGBT MOD 600V 600A 2250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 600A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 600 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 2250 W
Current - Collector Cutoff (Max): 400 nA
Input Capacitance (Cies) @ Vce: 60 nF @ 25 V
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1EDI302XASEVALBOARDTOBO1 1EDI302XASEVALBOARDTOBO1 Infineon Technologies Infineon-Z8F80037256-1EDI302xAS_1EDI303xAS-evaluation-board-UserManual-v01_00-EN.pdf?fileId=5546d462773f932401774914b0c60e9e Description: 1EDI302XAS EVALBOARD
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1EDI302xAS
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: No
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BLDCSHIELDTLE956XTOBO1 BLDCSHIELDTLE956XTOBO1 Infineon Technologies Infineon-BLDC_Shield_TLE956x-UserManual-v01_00-EN.pdf?fileId=5546d46272e49d2a0173240cd6a32199 Description: BLDC SHIELD_TLE956X
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TLE9563-3QX
Platform: Arduino
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2DIB1411FXUMA1 2DIB1411FXUMA1 Infineon Technologies Infineon-2DIBx41xF-DS_v01_00-EN.pdf-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c872bd8d60187370abe7d246c Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: General Purpose
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 3000Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-82
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: No
Channel Type: Unidirectional
Pulse Width Distortion (Max): 4ns
Number of Channels: 2
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2DIB1411FXUMA1 2DIB1411FXUMA1 Infineon Technologies Infineon-2DIBx41xF-DS_v01_00-EN.pdf-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c872bd8d60187370abe7d246c Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: General Purpose
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 3000Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-82
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: No
Channel Type: Unidirectional
Pulse Width Distortion (Max): 4ns
Number of Channels: 2
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IRGP4790-EPBF IRGP4790-EPBF Infineon Technologies IRGP4790%28-E%29PbF.pdf Description: IGBT 650V 140A TO-247AD
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Supplier Device Package: TO-247AD
Td (on/off) @ 25°C: 50ns/200ns
Switching Energy: 2.5mJ (on), 2.2mJ (off)
Test Condition: 400V, 75A, 10Ohm, 15V
Gate Charge: 210 nC
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 225 A
Power - Max: 455 W
Produkt ist nicht verfügbar
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IGI60F140A1LAUMA1 IGI60F140A1LAUMA1 Infineon Technologies Description: IC HALF BRIDGE DRIVER 1A 21TIQFN
Packaging: Tape & Reel (TR)
Package / Case: 21-TQFN Exposed Pad
Mounting Type: Surface Mount
Output Configuration: Half Bridge
Rds On (Typ): 140mOhm
Applications: General Purpose
Current - Output / Channel: 1A
Technology: Power MOSFET
Supplier Device Package: PG-TIQFN-21-1
Load Type: Inductive, Capacitive, Resistive
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IGI60F140A1LAUMA1 IGI60F140A1LAUMA1 Infineon Technologies Description: IC HALF BRIDGE DRIVER 1A 21TIQFN
Packaging: Cut Tape (CT)
Package / Case: 21-TQFN Exposed Pad
Mounting Type: Surface Mount
Output Configuration: Half Bridge
Rds On (Typ): 140mOhm
Applications: General Purpose
Current - Output / Channel: 1A
Technology: Power MOSFET
Supplier Device Package: PG-TIQFN-21-1
Load Type: Inductive, Capacitive, Resistive
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S6J328CKSPSE20000 S6J328CKSPSE20000 Infineon Technologies Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_int Description: IC MCU 32BIT 2.0625MB 208TEQFP
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Number of I/O: 120
DigiKey Programmable: Not Verified
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IPT65R080CFD7XTMA1 IPT65R080CFD7XTMA1 Infineon Technologies Infineon-IPT65R080CFD7-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c85ecb347018678d11e89546f Description: HIGH POWER_NEW
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Supplier Device Package: PG-HSOF-8-3
Drain to Source Voltage (Vdss): 650 V
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IPT65R040CFD7XTMA1 IPT65R040CFD7XTMA1 Infineon Technologies Infineon-IPT65R040CFD7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c85ecb347018678c6ae2a5377 Description: MOSFET N-CH 650V 8HSOF
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: PG-HSOF-8-2
Drain to Source Voltage (Vdss): 650 V
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CYW4319GKUBGT Infineon Technologies ?utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC RF TXRX+MCU WIFI 138UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 138-UFBGA, WLBGA
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Power - Output: 20dBm
Protocol: 802.11a/b/g/n
Data Rate (Max): 54Mbps
Supplier Device Package: 138-WLBGA (5.74x4.53)
GPIO: 8
Modulation: 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK
RF Family/Standard: WiFi
Serial Interfaces: SPI, UART, USB
DigiKey Programmable: Not Verified
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CYW20734UA1KFFB3GT CYW20734UA1KFFB3GT Infineon Technologies download Description: IC RF TXRX+MCU BLE 90FBGA
Packaging: Tape & Reel (TR)
Package / Case: 90-TFBGA
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.3V
Power - Output: 12dBm
Protocol: Bluetooth v4.1
Current - Receiving: 26mA
Data Rate (Max): 2Mbps
Current - Transmitting: 60mA
Supplier Device Package: 90-FBGA (8.5x8.5)
GPIO: 40
Modulation: 8DPSK, DQPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, I2S, SPI, UART
DigiKey Programmable: Not Verified
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CYW20734UA1KFFB3GT CYW20734UA1KFFB3GT Infineon Technologies download Description: IC RF TXRX+MCU BLE 90FBGA
Packaging: Cut Tape (CT)
Package / Case: 90-TFBGA
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.3V
Power - Output: 12dBm
Protocol: Bluetooth v4.1
Current - Receiving: 26mA
Data Rate (Max): 2Mbps
Current - Transmitting: 60mA
Supplier Device Package: 90-FBGA (8.5x8.5)
GPIO: 40
Modulation: 8DPSK, DQPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, I2S, SPI, UART
DigiKey Programmable: Not Verified
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CYW20736A1KWBGT Infineon Technologies CYW20736A1KWBGT_Web.pdf Description: IC RF TXRX+MCU BLUETOOTH
Packaging: Tape & Reel (TR)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.4V ~ 3.6V
Protocol: Bluetooth v4.1
Supplier Device Package: 80-WLCSP (2.2x2.2)
GPIO: 14
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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CYW20738A2KML3GT CYW20738A2KML3GT Infineon Technologies Infineon-CYW20738_Single_Chip_Bluetooth_Transceiver_for_Wireless_Input_Devices_Datasheet-AdditionalTechnicalInformation-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee210a6685d&utm_source=cypress&utm_medium=referral&utm_campaign Description: IC RF TXRX+MCU BLUETOOTH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -93dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB ROM, 60kB RAM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.8V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 27mA
Data Rate (Max): 1Mbps
Current - Transmitting: 27mA
Supplier Device Package: 40-QFN (6x6)
GPIO: 22
Modulation: DPSK, DQPSK, GFSK, GMSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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CYW20733A3KFB1G CYW20733A3KFB1G Infineon Technologies CYW20733_RevS_11-9-17.pdf Description: IC RF TXRX+MCU BLE 81FBGA
Packaging: Tray
Package / Case: 81-TFBGA
Sensitivity: -85dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Power - Output: 10dBm
Protocol: Bluetooth v3.0 +EDR
Current - Receiving: 28mA
Data Rate (Max): 3Mbps
Current - Transmitting: 63mA
Supplier Device Package: 81-FBGA (8x8)
GPIO: 40
Modulation: 4DQPSK, 8DPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
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CYW20705A1KWFBGT CYW20705A1KWFBGT Infineon Technologies Infineon-CYW20705_Single_Chip_Bluetooth_Transceiver_and_Baseband_Processor_Datasheet-AdditionalTechnicalInformation-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee20183683a&utm_source=cypress&utm_medium=referral&utm_campaign=202 Description: IC RF TXRX+MCU BLE 50WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 50-WFBGA
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 5.5V
Power - Output: 10dBm
Protocol: Bluetooth v4.1
Current - Receiving: 31mA
Data Rate (Max): 3Mbps
Current - Transmitting: 65mA
Supplier Device Package: 50-WFBGA (4.5x4)
GPIO: 8
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART, USB
DigiKey Programmable: Not Verified
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CYW20704UA1KFFB1G CYW20704UA1KFFB1G Infineon Technologies Infineon-CYW20704_Single-Chip_Bluetooth_Transceiver_and_Baseband_Processor_Datasheet-AdditionalTechnicalInformation-v08_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee1e9f96802&utm_source=cypress&utm_medium=referral&utm_campaign=202 Description: IC RF TXRX+MCU BLUETOOTH 49VFBGA
Packaging: Tray
Package / Case: 49-VFBGA, FCBGA
Sensitivity: -95.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Power - Output: 12dBm
Protocol: Bluetooth v4.1
Data Rate (Max): 2Mbps
Supplier Device Package: 49-FCBGA (4.5x4)
GPIO: 8
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
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CY9BF506RBPMC-G-UNE1 Infineon Technologies Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Number of I/O: 100
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S25FL064P0XBHI020 S25FL064P0XBHI020 Infineon Technologies Infineon-S25FL064P_64-Mbit_3.0_V_SPI_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed4dcb1535c&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files Description: IC FLASH 64MBIT SPI/QUAD 24BGA
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-BGA (8x6)
Write Cycle Time - Word, Page: 5µs, 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 8M x 8
DigiKey Programmable: Not Verified
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PEB55508EV1.2 PEB55508EV1.2 Infineon Technologies Description: GEMINAX MULTIPORT INTEGRATED ADS
Packaging: Bulk
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S6E2005F0A10AR000H8SA1 Infineon Technologies Description: MULTI-MARKET MCUS
Packaging: Tray
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BSO110N03MSGXUMA1 BSO110N03MSGXUMA1 Infineon Technologies BSO110N03MS_rev1.0.pdf?folderId=db3a304313d846880113d91d60c500c4&fileId=db3a30431b0626df011b0d7412447e2b Description: MOSFET N-CH 30V 10A 8DSO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 10A (Ta)
Rds On (Max) @ Id, Vgs: 11mOhm @ 12.1A, 10V
Power Dissipation (Max): 1.56W (Ta)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-DSO-8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 15 V
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2EDN7433BXTSA1 Infineon Technologies Description: DRIVER IC PG-SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Inverting
Supplier Device Package: PG-SOT23-6-3
Rise / Fall Time (Typ): 8.6ns, 6ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.4V, 1.9V
Current - Peak Output (Source, Sink): 5A, 5A
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2EDN7433BXTSA1 Infineon Technologies Description: DRIVER IC PG-SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Inverting
Supplier Device Package: PG-SOT23-6-3
Rise / Fall Time (Typ): 8.6ns, 6ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.4V, 1.9V
Current - Peak Output (Source, Sink): 5A, 5A
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TD500N12KOFHPSA2 TD500N12KOFHPSA2 Infineon Technologies Infineon-TT500N-DS-v03_04-EN.pdf?fileId=db3a30434486a89301448d34d0f7790d Description: SCR MODULE 1800V 900A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 17000A @ 50Hz
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 500 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (RMS)) (Max): 900 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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FS100R12KT4GB11BOSA1 FS100R12KT4GB11BOSA1 Infineon Technologies Infineon-FS100R12KT4G_B11-DS-v02_00-en_de.pdf?fileId=db3a3043156fd5730116191497ce1c8e Description: IGBT MOD 1200V 100A 515W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 100 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 515 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 6.3 nF @ 25 V
Produkt ist nicht verfügbar
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PVA3054NSPBF PVA3054NSPBF Infineon Technologies pva30n.pdf?fileId=5546d462533600a4015356839c762923 Description: SSR RELAY SPST-NO 50MA 0-300V
Packaging: Tube
Package / Case: 8-SMD (0.300", 7.62mm), 4 Leads
Output Type: AC, DC
Mounting Type: Surface Mount
Voltage - Input: 1.2VDC
Circuit: SPST-NO (1 Form A)
Termination Style: Gull Wing
Load Current: 50 mA
Supplier Device Package: 8-SMD
Voltage - Load: 0 V ~ 300 V
On-State Resistance (Max): 160 Ohms
Operating Temperature: -40°C ~ 85°C
Approval Agency: UL
Produkt ist nicht verfügbar
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CG8838AM
Hersteller: Infineon Technologies
Description: IC
Packaging: Bulk
Produkt ist nicht verfügbar
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CYAT81685-100AS61Z Infineon-CYAT81682-100AA61Z-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c82ce566401837edabc100b8b
Hersteller: Infineon Technologies
Description: PSOC BASED - TRUETOUCH
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Interface: I²C, SPI
Operating Temperature: -40°C ~ 105°C (TA)
Voltage - Supply: 1.71V ~ 1.95V, 3V ~ 5.5V
Supplier Device Package: 100-TQFP (14x14)
Touchscreen: 2 Wire Capacitive
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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CY15B116QN-40BKXIT
CY15B116QN-40BKXIT
Hersteller: Infineon Technologies
Description: IC FRAM 16MBIT SPI 24FBGA
Packaging: Tape & Reel (TR)
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 16Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.8V ~ 3.6V
Technology: FRAM (Ferroelectric RAM)
Clock Frequency: 40 MHz
Memory Format: FRAM
Supplier Device Package: 24-FBGA (6x8)
Memory Interface: SPI
Access Time: 9 ns
Memory Organization: 2M x 8
Produkt ist nicht verfügbar
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CYT2B93CACQ0AZSGST Infineon-CYT2B9_Datasheet_32-bit_Arm_Cortex-M4F_Microcontroller_TRAVEO_T2G_Family-AdditionalTechnicalInformation-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9c191729c
CYT2B93CACQ0AZSGST
Hersteller: Infineon Technologies
Description: IC MCU 32BT 2.0625MB FLSH 64LQFP
Packaging: Cut Tape (CT)
Package / Case: 64-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 45x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 64-LQFP (10x10)
Number of I/O: 49
DigiKey Programmable: Not Verified
auf Bestellung 2865 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+24.38 EUR
10+19.25 EUR
25+17.97 EUR
100+16.56 EUR
250+15.89 EUR
500+15.49 EUR
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CYT2B97CACQ0AZSGST Infineon-CYT2B9_Datasheet_32-bit_Arm_Cortex-M4F_Microcontroller_TRAVEO_T2G_Family-AdditionalTechnicalInformation-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9c191729c
CYT2B97CACQ0AZSGST
Hersteller: Infineon Technologies
Description: IC MCU 32BT 2.0625MB FLSH 144QFP
Packaging: Tape & Reel (TR)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 72x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 122
DigiKey Programmable: Not Verified
auf Bestellung 300 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
300+21.24 EUR
Mindestbestellmenge: 300
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CYT2B97CACQ0AZSGST Infineon-CYT2B9_Datasheet_32-bit_Arm_Cortex-M4F_Microcontroller_TRAVEO_T2G_Family-AdditionalTechnicalInformation-v10_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee9c191729c
CYT2B97CACQ0AZSGST
Hersteller: Infineon Technologies
Description: IC MCU 32BT 2.0625MB FLSH 144QFP
Packaging: Cut Tape (CT)
Package / Case: 144-LQFP
Mounting Type: Surface Mount
Speed: 100MHz, 160MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External, Internal
Program Memory Type: FLASH
EEPROM Size: 128K x 8
Core Processor: ARM® Cortex®-M0+, ARM® Cortex®-M4F
Data Converters: A/D 72x12b SAR
Core Size: 32-Bit Dual-Core
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, FIFO, I2C, IrDA, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, Crypto - AES, DMA, LVD, POR, PWM, SHA, TRNG, WDT
Supplier Device Package: 144-LQFP (20x20)
Number of I/O: 122
DigiKey Programmable: Not Verified
auf Bestellung 529 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+28.78 EUR
10+26.45 EUR
25+25.36 EUR
100+22.34 EUR
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ISP13DP06NMSATMA1 Infineon-ISP13DP06NMS-DataSheet-v02_01-EN.pdf?fileId=5546d46269e1c019016ae951b44b1ccc
ISP13DP06NMSATMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta)
Supplier Device Package: PG-SOT223
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3000+0.3 EUR
Mindestbestellmenge: 3000
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ISP13DP06NMSATMA1 Infineon-ISP13DP06NMS-DataSheet-v02_01-EN.pdf?fileId=5546d46269e1c019016ae951b44b1ccc
ISP13DP06NMSATMA1
Hersteller: Infineon Technologies
Description: MOSFET P-CH 60V SOT223
Packaging: Cut Tape (CT)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: P-Channel
Current - Continuous Drain (Id) @ 25°C: 2.8A (Ta)
Supplier Device Package: PG-SOT223
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 60 V
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.41 EUR
19+0.94 EUR
100+0.61 EUR
500+0.47 EUR
1000+0.43 EUR
Mindestbestellmenge: 13
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S29GL512T10TFI020 Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in
S29GL512T10TFI020
Hersteller: Infineon Technologies
Description: IC FLASH 512MBIT PARALLEL 56TSOP
Packaging: Tray
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 512Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 100 ns
Memory Organization: 64M x 8
DigiKey Programmable: Not Verified
auf Bestellung 1230 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+17.07 EUR
10+15.85 EUR
25+15.36 EUR
40+15.11 EUR
91+14.68 EUR
273+14.1 EUR
455+13.84 EUR
1001+13.44 EUR
Mindestbestellmenge: 2
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TD330N16KOFHPSA2 Infineon-TT330N-DS-v03_04-EN.pdf?fileId=5546d46269e1c019016a0c69cb4f4b54
Hersteller: Infineon Technologies
Description: TD330PhaContrThyristModule
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: 130°C (TJ)
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 200 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 12500A
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 330 A
Voltage - Gate Trigger (Vgt) (Max): 2 V
Current - On State (It (RMS)) (Max): 520 A
Voltage - Off State: 1.6 kV
Produkt ist nicht verfügbar
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KTY21-5 KT%2CKTY.pdf
KTY21-5
Hersteller: Infineon Technologies
Description: THERMISTOR PTC 985 OHM 3% TO92
Packaging: Bulk
Package / Case: TO-226-2, TO-92-2 (TO-226AC)
Mounting Type: Through Hole
Operating Temperature: -50°C ~ 150°C
Resistance Tolerance: ±3%
Supplier Device Package: TO-92MINI
Resistance @ 25°C: 985 Ohms
Produkt ist nicht verfügbar
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LWLR10LR50L15000AHPSA1
Hersteller: Infineon Technologies
Description: ACCY LIGHT FIBER FOR LTT
Packaging: Tray
Produkt ist nicht verfügbar
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LWLR10LR50L3000AHPSA1 Infineon-LIGHT%20FIBER%20LWL%20R10-LR50-DS-v02_01-EN.pdf?fileId=5546d462525dbac401532cc246cd74e5
LWLR10LR50L3000AHPSA1
Hersteller: Infineon Technologies
Description: FIBER OPTIC CBL 3M
Packaging: Tray
Cable Diameter: 0.12" (3.0mm), 0.14" (3.6mm)
Length - Overall: 9.8' (3.0m)
Produkt ist nicht verfügbar
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CY90F455SPMCR-G-JNE1
CY90F455SPMCR-G-JNE1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 24KB FLASH 48LQFP
Packaging: Tray
Package / Case: 48-LQFP
Mounting Type: Surface Mount
Speed: 16MHz
Program Memory Size: 24KB (24K x 8)
RAM Size: 2K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: F²MC-16LX
Data Converters: A/D 8x8/10b
Core Size: 16-Bit
Voltage - Supply (Vcc/Vdd): 3.5V ~ 5.5V
Connectivity: UART/USART
Peripherals: POR, WDT
Supplier Device Package: 48-LQFP (7x7)
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF468NPMC-GNE2 Infineon-CY9B460R_Series_32-bit_Arm_Cortex_-MF4_FM4_Microcontroller-DataSheet-v07_00-EN.pdf?fileId=8ac78c8c81fb7ad201821501ca6c7d04
CY9BF468NPMC-GNE2
Hersteller: Infineon Technologies
Description: IC MCU 32B 1.03125MB FLSH 100QFP
Packaging: Tray
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 160MHz
Program Memory Size: 1.03125MB (1.03125M x 8)
RAM Size: 128K x 8
Operating Temperature: -40°C ~ 125°C (TJ)
Oscillator Type: External, Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4F
Data Converters: A/D 24x12b SAR; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I2C, LINbus, SD, SPI, UART/USART
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 100-LQFP (14x14)
Number of I/O: 80
DigiKey Programmable: Not Verified
auf Bestellung 900 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+15.86 EUR
10+12.48 EUR
90+11.23 EUR
Mindestbestellmenge: 2
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CY14B101I-SFXI download
CY14B101I-SFXI
Hersteller: Infineon Technologies
Description: IC NVSRAM 1MBIT I2C 16SOIC
Packaging: Tube
Package / Case: 16-SOIC (0.295", 7.50mm Width)
Mounting Type: Surface Mount
Memory Size: 1Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: NVSRAM (Non-Volatile SRAM)
Clock Frequency: 3.4 MHz
Memory Format: NVSRAM
Supplier Device Package: 16-SOIC
Memory Interface: I2C
Memory Organization: 128K x 8
DigiKey Programmable: Not Verified
auf Bestellung 406 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+20.01 EUR
10+18.58 EUR
46+17.62 EUR
92+17.19 EUR
138+16.94 EUR
276+16.51 EUR
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CY8C21512-12PVXE download
CY8C21512-12PVXE
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 8KB FLASH 28SSOP
Packaging: Tube
Package / Case: 28-SSOP (0.209", 5.30mm Width)
Mounting Type: Surface Mount
Speed: 12MHz
Program Memory Size: 8KB (8K x 8)
RAM Size: 512 x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: M8C
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.25V
Connectivity: I²C, SPI, UART/USART
Peripherals: LVD, POR, PWM, WDT
Supplier Device Package: 28-SSOP
Number of I/O: 24
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY7C1565KV18-450BZI Infineon-CY7C1565KV18_72-Mbit_QDR(R)_II+_SRAM_Four-Word_Burst_Architecture_(2.5_Cycle_Read_Latency)-DataSheet-v20_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ebe0b293135&utm_source=cypress&utm_medium=referral&utm_campaign=202110_gl
CY7C1565KV18-450BZI
Hersteller: Infineon Technologies
Description: IC SRAM 72MBIT PAR 165FBGA
Packaging: Tray
Package / Case: 165-LBGA
Mounting Type: Surface Mount
Memory Size: 72Mbit
Memory Type: Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 1.7V ~ 1.9V
Technology: SRAM - Synchronous, QDR II+
Clock Frequency: 450 MHz
Memory Format: SRAM
Supplier Device Package: 165-FBGA (13x15)
Memory Interface: Parallel
Memory Organization: 2M x 36
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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051GL512S10TFI010
Hersteller: Infineon Technologies
Description: INFINEON
Packaging: Bulk
Produkt ist nicht verfügbar
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S29GL01GT13DHNV23 Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in
S29GL01GT13DHNV23
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT PARALLEL 64FBGA
Packaging: Tape & Reel (TR)
Package / Case: 64-LBGA
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 64-FBGA (9x9)
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 130 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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S29GL01GT13TFNV23 Infineon-S29GL01GT_S29GL512T_1-Gb_(128_MB)_512-Mb_(64_MB)_GL-T_MirrorBit_Eclipse_Flash-DataSheet-v13_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed2abb34fce&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_in
S29GL01GT13TFNV23
Hersteller: Infineon Technologies
Description: IC FLASH 1GBIT PARALLEL 56TSOP
Packaging: Tape & Reel (TR)
Package / Case: 56-TFSOP (0.724", 18.40mm Width)
Mounting Type: Surface Mount
Memory Size: 1Gbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1.65V ~ 3.6V
Technology: FLASH - NOR
Memory Format: FLASH
Supplier Device Package: 56-TSOP
Write Cycle Time - Word, Page: 60ns
Memory Interface: Parallel
Access Time: 130 ns
Memory Organization: 128M x 8
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CP7935ATT
Hersteller: Infineon Technologies
Description: INFINEON
Packaging: Bulk
Produkt ist nicht verfügbar
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CP7936ATT
Hersteller: Infineon Technologies
Description: INFINEON
Packaging: Bulk
Produkt ist nicht verfügbar
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TLE42742DV50NTMA1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: IC REG LINEAR 5V 400MA
Packaging: Bulk
Output Type: Fixed
Current - Output: 400mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Voltage - Output (Min/Fixed): 5V
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.5V @ 250mA
Protection Features: Over Current, Over Temperature, Reverse Polarity, Short Circuit
Current - Supply (Max): 30 mA
Produkt ist nicht verfügbar
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TLE4274GV85ATMA1 TLE4274_v1.7_01-20-11.pdf
TLE4274GV85ATMA1
Hersteller: Infineon Technologies
Description: IC REG LIN 8.5V 400MA TO263-3-1
Packaging: Tape & Reel (TR)
Package / Case: TO-263-4, D2PAK (3 Leads + Tab), TO-263AA
Output Type: Fixed
Mounting Type: Surface Mount
Current - Output: 400mA
Operating Temperature: -40°C ~ 150°C (TJ)
Output Configuration: Positive
Current - Quiescent (Iq): 220 µA
Voltage - Input (Max): 40V
Number of Regulators: 1
Supplier Device Package: PG-TO263-3-1
Voltage - Output (Min/Fixed): 8.5V
PSRR: 60dB (100Hz)
Voltage Dropout (Max): 0.5V @ 250mA
Protection Features: Over Current, Over Temperature, Reverse Polarity, Short Circuit
Current - Supply (Max): 30 mA
Grade: Automotive
Qualification: AEC-Q100
Produkt ist nicht verfügbar
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DF75R12W1H4FB11BOMA1 DF75R12W1H4F_B11_Rev3.0_2013-11-25.pdf
Hersteller: Infineon Technologies
Description: MOD DIODE BRIDGE EASY1B-2-1
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Diode Type: Single Phase
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: Standard
Voltage - Peak Reverse (Max): 1.2 kV
Current - Average Rectified (Io): 50 A
Voltage - Forward (Vf) (Max) @ If: 800 mV @ 50 A
Current - Reverse Leakage @ Vr: 100 µA @ 1200 V
Produkt ist nicht verfügbar
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6MS16017P43W40383NOSA1 Infineon-6MS16017P43W40383-DS-v02_00-EN.pdf?fileId=5546d462525dbac40152cace93b1645b
6MS16017P43W40383NOSA1
Hersteller: Infineon Technologies
Description: IGBT MODULE 1700V 880A
Packaging: Bulk
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -25°C ~ 55°C
NTC Thermistor: Yes
Supplier Device Package: Module
Voltage - Collector Emitter Breakdown (Max): 1700 V
Produkt ist nicht verfügbar
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CY8C3666AXI-052T #!?fileId=8ac78c8c7d0d8da4017d0ec73d263e88
CY8C3666AXI-052T
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 64KB FLASH 100TQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 8051
Data Converters: A/D 16x12b; D/A 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: CapSense, DMA, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 62
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1500+15.88 EUR
Mindestbestellmenge: 1500
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CY8C3666AXI-052T #!?fileId=8ac78c8c7d0d8da4017d0ec73d263e88
CY8C3666AXI-052T
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 64KB FLASH 100TQFP
Packaging: Cut Tape (CT)
Package / Case: 100-LQFP
Mounting Type: Surface Mount
Speed: 67MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 8K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
EEPROM Size: 2K x 8
Core Processor: 8051
Data Converters: A/D 16x12b; D/A 4x8b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 1.71V ~ 5.5V
Connectivity: EBI/EMI, I2C, LINbus, SPI, UART/USART
Peripherals: CapSense, DMA, POR, PWM, WDT
Supplier Device Package: 100-TQFP (14x14)
Number of I/O: 62
DigiKey Programmable: Not Verified
auf Bestellung 1500 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+25.08 EUR
10+23.05 EUR
25+22.09 EUR
100+19.47 EUR
250+18.51 EUR
500+17.32 EUR
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315-0649-000AAA
Hersteller: Infineon Technologies
Description: INFINEON
Packaging: Bulk
Produkt ist nicht verfügbar
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XC2263M72F80LRABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16/32B 576KB FLSH 100LQFP
Packaging: Tape & Reel (TR)
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 576KB (576K x 8)
RAM Size: 50K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: C166SV2
Data Converters: A/D 16x10b
Core Size: 16/32-Bit
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Connectivity: CANbus, EBI/EMI, I²C, LINbus, SPI, SSC, UART/USART, USI
Peripherals: I²S, POR, PWM, WDT
Supplier Device Package: PG-LQFP-100-8
Number of I/O: 76
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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FD600R06ME3S2BOSA1 Infineon-FD600R06ME3_S2-DS-v02_04-en_de.pdf?fileId=db3a30431a5c32f2011aa4c3b2034d8c
FD600R06ME3S2BOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 600V 600A 2250W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Single
Operating Temperature: -40°C ~ 125°C
Vce(on) (Max) @ Vge, Ic: 1.6V @ 15V, 600A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 600 A
Voltage - Collector Emitter Breakdown (Max): 600 V
Power - Max: 2250 W
Current - Collector Cutoff (Max): 400 nA
Input Capacitance (Cies) @ Vce: 60 nF @ 25 V
Produkt ist nicht verfügbar
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1EDI302XASEVALBOARDTOBO1 Infineon-Z8F80037256-1EDI302xAS_1EDI303xAS-evaluation-board-UserManual-v01_00-EN.pdf?fileId=5546d462773f932401774914b0c60e9e
1EDI302XASEVALBOARDTOBO1
Hersteller: Infineon Technologies
Description: 1EDI302XAS EVALBOARD
Packaging: Bulk
Function: Gate Driver
Type: Power Management
Utilized IC / Part: 1EDI302xAS
Supplied Contents: Board(s)
Primary Attributes: Isolated
Embedded: No
auf Bestellung 3 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+234.64 EUR
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BLDCSHIELDTLE956XTOBO1 Infineon-BLDC_Shield_TLE956x-UserManual-v01_00-EN.pdf?fileId=5546d46272e49d2a0173240cd6a32199
BLDCSHIELDTLE956XTOBO1
Hersteller: Infineon Technologies
Description: BLDC SHIELD_TLE956X
Packaging: Bulk
Function: Motor Controller/Driver
Type: Power Management
Contents: Board(s)
Utilized IC / Part: TLE9563-3QX
Platform: Arduino
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+84.6 EUR
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2DIB1411FXUMA1 Infineon-2DIBx41xF-DS_v01_00-EN.pdf-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c872bd8d60187370abe7d246c
2DIB1411FXUMA1
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Tape & Reel (TR)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: General Purpose
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 3000Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-82
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: No
Channel Type: Unidirectional
Pulse Width Distortion (Max): 4ns
Number of Channels: 2
auf Bestellung 5000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2500+0.79 EUR
5000+0.75 EUR
Mindestbestellmenge: 2500
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2DIB1411FXUMA1 Infineon-2DIBx41xF-DS_v01_00-EN.pdf-DataSheet-v01_00-EN.pdf?fileId=8ac78c8c872bd8d60187370abe7d246c
2DIB1411FXUMA1
Hersteller: Infineon Technologies
Description: DIGITAL ISOLATORS
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Type: General Purpose
Operating Temperature: -40°C ~ 150°C
Voltage - Supply: 2.7V ~ 6.5V
Data Rate: 40Mbps
Technology: Capacitive Coupling
Voltage - Isolation: 3000Vrms
Inputs - Side 1/Side 2: 1/1
Supplier Device Package: PG-DSO-8-82
Rise / Fall Time (Typ): 4ns, 4ns (Max)
Common Mode Transient Immunity (Min): 100kV/µs
Propagation Delay tpLH / tpHL (Max): 33ns, 33ns
Isolated Power: No
Channel Type: Unidirectional
Pulse Width Distortion (Max): 4ns
Number of Channels: 2
auf Bestellung 5388 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
8+2.46 EUR
12+1.56 EUR
100+1.09 EUR
500+0.91 EUR
1000+0.85 EUR
Mindestbestellmenge: 8
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IRGP4790-EPBF IRGP4790%28-E%29PbF.pdf
IRGP4790-EPBF
Hersteller: Infineon Technologies
Description: IGBT 650V 140A TO-247AD
Packaging: Tube
Package / Case: TO-247-3
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 175°C (TJ)
Input Type: Standard
Vce(on) (Max) @ Vge, Ic: 2V @ 15V, 75A
Supplier Device Package: TO-247AD
Td (on/off) @ 25°C: 50ns/200ns
Switching Energy: 2.5mJ (on), 2.2mJ (off)
Test Condition: 400V, 75A, 10Ohm, 15V
Gate Charge: 210 nC
Current - Collector (Ic) (Max): 140 A
Voltage - Collector Emitter Breakdown (Max): 650 V
Current - Collector Pulsed (Icm): 225 A
Power - Max: 455 W
Produkt ist nicht verfügbar
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IGI60F140A1LAUMA1
IGI60F140A1LAUMA1
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 1A 21TIQFN
Packaging: Tape & Reel (TR)
Package / Case: 21-TQFN Exposed Pad
Mounting Type: Surface Mount
Output Configuration: Half Bridge
Rds On (Typ): 140mOhm
Applications: General Purpose
Current - Output / Channel: 1A
Technology: Power MOSFET
Supplier Device Package: PG-TIQFN-21-1
Load Type: Inductive, Capacitive, Resistive
Produkt ist nicht verfügbar
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IGI60F140A1LAUMA1
IGI60F140A1LAUMA1
Hersteller: Infineon Technologies
Description: IC HALF BRIDGE DRIVER 1A 21TIQFN
Packaging: Cut Tape (CT)
Package / Case: 21-TQFN Exposed Pad
Mounting Type: Surface Mount
Output Configuration: Half Bridge
Rds On (Typ): 140mOhm
Applications: General Purpose
Current - Output / Channel: 1A
Technology: Power MOSFET
Supplier Device Package: PG-TIQFN-21-1
Load Type: Inductive, Capacitive, Resistive
Produkt ist nicht verfügbar
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S6J328CKSPSE20000 Infineon-S6J3200_Series_32-bit_Microcontroller_TRAVEO_T1G_Family-AdditionalTechnicalInformation-v18_00-EN.PDF?fileId=8ac78c8c7d0d8da4017d0ee0c1436670&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_int
S6J328CKSPSE20000
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2.0625MB 208TEQFP
Packaging: Tray
Package / Case: 208-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 240MHz
Program Memory Size: 2.0625MB (2.0625M x 8)
RAM Size: 256K x 8
Operating Temperature: -40°C ~ 105°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: Arm® Cortex®-R5F
Data Converters: A/D 46x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 4.5V ~ 5.5V
Connectivity: CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART
Peripherals: DMA, I2S, LVD, POR, PWM, WDT
Supplier Device Package: 208-TEQFP (28x28)
Number of I/O: 120
DigiKey Programmable: Not Verified
auf Bestellung 360 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
1+46.27 EUR
10+37.58 EUR
36+34.69 EUR
108+33.78 EUR
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IPT65R080CFD7XTMA1 Infineon-IPT65R080CFD7-DataSheet-v02_00-EN.pdf?fileId=8ac78c8c85ecb347018678d11e89546f
IPT65R080CFD7XTMA1
Hersteller: Infineon Technologies
Description: HIGH POWER_NEW
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Supplier Device Package: PG-HSOF-8-3
Drain to Source Voltage (Vdss): 650 V
auf Bestellung 2000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+9.73 EUR
10+6.56 EUR
100+4.74 EUR
500+4.64 EUR
Mindestbestellmenge: 2
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IPT65R040CFD7XTMA1 Infineon-IPT65R040CFD7-DataSheet-v02_01-EN.pdf?fileId=8ac78c8c85ecb347018678c6ae2a5377
IPT65R040CFD7XTMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 8HSOF
Packaging: Cut Tape (CT)
Package / Case: 8-PowerSFN
Mounting Type: Surface Mount
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Supplier Device Package: PG-HSOF-8-2
Drain to Source Voltage (Vdss): 650 V
auf Bestellung 1998 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+14.56 EUR
10+10.02 EUR
100+7.93 EUR
Mindestbestellmenge: 2
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CYW4319GKUBGT ?utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU WIFI 138UFBGA
Packaging: Tape & Reel (TR)
Package / Case: 138-UFBGA, WLBGA
Sensitivity: -94dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz, 5GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Power - Output: 20dBm
Protocol: 802.11a/b/g/n
Data Rate (Max): 54Mbps
Supplier Device Package: 138-WLBGA (5.74x4.53)
GPIO: 8
Modulation: 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK
RF Family/Standard: WiFi
Serial Interfaces: SPI, UART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW20734UA1KFFB3GT download
CYW20734UA1KFFB3GT
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 90FBGA
Packaging: Tape & Reel (TR)
Package / Case: 90-TFBGA
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.3V
Power - Output: 12dBm
Protocol: Bluetooth v4.1
Current - Receiving: 26mA
Data Rate (Max): 2Mbps
Current - Transmitting: 60mA
Supplier Device Package: 90-FBGA (8.5x8.5)
GPIO: 40
Modulation: 8DPSK, DQPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, I2S, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW20734UA1KFFB3GT download
CYW20734UA1KFFB3GT
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 90FBGA
Packaging: Cut Tape (CT)
Package / Case: 90-TFBGA
Sensitivity: -96.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -40°C ~ 125°C
Voltage - Supply: 3.3V
Power - Output: 12dBm
Protocol: Bluetooth v4.1
Current - Receiving: 26mA
Data Rate (Max): 2Mbps
Current - Transmitting: 60mA
Supplier Device Package: 90-FBGA (8.5x8.5)
GPIO: 40
Modulation: 8DPSK, DQPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, I2S, SPI, UART
DigiKey Programmable: Not Verified
auf Bestellung 1745 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
2+10.81 EUR
10+9.38 EUR
25+8.87 EUR
100+8.18 EUR
250+7.77 EUR
500+7.48 EUR
1000+7.2 EUR
Mindestbestellmenge: 2
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CYW20736A1KWBGT CYW20736A1KWBGT_Web.pdf
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLUETOOTH
Packaging: Tape & Reel (TR)
Package / Case: 80-XFBGA, WLCSP
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.4V ~ 3.6V
Protocol: Bluetooth v4.1
Supplier Device Package: 80-WLCSP (2.2x2.2)
GPIO: 14
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW20738A2KML3GT Infineon-CYW20738_Single_Chip_Bluetooth_Transceiver_for_Wireless_Input_Devices_Datasheet-AdditionalTechnicalInformation-v05_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee210a6685d&utm_source=cypress&utm_medium=referral&utm_campaign
CYW20738A2KML3GT
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLUETOOTH 40VFQFN
Packaging: Tape & Reel (TR)
Package / Case: 40-VFQFN Exposed Pad
Sensitivity: -93dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Memory Size: 320kB ROM, 60kB RAM
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3.8V
Power - Output: 4dBm
Protocol: Bluetooth v4.0
Current - Receiving: 27mA
Data Rate (Max): 1Mbps
Current - Transmitting: 27mA
Supplier Device Package: 40-QFN (6x6)
GPIO: 22
Modulation: DPSK, DQPSK, GFSK, GMSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW20733A3KFB1G CYW20733_RevS_11-9-17.pdf
CYW20733A3KFB1G
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 81FBGA
Packaging: Tray
Package / Case: 81-TFBGA
Sensitivity: -85dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: 0°C ~ 70°C
Voltage - Supply: 3V
Power - Output: 10dBm
Protocol: Bluetooth v3.0 +EDR
Current - Receiving: 28mA
Data Rate (Max): 3Mbps
Current - Transmitting: 63mA
Supplier Device Package: 81-FBGA (8x8)
GPIO: 40
Modulation: 4DQPSK, 8DPSK, GFSK
RF Family/Standard: Bluetooth
Serial Interfaces: I2C, SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW20705A1KWFBGT Infineon-CYW20705_Single_Chip_Bluetooth_Transceiver_and_Baseband_Processor_Datasheet-AdditionalTechnicalInformation-v07_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee20183683a&utm_source=cypress&utm_medium=referral&utm_campaign=202
CYW20705A1KWFBGT
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLE 50WFBGA
Packaging: Tape & Reel (TR)
Package / Case: 50-WFBGA
Sensitivity: -91dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 5.5V
Power - Output: 10dBm
Protocol: Bluetooth v4.1
Current - Receiving: 31mA
Data Rate (Max): 3Mbps
Current - Transmitting: 65mA
Supplier Device Package: 50-WFBGA (4.5x4)
GPIO: 8
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART, USB
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CYW20704UA1KFFB1G Infineon-CYW20704_Single-Chip_Bluetooth_Transceiver_and_Baseband_Processor_Datasheet-AdditionalTechnicalInformation-v08_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ee1e9f96802&utm_source=cypress&utm_medium=referral&utm_campaign=202
CYW20704UA1KFFB1G
Hersteller: Infineon Technologies
Description: IC RF TXRX+MCU BLUETOOTH 49VFBGA
Packaging: Tray
Package / Case: 49-VFBGA, FCBGA
Sensitivity: -95.5dBm
Mounting Type: Surface Mount
Frequency: 2.4GHz
Type: TxRx + MCU
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 3.3V
Power - Output: 12dBm
Protocol: Bluetooth v4.1
Data Rate (Max): 2Mbps
Supplier Device Package: 49-FCBGA (4.5x4)
GPIO: 8
RF Family/Standard: Bluetooth
Serial Interfaces: SPI, UART
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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CY9BF506RBPMC-G-UNE1
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Packaging: Tray
Package / Case: 120-LQFP
Mounting Type: Surface Mount
Speed: 80MHz
Program Memory Size: 512KB (512K x 8)
RAM Size: 64K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 16x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 2.7V ~ 5.5V
Connectivity: CANbus, CSIO, EBI/EMI, I²C, LINbus, UART/USART, USB
Peripherals: DMA, LVD, POR, PWM, WDT
Supplier Device Package: 120-LQFP (16x16)
Number of I/O: 100
Produkt ist nicht verfügbar
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S25FL064P0XBHI020 Infineon-S25FL064P_64-Mbit_3.0_V_SPI_Flash_Memory-DataSheet-v11_00-EN.pdf?fileId=8ac78c8c7d0d8da4017d0ed4dcb1535c&utm_source=cypress&utm_medium=referral&utm_campaign=202110_globe_en_all_integration-files
S25FL064P0XBHI020
Hersteller: Infineon Technologies
Description: IC FLASH 64MBIT SPI/QUAD 24BGA
Packaging: Tray
Package / Case: 24-TBGA
Mounting Type: Surface Mount
Memory Size: 64Mbit
Memory Type: Non-Volatile
Operating Temperature: -40°C ~ 85°C (TA)
Voltage - Supply: 2.7V ~ 3.6V
Technology: FLASH - NOR
Clock Frequency: 104 MHz
Memory Format: FLASH
Supplier Device Package: 24-BGA (8x6)
Write Cycle Time - Word, Page: 5µs, 3ms
Memory Interface: SPI - Quad I/O
Memory Organization: 8M x 8
DigiKey Programmable: Not Verified
auf Bestellung 25722 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
7+2.64 EUR
10+2.35 EUR
25+2.24 EUR
40+2.19 EUR
80+2.11 EUR
338+1.96 EUR
676+1.89 EUR
1014+1.85 EUR
5070+1.7 EUR
Mindestbestellmenge: 7
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PEB55508EV1.2
PEB55508EV1.2
Hersteller: Infineon Technologies
Description: GEMINAX MULTIPORT INTEGRATED ADS
Packaging: Bulk
auf Bestellung 1800 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
3+183.12 EUR
Mindestbestellmenge: 3
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S6E2005F0A10AR000H8SA1
Hersteller: Infineon Technologies
Description: MULTI-MARKET MCUS
Packaging: Tray
Produkt ist nicht verfügbar
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BSO110N03MSGXUMA1 BSO110N03MS_rev1.0.pdf?folderId=db3a304313d846880113d91d60c500c4&fileId=db3a30431b0626df011b0d7412447e2b
BSO110N03MSGXUMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 30V 10A 8DSO
Packaging: Cut Tape (CT)
Package / Case: 8-SOIC (0.154", 3.90mm Width)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 10A (Ta)
Rds On (Max) @ Id, Vgs: 11mOhm @ 12.1A, 10V
Power Dissipation (Max): 1.56W (Ta)
Vgs(th) (Max) @ Id: 2V @ 250µA
Supplier Device Package: PG-DSO-8
Drive Voltage (Max Rds On, Min Rds On): 4.5V, 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 30 V
Gate Charge (Qg) (Max) @ Vgs: 20 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 1500 pF @ 15 V
auf Bestellung 791 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl Preis
13+1.46 EUR
17+1.05 EUR
100+0.71 EUR
500+0.56 EUR
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2EDN7433BXTSA1
Hersteller: Infineon Technologies
Description: DRIVER IC PG-SOT23-6
Packaging: Tape & Reel (TR)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Inverting
Supplier Device Package: PG-SOT23-6-3
Rise / Fall Time (Typ): 8.6ns, 6ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.4V, 1.9V
Current - Peak Output (Source, Sink): 5A, 5A
Produkt ist nicht verfügbar
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2EDN7433BXTSA1
Hersteller: Infineon Technologies
Description: DRIVER IC PG-SOT23-6
Packaging: Cut Tape (CT)
Package / Case: SOT-23-6
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Voltage - Supply: 4.5V ~ 20V
Input Type: Inverting
Supplier Device Package: PG-SOT23-6-3
Rise / Fall Time (Typ): 8.6ns, 6ns
Channel Type: Independent
Driven Configuration: Low-Side
Number of Drivers: 2
Gate Type: N-Channel MOSFET
Logic Voltage - VIL, VIH: 1.4V, 1.9V
Current - Peak Output (Source, Sink): 5A, 5A
Produkt ist nicht verfügbar
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TD500N12KOFHPSA2 Infineon-TT500N-DS-v03_04-EN.pdf?fileId=db3a30434486a89301448d34d0f7790d
TD500N12KOFHPSA2
Hersteller: Infineon Technologies
Description: SCR MODULE 1800V 900A MODULE
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Operating Temperature: -40°C ~ 125°C
Structure: Series Connection - SCR/Diode
Current - Hold (Ih) (Max): 300 mA
Current - Gate Trigger (Igt) (Max): 250 mA
Current - Non Rep. Surge 50, 60Hz (Itsm): 17000A @ 50Hz
Number of SCRs, Diodes: 1 SCR, 1 Diode
Current - On State (It (AV)) (Max): 500 A
Voltage - Gate Trigger (Vgt) (Max): 2.2 V
Current - On State (It (RMS)) (Max): 900 A
Voltage - Off State: 1.8 kV
Produkt ist nicht verfügbar
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FS100R12KT4GB11BOSA1 Infineon-FS100R12KT4G_B11-DS-v02_00-en_de.pdf?fileId=db3a3043156fd5730116191497ce1c8e
FS100R12KT4GB11BOSA1
Hersteller: Infineon Technologies
Description: IGBT MOD 1200V 100A 515W
Packaging: Tray
Package / Case: Module
Mounting Type: Chassis Mount
Input: Standard
Configuration: Three Phase Inverter
Operating Temperature: -40°C ~ 150°C
Vce(on) (Max) @ Vge, Ic: 2.2V @ 15V, 100A
NTC Thermistor: Yes
Supplier Device Package: Module
IGBT Type: Trench Field Stop
Current - Collector (Ic) (Max): 100 A
Voltage - Collector Emitter Breakdown (Max): 1200 V
Power - Max: 515 W
Current - Collector Cutoff (Max): 1 mA
Input Capacitance (Cies) @ Vce: 6.3 nF @ 25 V
Produkt ist nicht verfügbar
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PVA3054NSPBF pva30n.pdf?fileId=5546d462533600a4015356839c762923
PVA3054NSPBF
Hersteller: Infineon Technologies
Description: SSR RELAY SPST-NO 50MA 0-300V
Packaging: Tube
Package / Case: 8-SMD (0.300", 7.62mm), 4 Leads
Output Type: AC, DC
Mounting Type: Surface Mount
Voltage - Input: 1.2VDC
Circuit: SPST-NO (1 Form A)
Termination Style: Gull Wing
Load Current: 50 mA
Supplier Device Package: 8-SMD
Voltage - Load: 0 V ~ 300 V
On-State Resistance (Max): 160 Ohms
Operating Temperature: -40°C ~ 85°C
Approval Agency: UL
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