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XC2388E136F128LAAKXUMA1 Infineon Technologies XC2387E_88E_v1.3_2014-07.pdf Description: IC MCU 16/32BIT 1.06MB FLASH
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XE161FL20F66VAAKXUMA1 Infineon Technologies Infineon-XE161XL-DS-v01_02-en.pdf?fileId=db3a30432e398416012e4d83b78a5da5 Description: IC MCU 16BIT 160KB FLASH 48VQFN
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XE161HL20F66VAAKXUMA1 XE161HL20F66VAAKXUMA1 Infineon Technologies Product_Cat_3-10-14.pdf Description: IC MCU 16BIT 160KB FLASH 48VQFN
DigiKey Programmable: Not Verified
RAM Size: 12K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 33
Part Status: Discontinued at Digi-Key
Supplier Device Package: PG-VQFN-48-54
Peripherals: DMA, I²S, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
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XE162FL12F80LAAFXQSA1 Infineon Technologies XE162FL_HL_v1.2_2012-07.pdf Description: IC MCU 16BIT 96KB FLASH 64LQFP
Number of I/O: 48
Part Status: Obsolete
Supplier Device Package: PG-LQFP-64-22
Peripherals: DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SPI, SSC, UART/USART, USI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 19x12b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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XE162FL20F66LAAKXUMA1 Infineon Technologies XE162FL_HL_v1.2_2012-07.pdf Description: IC MCU 16BIT 160KB FLASH 64LQFP
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XE162FL20F80LAAFXQSA1 Infineon Technologies XE162FL_HL_v1.2_2012-07.pdf Description: IC MCU 16BIT 160KB FLASH 64LQFP
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XE162HL20F80LAAFXQSA1 Infineon Technologies XE162FL_HL_v1.2_2012-07.pdf Description: IC MCU 16BIT 160KB FLASH 64LQFP
Number of I/O: 48
Part Status: Obsolete
Supplier Device Package: PG-LQFP-64-22
Peripherals: DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SPI, SSC, UART/USART, USI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 19x12b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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TC1791N384F200EPABKXUMA1 TC1791N384F200EPABKXUMA1 Infineon Technologies Description: IC MCU 32BIT 3MB FLASH 292LFBGA
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TC1793F512F270EBABKXUMA1 TC1793F512F270EBABKXUMA1 Infineon Technologies Infineon-TC1793-DS-v01_02-en.pdf?fileId=db3a304333227b5e013368d702f5176b Description: IC MCU 32BIT 4MB FLASH 416BGA
DigiKey Programmable: Not Verified
Number of I/O: 221
Supplier Device Package: PG-BGA-416
Peripherals: DMA, POR, WDT
Connectivity: ASC, CANbus, EBI/EMI, FlexRay, MLI, MSC, SSC
Voltage - Supply (Vcc/Vdd): 1.17V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b, 44x12b
Core Processor: TriCore™
EEPROM Size: 192K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 288K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 270MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
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TC1796256F150EBEKXUMA2 TC1796256F150EBEKXUMA2 Infineon Technologies Infineon-SAK-TC1796-256F150E+BE-DS-v01_00-EN.pdf?fileId=5546d46249a28d750149a34e1f28045d Description: IC MCU 32BIT 2MB FLASH 416BGA
DigiKey Programmable: Not Verified
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Number of I/O: 123
Part Status: Obsolete
Supplier Device Package: PG-BGA-416
Peripherals: DMA, POR, WDT
Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Core Size: 32-Bit Single-Core
Data Converters: A/D 44x12b
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XC822MT1FRAAAFXUMA1 XC822MT1FRAAAFXUMA1 Infineon Technologies Product_Cat_3-10-14.pdf Description: IC MCU 8BIT 4KB FLASH
RAM Size: 512 x 8
Number of I/O: 13
Part Status: Discontinued at Digi-Key
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity: I²C, SSC, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Program Memory Size: 4KB (4K x 8)
Speed: 24MHz
Packaging: Tape & Reel (TR)
Operating Temperature: -40°C ~ 125°C (TA)
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XC886CM8FFA3V3ACKXUMA1 XC886CM8FFA3V3ACKXUMA1 Infineon Technologies Infineon-XC88XCLM-DS-v01_02-en.pdf?fileId=db3a304412b407950112b40c4a9e0afb Description: IC MCU 8BIT 32KB FLASH
Number of I/O: 34
Part Status: Discontinued at Digi-Key
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 140°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Packaging: Tape & Reel (TR)
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XC888CM8FFI3V3ACFXUMA1 Infineon Technologies Infineon-XC88XCLM-DS-v01_02-en.pdf?fileId=db3a304412b407950112b40c4a9e0afb Description: IC MCU 8BIT 32KB FLASH
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C505CA4EMCABXUMA1 C505CA4EMCABXUMA1 Infineon Technologies C505%28x%29_Dec2000.pdf Description: IC MCU 8BIT 32KB OTP 44MQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-44-2
Part Status: Obsolete
Number of I/O: 34
DigiKey Programmable: Not Verified
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C505CA4EMCAFXUMA1 C505CA4EMCAFXUMA1 Infineon Technologies C505%28x%29_Dec2000.pdf Description: IC MCU 8BIT 32KB OTP 44MQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-44-2
Part Status: Obsolete
Number of I/O: 34
DigiKey Programmable: Not Verified
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C505CA4EMCAKXQMA1 C505CA4EMCAKXQMA1 Infineon Technologies C505%28x%29_Dec2000.pdf Description: IC MCU 8BIT 32KB OTP 44MQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-44-2
Part Status: Obsolete
Number of I/O: 34
DigiKey Programmable: Not Verified
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C515C8EMCAFXUMA1 C515C8EMCAFXUMA1 Infineon Technologies C515C_Feb_2003.pdf Description: IC MCU 8BIT 64KB OTP 80MQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-80-7
Number of I/O: 49
DigiKey Programmable: Not Verified
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C505CALMCAFXUMA1 C505CALMCAFXUMA1 Infineon Technologies C505%28x%29_Dec2000.pdf Description: IC MCU 8BIT ROMLESS 44MQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-44-2
Part Status: Obsolete
Number of I/O: 34
DigiKey Programmable: Not Verified
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ICE3BR4765JZXKLA1 ICE3BR4765JZXKLA1 Infineon Technologies ICE3BR4765JZ_v2.1_Aug30_2011.pdf Description: IC OFFLINE SWITCH FLYBACK 7DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm), 7 Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 65kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 25V
Supplier Device Package: PG-DIP-7
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Not For New Designs
Power (Watts): 26 W
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ICE3RBR4765JGXUMA1 ICE3RBR4765JGXUMA1 Infineon Technologies fundamentals-of-power-semiconductors Description: IC OFFLINE SWITCH FLYBACK 12DSO
Duty Cycle: 75%
Operating Temperature: -40°C ~ 130°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Power (Watts): 24 W
Part Status: Active
Voltage - Start Up: 18 V
Fault Protection: Current Limiting, Open Loop, Over Load, Over Temperature, Over Voltage
Supplier Device Package: PG-DSO-12-19
Voltage - Supply (Vcc/Vdd): 10.5V ~ 25V
Topology: Flyback
Output Isolation: Isolated
Voltage - Breakdown: 650V
Internal Switch(s): Yes
Frequency - Switching: 65kHz
Packaging: Tape & Reel (TR)
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IDP23011XUMA1 Infineon Technologies Description: AC/DC DIGITAL PLATFORM
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IDP2302XUMA1 Infineon Technologies Description: AC/DC DIGITAL PLATFORM
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TLE8886TN2AKSA1 TLE8886TN2AKSA1 Infineon Technologies Description: ALTERNATOR_IC
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TLE8886TN2AKSA2 Infineon Technologies Description: ALTERNATOR_IC
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XMC1201T028F0032ABXUMA1 XMC1201T028F0032ABXUMA1 Infineon Technologies Infineon-xmc1200_AB-DataSheet-v01_09-EN.pdf?fileId=5546d4624a0bf290014a4bdaf60925b0 Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-16
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
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XMC4700F100K1536AAXQMA1 XMC4700F100K1536AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
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XMC4800E196F1024AAXQMA1 XMC4800E196F1024AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I²S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Number of I/O: 155
DigiKey Programmable: Not Verified
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XMC4800E196F1536AAXQMA1 XMC4800E196F1536AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
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XMC4800F100F1536AAXQMA1 XMC4800F100F1536AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
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XMC4800F100F2048AAXQMA1 XMC4800F100F2048AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 2MB FLASH 100LQFP
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XMC4800F100K1024AAXQMA1 XMC4800F100K1024AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
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XMC4800F100K1536AAXQMA1 XMC4800F100K1536AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
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XMC4800F144K1536AAXQMA1 XMC4800F144K1536AAXQMA1 Infineon Technologies Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3 Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
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SAE800GGEGXUMA1 Infineon Technologies Part_Number_Guide_Web.pdf Description: IC AUDIO AMPLIFIER INDUSTRIAL
Packaging: Tape & Reel (TR)
Part Status: Obsolete
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SP370251060XTMA3 Infineon Technologies Description: BOARD MOUNT PRESSURE SENSOR
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TLE7263EXUMA2 Infineon Technologies TLE7263E_Rev1.71_Dec2013.pdf Description: IC INTERFACE SPECIALIZED BODY
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Part Status: Obsolete
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BGS12PN10E6327XTSA1 BGS12PN10E6327XTSA1 Infineon Technologies Infineon-BGS12PN10-DS-v01_00-EN.pdf?fileId=5546d46256fb43b30157565d296541b1 Description: IC RF SWITCH SPDT 6GHZ TSNP10-1
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SPDT
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Insertion Loss: 0.6dB
Frequency Range: 500MHz ~ 6GHz
Test Frequency: 6GHz
Isolation: 20dB
Supplier Device Package: PG-TSNP-10-1
Part Status: Active
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BGS13PN10E6327XTSA1 BGS13PN10E6327XTSA1 Infineon Technologies fundamentals-of-power-semiconductors Description: IC RF SWITCH SP3T 6GHZ TSNP10-1
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP3T
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Insertion Loss: 1.5dB
Frequency Range: 500MHz ~ 6GHz
Test Frequency: 6GHz
Isolation: 17dB
Supplier Device Package: PG-TSNP-10-1
IIP3: 76dBm
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BGS14PN10E6327XTSA1 BGS14PN10E6327XTSA1 Infineon Technologies Infineon-BGS14PN10-DS-v01_03-EN.pdf?fileId=5546d46258dd266d0158debc894b0db1 Description: IC RF SWITCH SP4T 6GHZ TSNP10-1
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP4T
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Insertion Loss: 1.2dB
Frequency Range: 500MHz ~ 6GHz
Test Frequency: 6GHz
Isolation: 18dB
Supplier Device Package: PG-TSNP-10-1
IIP3: 73dBm
Part Status: Active
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BGSX210MA18E6327XTSA1 BGSX210MA18E6327XTSA1 Infineon Technologies Infineon-BGSX210MA18-DS-v03_01-EN.pdf?fileId=5546d4625696ed760156daf71d3876d5 Description: IC RF SWITCH 3.8GHZ ATSLP-18
Supplier Device Package: PG-ATSLP-18
Isolation: 39dB
Test Frequency: 2.5GHz ~ 2.7GHz
Frequency Range: 100MHz ~ 3.8GHz
Insertion Loss: 0.65dB
Voltage - Supply: 2.5V ~ 3.4V
Operating Temperature: -30°C ~ 85°C
RF Type: LTE
Mounting Type: Surface Mount
Package / Case: 18-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
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BGSX212MA18E6327XTSA1 BGSX212MA18E6327XTSA1 Infineon Technologies Infineon-BGSX212MA18-DS-v03_01-EN.pdf?fileId=5546d4625696ed760156daf72bf076d8 Description: IC RF SWITCH 3.8GHZ ATSLP-18
Packaging: Tape & Reel (TR)
Package / Case: 18-UFQFN Exposed Pad
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: LTE
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.4V
Insertion Loss: 0.9dB
Frequency Range: 100MHz ~ 3.8GHz
Test Frequency: 2.5GHz, 3.5GHz
Isolation: 39dB
Supplier Device Package: PG-ATSLP-18
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BGSX28MA18E6327XTSA1 BGSX28MA18E6327XTSA1 Infineon Technologies BGSX28MA18.pdf Description: IC RF SWITCH DP3T 3.8GHZ ATSLP18
Part Status: Obsolete
Supplier Device Package: PG-ATSLP-18
Isolation: 39dB
Test Frequency: 2.5GHz, 3.5GHz
Frequency Range: 100MHz ~ 3.8GHz
Insertion Loss: 0.9dB
Voltage - Supply: 2.5V ~ 3.4V
Operating Temperature: -30°C ~ 85°C
RF Type: LTE
Circuit: DP3T
Mounting Type: Surface Mount
Impedance: 50Ohm
Package / Case: 18-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPD50R280CEAUMA1 IPD50R280CEAUMA1 Infineon Technologies Infineon-IPD50R280CE-DS-v02_03-EN.pdf?fileId=db3a3043382e8373013850fd9c9b0fae Description: MOSFET N-CH 500V 13A TO252
Input Capacitance (Ciss) (Max) @ Vds: 773 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 32.6 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 13V
Part Status: Active
Supplier Device Package: PG-TO252-3
Vgs(th) (Max) @ Id: 3.5V @ 350µA
Power Dissipation (Max): 119W (Tc)
Rds On (Max) @ Id, Vgs: 280mOhm @ 4.2A, 13V
Current - Continuous Drain (Id) @ 25°C: 13A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
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IPD50R500CEAUMA1 IPD50R500CEAUMA1 Infineon Technologies dgdl?fileId=db3a3043382e83730138514ff7881004 Description: MOSFET N-CH 500V 7.6A TO252
Input Capacitance (Ciss) (Max) @ Vds: 433 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 18.7 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 13V
Part Status: Active
Supplier Device Package: PG-TO252-3
Vgs(th) (Max) @ Id: 3.5V @ 200µA
Power Dissipation (Max): 57W (Tc)
Rds On (Max) @ Id, Vgs: 500mOhm @ 2.3A, 13V
Current - Continuous Drain (Id) @ 25°C: 7.6A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
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IPD60R1K5CEAUMA1 IPD60R1K5CEAUMA1 Infineon Technologies Infineon-IPD60R1K5CE-DS-v02_00-EN.pdf?fileId=5546d46249be182c0149c7c89cc51e98 Description: MOSFET N-CH 600V 5A TO252
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5A (Tc)
Rds On (Max) @ Id, Vgs: 1.5Ohm @ 1.1A, 10V
Power Dissipation (Max): 49W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 90µA
Supplier Device Package: PG-TO252-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 9.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 100 V
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IPD60R400CEAUMA1 IPD60R400CEAUMA1 Infineon Technologies Infineon-IPD60R400CE-DS-v02_02-EN.pdf?fileId=5546d46249be182c0149c83667001f0c Description: MOSFET N-CH 600V 14.7A TO252
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14.7A (Tc)
Rds On (Max) @ Id, Vgs: 400mOhm @ 3.8A, 10V
Power Dissipation (Max): 112W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 300µA
Supplier Device Package: PG-TO252-2
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 700 pF @ 100 V
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IPN50R1K4CEATMA1 IPN50R1K4CEATMA1 Infineon Technologies Infineon-IPN50R1K4CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547ac894e25aa7 Description: MOSFET N-CH 500V 4.8A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 900mA, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 70µA
Supplier Device Package: PG-SOT223-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 8.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 178 pF @ 100 V
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IPN50R2K0CEATMA1 IPN50R2K0CEATMA1 Infineon Technologies Infineon-IPN50R2K0CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547ac89b1f5aaa Description: MOSFET N-CH 500V 3.6A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.6A (Tc)
Rds On (Max) @ Id, Vgs: 2Ohm @ 600mA, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 50µA
Supplier Device Package: PG-SOT223-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 124 pF @ 100 V
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IPN50R3K0CEATMA1 IPN50R3K0CEATMA1 Infineon Technologies Infineon-IPN50R3K0CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547adae0c05ad5 Description: MOSFET N-CH 500V 2.6A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 2.6A (Tc)
Rds On (Max) @ Id, Vgs: 3Ohm @ 400mA, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 30µA
Supplier Device Package: PG-SOT223-3
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 4.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 84 pF @ 100 V
Produkt ist nicht verfügbar
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IPN50R650CEATMA1 IPN50R650CEATMA1 Infineon Technologies Infineon-IPN50R650CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547adae9265ad8 Description: MOSFET N-CH 500V 9A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 9A (Tc)
Rds On (Max) @ Id, Vgs: 650mOhm @ 1.8A, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 150µA
Supplier Device Package: PG-SOT223-3
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 342 pF @ 100 V
Produkt ist nicht verfügbar
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IPN50R800CEATMA1 IPN50R800CEATMA1 Infineon Technologies Infineon-IPN50R800CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547ae426895b03 Description: MOSFET N-CH 500V 7.6A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.6A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 1.5A, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 130µA
Supplier Device Package: PG-SOT223
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 12.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V
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IPN50R950CEATMA1 IPN50R950CEATMA1 Infineon Technologies Infineon-IPN50R950CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547ae41e225b00 Description: MOSFET N-CH 500V 6.6A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.6A (Tc)
Rds On (Max) @ Id, Vgs: 950mOhm @ 1.2A, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 100µA
Supplier Device Package: PG-SOT223
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 10.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 231 pF @ 100 V
Produkt ist nicht verfügbar
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IPN60R1K0CEATMA1 IPN60R1K0CEATMA1 Infineon Technologies Infineon-IPN60R1K0CE-DS-v02_00-EN.pdf?fileId=5546d46253f6505701547aed24095b21 Description: MOSFET N-CH 600V 6.8A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.8A (Tc)
Rds On (Max) @ Id, Vgs: 1Ohm @ 1.5A, 10V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 130µA
Supplier Device Package: PG-SOT223-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V
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3000+0.45 EUR
9000+0.4 EUR
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IPN65R1K5CEATMA1 IPN65R1K5CEATMA1 Infineon Technologies Infineon-IPN65R1K5CE-DS-v02_00-EN.pdf?fileId=5546d46253f6505701547af6617b5b50 Description: MOSFET N-CH 650V 5.2A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.2A (Tc)
Rds On (Max) @ Id, Vgs: 1.5Ohm @ 1A, 10V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 100µA
Supplier Device Package: PG-SOT223
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 10.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 225 pF @ 100 V
Produkt ist nicht verfügbar
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IPS60R1K0CEAKMA1 Infineon Technologies Infineon-IPS60R1K0CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537a8c943d7224 Description: CONSUMER
Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Not For New Designs
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 130µA
Power Dissipation (Max): 61W (Tc)
Rds On (Max) @ Id, Vgs: 1Ohm @ 1.5A, 10V
Current - Continuous Drain (Id) @ 25°C: 6.8A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Produkt ist nicht verfügbar
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IPS60R2K1CEAKMA1 IPS60R2K1CEAKMA1 Infineon Technologies Infineon-IPS60R2K1CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537af0473b761e Description: CONSUMER
Input Capacitance (Ciss) (Max) @ Vds: 140 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 6.7 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 60µA
Power Dissipation (Max): 38W (Tc)
Rds On (Max) @ Id, Vgs: 2.1Ohm @ 760mA, 10V
Current - Continuous Drain (Id) @ 25°C: 3.7A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Produkt ist nicht verfügbar
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IPS60R400CEAKMA1 IPS60R400CEAKMA1 Infineon Technologies Infineon-IPA60R400CE-DS-v02_00-EN.pdf?fileId=5546d46249be182c0149c82d428e1f02 Description: CONSUMER
Input Capacitance (Ciss) (Max) @ Vds: 700 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 300µA
Power Dissipation (Max): 112W (Tc)
Rds On (Max) @ Id, Vgs: 400mOhm @ 3.8A, 10V
Current - Continuous Drain (Id) @ 25°C: 14.7A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Produkt ist nicht verfügbar
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IPS60R460CEAKMA1 IPS60R460CEAKMA1 Infineon Technologies Infineon-IPS60R460CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537ed5aa20222e Description: CONSUMER
Produkt ist nicht verfügbar
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IPS60R650CEAKMA1 IPS60R650CEAKMA1 Infineon Technologies Infineon-IPS60R650CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537f15f6c6228a Description: CONSUMER
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 440 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 20.5 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 200µA
Power Dissipation (Max): 82W (Tc)
Rds On (Max) @ Id, Vgs: 650mOhm @ 2.4A, 10V
Current - Continuous Drain (Id) @ 25°C: 9.9A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
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IPS60R800CEAKMA1 IPS60R800CEAKMA1 Infineon Technologies Infineon-IPS60R800CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537f7a45772590 Description: CONSUMER
Input Capacitance (Ciss) (Max) @ Vds: 373 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 17.2 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Not For New Designs
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 170µA
Power Dissipation (Max): 74W (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 2A, 10V
Current - Continuous Drain (Id) @ 25°C: 8.4A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Produkt ist nicht verfügbar
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XC2388E136F128LAAKXUMA1 XC2387E_88E_v1.3_2014-07.pdf
Hersteller: Infineon Technologies
Description: IC MCU 16/32BIT 1.06MB FLASH
Produkt ist nicht verfügbar
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XE161FL20F66VAAKXUMA1 Infineon-XE161XL-DS-v01_02-en.pdf?fileId=db3a30432e398416012e4d83b78a5da5
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 160KB FLASH 48VQFN
Produkt ist nicht verfügbar
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XE161HL20F66VAAKXUMA1 Product_Cat_3-10-14.pdf
XE161HL20F66VAAKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 160KB FLASH 48VQFN
DigiKey Programmable: Not Verified
RAM Size: 12K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 66MHz
Mounting Type: Surface Mount
Package / Case: 48-VFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Number of I/O: 33
Part Status: Discontinued at Digi-Key
Supplier Device Package: PG-VQFN-48-54
Peripherals: DMA, I²S, POR, PWM, WDT
Connectivity: I²C, LINbus, SPI, UART/USART
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 10x12b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 125°C (TA)
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XE162FL12F80LAAFXQSA1 XE162FL_HL_v1.2_2012-07.pdf
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 96KB FLASH 64LQFP
Number of I/O: 48
Part Status: Obsolete
Supplier Device Package: PG-LQFP-64-22
Peripherals: DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SPI, SSC, UART/USART, USI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 19x12b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 96KB (96K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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XE162FL20F66LAAKXUMA1 XE162FL_HL_v1.2_2012-07.pdf
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 160KB FLASH 64LQFP
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XE162FL20F80LAAFXQSA1 XE162FL_HL_v1.2_2012-07.pdf
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 160KB FLASH 64LQFP
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XE162HL20F80LAAFXQSA1 XE162FL_HL_v1.2_2012-07.pdf
Hersteller: Infineon Technologies
Description: IC MCU 16BIT 160KB FLASH 64LQFP
Number of I/O: 48
Part Status: Obsolete
Supplier Device Package: PG-LQFP-64-22
Peripherals: DMA, I²S, POR, PWM, WDT
Connectivity: CANbus, I²C, LINbus, SPI, SSC, UART/USART, USI
Voltage - Supply (Vcc/Vdd): 3V ~ 5.5V
Core Size: 16-Bit
Data Converters: A/D 19x12b
Core Processor: C166SV2
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 85°C (TA)
RAM Size: 12K x 8
Program Memory Size: 160KB (160K x 8)
Speed: 80MHz
Mounting Type: Surface Mount
Package / Case: 64-LQFP Exposed Pad
Packaging: Tray
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TC1791N384F200EPABKXUMA1
TC1791N384F200EPABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 3MB FLASH 292LFBGA
Produkt ist nicht verfügbar
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TC1793F512F270EBABKXUMA1 Infineon-TC1793-DS-v01_02-en.pdf?fileId=db3a304333227b5e013368d702f5176b
TC1793F512F270EBABKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 4MB FLASH 416BGA
DigiKey Programmable: Not Verified
Number of I/O: 221
Supplier Device Package: PG-BGA-416
Peripherals: DMA, POR, WDT
Connectivity: ASC, CANbus, EBI/EMI, FlexRay, MLI, MSC, SSC
Voltage - Supply (Vcc/Vdd): 1.17V ~ 3.63V
Core Size: 32-Bit Single-Core
Data Converters: A/D 8x10b, 44x12b
Core Processor: TriCore™
EEPROM Size: 192K x 8
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 288K x 8
Program Memory Size: 4MB (4M x 8)
Speed: 270MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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TC1796256F150EBEKXUMA2 Infineon-SAK-TC1796-256F150E+BE-DS-v01_00-EN.pdf?fileId=5546d46249a28d750149a34e1f28045d
TC1796256F150EBEKXUMA2
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 416BGA
DigiKey Programmable: Not Verified
Core Processor: TriCore™
Program Memory Type: FLASH
Oscillator Type: External
Operating Temperature: -40°C ~ 125°C (TA)
RAM Size: 256K x 8
Program Memory Size: 2MB (2M x 8)
Speed: 150MHz
Mounting Type: Surface Mount
Package / Case: 416-BGA
Packaging: Tape & Reel (TR)
Number of I/O: 123
Part Status: Obsolete
Supplier Device Package: PG-BGA-416
Peripherals: DMA, POR, WDT
Connectivity: ASC, CANbus, EBI/EMI, MLI, MSC, SSC
Voltage - Supply (Vcc/Vdd): 1.42V ~ 1.58V
Core Size: 32-Bit Single-Core
Data Converters: A/D 44x12b
Produkt ist nicht verfügbar
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XC822MT1FRAAAFXUMA1 Product_Cat_3-10-14.pdf
XC822MT1FRAAAFXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 4KB FLASH
RAM Size: 512 x 8
Number of I/O: 13
Part Status: Discontinued at Digi-Key
Peripherals: Brown-out Detect/Reset, LED, POR, PWM, WDT
Connectivity: I²C, SSC, UART/USART
Voltage - Supply (Vcc/Vdd): 2.5V ~ 5.5V
Core Size: 8-Bit
Data Converters: A/D 4x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Program Memory Size: 4KB (4K x 8)
Speed: 24MHz
Packaging: Tape & Reel (TR)
Operating Temperature: -40°C ~ 125°C (TA)
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XC886CM8FFA3V3ACKXUMA1 Infineon-XC88XCLM-DS-v01_02-en.pdf?fileId=db3a304412b407950112b40c4a9e0afb
XC886CM8FFA3V3ACKXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH
Number of I/O: 34
Part Status: Discontinued at Digi-Key
Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
Connectivity: CANbus, SSI, UART/USART
Voltage - Supply (Vcc/Vdd): 2.3V ~ 3.6V
Core Size: 8-Bit
Data Converters: A/D 8x10b
Core Processor: XC800
Program Memory Type: FLASH
Oscillator Type: Internal
Operating Temperature: -40°C ~ 140°C (TA)
RAM Size: 1.75K x 8
Program Memory Size: 32KB (32K x 8)
Speed: 24MHz
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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XC888CM8FFI3V3ACFXUMA1 Infineon-XC88XCLM-DS-v01_02-en.pdf?fileId=db3a304412b407950112b40c4a9e0afb
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB FLASH
Produkt ist nicht verfügbar
Mindestbestellmenge: 1900 Stücke
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C505CA4EMCABXUMA1 C505%28x%29_Dec2000.pdf
C505CA4EMCABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB OTP 44MQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: 0°C ~ 70°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-44-2
Part Status: Obsolete
Number of I/O: 34
DigiKey Programmable: Not Verified
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C505CA4EMCAFXUMA1 C505%28x%29_Dec2000.pdf
C505CA4EMCAFXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB OTP 44MQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-44-2
Part Status: Obsolete
Number of I/O: 34
DigiKey Programmable: Not Verified
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C505CA4EMCAKXQMA1 C505%28x%29_Dec2000.pdf
C505CA4EMCAKXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 32KB OTP 44MQFP
Packaging: Tray
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 20MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-44-2
Part Status: Obsolete
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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C515C8EMCAFXUMA1 C515C_Feb_2003.pdf
C515C8EMCAFXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT 64KB OTP 80MQFP
Packaging: Tape & Reel (TR)
Package / Case: 80-QFP
Mounting Type: Surface Mount
Speed: 10MHz
Program Memory Size: 64KB (64K x 8)
RAM Size: 2.5K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: OTP
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, SPI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-80-7
Number of I/O: 49
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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C505CALMCAFXUMA1 C505%28x%29_Dec2000.pdf
C505CALMCAFXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 8BIT ROMLESS 44MQFP
Packaging: Tape & Reel (TR)
Package / Case: 44-QFP
Mounting Type: Surface Mount
Speed: 20MHz
RAM Size: 1.25K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: ROMless
Core Processor: C500
Data Converters: A/D 8x10b
Core Size: 8-Bit
Voltage - Supply (Vcc/Vdd): 4.25V ~ 5.5V
Connectivity: CANbus, EBI/EMI, UART/USART
Peripherals: POR, PWM, WDT
Supplier Device Package: PG-MQFP-44-2
Part Status: Obsolete
Number of I/O: 34
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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ICE3BR4765JZXKLA1 ICE3BR4765JZ_v2.1_Aug30_2011.pdf
ICE3BR4765JZXKLA1
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 7DIP
Packaging: Tube
Package / Case: 8-DIP (0.300", 7.62mm), 7 Leads
Mounting Type: Through Hole
Operating Temperature: -40°C ~ 150°C (TJ)
Duty Cycle: 75%
Frequency - Switching: 65kHz
Internal Switch(s): Yes
Voltage - Breakdown: 650V
Output Isolation: Isolated
Topology: Flyback
Voltage - Supply (Vcc/Vdd): 10.5V ~ 25V
Supplier Device Package: PG-DIP-7
Fault Protection: Current Limiting, Over Load, Over Temperature, Over Voltage
Voltage - Start Up: 18 V
Part Status: Not For New Designs
Power (Watts): 26 W
Produkt ist nicht verfügbar
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ICE3RBR4765JGXUMA1 fundamentals-of-power-semiconductors
ICE3RBR4765JGXUMA1
Hersteller: Infineon Technologies
Description: IC OFFLINE SWITCH FLYBACK 12DSO
Duty Cycle: 75%
Operating Temperature: -40°C ~ 130°C (TJ)
Mounting Type: Surface Mount
Package / Case: 16-SOIC (0.154", 3.90mm Width), 12 Leads
Power (Watts): 24 W
Part Status: Active
Voltage - Start Up: 18 V
Fault Protection: Current Limiting, Open Loop, Over Load, Over Temperature, Over Voltage
Supplier Device Package: PG-DSO-12-19
Voltage - Supply (Vcc/Vdd): 10.5V ~ 25V
Topology: Flyback
Output Isolation: Isolated
Voltage - Breakdown: 650V
Internal Switch(s): Yes
Frequency - Switching: 65kHz
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IDP23011XUMA1
Hersteller: Infineon Technologies
Description: AC/DC DIGITAL PLATFORM
Produkt ist nicht verfügbar
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IDP2302XUMA1
Hersteller: Infineon Technologies
Description: AC/DC DIGITAL PLATFORM
Produkt ist nicht verfügbar
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TLE8886TN2AKSA1
TLE8886TN2AKSA1
Hersteller: Infineon Technologies
Description: ALTERNATOR_IC
Produkt ist nicht verfügbar
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TLE8886TN2AKSA2
Hersteller: Infineon Technologies
Description: ALTERNATOR_IC
Produkt ist nicht verfügbar
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XMC1201T028F0032ABXUMA1 Infineon-xmc1200_AB-DataSheet-v01_09-EN.pdf?fileId=5546d4624a0bf290014a4bdaf60925b0
XMC1201T028F0032ABXUMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 32KB FLASH 28TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 28-TSSOP (0.173", 4.40mm Width)
Mounting Type: Surface Mount
Speed: 32MHz
Program Memory Size: 32KB (32K x 8)
RAM Size: 16K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M0
Data Converters: A/D 14x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 1.8V ~ 5.5V
Connectivity: I2C, LINbus, SPI, UART/USART
Peripherals: Brown-out Detect/Reset, I2S, POR, PWM, WDT
Supplier Device Package: PG-TSSOP-28-16
Part Status: Active
Number of I/O: 20
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC4700F100K1536AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4700F100K1536AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
auf Bestellung 862 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+36.74 EUR
10+29.26 EUR
90+25.45 EUR
180+24.67 EUR
540+23.7 EUR
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XMC4800E196F1024AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800E196F1024AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I²S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Number of I/O: 155
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
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XMC4800E196F1536AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800E196F1536AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLSH 196LFBGA
Packaging: Tray
Package / Case: 196-LFBGA
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1.5MB (1.5M x 8)
RAM Size: 276K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 32x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LFBGA-196-2
Part Status: Active
Number of I/O: 155
DigiKey Programmable: Not Verified
auf Bestellung 252 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+42.16 EUR
10+33.76 EUR
25+31.67 EUR
189+28.56 EUR
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XMC4800F100F1536AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800F100F1536AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Produkt ist nicht verfügbar
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XMC4800F100F2048AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800F100F2048AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 2MB FLASH 100LQFP
Produkt ist nicht verfügbar
Mindestbestellmenge: 540 Stücke
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XMC4800F100K1024AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800F100K1024AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1MB FLASH 100LQFP
Packaging: Tray
Package / Case: 100-LQFP Exposed Pad
Mounting Type: Surface Mount
Speed: 144MHz
Program Memory Size: 1MB (1M x 8)
RAM Size: 200K x 8
Operating Temperature: -40°C ~ 125°C (TA)
Oscillator Type: External
Program Memory Type: FLASH
Core Processor: ARM® Cortex®-M4
Data Converters: A/D 24x12b; D/A 2x12b
Core Size: 32-Bit
Voltage - Supply (Vcc/Vdd): 3.13V ~ 3.63V
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, LINbus, MMC/SD, SPI, UART/USART, USB OTG, USIC
Peripherals: DMA, I2S, LED, POR, Touch-Sense, WDT
Supplier Device Package: PG-LQFP-100-25
Part Status: Active
Number of I/O: 75
DigiKey Programmable: Not Verified
auf Bestellung 536 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+41.09 EUR
10+32.87 EUR
90+28.69 EUR
180+27.82 EUR
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XMC4800F100K1536AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800F100K1536AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 100LQFP
Produkt ist nicht verfügbar
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XMC4800F144K1536AAXQMA1 Infineon-XMC4700-XMC4800-DS-v01_00-EN.pdf?fileId=5546d462518ffd850151908ea8db00b3
XMC4800F144K1536AAXQMA1
Hersteller: Infineon Technologies
Description: IC MCU 32BIT 1.5MB FLASH 144LQFP
Produkt ist nicht verfügbar
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SAE800GGEGXUMA1 Part_Number_Guide_Web.pdf
Hersteller: Infineon Technologies
Description: IC AUDIO AMPLIFIER INDUSTRIAL
Packaging: Tape & Reel (TR)
Part Status: Obsolete
Produkt ist nicht verfügbar
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SP370251060XTMA3
Hersteller: Infineon Technologies
Description: BOARD MOUNT PRESSURE SENSOR
Produkt ist nicht verfügbar
Mindestbestellmenge: 1000 Stücke
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TLE7263EXUMA2 TLE7263E_Rev1.71_Dec2013.pdf
Hersteller: Infineon Technologies
Description: IC INTERFACE SPECIALIZED BODY
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Part Status: Obsolete
Produkt ist nicht verfügbar
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BGS12PN10E6327XTSA1 Infineon-BGS12PN10-DS-v01_00-EN.pdf?fileId=5546d46256fb43b30157565d296541b1
BGS12PN10E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH SPDT 6GHZ TSNP10-1
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SPDT
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Insertion Loss: 0.6dB
Frequency Range: 500MHz ~ 6GHz
Test Frequency: 6GHz
Isolation: 20dB
Supplier Device Package: PG-TSNP-10-1
Part Status: Active
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7500+0.46 EUR
Mindestbestellmenge: 7500 Stücke
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BGS13PN10E6327XTSA1 fundamentals-of-power-semiconductors
BGS13PN10E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH SP3T 6GHZ TSNP10-1
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP3T
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Insertion Loss: 1.5dB
Frequency Range: 500MHz ~ 6GHz
Test Frequency: 6GHz
Isolation: 17dB
Supplier Device Package: PG-TSNP-10-1
IIP3: 76dBm
Produkt ist nicht verfügbar
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BGS14PN10E6327XTSA1 Infineon-BGS14PN10-DS-v01_03-EN.pdf?fileId=5546d46258dd266d0158debc894b0db1
BGS14PN10E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH SP4T 6GHZ TSNP10-1
Packaging: Tape & Reel (TR)
Package / Case: 10-XFQFN
Impedance: 50Ohm
Mounting Type: Surface Mount
Circuit: SP4T
Operating Temperature: -40°C ~ 85°C
Voltage - Supply: 1.8V ~ 3.6V
Insertion Loss: 1.2dB
Frequency Range: 500MHz ~ 6GHz
Test Frequency: 6GHz
Isolation: 18dB
Supplier Device Package: PG-TSNP-10-1
IIP3: 73dBm
Part Status: Active
auf Bestellung 7500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
7500+0.58 EUR
Mindestbestellmenge: 7500 Stücke
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BGSX210MA18E6327XTSA1 Infineon-BGSX210MA18-DS-v03_01-EN.pdf?fileId=5546d4625696ed760156daf71d3876d5
BGSX210MA18E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH 3.8GHZ ATSLP-18
Supplier Device Package: PG-ATSLP-18
Isolation: 39dB
Test Frequency: 2.5GHz ~ 2.7GHz
Frequency Range: 100MHz ~ 3.8GHz
Insertion Loss: 0.65dB
Voltage - Supply: 2.5V ~ 3.4V
Operating Temperature: -30°C ~ 85°C
RF Type: LTE
Mounting Type: Surface Mount
Package / Case: 18-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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BGSX212MA18E6327XTSA1 Infineon-BGSX212MA18-DS-v03_01-EN.pdf?fileId=5546d4625696ed760156daf72bf076d8
BGSX212MA18E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH 3.8GHZ ATSLP-18
Packaging: Tape & Reel (TR)
Package / Case: 18-UFQFN Exposed Pad
Impedance: 50Ohm
Mounting Type: Surface Mount
RF Type: LTE
Operating Temperature: -30°C ~ 85°C
Voltage - Supply: 2.5V ~ 3.4V
Insertion Loss: 0.9dB
Frequency Range: 100MHz ~ 3.8GHz
Test Frequency: 2.5GHz, 3.5GHz
Isolation: 39dB
Supplier Device Package: PG-ATSLP-18
Produkt ist nicht verfügbar
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BGSX28MA18E6327XTSA1 BGSX28MA18.pdf
BGSX28MA18E6327XTSA1
Hersteller: Infineon Technologies
Description: IC RF SWITCH DP3T 3.8GHZ ATSLP18
Part Status: Obsolete
Supplier Device Package: PG-ATSLP-18
Isolation: 39dB
Test Frequency: 2.5GHz, 3.5GHz
Frequency Range: 100MHz ~ 3.8GHz
Insertion Loss: 0.9dB
Voltage - Supply: 2.5V ~ 3.4V
Operating Temperature: -30°C ~ 85°C
RF Type: LTE
Circuit: DP3T
Mounting Type: Surface Mount
Impedance: 50Ohm
Package / Case: 18-UFQFN Exposed Pad
Packaging: Tape & Reel (TR)
Produkt ist nicht verfügbar
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IPD50R280CEAUMA1 Infineon-IPD50R280CE-DS-v02_03-EN.pdf?fileId=db3a3043382e8373013850fd9c9b0fae
IPD50R280CEAUMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 13A TO252
Input Capacitance (Ciss) (Max) @ Vds: 773 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 32.6 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 13V
Part Status: Active
Supplier Device Package: PG-TO252-3
Vgs(th) (Max) @ Id: 3.5V @ 350µA
Power Dissipation (Max): 119W (Tc)
Rds On (Max) @ Id, Vgs: 280mOhm @ 4.2A, 13V
Current - Continuous Drain (Id) @ 25°C: 13A (Ta)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
auf Bestellung 2500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+0.92 EUR
Mindestbestellmenge: 2500 Stücke
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IPD50R500CEAUMA1 dgdl?fileId=db3a3043382e83730138514ff7881004
IPD50R500CEAUMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 7.6A TO252
Input Capacitance (Ciss) (Max) @ Vds: 433 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 18.7 nC @ 10 V
Drain to Source Voltage (Vdss): 500 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 13V
Part Status: Active
Supplier Device Package: PG-TO252-3
Vgs(th) (Max) @ Id: 3.5V @ 200µA
Power Dissipation (Max): 57W (Tc)
Rds On (Max) @ Id, Vgs: 500mOhm @ 2.3A, 13V
Current - Continuous Drain (Id) @ 25°C: 7.6A (Tc)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -55°C ~ 150°C (TJ)
Mounting Type: Surface Mount
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Packaging: Tape & Reel (TR)
auf Bestellung 17500 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+0.68 EUR
7500+0.61 EUR
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IPD60R1K5CEAUMA1 Infineon-IPD60R1K5CE-DS-v02_00-EN.pdf?fileId=5546d46249be182c0149c7c89cc51e98
IPD60R1K5CEAUMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 600V 5A TO252
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5A (Tc)
Rds On (Max) @ Id, Vgs: 1.5Ohm @ 1.1A, 10V
Power Dissipation (Max): 49W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 90µA
Supplier Device Package: PG-TO252-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 9.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 200 pF @ 100 V
auf Bestellung 75000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+0.48 EUR
7500+0.42 EUR
Mindestbestellmenge: 2500 Stücke
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IPD60R400CEAUMA1 Infineon-IPD60R400CE-DS-v02_02-EN.pdf?fileId=5546d46249be182c0149c83667001f0c
IPD60R400CEAUMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 600V 14.7A TO252
Packaging: Tape & Reel (TR)
Package / Case: TO-252-3, DPak (2 Leads + Tab), SC-63
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 14.7A (Tc)
Rds On (Max) @ Id, Vgs: 400mOhm @ 3.8A, 10V
Power Dissipation (Max): 112W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 300µA
Supplier Device Package: PG-TO252-2
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 700 pF @ 100 V
auf Bestellung 15000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
2500+0.86 EUR
5000+0.8 EUR
7500+0.76 EUR
12500+0.73 EUR
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IPN50R1K4CEATMA1 Infineon-IPN50R1K4CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547ac894e25aa7
IPN50R1K4CEATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 4.8A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 4.8A (Tc)
Rds On (Max) @ Id, Vgs: 1.4Ohm @ 900mA, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 70µA
Supplier Device Package: PG-SOT223-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 8.2 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 178 pF @ 100 V
auf Bestellung 6000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+0.37 EUR
6000+0.33 EUR
Mindestbestellmenge: 3000 Stücke
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IPN50R2K0CEATMA1 Infineon-IPN50R2K0CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547ac89b1f5aaa
IPN50R2K0CEATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 3.6A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 3.6A (Tc)
Rds On (Max) @ Id, Vgs: 2Ohm @ 600mA, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 50µA
Supplier Device Package: PG-SOT223-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 6 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 124 pF @ 100 V
auf Bestellung 3000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+0.31 EUR
Mindestbestellmenge: 3000 Stücke
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IPN50R3K0CEATMA1 Infineon-IPN50R3K0CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547adae0c05ad5
IPN50R3K0CEATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 2.6A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 2.6A (Tc)
Rds On (Max) @ Id, Vgs: 3Ohm @ 400mA, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 30µA
Supplier Device Package: PG-SOT223-3
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 4.3 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 84 pF @ 100 V
Produkt ist nicht verfügbar
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IPN50R650CEATMA1 Infineon-IPN50R650CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547adae9265ad8
IPN50R650CEATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 9A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 9A (Tc)
Rds On (Max) @ Id, Vgs: 650mOhm @ 1.8A, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 150µA
Supplier Device Package: PG-SOT223-3
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 15 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 342 pF @ 100 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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IPN50R800CEATMA1 Infineon-IPN50R800CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547ae426895b03
IPN50R800CEATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 7.6A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 7.6A (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 1.5A, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 130µA
Supplier Device Package: PG-SOT223
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 12.4 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V
Produkt ist nicht verfügbar
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IPN50R950CEATMA1 Infineon-IPN50R950CE-DS-v02_01-EN.pdf?fileId=5546d46253f6505701547ae41e225b00
IPN50R950CEATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 500V 6.6A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.6A (Tc)
Rds On (Max) @ Id, Vgs: 950mOhm @ 1.2A, 13V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 100µA
Supplier Device Package: PG-SOT223
Part Status: Not For New Designs
Drive Voltage (Max Rds On, Min Rds On): 13V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 500 V
Gate Charge (Qg) (Max) @ Vgs: 10.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 231 pF @ 100 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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IPN60R1K0CEATMA1 Infineon-IPN60R1K0CE-DS-v02_00-EN.pdf?fileId=5546d46253f6505701547aed24095b21
IPN60R1K0CEATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 600V 6.8A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 6.8A (Tc)
Rds On (Max) @ Id, Vgs: 1Ohm @ 1.5A, 10V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 130µA
Supplier Device Package: PG-SOT223-3
Part Status: Active
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 600 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V
auf Bestellung 12000 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
3000+0.45 EUR
9000+0.4 EUR
Mindestbestellmenge: 3000 Stücke
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IPN65R1K5CEATMA1 Infineon-IPN65R1K5CE-DS-v02_00-EN.pdf?fileId=5546d46253f6505701547af6617b5b50
IPN65R1K5CEATMA1
Hersteller: Infineon Technologies
Description: MOSFET N-CH 650V 5.2A SOT223
Packaging: Tape & Reel (TR)
Package / Case: TO-261-4, TO-261AA
Mounting Type: Surface Mount
Operating Temperature: -40°C ~ 150°C (TJ)
Technology: MOSFET (Metal Oxide)
FET Type: N-Channel
Current - Continuous Drain (Id) @ 25°C: 5.2A (Tc)
Rds On (Max) @ Id, Vgs: 1.5Ohm @ 1A, 10V
Power Dissipation (Max): 5W (Tc)
Vgs(th) (Max) @ Id: 3.5V @ 100µA
Supplier Device Package: PG-SOT223
Drive Voltage (Max Rds On, Min Rds On): 10V
Vgs (Max): ±20V
Drain to Source Voltage (Vdss): 650 V
Gate Charge (Qg) (Max) @ Vgs: 10.5 nC @ 10 V
Input Capacitance (Ciss) (Max) @ Vds: 225 pF @ 100 V
Produkt ist nicht verfügbar
Mindestbestellmenge: 3000 Stücke
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IPS60R1K0CEAKMA1 Infineon-IPS60R1K0CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537a8c943d7224
Hersteller: Infineon Technologies
Description: CONSUMER
Input Capacitance (Ciss) (Max) @ Vds: 280 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 13 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Not For New Designs
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 130µA
Power Dissipation (Max): 61W (Tc)
Rds On (Max) @ Id, Vgs: 1Ohm @ 1.5A, 10V
Current - Continuous Drain (Id) @ 25°C: 6.8A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Produkt ist nicht verfügbar
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IPS60R2K1CEAKMA1 Infineon-IPS60R2K1CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537af0473b761e
IPS60R2K1CEAKMA1
Hersteller: Infineon Technologies
Description: CONSUMER
Input Capacitance (Ciss) (Max) @ Vds: 140 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 6.7 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 60µA
Power Dissipation (Max): 38W (Tc)
Rds On (Max) @ Id, Vgs: 2.1Ohm @ 760mA, 10V
Current - Continuous Drain (Id) @ 25°C: 3.7A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Produkt ist nicht verfügbar
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IPS60R400CEAKMA1 Infineon-IPA60R400CE-DS-v02_00-EN.pdf?fileId=5546d46249be182c0149c82d428e1f02
IPS60R400CEAKMA1
Hersteller: Infineon Technologies
Description: CONSUMER
Input Capacitance (Ciss) (Max) @ Vds: 700 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 32 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 300µA
Power Dissipation (Max): 112W (Tc)
Rds On (Max) @ Id, Vgs: 400mOhm @ 3.8A, 10V
Current - Continuous Drain (Id) @ 25°C: 14.7A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Produkt ist nicht verfügbar
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IPS60R460CEAKMA1 Infineon-IPS60R460CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537ed5aa20222e
IPS60R460CEAKMA1
Hersteller: Infineon Technologies
Description: CONSUMER
Produkt ist nicht verfügbar
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IPS60R650CEAKMA1 Infineon-IPS60R650CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537f15f6c6228a
IPS60R650CEAKMA1
Hersteller: Infineon Technologies
Description: CONSUMER
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Input Capacitance (Ciss) (Max) @ Vds: 440 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 20.5 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 200µA
Power Dissipation (Max): 82W (Tc)
Rds On (Max) @ Id, Vgs: 650mOhm @ 2.4A, 10V
Current - Continuous Drain (Id) @ 25°C: 9.9A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Produkt ist nicht verfügbar
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IPS60R800CEAKMA1 Infineon-IPS60R800CE-DS-v02_00-EN.pdf?fileId=5546d462533600a401537f7a45772590
IPS60R800CEAKMA1
Hersteller: Infineon Technologies
Description: CONSUMER
Input Capacitance (Ciss) (Max) @ Vds: 373 pF @ 100 V
Gate Charge (Qg) (Max) @ Vgs: 17.2 nC @ 10 V
Drain to Source Voltage (Vdss): 600 V
Vgs (Max): ±20V
Drive Voltage (Max Rds On, Min Rds On): 10V
Part Status: Not For New Designs
Supplier Device Package: PG-TO251-3
Vgs(th) (Max) @ Id: 3.5V @ 170µA
Power Dissipation (Max): 74W (Tc)
Rds On (Max) @ Id, Vgs: 800mOhm @ 2A, 10V
Current - Continuous Drain (Id) @ 25°C: 8.4A (Tj)
FET Type: N-Channel
Technology: MOSFET (Metal Oxide)
Operating Temperature: -40°C ~ 150°C (TJ)
Mounting Type: Through Hole
Package / Case: TO-251-3 Short Leads, IPak, TO-251AA
Packaging: Tube
Produkt ist nicht verfügbar
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